CN113811159A - Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment - Google Patents
Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment Download PDFInfo
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- CN113811159A CN113811159A CN202111075483.8A CN202111075483A CN113811159A CN 113811159 A CN113811159 A CN 113811159A CN 202111075483 A CN202111075483 A CN 202111075483A CN 113811159 A CN113811159 A CN 113811159A
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- capillary structure
- upper cover
- cover body
- heat dissipation
- housing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 92
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 41
- 238000005530 etching Methods 0.000 claims description 20
- 238000011049 filling Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
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- 238000009833 condensation Methods 0.000 description 13
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- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910001069 Ti alloy Inorganic materials 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
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- 239000010935 stainless steel Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
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- 229910001256 stainless steel alloy Inorganic materials 0.000 description 5
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- 229910002651 NO3 Inorganic materials 0.000 description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 2
- 241000221535 Pucciniales Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
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- 230000001788 irregular Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
Abstract
The application discloses mainboard upper cover of electronic equipment, a manufacturing method thereof and electronic equipment, the mainboard upper cover of the electronic equipment comprises: an upper cover body and a working medium; one side of the upper cover body extends along the thickness direction to form a first capillary structure with preset thickness, the first capillary structure is positioned in a heat dissipation cavity, and the working medium is filled in the heat dissipation cavity; the working medium is heated and vaporized, fills the heat dissipation cavity in a gas form, is condensed when meeting cold, and flows along the first capillary structure in a liquid form.
Description
Technical Field
The application belongs to the technical field of electronics, and particularly relates to an upper cover of a mainboard of electronic equipment, a manufacturing method of the upper cover and the electronic equipment.
Background
With the progress of science and technology, the popularity of electronic devices is higher and higher. Along with the upgrading of electronic equipment, the heating power is increased, and therefore the heat dissipation performance of the electronic equipment is more and more emphasized. In the prior art, the electronic device is mainly cooled by sticking graphite cooling fins or adopting heat pipes and other modes, and the whole height of the upper cover of the mainboard in the electronic device is higher while the upper cover of the mainboard has a cooling function, so that the electronic device is larger in size and not beneficial to the light and thin design of the electronic device.
Disclosure of Invention
The present application is directed to a motherboard cover of an electronic device, a manufacturing method thereof, and an electronic device, which can solve the problem that the structure size of the electronic device is affected in order to have a heat dissipation function in the conventional motherboard cover.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides an upper cover of a motherboard of an electronic device, including: an upper cover body and a working medium;
one side of the upper cover body extends along the thickness direction to form a first capillary structure with preset thickness, the first capillary structure is positioned in a heat dissipation cavity, and the working medium is filled in the heat dissipation cavity;
the working medium is heated and vaporized, fills the heat dissipation cavity in a gas form, is condensed when meeting cold, and flows along the first capillary structure in a liquid form.
According to the mainboard upper cover of the electronic equipment provided by the embodiment of the application, the thickness of the first capillary structure is equal to the thickness of the upper cover body, the mainboard upper cover further comprises a first shell and a second shell, the first shell is arranged on one side of the upper cover body, the second shell is arranged on the other side of the upper cover body, and the first shell and the second shell are arranged on the first capillary structure in a covering mode.
According to the mainboard upper cover of the electronic equipment provided by the embodiment of the application, the thickness of the first capillary structure is smaller than that of the upper cover body, the mainboard upper cover further comprises a first shell, the first shell is arranged on one side of the upper cover body, and the first capillary structure is arranged in a covering mode.
According to the mainboard upper cover of the electronic equipment provided by the embodiment of the application, the other side of the upper cover body is provided with the heat conduction layer.
According to the mainboard upper cover of electronic equipment that this application embodiment provided, mainboard upper cover still includes first casing and second capillary structure, one side of upper cover body is formed with the recess, the second capillary structure is located in the recess, first casing is located one side of upper cover body, and the lid is located the second capillary structure to form airtight cavity, airtight cavity is filled there is working medium.
According to the mainboard upper cover of the electronic equipment, the first capillary structure and/or the second capillary structure comprise a base layer and a plurality of bulges arranged on the base layer in a protruding mode, and the bulges are arranged at intervals;
and a groove is formed between every two adjacent bulges, and the working medium is positioned in the groove.
In a second aspect, an embodiment of the present application provides an electronic device, including: the mainboard upper cover.
In a third aspect, an embodiment of the present application provides a method for manufacturing a motherboard upper cover of an electronic device, including:
a first capillary structure with a preset thickness is formed on one side of the upper cover body in an etching mode along the thickness direction;
placing the first capillary structure in a heat dissipation cavity;
filling a working medium in the heat dissipation cavity;
the working medium is heated and vaporized, fills the heat dissipation cavity in a gas form, is condensed when meeting cold, and flows along the first capillary structure in a liquid form.
