CN104252212A - Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment - Google Patents

Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment Download PDF

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Publication number
CN104252212A
CN104252212A CN201310270089.9A CN201310270089A CN104252212A CN 104252212 A CN104252212 A CN 104252212A CN 201310270089 A CN201310270089 A CN 201310270089A CN 104252212 A CN104252212 A CN 104252212A
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China
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heat radiator
water
internal memory
cooling head
hole
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CN201310270089.9A
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CN104252212B (en
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惠晓卫
张军
郭健
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Abstract

The embodiment of the invention provides a liquid cooling heat dissipation device and liquid cooling heat dissipation equipment. The liquid cooling heat dissipation device comprises two radiating fins, a fixture, a water-cooling head, a fixed link, a buckle and a hook, wherein the two radiating fins are respectively arranged on two sides of an internal storage in parallel; the water-cooling head is fixedly arranged on a main board and is in contact with the part, vertically extending out of one end of the internal storage, of one radiating fin; during installation, the other end of the fixed link passes through a through hole in one end of the buckle and a through hole of one radiating fin and is inserted into the hole of the water-cooling head, so that the buckle, one radiating fin and the water-cooling head are fixed together; the hook passes trough a through hole in the other end of the buckle and is buckled by the other end of the buckle. By virtue of a mounting tool with combined buckle and fixed link, the heat transfer distance of the liquid cooling heat dissipation device in installation and detachment processes are shortened without using tools, and the problem that detachment and installation in the liquid cooling heat dissipation device are inconvenient due to high thermal-conduction resistance of the internal storage liquid cooling heat dissipation device is solved.

Description

Liquid-cooling heat radiator and equipment
Technical field
The embodiment of the present invention relates to memory heat radiation technology, particularly relates to a kind of internal memory liquid-cooling heat radiator and equipment.
Background technology
Along with people are to the increase of computer performance demand, the speed of internal memory is also in continuous improve, and frequency and power consumption also increase.Especially to the high frequency used in large-scale server, high power consumption internal memory, higher requirement be it is also proposed to the protection of its radiating requirements and internal memory.
For the heat radiation of high speed, high power consumption internal memory, the good liquid-cooling heat radiator of general employing radiating effect.Fig. 1 is the application schematic diagram of the common liquid-cooling heat radiator for internal memory, as shown in Figure 1, in the both sides of internal memory, parallel contact arranges one piece of heat radiator respectively, and with fastener, two pieces of heat radiator and internal memory are fixed, two water-cooling heads are separately fixed at position mainboard being positioned at internal memory two ends, the two ends of two pieces of heat radiator extend to the position of corresponding water-cooling head respectively and are fixed by screws on corresponding water-cooling head, the heat of generation is passed to heat radiator by internal memory, and conduct heat to water-cooling head by heat radiator, heat is taken out of by the liquid coolant flowed by water-cooling head cocycle.
Above-mentioned in the liquid-cooling heat radiator of internal memory, the two ends of heat radiator are bending respectively extends contact water-cooling head, and is fixed on water-cooling head by screw, so that when interior existence needs to safeguard, dismantles and install all very inconvenient.
Summary of the invention
The embodiment of the present invention provides a kind of liquid-cooling heat radiator and equipment, in solving, there is in liquid-cooling heat radiator the problem of dismantling and installing inconvenience.
First aspect, the embodiment of the present invention provides a kind of liquid-cooling heat radiator, comprising: the fixture of the first heat radiator, the second heat radiator, fixture, water-cooling head and described water-cooling head; The fixture of described water-cooling head comprises fixed bar, fastener and grab;
Described first heat radiator and the second heat radiator, for respectively in the parallel placement in the both sides of internal memory, and with two side contacts of described internal memory;
Described fixture, fixes for described first heat radiator of the both sides by being placed on described internal memory and the second heat radiator and described internal memory;
Described water-cooling head, for being fixed on mainboard, and at described first heat radiator and the second heat radiator respectively in the both sides of described internal memory during parallel placement, the part contact extended out from one end of described internal memory with described first heat radiator;
Described fixed bar is that one end has the straight-bar emitting type structure, the two ends of described fastener are provided with through hole, described grab is for being fixed on mainboard, and the part that described first heat radiator extends out from one end of described internal memory is provided with through hole, and described water-cooling head arranges porose;
The other end of described fixed bar is used for through the through hole of described fastener first end and the through hole of described first heat radiator and inserts the hole of described water-cooling head, described fixed bar emit one end of type structure for fastening the through hole of described fastener first end, described grab be used for through described fastener second end through hole and fastened by the second end of described fastener.
In the first possibility implementation of first aspect, described grab is arranged on the lateral wall of described water-cooling head; Described water-cooling head is specifically for being directly fixed on mainboard.
According to the first possible implementation of first aspect or first aspect, in the implementation that the second is possible, the part that described second heat radiator extends out from one end of described internal memory, for the overlying contact of part contacted with described water-cooling head with described first heat radiator, the part that described second piece of heat radiator extends out from one end of described internal memory is provided with through hole;
The other end of described fixed bar specifically for through the through hole of described fastener first end, the through hole of described first heat radiator and described second heat radiator through hole and insert the hole of described water-cooling head.
According to any one of the possible implementation of the first and the second of first aspect, first aspect, in the implementation that the third is possible, the fixture of described water-cooling head also comprises: bracing frame, support frame as described above is arranged porose, hole on described water-cooling head is through hole, and described grab is arranged on the lateral wall of support frame as described above;
Support frame as described above, for be fixed on described mainboard and to support described water-cooling head, is fixed on described mainboard to make described water-cooling head by support frame as described above;
The other end of described fixed bar also for through described water-cooling head through hole and insert the hole of support frame as described above.
According to first aspect, first aspect the first to any one of the third possible implementation, in the 4th kind of possible implementation, described water-cooling head has two, for being placed on the two ends of described internal memory; Water-cooling head is used for the part contact extended out from one end of described internal memory with described first heat radiator, and another water-cooling head is used for the part contact extended out from the other end of described internal memory with the second heat radiator or described first heat radiator; Described fixture has two groups, with two water-cooling head one_to_one corresponding.
According to first aspect, first aspect the first to any one of the 4th kind of possible implementation, in the 5th kind of possible implementation, described first heat radiator specifically vertically extends from one end of described internal memory, and described first heat radiator vertically extends the part come center line from one end of described internal memory is straight line.
