CN204069476U - Single-side coated copper plate - Google Patents
Single-side coated copper plate Download PDFInfo
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- CN204069476U CN204069476U CN201420366074.2U CN201420366074U CN204069476U CN 204069476 U CN204069476 U CN 204069476U CN 201420366074 U CN201420366074 U CN 201420366074U CN 204069476 U CN204069476 U CN 204069476U
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- metal substrate
- dielectric ceramic
- ceramic layer
- copper plate
- coated copper
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Abstract
The utility model relates to a kind of single-side coated copper plate, it is characterized in that, comprises metal substrate, thermal-adhering in the dielectric ceramic layer on described metal substrate one surface, and at the FR4 central layer of described dielectric ceramic layer surface pressing.The heat of FR4 central layer is delivered on the good metal substrate of heat conductivility by dielectric ceramic layer by this single-side coated copper plate, thus improves heat-sinking capability.
Description
Technical field
The utility model relates to field of LED illumination, is specifically related to a kind of single-side coated copper plate.
Background technology
In existing LED illumination device, usually LED is arranged in single or double copper-clad plate.And existing single double face copper is mainly made up of FR4 central layer and insulating glass fibers cloth, FR4 central layer face is used for line design, encapsulation paster, and intermediate insulation glass fabric is mainly used in insulation and heat radiation.
And when the LED illumination device energising of finished product works long hours, heat cannot conduct fast, and particularly high-power lamp is particularly evident, causes material aging to be accelerated, and works and also easily burn out under prolonged periods high temperature.Therefore, the single-side coated copper plate heat dispersion in conventional art is poor.
Summary of the invention
Based on this, be necessary to provide a kind of single-side coated copper plate improving heat dispersion.
A kind of single-side coated copper plate, comprises metal substrate, thermal-adhering in the dielectric ceramic layer on described metal substrate one surface, and at the FR4 central layer of described dielectric ceramic layer surface pressing.
In one embodiment, the surface that described metal substrate and described dielectric ceramic layer are fitted is provided with the cellular quality dielectric oxide film of 3-5um thickness, be filled with insulating cement in described dielectric oxide film, described metal substrate and described dielectric ceramic layer are fitted by described insulating cement.
In one embodiment, the surface that described metal substrate is not fitted with described dielectric ceramic layer is provided with one or more projection.
In above-mentioned single-side coated copper plate, the heat that FR4 central layer produces at work is first delivered to dielectric ceramic layer, and then is delivered on metal substrate by dielectric ceramic layer.Because metal substrate is compared with the insulating glass fibers cloth in conventional art, there is higher heat-sinking capability, thus make the heat-sinking capability of this single-side coated copper plate have also been obtained raising.
Accompanying drawing explanation
Fig. 1 is the structural representation of single-side coated copper plate in an embodiment;
Fig. 2 is the structural representation that in another embodiment, metal substrate establishes bossed single-side coated copper plate.
Embodiment
In one embodiment, as shown in Figure 1, single-side coated copper plate comprises 3-tier architecture: metal substrate 10, thermal-adhering in the dielectric ceramic layer 20 on metal substrate 10 1 surface, and at the FR4 central layer 30 of the surperficial pressing of dielectric ceramic layer 20.
Preferably, metal substrate 10 can adopt the good aluminum base plate of heat conductivility.
FR4 central layer is the PCB substrate meeting FR4 standard, and can be the PCB substrate of multilayer.Copper plate is comprised, for transmission current in FR4 central layer.
Preferably, as shown in Figure 1, the surface that metal substrate 10 and dielectric ceramic layer 20 are fitted is provided with the cellular quality dielectric oxide film 40 of 3-5um thickness, is filled with insulating cement in dielectric oxide film 40, and metal substrate 10 and dielectric ceramic layer 20 are fitted by insulating cement.
That is, when processing single-side coated copper plate, first surface treatment being carried out to metal substrate, making a certain surface of metal substrate form the cellular quality dielectric oxide film of 3-5um thickness.
Then carry out hot pressing filling perforation, in the honeycomb hole in cellular quality dielectric oxide film, fill insulating cement.Preferably, under metallomicroscope, honeycomb hole is filled full, and does not have cavity, bubble.Then by full-automatic heat posted machine, will have high heat conduction, the ceramic powder filler film (dielectric ceramic layer) of high insulation is fitted and is formed dielectric ceramic layer on metallic substrates at about 130 DEG C temperature.
