CN105957848A - Base plate with integrated heat tubes and module device thereof - Google Patents
Base plate with integrated heat tubes and module device thereof Download PDFInfo
- Publication number
- CN105957848A CN105957848A CN201610564582.5A CN201610564582A CN105957848A CN 105957848 A CN105957848 A CN 105957848A CN 201610564582 A CN201610564582 A CN 201610564582A CN 105957848 A CN105957848 A CN 105957848A
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- Prior art keywords
- base plate
- integrated heat
- heat pipe
- phase change
- integrated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a base plate with integrated heat tubes and a module device thereof, wherein the base plate with the integrated heat tubes comprises a base plate main body, direct liquid cooling fins and the integrated heat tubes, the direct liquid cooling fins are arranged at the lower surface of the metal base plate, the base plate main body and the direct liquid cooling fins both are internally provided with the integrated heat tubes, and the integrated heat tubes are internally provided with a low-temperature phase change liquid medium for quickly conducting heat. The base plate with the integrated heat tubes and the module device thereof, provided by the invention, have the integrated heat tubes with high heat dissipation efficiency and the direct liquid cooling fins, perform heat dissipation through the low-temperature phase change liquid medium and an external cooling medium, consequently can eliminate heat conduction silicone grease in a conventional power module, and can realize high-efficiency and reliable heat dissipation for a power module of an electric car.
Description
Technical field
The invention belongs to power electronic device technical field used for electric vehicle, particularly relate to one and there is collection
Become base plate and the modular device thereof of heat pipe.
Background technology
Currently, in order to alleviate whole world fossil energy crisis and ecological deterioration, the mankind are making great efforts exploitation can be again
Life and clean energy resource, the power system of application new cleaning fuel is the focus neck of power electronic industry research and development
One of territory.Hybrid electrically and pure electric automobile are partially or completely to use power-actuated system, have become
Substitute one of fossil energy, the most important product reducing CO2 emission and sound pollution for utilizing, be
The focus that research institution of various countries and enterprise competitively develop at present.Wherein, with power IGBT (Insulated Gate
Bipolar Transistor) module be core component inverter system be responsible for by battery provide direct current energy
Be converted to motor-driven AC energy, it is achieved the driving of motor and control in electric automobile.
Power semiconductor can produce certain power attenuation in the course of the work, the heat that this loss generates
Amount must be lost in external agency as soon as possible, so that the junction temperature liter of power device is maintained at relatively low
Scope, increases reliability and the life-span of device.As it is shown in figure 1, Fig. 1 is traditional electric automobile power mould
The schematic diagram of block assembly.This power model includes metal basal board 16, and the peripheral part on its top is provided with plastics
Housing 17, this plastics housing 17 is internally provided with insulating lining 15, is provided with weld layer 14, welding
Layer 14 arrangement above have chip 13, and are attached by bonding wire 12 between chip 13, and gap is filled out
It is filled with silica gel 11, but also includes the power terminal 18 being connected with insulating lining 15 and be connected with chip 13
Control terminal 19, the heat dissipation of power device is mainly transferred to by this power model by metal basal board 16
External metallization radiator.The general heat-conducting silicone grease that adds between metal basal board and external metallization radiator is to fill out
Fill the air gap therebetween, to realize preferably contact.But, the thermal resistance of this layer of silicone grease accounts for device
To about the half of radiator entire thermal resistance, bigger thermal resistance is not suitable for high-power undersized encapsulating structure,
And the higher operating ambient temperature of electric automobile module will be substantially reduced its radiating efficiency, along with electronic vapour
The raising of car performance, power density, heat management, operating temperature and the electric energy conversion efficiency to IGBT module
Etc. the requirement of aspect also improving constantly, this is accomplished by using more efficient structure and material to carry out module envelope
Dress.
Therefore, the heat radiation how realizing power model high efficient and reliable is the one of electric automobile power model exploitation
Individual major issue.
Summary of the invention
For solving the problems referred to above, the invention provides a kind of base plate with integrated heat pipe and modular device thereof,
It is capable of the heat radiation of power model high efficient and reliable.
A kind of base plate with integrated heat pipe that the present invention provides, including floor body, direct liquid cooling fin wing
And integrated heat pipe, described direct liquid cooling fin wing is arranged at the lower surface of described floor body, described base plate master
It is provided with described integrated heat pipe inside body and described direct liquid cooling fin wing.
Preferably, in the above-mentioned base plate with integrated heat pipe, described integrated heat pipe include pipeline and for
Quickly conduct the low temperature phase change liquid medium of heat, and described low temperature phase change liquid medium is positioned at described pipeline
Inside.
Preferably, in the above-mentioned base plate with integrated heat pipe, described floor body be internally provided with use
In the low temperature phase change liquid medium quickly conducting heat.
Preferably, in the above-mentioned base plate with integrated heat pipe, the inside of described direct liquid cooling fin wing is arranged
There is the low temperature phase change liquid medium for quickly conducting heat.
Preferably, in the above-mentioned base plate with integrated heat pipe, the outside setting of described direct liquid cooling fin wing
The cooling medium cooled down favorably is carried out with electric automobile engine coolant.
Preferably, in the above-mentioned base plate with integrated heat pipe, described pipeline be diameter range be 1 millimeter extremely
The copper pipe of 3 millimeters or aluminum pipe.
Preferably, in the above-mentioned base plate with integrated heat pipe, described low temperature phase change liquid medium is liquid
One or more in ammonia, acetone, methanol or heptane.
Preferably, in the above-mentioned base plate with integrated heat pipe, the outer surface of described direct liquid cooling fin wing sets
It is equipped with nickel alloy coating.
Preferably, in the above-mentioned base plate with integrated heat pipe, described cooling medium is ethylene glycol and water
Mixed liquor.
A kind of modular device that the present invention provides, including the integrated heat pipe that has as described in any one above
Base plate, comprise the insulating lining of power electronic device, encapsulating package and external heat sink；
The upper surface of the described base plate with integrated heat pipe comprises power by soldering or sintering processing with described
The insulating lining of electronic device is connected；
The surrounding enclosed of the described base plate with integrated heat pipe be provided with described encapsulating package, and pass through
Self-tapping screw is connected；
The lower surface of the described base plate with integrated heat pipe is by encapsulant and mounting hole site and described outside
Radiator is connected.
By foregoing description, a kind of base plate with integrated heat pipe and module thereof that the present invention provides fill
Put, owing to floor body is internally provided with the integrated heat pipe for transferring heat to outside, by thermal losses
Quickly take away from power semiconductor, and the lower surface of described floor body is provided with for cooling
Direct liquid cooling fin wing, it is possible to effectively improving heat radiation efficiency, reduces system thermal resistance, thus on the whole can be real
Existing modular device dispels the heat to high efficient and reliable in electric automobile motor drive system.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to reality
Execute the required accompanying drawing used in example or description of the prior art to be briefly described, it should be apparent that below,
Accompanying drawing in description is only embodiments of the invention, for those of ordinary skill in the art, not
On the premise of paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
Fig. 1 is the schematic diagram of traditional electric automobile power model；
The schematic diagram of a kind of base plate with integrated heat pipe that Fig. 2 provides for the embodiment of the present application；
The schematic diagram of a kind of modular device that Fig. 3 provides for the embodiment of the present application；
Fig. 4 has the tomograph of the base plate of integrated heat pipe for the another kind that the embodiment of the present application provides；
Fig. 5 has the top view of the base plate of integrated heat pipe for the another kind that the embodiment of the present application provides；
Fig. 6 has the side view of the base plate of integrated heat pipe for the another kind that the embodiment of the present application provides；
Fig. 7 includes having the modular device of the base plate of integrated heat pipe for the another kind that application embodiment provides
Assembling assumption diagram.
Detailed description of the invention
The core concept of the present invention is to provide a kind of base plate with integrated heat pipe and modular device, energy
Enough realize power model to dispel the heat to high efficient and reliable in electric automobile motor drive system.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present invention, and
It is not all, of embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under creative work premise, broadly fall into the scope of protection of the invention.
The first of the embodiment of the present application offer has the base plate of integrated heat pipe as in figure 2 it is shown, Fig. 2 is this Shen
Please the schematic diagram of a kind of base plate with integrated heat pipe that provides of embodiment.This base plate includes:
Floor body 21, direct liquid cooling fin wing 22 and integrated heat pipe 23, described direct liquid cooling fin wing 22 is arranged
Internal all in the lower surface of described floor body 21, described floor body 21 and described direct liquid cooling fin wing 22
It is provided with described integrated heat pipe 23.