According to the 5th kind of possible implementation of first aspect, in the 6th kind of possible implementation, described second heat radiator specifically vertically extends from one end of described internal memory, and described second heat radiator vertically extends the part come center line from one end of described internal memory is straight line.
Second aspect, the embodiment of the present invention provides a kind of equipment, comprising: the fixture of mainboard, internal memory, the first heat radiator, the second heat radiator, fixture, water-cooling head and described water-cooling head; The fixture of described water-cooling head comprises fixed bar, fastener and grab;
Described mainboard is provided with memory bank, and described internal memory is inserted in the memory bank on described mainboard;
Described first heat radiator and the second heat radiator, respectively in the parallel placement in the both sides of internal memory, and with two side contacts of described internal memory;
Described fixture, fixes being placed on described first heat radiator of the both sides of described internal memory and the second heat radiator and described internal memory;
Described water-cooling head, is fixed on mainboard, and at described first heat radiator and the second heat radiator respectively in the both sides of described internal memory during parallel placement, the part contact extended out from one end of described internal memory with described first heat radiator;
Described fixed bar is that one end has the straight-bar emitting type structure, the two ends of described fastener are provided with through hole, described grab is for being fixed on mainboard, and the part that described first heat radiator extends out from one end of described internal memory is provided with through hole, and described water-cooling head arranges porose;
The other end of described fixed bar is through the through hole of described fastener first end and the through hole of described first heat radiator and insert the hole of described water-cooling head, the one end of type structure that emits of described fixed bar fastens the through hole of described fastener first end, and described grab passes the through hole of described fastener second end and fastened by the second end of described fastener.
In the first possibility implementation of second aspect, described grab is arranged on the lateral wall of described water-cooling head; Described water-cooling head is directly fixed on mainboard.
According to the first possible implementation of second aspect or first aspect, in the implementation that the second is possible, the part that described second heat radiator extends out from one end of described internal memory, the overlying contact of the part contacted with described water-cooling head with described first heat radiator, the part that described second piece of heat radiator extends out from one end of described internal memory is provided with through hole;
The other end of described fixed bar specifically through the through hole of described fastener first end, the through hole of described first heat radiator and described second heat radiator through hole and insert the hole of described water-cooling head.
According to any one of the possible implementation of the first and the second of second aspect, second aspect, in the implementation that the third is possible, the fixture of described water-cooling head also comprises: bracing frame, support frame as described above is arranged porose, hole on described water-cooling head is through hole, and described grab is arranged on the lateral wall of support frame as described above;
Support frame as described above, to be fixed on described mainboard and to support described water-cooling head, being fixed on described mainboard to make described water-cooling head by support frame as described above;
The other end of described fixed bar also through described water-cooling head through hole and insert the hole of support frame as described above.
According to second aspect, second aspect the first to any one of the third possible implementation, in the 4th kind of possible implementation, described water-cooling head has two, is placed on the two ends of described internal memory; The part contact that a water-cooling head and described first heat radiator extend out from one end of described internal memory, the part contact that another water-cooling head and the second heat radiator or described first heat radiator extend out from the other end of described internal memory; Described fixture has two groups, with two water-cooling head one_to_one corresponding.
According to second aspect, second aspect the first to any one of the 4th kind of possible implementation, in the 5th kind of possible implementation, described first heat radiator specifically vertically extends from one end of described internal memory, and described first heat radiator vertically extends the part come center line from one end of described internal memory is straight line.
According to the 5th kind of possible implementation of second aspect, in the 6th kind of possible implementation, described second heat radiator specifically vertically extends from one end of described internal memory, and described second heat radiator vertically extends the part come center line from one end of described internal memory is straight line.
The embodiment of the present invention provides a kind of liquid-cooling heat radiator and equipment, by the erecting tools that fastener and fixed bar combine, change installation method and the structure of liquid-cooling heat radiator, solve the interior problem that there is dismounting and installation inconvenience in liquid-cooling heat radiator, realize liquid-cooling heat radiator and all do not need use instrument in installation and removal process, it is convenient to mount and dismount, and improves the practicality of liquid-cooling heat radiator.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the application schematic diagram of the common liquid-cooling heat radiator of prior art;
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 2 A provides for the embodiment of the present invention one;
The vertical view of heat radiator in a kind of liquid-cooling heat radiator that Fig. 2 B provides for the embodiment of the present invention one;
The vertical view of heat radiator in a kind of liquid-cooling heat radiator that Fig. 3 A provides for the embodiment of the present invention two;
The side view of heat radiator in a kind of liquid-cooling heat radiator that Fig. 3 B provides for the embodiment of the present invention two;
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 4 provides for the embodiment of the present invention three;
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 5 provides for the embodiment of the present invention four;
The sectional view of a kind of liquid-cooling heat radiator that Fig. 6 provides for the embodiment of the present invention four;
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 7 A provides for the embodiment of the present invention five;
The vertical view of heat radiator in a kind of liquid-cooling heat radiator that Fig. 7 B provides for the embodiment of the present invention five;
The another application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 8 provides for the embodiment of the present invention;
The application schematic diagram of a kind of equipment that Fig. 9 provides for the embodiment of the present invention six;
The application schematic diagram of a kind of equipment that Figure 10 provides for the embodiment of the present invention seven;
The Another Application schematic diagram of a kind of equipment that Figure 11 provides for the embodiment of the present invention;
The another application schematic diagram of a kind of equipment that Figure 12 provides for the embodiment of the present invention.
Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment one
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 2 A provides for the embodiment of the present invention one.The device that the present embodiment provides is applicable to the heat radiation of internal memory.As shown in Figure 2 A, liquid-cooling heat radiator 10 comprises: not shown in first heat radiator 110, second heat radiator 111(Fig. 2 A), the fixture of fixture 120, water-cooling head 130 and water-cooling head 130; The fixture of water-cooling head 130 comprises fixed bar 150, fastener 160 and grab 101; First heat radiator 110 and the second heat radiator 111, for respectively in the parallel placement in the both sides of internal memory 200, and with two side contacts of internal memory 200; Fixture 140, fixes with internal memory 200 for the first heat radiator 110 of the both sides by being placed on internal memory 200 and the second heat radiator 111; Water-cooling head 130, for being fixed on mainboard 100, and when the first heat radiator 110 and the second heat radiator 111 are placed at the both sides parallel contact of internal memory 200 respectively, the part contact extended out from one end of internal memory 200 with the first heat radiator 110; Fixed bar 150 emits the straight-bar of type structure for one end has, the two ends of fastener 160 are provided with through hole, and grab 101 is for being fixed on mainboard 100, and the part that the first heat radiator 110 extends out from one end of internal memory 200 is provided with through hole, and water-cooling head 130 arranges porose; The other end of fixed bar 150 is used for the hole of inserting water-cooling head 130 through the through hole of fastener 160 first end and the through hole of the first heat radiator 110, fixed bar 150 emit one end of type structure for fastening the through hole of fastener 160 first end, grab 101 for through fastener 160 second end through hole and fastened by the second end of fastener 160.It should be noted that, only illustrate that the first heat radiator 110, second heat radiator 111 is placed on the opposite side of internal memory 200 in Fig. 2 A, in addition, the fixed form of grab 101 on mainboard 100 can be directly fixing, also can be indirectly fixing.
The vertical view of heat radiator in a kind of liquid-cooling heat radiator that Fig. 2 B provides for the embodiment of the present invention one.Please refer to Fig. 2 A and Fig. 2 B, in the liquid-cooling heat radiator 10 that the present embodiment provides, first heat radiator 110 comprises the outstanding part in sheet part and one end, second heat radiator 111 comprises sheet part, first heat radiator 110 and the second heat radiator 111 are parallel when being placed on the both sides of internal memory 200 respectively, first heat radiator 110 and the sheet part of the second heat radiator 111 and two side contacts of internal memory 200, and with fixture 120 by the first heat radiator 110, internal memory 200 and the second heat radiator 111 are fixed, the part that wherein first heat radiator 110 one end is given prominence to contacts with the water-cooling head 130 be fixed on mainboard 100, for when internal memory 200 runs the heat produced, the sheet part that the heat of internal memory is contacted with internal memory 200 by the first heat radiator 110 and the second heat radiator 111 is transferred to the part that the first heat radiator 110 is outstanding, namely the one end contacted with water-cooling head 130.
In the liquid-cooling heat radiator 10 that the present embodiment provides, by the through hole that the one end contacted with water-cooling head 130 at the first heat radiator 110 is arranged, the through hole that the hole that water-cooling head 130 is arranged and fastener 160 two ends are arranged, and utilize fixed bar 150 one end to have the feature emitting type structure, the other end inserts the hole of water-cooling head 130 through the through hole of fastener 160 first end and the through hole of the first heat radiator 110 when mounted, fixed bar 150 is made to have the through hole emitting one end of type structure to fasten fastener 160 first end, by fastener 160, first heat radiator 110 and water-cooling head 130 are fixed together, and grab 101 is passed the through hole of fastener 160 second end and fastens grab 101 with fastener 160, particularly, grab 101 is positioned at one end of the lateral wall of water-cooling head 130, therefore, second end of fastener 160 is fixed on one end of water-cooling head 130 lateral wall with grab, thus, by the first heat radiator 110 and the second heat radiator 111, the fixture of water-cooling head 130 and water-cooling head is all fixed on the upper of mainboard 100.Significantly, the mounting structure of the liquid-cooling heat radiator described in the present embodiment is simple, can easy removal, is convenient to install.
It should be noted that, the fixed form of fixture is described for two fixtures 120 in the present embodiment, two fixtures 120 can be the outsides being clipped in the first heat radiator 110 and the second heat radiator 111, also can for having the clip of spring assembly, specifically be fixed on the top inside the first heat radiator 110 and the second heat radiator 111, be connected with the second heat radiator 111 by first heat radiator 110, the present embodiment is not restricted the quantity of fixture and fixed form.
Therefore, compared with liquid-cooling heat radiator in prior art, the mounting structure of the liquid-cooling heat radiator that the present embodiment provides, adopts the erecting tools that fastener and fixed bar combine, there is provided downward setting pressure, for stablizing fixing cooling fins, water-cooling head and mainboard in an installation.Heat radiator and water-cooling head fixing in, significantly, more convenient than using screw to fixedly mount in prior art, and it is for convenience detach, and all use instrument is not needed in installation and removal process, therefore, can dismantle when internal memory needs to safeguard easily and install.
Alternatively, on the basis of the liquid-cooling heat radiator provided at above-described embodiment, the liquid-cooling heat radiator 10 that the present embodiment provides, grab 101 is arranged on the lateral wall of described water-cooling head 130; Water-cooling head 130, specifically for being directly fixed on mainboard 100, the lateral wall that in above-described embodiment, Fig. 2 A is arranged on water-cooling head 130 for grab 101 illustrates the position of buckle 101.
The liquid-cooling heat radiator that the present embodiment provides, compared with above-described embodiment, the particular location of grab 101 is arranged on the lateral wall of water-cooling head 130, particularly, because water-cooling head is directly fixed on mainboard 100 when installing, thus grab 101 is fixed on water-cooling head 130, to make grab 101, mainboard 100 is fixing relatively.The beneficial effect of the liquid-cooling heat radiator that the present embodiment provides is same with the above-mentioned embodiment, therefore does not repeat them here.
Embodiment two
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 2 A also can provide as the embodiment of the present invention two, the vertical view of heat radiator in a kind of liquid-cooling heat radiator that Fig. 3 A provides for the embodiment of the present invention two, the side view of heat radiator in a kind of liquid-cooling heat radiator that Fig. 3 B provides for the embodiment of the present invention two.In the liquid-cooling heat radiator 10 that the present embodiment provides, with above-described embodiment unlike, the part that second heat radiator 111 extends out from one end of internal memory 200, for the overlying contact of part contacted with water-cooling head 130 with the first heat radiator 110, the part that this second heat radiator 111 extends out from one end of internal memory 200 is provided with through hole; The other end of fixed bar 150 specifically for through the through hole of fastener 160 first end, the through hole of the first heat radiator 110 and the second heat radiator 111 through hole and insert the hole of water-cooling head 130.It should be noted that, in the present embodiment, grab 101 is specifically arranged on the lateral wall of water-cooling head 130.
