CN104279529A - LED miniature power supply - Google Patents
LED miniature power supply Download PDFInfo
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- CN104279529A CN104279529A CN201410491623.3A CN201410491623A CN104279529A CN 104279529 A CN104279529 A CN 104279529A CN 201410491623 A CN201410491623 A CN 201410491623A CN 104279529 A CN104279529 A CN 104279529A
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- Prior art keywords
- power supply
- module
- wafer
- pcb substrate
- ceramic pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
Abstract
The invention discloses an LED miniature power supply which comprises a ceramic PCB substrate and a silver paste circuit sintered on the ceramic PCB substrate. A power supply management IC module is disposed on the ceramic PCB substrate. An electronic component is disposed on the periphery of the power supply management IC module. Input-output bonding pads are disposed on two sides of the power supply management IC module. The power supply management IC module comprises a wafer, an auxiliary functional device and an insulating point rubber layer. The LED miniature power supply has the advantages that the power supply is super small in size, capable of being placed in lamp heads such as E12, stable in performance and high in cost performance, the power supply can be matched with various dimmers on market to achieve dimming, the power supply can pass safety, transmission and radiation authentication, the power factor of the power supply is larger than 0.85, the utilization rate of the power supply is larger than 90%, the power supply has an overvoltage and overpower intelligent protection function, and the like.
Description
Technical field
The present invention relates to power supply, specifically refer to a kind of LED compact power supply.
Background technology
Current LED power mode mainly contains several as follows: one is resistance-capacitance depressurization, adopt capacitance resistance ware subsides to insert in aluminium base to form, power factor low (about 0.4-0.5), power utilization rate low (less than 70%), electric current exports unstable with voltage ripple of power network, can not cross the certifications such as conduction, radiation; Two is Switching Power Supplies, and utilize the sophisticated electronic components and parts such as integrated IC and coil to make, volume is large, can not directly be positioned in the lamp holders such as E14, E12 at all; Cost is high, is 2-8 times of product of the present invention; Three is normal linear constant current schemes, linear constant current IC wafer is packaged into chip by common IC packaging technology, chip and simple electronic devices and components are welded on aluminium base, Deng input voltage ripple of power network when, as capacitance-resistance power source design, export instability, IC chip caloric value is large, especially load voltage and input voltage pressure reduction large time caloric value more sharply rise, causing IC chip functions to decline, all there is very big deviation in output current and power.Above-mentioned several power supply or volume is large, cost is high, structure meets in the lamp bulb of one of the present patent application application, cost also can not meet mass consumption demand; Unstable properties, to new product development, promotes and all brings great inconvenience.
Summary of the invention
The object of this invention is to provide a kind of volume extra small, can be placed in miniaturized lamp holder, stable performance, cost performance are extra-high, can mate that the various light modulator in market realizes light modulation, is greater than 0.85 by all safety and conduction and radiation certification, power factor, power utilization rate is greater than 90%, has the LED compact power supply of superpressure and overpower intelligent protection function.
The present invention can be achieved through the following technical solutions:
The invention discloses a kind of LED compact power supply, comprise ceramic PCB substrate and the silver slurry circuit of sintering in ceramic PCB substrate, described ceramic PCB substrate is provided with power management IC module, the wafer with linear constant current function is provided with and miscellaneous function device is directly encapsulated in ceramic PCB substrate in power management IC module, electronic devices and components are arranged with at the outer of power management IC module, the both sides of power management IC module are provided with input/output pads, in described ceramic PCB substrate, sintering has silver slurry circuit, described power management IC module comprises wafer, miscellaneous function device and the insulating point glue-line covered above wafer, wafer, miscellaneous function device is arranged on silver slurry circuit, silver slurry circuit comprises wafer, miscellaneous function device installation site and connect gauze being connected with input/output pads 4 from both sides lead line.
Several spread configurations of described wafer, and connected by wire between two or starch connection by wire and silver.
Described ceramic PCB substrate is mixed by aluminium oxide, graphite powder, feldspar powder, active metal zirconium, is 100: 10 ~ 15: 26 ~ 30:5 ~ 10 according to the adding proportion of mass fraction aluminium oxide, graphite powder, feldspar powder, active metal zirconium.
Described LED compact power supply is directly placed in lamp holders such as being applied to E12, E14, E17, E26, E27, B22.
LED compact power supply of the present invention has following beneficial effect:
1, wafer and the direct nation of auxiliary functions thereof being encapsulated on substrate surely, having the advantages that volume is little, without the need to increasing space, power supply can being directly positioned over E12 (S), E14(S) etc. in lamp holder;
2, the element such as wafer, rectifier bridge is directly encapsulated on substrate, eliminates IC encapsulation and IC
Paster link, cost significantly reduces;
3, wafer is directly encapsulated on substrate, eliminates the heat transition that middle IC encapsulates link,
The heat transfer directly produced by wafer work is on substrate, its heat conduction path is: wafer---", and silver starches (thermal conductivity factor 420w/m.k)---" ceramic wafer (thermal conductivity factor 33w/m.k), the heat conduction path of common metal substrate: wafer---" IC chip (thermal conductivity factor 33w/m.k)---" insulating barrier (thermal conductivity factor 0.2-0.8w/m.k)---" aluminium (thermal conductivity factor 237w/m.k), heat conduction is faster, guarantee that IC operating temperature is less than 60 degree, thus make that power source performance is more stable, the life-span is also longer;
4, the metal substrate of substrate non-generic and ceramic substrate, this substrate by the aluminium oxide of proper ratio,
The thick film ceramic that is mixed in of graphite powder and feldspar powder, active metal zirconium sinters, above-mentioned additive has the function of heat loss through radiation, the heat part produced by IC wafer is distributed by the mode of radiation, thus effectively ensure that the operating temperature of IC controls within 60 degree;
5, this power supply can realize the Power Management Design of various power by change resistance, and leaving pad increases overpressure protection or overpower protection device can realize extra defencive function, designs very convenient.
Accompanying drawing explanation
Accompanying drawing 1 is the structural representation of LED compact power supply of the present invention;
Accompanying drawing 2 is the distributed architecture schematic diagram of element in Fig. 1;
Accompanying drawing 3 is the structural representation be arranged in candle bulb LED of LED compact power supply of the present invention.
Detailed description of the invention
Below in conjunction with Figure of description, the invention will be further described:
As shown in accompanying drawing 1 ~ 2, the invention discloses a kind of LED compact power supply, comprise ceramic PCB substrate 1 and the silver slurry circuit 10 of sintering in ceramic PCB substrate 1, described ceramic PCB substrate 1 is provided with power management IC module 2, the wafer with linear constant current function is provided with and miscellaneous function device is directly encapsulated in ceramic PCB substrate 1 in power management IC module, electronic devices and components 3 are arranged with at the outer of power management IC module 2, the both sides of power management IC module 2 are provided with input/output pads 4, in described ceramic PCB substrate 1, sintering has silver slurry circuit, described power management IC module 2 comprises wafer 11, miscellaneous function device 12 and the insulating point glue-line 13 covered above wafer 11, wafer 11, miscellaneous function device 12 is arranged on silver slurry circuit 10, silver slurry circuit 10 comprises wafer 11, miscellaneous function device 12 installation site and connect gauze being connected with input/output pads 4 from both sides lead line.
As shown in Figure 2, described several spread configurations of wafer 11, and connected by wire between two or starch circuit 10 by wire be connected with silver.
Described in LED compact power supply of the present invention, ceramic PCB substrate 1 is mixed by aluminium oxide, graphite powder, feldspar powder, active metal zirconium, is 100: 10 ~ 15: 26 ~ 30:5 ~ 10 according to the adding proportion of mass fraction aluminium oxide, graphite powder, feldspar powder, active metal zirconium.
Described in LED compact power supply of the present invention, LED compact power supply is directly placed in lamp holders such as being applied to E12, E14, E17, E26, E27, B22.
Power management IC module described in LED compact power supply of the present invention is adapt to the wafer with linear constant current function that designs of technological requirement and miscellaneous function device is directly encapsulated on aforesaid substrate, save cost and heat-conducting medium that common IC encapsulates link, heat is directly led on substrate by wafer, by conduction and radiation, heat is dispelled the heat away, thus make the operating temperature of the IC wafer of substrate control within 60 degree, even if line voltage is raised to more than 270 degree once in a while, wafer work temperature also will control at about 80 degree, thus effectively protect this power supply IC wafer, make it stably to work.Peripheral electron components and parts 3 are resistance, capacitor element etc. for simple electronic devices and components, are product for catering to the various power demand in market and certification demand and increase, freely can match replacing.
LED compact power supply of the present invention resolves into IC, peripheral component two pieces, and the direct nation of IC is encapsulated on substrate surely, and peripheral components can need to select paster according to function, can realize flexible lot and quantize large-scale production.The sinking path of LED compact power supply of the present invention: each element of power drives, pad and chip all link with elargol, power drives operationally, the heat that chip produces is transmitted on ceramic substrate rapidly by elargol layer, makes chip can not gather too much heat.
As shown in Figure 3, being arranged in candle bulb LED of LED compact power supply of the present invention.Figure comprises glass shell 5,360 degree of LED silks 6, stem stem 7, linear tunable optical COB thick film power supply 8, E12 lamp holder 9, and it is the product of existing maturation, and concrete annexation no longer describes in detail.As seen from Figure 3, the volume of LED compact power supply of the present invention is little in the extreme, can be directly installed in E12 lamp holder 9.
LED compact power supply of the present invention is suitable for various light modulator on the market, unlike common LED
Controllable silicon dimmer applicable surface is narrow, often can only be suitable for several light modulator; Dimming function is controlled by IC, and need not increase light modulation device as other common dimming power sources, cost significantly reduces, compared with the common power supply with dimming function, cost only have its 1/8 to 1/3.
The above, be only preferred embodiment of the present invention, not does any pro forma restriction to the present invention; The those of ordinary skill of all industry all can shown in by specification accompanying drawing and the above and implement the present invention swimmingly; But all those skilled in the art are not departing within the scope of technical solution of the present invention, disclosed above technology contents can be utilized and make a little change, modify with differentiation equivalent variations, be Equivalent embodiments of the present invention; Meanwhile, all according to substantial technological of the present invention to the change of any equivalent variations that above embodiment is done, modify and differentiation etc., within the protection domain all still belonging to technical scheme of the present invention.
Claims (4)
1. a LED compact power supply, comprise ceramic PCB substrate (1) and silver slurry circuit (10) of sintering in ceramic PCB substrate (1), it is characterized in that: described ceramic PCB substrate (1) is provided with power management IC module (2), the wafer with linear constant current function is provided with and miscellaneous function device is directly encapsulated in ceramic PCB substrate (1) in power management IC module, electronic devices and components (3) are arranged with at the outer of power management IC module (2), the both sides of power management IC module (2) are provided with input/output pads (4), the upper sintering of described ceramic PCB substrate (1) has silver slurry circuit, described power management IC module (2) comprises wafer (11), miscellaneous function device (12) and the insulating point glue-line (13) covered above wafer (11), wafer (11), miscellaneous function device (12) is arranged on silver slurry circuit (10), silver slurry circuit (10) comprises wafer (11), miscellaneous function device (12) installation site and connect gauze being connected with input/output pads (4) from both sides lead line.
2. LED compact power supply according to claim 1, is characterized in that: described wafer (11) several spread configurations, and is connected by wire between two or starched circuit (10) by wire be connected with silver.
3. LED compact power supply according to claim 1 and 2, it is characterized in that: described ceramic PCB substrate (1) is mixed by aluminium oxide, graphite powder, feldspar powder, active metal zirconium, is 100: 10 ~ 15: 26 ~ 30:5 ~ 10 according to the adding proportion of mass fraction aluminium oxide, graphite powder, feldspar powder, active metal zirconium.
4. LED compact power supply according to claim 3, is characterized in that: described LED compact power supply is directly placed in lamp holders such as being applied to E12, E14, E17, E26, E27, B22.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410491623.3A CN104279529B (en) | 2014-09-24 | 2014-09-24 | A kind of LED compact power supplies |
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| CN201410491623.3A CN104279529B (en) | 2014-09-24 | 2014-09-24 | A kind of LED compact power supplies |
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| CN104279529A true CN104279529A (en) | 2015-01-14 |
| CN104279529B CN104279529B (en) | 2017-12-15 |
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| CN201053637Y (en) * | 2007-06-26 | 2008-04-30 | 宁波升谱光电半导体有限公司 | RGB white light LED device for illumination |
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| CN102980054A (en) * | 2011-09-07 | 2013-03-20 | 王元成 | Light-emitting diode (LED) lamp bulb |
| CN203686694U (en) * | 2014-01-20 | 2014-07-02 | 福建省德化福杰陶瓷有限公司 | Novel ceramic substrate LED lamp |
| CN203810334U (en) * | 2014-05-20 | 2014-09-03 | 贵州光浦森光电有限公司 | Large chip for LED (light emitting diode) driving power supply |
| CN204213862U (en) * | 2014-09-24 | 2015-03-18 | 惠州市英吉尔光电科技有限公司 | A kind of LED compact power supply |
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2014
- 2014-09-24 CN CN201410491623.3A patent/CN104279529B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0001707B1 (en) * | 1977-10-17 | 1982-10-13 | John Fluke Mfg. Co., Inc. | A thermally isolated monolithic semiconductor die and a process for producing such a die |
| CN86106288A (en) * | 1986-09-09 | 1988-03-23 | 山东省新材料研究所 | Black ceramics light-resistant, heat sink material |
| CN201053637Y (en) * | 2007-06-26 | 2008-04-30 | 宁波升谱光电半导体有限公司 | RGB white light LED device for illumination |
| US20090321114A1 (en) * | 2008-06-30 | 2009-12-31 | Hiroyuki Takahashi | Electrical inspection substrate unit and manufacturing method therefore |
| CN201298549Y (en) * | 2008-12-10 | 2009-08-26 | 深圳市矽格半导体科技有限公司 | A package structure of an LED constant current driving integrated circuit |
| CN201549499U (en) * | 2009-10-13 | 2010-08-11 | 中外合资江苏稳润光电有限公司 | Encapsulating structure of ceramic-based high-power red, green and blue LED |
| CN102005446A (en) * | 2010-11-03 | 2011-04-06 | 熊周成 | Light-emitting diode (LED) packaging structure and LED luminescent display module |
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| CN104279529B (en) | 2017-12-15 |
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Effective date of registration: 20180206 Address after: Chen Jiang Huifeng Street West three road 516006 in Guangdong province Huizhou City Zhongkai high tech Zone No. 108 A building, third floor Patentee after: Huizhou yingjir Lighting Technology Co. Ltd. Address before: 516000 Guangdong province Huizhou City Zhongkai high tech Zone District No. 54 (Building 3) Patentee before: HUIZHOU ENGLED PHOTOELECTRIC TECHNOLOGY CO., LTD. |
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Effective date of registration: 20191212 Address after: 225321 north side of Zhenbei Road, diaopu street, Gaogang District, Taizhou City, Jiangsu Province Patentee after: Li Qiannan Address before: Chen Jiang Huifeng Street West three road 516006 in Guangdong province Huizhou City Zhongkai high tech Zone No. 108 A building, third floor Patentee before: Huizhou yingjir Lighting Technology Co. Ltd. |
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Effective date of registration: 20191223 Address after: 2188 Longcheng Avenue, Zhonglou District, Changzhou City, Jiangsu Province Patentee after: Changzhou youpaisi Electric Technology Co., Ltd Address before: 225321 north side of Zhenbei Road, diaopu street, Gaogang District, Taizhou City, Jiangsu Province Patentee before: Li Qiannan |
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