CN111447792B - Heat dissipation device, preparation method of heat dissipation device and electronic equipment - Google Patents
Heat dissipation device, preparation method of heat dissipation device and electronic equipment Download PDFInfo
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- CN111447792B CN111447792B CN202010272824.XA CN202010272824A CN111447792B CN 111447792 B CN111447792 B CN 111447792B CN 202010272824 A CN202010272824 A CN 202010272824A CN 111447792 B CN111447792 B CN 111447792B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Abstract
The application provides a heat abstractor, including first apron, second apron, capillary structure and working fluid, first apron with the second apron lid closes and forms inclosed accommodation space, capillary structure sets up first apron is close to the surface of accommodation space, the working fluid is filled in the accommodation space, wherein, first apron includes first region and second region, capillary structure is including setting up at least one first capillary structure in first region is in with setting up at least one second capillary structure in the second region, the thickness of first capillary structure is greater than the thickness of second capillary structure. Through setting up the first capillary structure and the second capillary structure that thickness is different to increase the heat radiating area in the heat dissipation process, improve the radiating efficiency, and then be favorable to reducing heat abstractor's thickness, realize heat abstractor's frivolousization. The application also provides a preparation method of the heat dissipation device and electronic equipment.
Description
Technical Field
The application belongs to the technical field of heat conduction, and particularly relates to a heat dissipation device, a preparation method of the heat dissipation device and electronic equipment.
Background
When the electronic device is operated, heat is generated, which directly causes the temperature of the electronic device to rise sharply, and therefore, the heat needs to be dissipated quickly by a heat dissipation device. However, the conventional heat dissipation device is thick and occupies a certain space, thereby limiting the development of light and thin electronic devices.
Disclosure of Invention
In view of this, the present application provides a heat dissipation device and a method for manufacturing the heat dissipation device, which are beneficial to implementing the lightness and thinness of the heat dissipation device; meanwhile, the electronic equipment comprising the heat dissipation device is further provided, the heat dissipation performance of the electronic equipment is improved, and the electronic equipment is light and thin.
In a first aspect, the present application provides a heat dissipation device, including first apron, second apron, capillary structure and working fluid, first apron with the second apron lid closes and forms inclosed accommodation space, the capillary structure sets up first apron is close to the surface of accommodation space, the working fluid is filled in the accommodation space, wherein, first apron is including first region and second region, the capillary structure is including setting up at least one first capillary structure in first region is in with setting up at least one second capillary structure in the second region, the thickness of first capillary structure is greater than the thickness of second capillary structure.
In a second aspect, the present application provides a method for manufacturing a heat dissipation device, including:
providing a first cover plate and a second cover plate, wherein the first cover plate comprises a first area and a second area;
forming at least one first capillary structure in the first area, and forming at least one second capillary structure in the second area, wherein the thickness of the first capillary structure is larger than that of the second capillary structure;
covering the first cover plate and the second cover plate to form a closed accommodating space, wherein the first capillary structure and the second capillary structure are arranged in the accommodating space;
and injecting working fluid into the accommodating space, and sealing to form the heat dissipation device.
In a third aspect, the present application provides an electronic device, including a heat generating element and a heat dissipating device, the heat dissipating device includes a first cover plate, a second cover plate, a capillary structure and a working fluid, the first cover plate and the second cover plate cover to form a sealed accommodating space, the capillary structure is disposed on a surface of the first cover plate close to the accommodating space, and the working fluid is filled in the accommodating space, wherein the first cover plate includes a first region and a second region, the capillary structure includes at least one first capillary structure disposed in the first region and at least one second capillary structure disposed in the second region, a thickness of the first capillary structure is greater than a thickness of the second capillary structure, and the heat generating element is attached to the first region of the first cover plate.
The application provides a heat dissipation device and a preparation method of the heat dissipation device, and by arranging a first capillary structure and a second capillary structure with different thicknesses, the heat dissipation area is increased in the heat dissipation process, an excellent heat dissipation effect is realized, the weight and the overall thickness of the heat dissipation device are reduced, and the light and thin of the heat dissipation device are realized; the preparation method of the heat dissipation device is simple and is beneficial to realizing industrial production. The application also provides the electronic equipment comprising the heat dissipation device, so that the heat dissipation performance of the electronic equipment can be improved, and the electronic equipment is light and thin.
Drawings
In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present application.
Fig. 3 is a top view of a first cover plate according to an embodiment of the present application.
Fig. 4 is a top view of a first cover plate according to another embodiment of the present application.
Fig. 5 is a schematic flow chart illustrating a manufacturing method of a heat dissipation device according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 7 is a schematic cross-sectional view of an electronic device according to another embodiment of the present application.
Description of the drawings:
the heat dissipation device comprises a first cover plate-10, a first area-11, a second area-12, a second cover plate-20, a capillary structure-30, a first capillary structure-31, a second capillary structure-32, a containing space-40, a supporting structure-50, a heat dissipation device-100, a heating element-200, a panel-300, a shell-400 and a middle plate-500.
Detailed Description
The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat dissipation device 100 according to an embodiment of the present disclosure, including a first cover plate 10, a second cover plate 20, a capillary structure 30 and a working fluid, where the first cover plate 10 and the second cover plate 20 are covered to form a closed accommodating space 40, the capillary structure 30 is disposed on a surface of the first cover plate 10 close to the accommodating space 40, and the working fluid is filled in the accommodating space 40, which is not shown in fig. 1; the first cover plate 10 includes a first region 11 and a second region 12, the capillary structure 30 includes at least one first capillary structure 31 disposed in the first region 11 and at least one second capillary structure 32 disposed in the second region 12, and a thickness of the first capillary structure 31 is greater than a thickness of the second capillary structure 32.
In the present application, when the first cover plate 10 of the heat dissipation device 100 contacts a heat source, the heat is absorbed and transferred to the working fluid in the accommodating space 40, and the working fluid is vaporized to form steam after absorbing the heat, and the heat is transferred from the first cover plate 10 to the second cover plate 20 through the accommodating space 40 of the heat dissipation device 100, which may also be referred to as a heat dissipation channel, and then transferred to the outside through the second cover plate 20. In the heat transfer process, the vapor is condensed into liquid, and the capillary force generated by the capillary structure 30 guides the liquid to the first cover plate 10, so that the heat dissipation process is circularly performed, and the heat dissipation is further completed. This application has adopted first capillary structure 31 and second capillary structure 32 that have different thickness, in the heat dissipation process, the working fluid heat absorption vaporization of first capillary structure 31 and second capillary structure 32 department, because first capillary structure 31 is thicker than second capillary structure 32, consequently, the steam that the working fluid vaporization of first capillary structure 31 department formed, the steam that the working fluid vaporization of second capillary structure 32 department formed is wider than the diffusion scope on the thickness direction, it is higher, heat radiating area is bigger, and then make the radiating effect of first region 11 can be more obvious. In practical applications, the first region 11 of the first cover plate 10 corresponds to a heat source, and may not be limited to a heating element, etc., thereby increasing a vapor diffusion area in a heat dissipation process, improving a heat dissipation effect, facilitating to reduce the thickness of the heat dissipation device 100, giving consideration to a required heat dissipation effect, realizing the lightness and thinness of the heat dissipation device 100, reducing the usage of the second capillary structure 32 material in the second region 12, saving economy, facilitating large-scale industrial applications, and further reducing the weight of the heat dissipation device 100.
In the present application, the capillary structure 30 comprises at least one first capillary structure 31 in the first zone 11 and at least one second capillary structure 32 in the second zone 12. In one embodiment of the present application, referring to fig. 1, a first capillary structure 31 and a second capillary structure 32 are disposed at an interval on a surface of a first cover plate 10. It will be appreciated that there is a spacing between the first capillary structure 31 and the second capillary structure 32. In another embodiment of the present application, the first capillary structure 31 and the second capillary structure 32 are continuously disposed on the surface of the first cover plate 10, and there is no space between the first capillary structure 31 and the second capillary structure 32. When the first capillary structure 31 and the second capillary structure 32 are continuously arranged, in the heat dissipation process, after the working fluid in the first capillary structure 31 and the second capillary structure 32 is heated and vaporized, the working fluid is diffused from the surfaces of the first capillary structure 31 and the second capillary structure 32 close to the second cover plate 20, that is, gas-liquid separation is realized in the thickness direction of the capillary structure 30, which can be called as gas-liquid separation in the vertical direction. When the first capillary structure 31 and the second capillary structure 32 are arranged at an interval, in the heat dissipation process, the working fluid in the first capillary structure 31 and the second capillary structure 32 is heated and vaporized, and then is diffused from the first capillary structure 31 and the second capillary structure 32 in the transverse dimension direction, which can be called as that gas-liquid separation is realized in the horizontal direction. For the gas-liquid separation in the vertical direction, the heat dissipation channel after the gas-liquid separation in the horizontal direction has more volume occupied by the first capillary structure 31 and the second capillary structure 32, so that the heat dissipation channel is wider, the heat dissipation area is larger, and the heat dissipation efficiency is further improved. In an embodiment of the present invention, the distance between the first capillary structure 31 and the second capillary structure 32 is greater than 100 μm, so as to increase the heat dissipation area and the heat dissipation effect, and further reduce the thickness of the heat dissipation device 100, thereby achieving the light and thin heat dissipation device 100 while maintaining the heat dissipation performance. Further, the distance between the first capillary structure 31 and the second capillary structure 32 is larger than 150 μm, and the heat dissipation effect is further improved.
In the present embodiment, the first region 11 of the first cover plate 10 includes one or more first capillary structures 31. Referring to fig. 1, the first region 11 has a plurality of first capillary structures 31. In an embodiment, a plurality of first capillary structures 31 may be continuously and non-intermittently disposed on the first region 11. In another embodiment, the plurality of first capillary structures 31 are disposed in the first region 11 at intervals, so as to achieve gas-liquid separation in the horizontal direction, compared with the continuous arrangement of the plurality of first capillary structures 31, the heat dissipation channel is wider, the heat dissipation area is larger, and the heat dissipation efficiency of the heat dissipation device 100 is improved, and when the plurality of first capillary structures 31 are disposed continuously, a larger capillary force can be generated, so that the accommodating space 40 cannot be fully filled in the steam heat transfer process and is then drained to the first capillary structures 31 again, the accommodating space 40 cannot be fully utilized, and when the plurality of first capillary structures 31 are disposed at intervals, the accommodating space 40 can be more fully utilized, and the heat dissipation area is improved. In an embodiment, the distance between the adjacent first capillary structures 31 is greater than 100 μm, so as to increase the heat dissipation area, increase the heat dissipation effect, facilitate to reduce the thickness of the heat dissipation device 100, and achieve the light and thin heat dissipation device 100. Further, the distance between the adjacent first capillary structures 31 is larger than 150 μm, 180 μm, 200 μm or 210 μm, further improving the heat dissipation area and the heat dissipation effect. In another embodiment, the plurality of first capillary structures 31 are arranged in an array on the first cover plate 10, so that the heat dissipation process is more uniform, and the heat dissipation uniformity is improved.
In the present embodiment, the second region 12 of the first cover plate 10 includes one or more second capillary structures 32. Referring to fig. 1, the second region 12 has a plurality of second capillary structures 32. In an embodiment, a plurality of second capillary structures 32 may be continuously and non-intermittently disposed on the second region 12. In another embodiment, the plurality of second capillary structures 32 are disposed in the second region 12 at intervals, so as to achieve gas-liquid separation in the horizontal direction, compared with the continuous arrangement of the plurality of second capillary structures 32, the heat dissipation channel is wider, the heat dissipation area is larger, and the heat dissipation efficiency of the heat dissipation device 100 is improved, and when the plurality of second capillary structures 32 are disposed continuously, a larger capillary force can be generated, so that the accommodating space 40 cannot be fully filled in the process of transferring heat by steam, the accommodating space 40 can be drained to the second capillary structures 32 again, the accommodating space 40 cannot be fully utilized, and when the plurality of second capillary structures 32 are disposed at intervals, the accommodating space 40 can be more fully utilized, and the heat dissipation area is improved. In an embodiment, the distance between the adjacent second capillary structures 32 is greater than 100 μm, so as to increase the heat dissipation area, increase the heat dissipation effect, facilitate to reduce the thickness of the heat dissipation device 100, and achieve the light and thin heat dissipation device 100. Further, the distance between the adjacent second capillary structures 32 is greater than 150 μm, 180 μm, 200 μm, or 210 μm, further improving the heat dissipation area and the heat dissipation effect. In another embodiment, the plurality of second capillary structures 32 are arranged in an array on the first cover plate 10, so that the heat dissipation process is more uniform, and the heat dissipation uniformity is improved.
In the present embodiment, referring to fig. 2, the first capillary structure 31 abuts against the second cover plate 20. It is understood that the first capillary structure 31 has a first end and a second end opposite to each other in the thickness direction, the first capillary structure 31 is disposed on the first cover plate 10, the first end of the first capillary structure 31 abuts against the first cover plate 10, and the second end of the first capillary structure 31 abuts against the second cover plate 20. That is to say, the thickness of the first capillary structure 31 is consistent with the size of the accommodating space 40 in the thickness direction of the first capillary structure 31, so that after the working fluid in the first capillary structure 31 is vaporized to form steam, the working fluid can fill the accommodating space 40 corresponding to the whole first region 11, the accommodating space 40 is utilized more effectively, in practical application, the heat dissipation area of the corresponding heat source position is increased, and further the heat dissipation effect is improved, which is beneficial to reducing the thickness of the heat dissipation device 100, and the light and thin of the heat dissipation device 100 is realized.
In the present embodiment, when the first region 11 includes a plurality of first capillary structures 31, please refer to fig. 3, the accommodating space 40 can be divided by the plurality of first capillary structures 31 to form at least one heat dissipation channel between adjacent first capillary structures 31. When a plurality of heat dissipation channels are provided, the heat dissipation channels are not communicated with each other. In another embodiment of the present application, when the first region 11 includes a plurality of first capillary structures 31, referring to fig. 4, the accommodating space 40 can be divided by the plurality of first capillary structures 31 to form a plurality of interconnected sub-spaces, i.e. a plurality of interconnected heat dissipation channels. In an embodiment, the cross-section of the first capillary structure 31 may be, but is not limited to, square, rectangular, circular, oval, diamond, irregular, etc.
In the present embodiment, when the second region 12 includes a plurality of second capillary structures 32, please refer to fig. 3, the accommodating space 40 can be divided by the plurality of second capillary structures 32 to form at least one heat dissipation channel between adjacent second capillary structures 32. When a plurality of heat dissipation channels are provided, the heat dissipation channels are not communicated with each other. In another embodiment of the present application, when the second region 12 includes a plurality of second capillary structures 32, referring to fig. 4, the accommodating space 40 can be divided by the plurality of second capillary structures 32 to form a plurality of interconnected sub-spaces, i.e. a plurality of interconnected heat dissipation channels. In an embodiment, the cross-section of the first capillary structure 31 may be, but is not limited to, square, rectangular, circular, oval, diamond, irregular, etc. It can be understood that, when there are a plurality of first capillary structures 31 and a plurality of second capillary structures 32, heat dissipation channels that are not communicated with each other may also be provided between the first capillary structures 31, and heat dissipation channels that are communicated with each other may also be provided between the second capillary structures 32, and heat dissipation channels that are not communicated with each other may also be provided between the first capillary structures 31, and heat dissipation channels that are not communicated with each other may also be provided between the second capillary structures 32.
In the present application, by providing the first capillary structure 31 and the second capillary structure 32 with different thicknesses, the first region 11 corresponding to the heat source can have a larger heat dissipation area when in use, thereby improving the heat dissipation effect. The thicknesses of the first capillary structure 31 and the second capillary structure 32 may be selected according to actual needs, and in order to facilitate the thinning of the heat dissipation device 100, the first capillary structure 31 and the second capillary structure 32 may be the micro-scale capillary structure 30. In the embodiment of the present application, the thickness of the first capillary structure 31 is greater than 80 μm, and the thickness of the second capillary structure 32 is less than or equal to 80 μm, so that the working fluid in the first capillary structure 31 can be sufficiently dissipated after being vaporized, and the thickness of the second capillary structure 32 is relatively small, so that the weight of the heat dissipation device 100 is not excessively increased. In an embodiment, the thickness of the first capillary structure 31 is 85 μm to 120 μm, and the thickness of the second capillary structure 32 is 20 μm to 80 μm, which not only can improve the heat dissipation effect of the heat dissipation device 100, but also can reduce the volume of the heat dissipation device 100, and at the same time, the thickness of the heat dissipation device 100 is not too large, which is beneficial to implementing the light and thin of the heat dissipation device 100. In another embodiment, the thickness of the first capillary structure 31 is 90 μm to 120 μm and the thickness of the second capillary structure 32 is 40 μm to 70 μm. In the present embodiment, the thickness ratio of the first capillary structure 31 to the second capillary structure 32 is (1.1 to 6): 1, then the steam corresponding to the first area 11 can have a larger heat dissipation space in the heat dissipation process, and the heat dissipation efficiency is improved. Further, the thickness ratio of the first capillary structure 31 to the second capillary structure 32 is (1.5-4): 1.
in the present application, the capillary structure 30 is made of a metal material. In one embodiment, the material of the capillary structure 30 includes at least one of copper, titanium, nickel and tin or stainless steel; that is, the first capillary structure 31 and the second capillary structure 32 are made of stainless steel or at least one of copper, titanium, nickel and tin, and the first capillary structure 31 and the second capillary structure 32 may be made of the same material or different materials. For example, the first capillary structure 31 and the second capillary structure 32 are made of copper. For another example, the first capillary structure 31 is made of a copper-titanium alloy, and the second capillary structure 32 is made of copper. In the present application, the preparation of the capillary structure 30 can be selected according to actual needs, and it is sufficient if it can provide a capillary force. In one embodiment, the capillary structure 30 may be cut from a metal mesh. In another embodiment, the wicking structure 30 may be made of a sintered metal mesh. In yet another embodiment, the capillary structure 30 may be formed by etching. In the embodiment of the present application, by providing the first capillary structure 31 and the second capillary structure 32 having different thicknesses, the first capillary structure 31 does not need to be thin, so that a fine manufacturing process is not needed, and the method is more economical.
In this application, the heat dissipation device 100 includes a first cover plate 10 and a second cover plate 20, and the first cover plate 10 and the second cover plate 20 cover to form a closed accommodating space 40. It is to be understood that the terms "first", "second" and the like in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. The capillary structure 30 is arranged on the first cover plate 10, and when the capillary structure is applied, the surface of the first cover plate 10, which is far away from the second cover plate 20, is attached to a heat source, including direct attachment and indirect attachment through other components; of course, the capillary structure 30 may also be disposed on the second cover plate 20, and the surface of the second cover plate 20 away from the first cover plate 10 is disposed to be attached to a heat source. In the present application, the first cover plate 10 includes a first area 11 and a second area 12, and the first area 11 and the second area 12 are adjacent, for example, but not limited to, the first area 11 surrounds the second area 12, or the second area 12 surrounds the first area 11, or the first area 11 and the second area 12 are adjacent. The arrangement and range of the first area 11 and the second area 12 can be selected according to actual needs, and the range of the first area 11 can be designed according to the size of the heat source.
In the present application, in order to achieve the lightness and thinness of the heat dissipation device 100, optionally, the thickness of the first cover plate 10 is less than or equal to 200 μm, and the thickness of the second cover plate 20 is less than or equal to 200 μm. Further, the thickness of the first cover plate 10 is less than or equal to 180 μm, and the thickness of the second cover plate 20 is less than or equal to 180 μm. Further, the thickness of the first cover plate 10 is less than or equal to 150 μm, and the thickness of the second cover plate 20 is less than or equal to 150 μm. In the present application, the first cover plate 10 and the second cover plate 20 are composed of a material having a thermal conductive property. In an embodiment, the thermal conductivity of the first cover plate 10 is greater than 10W/(m · K), and the thermal conductivity of the second cover plate 20 is greater than 10W/(m · K), so that the heat dissipation apparatus 100 has an excellent heat dissipation effect. In one embodiment, the material of the first cover plate 10 includes stainless steel or at least one of copper, titanium, nickel and tin, and the material of the second cover plate 20 includes stainless steel or at least one of copper, titanium, nickel and tin. Further, the first cover plate 10 is made of titanium, copper-titanium alloy, copper-nickel alloy, copper-tin alloy or stainless steel, and the second cover plate 20 is made of titanium, copper-titanium alloy, copper-nickel alloy, copper-tin alloy or stainless steel, so that the first cover plate 10 and the second cover plate 20 have good mechanical properties, and the thickness of the first cover plate and the second cover plate is reduced, and the good performance of the heat dissipation device 100 is guaranteed. It is understood that the first cover plate 10 and the second cover plate 20 may be made of the same material or different materials, and the first cover plate 10 or the second cover plate 20 and the capillary structure 30 may be made of the same material or different materials. In an embodiment, the first cover plate 10 and the second cover plate 20 may have a single-layer structure or a multi-layer structure, which is selected according to actual needs.
In the embodiment of the present application, the first cover plate 10 includes a first horizontal layer and a first frame disposed at an edge of a surface of the first horizontal layer, and in this case, the first cover plate 10 may be, but is not limited to, integrally formed. In another embodiment of the present application, the first cover plate 10 has a horizontal structure. In the embodiment of the present application, the second cover plate 20 includes a second horizontal layer and a second frame disposed at an edge of a surface of the second horizontal layer, and in this case, the second cover plate 20 may be, but is not limited to, integrally formed. In another embodiment of the present application, the second cover plate 20 has a horizontal structure. In one embodiment, the first frame and the second frame abut against each other to form the accommodating space 40. In another embodiment, the first frame and the second cover plate 20 of the horizontal structure abut to form the accommodating space 40. In another embodiment, the second frame abuts against the first cover plate 10 in the horizontal structure to form the accommodating space 40. In another embodiment, the first cover plate 10 and the second cover plate 20 in the horizontal structure may be, but are not limited to, formed into the accommodating space 40 by welding, gluing, such as laser welding, diffusion welding, solder welding, glue bonding, and the like.
In the present application, the accommodating space 40 is in a vacuum state, so that the working fluid can be easily vaporized for heat conduction. Optionally, the vacuum degree in the accommodating space 40 is 10-3-10-1Pa. Further, the vacuum degree in the accommodating space 40 is 10-2-10-1Pa。
In the present application, the working fluid in the heat dissipation device 100 absorbs heat and rapidly vaporizes, which takes away a large amount of heat to complete a heat dissipation cycle. It will be appreciated that the working fluid is selected from a group of substances that do not chemically react with the first cover plate 10, the second cover plate 20 and the capillary structure 30. Optionally, the working fluid is selected from water, propylene glycol, acetone or methanol. Specifically, the working fluid may be, but is not limited to, deionized water. The filling amount of the working fluid in the accommodating space 40 also affects the heat dissipation efficiency of the heat dissipation device 100, the filling amount is too small, the amount of heat taken away in one heat dissipation cycle is limited, the filling amount is too large, and the weight of the heat dissipation device 100 is increased. Optionally, the filling amount of the working fluid in the accommodating space 40 is 15% to 70%, so that heat dissipation can be effectively performed without making the heat dissipation device 100 too heavy. Further, the filling amount of the working fluid in the accommodating space 40 is 30% -65%.
In this application, in order to satisfy the light and thin requirement of heat dissipation device 100, and possess stronger mechanical properties simultaneously again, consequently, can set up bearing structure 50 in accommodation space 40, play certain supporting role to accommodation space 40 of heat dissipation device 100, still be favorable to the diffusion efficiency of working fluid on bearing structure 50 extending direction simultaneously. In an embodiment, referring to fig. 1, the heat dissipation device 100 includes at least one supporting structure 50, and the supporting structure 50 is disposed in the accommodating space 40 and abuts against the first cover plate 10 and the second cover plate 20. In an embodiment, when the plurality of capillary structures 30 are disposed on the first cover plate 10 at intervals, the supporting structure 50 abuts against the capillary structures 30, so that the heat dissipation space is not affected, and efficient heat dissipation is facilitated. Further, the support structure 50 comprises at least one first support structure abutting the first capillary structure 31 and at least one second support structure abutting the second capillary structure 32. In another embodiment, when the first capillary structure 31 abuts the second cover plate 20, the first support structure is not required. In the present application, the supporting structure 50 is abutted against the capillary structure 30, so that the accommodating space 40 forms a plurality of mutually communicated heat dissipation channels, and the accommodating space 40 also forms a plurality of mutually non-communicated heat dissipation channels. In the present application, the thickness of the support structure 50 is selected according to actual needs, and may be, but is not limited to, 20 μm to 120 μm. It is understood that the support structure 50 mainly supports the heat dissipation device 100, and the material thereof can be selected according to the requirement, and can be, but not limited to, a metal, such as copper, a copper alloy, etc.
In the present application, by setting the first capillary structure 31 and the second capillary structure 32 with different thicknesses, in the application, the steam corresponding to the first region 11 of the heat source may have a larger heat dissipation space, and further, the heat dissipation efficiency is improved, meanwhile, the second region 12 without corresponding to the heat source does not need to set the thicker capillary structure 30, the use of materials is reduced, the weight of the heat dissipation device 100 is reduced, and further, the thickness of the heat dissipation device 100 can be reduced, thereby realizing the lightness and thinness of the heat dissipation device 100. Optionally, the thickness of the heat dissipation device 100 is less than or equal to 280 μm. Further, the thickness of the heat dissipation device 100 is less than or equal to 250 μm.
The present application also provides a method of manufacturing a heat dissipation device, which manufactures the heat dissipation device 100 of any of the above embodiments. Referring to fig. 5, fig. 5 is a schematic flow chart illustrating a manufacturing method of the heat dissipation device 100 according to an embodiment of the present application, including the following steps:
operation 101: a first cover plate and a second cover plate are provided, the first cover plate comprising a first region and a second region.
In operation 101, the first cover plate 10 and the second cover plate 20 may be, but not limited to, directly cut from a metal plate, and the metal plate may satisfy the thermal conductivity and mechanical properties required by the first cover plate 10 and the second cover plate 20 in the heat dissipation device 100. In order to achieve the light and thin heat dissipation device 100, optionally, the thickness of the first cover plate 10 is less than or equal to 200 μm, and the thickness of the second cover plate 20 is less than or equal to 200 μm. In the present application, the first cover plate 10 includes a first region 11 and a second region 12, and the first region 11 and the second region 12 are adjacent.
Operation 102: at least one first capillary structure is formed in the first area, at least one second capillary structure is formed in the second area, and the thickness of the first capillary structure is larger than that of the second capillary structure.
In operation 102, which may be but is not limited to providing a first metal mesh, the first metal mesh is cut and disposed in the first area 11 to form at least one first capillary structure 31; and providing a second metal net, cutting the second metal net and arranging the second metal net in the second area 12 to form at least one second capillary structure 32. In another embodiment, the first and second capillary structures 31 and 32 may be formed by sintering, and may also be formed by etching. The first capillary structure 31 and the second capillary structure 32 are arranged as above, and will not be described in detail herein.
Operation 103: the first cover plate and the second cover plate are covered to form a closed accommodating space, and the first capillary structure and the second capillary structure are arranged in the accommodating space.
In operation 103, the sealed accommodating space 40 may be formed by, but not limited to, welding or gluing. Optionally, the soldering includes at least one of laser welding, diffusion soldering, and solder soldering. The solder welding comprises low-temperature solder or high-temperature solder, the diffusion welding comprises vacuum diffusion welding or gas protection diffusion welding, and the adhesive material can be, but is not limited to, a dual epoxy-based adhesive material, a silicon-based adhesive material and the like. In one embodiment, the soldering may be performed at a soldering temperature of 600 ℃ to 900 ℃ in a nitrogen atmosphere. When the heat dissipation device 100 further includes the support structure 50, the support structure 50 is disposed in the accommodating space 40 and abuts against the first cover plate 10 and the second cover plate 20.
Operation 104: working fluid is injected into the accommodating space, and the heat dissipation device 100 is formed after sealing.
In operation 104, the accommodating space 40 is in a vacuum state, so that the working fluid can be easily vaporized for heat conduction. Optionally, the vacuum degree in the accommodating space 40 is 10-3-10-1Pa. In an embodiment, a liquid filling pipe is welded into the accommodating space 40, and a working fluid is filled into the accommodating space 40 through the liquid filling pipe, and the heat dissipation device 100 is formed after vacuum pumping and sealing.
The preparation method of the heat dissipation device 100 is simple, can be completed without using precise equipment, and is low in preparation cost, and the prepared heat dissipation device 100 is excellent in heat dissipation performance, is lighter and thinner, and is beneficial to application.
The present application further provides an electronic device including the heat dissipation apparatus 100 of any of the above embodiments. It is understood that the electronic device may be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a watch, an MP3, an MP4, a GPS navigator, a digital camera, etc., and the heat dissipation apparatus 100 may be, but is not limited to, a temperature equalization plate.
Referring to fig. 6, which is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure, the electronic device includes a panel 300 and a housing 400, the panel 300 and the housing 400 form an accommodating space, and the accommodating space includes a heating element 200 and a heat dissipation device 100, wherein the heating element 200 is attached to a first region 11 of the heat dissipation device 100, and a heat dissipation space after a working fluid corresponding to the first region 11 is vaporized is larger, so that faster heat dissipation can be achieved, and heat dissipation efficiency is improved; meanwhile, the heat dissipation device 100 can properly reduce the thickness and also have excellent heat dissipation performance, and the second capillary structure 32 of the second region 12 has a smaller thickness, which is beneficial to reducing the weight of the heat dissipation device 100 and further beneficial to realizing the lightness and thinness of the electronic equipment. In practical applications, the heat dissipation device 100 may directly contact with the heat generating element 200, or may contact with the heat generating element 200 through the middle plate, and at this time, the middle plate needs to be processed to embed the heat dissipation device 100 therein, that is, the heat dissipation device 100 may be directly attached to the heat generating element 200 or indirectly attached to the heat generating element 200, and the heat generating element 200 is disposed corresponding to the first region in the heat dissipation device 100. Referring to fig. 7, which is a schematic cross-sectional view of an electronic apparatus according to another embodiment of the present disclosure, the electronic apparatus includes a heat generating element 200, a heat dissipation device 100 and a middle plate 500, wherein the heat dissipation device 100 is embedded in the middle plate 500 and attached to the heat generating element 200. Taking a mobile phone as an example, the heat dissipation device is thick, and then the mechanical property of the middle plate of the mobile phone can be influenced, and further the overall strength of the mobile phone can be influenced, and the heat dissipation device 100 provided by the application can reduce the thickness of the heat dissipation device, and does not influence the heat dissipation performance, and further does not influence the overall performance of the mobile phone, and meanwhile, the heat dissipation device 100 provided by the application has small weight, does not excessively increase the weight of the mobile phone, and has good application prospect.
The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (13)
1. The heat dissipation device is characterized by comprising a first cover plate, a second cover plate, capillary structures and working fluid, wherein the first cover plate and the second cover plate are covered to form a closed accommodating space, the capillary structures are arranged on the surface, close to the accommodating space, of the first cover plate, the working fluid is filled in the accommodating space, the first cover plate comprises a first area and a second area, the capillary structures comprise at least one first capillary structure arranged in the first area and at least one second capillary structure arranged in the second area, the thickness of the first capillary structure is larger than that of the second capillary structure, and the first capillary structure and the second capillary structure are arranged on the surface of the first cover plate at intervals to achieve gas-liquid separation in the horizontal direction.
2. The heat dissipation device of claim 1, wherein a spacing between the first capillary structure and the second capillary structure is greater than 100 μ ι η.
3. The heat dissipation device of claim 1, wherein a plurality of the first capillary structures are arranged in an array on the first cover plate, and a plurality of the second capillary structures are arranged in an array on the first cover plate.
4. The heat dissipating device of claim 1, wherein the first capillary structure has a thickness greater than 80 μ ι η and the second capillary structure has a thickness less than or equal to 80 μ ι η.
5. The heat dissipating device of claim 4, wherein the first capillary structure has a thickness of 85 μ ι η to 120 μ ι η and the second capillary structure has a thickness of 20 μ ι η to 80 μ ι η.
6. The heat dissipating device of claim 1, wherein said first wicking structure abuts said second cover plate.
7. The heat dissipating device of claim 1, wherein the capillary structure comprises stainless steel or at least one of copper, titanium, nickel, and tin.
8. The heat dissipating device of claim 1, further comprising a support structure disposed within the receiving space and abutting the first cover plate and the second cover plate.
9. The heat dissipating device of claim 8, wherein said support structure abuts said capillary structure.
10. The heat dissipating device of claim 1, wherein the heat dissipating device has a thickness of less than or equal to 280 μ ι η.
11. A method for preparing a heat sink, comprising:
providing a first cover plate and a second cover plate, wherein the first cover plate comprises a first area and a second area;
forming at least one first capillary structure in the first area, and forming at least one second capillary structure in the second area, wherein the thickness of the first capillary structure is larger than that of the second capillary structure;
covering the first cover plate and the second cover plate to form a closed accommodating space, wherein the first capillary structure and the second capillary structure are arranged in the accommodating space;
and injecting working fluid into the accommodating space, sealing to form a heat dissipation device, and arranging the first capillary structure and the second capillary structure on the surface of the first cover plate at intervals to realize gas-liquid separation in the horizontal direction.
12. The method of claim 11, wherein forming at least one first capillary structure in the first region and at least one second capillary structure in the second region comprises:
providing a first metal net, cutting the first metal net and arranging the first metal net in the first area to form at least one first capillary structure;
and providing a second metal net, and cutting the second metal net to be arranged in the second area to form at least one second capillary structure.
13. An electronic device comprising a heat generating element and the heat dissipating device of any of claims 1-10, wherein the heat generating element is disposed in close proximity to the first region of the first cover plate in the heat dissipating device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010272824.XA CN111447792B (en) | 2020-04-08 | 2020-04-08 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| PCT/CN2021/075524 WO2021203825A1 (en) | 2020-04-08 | 2021-02-05 | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus |
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| CN202010272824.XA CN111447792B (en) | 2020-04-08 | 2020-04-08 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
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| CN111447792B true CN111447792B (en) | 2022-05-13 |
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| CN111447792B (en) * | 2020-04-08 | 2022-05-13 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN114251964A (en) * | 2020-09-19 | 2022-03-29 | 华为技术有限公司 | Temperature equalizing cavity, electronic equipment and method for manufacturing temperature equalizing cavity |
| CN113811159A (en) * | 2021-09-14 | 2021-12-17 | 维沃移动通信有限公司 | Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment |
| CN113891620B (en) * | 2021-09-27 | 2023-05-23 | 联想(北京)有限公司 | Heat abstractor and electronic equipment |
| CN114396818A (en) * | 2022-02-10 | 2022-04-26 | 嵊州天脉导热科技有限公司 | VC soaking plate cover plate heat dissipation module |
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| CN210108104U (en) * | 2019-05-24 | 2020-02-21 | 爱美达（上海）热能系统有限公司 | Temperature equalizing plate |
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| CN111447792B (en) * | 2020-04-08 | 2022-05-13 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
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| WO2021203825A1 (en) | 2021-10-14 |
| CN111447792A (en) | 2020-07-24 |
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