According to the manufacturing method of the upper cover of the main board of the electronic device, under the condition that the thickness of the first capillary structure is equal to that of the upper cover body, the first capillary structure is placed in the heat dissipation cavity, and the manufacturing method comprises the following steps:
and arranging a first shell on one side of the upper cover body, arranging a second shell on the other side of the upper cover body, and covering the first shell and the second shell on the first capillary structure.
According to the manufacturing method of the upper cover of the main board of the electronic device, when the thickness of the first capillary structure is smaller than the thickness of the upper cover body, the placing of the first capillary structure in the heat dissipation cavity includes:
and arranging a first shell on one side of the upper cover body, and covering the first capillary structure.
According to the manufacturing method of the upper cover of the main board of the electronic equipment provided by the embodiment of the application, the method further comprises the following steps:
a groove is formed on one side of the upper cover body in an etching mode;
arranging a second capillary structure in the groove;
arranging a first shell on one side of the upper cover body, and covering the first shell on the second capillary structure to form a closed cavity;
and filling the working medium in the closed cavity.
In the embodiment of the application, one side of the upper cover body extends along the thickness direction to form a first capillary structure with preset thickness, the first capillary structure is located in the heat dissipation cavity, the working medium in the heat dissipation cavity dissipates heat of a heat source in the electronic equipment through the processes of circulating evaporation and condensation, and the upper cover body is used as a carrier for bearing the first capillary structure, so that the overall height of the upper cover of the mainboard can be effectively reduced, and the upper cover of the mainboard has the design requirements of heat dissipation function and light weight.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is one of the partial schematic diagrams of a motherboard upper cover of an electronic device according to an embodiment of the present application;
fig. 2 is a second partial schematic diagram of a motherboard cover of an electronic device according to an embodiment of the present application;
fig. 3 is a third partial schematic view of a motherboard upper cover of an electronic device according to an embodiment of the present application;
fig. 4 is a flowchart of a method of manufacturing a motherboard upper cover of an electronic device according to an embodiment of the present application;
reference numerals:
1: an upper cover body; 2: a first capillary structure;
3: a first housing; 4: a second housing;
5: a second capillary structure.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the features of the terms "first", "second", and the like may explicitly or implicitly include one or more of the features.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
A motherboard upper cover of an electronic device according to an embodiment of the present application is described below with reference to fig. 1 to 3.
As shown in fig. 1, the motherboard upper cover of the electronic device in the embodiment of the present application includes: the upper cover body 1 and a working medium.
One side of the upper cover body 1 extends along the thickness direction to form a first capillary structure 2 with a preset thickness, the first capillary structure 2 is positioned in the heat dissipation cavity, and the heat dissipation cavity is filled with a working medium.
Wherein, the working medium is heated and vaporized, and fills the heat dissipation cavity in a gas form, and the working medium is condensed when meeting cold and flows along the first capillary structure 2 in a liquid form.
Specifically, the shape of the upper lid body 1 may be square, circular, polygonal, or the like, and the shape of the upper lid body 1 is not particularly limited.
One side of the upper cover body 1 extends along the thickness direction to form the first capillary structure 2 with a preset thickness, that is, the thickness of the first capillary structure 2 is the same as that of the upper cover body 1, or the thickness of the first capillary structure 2 is smaller than that of the upper cover body 1, and the thickness of the first capillary structure 2 is set according to actual requirements, which is not specifically limited herein.
The first capillary structure 2 may be formed at one side of the upper cap body 1 through an etching process.
The first capillary structure 2 formed by the etching process has good aperture consistency, and the higher consistency can make the liquid flow smoother, so that the capillary action of the first capillary structure 2 can be fully exerted.
When the shape of the upper cap body 1 is irregular, the first capillary structure 2 may be formed by an etching process, and when the thickness of the upper cap body 1 is small, the first capillary structure 2 may be formed to be ultra-thin by an etching process. Therefore, the first capillary structure 2 is formed by the etching process, which not only ensures the uniformity of the aperture of the first capillary structure 2, but also can satisfy diversified requirements.
Can set up with first capillary structure 2 assorted apron, cover the apron and locate the position at first capillary structure 2 on the upper cover body 1, form the heat dissipation cavity, first capillary structure 2 is arranged in the heat dissipation cavity, carries out the evacuation to the heat dissipation cavity earlier, fills working medium in to the heat dissipation cavity again.
The working medium comprises pure water and additives. In order to achieve the anti-rusting effect, the working medium is added with an additive for resisting rusting besides pure water.
The additive can be ethylene glycol, diethylene glycol, propylene glycol, nitrate, sulfate, methylbenzotriazole, polytriazole or thiobenzene, and the type of the additive is selected according to actual requirements.