Please refer to Fig. 2 A, Fig. 3 A and Fig. 3 B, first heat radiator 110 and the second heat radiator 111 include the outstanding part in sheet part and one end, first heat radiator 110 and the second heat radiator 111 are parallel when being placed on the both sides of internal memory 200 respectively, first heat radiator 110 and the sheet part of the second heat radiator 111 and two side contacts of internal memory 200, the part that wherein first heat radiator 110 one end is given prominence to contacts with the water-cooling head 130 be fixed on mainboard 100, the part that second heat radiator 111 one end is given prominence to is positioned on the part that the first heat radiator 110 contacts with water-cooling head 130, and the through hole of the first heat radiator 110 and the second heat radiator 111 is overlapping, for when internal memory 200 runs the heat produced, the sheet part that the heat of internal memory is contacted with internal memory 200 by the first heat radiator 110 and the second heat radiator 111 is transferred to the part that the first heat radiator 110 and second heat radiator 111 one end are outstanding, namely the one end contacted with water-cooling head 130.Correspondingly, when mounted the other end of fixed bar 150 specifically through the through hole of fastener 160 one end, the through hole of the first heat radiator 110 and the second heat radiator 111 through hole and insert the hole of water-cooling head 130, therefore, the part that first heat radiator 110 and second heat radiator 111 one end are given prominence to fixed with fixed bar 150 and water-cooling head 130, other mounting structure is same with the above-mentioned embodiment simultaneously.
The liquid-cooling heat radiator that the present embodiment provides, compared with above-described embodiment, the part outstanding in one end of the second heat radiator is also provided with through hole, and the part two pieces of heat radiator can given prominence to separately is when mounted fixed with fixed bar by overlapping through hole, enhances two pieces of heat radiator steadiness in an installation.The beneficial effect of the liquid-cooling heat radiator that the present embodiment provides is same with the above-mentioned embodiment, therefore does not repeat them here.
Embodiment three
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 4 provides for the embodiment of the present invention three.On the basis of the liquid-cooling heat radiator provided at above-described embodiment, the liquid-cooling heat radiator 10 that the present embodiment provides, the fixture of water-cooling head 130 also comprises bracing frame 170, bracing frame 170 is arranged porose, hole on water-cooling head 130 is through hole, and grab 101 is arranged on the lateral wall of bracing frame 170; Bracing frame 170, for be fixed on mainboard 100 and to support water-cooling head 130, to make water-cooling head 130 and to be fixed on mainboard 100 by bracing frame 170; The other end of fixed bar 150 also for through water-cooling head 130 through hole and insert the hole of bracing frame 170.
In the liquid-cooling heat radiator 10 that the present embodiment provides, on the basis of the liquid-cooling heat radiator provided at above-described embodiment, increase bracing frame 170, bracing frame 170 is fixed on mainboard, and water-cooling head is positioned on bracing frame 170, the mounting structure of the liquid-cooling heat radiator provided with above-described embodiment unlike, by utilizing fixed bar 150 one end, there is the feature emitting type structure, the other end is through after the through hole of fastener 160 first end and the through hole of heat radiator when mounted, also through water-cooling head 130 through hole and insert the hole of bracing frame 170, fixed bar 150 is made to have the through hole emitting one end of type structure to fasten fastener 160 first end, by the first end of fastener 160, heat radiator, water-cooling head 130 and bracing frame 170 are fixed together, and pass the through hole of fastener 160 second end with the grab 101 on bracing frame 170 and then fastened by the second end of fastener 160 and fix, because bracing frame is fixed on mainboard 100 when mounted, thus, liquid-cooling heat radiator 10 is fixed on mainboard 100, and mounting structure is simple, can easy removal, be convenient to install.The through hole of the heat radiator that the other end passes when it should be noted that fixed bar 150 is installed, this heat radiator can be the first heat radiator 110, also can be the first heat radiator 110 and the second heat radiator 111.
The mounting structure of the liquid-cooling heat radiator that the present embodiment provides, the erecting tools adopting fastener and fixed bar to combine, provides downward setting pressure, for stablizing fixing cooling fins, water-cooling head, bracing frame and mainboard in an installation.The liquid-cooling heat radiator that the present embodiment provides, with the difference of above-described embodiment, specifically be, not direct water-cooling head is fixed on mainboard, make the installation and removal of water-cooling head more flexible, the beneficial effect of the liquid-cooling heat radiator that the present embodiment provides is same with the above-mentioned embodiment, therefore does not repeat them here.
Embodiment four
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 5 provides for the embodiment of the present invention four.On the basis of the liquid-cooling heat radiator provided at above-described embodiment, the liquid-cooling heat radiator 10 that the present embodiment provides, also comprises two heat-conducting pieces; Two heat-conducting pieces are used for being placed in the first heat radiator 110 and second heat radiator 111(Fig. 5 respectively not shown) and the both sides of internal memory 200 between.It should be noted that, Fig. 5 to carry out expanding to example on embodiment one basis, in the present embodiment, grab 101 is specifically arranged on the lateral wall of water-cooling head 130, a heat-conducting piece 140 and the first heat radiator 110 are only shown in Fig. 5, and another heat-conducting piece and the second heat radiator 111 are placed on the opposite side of internal memory 200.
Common liquid-cooling heat radiator, owing to there is large power dissipating chip in the middle part of internal memory, the higher meeting of heat that can produce when internal memory runs causes heat on described two pieces of heat radiator uneven.In the liquid-cooling heat radiator that the present embodiment provides, at two heat-conducting pieces that the Contact of described internal memory both sides and described two pieces of heat radiator is placed, described two heat-conducting pieces can use graphite flake, ultra-thin vapor chamber (Vapor chamber, referred to as VC) etc. material make, there is efficient heat conduction function.By described two panels heat radiator internal memory produced heat transmit to water-cooling head time, improve heat conducting efficiency and improve the thermal uniformity problem of described two pieces of heat radiator, high level reducing memory heat radiation risk very much.
Further, the sectional view of a kind of liquid-cooling heat radiator that Fig. 6 provides for the embodiment of the present invention four, please refer to Fig. 5, Fig. 6 with I-I ' in Fig. 5 for profile line, state on the basis of the liquid-cooling heat radiator that embodiment provides on the invention, the liquid-cooling heat radiator that the present embodiment provides 10, two heat-conducting pieces 140 and 141 are schistose texture, in the first heat radiator 110 and the second heat radiator 111 for the one side of internal memory 200 liang of side contacts on be respectively arranged with sheet groove 140a and 141a; Two heat-conducting pieces 140 and 141 specifically for, be arranged on correspondingly in sheet groove 140a and 141a of the first heat radiator 110 and the second heat radiator 111.
In the liquid-cooling heat radiator 10 that the present embodiment provides, two heat-conducting pieces 140 and 141 are schistose texture, and thickness is less than the thickness of the sheet part of the first heat radiator 110 and the second heat radiator 111; By arranging the size of sheet groove 140a and 141a on the first heat radiator 110 and the second heat radiator 111, just in time can embed in sheet groove 140a and 141a of the first heat radiator 110 and the second heat radiator 111 to make two heat-conducting pieces 140 and 141.
The liquid-cooling heat radiator that the present embodiment provides, on the basis of the liquid-cooling heat radiator provided at above-described embodiment, under improving the prerequisite of the thermal uniformity problem of described two pieces of heat radiator, can not increase again the volume of liquid-cooling heat radiator in the heat conducting efficiency of raising.
In the liquid-cooling heat radiator that the above embodiment of the present invention provides, make that the radiating efficiency of internal memory is higher and heat dissipation uniformity is better owing to being configured with the heat-conducting piece with high-performance conductive structure, therefore, only use a water-cooling head just can ensure the radiating effect of internal memory, reduce the manufacturing cost of liquid-cooling heat radiator significantly, there is better market competitiveness.
Embodiment five
The application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 7 A provides for the embodiment of the present invention five, the vertical view of heat radiator in a kind of liquid-cooling heat radiator that Fig. 7 B provides for the embodiment of the present invention five.On the basis of the liquid-cooling heat radiator provided at above-described embodiment, the liquid-cooling heat radiator 10 that the present embodiment provides, described water-cooling head has two, for being placed on the two ends of internal memory 200; Water-cooling head 130 part contact for extending out from one end of internal memory 200 with the first heat radiator 110, the part contact of another water-cooling head 131 for extending out from the other end of internal memory 200 with the second heat radiator 111; Described fixture has two groups, with two water-cooling heads 130,131 one_to_one corresponding.It should be noted that, Fig. 7 A and 7B to carry out expanding to example on embodiment one basis, and in the present embodiment, grab 101 is specifically arranged on the lateral wall of water-cooling head 130.
Alternatively, the another application schematic diagram of a kind of liquid-cooling heat radiator that Fig. 8 provides for the embodiment of the present invention, on the basis of above-described embodiment five, the liquid-cooling heat radiator 10 that the present embodiment provides, bracing frame in the fixture of two water-cooling heads is also two, be specially bracing frame 170 and 171, two water-cooling heads, be specially water-cooling head 130 and 131, during installation, two water-cooling heads 130 and 131 are placed on the two ends of internal memory 200, for installing the fabricated section of two water-cooling heads 130 and 131, i.e. fixed bar, fastener and grab have two, be specially two fixed bars 150 and 151, two fasteners 160 and 161, two grabs 101 and 102, same as the previously described embodimentsly, the part contact that a water-cooling head 130 and the first heat radiator 110 extend out from one end of internal memory 200, and the first heat radiator 110, the installation of water-cooling head 130 and mainboard 100 and fixed form are also same as the previously described embodiments, unlike, heat radiator as shown in figs. 7 a-b, second heat radiator 111 also comprises the outstanding part in sheet part and one end, the part contact of another water-cooling head 131 for extending out from the other end of internal memory 200 with the second heat radiator 111, the part that one end of the part that this second heat radiator 111 extends out from the other end of internal memory 200 namely the second heat radiator 111 is outstanding, the water-cooling head 131 that internal memory 200 other end is placed, mounting structure and the fixed form of the second heat radiator 111 and mainboard 200 are same as the previously described embodiments.
Further, on the basis of above-described embodiment five, the liquid-cooling heat radiator 10 that the present embodiment provides, the concrete structure of the first heat radiator 110 and the second heat radiator 111 can the structure of heat radiator in reference example two, first heat radiator 110 and the second heat radiator 111 include the outstanding part in sheet part and two ends, water-cooling head 130 part contact for extending out from one end of internal memory 200 with the first heat radiator 110 during installation, the part contact of another water-cooling head 131 for extending out from the other end of internal memory 200 with the second heat radiator 111, correspondingly, the part that second heat radiator 111 extends out from one end of internal memory 200 is above water-cooling head 130 and the part contact outstanding with the first heat radiator 110, the part that first heat radiator 110 extends out from the other end of internal memory 200 is above water-cooling head 131 and the part contact outstanding with the second heat radiator 111.During concrete enforcement, water-cooling head 130 part contact for extending out from one end of internal memory 200 with the first heat radiator 110, the part contact that another water-cooling head 131 also can extend out from the other end of internal memory 200 with the first heat radiator 110, accordingly, the part that extends out from internal memory two ends of the second heat radiator 111 is above water-cooling head 130 and 131 and the part contact outstanding with the first heat radiator 110.It should be noted that, which end that the present invention does not limit heat radiator contacts with the water-cooling head at internal memory two ends, can be that two pieces of heat radiator one end separately contacts with a water-cooling head respectively, two pieces of heat radiator other end is separately above one end that another block heat radiator contacts with water-cooling head, and the part of horizontal height that the two ends of the heat radiator of this structure are outstanding is different; Also can be that the two ends of one piece of heat radiator contact with two water-cooling heads, the two ends of another block heat radiator be above above-mentioned one piece of heat radiator two ends, and the part of horizontal height that the two ends of the heat radiator of this structure are outstanding is identical.
On the basis of the various embodiments described above, the liquid-cooling heat radiator that the present embodiment provides, the radiating effect of liquid-cooling heat radiator is improved by using two water-cooling heads, the heat of internal memory is made to transmit by the water-cooling head of two pieces of heat radiator to internal memory two ends and to derive, add the path of delivered heat in internal memory, correspondingly, improve the radiating effect of liquid-cooling heat radiator of the present invention.
When specific implementation, as shown in Fig. 2 A to Fig. 8, in above-described embodiment, the first heat radiator 110 can specifically vertically extend from one end of internal memory 200, and the first heat radiator 110 vertically extends the part come center line from one end of internal memory 200 is straight line; Similarly, the second heat radiator 111 also can specifically vertically extend from one end of internal memory 200, and the second heat radiator 111 vertically extends the part come center line from one end of internal memory 200 is also straight line.In the same manner, when having two pieces of water-cooling heads in embodiments of the present invention, first heat radiator 110 and the second heat radiator 111 can have the outstanding part in two ends, and the part that these two ends are given prominence to can vertically extend from the two ends of internal memory 200, and the center line vertically extending the part come also is straight line.
Compared with the heat conduction distance being extended to water-cooling head by elbow with heat radiator two ends in prior art, significantly, when the center line of the part that heat radiator vertically extends from one end of internal memory is straight line, heat conduction distance is shorter, in the liquid-cooling heat radiator that the various embodiments described above of the present invention provide, contacted the length of one end with water-cooling head by shortening heat radiator, shorter with the transmission range making internal memory heat be transferred to water-cooling head from heat radiator, thus reduce the thermal-conduction resistance in liquid-cooling heat radiator.