Finally, can at dielectric ceramic layer surface recombination FR4 central layer.Can first by the alligatoring of FR4 core plate surface (cupric circuit bed roughness be 3um), then fitted in the surface of FR4 central layer alligatoring and dielectric ceramic layer 20, then in automatic hot press, set specified temp 100-200 DEG C, pressure 80-500pis, then the metal substrate segmentation pressing of FR4 central layer and dielectric ceramic layer of having fitted is solidified, last cold moudling, molded surface without concave point, scratch, bubble, and 30S is without layering (FR4 central layer, insulating material, aluminium) under high temperature 288 DEG C of conditions.
After single-side coated copper plate is made, circuit can be made on FR4 central layer, SMD lamp pearl or chip on circuit, energising, the luminous heat release of lamp pearl, produces larger heat, heat (has high withstand voltage 5KV by heat transfer conductive heat transfer film, insulation) on, film is transmitted on aluminium sheet again, out by heat diffusion finally.
Preferably, the surface that metal substrate is not fitted with dielectric ceramic layer can be provided with one or more projection.
As shown in Figure 2, can metal substrate do not fit dielectric ceramic layer surface on perpendicular needle-like or dentation can be set, thus the contact area with air can be increased, improve the heat-sinking capability of metal substrate.
In above-mentioned single-side coated copper plate, the heat that FR4 central layer produces at work is first delivered to dielectric ceramic layer, and then is delivered on metal substrate by dielectric ceramic layer.Because metal substrate is compared with the insulating glass fibers cloth in conventional art, there is higher heat-sinking capability, thus make the heat-sinking capability of this single-side coated copper plate have also been obtained raising.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (3)
1. a single-side coated copper plate, is characterized in that, comprises metal substrate, thermal-adhering in the dielectric ceramic layer on described metal substrate one surface, and at the FR4 central layer of described dielectric ceramic layer surface pressing.
2. single-side coated copper plate according to claim 1, it is characterized in that, the surface that described metal substrate and described dielectric ceramic layer are fitted is provided with the cellular quality dielectric oxide film of 3-5um thickness, be filled with insulating cement in described dielectric oxide film, described metal substrate and described dielectric ceramic layer are fitted by described insulating cement.
3. single-side coated copper plate according to claim 1, is characterized in that, the surface that described metal substrate is not fitted with described dielectric ceramic layer is provided with one or more projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420366074.2U CN204069476U (en) | 2014-07-04 | 2014-07-04 | Single-side coated copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420366074.2U CN204069476U (en) | 2014-07-04 | 2014-07-04 | Single-side coated copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204069476U true CN204069476U (en) | 2014-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420366074.2U Active CN204069476U (en) | 2014-07-04 | 2014-07-04 | Single-side coated copper plate |
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| CN (1) | CN204069476U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106364013A (en) * | 2016-08-30 | 2017-02-01 | 苏州格优碳素新材料有限公司 | Heat conduction and heat insulating material and preparation method and application thereof |
-
2014
- 2014-07-04 CN CN201420366074.2U patent/CN204069476U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106364013A (en) * | 2016-08-30 | 2017-02-01 | 苏州格优碳素新材料有限公司 | Heat conduction and heat insulating material and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong Province, Shenzhen city Baoan District manhole street after Mao Ting Zhoushan Industrial Park to the Arts crafts emporium Technology Park Chong Building 13 layer D Patentee after: Guangdong create new material technology Co., Ltd. Address before: 518000, Shenzhen, Guangdong, Baoan District manhole street, South Po Road, oyster three Lin slope pit first industrial zone, A3A4 building, A3 building on the third floor, B District Patentee before: SHENZHEN CHUANGHUI ALLIANCE TECHNOLOGY CO., LTD. |
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| CP03 | Change of name, title or address | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Industrial Building of Houting Maozhou Mountain Industrial Park, Shajing Street, Baoan District, Shenzhen City, Guangdong Province, to the 13th floor of Kechuang Building, Science and Technology Innovation Park Patentee after: Guangdong Chuanghui Xinluo Science and Technology Co., Ltd. Address before: 518000 Industrial Building of Houting Maozhou Mountain Industrial Park, Shajing Street, Baoan District, Shenzhen City, Guangdong Province, to the 13th floor of Kechuang Building, Science and Technology Innovation Park Patentee before: Guangdong create new material technology Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |