CN207765786U - A kind of semiconductor laser structure and its cooling device of directly logical coolant liquid heat dissipation - Google Patents
A kind of semiconductor laser structure and its cooling device of directly logical coolant liquid heat dissipation Download PDFInfo
- Publication number
- CN207765786U CN207765786U CN201820231288.7U CN201820231288U CN207765786U CN 207765786 U CN207765786 U CN 207765786U CN 201820231288 U CN201820231288 U CN 201820231288U CN 207765786 U CN207765786 U CN 207765786U
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- Prior art keywords
- shell
- cooling
- lower cover
- semiconductor laser
- cooling device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 67
- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 239000007788 liquid Substances 0.000 title claims abstract description 41
- 239000002826 coolant Substances 0.000 title claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 14
- 239000000110 cooling liquid Substances 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 9
- 239000002918 waste heat Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000960 laser cooling Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model embodiment discloses a kind of semiconductor laser structure and its cooling device of directly logical coolant liquid heat dissipation.The cooling device includes shell and the lower cover that is used cooperatively with shell, and shell is fixedly connected with lower cover, and accommodating chamber is equipped in shell, wherein, shell is equipped with a plurality of cooling duct in the lower section of accommodating chamber, and a plurality of cooling duct is towards the one end open of lower cover, and the other end is by housings close；Lower cover is equipped with into cooling liquid flowing channel and going out cooling liquid flowing channel, into cooling liquid flowing channel and is gone out cooling liquid flowing channel and is connected to a plurality of cooling duct, to form the circulation runner of coolant liquid.By the above-mentioned means, the utility model embodiment can reduce the junction temperature of semiconductor laser single tube, extend the service life of semiconductor laser, and improves the consistency of semiconductor laser output wavelength.
Description
Technical field
The utility model embodiment is related to laser technology field, more particularly to a kind of partly leading for directly logical coolant liquid heat dissipation
Body laser structure and its cooling device.
Background technology
High-capacity optical fiber laser advantage reliable and stable with its, non-maintaining is just gradually replacing traditional gas, solid to swash
Light device, become thin-sheet metal cutting, welding field important machining tool.
Currently, high-capacity optical fiber laser generally uses multiple semiconductor laser single tubes as its pumping source, a kind of typical case
High power pump laser cooling device as shown in Figure 1, including shell 1, coldplate 3 and setting in shell 1 and cooling
Thermal interfacial material 2 between plate 3, thermal interfacial material 2 can be graphite flake, heat-conducting silicone grease etc..
Accommodating chamber is equipped in shell 1, for placing semiconductor laser single tube 4, semiconductor laser single tube 4 can pass through solder 5
It is welded in shell 1；Cooling duct 31, the circulation runner as coolant liquid are equipped in coldplate 3.Semiconductor laser single tube 4 is sent out
Laser is penetrated, while generating waste heat, waste heat passes to coldplate 3 after shell 1 and thermal interfacial material 2, is flowed in cooling duct 31
Logical coolant liquid carries out heat exchange with waste heat, to realize the cooling to semiconductor laser single tube 4, the Cooling Design, semiconductor
The waste heat that laser single pipe 4 generates needs the conduction of 3 layer materials, is finally taken away by the coolant liquid of coldplate 3.
The output power of semiconductor laser single tube 4 is constantly promoted in recent years, and it is more than 20 watts to have had output power at present
Semiconductor laser single tube 4.For this large-power semiconductor laser single tube 4, in existing radiating mode, due to shell 1 with
Coolant liquid is not directly contacted with, and thermal interfacial material 2 can bring prodigious thermal resistance, is easy to cause the junction temperature of semiconductor laser single tube 4
It increases, influences its service life.In addition, the thermal resistance of some thermal interfacial materials 2 (such as graphite flake) is between shell 1 and coldplate 3
Mechanical erection very pressure-sensitive, some thermal interfacial materials 2 (such as heat-conducting silicone grease) the problem of there is also agings, not only influence partly to lead
The heat dissipation of body laser, also results in semiconductor laser wavelength drift, influences to use.
Utility model content
The utility model embodiment is mainly solving the technical problems that provide a kind of semiconductor of directly logical coolant liquid heat dissipation
Laser structure and its cooling device can reduce the junction temperature of semiconductor laser single tube by the way that cooling duct is arranged on shell,
Extend the service life of semiconductor laser, and improves the consistency of semiconductor laser output wavelength.
The utility model use a technical solution be：A kind of semiconductor laser of directly logical coolant liquid heat dissipation is provided
Cooling device, including shell and the lower cover that is used cooperatively with the shell, the shell be fixedly connected with the lower cover,
Accommodating chamber is equipped in the shell, wherein
The shell is equipped with a plurality of cooling duct in the lower section of the accommodating chamber, and a plurality of cooling duct is towards under described
The one end open of cover board, the other end is by the housings close；
The lower cover is equipped with into cooling liquid flowing channel and goes out cooling liquid flowing channel, it is described into cooling liquid flowing channel and it is described go out it is cold
But liquid stream road is connected to a plurality of cooling duct, to form the circulation runner of coolant liquid.
Optionally, the shell is equipped with groove in the lower section of the accommodating chamber, and the opening of the groove is towards the lower cover
Plate is equipped with multiple convex pipes in the groove, the cooling duct is formed between the tube wall of adjacent two convex pipe.
Optionally, the multiple convex pipe is in grid-like arrangement in the groove.
Optionally, the convex pipe is cylindrical tube, regular polygon pipe or waveform pipe.
In some embodiments, the two sides of the shell are equipped with multiple first threaded holes, in the lower cover and institute
It states and is equipped with the second threaded hole at the corresponding position of the first threaded hole；
The shell and the lower cover by screw sequentially pass through first threaded hole and second threaded hole into
Row fastening.
Optionally, sealing ring, the sealing ring is arranged between the shell and the lower cover, with the shell and institute
State and form a sealing area between lower cover, it is described into cooling liquid flowing channel and it is described go out cooling liquid flowing channel and a plurality of cooling it is logical
The circulation runner that road is formed is located in the sealing area.
Optionally, the lower cover is equipped with the embedded rings for being embedded in the sealing ring, and the depth of the embedded rings is small
In the thickness of the sealing ring.
The utility model embodiment also provides a kind of semiconductor laser structure of directly logical coolant liquid heat dissipation, including as above
The cooling device, and one or more semiconductor laser single tubes, one or more of semiconductor laser single tubes pass through
Solder is welded on the bottom of the accommodating chamber of the cooling device.
Optionally, the solder is preformed metal solder or liquid soldering paste.
The advantageous effect of the utility model embodiment is：The case where being different from the prior art, the utility model embodiment
Semiconductor laser includes cooling device and semiconductor laser single tube, wherein cooling device includes shell and makes with shell cooperation
Lower cover, shell is interior to be equipped with accommodating chamber, and semiconductor laser single tube is welded on the bottom of accommodating chamber by solder, and shell is holding
Receiving the lower section of chamber is equipped with a plurality of cooling duct, and lower cover is equipped with into cooling liquid flowing channel and cooling liquid flowing channel is gone out, into cooling liquid stream
Road and go out cooling liquid flowing channel and be connected to a plurality of cooling duct, to form the circulation runner of coolant liquid, during the work time, can lead to
It crosses logical coolant liquid directly to cool down shell, to take away the waste heat that semiconductor laser single tube generates in accommodating chamber, can reduce
The junction temperature of semiconductor laser single tube, extends the service life of semiconductor laser, and improves semiconductor laser output wavelength
Consistency.
Description of the drawings
Fig. 1 is the structural schematic diagram of the cooling device of the high power pump laser of the prior art；
Fig. 2 is the schematic diagram of the semiconductor laser structure of the directly logical coolant liquid heat dissipation of the utility model embodiment；
Fig. 3 is the structural schematic diagram of the lower cover of the cooling device of the utility model embodiment；
Fig. 4 is the structural schematic diagram of the shell of the cooling device of the utility model embodiment.
Specific implementation mode
For the ease of understanding the utility model, in the following with reference to the drawings and specific embodiments, the utility model is carried out more detailed
Thin explanation.It should be noted that when element is expressed " being fixed on " another element, it can be directly in another element
Upper or placed in the middle there may be one or more therebetween elements.When an element is expressed " connection " another element, it can
To be directly to another element or may exist one or more elements placed in the middle therebetween.This specification is used
Term " vertical ", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, technical and scientific term all used in this specification and the skill for belonging to the utility model
The normally understood meaning of technical staff in art field is identical.Art used in the description of the utility model in this specification
Language, which is only for the purpose of describing specific embodiments, is not intended to limitation the utility model.Term used in this specification
"and/or" includes any and all combinations of one or more relevant Listed Items.
