CN116625150A - Flexible flat heat pipe, preparation method thereof and electronic equipment - Google Patents
Flexible flat heat pipe, preparation method thereof and electronic equipment Download PDFInfo
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- CN116625150A CN116625150A CN202310896747.9A CN202310896747A CN116625150A CN 116625150 A CN116625150 A CN 116625150A CN 202310896747 A CN202310896747 A CN 202310896747A CN 116625150 A CN116625150 A CN 116625150A
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- Prior art keywords
- heat pipe
- flexible flat
- flat heat
- corrugated structure
- liquid
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 91
- 238000007789 sealing Methods 0.000 claims abstract description 43
- 238000003466 welding Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 230000004913 activation Effects 0.000 claims description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000002861 polymer material Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 229910052786 argon Inorganic materials 0.000 claims description 8
- 239000002585 base Substances 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000010301 surface-oxidation reaction Methods 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 20
- 238000005452 bending Methods 0.000 description 28
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a flexible flat heat pipe, a preparation method thereof and electronic equipment, and relates to the technical field of electronic component heat dissipation; the sealing chamber is surrounded by the shell; the housing includes at least one section of corrugated structure; the liquid suction core and the liquid working medium are arranged in the sealed cavity. The application solves the technical problem of poor application flexibility of the radiating flat plate on the electronic equipment in the prior art.
Description
Technical Field
The application relates to the technical field of intelligent electronic equipment heat dissipation, in particular to a flexible flat heat pipe, a preparation method thereof and electronic equipment.
Background
Along with development of technology, various electronic components such as sound, light and electricity are integrated in electronic equipment, along with reduction of product volume and integration of functions, thermal power consumption is also increased rapidly, if a reasonable heat dissipation mode is not adopted for dissipating heat of an electronic chip, the temperature of the electronic chip is increased, the working stability, the reliability and the service life of the electronic chip are greatly reduced, and even thermal deformation and damage of the electronic components are caused, so that the heat dissipation requirement for the electronic equipment is increased. And often can have the structural part of buckling in the current electronic equipment, for example fold the part of folding on the cell-phone, the lid of earphone box and the junction between the box body, AR (Augmented Reality ) or VR (Virtual Reality) glasses go up the mirror leg and the junction of picture frame and have the part etc. of buckling demand on other intelligent wearing equipment, however, the heat radiation structure of current plane form has certain rigidity, can't buckle, so can't be applicable to these electronic equipment that have structural part of buckling, perhaps only need satisfy the heat radiation demand of whole electronic equipment through setting up a plurality of heat radiation structures, the flexibility is relatively poor, the processing complexity is higher.
Disclosure of Invention
The application mainly aims to provide a flexible flat heat pipe, a preparation method thereof and electronic equipment, and aims to solve the technical problem of poor application flexibility of a heat dissipation flat plate on the electronic equipment in the prior art.
In order to achieve the above object, the present application provides a flexible flat heat pipe, which includes a housing, a sealed chamber, a wick, and a liquid working medium;
the sealing chamber is surrounded by the shell;
the housing includes at least one section of corrugated structure;
the liquid suction core and the liquid working medium are arranged in the sealed cavity.
Optionally, the shell comprises at least one copper layer and at least one polymer material layer.
Optionally, the thickness of the copper layer is 0.1-30 μm;
and/or the thickness of the polymer material layer is 0.1-30 mu m.
Optionally, the wick is a copper mesh or a copper wire.
Optionally, the wick has a pore size of 300-400 mesh.
Optionally, the liquid working medium is deionized water, absolute ethyl alcohol or fluorocarbon.
Optionally, the corrugated structure is an arc corrugated structure, a cone corrugated structure or a fin stacked corrugated structure.
The application also provides a preparation method of the flexible flat heat pipe, which is applied to the preparation of the flexible flat heat pipe, and comprises the following steps: providing two shell plates and a liquid suction core, wherein the shell plates comprise at least one section of corrugated structure;
placing the liquid suction core between two shell plates, forming a sealing chamber between the two shell plates in a hot-press welding mode, enabling the liquid suction core to be positioned in the sealing chamber, and reserving a liquid injection port;
and injecting liquid working medium into the sealed cavity through the liquid injection port, vacuumizing the sealed cavity through the liquid injection port, and sealing the liquid injection port to obtain the flexible flat heat pipe.
Optionally, before the step of providing the two shell plates and the wick, the method further comprises:
providing a wick substrate;
and (3) performing alkali-assisted surface oxidation hydrophilization treatment on the liquid absorption core substrate to obtain the liquid absorption core.
Optionally, before the step of providing the two shell plates and the wick, the method further comprises:
providing a sheet material base;
at least one corrugated structure is processed on the sheet material base by a stamping or expanding process.
Optionally, the step of forming a sealed chamber between the two casing sheets by thermocompression bonding includes:
carrying out plasma surface activation treatment on the areas to be welded on the two shell plates;
and welding the areas to be welded of the two shell plates in a hot-press welding mode so as to form a sealing cavity between the two shell plates.
Optionally, the inert gas adopted in the plasma surface activation treatment comprises at least one of argon and nitrogen, the activation power is 300-500W, and the activation time is 3-5 min.
Optionally, the welding temperature of the hot press welding is 200-250 ℃, the welding pressure is 40-120 mPa, and the welding time is 30-90 min.
Optionally, vacuum is drawn or a shielding gas is introduced during the hot press welding process, wherein the shielding gas comprises at least one of argon and nitrogen.
The application also provides electronic equipment comprising at least one bendable structure part and the flexible flat heat pipe, wherein the corrugated structure corresponds to the position of the bendable structure part.
The application provides a flexible flat heat pipe, a preparation method thereof and electronic equipment, wherein the flexible flat heat pipe comprises a shell, a sealed cavity, a liquid suction core and a liquid working medium; the sealing chamber is surrounded by the shell; the housing includes at least one section of corrugated structure; the liquid suction core and the liquid working medium are arranged in the sealed cavity. The application realizes the purpose of heat dissipation through the liquid suction core and the liquid working medium which are arranged in the sealed cavity, the corrugated structure has certain flexibility, so the flat heat pipe has certain flexibility and bending property by arranging at least one section of corrugated structure so as to adapt to the part with bending requirement on the electronic equipment, the existing planar heat dissipation structure is overcome to have certain rigidity and can not be bent, the flat heat pipe can not be suitable for the electronic equipment with the bending structure part, or the heat dissipation requirement of the whole electronic equipment can be met by arranging a plurality of heat dissipation structures, the flexibility is poor, the technical defect of higher processing complexity is overcome, the flexibility of the flat heat pipe can be effectively improved by improving the structure, and the flat heat pipe can be flexibly suitable for the electronic equipment with the bending structure part only by adjusting the position of the bending structure part, and the application flexibility of the flat heat pipe is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic diagram of a flexible flat heat pipe according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a corrugated structure according to an embodiment of the present application;
FIG. 3 is a schematic view of a structure of a housing according to an embodiment of the present application;
FIG. 4 is a schematic diagram of the profile of the corrugated structure according to an embodiment of the present application;
FIG. 5 is a flow chart of a method for manufacturing a flexible flat heat pipe according to an embodiment of the application.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, the following description of the embodiments accompanied with the accompanying drawings will be given in detail. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In one embodiment of the flexible flat heat pipe, referring to fig. 1, the flexible flat heat pipe includes a housing 10, a sealed chamber 30, a wick 20, and a liquid working medium;
the sealed chamber 30 is enclosed by the housing 10;
the housing 10 comprises at least one section of corrugated structure;
the wick 20 and the liquid working medium are disposed in the sealed chamber 30.