Working medium in the heat dissipation cavity directly contacts with first capillary structure 2 and apron, and the material of the last first capillary structure 2 of electronic equipment is copper or copper alloy etc. usually, and this type of material easily rusts with the water contact, and the additive can effectively prevent the corrosion of water to first capillary structure 2 and apron to improve the life of mainboard upper cover.
The following describes a heat dissipation process of the motherboard upper cover of the electronic device.
Electronic devices are often provided with a large number of electrical components, wherein high power electrical components constitute a heat source in the electronic device. The mainboard upper cover contacts with a heat source in the electronic equipment, the heat of the heat source is transferred to the heat dissipation cavity along the mainboard upper cover, a working medium in the heat dissipation cavity is heated, vaporized and evaporated into gas to fill the heat dissipation cavity in a gas form, and after the gas flows to a position with relatively low temperature, such as a cover plate, the gas is condensed into liquid, and the liquid can flow to a position with relatively high temperature through the reflux capacity of the first capillary structure 2.
The working medium is heated and evaporated to absorb a large amount of heat in the process of gas, the gas is cooled and condensed to emit a large amount of heat in the process of liquid, and the heat is dissipated to the external environment from the cover plate.
The evaporation and condensation process is performed in the heat dissipation cavity repeatedly, so that the upper cover of the mainboard can effectively dissipate the heat of the heat source, and the heat accumulation in the electronic equipment is avoided.
According to the position and the number of heat sources in the electronic device, a plurality of first capillary structures 2 can be arranged on the upper cover body 1, and the number, the shape and the size of the first capillary structures 2 are not particularly limited and are arranged according to the use requirement.
In the prior art, a heat source in an electronic device is usually cooled by attaching a vapor chamber to an upper cover of a motherboard, the vapor chamber being in contact with the heat source, and the heat source is cooled by the vapor chamber. Pasting the soaking plate on the mainboard upper cover can lead to the whole height of mainboard upper cover to increase, further leads to electronic equipment's structural dimension increase.
In this application embodiment, one side of the upper cover body 1 extends along the thickness direction to form the first capillary structure 2 with a preset thickness, the first capillary structure 2 is located in the heat dissipation cavity, the working medium in the heat dissipation cavity dissipates heat of a heat source in the electronic device through the processes of circulating evaporation and condensation, and the upper cover body 1 is used as a carrier for bearing the first capillary structure 2, so that the overall height of the upper cover of the main board can be effectively reduced, and the upper cover of the main board has the design requirements of heat dissipation function and light weight.
In an alternative embodiment, the thickness of the first capillary structure 2 is equal to the thickness of the upper cover body 1, the main board upper cover further includes a first housing 3 and a second housing 4, the first housing 3 is disposed on one side of the upper cover body 1, the second housing 4 is disposed on the other side of the upper cover body 1, and the first housing 3 and the second housing 4 are disposed on the first capillary structure 2 in a covering manner.
As shown in fig. 1, specifically, the first capillary structure 2 is formed by an etching process along one surface of the upper cap body 1 to the opposite other surface of the upper cap body 1, and the first capillary structure 2 penetrates through both the opposite surfaces of the upper cap body 1, whereby the thickness of the first capillary structure 2 is equal to the thickness of the upper cap body 1.
The shape and size of the first housing 3 and the shape and size of the second housing 4 may be the same or different, and are specifically set according to actual requirements.
In the case where the upper cover body 1 is a regular square body, the first housing 3 may be a flat plate, and the second housing 4 may also be a flat plate. In the case that the shape of the upper cover body 1 is irregular, the shapes of the first housing 3 and the second housing 4 are set based on the shape of the upper cover body 1, so that a heat dissipation cavity can be formed after the first housing 3 and the second housing 4 are covered on both sides of the upper cover body 1.
The first shell 3 can be fixed on one side of the upper cover body 1 in a bonding or welding mode, the first shell 3 completely covers one side of the first capillary structure 2, the second shell 4 can also be fixed on the other side of the upper cover body 1 in a bonding or welding mode, and the second shell 4 completely covers the other side of the first capillary structure 2, so that the first capillary structure 2 is positioned in a heat dissipation cavity formed by the first shell 3 and the second shell 4, and after the heat dissipation cavity is vacuumized, a working medium is filled in the heat dissipation cavity.
One of the first housing 3 and the second housing 4 is for contacting a heat source. The first casing 3 and the second casing 4 may be made of the same material, and the first casing 3 and the second casing 4 may be made of different materials.
For example, the first housing 3 is close to the heat source, and the material of the first housing 3 may be a metal with good heat conductivity, such as copper or copper alloy, so that the heat of the heat source is rapidly transferred to the heat dissipation cavity through the first housing 3. The second housing 4 is far from the heat source, and the material of the second housing 4 may be stainless steel or titanium alloy, etc. which have high strength, so as to ensure the strength of the plate body of the second housing 4.
The material of second casing 4 can be stainless steel or the higher metal of intensity such as titanium alloy, has improved the intensity of mainboard upper cover for the difficult plate body that takes place of mainboard upper cover in the use is sunken, thereby ensures that working medium's circulation can go on smoothly.
For example, the second housing 4 is close to the heat source, and the material of the second housing 4 may be a metal with good heat conductivity, such as copper or copper alloy, so that the heat of the heat source is transferred to the heat dissipation cavity through the second housing 4. The first housing 3 is far away from the heat source, and the material of the first housing 3 may be stainless steel or titanium alloy, etc. which have higher strength, so as to improve the strength of the plate body of the first housing 3.
The material of first casing 3 can be stainless steel or the higher metal of intensity such as titanium alloy, has improved the intensity of mainboard upper cover for the difficult plate body that takes place of mainboard upper cover in the use is sunken, thereby ensures that working medium's circulation can go on smoothly.
The heat dissipation process of the motherboard upper cover is explained below.
For example, the first housing 3 is made of copper or copper alloy, the second housing 4 is made of stainless steel or titanium alloy, the first housing 3 is in contact with a heat source in the electronic device, heat of the heat source is transferred into a heat dissipation cavity along the first housing 3, a working medium in the heat dissipation cavity is heated and evaporated into gas, and when the gas flows to a position where the second housing 4 is located, the gas is condensed into liquid because of a relatively low temperature at the second housing 4, and then the liquid flows back to the position where the first housing 3 is located through the backflow capability of the first capillary structure 2.
For example, the first housing 3 is made of stainless steel or titanium alloy, the second housing 4 is made of copper or copper alloy, the second housing 4 is in contact with a heat source in the electronic device, heat of the heat source is transferred into a heat dissipation cavity along the second housing 4, a working medium in the heat dissipation cavity is heated and evaporated into gas, and when the gas flows to the position where the first housing 3 is located, the gas is condensed into liquid because of a relatively low temperature at the position where the first housing 3 is located, and then the liquid flows back to the position where the second housing 4 is located through the backflow capability of the first capillary structure 2.
Therefore, the working medium dissipates the heat of the heat source through the continuous circulation of the evaporation and condensation process, and avoids heat accumulation in the electronic equipment. The first capillary structure 2 penetrates through two opposite surfaces of the upper cover body 1, and the working medium has enough space for carrying out circulating evaporation and condensation processes, so that heat dissipation is facilitated, and the mainboard upper cover has better heat dissipation efficiency.
In the embodiment of the present application, the first capillary structure 2 penetrates through two opposite surfaces of the upper cover body 1, the first capillary structure 2 is covered by the first housing 3 and the second housing 4, one of the first housing 3 and the second housing 4 is used for contacting a heat source, a working medium dissipates heat of the heat source through a continuous circulation evaporation and condensation process, the thickness of the first capillary structure 2 is equal to that of the upper cover body 1, which is beneficial to accelerating the circulation speed of the working medium in the heat dissipation cavity, so that the mainboard upper cover has better heat dissipation efficiency.
In an alternative embodiment, the thickness of the first capillary structure 2 is smaller than that of the upper cover body 1, the main board upper cover further includes a first housing 3, the first housing 3 is disposed on one side of the upper cover body 1, and the first capillary structure 2 is covered by the first housing 3.
As shown in fig. 2, specifically, the first capillary structure 2 is formed by an etching process in a direction perpendicular to one surface of the cap body 1, and the thickness of the first capillary structure 2 is smaller than that of the cap body 1.
The size of first casing 3 and the size looks adaptation of first capillary structure 2, first casing 3 can be fixed in one side of upper cover body 1 through bonding or welded mode, and first casing 3 can cover first capillary structure 2 completely, and first capillary structure 2 is arranged in the heat dissipation cavity that first casing 3 and upper cover body 1 formed from this, carries out the evacuation to the heat dissipation cavity after, fills working medium in to the heat dissipation cavity.
The material of the first housing 3 is set according to the use requirement.
For example, the first housing 3 may be made of a metal with high strength, such as stainless steel or titanium alloy, so as to improve the strength of the plate body of the first housing 3, thereby further improving the strength of the motherboard upper cover.
The upper cover body 1 is in contact with a heat source in the electronic device, heat of the heat source is transferred to the heat dissipation cavity along the upper cover body 1, a working medium in the heat dissipation cavity is heated and evaporated into gas, when the gas flows to the position where the first shell 3 is located, because the temperature at the position of the first shell 3 is relatively low, after the gas is condensed into liquid, the liquid flows back to the position where the upper cover body 1 facing the first capillary structure 2 through the backflow capacity of the first capillary structure 2.
For example, the material of the first housing 3 may be copper or copper alloy. The first shell 3 is in contact with a heat source in the electronic device, heat of the heat source is transferred to the heat dissipation cavity along the first shell 3, a working medium in the heat dissipation cavity is heated and evaporated into gas, when the gas flows to the position of the upper cover body 1, the gas is condensed into liquid because the temperature of the upper cover body 1 is relatively low, and then the liquid flows back to the position of the first shell 3 through the backflow capacity of the first capillary structure 2.
Therefore, the working medium can dissipate the heat of the heat source through the continuous circulation of the evaporation and condensation processes.
In this application embodiment, form first capillary structure 2 through etching process along a surface of upper cover body 1, the thickness of first capillary structure 2 is less than the thickness of upper cover body 1, the partial region of upper cover body 1 relative with first capillary structure 2 becomes the carrier that bears first capillary structure 2, only need set up a first casing 3 in one side of upper cover body 1 and the corresponding position of first capillary structure 2 and can form a heat dissipation cavity, the equipment process of mainboard upper cover has been simplified from this, the convenience of mainboard upper cover equipment has been improved, also be favorable to reducing the overall height of mainboard upper cover simultaneously.
In an alternative embodiment, the other side of the upper cover body 1 is provided with a heat conducting layer.
The heat conducting layer can be a heat conducting silica gel gasket, heat conducting gel or a copper plating layer formed through a copper plating process.
For example, the heat conduction layer is a heat conduction silica gel gasket, the heat conduction silica gel gasket can be fixed on the other side of the upper cover body 1 in a bonding mode, and the heat conduction silica gel gasket is arranged opposite to the first capillary structure 2.
For example, a copper plated layer is formed on the other side of the upper cap body 1 through a copper plating process, the thickness of the copper plated layer is set according to actual requirements, and the copper plated layer is disposed opposite to the first capillary structure 2. The copper plating layer has a thermal conductive property and can improve the strength of the upper lid body 1.
The upper cover body 1 contacts with a heat source in the electronic equipment, the heat of the heat source can be rapidly transmitted to the upper cover body 1 by the heat conduction silica gel gasket or the copper plating layer arranged on the other side of the upper cover body 1, the process that the working medium close to one side of the upper cover body is heated and evaporated into gas in the heat dissipation cavity is accelerated, the circulation process of evaporation and condensation of the working medium in the heat dissipation cavity is accelerated, heat dissipation is further accelerated, and the heat dissipation efficiency of the upper cover of the mainboard is improved.
In this application embodiment, the opposite side of upper cover body 1 is equipped with the heat-conducting layer, and the heat-conducting layer can transmit the heat of heat source to upper cover body 1 department fast, has accelerated the circulation process of working medium evaporation and condensation in the heat dissipation cavity to the radiating efficiency of mainboard upper cover has been improved.
In an optional embodiment, in order to further improve the heat exchange effect of the main board upper cover, the main board upper cover further includes a first housing 3 and a second capillary structure 5, a groove is formed on one side of the upper cover body 1, the second capillary structure 5 is disposed in the groove, the first housing 3 is disposed on one side of the upper cover body 1, and the second capillary structure 5 is disposed in the cover to form a closed cavity, and the closed cavity is filled with a working medium.
Specifically, a groove is formed by an etching process in a direction perpendicular to one surface of the upper cap body 1, and the size of the groove is set according to actual requirements.
The thickness of the second capillary structure 5 may be the same as the depth of the groove, the thickness of the second capillary structure 5 may also be greater than the depth of the groove, and the thickness of the second capillary structure 5 is set according to actual requirements.
As shown in fig. 3, for example, the thickness of the second capillary structure 5 is the same as the depth of the groove, the second capillary structure 5 is placed in the groove, one surface of the first housing 3 is attached to the upper cover body 1, the first housing 3 covers the position of the groove, the first housing 3 can be fixed to the upper cover body 1 by bonding or welding, and thus, the first housing 3 and the groove form a sealed cavity, the second capillary structure 5 is located in the sealed cavity, and the sealed cavity is filled with a working medium.
For example, the thickness of the second capillary structure 5 is larger than the depth of the groove, and the first housing 3 may be formed with a receiving cavity by a stamping process, and the receiving cavity and the groove are matched. The second capillary structure 5 is placed in the groove, the first shell 3 is covered at the position of the groove, when the first shell 3 and the upper cover body 1 are covered, the groove wall of the groove is connected with the cavity wall of the containing cavity, the groove and the containing cavity form a closed cavity, the second capillary structure 5 is located in the closed cavity, and the working medium is filled in the closed cavity.
In this application embodiment, form the recess through etching process in one side of upper cover body 1, lay second capillary structure 5 in the recess, locate one side of upper cover body 1 with first casing 3 lid again, accomplish the equipment of mainboard upper cover from this, be favorable to improving the packaging efficiency of mainboard upper cover.
In an alternative embodiment, the first capillary structure 2 and the second capillary structure 5 have the same structure, and the first capillary structure 2 is taken as an example for description.
The first capillary structure 2 comprises a base layer and a plurality of bulges arranged on the base layer in a protruding mode, and the bulges are arranged at intervals;
wherein, a groove is formed between two adjacent bulges, and the working medium is positioned in the groove.
Specifically, the base layer is flat, the protrusions may be trapezoidal, and adjacent protrusions are spaced apart from each other, so that an inverted trapezoidal groove is formed between every two adjacent protrusions.
Under the condition that the thickness of the first capillary structure 2 is equal to that of the upper cover body 1, one end, away from the base layer, of the protrusion is attached to the first shell 3, and the base layer is attached to the second shell 4.
Alternatively, the first capillary structure 2 is a net structure.
Wherein, the reticular structure can ensure that the capillary structure has good capillary force.
Specifically, the first capillary structure 2 comprises a base body, wherein the base body is in a net shape, a plurality of meshes are arranged on the base body, and the size of the meshes is 20-100 μm.
The first capillary structure 2 may have a plurality of base bodies, which are sequentially arranged in a stacked manner in the thickness direction of the upper cap body 1.
In an alternative embodiment, the first capillary structure 2 includes at least two heat-conducting rings and at least one heat-conducting connecting rib, the at least two heat-conducting rings are sequentially arranged at intervals along the thickness direction of the upper cover body 1, and each heat-conducting connecting rib is connected with the at least two heat-conducting rings, so that the capillary structure can generate a capillary force.
When the upper cover body 1 is heated, the working medium at the heated end, namely the evaporation end, is heated, evaporated and gasified to form steam, the steam flows to the condensation end along a steam channel in the capillary structure under a slight pressure difference to release heat, and the steam is condensed into liquid on the whole inner surface of the condensation end; and liquid flows to the hookup location of heat conduction ring and heat conduction splice bar around the heat conduction ring rather than contact under capillary structure's the capillary effect to flow back to the evaporation end along each heat conduction splice bar, so circulation, thereby realize giving off to the heat of passing to upper cover body 1.
In addition, an embodiment of the present application further provides an electronic device, including: the mainboard upper cover.
The electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like. The embodiment of the present application does not specifically limit the specific type of the electronic device.
It should be noted that, the electronic device using the motherboard upper cover has a heat dissipation function, and at the same time, the electronic device meets the design requirement of being light and thin, and is more convenient and fast to assemble.
In addition, as shown in fig. 4, an embodiment of the present application further provides a method for manufacturing a motherboard upper cover of an electronic device, including:
s100, etching and forming a first capillary structure 2 with a preset thickness on one side of an upper cover body 1 along the thickness direction;
that is, the thickness of the first capillary structure 2 is the same as that of the upper cover body 1, or the thickness of the first capillary structure 2 is smaller than that of the upper cover body 1, and the thickness of the first capillary structure 2 is set according to actual requirements, and is not particularly limited herein.
The first capillary structure 2 formed by the etching process has good aperture consistency, and the higher consistency can make the liquid flow smoother, so that the capillary action of the first capillary structure 2 can be fully exerted.
S200, placing the first capillary structure 2 in a heat dissipation cavity;
can set up with first capillary structure 2 assorted apron, cover the apron and locate the position at first capillary structure 2 on the upper cover body 1, form the heat dissipation cavity, first capillary structure 2 is located in the heat dissipation cavity.
S300, filling working media in the heat dissipation cavity;
the heat dissipation cavity is vacuumized, and then working media are filled into the heat dissipation cavity.
Wherein, the working medium is heated and vaporized, the heat dissipation cavity is filled with the working medium in a gas form, and the working medium is condensed when meeting cold and flows along the first capillary structure 2 in a liquid form.
It should be noted that the working medium includes pure water and additives. In order to achieve the anti-rusting effect, the working medium is added with an additive for resisting rusting besides pure water.
The additive can be ethylene glycol, diethylene glycol, propylene glycol, nitrate, sulfate, methylbenzotriazole, polytriazole or thiobenzene, and the type of the additive is selected according to actual requirements.
Working medium in the heat dissipation cavity directly contacts with upper cover body 1 and apron, and the material of upper cover body 1 is copper or copper alloy etc. usually in the electronic equipment, and this type of material easily rusts with the water contact, and the additive can effectively prevent the corrosion of water to upper cover body 1 and apron to improve the life of mainboard upper cover.
