CN104279529B - A kind of LED compact power supplies - Google Patents
A kind of LED compact power supplies Download PDFInfo
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- CN104279529B CN104279529B CN201410491623.3A CN201410491623A CN104279529B CN 104279529 B CN104279529 B CN 104279529B CN 201410491623 A CN201410491623 A CN 201410491623A CN 104279529 B CN104279529 B CN 104279529B
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- pcb substrate
- module
- wafer
- power management
- silver paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
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Abstract
The invention discloses a kind of LED compact power supplies, it includes ceramic PCB substrate and the silver paste circuit being sintered in ceramic PCB substrate, the ceramic PCB substrate is provided with power management IC module, electronic component is provided with the periphery of power management IC module, the both sides of power management IC module are provided with input/output pads, sintering has silver paste circuit in described ceramic PCB substrate, and described power management IC module includes wafer, miscellaneous function device and the insulating point glue-line being covered in above wafer.LED compact power supplies of the present invention have that volume is extra small, can be placed in the lamp holders such as E12, and stable performance, cost performance are extra-high, can match market various light modulators realize light modulation, can be more than 0.85, power utilization rate by all safety, conduction, radiation certification, power factor and be more than more than 90%, have the advantages that superpressure and overpower intelligent protection function.
Description
Technical field
The present invention relates to power supply, in particular to a kind of LED compact power supplies.
Background technology
Current LED power mode mainly has following several：First, resistance-capacitance depressurization, aluminium base is inserted in using capacitance resistance ware patch
Form, power factor is low（0.4-0.5 or so）, power utilization rate is low（Less than 70%）, electric current output with voltage ripple of power network without
It is stable, it is impossible to cross the certifications such as conduction, radiation；Second, Switching Power Supply, is made using the sophisticated electronic such as integrated IC and coil component,
Volume is big, can not be placed directly in the lamp holders such as E14, E12 at all；Cost is high, is 2-8 times of product of the present invention；It is third, common
Linear constant current scheme, linear constant current IC wafers are packaged into chip by common IC package technique, and chip welds with simple electronic component
It is connected on aluminium base, in the case of waiting input voltage ripple of power network, unstable, IC chip hair is exported as capacitance-resistance power source design
Heat is big, especially load voltage and caloric value more steeply rises during big input voltage pressure difference, causes IC chip function reduction, defeated
Go out electric current and power and very big deviation all occur.Or above-mentioned several power supply volumes are big, cost is high, Shen of the present invention is met in structure
Please apply one of lamp bulb in, mass consumption demand is also can not meet in cost；Performance is unstable, is opened to new product
Hair, promote and all bring great inconvenience.
The content of the invention
It is an object of the invention to provide a kind of volume it is extra small, can be placed in the lamp holder of miniaturization, stable performance, sexual valence bit
Height, the various light modulators realization light modulations in market can be matched, can be more than by all safety and conduction and radiation certification, power factor
0.85th, power utilization rate is more than 90%, has superpressure and the LED compact power supplies of overpower intelligent protection function.
The present invention can be achieved through the following technical solutions：
The invention discloses a kind of LED compact power supplies, including ceramic PCB substrate and it is sintered in ceramic PCB substrate
Silver paste circuit, the ceramic PCB substrate are provided with power management IC module, and being provided with power management IC module has linear constant current
The wafer and miscellaneous function device of function are directly encapsulated into ceramic PCB substrate, and electricity is provided with the periphery of power management IC module
Sub- component, the both sides of power management IC module are provided with input/output pads, and sintering has silver paste line in described ceramic PCB substrate
Road, described power management IC module include wafer, miscellaneous function device and the insulating point glue-line being covered in above wafer, brilliant
Circle, miscellaneous function device are arranged on silver paste circuit, and silver paste circuit includes wafer, miscellaneous function device installation site and connecting line
Net is simultaneously connected from both sides lead line with input/output pads 4.
Several spread configurations of the wafer, and connected by wire or connected by wire and silver paste circuit two-by-two
Connect.
The ceramic PCB substrate is mixed by aluminum oxide, graphite powder, feldspar powder, active metal zirconium, according to mass fraction
Aluminum oxide, graphite powder, feldspar powder, the adding proportion of active metal zirconium are 100: 10~15: 26~30：5~10.
The LED compact power supplies are directly placed applied in the lamp holders such as E12, E14, E17, E26, E27, B22.
LED compact power supplies of the present invention have the advantages that：
1st, wafer and its direct bonding of auxiliary functions are encapsulated on substrate, there is the characteristics of small volume, Ke Yiwu
Space need to be increased power supply is placed directly in E12 (S), E14（S）Deng in lamp holder；
2nd, the elements such as wafer, rectifier bridge are directly encapsulated on substrate, eliminate IC package and IC
Paster link, cost are greatly reduced；
3rd, wafer is directly encapsulated on substrate, eliminates the heat transition of middle IC package link,
It will be directly thermally conducted to caused by wafer work on substrate, its heat conduction path is：Wafer ---》Silver paste（Heat conduction system
Number 420w/m.k) ---》Ceramic wafer（Thermal conductivity factor 33w/m.k), the heat conduction path of common metal substrate：Wafer ---》IC cores
Piece（Thermal conductivity factor 33w/m.k) ---》Insulating barrier（Thermal conductivity factor 0.2-0.8w/m.k) ---》Aluminium（Thermal conductivity factor 237w/m.k),
Heat conduction is faster, it is ensured that IC operating temperatures are less than 60 degree, so that power source performance is more stable, the life-span is also longer；
4th, substrate non-generic metal substrate and ceramic substrate, this substrate by the aluminum oxide of proper ratio,
Graphite powder and feldspar powder, the thick film ceramic that is mixed in of active metal zirconium are sintered, and above-mentioned additive has radiation
The function of radiating, heat part caused by IC wafers is distributed by way of radiation, so as to be effectively guaranteed IC work
Make temperature control within 60 degree；
5th, this power supply by change resistance i.e. can be achieved various power Power Management Design, leave pad increase overpressure protection or
Overpower protection device is that extra defencive function can be achieved, and design is very convenient.
Brief description of the drawings
Accompanying drawing 1 is the structural representation of LED compact power supplies of the present invention；
Accompanying drawing 2 is the distributed architecture schematic diagram of element in Fig. 1；
Accompanying drawing 3 is the structural representation being arranged in candle bulb LED of LED compact power supplies of the present invention.
Embodiment
Below in conjunction with Figure of description, the invention will be further described：
As shown in accompanying drawing 1~2, the invention discloses a kind of LED compact power supplies, including ceramic PCB substrate 1 and sintering
Silver paste circuit 10 in ceramic PCB substrate 1, the ceramic PCB substrate 1 are provided with power management IC module 2, power management
The wafer with linear constant current function is provided with IC modules and miscellaneous function device is directly encapsulated into ceramic PCB substrate 1,
The periphery of power management IC module 2 is provided with electronic component 3, and the both sides of power management IC module 2 are provided with input/output pads 4,
Sintering has silver paste circuit in described ceramic PCB substrate 1, and described power management IC module 2 includes wafer 11, miscellaneous function
Device 12 and the insulating point glue-line 13 for being covered in the top of wafer 11, wafer 11, miscellaneous function device 12 are arranged on silver paste circuit 10
On, silver paste circuit 10 include wafer 11, the installation site of miscellaneous function device 12 and connection gauze and from both sides lead line with it is defeated
Enter o pads 4 to connect.
As shown in Fig. 2 described several spread configurations of wafer 11, and connected two-by-two by wire or by wire with
Silver paste circuit 10 connects.
Ceramic PCB substrate 1 is by aluminum oxide, graphite powder, feldspar powder, active metal zirconium described in LED compact power supplies of the present invention
Mix, the adding proportion according to mass fraction aluminum oxide, graphite powder, feldspar powder, active metal zirconium is 100: 10~15: 26
~30：5~10.
LED compact power supplies described in LED compact power supplies of the present invention directly place applied to E12, E14, E17, E26,
In the lamp holders such as E27, B22.
Power management IC module described in LED compact power supplies of the present invention has linear perseverance for what adaptation technological requirement designed
The wafer and its miscellaneous function device for flowing function are directly encapsulated on aforesaid substrate, save the cost of common IC package link with leading
Thermal medium, wafer directly lead heat on substrate, and heat is radiated away with radiation by conduction, so that the IC wafers of substrate
Operating temperature is controlled within 60 degree, even if line voltage is raised to more than 270 degree once in a while, wafer work temperature will be also controlled 80
Degree left and right, so as to be effectively protected this power supply IC wafers, works with making it stable.Peripheral electron component 3 is simple electronics
Component is resistance, capacitor element etc., is increased to cater to the product of the various power demands in market and certification demand, can be certainly
Changed by apolegamy.
LED compact power supplies of the present invention resolve into two pieces of IC, peripheral component, and the direct bondings of IC are encapsulated on substrate, outside
Peripheral device can need to select paster according to function, it is possible to achieve flexible lot quantifies large-scale production.LED miniaturizations electricity of the present invention
The sinking path in source：Each element of power drives, pad and chip are linked with elargol, and power drives at work, are produced on chip
Raw heat is rapidly transmitted on ceramic substrate by elargol layer so that excessive heat will not be gathered on chip.
As shown in figure 3, LED compact power supplies of the present invention are arranged in candle bulb LED.Figure include glass shell 5,
360 degree of LED filaments 6, stem 7, linear tunable optical COB thick films power supply 8, E12 lamp holders 9, it is existing ripe product, specifically
Annexation is no longer described in detail.As seen from Figure 3, the volume of LED compact power supplies of the present invention is small in the extreme, can be directly installed on
In E12 lamp holders 9.
LED compact power supplies of the present invention are applicable light modulators various on the market, unlike common LED
Controllable silicon dimmer applicable surface is narrow, can only often be applicable several light modulators；Dimming function is controlled by IC, without as it
He increases light modulation device by common dimming power source, and cost is greatly reduced, and compared with the commonly power supply with dimming function, cost only has
It 1/8 to 1/3.
The foregoing is only a preferred embodiment of the present invention, not makees any formal limitation to the present invention；It is all
The those of ordinary skill of the industry can be shown in by specification accompanying drawing and described above and swimmingly implement the present invention；It is but all
Those skilled in the art without departing from the scope of the present invention, using disclosed above technology contents
The equivalent variations for a little variation, modification and evolution made, it is the equivalent embodiment of the present invention；It is meanwhile all according to the present invention
The variation, modification and evolution of any equivalent variations made to above example of substantial technological etc., still fall within the present invention's
Within the protection domain of technical scheme.
Claims (3)
1. a kind of LED compact power supplies, including ceramic PCB substrate (1) and the silver paste line that is sintered in ceramic PCB substrate (1)
Road（10）, it is characterised in that：The ceramic PCB substrate (1) by aluminum oxide, graphite powder, feldspar powder, active metal zirconium mixing and
Into the adding proportion according to mass fraction aluminum oxide, graphite powder, feldspar powder, active metal zirconium is 100: 10~15: 26~30：5
~10, the ceramic PCB substrate (1) is provided with power management IC module（2）, power management IC module is interior to be provided with linear
The wafer and miscellaneous function device of constant current function are directly encapsulated into ceramic PCB substrate (1), in power management IC module（2）'s
Periphery is provided with electronic component（3）, power management IC module（2）Both sides be provided with input/output pads（4）, described ceramics
Sintering has silver paste circuit, described power management IC module in PCB substrate (1)（2）Including wafer（11）, miscellaneous function device
（12）Be covered in wafer（11）The insulating point glue-line of top（13）, wafer（11）, miscellaneous function device（12）Installed in silver paste
Circuit（10）On, silver paste circuit（10）Including wafer（11）, miscellaneous function device（12）Installation site and connection gauze and from two
Side lead line and input/output pads（4）Connection.
2. LED compact power supplies according to claim 1, it is characterised in that：The wafer（11）Several spread configurations,
And connected two-by-two by wire or pass through wire and silver paste circuit（10）Connection.
3. LED compact power supplies according to claim 1 or 2, it is characterised in that：The LED compact power supplies are directly put
Put applied in E12, E14, E17, E26, E27, B22 lamp holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410491623.3A CN104279529B (en) | 2014-09-24 | 2014-09-24 | A kind of LED compact power supplies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410491623.3A CN104279529B (en) | 2014-09-24 | 2014-09-24 | A kind of LED compact power supplies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104279529A CN104279529A (en) | 2015-01-14 |
| CN104279529B true CN104279529B (en) | 2017-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410491623.3A Active CN104279529B (en) | 2014-09-24 | 2014-09-24 | A kind of LED compact power supplies |
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Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4257061A (en) * | 1977-10-17 | 1981-03-17 | John Fluke Mfg. Co., Inc. | Thermally isolated monolithic semiconductor die |
| CN86106288A (en) * | 1986-09-09 | 1988-03-23 | 山东省新材料研究所 | Black ceramics light-resistant, heat sink material |
| CN201053637Y (en) * | 2007-06-26 | 2008-04-30 | 宁波升谱光电半导体有限公司 | RGB white light LED device for illumination |
| US8193456B2 (en) * | 2008-06-30 | 2012-06-05 | Ngk Spark Plug Co., Ltd. | Electrical inspection substrate unit and manufacturing method therefore |
| CN201298549Y (en) * | 2008-12-10 | 2009-08-26 | 深圳市矽格半导体科技有限公司 | A package structure of an LED constant current driving integrated circuit |
| CN201549499U (en) * | 2009-10-13 | 2010-08-11 | 中外合资江苏稳润光电有限公司 | Encapsulating structure of ceramic-based high-power red, green and blue LED |
| CN102005446A (en) * | 2010-11-03 | 2011-04-06 | 熊周成 | Light-emitting diode (LED) packaging structure and LED luminescent display module |
| CN102980054B (en) * | 2011-09-07 | 2014-10-22 | 王丽娜 | Light-emitting diode (LED) lamp bulb |
| CN203686694U (en) * | 2014-01-20 | 2014-07-02 | 福建省德化福杰陶瓷有限公司 | Novel ceramic substrate LED lamp |
| CN203810334U (en) * | 2014-05-20 | 2014-09-03 | 贵州光浦森光电有限公司 | Large chip for LED (light emitting diode) driving power supply |
| CN204213862U (en) * | 2014-09-24 | 2015-03-18 | 惠州市英吉尔光电科技有限公司 | A kind of LED compact power supply |
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Effective date of registration: 20180206 Address after: Chen Jiang Huifeng Street West three road 516006 in Guangdong province Huizhou City Zhongkai high tech Zone No. 108 A building, third floor Patentee after: Huizhou yingjir Lighting Technology Co. Ltd. Address before: 516000 Guangdong province Huizhou City Zhongkai high tech Zone District No. 54 (Building 3) Patentee before: HUIZHOU ENGLED PHOTOELECTRIC TECHNOLOGY CO., LTD. |
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Effective date of registration: 20191212 Address after: 225321 north side of Zhenbei Road, diaopu street, Gaogang District, Taizhou City, Jiangsu Province Patentee after: Li Qiannan Address before: Chen Jiang Huifeng Street West three road 516006 in Guangdong province Huizhou City Zhongkai high tech Zone No. 108 A building, third floor Patentee before: Huizhou yingjir Lighting Technology Co. Ltd. |
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Effective date of registration: 20191223 Address after: 2188 Longcheng Avenue, Zhonglou District, Changzhou City, Jiangsu Province Patentee after: Changzhou youpaisi Electric Technology Co., Ltd Address before: 225321 north side of Zhenbei Road, diaopu street, Gaogang District, Taizhou City, Jiangsu Province Patentee before: Li Qiannan |
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| TR01 | Transfer of patent right |