In this embodiment, the flat heat pipe refers to a heat pipe having a flat shape, which is beneficial to heat diffusion of the concentrated heat source. The flat heat pipe generally comprises an evaporation end and a condensation end, the liquid working medium is vaporized at the evaporation end, carries heat and is rapidly conducted to the condensation end, the vaporized liquid working medium is condensed at the condensation end, releases heat, and returns to the evaporation end under the capillary suction effect through the liquid suction core 20, so that the circulation work is realized, and the heat dissipation is realized. The flexible flat heat pipe refers to a flat heat pipe having flexibility, that is, the flexible flat heat pipe may be bent and deformed to some extent without being damaged.
The flexible flat heat pipe comprises a shell 10, a sealed cavity 30, a liquid suction core 20 and a liquid working medium. Wherein, the shell 10 is made of a material which has thermal conductivity and does not react with water, and the thermal conductive material comprises copper, aluminum, iron, steel, plastic, rubber, silica gel and the like; the housing 10 includes at least one section of corrugated structure, the corrugated structure may be an arc corrugated structure, a conical corrugated structure, a fin-shaped stacked corrugated structure, or an irregular corrugated structure, etc., the corrugated structure may be formed by bending the housing 10 on any side of the flexible flat heat pipe, referring to fig. 2, the corrugated structure 103 may also be formed by bending the housings 10 on both sides of the flexible flat heat pipe at corresponding positions, where the corresponding positions are positions where bending deformation may occur simultaneously, the corrugated structure formed by bending the flat plates on both sides of the flexible flat heat pipe at the corresponding positions has better flexibility in bending deformation, and the corrugated structure may implement flexible bending, so that the flexible flat heat pipe is not easy to be damaged after bending deformation occurs, and thus the heat dissipation of the flat heat pipe on the electronic device can be implemented by arranging the corrugated structure at the position corresponding to the bendable structure portion of the electronic device, such as a rotating shaft. The sealing chamber 30 is surrounded by the housing 10, and in one embodiment, the housing 10 may be formed by welding two housing 10 plates, that is, welding the peripheries of the two housing 10 plates, so that the sealing chamber 30 is formed in the middle; the housing 10 may be first processed into an initial housing 10 with a reserved sealing portion, and then the sealing portion is welded after the wick 20 is placed into the initial housing to form the sealing chamber 30, and the specific sealing manner may be determined according to the actual situation, which is not limited in this embodiment. The wick 20 is a porous capillary structure material, and is disposed in the sealed chamber 30, and is configured to provide a capillary driving force to promote the liquid working medium to flow back from the condensation end to the evaporation end, so as to implement a circulation process of heat transfer, and specific materials and structures of the wick 20 may be determined according to actual needs, which is not limited in this embodiment, in an implementation manner, the wick 20 is a metal braid, which has better flexibility, and can better meet the flexibility requirement of the flexible flat heat pipe. The liquid working medium is a medium substance for realizing heat and work conversion, and is filled in the sealed chamber 30, and comprises deionized water, absolute ethyl alcohol, fluorocarbon, acetone and the like.
Optionally, the shell comprises at least one copper layer and at least one polymer material layer.
In this embodiment, the shell is formed by laminating at least one copper layer and at least one polymer material, where the copper layer has good heat conduction performance, fast heat conduction, good ductility, easy processing and forming, and can better meet the flexibility requirement of the flexible flat heat pipe; the material of the high polymer material layer can be at least one of high polymer materials such as plastics, rubber, fibers and the like, and the high polymer material has better flexibility and can better meet the flexibility requirement of the flexible flat heat pipe.
In one embodiment, the sealing connection surface on the housing is located on the copper layer. When the shell is processed, after the liquid suction core is needed to be put in, sealing is carried out to form a sealing cavity, and then liquid working medium is injected to seal the liquid suction core and the liquid working medium in the sealing cavity, so that the liquid suction core and the liquid working medium can circulate in the sealing cavity to complete the heat transfer process. Compared with a high polymer material, the welding between the copper layers has lower air permeability, and the sealing purpose is realized, so that the sealing connection surface on the shell is arranged on the copper layers. Referring to fig. 3, two parts to be press-fit connected on a case are shown in fig. 3, the case part located above includes two copper layers 101 and one polymer material layer 102, the case part located below includes one copper layer 101 and one polymer layer 102, and the two copper layers 101 between the two parts are press-fit welded to each other during press-fit.
Optionally, the thickness of the copper layer is 0.1-30 μm;
and/or the thickness of the polymer material layer is 0.1-30 mu m.
In this embodiment, the thinner the overall thickness of the housing, the better the flexibility of the flexible flat heat pipe, and the lighter the overall mass, which can satisfy not only the flexibility requirement of the flexible flat heat pipe, but also the light-weight requirement of the electronic device, so the thickness of the copper layer is determined to be 0.1-30 μm, for example, 0.1 μm, 2 μm, 5 μm, 10 μm, 20 μm, 30 μm, and the like, and the thickness of the polymer material layer is determined to be 0.1-30 μm, for example, 0.1 μm, 2 μm, 5 μm, 10 μm, 20 μm, 30 μm, and the like.
Optionally, the wick is a copper mesh or a copper wire.
In this embodiment, copper has better heat conductivility, and heat conduction is fast, and the pliability is better, and ductility is strong, and the wick of preparation even set up in the ripple structure, also can buckle along with the buckling of ripple structure, can adapt to better the flexibility demand of flexible dull and stereotyped heat pipe.
Optionally, the wick has a pore size of 300-400 mesh.
In this embodiment, a suitable pore size is advantageous in providing a greater capillary driving force, and thus the pore size of the wick is determined to be 300-400 mesh, e.g., 300 mesh, 350 mesh, 400 mesh, etc.
Optionally, the liquid working medium is deionized water, absolute ethyl alcohol or fluorocarbon.
Optionally, the corrugated structure is an arc corrugated structure, a cone corrugated structure or a fin stacked corrugated structure.
In this embodiment, referring to fig. 4, the corrugated structure may be an arc-shaped corrugated structure 11, a cone-shaped corrugated structure 12, or a fin-shaped stacked corrugated structure 13.
In this embodiment, the flexible flat heat pipe includes a housing, a sealed chamber, a wick, and a liquid working medium; the sealing chamber is surrounded by the shell; the housing includes at least one section of corrugated structure; the liquid suction core and the liquid working medium are arranged in the sealed cavity. The application realizes the purpose of heat dissipation through the liquid suction core and the liquid working medium which are arranged in the sealed cavity, the corrugated structure has certain flexibility, so the flat heat pipe has certain flexibility and bending property by arranging at least one section of corrugated structure so as to adapt to the part with bending requirement on the electronic equipment, the existing planar heat dissipation structure is overcome to have certain rigidity and can not be bent, the flat heat pipe can not be suitable for the electronic equipment with the bending structure part, or the heat dissipation requirement of the whole electronic equipment can be met by arranging a plurality of heat dissipation structures, the flexibility is poor, the technical defect of higher processing complexity is overcome, the flexibility of the flat heat pipe can be effectively improved by improving the structure, and the flat heat pipe can be flexibly suitable for the electronic equipment with the bending structure part only by adjusting the position of the bending structure part, and the application flexibility of the flat heat pipe is improved.
Further, an embodiment of the present application further provides a method for manufacturing a flexible flat heat pipe, in an embodiment of the method for manufacturing a flexible flat heat pipe of the present application, referring to fig. 5, the method for manufacturing a flexible flat heat pipe includes:
step S10, providing two shell plates and a liquid suction core, wherein the shell plates comprise at least one section of corrugated structure;
in this embodiment, it should be noted that, the shell plate refers to a plate for manufacturing the flexible flat heat pipe shell, the whole shell plate is flat, and the edge area has a bending portion, and the bending portion is used for connecting with other shell plates, so that a sealed cavity is formed inside the flexible flat heat pipe shell after connection; the shell plate is provided with at least one section of corrugated structure, the corrugated structure can be an arc corrugated structure, a conical corrugated structure, a fin-shaped stacked corrugated structure or an irregular corrugated structure and the like, and the corrugated structure can realize flexible bending, so that the flexible flat heat pipe is not easy to damage after bending deformation, the corrugated structure can be arranged at the position corresponding to the bendable structure part of the electronic equipment, and the heat dissipation of the flat heat pipe on the electronic equipment can be realized by the bendable structure part such as a rotating shaft.
In an embodiment, the positions of the corrugated structures on the two selected shell plates are in the same region range, so that the corrugated structures on two sides of the processed flexible flat heat pipe are in corresponding positions, wherein the corresponding positions are positions where bending deformation is likely to occur simultaneously, and when the corrugated structures on two sides of the processed flexible flat heat pipe are in the corresponding positions, the flexibility of the flexible flat heat pipe is better when the flexible flat heat pipe is bent and deformed.
Illustratively, two shell sheets and at least one wick are obtained, either pre-prepared or commercially available.
Optionally, before the step of providing the two shell plates and the wick, the method further comprises:
step a10, providing a wick substrate;
and step A20, performing alkali-assisted surface oxidation hydrophilization treatment on the liquid absorption core substrate to obtain the liquid absorption core.
In this embodiment, the surface of the wick may be hydrophilized, so that the capillary performance of the wick is improved, the capillary suction force is improved, and the heat transfer rate is improved.
Illustratively, a pre-prepared or commercial wick substrate is obtained, and the wick substrate is soaked by an alkaline oxidizing solution to realize the alkaline-assisted surface oxidation hydrophilization treatment of the wick substrate, so as to obtain the wick, wherein the alkaline oxidizing solution can be configured or purchased according to actual needs, and the embodiment is not limited to this.
Optionally, before the step of providing the two shell plates and the wick, the method further comprises:
step B10, providing a plate base material;
and step B20, processing at least one section of corrugated structure on the plate base material through a stamping or expanding process.
The position, shape and specification of the corrugated structure on the flexible flat heat pipe can be determined according to the actual structure, specification and the like of the electronic equipment, the position, specification and the like of the bendable structure part in the electronic equipment, and then the plate base material is obtained, the corresponding corrugated structure is processed at the position of at least one corrugated structure preset on the plate base material through a stamping or expanding process, and thus the shell plate can better match the actual bending requirement of the electronic equipment.
Step S20, placing the liquid suction core between two shell plates, forming a sealing cavity between the two shell plates in a hot-press welding mode, enabling the liquid suction core to be positioned in the sealing cavity, and reserving a liquid injection port;
the liquid suction core is placed in a space recessed in the middle of the two shell plates, the surfaces to be welded of the two shell plates are attached together, the surfaces to be welded of the two shell plates are welded together in a hot-press welding mode, a liquid injection port is reserved on a welding line to form a sealing cavity which can be communicated with the outside only through the liquid injection port, the liquid suction core is located in the sealing cavity after welding, the specific position or structure of the liquid suction core can be determined according to actual needs, the position and the machining mode of the liquid injection port can be determined according to actual needs, the specific process condition of the hot-press welding can be determined according to actual needs, and the liquid suction core is not limited.
Optionally, the welding temperature of the hot press welding is 200-250 ℃, the welding pressure is 40-120 mPa, and the welding time is 30-90 min.
In this embodiment, since the thickness of the shell plate to be welded is small, and the material is melted at a high temperature when the shell plate includes the polymer material layer, low-temperature welding is required, the welding temperature of the hot press welding is 200-250 ℃, such as 200 ℃, 220 ℃, 250 ℃, and the like, the welding pressure is 40-120 mPa, such as 40mPa, 80mPa, 120mPa, and the like, and the welding time is 30-90 min, such as 30min, 60min, 90min, and the like.
Optionally, a shielding gas is introduced in the hot press welding process, wherein the shielding gas comprises at least one of argon and nitrogen.
In this embodiment, a shielding gas may be introduced during the hot press welding process, so as to avoid oxidation of the surface to be welded during the welding process, thereby affecting the welding effect, where the shielding gas includes at least one of argon and nitrogen.
Optionally, the step of forming a sealed chamber between the two casing sheets by thermocompression bonding includes:
step S21, plasma surface activation treatment is carried out on the areas to be welded on the two shell plates;
and S22, welding the areas to be welded of the two shell plates in a hot press welding mode so as to form a sealing cavity between the two shell plates.
In this embodiment, it should be noted that, the flexible flat heat pipe is filled with a liquid working medium, and the sealed chamber needs to be kept in vacuum, so that it is necessary to ensure complete sealing of the sealed chamber, so as to avoid leakage of the liquid working medium and failure of the flexible flat heat pipe caused by reduction of vacuum degree, and also avoid the outflow of the liquid working medium from damaging other structures inside the electronic device. Accordingly, the welding tightness and the firmness of the welding area can be improved by the plasma surface activation treatment, thereby improving the sealing performance of the sealing chamber.
The method includes the steps of determining to-be-welded areas on two shell plates in advance, performing plasma surface activation treatment on the to-be-welded areas on the two shell plates, attaching to-be-welded surfaces of the two shell plates together, and welding the to-be-welded areas of the two shell plates together in a hot-press welding mode, so that a sealing chamber is formed between the two shell plates.
Optionally, the inert gas adopted in the plasma surface activation treatment comprises at least one of argon and nitrogen, the activation power is 300-500W, and the activation time is 3-5 min.
In this embodiment, the inert gas used in the surface activation treatment includes at least one of argon and nitrogen, the activation power is 300-500W, for example 300W, 400W, 500W, etc., and the activation time is 3-5 min, for example 3min, 4min, 5min, etc.
And step S30, injecting liquid working medium into the sealed cavity through the liquid injection port, vacuumizing the sealed cavity through the liquid injection port, and sealing the liquid injection port to obtain the flexible flat heat pipe.
The liquid filling port is used for filling the prepared liquid working medium into the sealing chamber, and after the sealing chamber is vacuumized through the liquid filling port, the liquid filling port is sealed, so that the sealing chamber is in a complete sealing state, and the flexible flat heat pipe is obtained.
In this embodiment, a method for manufacturing the flexible flat heat pipe is provided, including the steps of: providing two shell plates and a liquid suction core, wherein the shell plates comprise at least one section of corrugated structure; placing the liquid suction core between two shell plates, forming a sealing chamber between the two shell plates in a hot-press welding mode, enabling the liquid suction core to be positioned in the sealing chamber, and reserving a liquid injection port; and injecting liquid working medium into the sealed cavity through the liquid injection port, and sealing the liquid injection port to obtain the flexible flat heat pipe. According to the embodiment, the purpose of heat dissipation is achieved through the liquid suction cores and the liquid working medium arranged in the sealed cavity, the corrugated structure machined on the shell plate is used for enabling the flat heat pipe to have certain flexibility and bending property so as to adapt to the part with bending requirements on the electronic equipment, the defect that the existing planar heat dissipation structure has certain rigidity and cannot be bent is overcome, and therefore the flat heat pipe cannot be suitable for the electronic equipment with the bending structure parts, or the heat dissipation requirements of the whole electronic equipment can be met by arranging a plurality of heat dissipation structures, the flexibility is poor, the technical defect of high processing complexity is overcome, the flexibility of the flat heat pipe can be effectively improved through structural improvement, the flat heat pipe can be flexibly suitable for the electronic equipment with the bending structure parts only by adjusting the position of the bending structure parts, and the application flexibility of the flat heat pipe is improved.
Further, the application also provides electronic equipment, which comprises at least one bendable structure part and the flexible flat heat pipe, wherein the corrugated structure corresponds to the position of the bendable structure part.
In one implementation, the electronic device may be a head mounted display device, a smart wearable device, or the like, such as VR/AR glasses, VR/AR helmets, or the like.
The electronic equipment provided by the application solves the technical problem of poor application flexibility of the radiating flat plate on the electronic equipment in the prior art. Compared with the prior art, the beneficial effects of the electronic device provided by the embodiment of the application are the same as those of the flexible flat heat pipe of the embodiment, and are not repeated here.
The foregoing description is only of the preferred embodiments of the present application, and is not intended to limit the scope of the application, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein, or any application, directly or indirectly, within the scope of the application.
Claims (15)
1. The flexible flat heat pipe is characterized by comprising a shell, a sealed cavity, a liquid suction core and a liquid working medium;
the sealing chamber is surrounded by the shell;
the housing includes at least one section of corrugated structure;
the liquid suction core and the liquid working medium are arranged in the sealed cavity.
2. The flexible flat panel heat pipe of claim 1, wherein said housing comprises at least one copper layer and at least one polymer material layer.
3. The flexible flat panel heat pipe of claim 2, wherein the copper layer has a thickness of 0.1 to 30 μm;
and/or the thickness of the polymer material layer is 0.1-30 mu m.
4. The flexible flat panel heat pipe of claim 1, wherein said wick is a copper braid or copper braid.
5. The flexible flat panel heat pipe of claim 1, wherein the wick has a pore size of 300-400 mesh.
6. The flexible flat panel heat pipe of claim 1, wherein the liquid working medium is deionized water, absolute ethyl alcohol, or fluorocarbon.
7. The flexible flat plate heat pipe of claim 1, wherein the corrugated structure is an arc-shaped corrugated structure, a cone-shaped corrugated structure, or a fin-shaped stacked corrugated structure.
8. A method for manufacturing a flexible flat heat pipe, wherein the method for manufacturing a flexible flat heat pipe is applied to manufacturing a flexible flat heat pipe as claimed in any one of claims 1 to 7, comprising the steps of:
providing two shell plates and a liquid suction core, wherein the shell plates comprise at least one section of corrugated structure;
placing the liquid suction core between two shell plates, forming a sealing chamber between the two shell plates in a hot-press welding mode, enabling the liquid suction core to be positioned in the sealing chamber, and reserving a liquid injection port;
and injecting liquid working medium into the sealed cavity through the liquid injection port, vacuumizing the sealed cavity through the liquid injection port, and sealing the liquid injection port to obtain the flexible flat heat pipe.
9. The method of making a flexible flat panel heat pipe according to claim 8, wherein prior to said step of providing two shell plates and a wick, further comprising:
providing a wick substrate;
and (3) performing alkali-assisted surface oxidation hydrophilization treatment on the liquid absorption core substrate to obtain the liquid absorption core.
10. The method of making a flexible flat panel heat pipe according to claim 8, wherein prior to said step of providing two shell plates and a wick, further comprising:
providing a sheet material base;
at least one corrugated structure is processed on the sheet material base by a stamping or expanding process.
11. The method of manufacturing a flexible flat heat pipe according to claim 8, wherein the step of forming a sealed chamber between two housing plates by thermocompression bonding comprises:
carrying out plasma surface activation treatment on the areas to be welded on the two shell plates;
and welding the areas to be welded of the two shell plates in a hot-press welding mode so as to form a sealing cavity between the two shell plates.
12. The method for manufacturing a flexible flat heat pipe according to claim 11, wherein the inert gas used for the plasma surface activation treatment comprises at least one of argon and nitrogen, the activation power is 300-500 w, and the activation time is 3-5 min.
13. The method for manufacturing a flexible flat heat pipe according to any one of claims 8 to 12, wherein the heat press welding is performed at a welding temperature of 200 to 250 ℃, a welding pressure of 40 to 120mpa, and a welding time of 30 to 90min.
14. The method of manufacturing a flexible flat heat pipe as claimed in claim 13, wherein a vacuum is applied or a shielding gas is introduced during the thermocompression bonding, the shielding gas including at least one of argon and nitrogen.
15. An electronic device comprising a bendable structure portion and a flexible flat heat pipe according to any one of claims 1-7, wherein the corrugated structure corresponds to a position of the bendable structure portion.
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| CN116625150B (en) | 2023-11-14 |
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