Wherein, described floor body 21 generally metal basal board, the material used by making can be copper, aluminum
Molybdenum or copper aluminum composite material, it is also possible to use ceramic substrate, concrete, can be selected for aluminium silicon carbide, carbon
Changing aluminum or graphite material, the present embodiment can be preferably metallic copper material；Described direct liquid cooling fin wing 22
Different according to radiating requirements, the lower surface of described floor body 21 it is arranged on according to certain layout；Direct liquid cooling
Fin wing 22 is the cylindrical structural according to 6 row 8 row form arrays, and fin wing height is 5 millimeters, described direct liquid
Cold fin wing, typically by forging or being stamped and formed out pin aliform heat-conducting part, carries out direct liquid radiating or gas dissipates
Heat, pin aliform heat-conducting part can be discrete or the cylinder of platoon, prismatic or conical etc., pin wing
Size, height and spacing can be optimized according to demand, be substantially reduced the thermal resistance of system, to reach
Optimal radiating effect；Described integrated heat pipe 23 is subordinated to described floor body 21 and described direct liquid cooling fin
Wing 22.
By foregoing description, the first of the embodiment of the present application offer has the base plate of integrated heat pipe,
Owing to floor body is internally provided with the integrated heat pipe for transferring heat to outside, thermal losses is quick
Take away from power semiconductor, and the lower surface of described floor body is provided with direct for cool down
Liquid cold fin wing, it is possible to effectively improving heat radiation efficiency, reduces system thermal resistance, thus on the whole can be electronic
High efficient and reliable ground heat radiation in electric motor of automobile drive system.
The second that the embodiment of the present application provides has the base plate of integrated heat pipe, be above-mentioned the first have
On the basis of the base plate of integrated heat pipe, also include following technical characteristic:
With continued reference to Fig. 2, described integrated heat pipe 23 includes pipeline 231 and for quickly conducting the low temperature of heat
Phase-change liquid medium 232, described pipeline 231 is positioned at the inside of described integrated heat pipe 23, and described low-temperature phase
Becoming liquid medium 232 and be positioned at the inside of described pipeline 231, the quantity of described pipeline 231 and layout are according to power
Dissipation from electronic devices demand is different and different, it should be noted that due at floor body and direct liquid cooling
All there is described integrated heat pipe 23 inside fin wing, therefore both is demarcated by Fig. 2.
The quantity of described pipeline 231 is different and different according to power electronic device radiating requirements with layout, this reality
The array format executing pipeline 231 described in example is 24 × 1, and placement position is the inside of whole floor body 21；
Described low temperature phase change liquid medium 232 boiling point is low and volatile liquid medium, and its two ends are respectively heat stream
Enter and flow out district, middle for evaporating and condensing zone, utilize evaporation and the phase transition process flash heat transfer of condensation,
Thermal losses is quickly taken away from power electronic device, improves the reliability of temperature cycles.
The embodiment of the present application provide the third there is the base plate of integrated heat pipe, be above-mentioned the first have
On the basis of the base plate of integrated heat pipe, also include following technical characteristic:
The low temperature phase change liquid medium being internally provided with for quickly conducting heat of described floor body.
In this case, utilize low temperature phase change liquid medium within floor body in evaporation and condensation
Phase transition process flash heat transfer, quickly takes away thermal losses from power electronic device such that it is able to reply mould
Block quickly discharges the situation of amount of heat, improves the reliability of temperature cycles.
The 4th kind of base plate with integrated heat pipe that the embodiment of the present application provides, be above-mentioned the first have
On the basis of the base plate of integrated heat pipe, also include following technical characteristic:
The low temperature phase change liquid for quickly conduction heat that is internally provided with of described direct liquid cooling fin wing is situated between
Matter.
In this case, the low temperature phase change liquid medium utilizing the inside of described direct liquid cooling fin wing is steaming
Send out and the phase transition process flash heat transfer of condensation, thermal losses is quickly taken away from power electronic device, improve
The reliability of temperature cycles.
The 5th kind of the embodiment of the present application offer has the base plate of integrated heat pipe, is to have at above-mentioned 4th kind
On the basis of the base plate of integrated heat pipe, also include following technical characteristic:
The outside of described direct liquid cooling fin wing is provided with and utilizes electric car engine coolant to carry out cooling down
Cooling medium, this makes it possible to quickly be conducted by the heat in described direct liquid cooling fin wing further.
The 6th kind of the embodiment of the present application offer has the base plate of integrated heat pipe, is to have at above-mentioned the second
On the basis of the base plate of integrated heat pipe, also include following technical characteristic:
Described pipeline be diameter range be copper pipe or the aluminum pipe of 1 millimeter to 3 millimeters, can be more preferably
The copper pipe of a diameter of 1.5 millimeters.
The 7th kind of base plate with integrated heat pipe that the embodiment of the present application provides, is at above-mentioned the second to the
In four kinds of base plates with integrated heat pipe on the basis of any one, also include following technical characteristic:
Described low temperature phase change liquid medium is one or more in liquid ammonia, acetone, methanol or heptane.