It should be noted that, in above-described embodiment, the straight bar part of fixed bar can be a smooth straight-bar, accordingly, water-cooling head, the inwall of the through hole on heat radiator and bracing frame is also smooth, the straight bar part of fixed bar can be made to pass, such as, rivet usually can be used as fixed bar; The straight bar part of fixed bar can also be a straight-bar with helicitic texture, accordingly, water-cooling head, through hole on heat radiator and bracing frame can be the nut structure corresponding to fixed bar helicitic texture, the straight bar part of fixed bar through water-cooling head, threadingly realizes during through hole on heat radiator and bracing frame.The embodiment of the present invention does not limit fixed bar, water-cooling head, and the concrete structure of through hole on heat radiator and bracing frame, as long as the structure that can realize connected mode of the present invention can.
Embodiment six
The application schematic diagram of a kind of equipment that Fig. 9 provides for the embodiment of the present invention six.The equipment 20 that the present embodiment provides, comprises in mainboard 100, internal memory 200, first heat radiator 110, second heat radiator 111(Fig. 9 not shown), the fixture of fixture 120, water-cooling head 130 and water-cooling head 130; The fixture of water-cooling head 130 comprises fixed bar 150, fastener 160 and grab 101; First heat radiator 110 and the second heat radiator 111, respectively in the parallel placement in the both sides of internal memory 200, and with two side contacts of internal memory 200; Fixture 140, fixes the first heat radiator 110 and the second heat radiator 111 that are placed on the both sides of internal memory 200 with described internal memory 200; Water-cooling head 130, is fixed on mainboard 100, and when the first heat radiator 110 and the second heat radiator 111 are placed at the both sides parallel contact of internal memory 200 respectively, the part contact extended out from one end of internal memory 200 with the first heat radiator 110; Fixed bar 150 emits the straight-bar of type structure for one end has, the two ends of fastener 160 are provided with through hole, and grab 101 is for being fixed on mainboard 100, and the part that the first heat radiator 110 extends out from one end of internal memory 200 is provided with through hole, and water-cooling head 130 arranges porose; The other end of fixed bar 150 inserts the hole of water-cooling head 130 through the through hole of fastener 160 first end and the through hole of the first heat radiator 110, the one end of type structure that emits of fixed bar 150 fastens the through hole of fastener 160 first end, and grab 101 passes the through hole of fastener 160 second end and fastened by the second end of fastener 160.
Alternatively, on the basis of above-described embodiment six, the part that second heat radiator 111 also can extend out from one end of internal memory 200, and the overlying contact of the part contacted with water-cooling head 130 with the first heat radiator 110, the part that this second heat radiator 111 extends out from one end of internal memory 200 is provided with through hole; The other end of fixed bar 150 specifically through the through hole of fastener 160 first end, the through hole of the first heat radiator 110 and the second heat radiator 111 through hole and insert the hole of water-cooling head 130.It should be noted that, in the present embodiment, grab 101 is specifically arranged on the lateral wall of water-cooling head 130.It should be noted that, the liquid-cooling heat radiator that in the equipment shown in Fig. 9, liquid-cooling heat radiator provides for embodiment two.
The equipment 20 that the present embodiment provides, first heat radiator 110 and the second heat radiator 111 are fixed integrally with internal memory 200, when internal memory 200 being inserted in the memory bank 200a on mainboard 100, first heat radiator 110 and the second heat radiator 111 are also fixed on the relevant position of mainboard 100, water-cooling head 130 is in the position of internal memory 200 one end, and the part contact extended out from internal memory 200 one end with the first heat radiator 110; During installation, water-cooling head 130 is fixed on mainboard 100, by utilizing fixed bar 150 one end, there is the feature emitting type structure, the other end inserts the hole of water-cooling head 130 through the through hole of fastener 160 first end and the through hole of heat radiator when mounted, fixed bar 150 is made to have the through hole emitting one end of type structure to fasten fastener 160 first end, the first end of fastener 160, heat radiator and water-cooling head 130 is fixed together, and passes the through hole of fastener 160 second end with grab 101 and then be fixed on mainboard 100 by the second end of fastener 160.Significantly, the equipment mounting structure that the present embodiment provides is simple, can easy removal, is convenient to install.It should be noted that, when in the present embodiment, fixed bar 150 is installed, the other end is through the through hole of heat radiator, and this heat radiator can be the first heat radiator 110, also can be the first heat radiator 110 and the second heat radiator 111.
The equipment that the present embodiment provides; liquid-cooling heat radiator described in the application of the invention above-described embodiment; particularly; for installing internal memory; and when being installed on mainboard by liquid-cooling heat radiator described in internal memory and the above embodiment of the present invention, heat radiation protection effect is played to described internal memory, when internal memory runs generation heat; the heat of internal memory transmitted to water-cooling head direction and derives, ensure that the heat that main onboard memory produces can effectively be derived.Due to the liquid-cooling heat radiator that the equipment described in the present embodiment adopts the above embodiment of the present invention to provide, therefore, the mounting structure of equipment provided by the invention is similar to liquid-cooling heat radiator described in above-described embodiment with beneficial effect, therefore does not repeat them here.
Embodiment seven
The application schematic diagram of a kind of equipment that Figure 10 provides for the embodiment of the present invention seven.On the basis of the equipment provided at above-described embodiment, in the equipment 20 that the present embodiment provides, the fixture of water-cooling head 130 also comprises bracing frame 170, bracing frame 170 is arranged porose, hole on water-cooling head 130 is through hole, and grab 101 is arranged on the lateral wall of bracing frame 170; Bracing frame 170, to be fixed on mainboard 100 and to support water-cooling head 130, to make water-cooling head 130 be fixed on mainboard 100 by bracing frame 170, the other end of fixed bar 150 also through water-cooling head 130 through hole and insert the hole of bracing frame 170.
The equipment 20 that the present embodiment provides, bracing frame 170 is adopted to be fixed on mainboard 100, and make water-cooling head 130 be fixed on mainboard 200 by bracing frame 170, the equipment that the present embodiment provides is similar to the mounting structure of equipment described in above-described embodiment, unlike, by utilizing fixed bar 150 one end, there is the feature emitting type structure, when mounted the other end through the through hole of fastener 160 first end and the through hole of heat radiator and water-cooling head 130 through hole and insert the hole of bracing frame 170, fixed bar 150 is made to have the through hole emitting one end of type structure to fasten fastener 160 first end, by fastener 160, heat radiator, water-cooling head 130 and support 170 are fixed together, and pass the through hole of fastener 160 second end with grab 101 and then fastened by fastener 160, whole liquid-cooling heat radiator 10 is fixed on the upper of mainboard 100.It should be noted that, when in the present embodiment, fixed bar 150 is installed, the other end is through the through hole of heat radiator, and this heat radiator can be the first heat radiator 110, also can be not shown in the first heat radiator 110 and second heat radiator 111(Figure 10).
The equipment that the present embodiment provides, the difference of the equipment provided with above-described embodiment is, water-cooling head is not directly fixed on mainboard, but by bracing frame is fixed on mainboard, for supporting described water-cooling head, therefore, make the installation and removal of described water-cooling head convenient, mounting structure and the beneficial effect of described liquid-cooling heat radiator structure and described mainboard and internal memory are all same with the above-mentioned embodiment, therefore do not repeat them here.
The thermal-conduction resistance in liquid-cooling heat radiator is reduced due to equipment described in various embodiments of the present invention, heat-conducting piece again by having high-performance conductive structure makes that the radiating efficiency of internal memory is higher and heat dissipation uniformity is better, therefore, equipment described in the embodiment of the present invention only uses a water-cooling head just can ensure the radiating effect of internal memory, reduce the manufacturing cost of liquid-cooling heat radiator significantly, there is better market competitiveness.
Further, a kind of Another Application schematic diagram of equipment that provides for the embodiment of the present invention of Figure 11.On the basis that above-described embodiment provides, in the equipment 20 that the present embodiment provides, in the installation of the liquid-cooling heat radiator provided in internal memory, mainboard and the embodiment of the present invention, by utilizing internal memory buckle 201, internal memory 200 and mainboard 100 are fixed; Fixing or the bracing frame 170 of water-cooling head 130 and mainboard 200 and the fixing of mainboard 200, can adopt securing member 103, securing member 103 can be specifically screw or fixed bar.It should be noted that, Figure 11 to carry out expanding to example on embodiment seven basis.
The fixed sturcture of the internal memory that the present embodiment provides and mainboard, can make described liquid-cooling heat radiator and fixing more firm between internal memory and mainboard.
Further, a kind of another application schematic diagram of equipment that provides for the embodiment of the present invention of Figure 12.On the basis of the equipment provided at above-described embodiment, in the equipment 20 that the present embodiment provides, described water-cooling head has two, is placed on the two ends of internal memory 200; The part contact that a water-cooling head 130 and the first heat radiator 110 extend out from one end of internal memory 200, the part contact that another water-cooling head 131 and the second heat radiator 111 extend out from the other end of internal memory 200; Water-cooling head fixture and have two groups for the internal memory buckle of erecting equipment 20 and securing member, and with two water-cooling heads 130,131 one_to_one corresponding; Be specially two bracing frames, 170 and 171, two fixed bars, 150 and 151, two fasteners, 160 and 161, two grabs, 101 and 102, two internal memory buckles 201 and 202 and two securing members 103 and 104; When specific implementation, two bracing frames 170 and 171 and two water-cooling heads 130 and 131, in the position at internal memory 200 two ends, the liquid-cooling heat radiator that equipment described in the present embodiment adopts the embodiment of the present invention to provide, the unit affinity provided in the mounting structure of described equipment and above-described embodiment, therefore do not repeat them here.The equipment that the present embodiment provides is by use two described water-cooling heads, the heat of internal memory is made to transmit by the water-cooling head of two pieces of heat radiator to internal memory two ends and to derive, add the path of delivered heat in internal memory, correspondingly, improve the radiating effect of liquid-cooling heat radiator of the present invention.
Above-described embodiment is when specific implementation, and the first heat radiator 110 can specifically vertically extend from one end of internal memory 200, and the first heat radiator 110 vertically extends the part come center line from one end of internal memory 200 is straight line; Similarly, the second heat radiator 111 also can specifically vertically extend from one end of internal memory 200, and the second heat radiator 111 vertically extends the part come center line from one end of internal memory 200 is also straight line.In the same manner, when having two pieces of water-cooling heads in embodiments of the present invention, first heat radiator 110 and the second heat radiator 111 can have the outstanding part in two ends, and the part that these two ends are given prominence to can vertically extend from the two ends of internal memory 200, and the center line vertically extending the part come also is straight line.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.

Claims (14)

1. a liquid-cooling heat radiator, is characterized in that, comprising: the fixture of the first heat radiator, the second heat radiator, fixture, water-cooling head and described water-cooling head; The fixture of described water-cooling head comprises fixed bar, fastener and grab;
Described first heat radiator and the second heat radiator, for respectively in the parallel placement in the both sides of internal memory, and with two side contacts of described internal memory;
Described fixture, fixes for described first heat radiator of the both sides by being placed on described internal memory and the second heat radiator and described internal memory;
Described water-cooling head, for being fixed on mainboard, and at described first heat radiator and the second heat radiator respectively in the both sides of described internal memory during parallel placement, the part contact extended out from one end of described internal memory with described first heat radiator;
Described fixed bar is that one end has the straight-bar emitting type structure, the two ends of described fastener are provided with through hole, described grab is for being fixed on mainboard, and the part that described first heat radiator extends out from one end of described internal memory is provided with through hole, and described water-cooling head arranges porose;
The other end of described fixed bar is used for through the through hole of described fastener first end and the through hole of described first heat radiator and inserts the hole of described water-cooling head, described fixed bar emit one end of type structure for fastening the through hole of described fastener first end, described grab be used for through described fastener second end through hole and fastened by the second end of described fastener.
2. device according to claim 1, is characterized in that, described grab is arranged on the lateral wall of described water-cooling head; Described water-cooling head is specifically for being directly fixed on mainboard.
3. device according to claim 1 and 2, it is characterized in that, the part that described second heat radiator extends out from one end of described internal memory, for the overlying contact of part contacted with described water-cooling head with described first heat radiator, the part that described second piece of heat radiator extends out from one end of described internal memory is provided with through hole;
The other end of described fixed bar specifically for through the through hole of described fastener first end, the through hole of described first heat radiator and described second heat radiator through hole and insert the hole of described water-cooling head.
4., according to described device arbitrary in claims 1 to 3, it is characterized in that, the fixture of described water-cooling head also comprises: bracing frame, support frame as described above is arranged porose, and the hole on described water-cooling head is through hole, and described grab is arranged on the lateral wall of support frame as described above;
Support frame as described above, for be fixed on described mainboard and to support described water-cooling head, is fixed on described mainboard to make described water-cooling head by support frame as described above;
The other end of described fixed bar also for through described water-cooling head through hole and insert the hole of support frame as described above.
5. the device according to any one of Claims 1 to 4, is characterized in that, described water-cooling head has two, for being placed on the two ends of described internal memory; Water-cooling head is used for the part contact extended out from one end of described internal memory with described first heat radiator, and another water-cooling head is used for the part contact extended out from the other end of described internal memory with the second heat radiator or described first heat radiator; Described fixture has two groups, with two water-cooling head one_to_one corresponding.
6. according to described device arbitrary in Claims 1 to 5, it is characterized in that, described first heat radiator specifically vertically extends from one end of described internal memory, and described first heat radiator vertically extends the part come center line from one end of described internal memory is straight line.
7. the device according to any one of claim 6, it is characterized in that, described second heat radiator specifically vertically extends from one end of described internal memory, and described second heat radiator vertically extends the part come center line from one end of described internal memory is straight line.
8. an equipment, is characterized in that, comprising: the fixture of mainboard, internal memory, the first heat radiator, the second heat radiator, fixture, water-cooling head and described water-cooling head; The fixture of described water-cooling head comprises fixed bar, fastener and grab;
Described mainboard is provided with memory bank, and described internal memory is inserted in the memory bank on described mainboard;
Described first heat radiator and the second heat radiator, respectively in the parallel placement in the both sides of internal memory, and with two side contacts of described internal memory;
Described fixture, fixes being placed on described first heat radiator of the both sides of described internal memory and the second heat radiator and described internal memory;
Described water-cooling head, is fixed on mainboard, and at described first heat radiator and the second heat radiator respectively in the both sides of described internal memory during parallel placement, the part contact extended out from one end of described internal memory with described first heat radiator;
Described fixed bar is that one end has the straight-bar emitting type structure, the two ends of described fastener are provided with through hole, described grab is for being fixed on mainboard, and the part that described first heat radiator extends out from one end of described internal memory is provided with through hole, and described water-cooling head arranges porose;
The other end of described fixed bar is through the through hole of described fastener first end and the through hole of described first heat radiator and insert the hole of described water-cooling head, the one end of type structure that emits of described fixed bar fastens the through hole of described fastener first end, and described grab passes the through hole of described fastener second end and fastened by the second end of described fastener.
9. equipment according to claim 8, is characterized in that, described grab is arranged on the lateral wall of described water-cooling head; Described water-cooling head is directly fixed on mainboard.
10. equipment according to claim 8 or claim 9, it is characterized in that, the part that described second heat radiator extends out from one end of described internal memory, the overlying contact of the part contacted with described water-cooling head with described first heat radiator, the part that described second piece of heat radiator extends out from one end of described internal memory is provided with through hole;
The other end of described fixed bar specifically through the through hole of described fastener first end, the through hole of described first heat radiator and described second heat radiator through hole and insert the hole of described water-cooling head.
Arbitrary described equipment in 11. according to Claim 8 ~ 10, it is characterized in that, the fixture of described water-cooling head also comprises: bracing frame, support frame as described above is arranged porose, hole on described water-cooling head is through hole, and described grab is arranged on the lateral wall of support frame as described above;
Support frame as described above, to be fixed on described mainboard and to support described water-cooling head, being fixed on described mainboard to make described water-cooling head by support frame as described above;
The other end of described fixed bar also through described water-cooling head through hole and insert the hole of support frame as described above.
Arbitrary described equipment in 12. according to Claim 8 ~ 11, it is characterized in that, described water-cooling head has two, is placed on the two ends of described internal memory; The part contact that a water-cooling head and described first heat radiator extend out from one end of described internal memory, the part contact that another water-cooling head and the second heat radiator or described first heat radiator extend out from the other end of described internal memory; Described fixture has two groups, with two water-cooling head one_to_one corresponding.
Arbitrary described equipment in 13. according to Claim 8 ~ 12, it is characterized in that, described first heat radiator specifically vertically extends from one end of described internal memory, and described first heat radiator vertically extends the part come center line from one end of described internal memory is straight line.
14. according to described equipment arbitrary in claim 13, it is characterized in that, described second heat radiator specifically vertically extends from one end of described internal memory, and described second heat radiator vertically extends the part come center line from one end of described internal memory is straight line.
CN201310270089.9A 2013-06-29 2013-06-29 Liquid-cooling heat radiator and equipment Active CN104252212B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107256075A (en) * 2017-08-23 2017-10-17 湖南智热技术股份有限公司 Soldering formula CPU liquid cooling heat radiators with internal memory heat sink
CN108845645A (en) * 2018-05-30 2018-11-20 郑州云海信息技术有限公司 One kind being applied to area of computer aided radiating fin fixing device
CN117369597A (en) * 2023-10-12 2024-01-09 沐曦科技(北京)有限公司 Main board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2559188Y (en) * 2002-05-28 2003-07-02 台达电子工业股份有限公司 Electronic member heat radiator assembling fastener
CN101115365A (en) * 2006-07-28 2008-01-30 富准精密工业(深圳)有限公司 Heat radiating device
CN101128101A (en) * 2006-08-16 2008-02-20 富准精密工业(深圳)有限公司 Heat radiator assembly
CN201159867Y (en) * 2007-12-21 2008-12-03 亚冠国际有限公司 Extension type internal memory guard sheet
JP4603783B2 (en) * 2003-07-18 2010-12-22 株式会社日立製作所 Liquid cooling system and radiator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2559188Y (en) * 2002-05-28 2003-07-02 台达电子工业股份有限公司 Electronic member heat radiator assembling fastener
JP4603783B2 (en) * 2003-07-18 2010-12-22 株式会社日立製作所 Liquid cooling system and radiator
CN101115365A (en) * 2006-07-28 2008-01-30 富准精密工业(深圳)有限公司 Heat radiating device
CN101128101A (en) * 2006-08-16 2008-02-20 富准精密工业(深圳)有限公司 Heat radiator assembly
CN201159867Y (en) * 2007-12-21 2008-12-03 亚冠国际有限公司 Extension type internal memory guard sheet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107256075A (en) * 2017-08-23 2017-10-17 湖南智热技术股份有限公司 Soldering formula CPU liquid cooling heat radiators with internal memory heat sink
CN108845645A (en) * 2018-05-30 2018-11-20 郑州云海信息技术有限公司 One kind being applied to area of computer aided radiating fin fixing device
CN117369597A (en) * 2023-10-12 2024-01-09 沐曦科技(北京)有限公司 Main board

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