In this application embodiment, one side of the upper cover body 1 extends along the thickness direction to form the first capillary structure 2 with a preset thickness, the first capillary structure 2 is located in the heat dissipation cavity, the working medium in the heat dissipation cavity dissipates heat of a heat source in the electronic device through the processes of circulating evaporation and condensation, and the upper cover body 1 is used as a carrier for bearing the first capillary structure 2, so that the overall height of the upper cover of the main board can be effectively reduced, and the upper cover of the main board has the design requirements of heat dissipation function and light weight.
In an alternative embodiment, in the case that the thickness of the first capillary structure 2 is equal to that of the upper cover body 1, placing the first capillary structure 2 in the heat dissipation cavity includes:
the first shell 3 is arranged on one side of the upper cover body 1, the second shell 4 is arranged on the other side of the upper cover body 1, and the first shell 3 and the second shell 4 are arranged on the first capillary structure 2 in a covering mode.
Specifically, the first capillary structure 2 is formed by an etching process along one surface of the upper cap body 1 to the opposite other surface of the upper cap body 1, and the first capillary structure 2 penetrates through both the opposite surfaces of the upper cap body 1, whereby the thickness of the first capillary structure 2 is equal to the thickness of the upper cap body 1.
The first shell 3 can be fixed on one side of the upper cover body 1 in a bonding or welding mode, the first shell 3 completely covers one side of the first capillary structure 2, the second shell 4 can also be fixed on the other side of the upper cover body 1 in a bonding or welding mode, and the second shell 4 completely covers the other side of the first capillary structure 2, so that the first capillary structure 2 is positioned in a heat dissipation cavity formed by the first shell 3 and the second shell 4, and after the heat dissipation cavity is vacuumized, a working medium is filled in the heat dissipation cavity.
In an alternative embodiment, in the case that the thickness of the first capillary structure 2 is smaller than that of the upper cover body 1, placing the first capillary structure 2 in the heat dissipation cavity includes:
the first housing 3 is disposed on one side of the upper cover body 1, and covers the first capillary structure 2.
Specifically, the first capillary structure 2 is formed by an etching process in a direction perpendicular to one surface of the upper cap body 1, and the thickness of the first capillary structure 2 is smaller than that of the upper cap body 1.
The size of first casing 3 and the size looks adaptation of first capillary structure 2, first casing 3 can be fixed in one side of upper cover body 1 through bonding or welded mode, and first casing 3 can cover first capillary structure 2 completely, and first capillary structure 2 is arranged in the heat dissipation cavity that first casing 3 and upper cover body 1 formed from this, carries out the evacuation to the heat dissipation cavity after, fills working medium in to the heat dissipation cavity.
In an alternative embodiment, the other side of the upper cover body 1 is provided with a heat conducting layer. The heat conducting layer can be a heat conducting silica gel gasket, heat conducting gel or a copper plating layer formed through a copper plating process.
The upper cover body 1 contacts with a heat source in the electronic equipment, the heat of the heat source can be rapidly transmitted to the upper cover body 1 by the heat conduction silica gel gasket or the copper plating layer arranged on the other side of the upper cover body 1, the process that the working medium close to one side of the upper cover body is heated and evaporated into gas in the heat dissipation cavity is accelerated, the circulation process of evaporation and condensation of the working medium in the heat dissipation cavity is accelerated, heat dissipation is further accelerated, and the heat dissipation efficiency of the upper cover of the mainboard is improved.
In an alternative embodiment, the method for manufacturing a motherboard upper cover of an electronic device further includes:
a groove is formed on one side of the upper cover body 1 in an etching mode;
a groove is formed by an etching process in a direction perpendicular to one surface of the upper cap body 1, and the size of the groove is set according to actual requirements.
Arranging the second capillary structure 5 in the groove;
the thickness of the second capillary structure 5 may be the same as the depth of the groove, the thickness of the second capillary structure 5 may also be greater than the depth of the groove, and the thickness of the second capillary structure 5 is set according to actual requirements.
Arranging the first shell 3 at one side of the upper cover body 1, and covering the first shell on the second capillary structure 5 to form a closed cavity;
after the second capillary structure 5 is placed in the groove, one surface of the first shell 3 is attached to the upper cover body 1, the first shell 3 covers the position of the groove, the first shell 3 can be fixed to the upper cover body 1 in a bonding or welding mode, therefore, the first shell 3 and the groove form a closed cavity, the second capillary structure 5 is located in the closed cavity, and the closed cavity is filled with a working medium.
And filling the working medium in the closed cavity.
The sealed cavity is vacuumized and filled with working medium.
It should be noted that, the main board upper cover is provided with the first capillary structure 2 and the second capillary structure 5 at the same time, so that the heat exchange effect of the main board upper cover can be further improved.
The first capillary structure 2 and the second capillary structure 5 have the same structure, and the first capillary structure 2 will be described as an example.
The first capillary structure 2 comprises a base layer and a plurality of bulges arranged on the base layer in a protruding mode, and the bulges are arranged at intervals;
wherein, a groove is formed between two adjacent bulges, and the working medium is positioned in the groove.
Specifically, the base layer is flat, the protrusions may be trapezoidal, and adjacent protrusions are spaced apart from each other, so that an inverted trapezoidal groove is formed between every two adjacent protrusions.
In the description herein, references to the description of the term "alternative implementations" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. A motherboard cover for an electronic device, comprising: an upper cover body and a working medium;
one side of the upper cover body extends along the thickness direction to form a first capillary structure with preset thickness, the first capillary structure is positioned in a heat dissipation cavity, and the working medium is filled in the heat dissipation cavity;
the working medium is heated and vaporized, fills the heat dissipation cavity in a gas form, is condensed when meeting cold, and flows along the first capillary structure in a liquid form.
2. The motherboard cover as recited in claim 1, wherein the thickness of the first capillary structure is equal to the thickness of the cover body, the motherboard cover further comprises a first housing and a second housing, the first housing is disposed on one side of the cover body, the second housing is disposed on the other side of the cover body, and the first housing and the second housing cover the first capillary structure.
3. The motherboard cover as recited in claim 1, wherein a thickness of the first capillary structure is smaller than a thickness of the cover body, the motherboard cover further comprising a first housing disposed on a side of the cover body and covering the first capillary structure.
4. A motherboard cover as recited in claim 3, characterized in that the other side of the cover body is provided with a heat conductive layer.
5. The motherboard upper cover according to claim 1, further comprising a first housing and a second capillary structure, wherein a groove is formed on one side of the upper cover body, the second capillary structure is disposed in the groove, the first housing is disposed on one side of the upper cover body, and covers the second capillary structure to form a sealed cavity, and the sealed cavity is filled with the working medium.
6. The main board cover according to claim 5, wherein the first capillary structure and/or the second capillary structure comprises a base layer and a plurality of protrusions protruding from the base layer, the plurality of protrusions being spaced apart from each other;
and a groove is formed between every two adjacent bulges, and the working medium is positioned in the groove.
7. An electronic device, comprising the motherboard upper cover according to any one of claims 1 to 6.
8. A method for manufacturing an upper cover of a main board of an electronic device, comprising:
a first capillary structure with a preset thickness is formed on one side of the upper cover body in an etching mode along the thickness direction;
placing the first capillary structure in a heat dissipation cavity;
filling a working medium in the heat dissipation cavity;
the working medium is heated and vaporized, fills the heat dissipation cavity in a gas form, is condensed when meeting cold, and flows along the first capillary structure in a liquid form.
9. The method of manufacturing a motherboard cover according to claim 8, wherein the placing of the first capillary structure in a heat dissipation cavity under the condition that the thickness of the first capillary structure is equal to the thickness of the cover body comprises:
and arranging a first shell on one side of the upper cover body, arranging a second shell on the other side of the upper cover body, and covering the first shell and the second shell on the first capillary structure.
10. The method of manufacturing a motherboard cover according to claim 8, wherein in a case where a thickness of the first capillary structure is smaller than a thickness of the cover body, the placing the first capillary structure in a heat dissipation cavity comprises:
and arranging a first shell on one side of the upper cover body, and covering the first capillary structure.
11. A method of manufacturing a motherboard cover as recited in claim 8, further comprising:
a groove is formed on one side of the upper cover body in an etching mode;
arranging a second capillary structure in the groove;
arranging a first shell on one side of the upper cover body, and covering the first shell on the second capillary structure to form a closed cavity;
and filling the working medium in the closed cavity.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111075483.8A CN113811159A (en) | 2021-09-14 | 2021-09-14 | Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111075483.8A CN113811159A (en) | 2021-09-14 | 2021-09-14 | Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment |
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| CN110402068A (en) * | 2019-07-27 | 2019-11-01 | Oppo广东移动通信有限公司 | The assemble method of electronic equipment and electronic equipment |
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| CN111447792A (en) * | 2020-04-08 | 2020-07-24 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
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| CN105658032A (en) * | 2016-01-22 | 2016-06-08 | 白鹏飞 | Ultrathin soaking plate and manufacturing method thereof |
| CN110402068A (en) * | 2019-07-27 | 2019-11-01 | Oppo广东移动通信有限公司 | The assemble method of electronic equipment and electronic equipment |
| CN111163621A (en) * | 2020-01-14 | 2020-05-15 | 华为技术有限公司 | High-strength vapor chamber, preparation method thereof and electronic equipment |
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