US20100163212A1 - Flat loop Heat pipe - Google Patents
Flat loop Heat pipe Download PDFInfo
- Publication number
- US20100163212A1 US20100163212A1 US12/461,787 US46178709A US2010163212A1 US 20100163212 A1 US20100163212 A1 US 20100163212A1 US 46178709 A US46178709 A US 46178709A US 2010163212 A1 US2010163212 A1 US 2010163212A1
- Authority
- US
- United States
- Prior art keywords
- lhp
- flat
- capillary core
- container
- airtight connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
Definitions
- the present invention relates generally to heat-dissipating technology, and more particularly, to a flat loop heat pipe.
- a conventional loop heat pipe is an effective heat-dissipating device and generally composed of an evaporator, a vapor line, a condenser, and a liquid line, all of which are connected and communicated with one another to become a loop containing a working fluid.
- the evaporator includes a capillary structure connected with a heat source.
- a compensation chamber is provided between the liquid line and the capillary structure.
- the vapors flow through a pipeline from the evaporator toward condenser chamber and then give out the heat at the condenser to be condensed and converted into liquid, and then the liquid drive into the evaporator to complete a cycle.
- the working fluid repeatedly adsorb heat to evaporate and give out heat to condense for thermal dissipation.
- the capillary structure in the evaporator of the conventional LHP is generally made of sintered powders.
- the sintered powders are solid to have greater flow resistance, such that it is difficult to activate the cycle of the thermal dissipation when the heat source is low-watt.
- the evaporation rate of the working fluid in the evaporator is larger than the reflux rate of the liquid line, it is difficult to suck the working fluid from the compensation chamber to the evaporator, such that the working fluid in the evaporator is subject to dry-out to weaken the heat-dissipating performance of the LHP.
- the primary objective of the present invention is to provide a flat LHP, which can prevent circulation of thermal dissipation from difficult activation.
- the secondary objective of the present invention is to provide a flat LHP, which can enhance the heat-dissipating performance.
- the flat LHP composed of a container, a first capillary core, a second capillary core, a circulatory pipeline, and a working fluid.
- the container includes a case, a cover, and a chamber formed therein between the case and the cover.
- the case has two openings, one of which is a vapor outlet and the other is a liquid inlet.
- the first capillary core is sleeve-shaped and mounted below the chamber, having a plurality of pores disposed thereon and an opening connected with the vapor outlet in airtight in such a way that an evaporation room is formed.
- the second capillary core is also sleeve-shaped and mounted above the chamber, having a plurality of pores disposed thereon, a lower part stopped against the first capillary core, and an opening stopped against the liquid inlet in such a way that a compensation room is formed.
- the circulatory pipeline includes a vapor line, a condensation line, a liquid reflux line, and an injection port.
- the vapor line has one end connected with the vapor outlet in airtight.
- the condensation line has one end connected with the vapor line in airtight.
- the liquid reflux line has two ends, one of which is connected with the condensation line in airtight and the other end is connected with the liquid inlet in airtight.
- the injection port is located at the vapor line or the liquid reflux line. The working fluid is infused into the circulatory pipeline to become a medium of heat absorption and dissipation.
- vapors generated from the working fluid under a heat source of relatively low wattage can still travel to the evaporation room, such that the flow resistance of the vapors is too little to cause overgreat pressure partially inside the evaporation room and to make it difficult for activating the circulation of thermal dissipation.
- the second capillary core is stopped against the first capillary core without contact with the heat source, such that no evaporation happens and then the second capillary core keeps absorbing the working fluid located in the compensation room to reinforce supplement of the working fluid required by the first capillary core. In this way, it can prevent the evaporation room from dry-out to further enhance the heat-dissipating performance of the flat LHP.
- FIG. 1 is a partially sectional view of a preferred embodiment of the present invention.
- FIG. 2 is an exploded view of the preferred embodiment of the present invention.
- FIG. 3 is a perspective view of a part of the preferred embodiment of the present invention.
- FIG. 4 is another perspective view of a part of the preferred embodiment of the present invention.
- a flat LHP 1 constructed according to a preferred embodiment of the present invention is composed of a container 20 , a first capillary core 30 , a second capillary core 40 , a first support member 50 , a second support member 60 , a circulatory pipeline 70 , and a working fluid 80 .
- the container 20 includes a case 21 and a cover 22 .
- a chamber 23 is formed inside the container 20 and between the case 21 and the cover 22 .
- the case 21 has two openings, which are a vapor outlet 211 and a liquid inlet 212 respectively.
- the distance between a center of the vapor outlet 211 and a bottom side of the base 21 is smaller than the distance between a center of the liquid inlet 212 and the bottom side of the case 21 .
- the vapor outlet 211 and the liquid inlet 212 are mounted to a left side and a right side of the base 21 .
- Each of the first and second capillary cores 30 and 40 is structurally capillary and thin sleeve-shaped, having a close end 31 ( 41 ) at one end thereof, an open end 32 ( 42 ) at the other end thereof, and a plurality of pores disposed thereon.
- Each of the two capillary cores 30 and 40 can be made of a porous material, which can be sintered powers, a fine groove, a net, a fiber, or a composition of those materials.
- each of the two capillary cores 30 and 40 is a metallic thin net having above 100 meshes.
- Each of the first and second support members 50 and 60 is a sleeve-shaped metallic thin net having less than 20 meshes, a close end 51 ( 61 ), an open end 52 ( 62 ), and a plurality of pores disposed thereon.
- the first capillary core 30 is sleeved onto the first support member 50
- the second capillary core 40 is sleeved onto the second support member 60 . In this way, the first and second capillary cores 30 and 40 can be well supported by the first and second support members 50 and 60 respectively.
- the first capillary core 30 is sleeved into the first support member 50 by that the close end 31 is stopped against the close end 51 , thus forming an evaporation module 100 .
- the evaporation module 100 is mounted to a bottom side of the chamber 23 to enable the open ends 32 and 52 to face and be connected with the vapor outlet 211 in airtight in such a way that an evaporation room 33 is formed inside the first capillary core 30 .
- the second capillary core 40 is sleeved into the second support member 60 by that the close end 41 is stopped against the close end 61 , thus forming a compensation module 200 .
- the compensation module 200 is mounted to a top side of the chamber 23 to enable the open ends 42 and 62 to face and be connected with the liquid inlet 212 in airtight in such a way that a compensation room 43 is formed inside the second capillary core 40 .
- the sum of the height of the evaporation module 100 and of the compensation module 200 is larger than the height of the chamber 23 , such that the evaporation and compensation modules 100 and 200 squeeze each other.
- the contact area between a bottom side of the evaporation module 100 and an internal bottom side of the container 20 and between a top side of the evaporation module 100 and a bottom side of the compensation module 200 is relatively larger; the contact area between a bottom side of the compensation module 200 and the top side of the evaporation module 100 and between a top side of the compensation module 200 and an internal top side of the container 20 is relatively larger.
- the circulatory pipeline 70 includes a vapor line 71 , a condensation line 72 , a liquid reflux line 73 , and an injection port 74 .
- the vapor line 71 has one end connected with the vapor outlet 211 in airtight for guiding flowage of vapors.
- the condensation line has one end connected with the vapor line 71 in airtight.
- a heat sink 75 can be additionally mounted to an external periphery of the condensation line 72 for reinforcing thermal dissipation and condensation of the condensation line 72 .
- the heat sink 75 can be fins, a cooling fan, or the like. In this embodiment, the heat sink is fins.
- the liquid reflux line 73 has two ends, one of which is connected with the other end of the condensation line 72 in airtight and the other of which is connected with the liquid inlet 212 in airtight.
- the injection port 74 is located at the vapor line 71 or the liquid reflux line 73 for injecting the working fluid 80 and vacuating and sealing the flat LHP 1 therethrough.
- the working fluid 80 which can be water, methanol, ammonia, or Freon, is injected through the injection port 74 into the flat LHP 1 .
- the flat LHP 1 can be applied to a central processing unit (CPU), a light emitting diode (LED), or another euthermic element.
- CPU central processing unit
- LED light emitting diode
- FIG. 1 when the bottom side of the case 21 is in contact with a heat source (not shown), like a CPU or an LED, the heat source transmits the heat to the container 20 and the evaporation module 100 .
- the working fluid 80 existing in the first capillary core 30 absorbs the heat from the heat source. When the heat absorbed by the working fluid 80 is greater than its latent heat, the working fluid 80 proceeds with phase change to transform itself into the vapors from liquid and then to fill the evaporation room 33 .
- the vapors flow into through the vapor outlet 211 into the vapor line 71 from the evaporation room 33 and then flow along the vapor line 71 into the condensation line 72 .
- the heat in the vapors is dissipated for heat exchange with outside and the efficiency of such thermal dissipation is enhanced by the heat sink 75 .
- the working fluid 80 proceeds with another phase change to transform itself into liquid from the vapors.
- the working fluid 80 transformed into liquid is pushed by the vapors and then flow to the liquid reflux line 73 and finally back to the compensation room 43 .
- the working fluid 80 returns to the first capillary core 30 by means of the capillary action of the second capillary core 40 for again absorbing the heat of the heat source. In this way, a working cycle is formed.
- the first support member 50 can upheave the first capillary core 30 to form the evaporation room 33 , such that the flow resistance of the vapors can be reduced and even when the heat source is low-watt, the flowage of the vapors can still cause a circulatory thermal dissipation without any difficulty.
- the second capillary core 40 keeps absorbing the working fluid 80 and then transmit the same to the first capillary core 30 to prevent the first capillary core 40 from drought.
- the evaporation module 100 is formed of the first capillary core 30 and the first support member 50 ; however, if the first capillary core 30 is rigid enough, it will be not necessary to mount the first support member 50 into the first capillary core 30 .
- the compensation module 200 is formed of the second capillary core 40 and the second support member 60 ; however, if the second capillary core 40 is rigid enough, it will be not necessary to mount the second support member 60 into the second capillary core 40 .
- the sum of the height of the first and second capillary cores 30 and 40 is preferably larger than that of the chamber 23 in such a way that the first and second capillary cores 30 and 40 can squeeze each other to enable the larger contact area therebetween.
- the present invention is to primarily enable the hollow compensation and evaporation rooms 43 and 33 to be spaced from each other by a capillary structure, such that only one sleeve-shaped capillary core mounted to the bottom side of the container and connected with the vapor outlet 211 in airtight can also space the compensation and evaporation rooms 43 and 33 from each other.
- This sleeve-shaped capillary core can lessen the flow resistance of the vapors and enable the flowage of the vapors to do circulatory thermal dissipation without any difficulty while the heat source is low-watt.
Abstract
A flat loop heat pipe is formed of a first capillary core, a second capillary core, a first support member, and a second support member. The first capillary core and the first support member constitute an evaporation room. The second capillary core and the second support member constitute a compensation room. In light of this structure, it is not difficult to activate circulation of thermal dissipation under low-watt heat source and the first capillary core can avoid dry-out phenomenon.
Description
- 1. Field of the Invention
- The present invention relates generally to heat-dissipating technology, and more particularly, to a flat loop heat pipe.
- 2. Description of the Related Art
- A conventional loop heat pipe (LHP) is an effective heat-dissipating device and generally composed of an evaporator, a vapor line, a condenser, and a liquid line, all of which are connected and communicated with one another to become a loop containing a working fluid. The evaporator includes a capillary structure connected with a heat source. A compensation chamber is provided between the liquid line and the capillary structure. When the evaporator absorbs the heat from the heat source, the working fluid inside the LHP also absorbs the heat from the heat source to produce vapors. The vapors flow through a pipeline from the evaporator toward condenser chamber and then give out the heat at the condenser to be condensed and converted into liquid, and then the liquid drive into the evaporator to complete a cycle. In light of the aforesaid operation, the working fluid repeatedly adsorb heat to evaporate and give out heat to condense for thermal dissipation.
- The capillary structure in the evaporator of the conventional LHP is generally made of sintered powders. However, the sintered powders are solid to have greater flow resistance, such that it is difficult to activate the cycle of the thermal dissipation when the heat source is low-watt. In addition, when the evaporation rate of the working fluid in the evaporator is larger than the reflux rate of the liquid line, it is difficult to suck the working fluid from the compensation chamber to the evaporator, such that the working fluid in the evaporator is subject to dry-out to weaken the heat-dissipating performance of the LHP.
- The primary objective of the present invention is to provide a flat LHP, which can prevent circulation of thermal dissipation from difficult activation.
- The secondary objective of the present invention is to provide a flat LHP, which can enhance the heat-dissipating performance.
- The foregoing objectives of the present invention are attained by the flat LHP composed of a container, a first capillary core, a second capillary core, a circulatory pipeline, and a working fluid. The container includes a case, a cover, and a chamber formed therein between the case and the cover. The case has two openings, one of which is a vapor outlet and the other is a liquid inlet. The first capillary core is sleeve-shaped and mounted below the chamber, having a plurality of pores disposed thereon and an opening connected with the vapor outlet in airtight in such a way that an evaporation room is formed. The second capillary core is also sleeve-shaped and mounted above the chamber, having a plurality of pores disposed thereon, a lower part stopped against the first capillary core, and an opening stopped against the liquid inlet in such a way that a compensation room is formed. The circulatory pipeline includes a vapor line, a condensation line, a liquid reflux line, and an injection port. The vapor line has one end connected with the vapor outlet in airtight. The condensation line has one end connected with the vapor line in airtight. The liquid reflux line has two ends, one of which is connected with the condensation line in airtight and the other end is connected with the liquid inlet in airtight. The injection port is located at the vapor line or the liquid reflux line. The working fluid is infused into the circulatory pipeline to become a medium of heat absorption and dissipation.
- In light of the above structure, vapors generated from the working fluid under a heat source of relatively low wattage can still travel to the evaporation room, such that the flow resistance of the vapors is too little to cause overgreat pressure partially inside the evaporation room and to make it difficult for activating the circulation of thermal dissipation. Besides, the second capillary core is stopped against the first capillary core without contact with the heat source, such that no evaporation happens and then the second capillary core keeps absorbing the working fluid located in the compensation room to reinforce supplement of the working fluid required by the first capillary core. In this way, it can prevent the evaporation room from dry-out to further enhance the heat-dissipating performance of the flat LHP.
-
FIG. 1 is a partially sectional view of a preferred embodiment of the present invention. -
FIG. 2 is an exploded view of the preferred embodiment of the present invention. -
FIG. 3 is a perspective view of a part of the preferred embodiment of the present invention. -
FIG. 4 is another perspective view of a part of the preferred embodiment of the present invention. - Referring to
FIGS. 1-4 , aflat LHP 1 constructed according to a preferred embodiment of the present invention is composed of acontainer 20, a firstcapillary core 30, a secondcapillary core 40, afirst support member 50, asecond support member 60, acirculatory pipeline 70, and a workingfluid 80. - The
container 20 includes acase 21 and acover 22. Achamber 23 is formed inside thecontainer 20 and between thecase 21 and thecover 22. Thecase 21 has two openings, which are avapor outlet 211 and aliquid inlet 212 respectively. The distance between a center of thevapor outlet 211 and a bottom side of thebase 21 is smaller than the distance between a center of theliquid inlet 212 and the bottom side of thecase 21. Thevapor outlet 211 and theliquid inlet 212 are mounted to a left side and a right side of thebase 21. - Each of the first and second
capillary cores capillary cores capillary cores - Each of the first and
second support members capillary core 30 is sleeved onto thefirst support member 50, and the secondcapillary core 40 is sleeved onto thesecond support member 60. In this way, the first and secondcapillary cores second support members - The first
capillary core 30 is sleeved into thefirst support member 50 by that theclose end 31 is stopped against theclose end 51, thus forming anevaporation module 100. Theevaporation module 100 is mounted to a bottom side of thechamber 23 to enable theopen ends vapor outlet 211 in airtight in such a way that anevaporation room 33 is formed inside the firstcapillary core 30. The secondcapillary core 40 is sleeved into thesecond support member 60 by that theclose end 41 is stopped against theclose end 61, thus forming acompensation module 200. Thecompensation module 200 is mounted to a top side of thechamber 23 to enable theopen ends liquid inlet 212 in airtight in such a way that acompensation room 43 is formed inside the secondcapillary core 40. The sum of the height of theevaporation module 100 and of thecompensation module 200 is larger than the height of thechamber 23, such that the evaporation andcompensation modules evaporation module 100 and an internal bottom side of thecontainer 20 and between a top side of theevaporation module 100 and a bottom side of thecompensation module 200 is relatively larger; the contact area between a bottom side of thecompensation module 200 and the top side of theevaporation module 100 and between a top side of thecompensation module 200 and an internal top side of thecontainer 20 is relatively larger. - The
circulatory pipeline 70 includes avapor line 71, acondensation line 72, aliquid reflux line 73, and aninjection port 74. Thevapor line 71 has one end connected with thevapor outlet 211 in airtight for guiding flowage of vapors. The condensation line has one end connected with thevapor line 71 in airtight. Aheat sink 75 can be additionally mounted to an external periphery of thecondensation line 72 for reinforcing thermal dissipation and condensation of thecondensation line 72. Theheat sink 75 can be fins, a cooling fan, or the like. In this embodiment, the heat sink is fins. Theliquid reflux line 73 has two ends, one of which is connected with the other end of thecondensation line 72 in airtight and the other of which is connected with theliquid inlet 212 in airtight. Theinjection port 74 is located at thevapor line 71 or theliquid reflux line 73 for injecting the workingfluid 80 and vacuating and sealing theflat LHP 1 therethrough. - The working
fluid 80, which can be water, methanol, ammonia, or Freon, is injected through theinjection port 74 into theflat LHP 1. - The
flat LHP 1 can be applied to a central processing unit (CPU), a light emitting diode (LED), or another euthermic element. Referring toFIG. 1 again, when the bottom side of thecase 21 is in contact with a heat source (not shown), like a CPU or an LED, the heat source transmits the heat to thecontainer 20 and theevaporation module 100. The workingfluid 80 existing in thefirst capillary core 30 absorbs the heat from the heat source. When the heat absorbed by the workingfluid 80 is greater than its latent heat, the workingfluid 80 proceeds with phase change to transform itself into the vapors from liquid and then to fill theevaporation room 33. Next, the vapors flow into through thevapor outlet 211 into thevapor line 71 from theevaporation room 33 and then flow along thevapor line 71 into thecondensation line 72. When the vapors are located at thecondensation line 72, the heat in the vapors is dissipated for heat exchange with outside and the efficiency of such thermal dissipation is enhanced by theheat sink 75. After the heat in the vapors is fully released, the workingfluid 80 proceeds with another phase change to transform itself into liquid from the vapors. In the meantime, the workingfluid 80 transformed into liquid is pushed by the vapors and then flow to theliquid reflux line 73 and finally back to thecompensation room 43. At last, the workingfluid 80 returns to thefirst capillary core 30 by means of the capillary action of thesecond capillary core 40 for again absorbing the heat of the heat source. In this way, a working cycle is formed. - During the above working cycle, the
first support member 50 can upheave thefirst capillary core 30 to form theevaporation room 33, such that the flow resistance of the vapors can be reduced and even when the heat source is low-watt, the flowage of the vapors can still cause a circulatory thermal dissipation without any difficulty. Besides, thesecond capillary core 40 keeps absorbing the workingfluid 80 and then transmit the same to thefirst capillary core 30 to prevent thefirst capillary core 40 from drought. - It is to be noted that the
evaporation module 100 is formed of thefirst capillary core 30 and thefirst support member 50; however, if thefirst capillary core 30 is rigid enough, it will be not necessary to mount thefirst support member 50 into thefirst capillary core 30. Likewise, thecompensation module 200 is formed of thesecond capillary core 40 and thesecond support member 60; however, if thesecond capillary core 40 is rigid enough, it will be not necessary to mount thesecond support member 60 into thesecond capillary core 40. The sum of the height of the first and secondcapillary cores chamber 23 in such a way that the first and secondcapillary cores - In addition, the present invention is to primarily enable the hollow compensation and
evaporation rooms vapor outlet 211 in airtight can also space the compensation andevaporation rooms - Although the present invention has been described with respect to a specific preferred embodiment thereof, it is no way limited to the details of the illustrated structures but changes and modifications may be made within the scope of the appended claims.
Claims (14)
1. A flat LHP comprising:
a container having a case, a cover, and a chamber formed therein between the case and the cover, the chamber having two opening, one of which is a vapor outlet and the other is a liquid inlet, the distance between a center of the vapor outlet and a bottom side of the case being smaller than the distance between a center of the liquid inlet and the bottom side of the case, the cover being in airtight connection with the case;
at least one sleeve-shaped capillary core having a plurality of pores and located at a bottom side of the container and in airtight connection with the vapor outlet;
a circulatory pipeline having a vapor line, a condensation line, and a liquid reflux line, the vapor line connected with the vapor outlet in airtight for guiding flowage of vapors, the condensation line having an end in airtight connection with the vapor line, the liquid reflux line having two ends, one of which is in airtight connection with the other end of the condensation line and the other of which is in airtight connection with the liquid inlet; and
a working fluid infused into the circulatory pipeline to become a medium of heat absorption and release.
2. The flat LHP as defined in claim 1 , wherein the at least one capillary core comprises a close end and an open end, the open end being in airtight connection with the vapor outlet.
3. The flat LHP as defined in claim 2 further comprising at least one sleeve-shaped support member, wherein the at least one support member has a close end, an open end, and a plurality of pores, the at least one support member being sleeved into the at least one capillary core by their two close ends stopped against each other to become an evaporation module.
4. The flat LHP as defined in claim 1 , wherein the at least one capillary core is two in number, one of which is a first capillary core and the other is a second capillary core, the first capillary core being located at a bottom side of the container and in airtight connection with the vapor outlet, the second capillary core being located at a top side of the container and in airtight connection with the liquid inlet.
5. The flat LHP as defined in claim 4 further comprising two sleeve-shaped support members, one of which is a first support member and the other is a second support member, wherein each of the support members has a close end, an open end, and a plurality of pores disposed thereon, the first support member being sleeved into the first capillary core by that their close ends are stopped against each other in such a way that an evaporation module is formed, the second support member being sleeved into the second capillary core by that their close ends are stopped against each other in such a way that a compensation module is formed.
6. The flat LHP as defined in claim 4 , wherein the sum of height of the first and second capillary cores is larger than that of the container.
7. The flat LHP as defined in claim 5 , wherein the sum of the height of the evaporation and compensation modules is larger than that of the container.
8. The flat LHP as defined in claim 1 , wherein the condensation line comprises a heat sink mounted to an external periphery thereof.
9. The flat LHP as defined in claim 1 further comprising an injection port, which is formed between the evaporation line and the liquid reflux line.
10. The flat LHP as defined in claim 1 , wherein the vapor outlet and the liquid inlet are located at a left side and a right side of the container respectively.
11. The flat LHP as defined in claim 4 , wherein each of the first and second capillary cores is a metallic net having at least 100 meshes.
12. The flat LHP as defined in claim 5 , wherein each of the first and second support members is a metallic net having at least 20 meshes.
13. A flat LHP comprising:
a container having a chamber defining two openings, one of which is a vapor outlet and the other is a liquid inlet;
a sleeve-shaped evaporation module having a plurality of pores and an evaporation room formed therein, the evaporation room being located at a bottom side of the container and in airtight connection with the vapor outlet;
a circulatory pipeline having an end in airtight connection with the vapor outlet and the other end in airtight connection with the liquid inlet; and
a working fluid infused into the circulatory pipeline to become a medium of heat absorption and release.
14. The flat LHP as defined in claim 13 further comprising a sleeve-shaped compensation module, wherein the compensation module has a plurality of pores disposed thereon and a compensation room formed therein, the compensation room being located at a top side of the container and in airtight connection with the liquid inlet.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97151147 | 2008-12-26 | ||
TW097151147A TW201024648A (en) | 2008-12-26 | 2008-12-26 | Flat loop heat pipe |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100163212A1 true US20100163212A1 (en) | 2010-07-01 |
Family
ID=42283470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/461,787 Abandoned US20100163212A1 (en) | 2008-12-26 | 2009-08-25 | Flat loop Heat pipe |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100163212A1 (en) |
TW (1) | TW201024648A (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110073284A1 (en) * | 2009-09-25 | 2011-03-31 | Yoo Jung Hyun | Evaporator for loop heat pipe system |
JP2012037097A (en) * | 2010-08-04 | 2012-02-23 | Hosei Nagano | Loop heat pipe, and electronic apparatus |
JP2012132613A (en) * | 2010-12-21 | 2012-07-12 | Fujitsu Ltd | Loop type heat pipe and information processing apparatus |
US20120247736A1 (en) * | 2011-03-29 | 2012-10-04 | Asia Vital Components (Shen Zhen) Co., Ltd. | Loop heat pipe structure |
US20130206369A1 (en) * | 2012-02-13 | 2013-08-15 | Wei-I Lin | Heat dissipating device |
US20130312939A1 (en) * | 2012-05-14 | 2013-11-28 | Fujitsu Limited | Cooling device using loop type heat pipe |
US20140014304A1 (en) * | 2012-01-19 | 2014-01-16 | Acmecools Tech. Ltd. | Method of manufacturing heat-dissipating device without injection tube and object manufactured by the method |
CN103672814A (en) * | 2013-12-16 | 2014-03-26 | 深圳市华星光电技术有限公司 | Cooling circuit pipe and backlight module adopting cooling circuit pipe |
US20150138830A1 (en) * | 2013-11-19 | 2015-05-21 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation pipe loop and backlight module using same |
US20160282547A1 (en) * | 2014-07-30 | 2016-09-29 | Shenzhen Tcl New Technology Co., Ltd | Radiator, backlight module and display module |
CN106465562A (en) * | 2015-10-23 | 2017-02-22 | 华为技术有限公司 | Heat pipe cooling system and power equipment |
US9599408B1 (en) * | 2012-03-03 | 2017-03-21 | Advanced Cooling Technologies, Inc. | Loop heat pipe evaporator including a second heat pipe |
CN112146495A (en) * | 2020-09-25 | 2020-12-29 | 奇鋐科技股份有限公司 | Gas-liquid condensing system |
EP3812684A1 (en) * | 2019-10-24 | 2021-04-28 | SAB Engineers GmbH | Planar heat transfer device and method for its manufacture |
US11371783B2 (en) * | 2017-06-23 | 2022-06-28 | Ricoh Company, Ltd. | Loop heat pipe, cooling device, and electronic device |
WO2023029429A1 (en) * | 2021-08-30 | 2023-03-09 | 中兴通讯股份有限公司 | Heat transfer plate |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016051569A1 (en) * | 2014-10-02 | 2016-04-07 | 富士通株式会社 | Evaporator, cooling device, and electronic device |
WO2023156976A1 (en) * | 2022-02-18 | 2023-08-24 | Thales Alenia Space Italia S.P.A. Con Unico Socio | Modular evaporator assembly for a loop heat pipe thermal control system |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060137857A1 (en) * | 2004-12-28 | 2006-06-29 | Jia-Hao Li | Support structure of heat-pipe multi-layer wick structure |
US20060201655A1 (en) * | 2005-03-11 | 2006-09-14 | Chu-Wan Hong | Heat pipe suitable for application in electronic device with limited mounting space |
US20080078530A1 (en) * | 2006-10-02 | 2008-04-03 | Foxconn Technology Co., Ltd. | Loop heat pipe with flexible artery mesh |
US20080128898A1 (en) * | 2005-09-16 | 2008-06-05 | Progressive Cooling Solutions, Inc. | Integrated thermal systems |
US20080164010A1 (en) * | 2007-01-09 | 2008-07-10 | Shung-Wen Kang | Loop heat pipe with flat evaportor |
-
2008
- 2008-12-26 TW TW097151147A patent/TW201024648A/en not_active IP Right Cessation
-
2009
- 2009-08-25 US US12/461,787 patent/US20100163212A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060137857A1 (en) * | 2004-12-28 | 2006-06-29 | Jia-Hao Li | Support structure of heat-pipe multi-layer wick structure |
US20060201655A1 (en) * | 2005-03-11 | 2006-09-14 | Chu-Wan Hong | Heat pipe suitable for application in electronic device with limited mounting space |
US20080128898A1 (en) * | 2005-09-16 | 2008-06-05 | Progressive Cooling Solutions, Inc. | Integrated thermal systems |
US20080078530A1 (en) * | 2006-10-02 | 2008-04-03 | Foxconn Technology Co., Ltd. | Loop heat pipe with flexible artery mesh |
US20080164010A1 (en) * | 2007-01-09 | 2008-07-10 | Shung-Wen Kang | Loop heat pipe with flat evaportor |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110073284A1 (en) * | 2009-09-25 | 2011-03-31 | Yoo Jung Hyun | Evaporator for loop heat pipe system |
JP2012037097A (en) * | 2010-08-04 | 2012-02-23 | Hosei Nagano | Loop heat pipe, and electronic apparatus |
JP2012132613A (en) * | 2010-12-21 | 2012-07-12 | Fujitsu Ltd | Loop type heat pipe and information processing apparatus |
US20120247736A1 (en) * | 2011-03-29 | 2012-10-04 | Asia Vital Components (Shen Zhen) Co., Ltd. | Loop heat pipe structure |
US9504185B2 (en) * | 2011-03-29 | 2016-11-22 | Asia Vital Components (Shen Zhen) Co., Ltd. | Dual chamber loop heat pipe structure with multiple wick layers |
US20140014304A1 (en) * | 2012-01-19 | 2014-01-16 | Acmecools Tech. Ltd. | Method of manufacturing heat-dissipating device without injection tube and object manufactured by the method |
US20130206369A1 (en) * | 2012-02-13 | 2013-08-15 | Wei-I Lin | Heat dissipating device |
US9599408B1 (en) * | 2012-03-03 | 2017-03-21 | Advanced Cooling Technologies, Inc. | Loop heat pipe evaporator including a second heat pipe |
US20130312939A1 (en) * | 2012-05-14 | 2013-11-28 | Fujitsu Limited | Cooling device using loop type heat pipe |
US9464849B2 (en) * | 2012-05-14 | 2016-10-11 | Fujitsu Limited | Cooling device using loop type heat pipe |
TWI585354B (en) * | 2012-05-14 | 2017-06-01 | 富士通股份有限公司 | Cooling device using loop type heat pipe |
US20150138830A1 (en) * | 2013-11-19 | 2015-05-21 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation pipe loop and backlight module using same |
US9366484B2 (en) * | 2013-11-19 | 2016-06-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Heat dissipation pipe loop and backlight module using same |
CN103672814A (en) * | 2013-12-16 | 2014-03-26 | 深圳市华星光电技术有限公司 | Cooling circuit pipe and backlight module adopting cooling circuit pipe |
US20150305199A1 (en) * | 2013-12-16 | 2015-10-22 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation pipe loop and backlight module using same |
US9426928B2 (en) * | 2013-12-16 | 2016-08-23 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation pipe loop and backlight module using same |
US20160282547A1 (en) * | 2014-07-30 | 2016-09-29 | Shenzhen Tcl New Technology Co., Ltd | Radiator, backlight module and display module |
US9880347B2 (en) * | 2014-07-30 | 2018-01-30 | Shenzhen Tcl New Technology Co., Ltd | Radiator, backlight module and display module |
CN106465562A (en) * | 2015-10-23 | 2017-02-22 | 华为技术有限公司 | Heat pipe cooling system and power equipment |
US20170196124A1 (en) * | 2015-10-23 | 2017-07-06 | Huawei Technologies Co., Ltd. | Heat-Pipe Heat Dissipation System and Power Device |
US10470339B2 (en) * | 2015-10-23 | 2019-11-05 | Huawei Technologies Co., Ltd. | Heat-pipe heat dissipation system and power device |
US11371783B2 (en) * | 2017-06-23 | 2022-06-28 | Ricoh Company, Ltd. | Loop heat pipe, cooling device, and electronic device |
EP3812684A1 (en) * | 2019-10-24 | 2021-04-28 | SAB Engineers GmbH | Planar heat transfer device and method for its manufacture |
WO2021078957A1 (en) * | 2019-10-24 | 2021-04-29 | Sab Engineers Gmbh | Planar heat transfer apparatus and method for production thereof |
CN112146495A (en) * | 2020-09-25 | 2020-12-29 | 奇鋐科技股份有限公司 | Gas-liquid condensing system |
WO2023029429A1 (en) * | 2021-08-30 | 2023-03-09 | 中兴通讯股份有限公司 | Heat transfer plate |
Also Published As
Publication number | Publication date |
---|---|
TW201024648A (en) | 2010-07-01 |
TWI371566B (en) | 2012-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20100163212A1 (en) | Flat loop Heat pipe | |
JP5678662B2 (en) | Boiling cooler | |
CN103629963B (en) | Multi-scale capillary core flat plate loop heat pipe type heat-dissipation device | |
US8622118B2 (en) | Loop heat pipe | |
JP4524289B2 (en) | Cooling system with bubble pump | |
US8550150B2 (en) | Loop heat pipe | |
US8100170B2 (en) | Evaporator, loop heat pipe module and heat generating apparatus | |
US20140083653A1 (en) | Vapor-Based Heat Transfer Apparatus | |
US20100155019A1 (en) | Evaporator and loop heat pipe employing it | |
CN101534627A (en) | High-effective integral spray cooling system | |
US20100243214A1 (en) | Flat plate type micro heat transport device | |
JP2009068827A (en) | Heat radiator | |
JP2017531154A (en) | Planar heat pipe with storage function | |
CN101776407A (en) | Flat-plate loop heat pipe | |
JP2007263427A (en) | Loop type heat pipe | |
US20180209745A1 (en) | Loop heat pipe structure | |
JP3156954U (en) | Support structure for flat plate heat pipe | |
US20200326130A1 (en) | Heat dissipating module with three-dimensional structure | |
US9182177B2 (en) | Heat transfer system with integrated evaporator and condenser | |
CN104613439B (en) | A kind of heat abstractor of LED lamp | |
JP2004218887A (en) | Cooling device of electronic element | |
CN202485508U (en) | Two-phase cooling fin | |
CN104613802B (en) | The evaporator and heat abstractor of a kind of loop circuit heat pipe | |
CN201569340U (en) | Flat heating pipe type heat dissipater | |
TW201041492A (en) | Heat dissipation device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |