CN203686694U - Novel ceramic substrate LED lamp - Google Patents
Novel ceramic substrate LED lamp Download PDFInfo
- Publication number
- CN203686694U CN203686694U CN201420032335.7U CN201420032335U CN203686694U CN 203686694 U CN203686694 U CN 203686694U CN 201420032335 U CN201420032335 U CN 201420032335U CN 203686694 U CN203686694 U CN 203686694U
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- ceramic substrate
- led lamp
- conducting wire
- base plate
- tin cream
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Abstract
The utility model discloses a novel ceramic substrate LED lamp, and relates to the field of illuminating lamps, in particular to the field of ceramic LED lamps. The novel ceramic substrate LED lamp comprises a ceramic substrate, a conducting circuit layer and an LED wafer. A heat dissipation structure is arranged on one surface of the ceramic substrate, the conducting circuit layer is arranged on the other surface of the ceramic substrate, and the LED wafer is welded to the conducting circuit layer. The novel ceramic substrate LED lamp is characterized in that except a bonding pad, used for welding, on the conducting circuit layer on the ceramic substrate, the rest of the conducting circuit layer is printed by a layer of low-temperature glaze; the bonding pad, used for welding, on the conducting circuit layer is provided with a solder paste steel net plate printed with solder paste for being welded with the LED wafer. The structure can rapidly and effectively conduct and dissipate the heat produced when the LED wafer works, the LED lamp has the higher lighting efficiency and longer service life, and the structure is highly insulated, practical and safe.
Description
Technical field
The utility model relates to field of illuminating lamps, particularly relates to ceramic LED lamp field.
Background technology
LED lamp can be described as the product that compares main flow in lighting at present, there is the life-span long, energy-conserving and environment-protective, high brightness lamp advantage, mostly the LED lamp of generally seeing on market is now taking aluminum as substrate, and the pottery of good insulation preformance is also not universal as the application of substrate, ceramic substrate has the heat conduction and heat radiation performance that is better than aluminium base, because the complicated cost of the structure manufacturing process of ceramic substrate LED is higher, cause the price of market sale higher, be unfavorable for applying, the heat loss through conduction performance of the structure of the existing LED lamp taking pottery as substrate or not ideal enough in addition, also should make improvements.
Summary of the invention
The purpose of this utility model is to provide a kind of ceramic substrate LED lamp that can reach better heat loss through conduction performance.
For achieving the above object, technical solutions of the utility model are such:
A kind of Novel ceramic base plate LED lamp, comprise ceramic substrate, conducting wire layer and LED wafer, on one surface of described ceramic substrate, there is radiator structure, described conducting wire layer is arranged on another surface of ceramic substrate, described LED wafer is welded on the layer of conducting wire, conducting wire layer on described ceramic substrate is except the pad place for welding, and on all the other conducting wire layers, printing is coated one deck low temperature glaze; Described conducting wire layer is provided with tin cream steel net plate on the pad welding, and prints one deck and supply the tin cream welding with LED wafer on the firm web plate of described tin cream.
Described ceramic substrate is become with boron nitride powder system by the alumina powder jointed particle of a-.
The basic crystalline size of the alumina powder jointed particle of described a-is 0.6-9 μ m, and the density of described boron nitride powder is 2.2-2.6g/m 3.
Another surface of described ceramic substrate adopts 25# diamond dust to carry out rubbing down.
Another surperficial surface smoothness of described ceramic substrate reaches and is less than 0.076/25.4mm; Refinement roughness in surface reaches Ra and is less than 2 μ m, and Rz is less than 20 μ m.
Described conducting wire layer is mixed by tin cream, fine silver slurry, platinum slurry, yttrium slurry.
The thickness of described conducting wire layer is 8-20 μ m.
Described tin cream be without cadmium, unleaded, without the tin cream of nickel.
Adopt after technique scheme, the beneficial effects of the utility model are: compared with the structure of ceramic substrate LED lamp of the prior art, the heat producing when the utility model can be worked LED wafer conducts fast and effectively and distributes, make LED light fixture have higher luminous efficiency and longer service life, and this structure height insulation, practical safety.
Brief description of the drawings
Fig. 1 is layer structure enlarged diagram of the present utility model.
In figure:
Conducting wire layer 2 pad 21
Steel net plate 5 tin creams 6.
Detailed description of the invention
Below by conjunction with the accompanying drawings and embodiments, specifically set forth the technical solution of the utility model.
As shown in fig. 1, a kind of Novel ceramic base plate LED lamp 100, comprise ceramic substrate 1, conducting wire layer 2 and LED wafer 3, on one surface of described ceramic substrate 1, there is the heat radiator structure 11 that heat loss through conduction is gone out fast and effectively producing while being beneficial to brilliant 3 work of LED, described conducting wire layer 2 is arranged on another surface of ceramic substrate 1, and described LED wafer 3 is welded on conducting wire layer 2.
Said structure is the common structure of existing product, the place that the utility model is different from prior art is, conducting wire layer 2 on described ceramic substrate 1 is except pad 21 places for welding, and on all the other conducting wire layers 2, the coated one deck of printing can make the not oxidized low temperature glaze in conducting wire 4; Described conducting wire layer 2 is for being provided with tin cream steel net plate 5 on the pad 21 welding, and described tin cream steel net plate 5 plays the effect of protection conducting wire layer 2; On the firm web plate 5 of described tin cream, print one deck and supply the tin cream 6 welding with LED wafer 3, can adopt so more advanced solder technology mode that LED wafer 3 is welded, reach better welding effect.
In the present embodiment, further, described ceramic substrate 1 is become with boron nitride powder system by the alumina powder jointed particle of a-, and preferred, the basic crystalline size of the alumina powder jointed particle of described a-is 0.6-9 μ m, and the density of described boron nitride powder is 2.2-2.6g/m 3.
Further, described ceramic substrate 1 another surface adopts 25# diamond dust to carry out rubbing down, and preferred, another surperficial surface smoothness of described ceramic substrate reaches and is less than 0.076/25.4mm; Refinement roughness in surface reaches Ra and is less than 2 μ m, and Rz is less than 20 μ m.
Further, described conducting wire layer 2 is mixed by tin cream, fine silver slurry, platinum slurry, yttrium slurry, and preferred, the thickness of described conducting wire layer 2 is 8-20 μ m.
Tin cream 6 described in the present embodiment is preferred adopt without cadmium, unleaded, without the tin cream of nickel, can make the more environmental protection of this product.
The heat producing when structure of the present utility model can be worked LED wafer 3 conducts fast and effectively and distributes, and makes LED lamp 100 have higher luminous efficiency and longer service life, and this structure height insulation, practical safety.
Be only the utility model preferred embodiment in sum, be not used for limiting practical range of the present utility model.Be that all equivalences of doing according to the content of the utility model claim change and modify, all should belong to technology category of the present utility model.
Claims (8)
1. a Novel ceramic base plate LED lamp, comprise ceramic substrate, conducting wire layer and LED wafer, on one surface of described ceramic substrate, there is radiator structure, described conducting wire layer is arranged on another surface of ceramic substrate, described LED wafer is welded on the layer of conducting wire, it is characterized in that: the conducting wire layer on described ceramic substrate is except the pad place for welding, and on all the other conducting wire layers, printing is coated one deck low temperature glaze; Described conducting wire layer is provided with tin cream steel net plate on the pad welding, and prints one deck and supply the tin cream welding with LED wafer on the firm web plate of described tin cream.
2. a kind of Novel ceramic base plate LED lamp according to claim 1, is characterized in that: described ceramic substrate is become with boron nitride powder system by the alumina powder jointed particle of a-.
3. a kind of Novel ceramic base plate LED lamp according to claim 2, is characterized in that: the basic crystalline size of the alumina powder jointed particle of described a-is 0.6-9 μ m, and the density of described boron nitride powder is 2.2-2.6g/m 3.
4. a kind of Novel ceramic base plate LED lamp according to claim 1, is characterized in that: another surface of described ceramic substrate adopts 25# diamond dust to carry out rubbing down.
5. a kind of Novel ceramic base plate LED lamp according to claim 4, is characterized in that: another surperficial surface smoothness of described ceramic substrate reaches and is less than 0.076/25.4mm; Refinement roughness in surface reaches Ra and is less than 2 μ m, and Rz is less than 20 μ m.
6. a kind of Novel ceramic base plate LED lamp according to claim 1, is characterized in that: described conducting wire layer is mixed by tin cream, fine silver slurry, platinum slurry, yttrium slurry.
7. a kind of Novel ceramic base plate LED lamp according to claim 6, is characterized in that: the thickness of described conducting wire layer is 8-20 μ m.
8. according to a kind of Novel ceramic base plate LED lamp described in any one in claim 1,2,3,4,5,6 or 7, it is characterized in that: described tin cream be without cadmium, unleaded, without the tin cream of nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420032335.7U CN203686694U (en) | 2014-01-20 | 2014-01-20 | Novel ceramic substrate LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420032335.7U CN203686694U (en) | 2014-01-20 | 2014-01-20 | Novel ceramic substrate LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203686694U true CN203686694U (en) | 2014-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420032335.7U Expired - Fee Related CN203686694U (en) | 2014-01-20 | 2014-01-20 | Novel ceramic substrate LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203686694U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279529A (en) * | 2014-09-24 | 2015-01-14 | 惠州市英吉尔光电科技有限公司 | LED miniature power supply |
| CN105489734A (en) * | 2015-04-10 | 2016-04-13 | 郭垣成 | Chip on board (COB) production process free from wire binding |
-
2014
- 2014-01-20 CN CN201420032335.7U patent/CN203686694U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279529A (en) * | 2014-09-24 | 2015-01-14 | 惠州市英吉尔光电科技有限公司 | LED miniature power supply |
| CN105489734A (en) * | 2015-04-10 | 2016-04-13 | 郭垣成 | Chip on board (COB) production process free from wire binding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Novel ceramic substrate LED lamp Effective date of registration: 20161011 Granted publication date: 20140702 Pledgee: Industrial Commercial Bank of China Ltd Dehua branch Pledgor: Fujian Dehua Fujie Ceramic Co., Ltd. Registration number: 2016990000856 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211115 Granted publication date: 20140702 Pledgee: Industrial Commercial Bank of China Ltd. Dehua branch Pledgor: FUJIAN DEHUA FUJIE CERAMICS CO.,LTD. Registration number: 2016990000856 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20210120 |