CN204054782U - Double face copper - Google Patents
Double face copper Download PDFInfo
- Publication number
- CN204054782U CN204054782U CN201420366088.4U CN201420366088U CN204054782U CN 204054782 U CN204054782 U CN 204054782U CN 201420366088 U CN201420366088 U CN 201420366088U CN 204054782 U CN204054782 U CN 204054782U
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- copper
- double face
- ceramic layer
- dielectric ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model relates to a kind of double face copper, comprises metal substrate, thermal-adhering in the dielectric ceramic layer on the two surface of described metal substrate, and at the Copper Foil of each described dielectric ceramic layer surface pressing; Described metal substrate is provided with the insert hole penetrating described metal substrate, and the inwall of described insert hole is provided with copper plate, and described copper plate is connected with described Copper Foil.The heat of Copper Foil is delivered on the good metal substrate of heat conductivility by dielectric ceramic layer by this double face copper, thus improves heat-sinking capability.
Description
Technical field
The utility model relates to field of LED illumination, is specifically related to a kind of double face copper.
Background technology
In existing LED illumination device, usually LED is arranged in single or double copper-clad plate.And existing single double face copper is mainly made up of Copper Foil and insulating glass fibers cloth, copper-clad surface is used for line design, encapsulation paster, and intermediate insulation glass fabric is mainly used in insulation and heat radiation.
And when the LED illumination device energising of finished product works long hours, heat cannot conduct fast, and particularly high-power lamp is particularly evident, causes material aging to be accelerated, and works and also easily burn out under prolonged periods high temperature.Therefore, the double face copper heat dispersion in conventional art is poor.
Utility model content
Based on this, be necessary to provide a kind of double face copper improving heat dispersion.
A kind of double face copper, is characterized in that, comprise metal substrate, thermal-adhering in the dielectric ceramic layer on the two surface of described metal substrate, and at the Copper Foil of each described dielectric ceramic layer surface pressing; Described metal substrate is provided with the insert hole penetrating described metal substrate, and the inwall of described insert hole is provided with copper plate, and described copper plate is connected with described Copper Foil.
In one embodiment, the surface that described metal substrate and described dielectric ceramic layer are fitted is provided with the cellular quality dielectric oxide film of 3-5um thickness, be filled with insulating cement in described dielectric oxide film, described metal substrate and described dielectric ceramic layer are fitted by described insulating cement.
In one embodiment, described metal substrate is also provided with installing hole.
In one embodiment, described double face copper also comprises the external radiating piece inserting described installing hole.
In above-mentioned double face copper, the heat that Copper Foil produces at work is first delivered to dielectric ceramic layer, and then is delivered on metal substrate by dielectric ceramic layer.Because metal substrate is compared with the insulating glass fibers cloth in conventional art, there is higher heat-sinking capability, thus make the heat-sinking capability of this double face copper have also been obtained raising.
Accompanying drawing explanation
Fig. 1 is the structural representation of double face copper in an embodiment;
Fig. 2 is the structural representation of the double face copper being provided with external radiating piece in another embodiment.
Detailed description of the invention
In one embodiment, as shown in Figure 1, double face copper comprises 3-tier architecture: metal substrate 10, thermal-adhering in the dielectric ceramic layer 20 on metal substrate 10 1 surface, and at the Copper Foil 30 of the surperficial pressing of dielectric ceramic layer 20.
In addition, as shown in Figure 1, metal substrate 10 can be provided with the insert hole 12 of penetrating metal substrate 10, the inwall of insert hole be provided with copper plate 14, copper plate 14 can be connected with Copper Foil 30.LED lamp bead etc. are fixed on metal substrate 10 by the mode inserting insert hole 12, because copper plate 14 is connected with Copper Foil 30, make LED lamp bead to obtain normal power supply.
Preferably, metal substrate 10 can adopt the good aluminum base plate of heat conductivility, and aluminum base plate is comparatively light and heat dispersion is good.
Preferably, as shown in Figure 1, the surface that metal substrate 10 and dielectric ceramic layer 20 are fitted is provided with the cellular quality dielectric oxide film 40 of 3-5um thickness, is filled with insulating cement in dielectric oxide film 40, and metal substrate 10 and dielectric ceramic layer 20 are fitted by insulating cement.
That is, when processing double face copper, first surface treatment being carried out to metal substrate, making a certain surface of metal substrate form the cellular quality dielectric oxide film of 3-5um thickness.
Then carry out hot pressing filling perforation, in the honeycomb hole in cellular quality dielectric oxide film, fill insulating cement.Preferably, under metallographic microscope, honeycomb hole is filled full, and does not have cavity, bubble.Then by full-automatic heat posted machine, will have high heat conduction, the ceramic powder filler film (dielectric ceramic layer) of high insulation is fitted and is formed dielectric ceramic layer on metallic substrates at about 130 DEG C temperature.
Finally, can at dielectric ceramic layer surface recombination Copper Foil.Specified temp 100-200 DEG C can be set in automatic hot press, pressure 80-500pis, then the metal substrate segmentation pressing of Copper Foil and dielectric ceramic layer of having fitted is solidified, last cold moudling, molded surface without concave point, scratch, bubble, and 30S is without layering (Copper Foil, insulating materials, aluminium) under high temperature 288 DEG C of conditions.
In one embodiment, as shown in Figure 2, metal substrate 10 is also provided with installing hole 16.Double face copper also comprises the external radiating piece 50 inserting installing hole 16.
That is, external radiating piece (such as, the copper sheet array that area is larger or aluminium flake array) is connected with metal substantially by installing hole 16, and carries out heat transfer by installing hole 16, thus expands the area contacted with air, improves heat-sinking capability.
In above-mentioned double face copper, the heat that Copper Foil produces at work is first delivered to dielectric ceramic layer, and then is delivered on metal substrate by dielectric ceramic layer.Because metal substrate is compared with the insulating glass fibers cloth in conventional art, there is higher heat-sinking capability, thus make the heat-sinking capability of this double face copper have also been obtained raising.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (4)
1. a double face copper, is characterized in that, comprises metal substrate, thermal-adhering in the dielectric ceramic layer on the two surface of described metal substrate, and at the Copper Foil of each described dielectric ceramic layer surface pressing; Described metal substrate is provided with the insert hole penetrating described metal substrate, and the inwall of described insert hole is provided with copper plate, and described copper plate is connected with described Copper Foil.
2. double face copper according to claim 1, it is characterized in that, the surface that described metal substrate and described dielectric ceramic layer are fitted is provided with the cellular quality dielectric oxide film of 3-5um thickness, be filled with insulating cement in described dielectric oxide film, described metal substrate and described dielectric ceramic layer are fitted by described insulating cement.
3. double face copper according to claim 1, is characterized in that, described metal substrate is also provided with installing hole.
4. double face copper according to claim 3, is characterized in that, described double face copper also comprises the external radiating piece inserting described installing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420366088.4U CN204054782U (en) | 2014-07-04 | 2014-07-04 | Double face copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420366088.4U CN204054782U (en) | 2014-07-04 | 2014-07-04 | Double face copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204054782U true CN204054782U (en) | 2014-12-31 |
Family
ID=52196360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420366088.4U Active CN204054782U (en) | 2014-07-04 | 2014-07-04 | Double face copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204054782U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI610601B (en) * | 2016-03-08 | 2018-01-01 | 訊芯電子科技(中山)有限公司 | A double sided copperizing ceramic circuit board and manufacturing method thereof |
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
-
2014
- 2014-07-04 CN CN201420366088.4U patent/CN204054782U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI610601B (en) * | 2016-03-08 | 2018-01-01 | 訊芯電子科技(中山)有限公司 | A double sided copperizing ceramic circuit board and manufacturing method thereof |
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103342543B (en) | LED ceramic baseplate and preparation method thereof | |
| CN104320954B (en) | Heat-conducting liner including hot-melting heat-conducting film and preparation device thereof | |
| CN103872227B (en) | The manufacture method of a kind of 360 degree of luminous LED filament light sources | |
| CN103236485B (en) | A kind of method making luminous element on sapphire transparent heat-conducting plate | |
| CN204054782U (en) | Double face copper | |
| CN104129920A (en) | Co-fired glass ceramic material and preparation method thereof, and method for preparing LED package substrate by utilizing co-fired glass ceramic material | |
| CN102673050B (en) | A kind of Metamaterial composite plate and processing method | |
| CN202285457U (en) | Heat dissipation substrate | |
| CN204069477U (en) | A kind of single-side coated copper plate | |
| CN204069476U (en) | Single-side coated copper plate | |
| CN103826425A (en) | High-heat-conductivity foam gasket as well as preparation method and applications thereof | |
| CN203521463U (en) | High-thermal conductivity LED-COB packaging substrate | |
| CN104726046A (en) | Special glue solution for production of CEM-3 copper-clad plate and preparation method of copper-clad plate | |
| CN202647322U (en) | LED lamp panel | |
| CN202927508U (en) | Light-emitting diode (LED) lamp module with circuit directly manufactured on three-dimensional heat dissipating support lamp carrier | |
| CN103068151A (en) | Heat dissipation base material | |
| CN201927604U (en) | LED (light-emitting diode) light source | |
| CN113556835A (en) | Preparation process of graphene heating ceramic plate and graphene heating ceramic plate | |
| CN104091860A (en) | LED packaging light source and manufacturing process thereof | |
| CN204464316U (en) | A kind of package support | |
| CN103085581A (en) | Method and device for manufacturing sticking film with three-dimensional pattern | |
| CN105198436A (en) | Insulating and heat-conducting inorganic-nano composite ceramic as well as preparation method and application thereof | |
| CN203686694U (en) | Novel ceramic substrate LED lamp | |
| CN102881813A (en) | Radiator panel manufacture method | |
| CN108332077B (en) | Heat conducting pad assembling method of high-power LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong Province, Shenzhen city Baoan District manhole street after Mao Ting Zhoushan Industrial Park to the Arts crafts emporium Technology Park Chong Building 13 layer D Patentee after: SHENZHEN CHUANGHUI NEW MATERIAL TECHNOLOGY CO.,LTD. Address before: 518000 Guangdong Province, Shenzhen city Baoan District manhole street after Mao Ting Zhoushan Industrial Park to science and Technology Park Arts crafts emporium all Chong Building 13 layer D Patentee before: Guangdong creative Alliance Technology Co.,Ltd. Address after: 518000 Guangdong Province, Shenzhen city Baoan District manhole street after Mao Ting Zhoushan Industrial Park to science and Technology Park Arts crafts emporium all Chong Building 13 layer D Patentee after: Guangdong creative Alliance Technology Co.,Ltd. Address before: 518000, Shenzhen, Guangdong, Baoan District manhole street, South Po Road, oyster three Lin slope pit first industrial zone, A3A4 building, A3 building on the third floor, B District Patentee before: SHENZHEN CHUANGHUI ALLIANCE TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Industrial Building of Houting Maozhou Mountain Industrial Park, Shajing Street, Baoan District, Shenzhen City, Guangdong Province, to the 13th floor of Kechuang Building, Science and Technology Innovation Park Patentee after: Guangdong Chuanghui Xinluo Science and Technology Co.,Ltd. Address before: 518000 Industrial Building of Houting Maozhou Mountain Industrial Park, Shajing Street, Baoan District, Shenzhen City, Guangdong Province, to the 13th floor of Kechuang Building, Science and Technology Innovation Park Patentee before: SHENZHEN CHUANGHUI NEW MATERIAL TECHNOLOGY CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder |