CN111278259A - Radiator with built-in integrated supporting structure and preparation method thereof - Google Patents
Radiator with built-in integrated supporting structure and preparation method thereof Download PDFInfo
- Publication number
- CN111278259A CN111278259A CN202010095258.XA CN202010095258A CN111278259A CN 111278259 A CN111278259 A CN 111278259A CN 202010095258 A CN202010095258 A CN 202010095258A CN 111278259 A CN111278259 A CN 111278259A
- Authority
- CN
- China
- Prior art keywords
- upper plate
- base
- plate
- heat
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000012546 transfer Methods 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000004080 punching Methods 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000005219 brazing Methods 0.000 claims description 69
- 229910052751 metal Inorganic materials 0.000 claims description 63
- 239000002184 metal Substances 0.000 claims description 63
- 239000000945 filler Substances 0.000 claims description 62
- 238000003466 welding Methods 0.000 claims description 60
- 230000017525 heat dissipation Effects 0.000 claims description 48
- 238000000605 extraction Methods 0.000 claims description 20
- 238000005086 pumping Methods 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 230000001965 increasing effect Effects 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002309 gasification Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004021 metal welding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/02—Combined welding or cutting procedures or apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a radiator with a built-in integrated supporting structure, which comprises a radiating base plate, wherein the radiating base plate comprises a base and an upper plate, the base is provided with a concave cavity with an upward opening, the upper plate is used for covering the base and sealing the opening, a vacuum cavity is formed between the upper plate and the base, the vacuum cavity is internally provided with a liquid heat transfer medium which is condensed to dissipate heat after being gasified, the upper plate is provided with a plurality of bulges which are vertical to the surface of the upper plate and face the direction of the vacuum cavity, the bulges are propped against the surface of the base, the invention optimizes the internal supporting structure of the heat-radiating substrate, a plurality of three-level bulges are formed on the upper plate in an integrated punching mode, the process is saved, the cost is saved, the production efficiency is improved, the internal supporting area of the radiating substrate is increased, the stability of an internal structure is enhanced, and the flatness of the radiating substrate is maintained.
Description
Technical Field
The invention relates to the technical field of radiators, in particular to a radiator with a built-in integrated supporting structure.
Background
With the rapid development of electronic devices, the operating capability of the electronic devices is stronger and stronger, and the heat generated during operation is more, so that the Vapor Chamber (VC for short) is widely applied as a heat sink in high-power or high-integration electronic products. When used properly, it can be simply understood as a very high thermal conductivity component. The vapor chamber has the following advantages: 1. the space requirement is low, 2 the contact area is large, and 3 the quick thermal response is realized. These features can be applied to heat sinks to reduce thermal diffusion resistance and hot spots.
The application of VC is divided into a 2D VC radiator and a 3D VC radiator, wherein the 2D VC radiator is a plate radiator to realize heat conduction on a two-dimensional surface, the 3D VC radiator is characterized in that a heat conduction pipe is embedded in the radiator to fully and uniformly spread the heat of a chip on a radiator substrate or fins, at the moment, the heat conduction pipe is connected with the fins, and the heat can be effectively dissipated into the air through the whole radiator to realize heat conduction on the three-dimensional surface.
However, the existing VC process is to punch a base and a flat upper plate, where the base has a cavity with an opening at one end, form a welding surface on the periphery of the base, lay a capillary structure (copper mesh or copper powder) at the bottom of the cavity, manually place support columns (copper columns) into the reserved holes one by one, apply a circle of brazing filler metal on the welding surface, cover the upper plate on the opening, seal the edge (each side is welded and sealed), attach the upper plate to the welding surface, visually check whether the contact part between the welding surface of the base and the upper plate forms a uniform brazing seam structure and whether there is residual excess brazing filler metal in the seam between the base and the upper plate, and cut the excess brazing filler metal by precise high-speed milling or high-precision laser; the base and the upper plate extend out of a semi-cylindrical shell at one corresponding side edge, the two semi-cylindrical shells surround to form a vacuumizing port, vacuumizing equipment vacuumizes the inner cavity of the radiating base plate through the vacuumizing port, then a proper amount of liquid heat transfer medium is filled into the vacuumizing port, the vacuumizing port is sealed after the injection amount of the liquid heat transfer medium reaches the standard capacity, and the liquid heat transfer medium is condensed to radiate after being heated and gasified to form the vacuum temperature-equalizing plate.
The existing VC radiator has the following problems: the existing structure needs a large number of copper columns and is high in cost; the copper post needs the manual work to be put, and the human cost is high and production efficiency is extremely low, and the back is put to the copper post, covers the upper cover again, in operation and handling, easily causes the copper post to incline and fall, leads to the fact the bad expense of reporting of plane degree at last.
Disclosure of Invention
In order to solve the problems, the invention provides a radiator with a built-in integrated supporting structure, which ensures that a radiating base plate is not deformed during vacuumizing, provides enough supporting force for an upper plate, greatly improves the production efficiency and saves the production cost by optimizing the structure of the radiating base plate, and greatly improves the bonding strength between a base and the upper plate.
In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a built-in integrative formula bearing structure's radiator, includes the heat dissipation base plate, the heat dissipation base plate includes base and upper plate, the base has open-ended cavity up, the upper plate is used for the lid to close on the base and seal the opening, in form a vacuum cavity between upper plate and the base, the vacuum cavity has contained liquid heat transfer medium, condense after the gasification of liquid heat transfer medium with the heat dissipation, be equipped with a plurality of swell towards the vacuum cavity direction on the upper plate perpendicular to upper plate surface for the upper plate surface is the wavy, the swell is held up on the base surface.
The upper plate surface is changed into a wavy shape from a flat surface, the heat dissipation area is increased, particularly the heat dissipation area is increased by at least 15%, so that the heat dissipation effect is enhanced, and the bulge is in a circular shape, a square shape, a triangular shape, a rhombic shape or other shapes, or a combination of two or more of the shapes. The heat in the shape can be radiated to all directions, so that the heat radiation performance is better; and further increase fin intensity, reduce the deformation.
Further, the swell is tertiary boss structure, effectively avoids the base to bulge crowded vacuum cavity full after the upper plate is assembled, provides sufficient convection current space for the mobility of gas, improves the cooling effect to high-temperature gas, first swell, second swell and third swell are extended towards the base in proper order to the swell from the upper plate surface, first swell is fallen to have the arc face with the linking department on upper plate surface, third swell top surface is the plane, the plane is hugged closely on the base surface. The top surface of the third bulge is a plane, so that the pressure resistance of the heat dissipation substrate during hot gas expansion can be improved.
The base is after receiving a heat that generates heat, the liquid heat transfer medium of storage in the base cavity is risen to first swell by the thermal gasification, heat transfer medium steam forms liquid heat transfer medium after meeting cold, the heat radiates away through the swell, by air-cooled liquid heat transfer medium along swell landing in the base cavity by the heating again, begin new circulation, the swell of tertiary convex structure makes heat transfer medium gasification after the convection current circulation more have mobility, the convection current effect is better, thereby the radiating effect is better.
Further, the liquid heat transfer medium adopts water, acetone or ethanol.
Further, the base and the upper plate are formed by punching metal plates; the metal plate is a copper plate and/or a copper alloy plate or an aluminum alloy plate or other metal material plates.
Furthermore, a plurality of heat conduction pipes are connected to the heat dissipation substrate in a penetrating manner, a plurality of extraction pipes are arranged on the upper surface of the upper plate and comprise pre-punched holes and flanges integrated with the pre-punched holes, the flanges are opposite to the flanges, an interface communicated with the heat conduction pipes is formed by protruding the upper surface of the upper plate, the heat conduction pipes are hollow pipes with one ends open, and the outer wall surfaces of the openings of the heat conduction pipes are connected with the inner wall surfaces of the interfaces. The traditional 3D VC radiator inlays the heat pipe in the radiator, current structure is punching the jack on the upper plate, then insert the heat pipe in the jack, the heat pipe surface is linear contact with the jack this moment, weld in contact department, at first the heat pipe is linear contact with the jack periphery, both area of contact are little, if the welding is insecure, cause the crack easily, influence the radiator seal degree, influence the heat conductivity of radiator, change into the takeout pipe by the jack, make the outer wall of heat pipe and the internal face contact of turn-ups, change into facial nature contact by linear contact, the area of contact of heat pipe with the takeout pipe has been increased, make the heat pipe more firm with the takeout pipe welding, the leakproofness is better.
Furthermore, the periphery of the base is provided with a circle of welding surface, the upper plate is provided with a circle of brazing filler metal holes corresponding to the welding surface, and brazing filler metal is arranged between the welding surface and the upper plate. The base of current heat dissipation base plate and the banding between the upper plate can be through brazing or laser welding or diffusion welding, nevertheless if adopt brazing filler metal to weld, the key that its manufacture became bad lies in the presetting of vacuum brazing filler metal, but the face of weld is usually distributed a large amount of minute cavity or cracks (being the face of weld unevenness), if brazing seam tissue is inhomogeneous, discontinuous and cavity area is great, can influence the vacuum of heat dissipation base plate, in addition, because the brazing filler metal is soft, can make the brazing filler metal seriously warp, distort even fracture at the face of weld through the upper plate pressfitting. Solder holes are formed in the upper plate at the corresponding positions of the welding surface of the base, the contact position of the welding surface and the solder is just the position where the edge sealing of the radiating substrate needs to be brazed, the solder enters a gap between the welding surface and the upper plate through the solder holes, a layer of solder can be dissolved and diffused on the surface of the welding surface, and the shape of the layer of solder is completely consistent with the position where the edge sealing of the radiating substrate needs to be welded; the brazing filler metal, the base and the upper plate are integrated, so that the assembly process can be simplified to the greatest extent, accurate assembly and positioning are realized, and the manufacturing qualification rate of the radiating substrate is greatly improved.
Further, the upper surface of the upper plate is provided with a vacuum pumping port. The evacuation port of the existing heat dissipation substrate is formed at the joint of the two plates, and the 'splicing joint' is unavoidable, so that the heat insulation performance of the uniform temperature plate is influenced, cracks are easily generated at the splicing joint, and the attractiveness is influenced. The vacuum pumping port and the pumping pipe are simultaneously formed on the upper plate surface, the manufacturing process is simple, the cost is low, the efficiency is high, and the problem of 'splicing' is avoided.
A method for preparing a radiator with a built-in integrated supporting structure comprises the following steps:
step one, manufacturing an upper plate: preparing a first plate, forming a plurality of pumping pipes and a vacuum port on the first plate by protruding upwards from the surface of the first plate, forming a plurality of bulges on the first plate by protruding downwards from the surface of the first plate, and forming a circle of brazing filler metal holes on the periphery of the first plate;
step two, manufacturing a base: preparing a second plate, wherein the middle part of the second plate is sunken to form a hollow cavity, and the periphery of the second plate is turned over to form a welding surface;
thirdly, dotting brazing filler metal on the bulges of the upper plate, covering the upper plate on the base, sealing the opening of the base by the upper plate at the moment, dotting the brazing filler metal into the brazing filler metal holes, carrying out vacuum brazing on the upper plate and the base, enabling the brazing filler metal to enter a gap between the upper plate and a welding surface along the brazing filler metal holes, and enabling the contact part of the upper plate and the brazing filler metal to dissolve and diffuse a layer of brazing filler metal on the surface of the welding surface so as to enable the edge of the upper plate and the edge of the base to be sealed to form a heat dissipation substrate of a;
inserting the opening end of the heat conduction pipe into the extraction pipe, wherein the heat conduction pipe is in interference fit with the inner wall of the extraction pipe, welding is carried out at the joint of the heat conduction pipe and the extraction pipe, and the hollow inner cavity of the heat conduction pipe is communicated with the cavity of the heat dissipation substrate to form an inner cavity;
step five, vacuumizing the inner cavity by a vacuumizing device through a vacuumizing port, then filling a proper amount of liquid heat transfer medium through the vacuumizing port, and performing argon protection electric welding sealing on the vacuumizing port after the injection amount of the liquid heat transfer medium reaches the standard capacity, wherein the liquid heat transfer medium can be pure water;
and sixthly, mounting the fin group on the heat conduction pipe to finish the preparation of the radiator.
The invention has the beneficial effects that:
1. the internal supporting structure of the radiating substrate is optimized, the upper plate is punched to bulge when being punched to form the supporting structure between the base and the upper plate, the structure is reasonable, the design is novel, the cost of copper columns and materials is completely eliminated, the supporting columns are not required to be welded one by one, the process is saved, the cost for manually placing the copper columns is saved, the production efficiency is improved, the internal supporting area of the radiating substrate is increased, the stability of the internal structure is enhanced, and the flatness is favorably maintained; the bad scrap caused by the tilting of the copper column is avoided, then the upper plate is integrally formed, and the pumping pipe, the bulge and the vacuum pumping port are formed on the upper plate, so that the cost is greatly reduced and the production efficiency is improved;
2. the brazing filler metal is injected from the brazing filler metal hole, flows and is filled in the gap when a brazing mode is adopted, the brazing filler metal can be prevented from deforming or breaking by the aid of the brazing filler metal, cracks are prevented from being generated, air tightness of the radiating substrate is improved, and welding time is shortened. The cost is saved;
3. the pipe is arranged on the upper plate, so that the welding structure of the heat conduction pipe and the heat dissipation substrate is optimized, the welding area of the heat conduction pipe and the heat dissipation substrate is increased, the stability of the heat conduction pipe is improved, the heat conduction pipe is prevented from loosening, and the air tightness of the heat dissipation substrate is enhanced;
4. the position design of the vacuumizing port is optimized, the traditional mode that the abutted seam vacuumizing port is formed in the side face is optimized to the mode that the vacuumizing port is formed in the upper plate, and the problem of low air tightness caused by the fact that the upper plate and the base are not tightly closed can be solved;
5. the structure design and the installation design of the fin group are optimized, the fin group can be vertically installed on the radiating substrate, a radiating air channel is changed, the installation direction of the fan can be changed from the side surface of the heating piece to the upper side of the heating piece, and the fin group is compatible with more different working environments.
Drawings
FIG. 1 is a block diagram of the present invention.
Fig. 2 is an exploded view of the present invention.
FIG. 3 is an upper plate structure of the present invention.
Fig. 4 is another perspective view of fig. 2.
Fig. 5 is a base structure of the present invention.
Fig. 6 is a structural view of the present invention in combination with a heat conductive pipe.
Fig. 7 is a view of an embodiment of the present invention applied to a 3D heat sink.
Fig. 8 is a diagram of an embodiment of the present invention applied to a 3D heat sink.
Fig. 9 is a diagram of an embodiment of the present invention applied to a 3D heat sink.
Fig. 10 is a diagram of an embodiment of the present invention applied to a 3D heat sink.
Description of reference numerals: 1. a heat-dissipating substrate; 11. a base; 111. a concave cavity; 112. welding a surface; 12. an upper plate; 121. a brazing filler metal hole; 122. drawing a pipe; 123. a vacuum pumping port; 124. bulging; 1241. a first bulge; 1242. a second bulge; 1243. a third bulge; 2. a heat conducting pipe; 3. a set of fins.
Detailed Description
Example 1
Referring to fig. 1-10, a heat sink with an integrated supporting structure inside includes a heat dissipating substrate 1, the heat dissipating substrate 1 is a VC structural member, the heat dissipating substrate 1 includes a base and an upper plate, the connecting edges of the base and the upper plate are sealed by diffusion welding, laser welding or solder welding, the base 11 has a cavity, a supporting joint member is disposed in the cavity, a ring of welding surface 112 is disposed outside the cavity, a ring of solder is dotted on the welding surface 112, the upper plate 12 covers the welding surface and closes the opening, the base 11 and the upper plate 12 are assembled together for solder welding, when the base 11 and the upper plate 12 are heated to a temperature slightly higher than the melting point of the solder, the solder is melted and sucked into and filled in the gap between the welding surface and the upper plate by capillary action, the liquid solder is mutually diffused and dissolved with the welding surface and the upper plate 12, and a vacuum cavity is formed between the upper plate and the base after the upper plate is sealed, the concave cavity becomes a vacuum cavity, the upper surface and the lower surface of the support joint are respectively welded with the lower surface of the upper plate and the bottom surface of the base together through brazing filler metal, and the support joint is used for pulling and supporting the upper plate when the vacuum cavity is formed between the base and the upper plate, the upper surface of the upper plate is provided with a vacuumizing port, vacuumizing equipment vacuumizes an inner cavity of the radiating substrate through the vacuumizing port, then a proper amount of liquid heat transfer medium is filled into the vacuumizing port, the liquid heat transfer medium flows into the vacuum cavity, the vacuumizing port is sealed after the injection amount of the liquid heat transfer medium reaches the standard capacity, the liquid heat transfer medium adopts water, acetone or ethanol, the radiator absorbs heat through the liquid heat transfer medium in the vacuum cavity and evaporates to form steam, and the steam reaches the upper plate and exchanges heat with the external environment to form liquid heat transfer medium drops, the heat flows back to the concave cavity to continuously carry out circulating heat exchange, so that the local heat accumulation can be effectively reduced, the heat dissipation efficiency is high, and the heat can be quickly dissipated. The existing vacuumizing port 123 is generally installed at the junction of two plates of the heat dissipation substrate 1, an arc-shaped opening is formed in the side surface of the upper plate 12 and the base 11, the two arc-shaped openings are combined to form the vacuumizing port 123 after the upper plate 12 and the base 11 are jointed and welded, a seam can be formed in the structure of the vacuumizing port 123, and if the vacuumizing port 123 is not closed well, the sealing performance of the heat dissipation substrate 1 can be affected, so that the overall heat dissipation effect of the heat sink is reduced; the structure of the vacuumizing opening 123 is optimized in the embodiment, the vacuumizing opening is arranged on the upper surface of the upper plate 12, splicing is not needed, the seam is avoided, and the vacuumizing effect and the sealing performance of the radiating substrate 1 are effectively improved.
Support the inside bearing structure who changes the VC structure into the swell by the copper post and support, the swell is equipped with a plurality of swell 124 towards the base direction by the integrative stamping forming of upper plate, perpendicular to upper plate surface direction on upper plate 12, the swell supports 124 and ends on the base surface, and is further, the swell is the stair structure, the swell extends first swell, second swell and third swell toward the base in proper order from the upper plate surface, first swell is fallen the arc face with the linking department on upper plate surface, third swell top surface is the plane, the plane is hugged closely on the base surface.
The invention optimizes the internal supporting structure of the radiating substrate, and the bulge formed by stamping the upper plate forms the supporting structure between the base and the upper plate, so that the structure is reasonable, the design is novel, the copper column-material cost is completely cancelled, and the support columns do not need to be welded one by one, thereby saving the working procedure, saving the cost of manually placing the copper columns, improving the production efficiency, increasing the internal supporting area of the radiating substrate, enhancing the stability of the internal structure and being beneficial to maintaining the flatness; avoid the bad scrap caused by the tilting of the copper column. The stability of the internal structure is enhanced, the flatness is more favorably maintained, the speed is high, and the production efficiency is high.
Preferably, the upper plate 12 and the base 11 are both VC plates.
Example 2
This embodiment is a modification of embodiment 1, and is modified in that: a circle of brazing filler metal holes 121 are distributed on the edge of the upper plate 12 corresponding to the position of the welding surface, and the brazing filler metal holes 121 are used for injecting brazing filler metal.
The welding surface is usually distributed with a large number of tiny cavities or cracks (i.e. the welding surface is not flat), when the upper plate is pressed on the opening of the base, the upper plate is pressed on the welding surface, so that the brazing filler metal on the welding surface is seriously deformed, distorted and even broken, the brazing seam tissue is uneven and discontinuous, the hollow area is large, the vacuum degree of the heat dissipation substrate is influenced, and even the brazing filler metal possibly overflows into the concave cavity of the base, and through the setting in brazing filler metal hole, the brazing filler metal point is downthehole at the brazing filler metal, the part of pouring into brazing filler metal and upper plate contact just can be at the faying surface melting, the diffusion is filled, the solution is not because of getting into the cavity or forming unnecessary brazing filler metal in banding department by the upper plate extrusion, brazing filler metal and base 11, upper plate 12 forms integratively, can the at utmost simplify assembly process, use traditional "one face two round pins" locate mode can realize accurate assembly and location, and then improve radiating basal plate 1's manufacturing qualification rate by a wide margin.
The edge sealing can be performed by adopting diffusion welding or laser welding, the laser welding is high in welding speed and free of other consumable solders, the operation is stable, the welding effect is visible, the welding time is shortened by adopting brazing filler metal welding, the production efficiency is improved, the diffusion welding time is changed from 8H to 1H, the cost is saved, the time required by welding is greatly shortened, and a great deal of energy is not required to be consumed for surface treatment of the welding surface.
Example 3
This example is a variation of examples 1 and 2, with the following: this embodiment is applied to the 3D radiator, upwards conducts the heat through the heat pipe, dispels the heat with higher speed, be equipped with a plurality of heat pipes on the heat dissipation base plate, the cover is equipped with fin group on the heat pipe, the heat pipe for having one end open-ended cavity body, upper plate 12 upper surface be equipped with take out pipe 122 that corresponds with the heat pipe, take out pipe 122 including punch a hole in advance and with punch a hole integrative turn-ups in advance, the turn-ups is relative upper plate upper surface is protruding to be established, the open end of heat pipe is inserted and is located in taking out the pipe, and the cavity inner chamber and the vacuum cavity of heat pipe link up, the outer wall face and the turn-ups internal face of open end are. The common line-surface contact is changed into the surface-surface contact, so that the defects that the heat conduction pipe and the upper plate are not firmly welded, cracks are easy to appear after long-time use and the like are overcome, and the reliability of the radiator is improved.
The tube drawing method comprises the steps of firstly processing a pre-punched hole on an upper plate 12 by using a stamping die, applying force to the pre-punched hole in a direction perpendicular to the surface of the upper plate 12 at the position of the pre-punched hole to press a tube drawing 122, wherein the aperture of the tube drawing 122 is larger than that of the pre-punched hole. The punch die has a conical punch that reciprocates linearly and simultaneously rotates at the pre-punch position to punch out the extraction tube 122.
Presetting a pipe drawing position on a vertical upper plate, jacking the upper plate from the lower surface of the upper plate by adopting a stamping die, forming a plurality of bulges with regular shapes on the upper surface of the upper plate, wherein the bulges protrude relative to the surface of the upper plate, and then punching a punching plane from bottom to top along the boundary line position of the punching plane and an inclined plane to form a punched hole, wherein the diameter of the punched hole is smaller than the inner diameters of an annular inclined plane and an annular arc surface; the punch is then turned over from below to above to form the extraction tube 122.
Example 4
Referring to fig. 10, this embodiment is an application of embodiments 1 to 3, and the fin group 3 is vertically installed relative to the upper plate 12. The fin group 3 comprises a plurality of fins which are arranged in parallel, adjacent fins form a heat dissipation air channel, the heat dissipation air channel is arranged towards the direction of the heat dissipation substrate, the fan is arranged on one side of the heat dissipation air channel and is arranged opposite to the heat dissipation air channel, the heat dissipation efficiency of the heat dissipation air channel is enhanced by utilizing air flow generated by the fan, the heat dissipation effect is better, the thickness and the arrangement distance of the fins can be adjusted according to requirements, and the heat dissipation effect is improved. The heat dissipation air channel formed by the traditional fin group is parallel to the heat dissipation substrate, as shown in figures 8-9, a fan can only be arranged on the side surface of the heat dissipation substrate and blows the heat dissipation substrate laterally, so that the application environment of the heat dissipation substrate is limited, namely the installation position of the fan is fixed and cannot be changed according to the surrounding environment.
A method for preparing a radiator with a built-in integrated supporting structure comprises the following steps:
preparing a first plate, forming a plurality of pumping pipes and a vacuum port on the first plate by protruding upwards from the surface of the first plate, forming a plurality of bulges on the first plate by protruding downwards from the surface of the first plate, and forming a circle of brazing filler metal holes on the periphery of the first plate to form an upper plate;
before forming the extraction pipe and the bulges, the extraction pipe and the bulges need to form a bulge structure, firstly, the positions of the bulges and brazing filler metal holes are preset on a vertical first plate, the upper part and the lower part of the bulges are simultaneously reversely jacked, a plurality of first bulges and second bulges with regular shapes are formed on the upper surface and the lower surface of the first plate, the first bulges and the second bulges are protruded relative to the surface of the first plate, the first bulges are bulges formed by downwards bulging the first plate from the surface of the first plate, the first bulges are reversely jacked for the second time and the third time to form the bulge structure, the second bulges are bulges formed by upwards bulging the first plate from the surface of the second plate, the center position of the second bulges is a punching plane, an annular inclined plane which is in obtuse angle relation with the punching plane is arranged around the punching plane, an annular arc surface of the bulges is arranged around the inclined plane, and a concave shoulder position connected with the plate plane is arranged around the arc surface, then, punching the punching plane from bottom to top along the boundary position of the punching plane and the inclined plane to form a punched hole, wherein the diameter of the punched hole is smaller than the inner diameters of the annular inclined plane and the annular circular arc surface; then, the punched hole is rightly turned over from bottom to top to form a drawing pipe; forming a punched hole and simultaneously forming a brazing filler metal hole;
preparing a second plate, wherein the middle of the second plate is sunken to form a hollow cavity, and the periphery of the second plate is turned over to form a welding surface; forming a base;
thirdly, dotting brazing filler metal on the bulge of the upper plate, covering the upper plate on the base, sealing the opening of the base by the upper plate, dotting the brazing filler metal at the brazing filler metal position, performing vacuum brazing filler metal welding on the upper plate and the base, enabling the brazing filler metal to enter a gap between the upper plate and a welding surface along a brazing filler metal hole, and dissolving and diffusing a layer of brazing filler metal on the surface of the welding surface at the part of the upper plate, which is in contact with the brazing filler metal; forming a heat dissipation substrate;
the brazing filler metal is pre-arranged, a layer of brazing filler metal is dissolved and diffused on the surface of the welding surface only when the brazing filler metal is in contact with the upper plate, and the shape of the layer of brazing filler metal is completely consistent with that of the position, needing to be welded, of the edge sealing of the heat dissipation substrate; the brazing filler metal, the base and the upper plate are integrated, the assembly process can be simplified to the greatest extent, the traditional 'one-surface two-pin' positioning mode is used, accurate assembly and positioning can be achieved, and the manufacturing yield of the radiating substrate is greatly improved.
Inserting the heat conduction pipe into the extraction pipe, wherein the surface of the heat conduction pipe is in interference fit with the inner wall of the extraction pipe, welding is carried out at the joint of the heat conduction pipe and the extraction pipe, the heat conduction pipe is a hollow pipe body, and the heat conduction pipe is communicated with the heat dissipation substrate to form an inner cavity;
fifthly, vacuumizing the inner cavity by a vacuumizing device through a vacuumizing port, then filling a proper amount of liquid heat transfer medium through the vacuumizing port, and performing argon protection electric welding sealing on the vacuumizing port after the injection amount of the liquid heat transfer medium reaches the standard capacity;
and sixthly, mounting the fin group on the heat conduction pipe to finish the preparation of the radiator.
Before the fin group is installed, the heat conducting pipe can be bent and installed, as shown in fig. 10.
The fin group can also be integrally formed by adopting an aluminum extruded section, the aluminum extruded section of the integral section needs to be milled to increase waste materials, but the aluminum extruded section can obtain the specified shape and specification without opening the die again, so that the manufacturing cost of the die is reduced; can cooperate with the heat conduction pipe gomphosis, the heat conduction pipe need not flatten, and the processing is easy, and the assembly is nimble, and the radiating efficiency is higher moreover, and stability is good.
The aluminum extruded section comprises a base, wherein the base is provided with a plurality of groups of fin groups and clamping grooves, the fin groups comprise a plurality of fins which are arranged in parallel along the length direction of the base, the fins and the base are arranged in a cross manner, adjacent fins form a heat dissipation air channel, the clamping grooves are arranged on one side of the heat dissipation air channel and are used for being clamped on a heat conduction pipe, the base can also be provided with a plurality of extraction pipes, and the base is arranged on the heat conduction pipe through the extraction pipes, as shown in figure 10.
The above embodiments are merely illustrative of the preferred embodiments of the present invention, and not restrictive, and various changes and modifications to the technical solutions of the present invention may be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are intended to fall within the scope of the present invention defined by the appended claims.
Claims (8)
1. The utility model provides a built-in integral type bearing structure's radiator which characterized in that: including the heat dissipation base plate, the heat dissipation base plate includes base and upper plate, the base has open-ended cavity up, the upper plate is used for the lid to close on the base and seal the opening, in form a vacuum cavity between upper plate and the base, it has liquid heat transfer medium to hold in the vacuum cavity, and perpendicular to upper plate surface is equipped with a plurality of swell towards vacuum cavity direction on the upper plate, the swell is supported and is ended on the base surface.
2. The heat sink with built-in integrated support structure of claim 1, wherein: the bulge is of a step structure, a first bulge, a second bulge and a third bulge sequentially extend from the surface of the upper plate to the interior of the vacuum cavity, an arc surface is inverted at the joint of the first bulge and the surface of the upper plate, the top surface of the third bulge is a plane, and the plane is tightly attached to the surface of the base.
3. The heat sink with built-in integrated support structure of claim 1, wherein: the liquid heat transfer medium is water, acetone or ethanol.
4. The heat sink with built-in integrated support structure of claim 1, wherein: the base and the upper plate are formed by punching and molding metal plates.
5. The heat sink with built-in integrated support structure of claim 1, wherein: the heat dissipation base plate is connected with a plurality of heat conduction pipes in a penetrating mode, the upper surface of the upper plate is provided with a plurality of extraction pipes, each extraction pipe comprises a pre-punched hole and a flanging integrated with the pre-punched hole, the flanging is opposite to the upper surface of the upper plate, an interface communicated with the heat conduction pipes is formed in a protruding mode, the heat conduction pipes are hollow pipe bodies with one ends open, and the outer wall surfaces of the openings of the heat conduction pipes are connected with the inner wall surfaces of the interfaces.
6. The heat sink with built-in integrated support structure of claim 1, wherein: the base periphery is equipped with the round face of weld, the upper plate correspond the face of weld position and be equipped with the round brazing filler metal hole, the face of weld is equipped with the brazing filler metal with the upper plate junction.
7. The heat sink with built-in integrated support structure of claim 1, wherein: the upper surface of the upper plate is provided with a vacuum pumping port.
8. A method for preparing a radiator with a built-in integrated supporting structure according to claim 1, wherein the method comprises the following steps: the method comprises the following steps:
step one, manufacturing an upper plate: preparing a first plate, forming a plurality of pumping pipes and a vacuum port on the first plate by protruding upwards from the surface of the first plate, forming a plurality of bulges on the first plate by protruding downwards from the surface of the first plate, and forming a circle of brazing filler metal holes on the periphery of the first plate;
step two, manufacturing a base: preparing a second plate, wherein the middle part of the second plate is sunken to form a hollow cavity, and the periphery of the second plate is turned over to form a welding surface;
thirdly, dotting brazing filler metal on the bulges of the upper plate, covering the upper plate on the base, sealing the opening of the base by the upper plate at the moment, dotting the brazing filler metal into the brazing filler metal holes, carrying out vacuum brazing on the upper plate and the base, enabling the brazing filler metal to enter a gap between the upper plate and a welding surface along the brazing filler metal holes, and enabling the contact part of the upper plate and the brazing filler metal to dissolve and diffuse a layer of brazing filler metal on the surface of the welding surface so as to enable the edge of the upper plate and the edge of the base to be sealed to form a heat dissipation;
inserting the opening end of the heat conduction pipe into the extraction pipe, wherein the heat conduction pipe is in interference fit with the inner wall of the extraction pipe, welding is carried out at the joint of the heat conduction pipe and the extraction pipe, and the hollow inner cavity of the heat conduction pipe is communicated with the cavity of the heat dissipation substrate to form an inner cavity;
step five, vacuumizing the inner cavity by a vacuumizing device through a vacuumizing port, then filling a proper amount of liquid heat transfer medium through the vacuumizing port, and sealing the vacuumizing port after the injection amount of the liquid heat transfer medium reaches the standard capacity;
and sixthly, mounting the fin group on the heat conduction pipe to finish the preparation of the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010095258.XA CN111278259A (en) | 2020-02-16 | 2020-02-16 | Radiator with built-in integrated supporting structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010095258.XA CN111278259A (en) | 2020-02-16 | 2020-02-16 | Radiator with built-in integrated supporting structure and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111278259A true CN111278259A (en) | 2020-06-12 |
Family
ID=71002764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010095258.XA Pending CN111278259A (en) | 2020-02-16 | 2020-02-16 | Radiator with built-in integrated supporting structure and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111278259A (en) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2566457Y (en) * | 2002-08-02 | 2003-08-13 | 王培清 | Heat pipe radiator for central processor of computer |
| JP2013047048A (en) * | 2011-08-29 | 2013-03-07 | Ihi Marine United Inc | Fuel tank support structure and floating structure |
| CN203177703U (en) * | 2013-01-14 | 2013-09-04 | 深圳市万景华科技有限公司 | Vertical type heat conduction structure |
| JP2014109144A (en) * | 2012-12-03 | 2014-06-12 | Zojirushi Corp | Heat insulation panel and heat insulating body |
| TW201510460A (en) * | 2013-09-04 | 2015-03-16 | Shenzhen Wanjinhua Technology Co Ltd | A stereo heat-conducting device of a radiator |
| CN106197104A (en) * | 2015-12-16 | 2016-12-07 | 广州共铸科技股份有限公司 | 3 D stereo hot superconductive temperature equalizing radiator and preparation method thereof |
| CN106238614A (en) * | 2016-02-02 | 2016-12-21 | 苏州宝成汽车冲压有限公司 | The method of molding convex closure and automobile absorber connecting rod on high-strength plate |
| CN207816070U (en) * | 2018-02-05 | 2018-09-04 | 东莞市合众导热科技有限公司 | A kind of new support construction of temperature-uniforming plate upper and lower covers |
| CN110779370A (en) * | 2019-12-06 | 2020-02-11 | 昆山联德电子科技有限公司 | Thin type temperature equalizing plate |
| CN111163622A (en) * | 2020-02-16 | 2020-05-15 | 东莞市正康电子有限公司 | Radiator with folding fins and preparation method thereof |
| CN211352934U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Novel heat radiation structure |
| CN211352932U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Radiator with folding fin |
| CN211352935U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Pump pipe structure of VC radiator |
| CN211352937U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Radiator with built-in integrated supporting structure |
| CN211352933U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Heat dissipation base plate banding structure of VC radiator |
| CN211739969U (en) * | 2020-02-16 | 2020-10-23 | 东莞市正康电子有限公司 | Vacuum-pumping port structure of VC radiator |
-
2020
- 2020-02-16 CN CN202010095258.XA patent/CN111278259A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2566457Y (en) * | 2002-08-02 | 2003-08-13 | 王培清 | Heat pipe radiator for central processor of computer |
| JP2013047048A (en) * | 2011-08-29 | 2013-03-07 | Ihi Marine United Inc | Fuel tank support structure and floating structure |
| JP2014109144A (en) * | 2012-12-03 | 2014-06-12 | Zojirushi Corp | Heat insulation panel and heat insulating body |
| CN203177703U (en) * | 2013-01-14 | 2013-09-04 | 深圳市万景华科技有限公司 | Vertical type heat conduction structure |
| TW201510460A (en) * | 2013-09-04 | 2015-03-16 | Shenzhen Wanjinhua Technology Co Ltd | A stereo heat-conducting device of a radiator |
| CN106197104A (en) * | 2015-12-16 | 2016-12-07 | 广州共铸科技股份有限公司 | 3 D stereo hot superconductive temperature equalizing radiator and preparation method thereof |
| CN106238614A (en) * | 2016-02-02 | 2016-12-21 | 苏州宝成汽车冲压有限公司 | The method of molding convex closure and automobile absorber connecting rod on high-strength plate |
| CN207816070U (en) * | 2018-02-05 | 2018-09-04 | 东莞市合众导热科技有限公司 | A kind of new support construction of temperature-uniforming plate upper and lower covers |
| CN110779370A (en) * | 2019-12-06 | 2020-02-11 | 昆山联德电子科技有限公司 | Thin type temperature equalizing plate |
| CN111163622A (en) * | 2020-02-16 | 2020-05-15 | 东莞市正康电子有限公司 | Radiator with folding fins and preparation method thereof |
| CN211352934U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Novel heat radiation structure |
| CN211352932U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Radiator with folding fin |
| CN211352935U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Pump pipe structure of VC radiator |
| CN211352937U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Radiator with built-in integrated supporting structure |
| CN211352933U (en) * | 2020-02-16 | 2020-08-25 | 东莞市正康电子有限公司 | Heat dissipation base plate banding structure of VC radiator |
| CN211739969U (en) * | 2020-02-16 | 2020-10-23 | 东莞市正康电子有限公司 | Vacuum-pumping port structure of VC radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111163622A (en) | Radiator with folding fins and preparation method thereof | |
| CN211352937U (en) | Radiator with built-in integrated supporting structure | |
| CN201844724U (en) | Flat-plate soaking plate | |
| CN102095323A (en) | Flat-panel vapor chamber | |
| JPH1038484A (en) | Flat type heat pipe | |
| CN107421364B (en) | Temperature equalizing plate structure and manufacturing method thereof | |
| CN211739969U (en) | Vacuum-pumping port structure of VC radiator | |
| US6647625B2 (en) | Method for fabricating a heat pipe structure in a radiating plate | |
| CN110849190A (en) | Copper-aluminum composite radiator and processing method thereof | |
| CN211234063U (en) | Temperature equalizing plate | |
| CN211352932U (en) | Radiator with folding fin | |
| CN211352935U (en) | Pump pipe structure of VC radiator | |
| CN211352933U (en) | Heat dissipation base plate banding structure of VC radiator | |
| CN111278259A (en) | Radiator with built-in integrated supporting structure and preparation method thereof | |
| CN211234064U (en) | Copper-aluminum composite radiator | |
| CN211352934U (en) | Novel heat radiation structure | |
| TWI801739B (en) | Temperature-uniformizing board and method for making the same | |
| CN220422314U (en) | Temperature equalizing plate and radiator | |
| CN216673629U (en) | Brazing laminated heat pipe radiator | |
| CN219511351U (en) | Close-fitting heat pipe with close-fitting groove on base | |
| CN111770660A (en) | Integrated temperature-uniforming plate and manufacturing method thereof | |
| CN213983486U (en) | Radiator assembled in limiting interference fit manner and press-fitting structure thereof | |
| CN113357950A (en) | Radiator and manufacturing method thereof | |
| CN215872383U (en) | Two-phase flow high-performance radiator | |
| CN220935465U (en) | Temperature equalizing plate for heat dissipation of electronic product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |