CN105188313A - Temperature equalizing plate with heat-conducting pipe - Google Patents
Temperature equalizing plate with heat-conducting pipe Download PDFInfo
- Publication number
- CN105188313A CN105188313A CN201510539182.4A CN201510539182A CN105188313A CN 105188313 A CN105188313 A CN 105188313A CN 201510539182 A CN201510539182 A CN 201510539182A CN 105188313 A CN105188313 A CN 105188313A
- Authority
- CN
- China
- Prior art keywords
- heat
- temperature
- heat pipe
- uniforming plate
- equalizing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a temperature equalizing plate with a heat-conducting pipe. The temperature equalizing plate comprises a temperature equalizing plate body. The temperature equalizing plate is characterized in that the temperature equalizing plate body is connected with the bottom end of the heat-conducting pipe; and the heat-conducting pipe is communicated with an internal cavity of the temperature equalizing plate body. The temperature equalizing plate is free of a filling opening, and is changed into filling from a seal opening of the heat-conducting pipe. According to the temperature equalizing plate, the heat conduction efficiency of the heat-conducting pipe and the temperature equalizing plate is increased; the heat dissipation efficiency is directly increased; and the heat dissipation effect is relatively good.
Description
Technical field
The invention relates to a kind of equalizing plate structure, specifically the novel temperature-uniforming plate of a kind of heat pipe and temperature-uniforming plate integrated formed structure.
Background technology
Along with scientific and technological industry progress fast, the function of electronic installation is also more and more powerful, such as, in centre device (CentralProcessingUnit, CPU), the electronic component arithmetic speed of wafer set or display unit also along with growth, the heat causing the electronic component unit interval to produce will improve relatively; Therefore, if the heat that electronic component gives out cannot dispel the heat in time, the running of electronic installation entirety will be affected, or cause the damage of electronic component.
The heat radiator of electronic element major part that general industry adopts is passed through as fan, the heat dissipation element such as radiator or heat pipe dispels the heat, and by radiator contact thermal source, heat preached to far-end by heat pipe again and dispel the heat, or by fan mandatory guidance air-flow to this radiator forced heat radiation, the electronic heating component coupling that temperature-uniforming plate (vaporchamber) is narrower for installing space or area is larger uses, in order to provide heat sinking function, it is mainly the upper cover plate and the lower cover that comprise coupling mutually, Yu Shang, solder bond is imposed after lower cover correspondence covers, and the sealed internal chamber room of inner system in vacuum state, in chamber there is the capillary structure of supporting construction and limit wall, and inject working solution in advance, paste to touch for various electronic heating component (as CPU etc.) and obtain temperature uniforming heat radiation effect.
Above-mentioned known electronic element adopts good heat radiation heat structure to seem very important.Temperature-uniforming plate (vaporchamber) is a kind of element improving heat transfer efficiency, when temperature-uniforming plate end thereof contacts electronic component is heated, absorb heat from thermal source, heat can be made can not to pile up at heating position from thermal source block transitive to radiating area amount of heat, but be dispersed in radiating fin group uniformly, in prior art, general radiator structure has VC to weld with fin or VC welds with heat pipe, fin and other structure radiator structure.VC and heat pipe Welding Structure are because adopting other filler as welding material, and the thermal conductivity, consumption, welding procedure etc. of welding material determine heat transmission effect, thus reduce heat transfer efficiency, and radiating effect is reduced.At present, in future in order to meet the cooling requirements of high power consumption calculation machine, the heat dispersion improving radiator will be heat radiation industry important research direction.
Summary of the invention
The object of the invention there is provided a kind of temperature-uniforming plate with heat pipe reducing heat slippages, improves heat conduction process speed and efficiency, improves heat dispersion further.
Technical scheme: a kind of temperature-uniforming plate with heat pipe, comprises temperature-uniforming plate, it is characterized in that: described temperature-uniforming plate is connected with heat pipe bottom, and the internal cavity of heat pipe and temperature-uniforming plate is interconnected.
Described heat pipe has some, evenly distributed on temperature-uniforming plate.
There is liquid injection port on described heat pipe top.
Hydraulic fluid is injected with in described heat pipe and temperature-uniforming plate cavity.
Described heat pipe bottom is provided with fixed support.
Beneficial effect: the present invention owing to have employed technique scheme, thus adds heat pipe and temperature-uniforming plate heat transfer efficiency, and the increase of heat transfer efficiency directly increases radiator heat exchange efficiency, improves the performance of heat radiation.Heat pipe and temperature-uniforming plate one, eliminate welding material and welding procedure that heat pipe is connected with temperature-uniforming plate, reduce cost and the defective products of product, improve heat transfer efficiency.
Accompanying drawing explanation
Fig. 1 is prior art temperature-uniforming plate schematic diagram.
Fig. 2 is prior art temperature-uniforming plate stereogram.
Fig. 3 is prior art application implementation schematic diagram.
Fig. 4 is the embodiment of the present invention 1 front view.
Fig. 5 is the embodiment of the present invention 1 STRUCTURE DECOMPOSITION stereogram.
Fig. 6 is the embodiment of the present invention 2 front view.
Fig. 7 is one of the embodiment of the present invention 2 STRUCTURE DECOMPOSITION figure.
Fig. 8 is the embodiment of the present invention 2 STRUCTURE DECOMPOSITION figure bis-.
Number in the figure represents: 1 temperature-uniforming plate, 2 heat pipes, 3 liquid injection port, 4 upper covers, 5 lower covers, 6 liquid injection pipes, 7 welding materials, 8 installing holes, 9 fixed supports.
Embodiment
Embodiment 1: see Fig. 4,5, a kind of temperature-uniforming plate with heat pipe, comprises temperature-uniforming plate 1, and described temperature-uniforming plate 1 is connected with heat pipe 2 bottom, and heat pipe bottom is inserted in installing hole 8 fixing, and heat pipe 2 is interconnected with the internal cavity of temperature-uniforming plate 1.Heat pipe 2 is hollow-core construction, and temperature-uniforming plate is made up of upper cover 4 and lower cover 5 and has inner cavity chamber.
Heat pipe 2 has some, evenly distributed on temperature-uniforming plate 2, and the present embodiment has four heat pipes.There is liquid injection port 3 on heat pipe 2 top, liquid injection port is sealed after fluid injection.Hydraulic fluid is injected with in described heat pipe 2 and temperature-uniforming plate 1 cavity.Hydraulic fluid communicates in heat pipe hollow pipe with in temperature-uniforming plate cavity.
Heat pipe is communicated with temperature-uniforming plate vacuum cavity inside, and hydraulic fluid can directly act in heat pipe, removes temperature-uniforming plate liquid injection pipe, changes by the fluid injection of the heat conduction mouth of pipe.Heat pipe is connected with temperature-uniforming plate internal working fluid uniform operational.Heat pipe end socket is as temperature-uniforming plate and heat pipe liquid injection port.Heat pipe and temperature-uniforming plate internal structure and operation principle same as the prior art, no longer describe in detail.
Embodiment 2: see Fig. 5-8, the present embodiment difference from Example 1 is:
Heat pipe 2 bottom is provided with fixed support 9, is convenient to heat pipe and firmly connects.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. have a temperature-uniforming plate for heat pipe, comprise temperature-uniforming plate, it is characterized in that: described temperature-uniforming plate is connected with heat pipe bottom, the internal cavity of heat pipe and temperature-uniforming plate is interconnected.
2. a kind of temperature-uniforming plate with heat pipe according to claim 1, is characterized in that: described heat pipe has some, evenly distributed on temperature-uniforming plate.
3. a kind of temperature-uniforming plate with heat pipe according to claim 1, is characterized in that: there is liquid injection port on described heat pipe top.
4. a kind of temperature-uniforming plate with heat pipe according to claim 1, is characterized in that: be injected with hydraulic fluid in described heat pipe and temperature-uniforming plate cavity.
5. a kind of temperature-uniforming plate with heat pipe according to claim 1, is characterized in that: described heat pipe bottom is provided with fixed support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510539182.4A CN105188313A (en) | 2015-08-29 | 2015-08-29 | Temperature equalizing plate with heat-conducting pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510539182.4A CN105188313A (en) | 2015-08-29 | 2015-08-29 | Temperature equalizing plate with heat-conducting pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105188313A true CN105188313A (en) | 2015-12-23 |
Family
ID=54910080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510539182.4A Pending CN105188313A (en) | 2015-08-29 | 2015-08-29 | Temperature equalizing plate with heat-conducting pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105188313A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109392291A (en) * | 2018-11-05 | 2019-02-26 | 四川九洲电器集团有限责任公司 | A kind of closed module of piezoelectric fan heat dissipation |
| CN111668713A (en) * | 2020-07-01 | 2020-09-15 | 广东电网有限责任公司 | High-efficient controllable formula heat abstractor of switch board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102788276A (en) * | 2012-07-31 | 2012-11-21 | 苏州晶雷光电照明科技有限公司 | LED lamp provided with heat dissipation function |
| CN203177703U (en) * | 2013-01-14 | 2013-09-04 | 深圳市万景华科技有限公司 | Vertical type heat conduction structure |
| US20130327502A1 (en) * | 2012-06-08 | 2013-12-12 | Rung-An Chen | Phase change type heat dissipating device |
| CN203369041U (en) * | 2013-08-13 | 2013-12-25 | 奇鋐科技股份有限公司 | Heat-dissipating module |
| CN204887858U (en) * | 2015-08-29 | 2015-12-16 | 陈豪 | Temperature -uniforming plate with heat pipe |
-
2015
- 2015-08-29 CN CN201510539182.4A patent/CN105188313A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130327502A1 (en) * | 2012-06-08 | 2013-12-12 | Rung-An Chen | Phase change type heat dissipating device |
| CN102788276A (en) * | 2012-07-31 | 2012-11-21 | 苏州晶雷光电照明科技有限公司 | LED lamp provided with heat dissipation function |
| CN203177703U (en) * | 2013-01-14 | 2013-09-04 | 深圳市万景华科技有限公司 | Vertical type heat conduction structure |
| CN203369041U (en) * | 2013-08-13 | 2013-12-25 | 奇鋐科技股份有限公司 | Heat-dissipating module |
| CN204887858U (en) * | 2015-08-29 | 2015-12-16 | 陈豪 | Temperature -uniforming plate with heat pipe |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109392291A (en) * | 2018-11-05 | 2019-02-26 | 四川九洲电器集团有限责任公司 | A kind of closed module of piezoelectric fan heat dissipation |
| CN111668713A (en) * | 2020-07-01 | 2020-09-15 | 广东电网有限责任公司 | High-efficient controllable formula heat abstractor of switch board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204462980U (en) | A kind of mainframe computer cooling cabinet of external dust guard | |
| CN204887858U (en) | Temperature -uniforming plate with heat pipe | |
| CN105188313A (en) | Temperature equalizing plate with heat-conducting pipe | |
| CN203350795U (en) | Radiator and host comprising same | |
| CN208848885U (en) | A kind of New IGBT module copper soleplate structure | |
| CN203859111U (en) | Conflux heat pipe radiator | |
| CN103615921A (en) | Novel radiator | |
| CN101707192A (en) | Heat-radiation packaging structure and method for packaging high-power component pipe core thereof | |
| CN204350534U (en) | A kind of large power, electrically heat dissipation device | |
| CN203746004U (en) | Radiating device for computer | |
| CN203054134U (en) | Electronic component aging test module | |
| CN207369502U (en) | A kind of industrial recirculated water cooling electrical cabinet | |
| CN201064074Y (en) | Heat pipe radiator | |
| CN203241898U (en) | Immersion heat dissipation computer case | |
| CN203687710U (en) | Novel heat radiator | |
| CN201837956U (en) | External radiator of notebook computer and portable small heat emitting machine | |
| CN101616574A (en) | A kind of power amplification module heat pipe cooling radiator of broadcast television emitter | |
| CN211183776U (en) | High-temperature isolation power supply module | |
| CN104149308B (en) | A kind of barrel configuration of the single screw rod/double screw extruder based on phase-change heat transfer | |
| CN110355917A (en) | A kind of mold heating device | |
| CN215188077U (en) | Temperature-uniforming plate with heat conduction pipe | |
| CN207685123U (en) | Heating mechanism for glass heat bender | |
| CN204598566U (en) | A kind of heat radiation device of thermal conduction tube | |
| CN108801009A (en) | A kind of heat-conducting copper pipe and its preparation process | |
| CN202183054U (en) | Heat radiation temperature control device for high power transistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151223 |
|
| RJ01 | Rejection of invention patent application after publication |