CN203177703U - Vertical type heat conduction structure - Google Patents

Vertical type heat conduction structure Download PDF

Info

Publication number
CN203177703U
CN203177703U CN 201320018270 CN201320018270U CN203177703U CN 203177703 U CN203177703 U CN 203177703U CN 201320018270 CN201320018270 CN 201320018270 CN 201320018270 U CN201320018270 U CN 201320018270U CN 203177703 U CN203177703 U CN 203177703U
Authority
CN
China
Prior art keywords
bottom block
cavity
conductive structure
heat
heat conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201320018270
Other languages
Chinese (zh)
Inventor
李俊宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Wanjinghua Technology Co ltd
Original Assignee
Shenzhen Wanjinghua Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Wanjinghua Technology Co ltd filed Critical Shenzhen Wanjinghua Technology Co ltd
Priority to CN 201320018270 priority Critical patent/CN203177703U/en
Priority to PCT/CN2013/075064 priority patent/WO2014107939A1/en
Application granted granted Critical
Publication of CN203177703U publication Critical patent/CN203177703U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to the technical field of heat dissipation and provides a vertical type heat conduction structure. The vertical type heat conduction structure is used in a heat dissipation device and plays a role in heat dissipation and heat conduction. The vertical type heat conduction structure comprises a vapor chamber. The vapor chamber comprises a bottom plate seat, a plate cover, first capillary tissue and working fluid, wherein the bottom plate seat is provided with a cavity, the plate cover is buckled on the bottom plate seat, the first capillary tissue is arranged inside the cavity of the bottom plate seat, the working fluid is filled in the cavity of the bottom plate seat, and the combining surface of the bottom plate seat and the plate cover is provided with a gas pipe used for vacuum pumping. The vertical type heat conduction structure further comprises at least one heat conduction pipe which is connected to the plate cover, and an inner cavity of the heat conduction pipe is communicated with the cavity of the bottom plate seat. On the basis of an existing vapor chamber, the vertical type heat conduction structure is provided with the heat conduction pipe, and the vapor chamber is connected with the heat conduction pipe. The inner cavity of the heat conduction pipe is communicated with the inner cavity of the vapor chamber, and therefore the capabilities of heat dissipation and heat conduction of the vapor chamber are further improved in space.

Description

Three-dimensional conductive structure
Technical field
The utility model belongs to the heat dissipation technology field, relates in particular to a kind of three-dimensional conductive structure.
Background technology
Temperature-uniforming plate as a kind of heat radiation and heat transfer medium, is widely used in the heat abstractor, yet it is generally single plate body structure existing temperature-uniforming plate, its heat radiation and heat conducting limited in one's ability.
The utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, and a kind of three-dimensional conductive structure that heat pipe is combined with temperature-uniforming plate is provided, thereby has improved heat radiation and the heat conducting ability of single equalizing plate structure.
The utility model is achieved in that a kind of three-dimensional conductive structure, be used for heat abstractor and play heat radiation and heat conducting effect, comprise temperature-uniforming plate, described temperature-uniforming plate comprises the bottom block with cavity, be fastened on the plate lid on the described bottom block, be located at first capillary structure in the described bottom block cavity and be filled in the interior working fluid of described bottom block cavity, the faying face place of described bottom block and described plate lid is provided be used to the tracheae that vacuumizes, also comprise at least one heat pipe that is connected on the described plate lid, the inner chamber of described heat pipe is communicated with the cavity of described bottom block.
Particularly, the inwall of described heat pipe is covered with second capillary structure.
Particularly, described plate covers and offers the pore that wears for described heat pipe.
More specifically, the edge along described pore convexes with pipe box.
Particularly, described heat pipe is provided with six, and described six heat pipes are two rows and are distributed on the described plate lid.
Particularly, described plate covers on the face relative with the cavity of described bottom block and is covered with the 3rd capillary structure.
Particularly, described tracheae is located at the place, position, angle of described temperature-uniforming plate.
Particularly, described heat pipe one port is communicated with the cavity of described bottom block, and the another port is blind end.
Particularly, convex with reference column on the face of fitting with described plate lid on the described bottom block, described reference column is located at the place, position, angle of described bottom block.
More specifically, the place, position, angle of described plate lid is provided with the breach that is complementary with described reference column.
The three-dimensional conductive structure that the utility model provides, it is combined with temperature-uniforming plate by a plurality of heat pipes are set, and the inwall of heat pipe also is covered with capillary structure, the working fluid of being located in the temperature-uniforming plate can reflux by this heat pipe evaporation, thereby the function of spatially having expanded single temperature-uniforming plate heat radiation and having conducted heat, thereby compare with single temperature-uniforming plate, its heat radiation of the three-dimensional conductive structure that the utility model provides and heat-transfer capability are stronger.
Description of drawings
Fig. 1 is the exploded perspective view of the three-dimensional conductive structure that provides of the utility model embodiment;
Fig. 2 is the three-dimensional conductive structure blast front elevational schematic that the utility model embodiment provides;
Fig. 3 is the heat pipe partial sectional view that the utility model embodiment provides;
Fig. 4 is the schematic top plan view of the three-dimensional conductive structure that provides of the utility model embodiment;
Fig. 5 is the schematic perspective view of the bottom block that provides of the utility model embodiment.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Shown in Fig. 1-3, a kind of three-dimensional conductive structure that provides for the utility model embodiment, be used for playing heat radiation and heat conducting effect at heat abstractor, comprise temperature-uniforming plate 1, temperature-uniforming plate 1 comprises the bottom block 11 with cavity, be fastened on the plate lid 12 on the bottom block 11, be located at first capillary structure 13 in bottom block 11 cavitys and be filled in the interior working fluid (not shown) of bottom block cavity, bottom block 11 is provided be used to the tracheae 14 that vacuumizes with the faying face place of plate lid 12, be connected with at least onely for being connected with external component and the heat pipe 2 of heat conduction on the plate lid 12, the inner chamber of heat pipe 2 is communicated with the cavity of bottom block.First capillary structure 13 can adopt the mixture of sintered body, grid body, carbon fiber and graphite or above-mentioned substance to make, working fluid can adopt the lower liquid of boiling point such as ethanol, distilled water, like this than being easier to evaporative condenser, thereby can absorb heat faster and dispel the heat; Heat pipe 2 not only plays a part heat radiation and conducts heat, and also is used for being connected with outside other parts, for example is connected with the radiating fin group that radiating fin constitutes.The three-dimensional conductive structure that the utility model provides, it is combined with temperature-uniforming plate by heat pipe is set, lower boiling working fluid draw heat and evaporating from the temperature-uniforming plate, steam enters heat pipe, and then condensation heat radiation, thereby spatially expanded the functional structure of heat radiation and the heat transfer of temperature-uniforming plate further, improved the ability of its heat radiation and heat transfer.
The inwall of heat pipe 2 is covered with second capillary structure 21, the material of second capillary structure 21 can be selected to make with first capillary structure, 13 identical materials, second capillary structure 21 is little with the inwall thermal contact resistance of heat pipe 2, capillary force is strong, be convenient to working fluid and in time be back to the temperature-uniforming plate inner chamber, thereby form the heat absorption evaporation, the circulation heat radiation of condensation heat radiation.
Heat pipe 2 one ports are communicated with the cavity of bottom block 11, and the another port is blind end, the common formation of the inner chamber of its inner chamber and bottom block 11 one overall vacuum chamber.
Offer the pore 120 that wears for heat pipe 2 on the plate lid 12, heat pipe 2 is communicated with bottom block 11 by pore 120.
Plate covers on the face relative with the cavity of bottom block 11 on 12 and is covered with the 3rd capillary structure (not shown), thereby the inwall of the inner chamber of whole temperature-uniforming plate all is covered with capillary structure, form a bigger evaporative condenser face, steam flows in the hollow position of the inner chamber of temperature-uniforming plate and heat pipe, condensed working fluid refluxes by the capillary structure that is overlying on the inwall, the working fluid evaporation of constantly absorbing heat, the continuous condensation heat radiation of steam, thus make heat radiation and conduct heat and can constantly circulate.
Edge along pore 120 convexes with pipe box 121, pipe box 121 can play guiding when heat pipe 2 and plate lid 12 is connected, simultaneously, because of plate lid 12 thinner, be connected with heat pipe 2 only according to plate lid 12 and be not enough to fix well heat pipe 2, therefore, pipe box 121 also plays a part to strengthen heat pipe 2 and plate lid 12 steadiness that are connected, and heat pipe 2 can be connected in by the mode of welding on the plate lid 12.
In the present embodiment, heat pipe 2 is provided with six, and described six heat pipes are two rows and are distributed in side by side on the plate lid 12, thereby spatially expanded the function of temperature-uniforming plate 1 heat conduction and heat radiation, the number of heat pipe 2 arranges very few, is not enough to play the ability of 1 heat radiation of expansion temperature-uniforming plate and heat transfer, if arrange too much, bring constant then can for the manufacturing of temperature-uniforming plate, therefore, in the present embodiment, arrange six comparatively suitable, certainly, the number of heat pipe is not regarded it as and is limited.
As shown in Figure 4, tracheae 14 is located at the place, position, angle of temperature-uniforming plate, and correspondingly, the superposed surfaces place of bottom block 11 and plate lid offers the pipe hole that air supply pipe 14 wears.
As shown in Figure 5, convex with reference column 110 on the face of fitting with the plate lid on the bottom block 11, reference column 110 is located at the place, position, angle of bottom block 11, being arranged so that of reference column 110 can be located when plate lid fastens with bottom block accurately and rapidly, thereby enhance productivity, guarantee the welding quality of plate lid and bottom block.
As shown in Figure 1, the place, position, angle of plate lid 12 is provided with the breach 122 that is complementary with reference column 110, so that plate lid 12 and accurately contraposition of bottom block 11.
The three-dimensional conductive structure that the utility model provides, it has good heat radiation and heat transmission function, thereby in applying to heat abstractor the time, it can be rapidly, equably with other parts in the heat transferred heat abstractor with further heat radiation, simultaneously self also play a part heat radiation, thereby can improve the integral heat sink efficient of heat abstractor.
Below only be preferred embodiment of the present utility model, not in order to limiting the utility model, all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace or improvement etc., all should be included within the protection domain of the present utility model.

Claims (10)

1. three-dimensional conductive structure, be used for heat abstractor and play heat radiation and heat conducting effect, comprise temperature-uniforming plate, described temperature-uniforming plate comprises that the bottom block with cavity, the plate that is fastened on the described bottom block cover, are located at first capillary structure in the described bottom block cavity and be filled in the interior working fluid of described bottom block cavity, the faying face place of described bottom block and described plate lid is provided be used to the tracheae that vacuumizes, it is characterized in that: also comprise at least one heat pipe that is connected on the described plate lid, the inner chamber of described heat pipe is communicated with the cavity of described bottom block.
2. three-dimensional conductive structure as claimed in claim 1, it is characterized in that: the inwall of described heat pipe is covered with second capillary structure.
3. three-dimensional conductive structure as claimed in claim 1 is characterized in that: described plate covers and offers the pore that wears for described heat pipe.
4. three-dimensional conductive structure as claimed in claim 3, it is characterized in that: the edge along described pore convexes with pipe box.
5. three-dimensional conductive structure as claimed in claim 1, it is characterized in that: described heat pipe is provided with six, and described six heat pipes are two rows and are distributed on the described plate lid.
6. three-dimensional conductive structure as claimed in claim 1, it is characterized in that: described plate covers on the face relative with the cavity of described bottom block and is covered with the 3rd capillary structure.
7. three-dimensional conductive structure as claimed in claim 1 is characterized in that: described tracheae is located at the place, position, angle of described temperature-uniforming plate.
8. three-dimensional conductive structure as claimed in claim 1, it is characterized in that: described heat pipe one port is communicated with the cavity of described bottom block, and the another port is blind end.
9. three-dimensional conductive structure as claimed in claim 1 is characterized in that: convex with reference column on the face of fitting with described plate lid on the described bottom block, described reference column is located at the place, position, angle of described bottom block.
10. as each described three-dimensional conductive structure of claim 1-9, it is characterized in that: the place, position, angle of described plate lid is provided with the breach that is complementary with described reference column.
CN 201320018270 2013-01-14 2013-01-14 Vertical type heat conduction structure Expired - Lifetime CN203177703U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 201320018270 CN203177703U (en) 2013-01-14 2013-01-14 Vertical type heat conduction structure
PCT/CN2013/075064 WO2014107939A1 (en) 2013-01-14 2013-05-02 Vertical type heat conduction structure and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320018270 CN203177703U (en) 2013-01-14 2013-01-14 Vertical type heat conduction structure

Publications (1)

Publication Number Publication Date
CN203177703U true CN203177703U (en) 2013-09-04

Family

ID=49074388

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320018270 Expired - Lifetime CN203177703U (en) 2013-01-14 2013-01-14 Vertical type heat conduction structure

Country Status (2)

Country Link
CN (1) CN203177703U (en)
WO (1) WO2014107939A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104296575A (en) * 2014-11-04 2015-01-21 芜湖长启炉业有限公司 Sleeve superconducting radiator
CN104315905A (en) * 2014-10-24 2015-01-28 芜湖长启炉业有限公司 Double-end insertion type superconducting radiating column
CN105188313A (en) * 2015-08-29 2015-12-23 陈豪 Temperature equalizing plate with heat-conducting pipe
CN105611806A (en) * 2016-01-26 2016-05-25 张波 Thermal dissipation system for electrical equipment
US20160348985A1 (en) * 2015-05-25 2016-12-01 Cooler Master Co., Ltd. Three-dimensional heat conducting structure and manufacturing method thereof
CN106288891A (en) * 2015-05-25 2017-01-04 讯凯国际股份有限公司 Three-dimensional conductive structure and preparation method thereof
TWI603047B (en) * 2016-11-02 2017-10-21 奇鋐科技股份有限公司 Vapor chamber structure
CN107306488A (en) * 2016-04-21 2017-10-31 奇鋐科技股份有限公司 Heat radiation module
US20170363367A1 (en) * 2016-06-21 2017-12-21 Tai-Sol Electronics Co., Ltd. Heat dissipation device
CN107843134A (en) * 2017-11-30 2018-03-27 奇鋐科技股份有限公司 Heat-sink unit protection structure
CN108731526A (en) * 2017-04-24 2018-11-02 迈萪科技股份有限公司 Conductive structure and preparation method thereof
US10483190B2 (en) 2017-06-06 2019-11-19 Taiwan Microloops Corp. Thermal conduction structrure and manufacturing method thereof
CN111278259A (en) * 2020-02-16 2020-06-12 东莞市正康电子有限公司 Radiator with built-in integrated supporting structure and preparation method thereof
WO2024093689A1 (en) * 2022-10-31 2024-05-10 广州力及热管理科技有限公司 Three-dimensional vapor chamber element and manufacturing method therefor

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104748597A (en) * 2015-04-13 2015-07-01 锘威科技(深圳)有限公司 Flat plate heating tube and manufacturing method thereof
CN105371214A (en) * 2015-12-16 2016-03-02 广州共铸科技股份有限公司 LED automobile head lamp
TWI628403B (en) * 2016-02-26 2018-07-01 邁萪科技股份有限公司 Heat transfer module
TWI601931B (en) * 2016-02-26 2017-10-11 邁萪科技股份有限公司 Heat and vapor chamber connecting structure and method thereof
TWI608215B (en) * 2016-02-26 2017-12-11 邁萪科技股份有限公司 Method of menufacturing heat transfer module
CN106888567A (en) * 2017-04-12 2017-06-23 惠州智科实业有限公司 A kind of heat-transfer device
CN113573540B (en) * 2020-04-29 2024-10-29 华为机器有限公司 Heat dissipation device, manufacturing method thereof and electronic equipment
CN111811307A (en) * 2020-08-24 2020-10-23 陈豪 Integrated 3D temperature equalization plate and manufacturing method thereof
CN114147422A (en) * 2021-11-18 2022-03-08 中山市洛丝特电子科技有限公司 Ultrathin tube processing technology of mandrel-free and shrinkage-free hose
CN115763394A (en) * 2022-10-18 2023-03-07 广州华钻电子科技有限公司 Phase change heat conduction structure with capillary structure connecting piece and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264694A (en) * 1995-03-20 1996-10-11 Calsonic Corp Cooling device for electronic parts
CN1825047A (en) * 2005-02-22 2006-08-30 徐惠群 Sintering method and device of capillary texture in heat pipe
CN2874398Y (en) * 2005-05-10 2007-02-28 苏子欣 Integrated heat conductive pipe radiation structure
CN102003903B (en) * 2009-08-31 2013-07-03 富准精密工业(深圳)有限公司 Heat pipe and heat-radiating device using same
CN102506600B (en) * 2011-09-20 2014-01-29 华北电力大学 Condensation end extension type integrated flat heat pipe
CN202511667U (en) * 2012-02-07 2012-10-31 深圳市万景华科技有限公司 Temperature homogenizing plate

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104315905A (en) * 2014-10-24 2015-01-28 芜湖长启炉业有限公司 Double-end insertion type superconducting radiating column
CN104296575A (en) * 2014-11-04 2015-01-21 芜湖长启炉业有限公司 Sleeve superconducting radiator
US10077946B2 (en) * 2015-05-25 2018-09-18 Cooler Master Co., Ltd. Three-dimensional heat conducting structure and manufacturing method thereof
CN106288891B (en) * 2015-05-25 2018-08-17 讯凯国际股份有限公司 Three-dimensional conductive structure and its preparation method
US20160348985A1 (en) * 2015-05-25 2016-12-01 Cooler Master Co., Ltd. Three-dimensional heat conducting structure and manufacturing method thereof
CN106288891A (en) * 2015-05-25 2017-01-04 讯凯国际股份有限公司 Three-dimensional conductive structure and preparation method thereof
TWI588439B (en) * 2015-05-25 2017-06-21 訊凱國際股份有限公司 3d heat conducting structures and manufacturing method thereof
CN105188313A (en) * 2015-08-29 2015-12-23 陈豪 Temperature equalizing plate with heat-conducting pipe
CN105611806A (en) * 2016-01-26 2016-05-25 张波 Thermal dissipation system for electrical equipment
CN107306488A (en) * 2016-04-21 2017-10-31 奇鋐科技股份有限公司 Heat radiation module
CN107306488B (en) * 2016-04-21 2023-02-28 奇鋐科技股份有限公司 Heat radiation module
US20170363367A1 (en) * 2016-06-21 2017-12-21 Tai-Sol Electronics Co., Ltd. Heat dissipation device
TWI603047B (en) * 2016-11-02 2017-10-21 奇鋐科技股份有限公司 Vapor chamber structure
CN108731526A (en) * 2017-04-24 2018-11-02 迈萪科技股份有限公司 Conductive structure and preparation method thereof
US10483190B2 (en) 2017-06-06 2019-11-19 Taiwan Microloops Corp. Thermal conduction structrure and manufacturing method thereof
CN107843134A (en) * 2017-11-30 2018-03-27 奇鋐科技股份有限公司 Heat-sink unit protection structure
CN111278259A (en) * 2020-02-16 2020-06-12 东莞市正康电子有限公司 Radiator with built-in integrated supporting structure and preparation method thereof
WO2024093689A1 (en) * 2022-10-31 2024-05-10 广州力及热管理科技有限公司 Three-dimensional vapor chamber element and manufacturing method therefor

Also Published As

Publication number Publication date
WO2014107939A1 (en) 2014-07-17

Similar Documents

Publication Publication Date Title
CN203177703U (en) Vertical type heat conduction structure
CN203672209U (en) Miniature capillary pump ring with capillary wick structure of gradient pore structure
CN102723316A (en) Loop heat pipe structure
US20100163212A1 (en) Flat loop Heat pipe
CN203177382U (en) Evaporative air cooler wet curtain component and cooling fan provided with same
US20170153064A1 (en) Heat dissipation unit
TWM517314U (en) Heat dissipation apparatus
US20170256828A1 (en) Thermal management system of battery pack
CN101730449A (en) Liquid cooling heat abstractor
CN103307579A (en) Method for improving heat radiating efficiency of LED lighting source and integrated radiator
CN201926356U (en) Uniform-temperature plate
CN208139909U (en) A kind of multichannel loop type temperature-uniforming plate
CN202008994U (en) Loop heat pipe structure
CN106714509B (en) Radiator
CN201156860Y (en) Water cooling head construction for heat radiating
CN201344753Y (en) Combined flat-plate heat tube radiator with complex cavity
CN107257609A (en) A kind of Micro LED water-cooling display screens
CN105371676B (en) A kind of double capillary core evaporators
CN202066398U (en) Loop heat pipe structure
CN203642761U (en) Super-thermal-conduction column
CN103781325B (en) Thin-type radiator
CN210165803U (en) Mobile phone heat pipe with high diameter-thickness ratio
CN108332593A (en) A kind of multichannel loop type temperature-uniforming plate
CN210470132U (en) Direct-contact low-thermal-resistance heat pipe radiator for heating device
CN209693334U (en) A kind of temperature-uniforming plate

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130904