These medium boiling points are low, volatile, utilize evaporation and the phase transition process flash heat transfer of condensation, it is possible to by heat
Loss is quickly taken away from power semiconductor such that it is able to reply module quickly discharges amount of heat
Situation.
The 8th kind of base plate with integrated heat pipe that the embodiment of the present application provides, be above-mentioned the first have
On the basis of the base plate of integrated heat pipe, also include following technical characteristic:
The outer surface of described direct liquid cooling fin wing is provided with nickel alloy coating, it is possible to help formed brazing layer or
Carry out solder welding, and can be anticorrosive.
The 9th kind of the embodiment of the present application offer has the base plate of integrated heat pipe, is to have at above-mentioned 5th kind
On the basis of the base plate of integrated heat pipe, also include following technical characteristic:
Described cooling medium is the mixed liquor of ethylene glycol and water, and water-cooling pattern thus can be utilized to carry in time
Walk heat.
The embodiment of the present application provide modular device as it is shown on figure 3, Fig. 3 provide for the embodiment of the present application one
Plant the schematic diagram of modular device.This modular device includes the integrated heat pipe that has as described in any one above
Base plate 20, comprise the insulating lining 30 of power electronic device, encapsulating package 40 and external heat sink 50；
The upper surface of the described base plate with integrated heat pipe 20 comprises merit by soldering or sintering processing with described
The insulating lining 30 of rate electronic device is connected, and this insulating lining 30 can be insulating ceramics liner plate, insulating barrier
Material can be with any one in selective oxidation aluminum, aluminium nitride or silicon nitride, described insulating lining 30 upper
Surface connects has the power electronic device 31 interconnected by bonding wire (to use igbt chip and FRD core
Sheet)；
The surrounding enclosed of the described base plate 20 with integrated heat pipe be provided with described encapsulating package 40, and
Being connected by self-tapping screw, this encapsulating package 40 is to utilize outside the plastics that integration injection molding and forming technology is formed
Shell；
The lower surface of the described base plate 20 with integrated heat pipe by encapsulant and mounting hole site with described outside
Portion's radiator 50 is connected, and described external heat sink 50 includes that water inlet 51, outlet 52 and cooling are situated between
Matter 53.
The another kind that the embodiment of the present application provides has the base plate of integrated heat pipe as shown in Figure 4, Figure 5 and Figure 6,
Fig. 4 has the tomograph of the base plate of integrated heat pipe for the another kind that the embodiment of the present application provides, and Fig. 5 is
The another kind that the embodiment of the present application provides has the top view of the base plate of integrated heat pipe, and Fig. 6 is that the application implements
The another kind that example provides has the side view of the base plate of integrated heat pipe.
The material of this base plate is copper aluminum composite material, and pipeline 61 therein is the aluminum pipe of a diameter of 2 millimeters, institute
The array format stating pipeline 61 is that 6 row 3 arrange, point three Regional Distributions inside whole floor body 60, this
Just can place liner plate respectively and dispel the heat in portion on each zone.In this base plate, direct liquid cooling fin wing
62 according to the different lower surface being arranged on described floor body 60 according to certain layout of radiating requirements, here
The conical structure that direct liquid cooling fin wing 62 arranges according to 8 row 12 row forms, fin wing height is 6 millimeters.
Here the mixed liquor that low temperature phase change liquid medium is acetone and heptane used, described direct liquid cooling fin
The cooling medium that wing 62 outside is arranged is ethylene glycol with water according to the mixing of certain 9:1 proportions
Liquid.
Include having the base plate of integrated heat pipe for the another kind that the embodiment of the present application provides with reference to Fig. 7, Fig. 7
The assembling assumption diagram of modular device.The another kind of modular device that the embodiment of the present application provides, including having collection
Become the base plate 70 of heat pipe, comprise the insulating lining (not shown) of power electronic device, external cooling
Device 71 and encapsulating package 72.In this modular device, the upper surface of base plate 70 passes through nanometer silver sintering process
With the insulating lining phase comprising the power electronic device (using SiC MOSFET chip) with specific function
Even；The lower surface of described insulating lining is connected with the upper surface of described base plate 70, and this insulating lining material is
Aluminium nitride；The upper surface of described insulating lining connects the power electronic device interconnected by bonding wire.
The surrounding enclosed of the described base plate 70 with integrated heat pipe be provided with described encapsulating package 72, and pass through
Self-tapping screw is connected；The lower surface of the described base plate 70 with integrated heat pipe passes through encapsulant and installing hole
Position is connected with described external heat sink 71, thus constitutes the mould of a kind of base plate including having integrated heat pipe
Block assembly.
By foregoing description, a kind of module including there is the base plate of integrated heat pipe that the application provides
Device, owing to base plate interior is provided with the integrated heat pipe for transferring heat to outside, described integrated heat
The pipe interior of pipe has the low temperature phase change liquid medium for quickly conducting heat, and this just can utilize steaming
Send out and the phase transition process of condensation, make heat quickly conduct, by thermal losses quickly from power semiconductor band
Walk；And the lower surface of described base plate is provided with the direct liquid cooling fin wing for cooling, described direct liquid cooling
Being internally provided with for the quick low temperature phase change liquid medium conducting heat of fin wing, and outside is provided with
Electric car engine coolant is utilized to carry out the cooling medium cooled down, it is possible to effective improving heat radiation efficiency,
Reduction system thermal resistance, thus it is high in electric automobile motor drive system to be capable of power model on the whole
Effect is reliably dispelled the heat.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses
The present invention.Multiple amendment to these embodiments will be aobvious and easy for those skilled in the art
See, generic principles defined herein can without departing from the spirit or scope of the present invention,
Realize in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein,
And it is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (10)
1. a base plate with integrated heat pipe, it is characterised in that include floor body, direct liquid cooling fin
Wing and integrated heat pipe, described direct liquid cooling fin wing is arranged at the lower surface of described floor body, described base plate
It is provided with described integrated heat pipe inside main body and described direct liquid cooling fin wing.
The base plate with integrated heat pipe the most according to claim 1, it is characterised in that described integrated
Heat pipe includes pipeline and for quickly conducting the low temperature phase change liquid medium of heat, and described low temperature phase change liquid
Body medium is positioned at the inside of described pipeline.
The base plate with integrated heat pipe the most according to claim 1, it is characterised in that described base plate
The low temperature phase change liquid medium being internally provided with for quickly conducting heat of main body.
The base plate with integrated heat pipe the most according to claim 1, it is characterised in that described directly
The low temperature phase change liquid medium being internally provided with for quickly conducting heat of liquid cold fin wing.
The base plate with integrated heat pipe the most according to claim 4, it is characterised in that described directly
The outside of liquid cold fin wing is provided with and utilizes electric car engine coolant to carry out the cooling medium cooled down.
The base plate with integrated heat pipe the most according to claim 2, it is characterised in that described pipeline
For copper pipe that diameter range is 1 millimeter to 3 millimeters or aluminum pipe.
7. according to the base plate with integrated heat pipe described in any one of claim 2-4, it is characterised in that
Described low temperature phase change liquid medium is one or more in liquid ammonia, acetone, methanol or heptane.
The base plate with integrated heat pipe the most according to claim 1, it is characterised in that described directly
The outer surface of liquid cold fin wing is provided with nickel alloy coating.
The base plate with integrated heat pipe the most according to claim 5, it is characterised in that described cooling
Medium is the mixed liquor of ethylene glycol and water.
10. a modular device, it is characterised in that include having as described in any one of claim 1-9
The base plate of integrated heat pipe, comprise the insulating lining of power electronic device, encapsulating package and external heat sink；
The upper surface of the described base plate with integrated heat pipe comprises power by soldering or sintering processing with described
The insulating lining of electronic device is connected；
The surrounding enclosed of the described base plate with integrated heat pipe be provided with described encapsulating package, and pass through
Self-tapping screw is connected；
The lower surface of the described base plate with integrated heat pipe is by encapsulant and mounting hole site and described outside
Radiator is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610564582.5A CN105957848B (en) | 2016-07-18 | 2016-07-18 | A kind of bottom plate and its modular device with integrated heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610564582.5A CN105957848B (en) | 2016-07-18 | 2016-07-18 | A kind of bottom plate and its modular device with integrated heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105957848A true CN105957848A (en) | 2016-09-21 |
| CN105957848B CN105957848B (en) | 2019-01-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610564582.5A Active CN105957848B (en) | 2016-07-18 | 2016-07-18 | A kind of bottom plate and its modular device with integrated heat pipe |
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| Country | Link |
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| CN (1) | CN105957848B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602929A (en) * | 2019-10-08 | 2019-12-20 | 中国电子科技集团公司第十八研究所 | MPPT controlling means based on heat pipe heat dissipation |
| EP3621106A4 (en) * | 2017-06-14 | 2020-05-06 | Yangzhou Guoyang Electronic Co., Ltd. | Low parasitic inductance power module and double-sided heat-dissipation low parasitic inductance power module |
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| CN110662406A (en) * | 2019-11-04 | 2020-01-07 | 深圳航天东方红海特卫星有限公司 | Phase-change heat exchanger |
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| CN105957848B (en) | 2019-01-29 |
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