CN113573540A - Heat sink, method for manufacturing the same, and electronic device - Google Patents
Heat sink, method for manufacturing the same, and electronic device Download PDFInfo
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- CN113573540A CN113573540A CN202010357227.7A CN202010357227A CN113573540A CN 113573540 A CN113573540 A CN 113573540A CN 202010357227 A CN202010357227 A CN 202010357227A CN 113573540 A CN113573540 A CN 113573540A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims description 28
- 230000007704 transition Effects 0.000 claims abstract description 82
- 239000000843 powder Substances 0.000 claims description 84
- 229910052751 metal Inorganic materials 0.000 claims description 51
- 239000002184 metal Substances 0.000 claims description 51
- 238000005452 bending Methods 0.000 claims description 18
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 112
- 239000007788 liquid Substances 0.000 description 30
- 230000000694 effects Effects 0.000 description 14
- 238000005245 sintering Methods 0.000 description 14
- 229910052755 nonmetal Inorganic materials 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application provides a heat dissipation device, a manufacturing method thereof and an electronic device. The manufacturing method of the heat dissipation device comprises the following steps: manufacturing a first cover plate, wherein the first cover plate comprises a cover body and a pipe body, the cover body comprises a first surface, one end of the pipe body is fixedly connected to the cover body, the pipe body extends towards the direction of the cover body, which is deviated from the first surface, and a connecting part is formed at the connecting part of the inner wall of the pipe body and the first surface; and a first capillary structure is formed on the inner wall, a second capillary structure is formed on the first surface, and a transition capillary structure is formed on the connecting part and is connected between the first capillary structure and the second capillary structure. The manufacturing method of the heat dissipation device is used for ensuring smooth internal circulation of the heat dissipation device and improving the heat dissipation performance of the heat dissipation device.
Description
Technical Field
The present disclosure relates to heat dissipation technologies, and particularly to a heat dissipation device, a method for manufacturing the same, and an electronic device.
Background
The three-dimensional vapor chamber (3-dimensional DVC) comprises a vapor chamber and heat pipes, wherein the inner cavity of the vapor chamber is communicated with the inner cavity of the heat pipes, the 3DVC can not only transfer heat concentrated on a heating part to the vapor chamber, but also directly transfer the heat to the heat pipes with different heights, the heat diffusion process is expanded from two dimensions to three dimensions, the heat is more efficiently transferred to the heat pipes and finally to the air, and the problem of low heat dissipation efficiency caused by the overhigh height of the heat pipes can be effectively solved. The 3DVC manufacturing method in the prior art cannot ensure that the capillary structure in the temperature-uniforming plate is fully connected with the capillary structure in the heat pipe, so that the liquid working medium is not smoothly circulated in the inner cavity of the heat pipe and the inner cavity of the temperature-uniforming plate, and the heat dissipation performance of the 3DVC is influenced.
Disclosure of Invention
The application provides a manufacturing method of a heat dissipation device, which is used for ensuring smooth internal circulation of the heat dissipation device and improving heat dissipation performance of the heat dissipation device.
The application also provides a heat dissipation device and an electronic device.
The manufacturing method of the heat dissipation device comprises the following steps:
manufacturing a first cover plate, wherein the first cover plate comprises a cover body and a pipe body, the cover body comprises a first surface, one end of the pipe body is fixedly connected to the cover body, the pipe body extends towards the direction of the cover body, which is deviated from the first surface, and a connecting part is formed at the connecting part of the inner wall of the pipe body and the first surface;
and a first capillary structure is formed on the inner wall, a second capillary structure is formed on the first surface, and a transition capillary structure is formed on the connecting part and is connected between the first capillary structure and the second capillary structure.
The manufacturing method of the present application can be understood by forming the transition capillary structure connecting the first capillary structure and the second capillary structure on the connection portion between the first capillary structure formed on the inner wall and the second capillary structure formed on the first surface, wherein the transition capillary structure connects the first capillary structure of the tube body at the opening with the second capillary structure of the first surface of the cover body at the periphery thereof, that is, the first capillary structure of the inner wall and the second capillary structure of the first surface realize the maximization of the connection area through the transition capillary structure, thereby ensuring the good connection between the first capillary structure of the inner wall and the second capillary structure of the first surface, reducing the flow resistance of the liquid working medium and the gas working medium between the first capillary structure in the tube body and the second capillary structure of the cover body, therefore, the liquid medium in the heat dissipation device can smoothly circulate between the inner wall and the first surface through the transition capillary structure, and the heat dissipation performance of the heat dissipation device is effectively improved.
In one such aspect, the step of forming the first capillary structure, the second capillary structure and the transitional capillary structure includes: forming a layer to be sintered on the inner wall, the first surface and the connecting portion, and performing high-temperature treatment on the layer to be sintered to form the first capillary structure, the second capillary structure and the transition capillary structure. It can be understood that the first capillary structure, the second capillary structure and the transition capillary structure are formed through the same high-temperature processing step, so that the increase of the processing steps caused by the respective formation of the first capillary structure, the second capillary structure and the transition capillary structure is effectively avoided, the production efficiency of the product is improved, and the production cost of the product is reduced.
In one embodiment, the layer to be sintered includes a powder layer formed on the inner wall, the first surface, and the connecting portion.
In the embodiment, the powder layer is formed on the inner wall, the first surface and the connecting portion, and the powder layer extends from the inner wall to the first surface, that is, the inner wall, the connecting portion and the first surface form the powder layer which is an integrated structure, so as to ensure the connection strength of the powder layer on the inner wall, the connecting portion and the first surface, and further ensure the connection strength between the first capillary structure, the transition capillary structure and the second capillary structure on the inner wall, the connecting portion and the first surface, and the liquid medium in the heat dissipation device can smoothly circulate between the inner wall and the first surface through the transition capillary structure, thereby effectively improving the heat dissipation performance of the heat dissipation device.
In one embodiment, the layer to be sintered comprises a powder layer formed on the first surface and a metal mesh formed on the inner wall. Of course, in other embodiments, the layer to be sintered comprises a metal mesh formed on said first surface and a powder layer formed on said inner wall.
In one embodiment, the layer to be sintered includes a powder layer formed on the first surface, a metal mesh formed on the inner wall, and a metal mesh formed on the connecting portion. The metal net extends out of the inner wall to form the inner wall on the connecting portion and is connected with the powder layer, namely, the inner wall and the metal net formed on the connecting portion are of an integral structure, the first cover plate is processed at high temperature to fix the metal net and the powder layer, so that the powder layer and the metal net form the first capillary structure, the transition capillary structure and the second capillary structure which are connected, liquid media in the heat dissipation device can circulate smoothly between the inner wall and the first surface through the transition capillary structure, and the heat dissipation performance of the heat dissipation device is effectively improved. Of course, in other embodiments, the metal mesh formed at the inner wall and at the connection portion is a single metal. Forming a powder layer on the connecting part; alternatively, a powder layer and a metal mesh are formed on the connecting portion.
In one embodiment, the first cover plate is subjected to a high temperature treatment by a sintering process, so that the powder layer forms the fixed first capillary structure, the transition capillary structure and the second capillary structure.
In one embodiment, the manufacturing of the first cover plate specifically includes:
providing a pipe body, and bending an opening end of the pipe body to form a bending section at the opening of the pipe body;
providing a cover body;
and penetrating the pipe body through the cover body, limiting the bent section on the first surface, and forming the connecting part by the bent section to form the first cover plate.
It can be understood that the pipe body can increase the connection area between the pipe body and the cover body by forming the bending section, so that the pipe body is more stably connected to the cover body. In this embodiment, the pipe body and the cover body are respectively independent bodies and are connected into a whole through a connection process. Specifically, the pipe body is connected to the cover body through diffusion welding, and the connection process of the pipe body and the cover body and the sintering process of the first cover plate can be performed simultaneously, so that the number of working procedures of the heat dissipation device is reduced, the manufacturing efficiency is improved, and the production cost is reduced. Of course, in other embodiments, the pipe body is connected to the cover body by other connection methods such as brazing, and the connection process of the pipe body and the cover body and the sintering process of the first cover plate may be performed in steps. The tube body and the cover body can also be of an integrally formed integral structure.
In one embodiment, a through hole is formed in the cover before the tube is fixed to the cover, and the tube is installed and fixed in the through hole while the tube is fixed to the cover, so that the inner wall of the tube is connected to the first surface to form the transitional capillary structure between the inner wall of the tube and the first surface.
In one embodiment, the manufacturing method further includes providing a fixing ring communicating with the through hole on the second surface of the cover, and disposing the tube body in the fixing ring when the tube body is fixed to the cover. The fixing ring is used for positioning the pipe body, and meanwhile, the fixing ring also increases the connecting area of the pipe body and the cover body, and increases the stability of the pipe body, so that the pipe body is more stably fixed in the cover body. Of course, in other embodiments, the fixing ring and the cover are integrally formed into a single structure.
In one embodiment, the method of manufacturing further comprises sealing a gap between the retaining ring and the tubular body. Through sealed solid fixed ring with gap between the body is guaranteeing the body with on the basis of the seal between the lid, make the body with area of contact between the lid is bigger, improves heat abstractor's radiating effect.
In one embodiment, the manufacturing method further includes forming a groove on the first surface, and when the pipe body is fixed to the cover, the bending section is accommodated in the groove, and a surface of the bending section is coplanar with the first surface. That is to say, the first surface provides an accommodating space for the bending section by forming the groove, so that the bending section does not protrude out of the first surface, thereby ensuring that the transition capillary structure is formed more uniformly between the first surface and the inner wall, and improving the heat dissipation effect of the heat dissipation device.
In one embodiment, the manufacturing method further includes covering a second cover plate with the first cover plate toward the first surface to form the heat dissipation device. Specifically, the first cover plate and the second cover plate are connected by welding to form a closed space. Of course, in other embodiments, the first cover plate and the second cover plate may be connected by other welding processes such as diffusion welding.
In one embodiment, a third capillary structure is formed on the second cover plate simultaneously with the formation of the second capillary structure, and the second capillary structure and the third capillary structure are connected when the second cover plate is covered with the first cover plate. That is to say, the second capillary structure and the third capillary structure are formed simultaneously through the same process, so that the production time of the product is effectively reduced, the production efficiency is improved, and the production cost is reduced.
In one embodiment, the method of manufacturing further comprises filling a liquid working medium between the first cover plate and the second cover plate. In this embodiment, the liquid working medium is water. So as to ensure the internal heat circulation of the heat dissipation device and improve the heat dissipation effect of the heat dissipation device. Of course, in other embodiments, the liquid working medium may also be one or more solutions of methanol, acetone, and the like.
The application heat abstractor include first apron, first capillary structure, second capillary structure and transition capillary structure, first apron includes lid and body, the body runs through and is fixed in the lid, the inner wall of body with the junction of the first surface of lid forms connecting portion, the inner wall is formed with first capillary structure, the first surface is formed with second capillary structure, transition capillary structure locates on connecting portion and connects first capillary structure with between the second capillary structure.
The heat dissipation device of the present application is connected between the first capillary structure and the second capillary structure through the transition capillary structure, it can be understood that the transition capillary structure connects the first capillary structure at the opening of the tube body with the second capillary structure at the periphery of the first capillary structure, that is, the first capillary structure of the inner wall and the second capillary structure at the first surface realize the maximization of the connection area through the transition capillary structure, ensure the good connection between the first capillary structure of the inner wall and the second capillary structure of the first surface, reduce the flow resistance between the first capillary structure in the tube body and the second capillary structure of the cover body of the liquid working medium and the gas working medium, and thus ensure that the liquid working medium inside the heat dissipation device can smoothly circulate between the inner wall and the first surface through the transition capillary structure, the heat dissipation performance of the heat dissipation device is effectively improved.
In one embodiment, the first capillary structure, the transition capillary structure and the second capillary structure are integrally formed, so that the connection strength among the first capillary structure, the transition capillary structure and the second capillary structure is ensured, a liquid medium in the heat dissipation device can smoothly circulate between the inner wall and the first surface through the transition capillary structure, and the heat dissipation performance of the heat dissipation device is effectively improved.
The first capillary structure and the transition capillary structure are integrally formed into an integral structure, so that the connection strength between the first capillary structure and the transition capillary structure is guaranteed, liquid media in the heat dissipation device can smoothly circulate between the inner wall and the first surface through the transition capillary structure, and the heat dissipation performance of the heat dissipation device is effectively improved.
The pipe body comprises a bending section located at the opening end of the pipe body, the bending section is located on the first surface and connected with the first surface, and the bending section forms the connecting portion to increase the connecting area between the pipe body and the cover body, so that the pipe body is connected onto the cover body more stably.
The pipe body comprises a bending section located at the opening end of the pipe body, the first surface comprises a groove, the bending section is contained in the groove, the surface of the bending section is coplanar with the first surface, so that the bending section does not protrude out of the first surface, the transition capillary structure is ensured to be more uniform between the first surface and the inner wall, and the heat dissipation effect of the heat dissipation device is improved.
This application electronic equipment is including generating heat and foretell heat abstractor, generate heat the piece and pass through heat abstractor dispels the heat, through heat abstractor does generate heat a heat dissipation has guaranteed the electrical property of the piece that generates heat, and then has guaranteed electronic equipment's performance.
The manufacturing method of the present application can be understood by forming the transition capillary structure connecting the first capillary structure and the second capillary structure on the connection portion between the first capillary structure formed on the inner wall and the second capillary structure formed on the first surface, wherein the transition capillary structure connects the first capillary structure of the tube body at the opening with the second capillary structure of the first surface of the cover body at the periphery thereof, that is, the first capillary structure of the inner wall and the second capillary structure of the first surface realize the maximization of the connection area through the transition capillary structure, thereby ensuring the good connection between the first capillary structure of the inner wall and the second capillary structure of the first surface, reducing the flow resistance of the liquid working medium and the gas working medium between the first capillary structure in the tube body and the second capillary structure of the cover body, therefore, the liquid medium in the heat dissipation device can smoothly circulate between the inner wall and the first surface through the transition capillary structure, and the heat dissipation performance of the heat dissipation device is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.
Fig. 1 is a schematic structural diagram of a portion of an electronic device provided in an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a heat dissipation device provided in the present application.
Fig. 3 is a schematic cross-sectional view of the heat dissipation device provided in fig. 2.
Fig. 4 is a schematic structural diagram of another embodiment of the heat dissipation device of the present application.
Fig. 5 is a schematic structural diagram of another embodiment of the heat dissipation device of the present application.
Fig. 6 is a schematic flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present application.
Fig. 7-12 are schematic flow charts of the manufacturing method provided in fig. 6.
Detailed Description
The embodiments of the present application will be described below with reference to the drawings.
The performance of current electronic products is gradually improved, and the increasing demands of consumers are met. The performance of the electronic product is mainly determined by the capability of the chip, and generally, the faster the computation speed of the chip is, the stronger the performance is, and the larger the heat productivity of the chip is. If the heat of the chip cannot be effectively conducted out, the temperature of the chip can be over-heated, so that the chip can work in a frequency reduction mode and even be burnt out. Electronic products show an increasing trend in the aspect of chip power consumption, and in the near future, the heat dissipation requirement of products with higher performance may reach more than 500W, that is, the maximum heat dissipation capability of a heat dissipation device for dissipating heat of the products needs to reach more than 500W, and the heat dissipation of the products faces a significant challenge. How to solve the heat dissipation problem of the high-power-consumption chip is one of the important factors restricting the upgrade of the electronic product.
In view of this, an electronic device provided in the embodiments of the present application is please refer to fig. 1, and fig. 1 is a schematic partial structural diagram of the electronic device provided in the embodiments of the present application. The electronic device 100 includes, but is not limited to, an electronic device having a heat generating member, such as a mobile phone, a computer, a multimedia player, an electronic book reader, a notebook computer, a vehicle-mounted device, or a communication device. The electronic device 100 includes a housing, a heat generating component 10 and a heat dissipating device 20, wherein the heat generating component 10 and the heat dissipating device 20 are both disposed in the housing, and the heat dissipating device 20 is disposed on the heat generating component 10. The piece 10 that generates heat in this embodiment is the processing chip, heat abstractor 20 one end is used for absorbing the heat of handling chip position department, and simultaneously, the heat abstractor 20 other end is the heat dissipation end, keep away from the one end that generates heat piece 10 promptly, reach the heat that will handle the chip and spread to heat abstractor 20 fast, and effectively expand its heat dissipation end through heat abstractor 20, spread and go out its heat transfer with the heat samming of handling the chip, reduce the temperature of handling the chip, eliminate local hot spot problem, improve user experience. The heat dissipation device 20 dissipates heat for the heat generating member 10, so that the electrical performance of the heat generating member 10 is ensured, and the performance of the electronic device 100 is further ensured. Of course, in other embodiments, the heat generating member 10 may also be other electronic devices with large heat generation.
Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of a heat dissipation device provided in the present application. Fig. 3 is a schematic cross-sectional view of the heat dissipation device provided in fig. 2. The heat sink 20 includes a first cover plate 21 and a second cover plate 22, and the first cover plate 21 and the second cover plate 22 cover to form a cavity 23. The first cover 21 includes a cover 211, a tube 212 penetrating and fixed to the cover 211 and extending away from the first surface 2111 of the cover 211, an inner cavity 2121 of the tube 212 communicating with the cavity 23, and a connection portion 213 formed at a connection portion between an inner wall 2122 of the tube 212 and the first surface 2111. The inner wall 2122 of the tube 212 is formed with a first capillary structure 24, the first surface 2111 of the cover 211 is formed with a second capillary structure 25, the transition capillary structure 26 is disposed on the connection portion 213 and is connected between the first capillary structure 24 and the second capillary structure 25, it is understood that the transition capillary structure 26 is directly connected to the first capillary structure 24 and the second capillary structure 25, the second cover 22 is provided with a third capillary structure 27, and the first capillary structure 24 and the third capillary structure 27 are connected to form a continuous capillary structure in the cavity 23 and the cavity wall of the inner cavity 2121, so that the liquid medium in the heat sink 20 can smoothly circulate in the cavity 23 and the inner cavity 2121 of the heat sink 20 through the transition capillary structure 26, thereby improving the heat dissipation effect of the heat sink 20. The heat generating member 10 is disposed on a surface of the heat dissipating device 20 facing away from the tube 212, that is, the heat generating member 10 is disposed on a surface of the second cover 22 facing away from the first cover 21. It should be noted that, in fig. 2, the number of the tubes 212 is three, and the three tubes 212 are disposed on the cover 211 at intervals, which is only an example, and actually, the number of the tubes 212 may be set according to the heat dissipation requirement.
When the heating element 10 generates heat, the heat of the heating element 10 is transferred to the heat dissipation device 20 through the second cover plate 22, the liquid working medium in the cavity 23 is heated and evaporated to generate a gasification phenomenon, the gasified steam is away from the part of the heating element 10, namely, the pipe body 212 is partially contacted with a cold area to generate a condensation phenomenon, and the heat is released during condensation, at the moment, the condensed liquid working medium at each position can be sucked back to the cavity 23 due to the capillary force of the first capillary structure 24, the transition capillary structure 26, the second capillary structure 25 and the third capillary structure 27 to be continuously heated and gasified to take away the heat. Since the transition capillary structure 26 is connected between the first capillary structure 24 and the second capillary structure 25 in this application, that is, the transition capillary structure 26 connects the first capillary structure 24 at the opening of the tube 212 with the second capillary structure 25 at the periphery of the first capillary structure 2111, that is, the first capillary structure 24 at the inner wall 2122 and the second capillary structure 24 at the first surface 2111 are connected by the transition capillary structure 26 to maximize the connection area, the first capillary structure 24 in the inner cavity of the tube 212 and the second capillary structure 25 at the first surface 2111 are connected well, the flow resistance between the liquid working medium and the gas working medium in the tube 212 and the first capillary structure 24 in the tube 212 and the second capillary structure 25 in the cover 211 is reduced, it is ensured that the liquid working medium circulates smoothly in the cavity 23 and the inner cavity 2121, and the heat dissipation effect of the heat dissipation device 20 is improved. The maximum heat dissipation capacity of the heat dissipation device 20 in the present application is greater than 500W, for example, the maximum heat dissipation capacity of the heat dissipation device 20 is 1200W. Therefore, effective heat dissipation can be provided for products with higher performance, and upgrading of electronic products is promoted.
In this embodiment, the first capillary structure 24, the transition capillary structure 26, and the second capillary structure 25 are integrally formed, so that the connection strength among the first capillary structure 24, the transition capillary structure 26, and the second capillary structure 25 is ensured, the liquid medium inside the heat dissipation device 20 can smoothly circulate between the inner wall 2122 and the first surface 2111 through the transition capillary structure 26, and the heat dissipation performance of the heat dissipation device 20 is effectively improved. The first capillary structure 24, the transition capillary structure 26, the second capillary structure 25 and the third capillary structure 27 are formed by sintering metal powder, and the specific metal powder comprises one or more metal powders such as copper metal powder and aluminum metal powder. Of course, in other embodiments, the third capillary structure 27 may also be formed by sintering one or more of metal mesh, metal powder or non-metal powder. The first capillary structure 24, the transition capillary structure 26, the second capillary structure 25 and the third capillary structure 27 can also be formed by sintering nonmetal powder, wherein the nonmetal powder comprises one or more nonmetal powders such as ceramic powder or silica gel powder.
In another embodiment, please refer to fig. 4, wherein fig. 4 is a schematic structural diagram of another embodiment of the heat dissipation device of the present application. The first capillary structure 24 and the transition capillary structure 26 are integrally formed, so that the connection strength between the first capillary structure 24 and the transition capillary structure 26 is ensured, the liquid medium in the heat dissipation device 20 can smoothly circulate between the inner wall 2122 and the first surface 2111 through the transition capillary structure 26, and the heat dissipation performance of the heat dissipation device 20 is effectively improved. The first capillary structure 24 and the transition capillary structure 26 are formed by sintering metal meshes, and the second capillary structure 25 and the third capillary structure 27 are formed by sintering one or more of metal meshes, metal powder and nonmetal powder. The specific metal powder comprises one or more metal powders such as copper metal powder and aluminum metal powder, and the non-metal powder comprises one or more non-metal powders such as ceramic powder or silica gel powder. Of course, in other embodiments, the first capillary structure 24, the second capillary structure 25, and the third capillary structure 27 are all microchannel capillary structures, and the transition capillary structure 26 is formed by sintering one or more of metal mesh, metal powder, or non-metal powder.
In this embodiment, a groove 2112 is formed on the first surface 2111 of the cover 211, the through hole 2113 penetrates through the groove 2112 and the second surface 2114 of the cover 211, the tube 212 includes a bent section 2123 at an open end thereof, the tube 212 is fixed in the through hole 2113, the opening of the tube 212 faces and communicates with the cavity 23, the bent section 2123 is accommodated in the groove 2112 and connected with a groove wall of the groove 2112, a surface of the connecting portion 213 is coplanar with the first surface 2111, and the bent section 2123 forms the connecting portion 213. The bending section 2123 increases a connection area between the tube 212 and the cover 211, so that the tube 212 is more stably fixed on the cover 211, and meanwhile, the bending section 2123 does not protrude from the first surface 2111, so as to ensure that the transition capillary structure 26 is more uniformly formed between the first surface 2111 and the inner wall 2122, thereby improving a heat dissipation effect of the heat dissipation apparatus 20. Of course, in other embodiments, the first surface 2111 of the cover 211 is not provided with a groove, and the bent section 2123 of the tube 212 is in abutting connection with the first surface 2111 of the tube 212. Or the pipe 212 is not provided with a bent section, the first surface 2111 of the cover 211 is also not provided with a groove, the opening of the pipe 212 is flush with the first surface 2111 of the cover 211, and the connection portion is the portion from the opening of the pipe 212 to the first surface 2111.
The cover 211 is provided with a fixing ring 2115 protruding from the second surface 2114 of the cover 211 at the periphery of the through hole 2113, and the inner wall 2122 of the fixing ring 2115 is in face contact with the second surface 2114 of the tube body 212. The fixing ring 2115 is disposed to provide better positioning of the tube 212 when passing through the through hole 2113, and better combination between the tube 212 and the cover 211, thereby improving the stability and yield of the heat dissipating device 20. In this embodiment, the fixing ring 2115 and the cover 211 are integrally formed. Of course, in other embodiments, the fixing ring 2115 and the cover 211 can be connected by one of gluing, clamping and welding. The cover 211 may not have a fixing ring.
The gap between the fixing ring 2115 and the tube body 212 is sealed by a sealing body (not shown), specifically, a heat transfer sealant to improve heat transfer between the cover 211 and the tube body 212. By sealing the gap between the fixing ring 2115 and the tube body 212, the contact area between the tube body 212 and the cover body 211 is increased on the basis of ensuring the sealing property between the tube body 212 and the cover body 211, and the heat dissipation effect of the heat dissipation device 20 is improved. Of course, in other embodiments, the sealing body between the retaining ring 2115 and the tube 212 may be other sealing heat transfer materials such as solder.
Referring to fig. 5, fig. 5 is a schematic structural diagram of another embodiment of a heat dissipation device of the present application. This embodiment is substantially the same as the previous embodiment, except that the through hole 2113 penetrates through the first surface 2111 and the second surface 2114 of the cover 211, the tube 212 includes a bent section 2123 at an open end thereof, the tube 212 is fixed in the through hole 2113, the tube 212 is open to the cavity 23, the bent section 2123 thereof is connected with the first surface 2111 of the cover 211, so that the tube 212 is fixed on the cover 211, and the bent section 2123 forms the connection portion 213. Of course, in other embodiments, the tube 212 is not provided with a bent section, the second surface 2114 of the tube 212 is connected and fixed to the inner wall 2122 of the through hole 2113, the opening of the tube 212 is flush with the first surface 2111 of the cover 211, and the connection portion is the portion between the opening of the tube 212 and the first surface 2111.
The transition capillary structure 26 of the heat dissipation device 20 is connected between the first capillary structure 24 and the second capillary structure 25, it can be understood that the transition capillary structure 26 connects the first capillary structure 24 at the opening of the tube body 212 with the second capillary structure 25 at the first surface 2111 at the periphery thereof, that is, the first capillary structure 24 of the inner wall 2122 and the second capillary structure 24 of the first surface 2111 achieve the maximum connection area through the transition capillary structure 26, ensure the good connection between the first capillary structure 24 of the inner wall 2122 and the second capillary structure 25 of the first surface 2111, reduce the flow resistance between the liquid working medium and the gas working medium in the tube body 212 and the second capillary structure 25 of the cover body 211, and thus ensure that the liquid working medium inside the heat dissipation device 20 can smoothly circulate between the inner wall 2122 and the first surface 2111 through the transition capillary structure 26, the heat dissipation performance of the heat dissipation device 20 is effectively improved.
Referring to fig. 6, fig. 6 is a schematic flow chart illustrating a method for manufacturing a heat dissipation device according to an embodiment of the present disclosure. The manufacturing method is used for manufacturing the heat sink 20. As shown in fig. 6, the method of manufacturing the heat sink includes the following steps S110 to S130.
S110: the first apron of preparation, first apron include lid and body, and the lid includes the first surface, and the one end of body links firmly to the lid, and the body extends towards the direction that deviates from the first surface of lid, and the inner wall of body and the junction of first surface form connecting portion.
Specifically, referring to fig. 7, first, a tube 212 is provided, the tube 212 is made of copper, and an opening end of the tube 212 is bent to form a bent section 2123 at the opening of the tube 212. Specifically, in the embodiment, the number of the tubes 212 is three, and the bent portion 2123 extends away from the tube axis of the tube 212 and is perpendicular to the tube axis of the tube 212. Of course, in other embodiments, the number of the tubes 212 may be set according to the actual heat dissipation requirement. The tube 212 may be made of aluminum, copper alloy, or other materials with good heat dissipation effect. The open end of the tube 212 is bent such that the bent portion 2123 is formed at an acute angle or an obtuse angle with respect to the tube axis of the tube 212. Or the open end of the tube 212 may not be bent.
Next, the cover 211 is provided, the material of the cover 211 is copper, a groove 2112 (fig. 9) is formed on the first surface 2111 of the cover 211, a through hole 2113 penetrating the groove 2112 and the second surface 2114 of the cover 211 is formed in the cover 211, a fixing ring 2115 communicating with the through hole 2113 is provided on the second surface 2114 of the cover 211, and the inner diameter of the fixing ring 2115 and the inner diameter of the through hole 2113 are matched with the outer diameter of the pipe body 212. Of course, in other embodiments, the material of the cover 211 may also be metal aluminum, copper alloy, or other materials with good heat dissipation effect. Or the first surface 2111 of the cover 211 is not recessed. The fixing ring 2115 and the cover 211 are integrally formed. Or the second surface 2114 of the cover 211 is not provided with a securing ring.
Finally, referring to fig. 8 and 9, the tube 212 is passed through the cover 211, the bent portion 2123 is limited on the first surface 2111, and the bent portion 2123 forms a connection portion to form the first cover 21. Specifically, an end of the tube 212 opposite to the opening thereof passes through the through hole 2113 and the fixing ring 2115, so that the bent section 2123 is accommodated in the groove 2112, the surface of the bent section 2123 is coplanar with the first surface 2111, and the bent section 2123 is connected to a groove wall of the groove 2112, so that the tube 212 is fixed to the cover 211 to form the first cover 21. The tube 212 is installed and secured within the through-hole 2113 such that the inner wall 2122 of the tube 212 is connected to the first surface 2111 via the connection 213, to facilitate subsequent processing to form the transitional capillary structure 26 at the connection 213 between the inner wall 2122 and the first surface 2111. The bent portion 2123 is connected to the groove 2112 to increase the connection area between the tube 212 and the cover 211, so that the tube 212 is more stably connected to the cover 211. The first surface 2111 provides a receiving space for the bent section 2123 by forming the groove 2112, so that the bent section 2123 does not protrude from the first surface 2111, thereby ensuring that the transition capillary structure 26 formed in the subsequent process is more uniformly arranged between the first surface 2111 and the inner wall 2122, and improving the heat dissipation effect of the heat dissipation device 20. The tube 212 is disposed in the fixing ring 2115, so that the fixing ring 2115 positions the tube 212, and the fixing ring 2115 increases the connection area between the tube 212 and the cover 211, and increases the stability of the tube 212, so that the tube 212 is more stably fixed in the cover 211. Of course, in other embodiments, the end of the tube 212 opposite to the opening thereof passes through the through hole 2113 and the fixing ring 2115, and the bent section 2123 is located on the first surface 2111 and is connected and fixed with the first surface 2111. Alternatively, the tube 212 is not formed with a bent section, the first surface 2111 of the cover 211 is also not formed with a groove, the opening of the tube 212 is flush with the first surface 2111 of the cover 211, and the connection portion is the portion between the opening of the tube 212 and the first surface 2111.
It is understood that, in the present embodiment, the tube 212 and the cover 211 are separate bodies, and are integrally connected through a connection process. Specifically, the pipe body 212 is connected to the cover 211 by diffusion welding. Of course, in other embodiments, the pipe 212 is connected to the cover 211 by other connection means such as brazing. The tube 212 and the cover 211 may be integrally formed as a single piece. The order of steps for providing the tube body 212 and the cover body 211 may be interchanged.
After the pipe body 212 is fixed to the cover body 211, the gap between the fixing ring 2115 and the pipe body 212 is sealed. By sealing the gap between the fixing ring 2115 and the tube body 212, the contact area between the tube body 212 and the cover 211 is increased on the basis of ensuring the sealing property between the tube body 212 and the cover 211, and the heat dissipation effect of the heat dissipation device 20 is improved.
S120: a first capillary structure is formed on the inner wall, a second capillary structure is formed on the first surface, and a transition capillary structure is formed on the connection portion 213, the transition capillary structure being connected between the first capillary structure and the second capillary structure.
Specifically, referring to fig. 10, the first capillary structure 24, the second capillary structure 25 and the transition capillary structure 26 are formed by forming a layer to be sintered on the inner wall 2122, the first surface 2111 and the connection portion 213, and performing a high temperature process on the layer to be sintered to form the first capillary structure 24, the second capillary structure 25 and the transition capillary structure 26. In this embodiment, the formation of the layer to be sintered on the inner wall 2122, the first surface 2111 and the connection portion 213 is specifically to form a powder layer on the inner wall 2122, the connection portion 213 and the first surface 2111 of the tube body, the powder layer extending from the inner wall 2122 to the first surface 2111. It will be appreciated that the powder layer at the connection 213 connects the powder layer of the tube 212 at the opening with the powder layer of the first surface 2111 of the cover 211 at its periphery, i.e. the powder layers of the tube 212 and the first surface 2111 of the cover 211 achieve a maximum connection area through the powder layers of the connection 213. The first cover plate 21 is then subjected to a high temperature treatment so that the powder layer forms a first capillary structure 24, a transition capillary structure 26 and a second capillary structure 25 connected in succession. In this embodiment, the powder layer is a metal powder layer, such as a copper powder layer. The first cover plate 21 is subjected to a high temperature treatment by a sintering process such that the powder layer forms a first capillary structure 24, a transition capillary structure 26 and a second capillary structure 25 connected in sequence. In the present embodiment, a powder layer is formed on the inner wall 2122, the connection portion 213, and the first surface 2111, and the powder layer extends from the inner wall 2122 to the first surface 2111, that is, the powder layer formed on the inner wall 2122, the connection portion 213, and the first surface 2111 is an integrally formed integral structure, so as to ensure the connection area and the connection strength of the powder layer on the inner wall 2122, the connection portion 213, and the first surface 2111, and further ensure the connection area and the connection strength between the inner wall 2122, the connection portion 213, and the first capillary structure 24 on the first surface 2111, and a liquid medium inside the heat dissipation device 20 can smoothly circulate between the inner wall 2122 and the first surface 2111 through the transition capillary structure 26, thereby effectively improving the heat dissipation performance of the heat dissipation device 20. And the first capillary structure 24, the second capillary structure 25 and the transition capillary structure 26 are formed through the same high-temperature processing step, so that the increase of the process steps caused by the respective formation of the first capillary structure 24, the second capillary structure 25 and the transition capillary structure 26 is effectively avoided, the production efficiency of the product is improved, and the production cost of the product is reduced.
Of course, in other embodiments, referring to fig. 11, the first capillary structure 24, the second capillary structure 25 and the transition capillary structure 26 are formed by forming a layer to be sintered on the inner wall 2122, the first surface 2111 and the connecting portion 213, and performing a high temperature treatment on the layer to be sintered to form the first capillary structure 24, the second capillary structure 25 and the transition capillary structure 26. In this embodiment, the step of forming the layer to be sintered on the inner wall 2122, the first surface 2111 and the connection portion 213 includes forming a powder layer 241 on the first surface 2111, and forming the metal mesh 242 on the inner wall 2122 and the connection portion 213, that is, the metal mesh 242 formed on the inner wall 2122 and the metal mesh 242 formed on the connection portion 213 are integrated, and the metal mesh 242 extends out of the inner wall 2122 and is connected to the powder layer 241. It will be appreciated that the metal mesh 242 at the opening of the tube 212 is connected to the powder layer 241 of the first surface 2111 of the cover 211 at its periphery, i.e. the metal mesh 242 of the tube 212 and the connection 213 and the powder layer 241 of the first surface 2111 of the cover 211 achieve a maximum connection area. The first cover plate 21 is then subjected to a high temperature treatment so that the metal mesh 242 and the powder layer 241 form the first capillary structure 24, the transition capillary structure 26 and the second capillary structure 25 connected in sequence. In this embodiment, the powder layer 241 is a metal powder layer 241, such as a copper powder layer 241. The first cover plate 21 is subjected to a high temperature treatment by a sintering process so that the powder layer 241 forms the second capillary structure 25. In the embodiment, the powder layer 241 is formed on the first surface 2111, the metal mesh 242 is formed on the inner wall 2122, the metal mesh 242 extends out of the inner wall 2122 and is connected with the powder layer 241, and then the first cover plate 21 is processed at high temperature to fix the metal mesh 242 and the powder layer 241, so that the powder layer 241 and the metal mesh 242 form the first capillary structure 24, the transition capillary structure 26 and the second capillary structure 25 which are connected in sequence, and the liquid medium in the heat dissipation device 20 can smoothly circulate between the inner wall 2122 and the first surface 2111 through the transition capillary structure 26, thereby effectively improving the heat dissipation performance of the heat dissipation device 20. Of course, the metal mesh formed on the inner wall and the connection portion 213 may be a separate metal. A powder layer can be formed on the connecting part; alternatively, the powder layer and the metal mesh may be formed on the connecting portion. Alternatively, the metal mesh may be formed on the first surface, and the powder layer may be formed on the inner wall and the connection portion 213. Alternatively, both the first surface and the inner wall may form the metal mesh and the powder layer. The powder layer 241 may be another metal powder layer such as an aluminum powder layer. The powder layer 241 may be a powder layer made of a material such as ceramic or silica gel. A metal mesh may also be formed on first surface 2111.
While the second capillary structure 25 is formed, referring to fig. 12, the third capillary structure 27 is formed on the second cover plate 22, that is, the second capillary structure 25 and the third capillary structure 27 are formed simultaneously by the same process, so that the production time of the product is effectively reduced, the production efficiency is improved, and the production cost is reduced. In this embodiment, the material of the second cover plate 22 is copper. The third capillary structure 27 is formed by sintering one or more of metal mesh, metal powder or nonmetal powder. The specific metal powder comprises metal powder such as copper metal powder and aluminum metal powder, and the non-metal powder comprises non-metal powder such as ceramic powder or silica gel powder. Of course, in other embodiments, the material of the second cover plate 22 may also be other materials with good heat dissipation effect, such as aluminum, copper alloy, and the like. The third capillary structure may also be a capillary structure in the form of a microchannel.
The connecting process of the tube body 212 and the cover body 211 and the sintering process of the first cover plate 21 are performed simultaneously, so that the number of processes of the heat dissipation device 20 is reduced, the manufacturing efficiency is improved, and the production cost is reduced. Of course, in other embodiments, the coupling process of the tube body 212 and the cover body 211 and the sintering process of the first cover plate 21 may be performed in steps.
In other embodiments, when the first capillary structure and/or the second capillary structure is a microchannel type capillary structure, the first capillary structure and/or the second capillary structure are formed on the inner wall of the tube body and the first surface of the cover body before the tube body and the cover body are fixed, respectively.
S130: and covering the second cover plate and the first cover plate towards the first surface to form the heat dissipation device.
Specifically, referring to fig. 3, the first cover plate 21 and the second cover plate 22 are connected by welding to form a sealed space. When the second cover plate 22 is closed with the first cover plate 21, the second capillary structure 25 and the third capillary structure 27 are connected. The closed space is then evacuated and the liquid working medium is filled between the first cover plate 21 and the second cover plate 22. In this embodiment, the liquid working medium is water. To ensure the internal heat circulation of the heat sink 20 to improve the heat dissipation effect of the heat sink 20. Meanwhile, the first cover plate 21 and the second cover plate 22 are covered after the first capillary structure 24, the second capillary structure 25, the transition capillary structure 26 and the third capillary structure 27 are formed, so that the formation quality of the first capillary structure 24, the second capillary structure 25, the transition capillary structure 26 and the third capillary structure 27 can be checked before the first cover plate 21 and the second cover plate 22 are covered, the quality inspection difficulty of products is favorably reduced, the product qualification rate of the heat dissipation device 20 is improved, and the production cost is reduced. Of course, in other embodiments, the liquid working medium may also be one or more solutions of methanol, acetone, and the like. The first cover plate 21 and the second cover plate 22 may also be joined by other welding processes such as diffusion welding.
The manufacturing method of the present application forms the transitional capillary structure 26 connecting the first capillary structure 24 and the second capillary structure 25 on the connection portion 213 between the first capillary structure 24 formed on the inner wall 2122 and the second capillary structure 25 formed on the first surface 2111, and it can be understood that the transitional capillary structure 26 connects the first capillary structure 24 at the opening of the tube body 212 and the second capillary structure 25 on the first surface 2111 of the cover body 211 at the periphery thereof, that is, the first capillary structure 24 of the inner wall 2122 and the second capillary structure 25 on the first surface 2111 achieve the maximum connection area through the transitional capillary structure 26, ensure good connection between the first capillary structure 24 of the inner wall 2122 and the second capillary structure 25 on the first surface 2111, reduce the flow resistance of the liquid working medium and the gas working medium between the first capillary structure 24 in the tube body 212 and the second capillary structure 25 of the cover body 211, therefore, the liquid medium in the heat dissipation device 20 can smoothly circulate between the inner wall 2122 and the first surface 2111 through the transition capillary structure 26, and the heat dissipation performance of the heat dissipation device 20 is effectively improved. Meanwhile, the first cover plate 21 and the second cover plate 22 are covered after the first capillary structure 24, the second capillary structure 25, the transition capillary structure 26 and the third capillary structure 27 are formed, so that the formation quality of the first capillary structure 24, the second capillary structure 25, the transition capillary structure 26 and the third capillary structure 27 can be checked before the first cover plate 21 and the second cover plate 22 are covered, the quality inspection difficulty of products is favorably reduced, the product qualification rate of the heat dissipation device 20 is improved, and the production cost is reduced.
The above embodiments and embodiments of the present application are only examples and embodiments, and the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (15)
1. A method of manufacturing a heat sink, the method comprising:
manufacturing a first cover plate, wherein the first cover plate comprises a cover body and a pipe body, the cover body comprises a first surface, one end of the pipe body is fixedly connected to the cover body, the pipe body extends towards the direction of the cover body, which is deviated from the first surface, and a connecting part is formed at the connecting part of the inner wall of the pipe body and the first surface;
and forming a first capillary structure on the inner wall, forming a second capillary structure on the first surface, and forming a transition capillary structure on the connecting part, wherein the transition capillary structure is connected between the first capillary structure and the second capillary structure.
2. The method of manufacturing of claim 1, wherein the step of forming the first capillary structure, the second capillary structure, and the transition capillary structure comprises: forming a layer to be sintered on the inner wall, the first surface and the connecting portion, and performing high-temperature treatment on the layer to be sintered to form the first capillary structure, the second capillary structure and the transition capillary structure.
3. The manufacturing method according to claim 2, wherein the layer to be sintered includes a powder layer formed on the inner wall, the first surface, and the connecting portion.
4. The manufacturing method according to claim 2, wherein the layer to be sintered includes a powder layer formed on the first surface and a metal mesh formed on the inner wall.
5. The manufacturing method according to claim 4, wherein the layer to be sintered further includes a powder layer formed at the connection portion; or the layer to be sintered also comprises a metal mesh formed on the connecting part; or the layer to be sintered also comprises a powder layer and a metal net formed on the connecting part.
6. The manufacturing method according to any one of claims 1 to 5, wherein the manufacturing of the first cover plate specifically comprises:
providing a pipe body, and bending an opening end of the pipe body to form a bending section at the opening of the pipe body;
providing a cover body;
and penetrating the pipe body through the cover body, limiting the bent section on the first surface, and forming the connecting part by the bent section to form the first cover plate.
7. The method of manufacturing of claim 6, further comprising forming a groove in the first surface, the bend being received in the groove when the tube is secured to the cover, a surface of the bend being coplanar with the first surface.
8. The method of manufacturing of claim 1, further comprising closing a second cover plate with the first cover plate toward the first surface.
9. The manufacturing method according to claim 8, wherein a third capillary structure is formed on the second cover plate at the same time as the second capillary structure is formed, and the second capillary structure and the third capillary structure are connected when the second cover plate is covered with the first cover plate.
10. The utility model provides a heat abstractor, its characterized in that, heat abstractor includes first apron, first capillary structure, second capillary structure and transition capillary structure, first apron includes lid and body, the body runs through and is fixed in the lid, the inner wall of body with the junction of the first surface of lid forms connecting portion, the inner wall is formed with first capillary structure, the first surface is formed with second capillary structure, transition capillary structure is located on the connecting portion and is connected first capillary structure with between the second capillary structure.
11. The heat dissipating device of claim 10, wherein the first capillary structure, the transition capillary structure, and the second capillary structure are integrally formed as a unitary structure.
12. The heat dissipating device of claim 10, wherein the first wick structure and the transition wick structure are integrally formed as a unitary structure.
13. The heat dissipating device of claim 11 or 12, wherein the tube includes a bent section at an open end thereof, the bent section being located at and connected to the first surface, the bent section forming the connecting portion.
14. The heat dissipating device of claim 11 or 12, wherein the tube includes a bent section at an open end thereof, the first surface includes a groove, the bent section is received in the groove, and a surface of the bent section is coplanar with the first surface.
15. An electronic apparatus, characterized in that the electronic apparatus comprises a heat generating member and the heat dissipating device of any one of claims 10 to 14, the heat generating member dissipating heat through the heat dissipating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010357227.7A CN113573540B (en) | 2020-04-29 | Heat dissipation device, manufacturing method thereof and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010357227.7A CN113573540B (en) | 2020-04-29 | Heat dissipation device, manufacturing method thereof and electronic equipment |
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| CN113573540A true CN113573540A (en) | 2021-10-29 |
| CN113573540B CN113573540B (en) | 2024-10-29 |
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