Referring to Fig. 2, the semiconductor laser knot for the directly logical coolant liquid heat dissipation that Fig. 2, which is the utility model embodiment, to be provided
The schematic diagram of structure, the semiconductor laser structure include cooling device and one or more semiconductor laser single tubes 4, the present embodiment
By taking multiple semiconductor laser single tubes 4 as an example, wherein cooling device includes shell 6 and the lower cover being used cooperatively with shell 67, shell
Body 6 is fixedly connected with lower cover 7, is such as fastenedly connected by fastener, or welding；Accommodating chamber 61 is equipped in shell 6, it is multiple partly to lead
Volumetric laser single tube 4 is welded on the bottom of accommodating chamber 61, the laser that multiple semiconductor laser single tubes 4 are sent out, Ke Yizhi by solder 5
Output optical fibre output was connected, output optical fibre output can also be coupled into after the optical element shaping inside accommodating chamber 61.
Optionally, solder 5 is preformed metal solder or liquid soldering paste.
It is additionally provided with the mounting hole (not shown) through shell 6 in the cavity wall of accommodating chamber 61, swashs for installing semiconductor
The output optical fibre of light device.
Shell 6 the lower section of accommodating chamber 61 be equipped with a plurality of cooling duct 60, a plurality of cooling duct 60 towards lower cover 7 one
End opening, the other end are closed by shell 6；As shown in figure 3, lower cover 7 is equipped with into cooling liquid flowing channel 71 and goes out cooling liquid flowing channel
72, into cooling liquid flowing channel 71 and go out cooling liquid flowing channel 72 and be connected to a plurality of cooling duct 60, to form the circulation stream of coolant liquid
Road.
Specifically, the side wall of lower cover 7 be equipped with into cooling liquid flowing channel 71 be connected into coolant liquid mouth 710, with go out it is cold
What but liquid stream road 72 was connected to goes out coolant liquid mouth 720, when coolant liquid into coolant liquid mouth 710 from after entering into cooling liquid flowing channel 71,
Because cooling duct 60 is towards the one end open of lower cover 7, coolant liquid flows into cooling duct 60 under the action of hydraulic pressure, directly right
Shell 6 is cooled down, to take away the waste heat of the generation of the semiconductor laser single tube 4 in accommodating chamber 61.Since there is no hot interface material
Material, thermal resistance is small, and the cooling efficiency of coolant liquid is high, and cooling effect is only determined by the temperature of coolant liquid and flow, be not present due to
The problem of installing heat dissipation inconsistency caused by pressure and thermal interfacial material aging.
Wherein, coolant liquid can be pure water, distilled water, deionized water or added with additive (such as preservative, antifreeze
Liquid etc.) water.
Referring to Fig. 4, in the present embodiment, shell 6 is equipped with groove 62, the opening direction of groove 62 in the lower section of accommodating chamber 61
Lower cover 7, groove 62 is interior to be equipped with multiple convex pipes 63, and cooling duct 60, cooling duct 60 are formed between the tube wall of adjacent two convex pipe
Towards the one end open of lower cover 7, the other end is then closed by the slot bottom of groove 62.It should be noted that except adjacent two convex pipe
Outside the cooling duct 60 formed between tube wall, cooling duct 60 further includes in tube wall and groove 62 by outermost convex pipe 63
The channel that wall is formed.
Optionally, multiple convex pipes 63 are in grid-like arrangement in groove 62, with increasing heat radiation area, also so that each cooling
The width of flow path in channel 60 is consistent, and heat-exchange capacity is consistent.In other embodiments, multiple convex pipes 63 may not be used in groove 62 yet
In grid-like arrangement, and the interval of convex pipe 63 is set according to the cooling dynamics that different parts need, the interval of adjacent convex pipe 63 is got over
Greatly, the coolant liquid that the cooling duct 60 formed can accommodate and circulate is more, more can timely take away heat.
Convex pipe 63 is cylindrical tube, regular polygon pipe or waveform pipe.
In one embodiment, the two sides of shell 6 are equipped with multiple first threaded holes 64, in lower cover and the first threaded hole
The second threaded hole 73 is equipped at corresponding position；
Shell 6 and lower cover 7 sequentially passes through the first threaded hole 64 by screw and the second threaded hole 73 is fastened.
For the sealing effect for further strengthening between shell 6 and lower cover 7, which further includes：Sealing ring
(not shown), sealing ring are arranged between shell 6 and lower cover 7, and a seal area is formed between shell 6 and lower cover 7
Domain is located at the sealing area into cooling liquid flowing channel 71 and the circulation runner for going out cooling liquid flowing channel 72 and the formation of a plurality of cooling duct 60
It is interior.
Optionally, lower cover 7 is equipped with the embedded rings 73 for embedding sealing circle, and the depth of embedded rings 73 is less than sealing ring
Thickness.
The semiconductor laser structure of the directly logical coolant liquid heat dissipation of the utility model embodiment includes cooling device and half
Conductor Laser single tube 4, wherein cooling device includes shell 6 and the lower cover being used cooperatively with shell 67, is equipped with and holds in shell 6
Receive chamber 61, semiconductor laser single tube 4 is welded on the bottom of accommodating chamber 61 by solder 5, and shell 6 is equipped in the lower section of accommodating chamber 61
A plurality of cooling duct 60, lower cover 7 are equipped with into cooling liquid flowing channel 71 and go out cooling liquid flowing channel 72, into cooling liquid flowing channel 71 and go out
Cooling liquid flowing channel 72 is connected to a plurality of cooling duct 60, to form the circulation runner of coolant liquid, during the work time, can be passed through
Logical coolant liquid directly cools down shell 6, to take away the waste heat that semiconductor laser single tube 4 generates in accommodating chamber 61, can drop
The junction temperature of low semiconductor laser single tube 4, extends the service life of semiconductor laser, and improves semiconductor laser output wavelength
Consistency.
According to above-described embodiment, the utility model also provides a specific implementation, in the specific implementation, partly leads
Body laser includes：20 road semiconductor laser single tubes 4, solder 5, the shell 6 with cooling duct and lower cover 7.
20 road semiconductor laser single tubes 4 are welded on by solder 5 in the accommodating chamber 61 of shell 6, single channel semiconductor laser
The output power of single tube 4 is 22 watts, and output wavelength is 915 nanometers, luminous efficiency 60%.20 road semiconductor laser single tubes 1 are total
About 300 watts of waste heat are generated, waste heat passes through solder 5, passes to shell 6, and shell 6 is logical equipped with a plurality of cooling in the lower section of accommodating chamber 61
Road 60.
Lower cover 7 is fixed by screws in the lower section of shell 6, the circulation loop of a sealing can be formed between the two, in shell
Can directly shell 6 be cooled down by leading to coolant liquid between body 6 and lower cover 7.
When it is implemented, the transmitting laser of semiconductor laser single tube 4 passes through light after 6 internal optics shaping of shell
Fibre coupling output, coupling efficiency about 90%.When coolant temperature is 25 degree, and flow is 150 ls/h, 20 road semiconductors swash
About 400 watts of the laser power of light single tube 4, the temperature of shell 6<35 degree.
It should be noted that giving the preferable implementation of the utility model in the specification and its attached drawing of the utility model
Example, still, the utility model can be realized by many different forms, however it is not limited to which this specification is described to be implemented
Example, not as the additional limitation to the utility model content, purpose of providing these embodiments is makes to this reality these embodiments
Understanding with novel disclosure is more thorough and comprehensive.Also, above-mentioned each technical characteristic continues to be combined with each other, and is formed not upper
The various embodiments that face is enumerated are accordingly to be regarded as the range of the utility model specification record；Further, to ordinary skill
For personnel, it can be modified or changed according to the above description, and all these modifications and variations should all belong to this practicality newly
The protection domain of type appended claims.
Claims (9)
1. a kind of cooling device of the semiconductor laser of directly logical coolant liquid heat dissipation, including shell and make with shell cooperation
Lower cover, the shell are fixedly connected with the lower cover, and accommodating chamber is equipped in the shell, which is characterized in that
The shell is equipped with a plurality of cooling duct in the lower section of the accommodating chamber, and a plurality of cooling duct is towards the lower cover
One end open, the other end is by the housings close；
The lower cover is equipped with into cooling liquid flowing channel and goes out cooling liquid flowing channel, it is described into cooling liquid flowing channel and it is described go out coolant liquid
Runner is connected to a plurality of cooling duct, to form the circulation runner of coolant liquid.
2. cooling device according to claim 1, which is characterized in that
The shell is equipped with groove in the lower section of the accommodating chamber, and the opening of the groove is towards the lower cover, described recessed
It is equipped with multiple convex pipes in slot, the cooling duct is formed between the tube wall of adjacent two convex pipe.
3. cooling device according to claim 2, which is characterized in that
The multiple convex pipe is in grid-like arrangement in the groove.
4. cooling device according to claim 2, which is characterized in that
The convex pipe is cylindrical tube, regular polygon pipe or waveform pipe.
5. according to claim 1-4 any one of them cooling devices, which is characterized in that
The two sides of the shell are equipped with multiple first threaded holes, in lower cover position corresponding with first threaded hole
It sets place and is equipped with the second threaded hole；
The shell and the lower cover sequentially pass through first threaded hole and second threaded hole progress tightly by screw
Gu.
6. cooling device according to claim 5, which is characterized in that further include：
Sealing ring, the sealing ring are arranged between the shell and the lower cover, with the shell and the lower cover it
Between form a sealing area, it is described into cooling liquid flowing channel and it is described go out the stream that is formed with a plurality of cooling duct of cooling liquid flowing channel
Passage flow duct is located in the sealing area.
7. cooling device according to claim 6, which is characterized in that
The lower cover is equipped with the embedded rings for being embedded in the sealing ring, and the depth of the embedded rings is less than the sealing ring
Thickness.
8. a kind of semiconductor laser structure of directly logical coolant liquid heat dissipation, which is characterized in that any including such as claim 1-7
Cooling device described in, and one or more semiconductor laser single tubes, one or more of semiconductor laser single tubes are logical
Cross the bottom that solder is welded on the accommodating chamber of the cooling device.
9. semiconductor laser structure according to claim 8, which is characterized in that
The solder is preformed metal solder or liquid soldering paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820231288.7U CN207765786U (en) | 2018-02-08 | 2018-02-08 | A kind of semiconductor laser structure and its cooling device of directly logical coolant liquid heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820231288.7U CN207765786U (en) | 2018-02-08 | 2018-02-08 | A kind of semiconductor laser structure and its cooling device of directly logical coolant liquid heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207765786U true CN207765786U (en) | 2018-08-24 |
Family
ID=63180379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820231288.7U Withdrawn - After Issue CN207765786U (en) | 2018-02-08 | 2018-02-08 | A kind of semiconductor laser structure and its cooling device of directly logical coolant liquid heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207765786U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366512A (en) * | 2020-09-28 | 2021-02-12 | 北京凯普林光电科技股份有限公司 | Semiconductor laser heat radiation structure |
-
2018
- 2018-02-08 CN CN201820231288.7U patent/CN207765786U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366512A (en) * | 2020-09-28 | 2021-02-12 | 北京凯普林光电科技股份有限公司 | Semiconductor laser heat radiation structure |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Directly lead to radiating semiconductor laser structure of coolant liquid and cooling device thereof Effective date of registration: 20200114 Granted publication date: 20180824 Pledgee: Shenzhen SME financing Company limited by guarantee Pledgor: Shenzhen star Han Laser Technology Co., Ltd. Registration number: Y2020990000062 |
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| CP03 | Change of name, title or address |
Address after: 518000 5th floor, building B4, xujingchang Industrial Park, No. 39, Haoye Road, Xinhe community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Xinghan Laser Technology Co.,Ltd. Address before: 518000 No.301, A22, second industrial zone, Fuwei community, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XINGHAN LASER TECHNOLOGY Co.,Ltd. |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210222 Granted publication date: 20180824 Pledgee: Shenzhen SME financing Company limited by guarantee Pledgor: SHENZHEN XINGHAN LASER TECHNOLOGY Co.,Ltd. Registration number: Y2020990000062 |
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Correction item: abandonment of patent right Correct: Voluntary surrender of patent rights False: The initiative to abandon the patent Number: 07-02 Volume: 37 |
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