CN220422314U

CN220422314U - Temperature equalizing plate and radiator

Info

Publication number: CN220422314U
Application number: CN202322018271.7U
Authority: CN
Inventors: 官红刚; 徐海长
Original assignee: Dongguan Zhengkang Electronics Co ltd
Current assignee: Dongguan Zhengkang Electronics Co ltd
Priority date: 2023-07-31
Filing date: 2023-07-31
Publication date: 2024-01-30
Anticipated expiration: 2033-07-31

Abstract

The utility model relates to a temperature equalizing plate and a radiator, wherein the radiator comprises a temperature equalizing plate, back glue, a back plate, heat pipes, a mounting bracket and a radiating fin group sheet, the back glue is arranged on the lower surface of the temperature equalizing plate, the back plate is arranged on the upper surface of the temperature equalizing plate, heat pipe grooves are arranged on two sides of the back plate, the heat pipes are arranged in the heat pipe grooves, the other ends of the heat pipes protrude out of the heat pipe grooves and are connected with the mounting bracket, the radiating fin group sheet is assembled and spliced with the heat pipes on two sides and the upper surface of the back plate, the temperature equalizing plate comprises a VC lower plate and a VC upper plate, the VC lower plate and the VC upper plate are assembled in a covering way, an inner cavity is formed in an inner space between the VC lower plate and the VC upper plate after the VC lower plate and the VC upper plate are covered, and a plurality of supporting columns are arranged in the inner cavity, and the radiator is characterized in that: the bottom of any support column locate the internal surface of VC hypoplastron and with VC hypoplastron integrated into one piece, the top of support column hug closely in the internal surface of VC upper plate.

Description

Temperature equalizing plate and radiator

Technical Field

The utility model relates to the technical field of radiators, in particular to a temperature equalizing plate and a radiator.

Background

With the rapid development of electronic devices, the operation capability of the electronic devices is stronger, and the more heat is generated during operation, the more heat is used as a radiator in high-power or high-integration electronic products. The temperature equalizing plate is widely applied as a radiator in high-power or high-integration electronic products, VC is formed by sintering a capillary structure in a closed cavity, injecting a circulating working medium and vacuumizing. When the heat absorption and evaporation device works, working medium at the position (evaporation end) contacted with the chip absorbs heat and evaporates, so that base gas is changed into base gas to quickly move to the condensation section of the radiating fin, precooled and condensed into liquid state, heat is released, and then the base gas returns to the evaporation end through the capillary structure, so that the heat is circulated repeatedly, and the function of conveying the heat from the evaporation end to the condensation end is realized.

For example, in the disclosure of CN215149002U, a patent name is a background technology of a jig for efficiently placing copper columns of a temperature equalization plate, where the copper columns need to be placed by means of the placing jig in the production process of the temperature equalization plate. The current VC technology comprises the steps of firstly stamping a base and a flat upper plate, wherein the base is provided with a concave cavity with an opening at one end, forming a welding surface at the periphery of the base, paving an upper capillary structure (copper net or copper powder) at the bottom of the concave cavity, finally manually putting support columns (copper columns) into reserved hole sites one by one, coating a circle of brazing filler metal on the welding surface, covering the upper plate at the opening, sealing edges (all sides are welded and sealed), attaching the upper plate to the welding surface, visually checking whether a uniform brazing seam structure is formed at the contact part of the welding surface of the base and the upper plate and whether redundant brazing filler metal remains at the gap between the base and the upper plate, and cutting the redundant brazing filler metal through precise high-speed milling or high-precision laser; the base and the upper plate extend outwards from a corresponding side to form a semi-cylindrical shell, the two semi-cylindrical shells are surrounded to form a vacuumizing port, the vacuumizing equipment vacuumizes the inner cavity of the radiating substrate through the vacuumizing port, then a proper amount of liquid heat transfer medium is poured into the vacuumizing port, after the injection amount of the liquid heat transfer medium reaches the standard capacity, the vacuumizing port is sealed, and the liquid heat transfer medium is condensed to dissipate heat after being heated and gasified when meeting heat, so that the vacuum temperature equalizing plate is formed.

The existing VC radiator has the following problems: the number of copper columns required by the existing structure is large, and the cost is high; the copper column needs to be manually placed, the labor cost is high, the production efficiency is extremely low, after the copper column is well placed, the copper column is covered with the upper cover, the copper column is easy to fall down in the operation and carrying processes, and poor flatness fee reporting is finally caused.

Disclosure of Invention

In order to solve the above problems, the present utility model provides a heat sink and a temperature equalizing plate thereof.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a samming board, samming board contains VC hypoplastron and VC upper plate, VC hypoplastron and VC upper plate are closed the equipment through welding technique, and the inner space between VC hypoplastron and the VC upper plate forms the inner chamber after closing, is equipped with a plurality of support column in the inner chamber, the internal surface of VC hypoplastron is located to the bottom of support column and with VC hypoplastron integrated into one piece, the top of support column hug closely in the internal surface of VC upper plate.

Preferably, the VC lower plate is provided with a concave cavity which is opened upwards, a circle of welding surfaces are arranged on the periphery of the concave cavity, and the VC upper plate is used for covering and sealing the welding surfaces of the VC lower plate.

Preferably, the support column is a circular column.

Preferably, the side surface of the temperature equalization plate is provided with at least one groove, the inner wall of the groove is provided with at least one water injection through hole communicated with the inner cavity, the water injection through hole is matched with a water injection pipe, and the water injection pipe is positioned in the groove and is flush with the side surface of the temperature equalization plate.

The utility model provides a radiator, includes samming board, gum, backplate, heat pipe, installing support and heat radiation fin group piece, samming board lower surface be equipped with the gum, samming board upper surface be equipped with the backplate, the both sides of backplate all are equipped with the heat pipe groove, the heat pipe inslot be equipped with the heat pipe, the outstanding heat pipe groove of other one end of heat pipe is connected with the installing support, heat radiation fin group piece and the heat pipe and backplate upper surface of both sides assemble the concatenation.

Preferably, the temperature equalization plate is provided with at least one temperature equalization mounting hole penetrating through the upper surface and the lower surface of the temperature equalization plate, the backboard is provided with at least one backboard mounting hole penetrating through the upper surface and the lower surface of the temperature equalization plate, the position of the backboard mounting hole corresponds to the temperature equalization mounting hole, and the temperature equalization mounting hole of the temperature equalization plate can be matched with the backboard mounting hole of the backboard for connection and assembly.

Preferably, the back plate comprises a back plate upper surface and a back plate lower surface, the back plate lower surface is clung to the upper surface of the temperature equalization plate, the heat pipe grooves are arranged on two sides of the back plate lower surface, and the shape of the heat pipe grooves is matched with that of the heat pipes.

Preferably, the center of the upper surface of the back plate is provided with a back plate groove, and the back plate groove is quadrilateral and can accommodate and place the third radiating fin group.

Preferably, the heat dissipation fin group piece includes a first heat dissipation fin group piece, a second heat dissipation fin group piece and a third heat dissipation fin group piece, the first heat dissipation fin group piece and the second heat dissipation fin group piece are spliced with the heat pipes at two sides, and the third heat dissipation fin group piece is assembled in the back plate groove.

Preferably, the surfaces of the first radiating fin group sheet and the second radiating fin group sheet are provided with at least one fin hole.

The utility model has the beneficial effects that: the VC lower plate and the VC upper plate of the temperature equalization plate are assembled in a covering mode through a welding technology, an inner cavity is formed in an inner space between the VC lower plate and the VC upper plate of the temperature equalization plate after covering, a plurality of support columns are arranged in the inner cavity, one ends of the support columns are integrally formed by the VC lower plate and the support columns through a cold forging technology, and the other ends of the support columns are tightly attached to the VC upper plate. According to the scheme, the VC lower plate and the support columns are integrally formed by adopting a cold forging technology, and then welding of the support columns one by one is not needed manually, so that bad scrapping caused by tilting of the copper columns is avoided, the working procedure is saved, the cost of manually placing the copper columns is saved, and the production efficiency is improved.

Drawings

FIG. 1 is a schematic view of the installation of a temperature equalization plate of the present utility model.

Fig. 2 is a schematic structural diagram of a lower plate of the temperature equalization plate VC of the present utility model.

Fig. 3 is a schematic structural diagram of an upper plate of the temperature equalization plate VC of the present utility model.

FIG. 4 is a schematic view of the structure of the upper surface of the back plate of the present utility model.

FIG. 5 is a schematic view of the structure of the lower surface of the back plate of the present utility model.

Fig. 6 is a schematic structural diagram of a fin assembly according to the present utility model.

Fig. 7 is a schematic structural view of a heat sink according to the present utility model.

Fig. 8 is a schematic view of another angle of the radiator of the present utility model.

Description of the drawings:

1. a temperature equalizing plate; VC lower plate; 111. a uniform temperature mounting hole; 112. a support column; 113. a groove; 114. a water injection pipe; 115. a welding surface; VC upper plate; 2. a back plate; 21. the upper surface of the backboard; 211. a back plate mounting hole; 212. a back plate groove; 22. the lower surface of the backboard; 221. a heat pipe groove; 3. back glue; 4. a heat pipe; 5. a mounting bracket; 6. a heat radiation fin group sheet; 61. a first fin group; 62. a second fin group; 63. a third fin group; 64. fin holes; 7. a gasket; 8. a spring; 9. and (5) a screw.

Detailed Description

Referring to fig. 1-7, the present utility model relates to a heat sink and a temperature equalizing plate thereof, which comprises a temperature equalizing plate 1, a back adhesive 3, a back plate 2, a heat pipe 4, a mounting bracket 5 and a heat dissipating fin set sheet 6.

The lower surface of samming board 1 is equipped with gum 3, the upper surface of samming board 1 is equipped with backplate 2, is equipped with at least one samming mounting hole 111 that link up its upper and lower surface on the samming board 1, is equipped with backplate mounting hole 211 on the backplate 2, and the samming mounting hole 111 of samming board 1 can cooperate backplate mounting hole 211 of backplate 2 to use screw 9 to connect the equipment. At least one heat pipe groove 221 is arranged on two sides of the back plate 2, a heat pipe 4 is arranged in the heat pipe groove 221, and the other end of the heat pipe 4 protrudes out of the heat pipe groove 221 to be connected with the mounting bracket 5. The heat radiation fin group sheet 6 comprises a first heat radiation fin group sheet 61, a second heat radiation fin group sheet 62 and a third heat radiation fin group sheet 63, the first heat radiation fin group sheet 61 and the second heat radiation fin group sheet 62 are spliced with the heat pipes 4 at two sides, and the third heat radiation fin group sheet 63 is assembled on the upper surface of the backboard 2.

As shown in fig. 1-3, in this embodiment, the temperature equalizing plate 1 includes a VC lower plate 11 and a VC upper plate 12, and the temperature equalizing plate 1 is provided with at least one temperature equalizing mounting hole 111 penetrating the surfaces of the VC lower plate 11 and the VC upper plate 12. The VC lower plate 11 has a cavity opening upwards, a welding surface 115 is disposed around the periphery of the cavity, the VC upper plate 12 is used for covering and sealing the welding surface 115 of the VC lower plate 11, so that the VC upper plate 12 and the VC lower plate 11 are assembled in a covering manner, an inner space between the VC lower plate 11 and the VC upper plate 12 after covering forms an inner cavity, a plurality of support columns 112 are disposed in the inner cavity, the support columns 112 are not limited to specific shapes, including but not limited to one or more of circular columns, square columns, prismatic columns, bar columns, etc., in this embodiment, the support columns 112 are circular columns, one end of each support column 112 adopts a cold forging technology to integrally form the VC lower plate 11 and the support column 112, and the other end of each support column 112 is tightly attached to the VC upper plate 12. At least one groove 113 is formed in the side surface of the VC lower plate 11, at least one water injection through hole is formed in the inner wall of the groove 113, and the water injection through hole is matched with the water injection pipe 114, so that water injection and other operations can be realized after the VC lower plate 11 and the VC upper plate 12 are covered.

As shown in fig. 5-6, in this example, the back plate 2 includes a back plate upper surface 21 and a back plate lower surface 22, at least one back plate mounting hole 211 penetrating through the back plate upper surface 21 and the back plate lower surface 22 is provided on the back plate 2, threads are provided in the back plate mounting hole 211, the position of the back plate mounting hole 211 corresponds to the position of the temperature equalizing mounting hole 111, the back plate 2 and the temperature equalizing plate 1 can be assembled and fixed by the screw 9, the gasket 7 and the spring 8, a back plate groove 212 is provided at the center of the back plate upper surface 21, in this embodiment, the shape of the back plate groove 212 is a quadrangle, and the size of the back plate groove 212 can accommodate and place the third heat dissipation fin group 63. At least one heat pipe groove 221 is arranged on both sides of the lower surface 22 of the back plate, and the shape of the heat pipe groove 221 is matched with that of the heat pipe 4. In this embodiment, the heat pipe 4 has a rounded rectangular shape, one end of the heat pipe 4 can be completely inserted into the heat pipe groove 221 to reach the deepest portion of the heat pipe groove 221, and the other end protrudes from the heat pipe groove 221 and is connected to the mounting bracket 5.

As shown in fig. 6-7, the fin group 6 is composed of a plurality of fins, and the shape of the fins is determined according to the function and the installation position, for example: in this embodiment, the heat radiation fin group 6 includes a first heat radiation fin group 61, a second heat radiation fin group 62, and a third heat radiation fin group 63. The first heat radiation fin group piece 61 and the second heat radiation fin group piece 62 need to be spliced with the heat pipes 4 at two sides of the back plate 2, at least one fin hole 64 is arranged on the surface of the first heat radiation fin group piece 61 and the surface of the second heat radiation fin group piece 62, and the number, the size and the position of the fin holes 64 are consistent with the number, the size and the position of the cross section of the heat pipes 4, so that the heat radiation fin group can be spliced and assembled with the heat pipes 4.

In this embodiment, the VC lower plate 11 and the VC upper plate 12 of the temperature equalization plate 1 are assembled by welding, and an inner space between the VC lower plate 11 and the VC upper plate 12 of the temperature equalization plate 1 after being assembled forms an inner cavity, a plurality of support columns 112 are disposed in the inner cavity, one end of each support column 112 adopts cold forging technology to integrally form the VC lower plate 11 and the support column 112, and the other end of each support column 112 is tightly attached to the VC upper plate 12. The VC lower plate 11 surface of samming board 1 is equipped with gum 3, samming mounting hole 111 of samming board 1 can cooperate backplate mounting hole 211 of backplate 2 to use screw 9, spring 8 and gasket 7 to connect the equipment, makes samming board 1 and backplate 2 concatenation lid close, after the lid closes, in the heat pipe groove 221 that has a plurality of heat pipe 4 to be connected to backplate 2 both sides specifically: one end of the heat pipe 4 is completely inserted into the heat pipe groove 221 of the back plate 2 to reach the deepest part of the heat pipe groove 221, and the other end protrudes out of the heat pipe groove 221 and is connected with the mounting bracket 5. The first heat radiation fin group piece 61 and the second heat radiation fin group piece 62 are spliced with the heat pipes 4 at two sides, the heat pipes 4 are wrapped by the first heat radiation fin group piece 61 and the second heat radiation fin group piece 62, and the third heat radiation fin group piece 63 is assembled on the upper surface of the backboard 2 to form a radiator.

In the temperature equalizing plate 1 of the prior art, the support columns 112 of the temperature equalizing plate 1 are manually placed into the reserved lower plate hole sites of the temperature equalizing plate 1 one by one, and the support columns 112 are required to be welded one by one after placement. The design of the utility model is characterized in that the VC lower plate 11 and the VC upper plate 12 of the temperature equalization plate 1 are assembled in a covering way through a welding technology, an inner cavity is formed in an inner space between the VC lower plate 11 and the VC upper plate 12 of the temperature equalization plate 1 after the covering, a plurality of support columns 112 are arranged in the inner cavity, one end of each support column 112 adopts a cold forging technology to integrally form the VC lower plate 11 and the support column 112, and the other end of each support column 112 is tightly attached to the VC upper plate 12. The scheme adopts cold forging technology to integrally form the VC lower plate 11 and the support columns 112, and secondly, the support columns 112 are welded one by one without manual work, so that bad scrapping caused by tilting of copper columns is avoided, the working procedure is saved, the cost of manually placing the copper columns is saved, and the production efficiency is improved.

The above embodiments are merely illustrative of the preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, and various modifications and improvements made by those skilled in the art to the technical solution of the present utility model should fall within the scope of protection defined by the claims of the present utility model without departing from the spirit of the design of the present utility model.

Claims

1. The utility model provides a samming board, samming board contains VC hypoplastron and VC upper plate, VC hypoplastron and VC upper plate are closed the equipment, and the inner space between VC hypoplastron and the VC upper plate forms the inner chamber after closing, is equipped with a plurality of support column, its characterized in that in the inner chamber: the bottom of any support column locate the internal surface of VC hypoplastron and with VC hypoplastron integrated into one piece, the top of support column hug closely in the internal surface of VC upper plate.

2. A temperature equalization plate as set forth in claim 1 wherein: the VC bottom plate is provided with a concave cavity which is opened upwards, a circle of welding surface is arranged at the periphery of the concave cavity, and the VC top plate is used for covering and sealing the welding surface of the VC bottom plate.

3. A temperature equalization plate as set forth in claim 1 wherein: the support column is a round column.

4. A temperature equalization plate as set forth in claim 1 wherein: the side surface of samming board on be equipped with at least one recess, the recess inner wall on have at least one and link up with the inner chamber water injection through-hole, water injection through-hole and water injection pipe cooperate, the water injection pipe be located the recess and flush with samming board's side surface.

5. A heat sink, characterized by: the heat pipe assembly comprises the temperature equalization plate, back glue, a back plate, heat pipes, a mounting bracket and a heat radiation fin assembly sheet according to any one of claims 1-4, wherein the back glue is arranged on the lower surface of the temperature equalization plate, the back plate is arranged on the upper surface of the temperature equalization plate, heat pipe grooves are formed in two sides of the back plate, the heat pipes are arranged in the heat pipe grooves, the other ends of the heat pipes protrude out of the heat pipe grooves to be connected with the mounting bracket, and the heat radiation fin assembly sheet is assembled and spliced with the heat pipes on two sides and the upper surface of the back plate.

6. A heat sink as defined in claim 5, wherein: the temperature equalization plate on be equipped with at least one and link up its upper and lower surface's samming mounting hole, be equipped with at least one on the backplate and link up its upper and lower surface's backplate mounting hole, the position and the samming mounting hole of backplate mounting hole correspond, the samming mounting hole of samming plate can cooperate the backplate mounting hole of backplate to connect the equipment.

7. A heat sink as defined in claim 5, wherein: the heat pipe grooves are formed in two sides of the lower surface of the backboard, and the shape of the heat pipe grooves is matched with that of the heat pipe.

8. A heat sink as defined in claim 5, wherein: the center of the upper surface of the backboard is provided with a backboard groove which is quadrilateral and can accommodate and place the radiating fin group sheet.

9. A heat sink as defined in claim 8, wherein: the radiating fin group piece comprises a first radiating fin group piece, a second radiating fin group piece and a third radiating fin group piece, wherein the first radiating fin group piece and the second radiating fin group piece are spliced with the heat pipes on two sides, and the third radiating fin group piece is assembled in the back plate groove.

10. A heat sink as claimed in claim 9, wherein: at least one fin hole is formed in the surfaces of the first radiating fin group sheet and the second radiating fin group sheet.