CN216058030U - Ultra-thin VC copper sheet heat dissipation plate for 5G mobile phone - Google Patents
Ultra-thin VC copper sheet heat dissipation plate for 5G mobile phone Download PDFInfo
- Publication number
- CN216058030U CN216058030U CN202122174485.4U CN202122174485U CN216058030U CN 216058030 U CN216058030 U CN 216058030U CN 202122174485 U CN202122174485 U CN 202122174485U CN 216058030 U CN216058030 U CN 216058030U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- copper sheet
- dissipation plate
- lower cover
- mobile phone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone, which belongs to the technical field of heat dissipation plates and comprises an upper cover and a lower cover, wherein the lower cover is covered on the surface of the upper cover, a filling cavity is formed between the upper cover and the lower cover, cooling liquid is filled in the filling cavity, capillary structures are arranged in the upper cover and the lower cover, a wavy support structure is arranged in the filling cavity, and through holes are formed in the side surfaces of the upper part and the lower part of the support structure. According to the ultrathin VC copper sheet heat dissipation plate for the 5G mobile phone, the support structure is arranged into the integrated wavy copper sheet, so that the integral heat dissipation effect of the heat dissipation plate is guaranteed, the support structure is convenient to install, the heat dissipation plate is convenient to process, and the processing time is saved. All set up the through-hole in bearing structure upper portion and the side of lower part, guarantee that the coolant liquid can be full of fast and fill the chamber, bearing structure can not obstruct the flow of coolant liquid.
Description
Technical Field
The utility model relates to the technical field of heat dissipation plates, in particular to an ultrathin VC copper sheet heat dissipation plate for a 5G mobile phone.
Background
The VC copper sheet radiating plate is usually a vacuum cavity soaking plate. In the early stage of heat dissipation of mobile phones, graphite is generally used as a main material, and can be called as first-generation heat dissipation. The liquid cooling of the copper pipe is the second generation heat dissipation technology, and the VC soaking plate is the latest third generation heat dissipation technology. The VC liquid cooling can be regarded as the dimension-increasing technology of the liquid cooling of the copper pipe, and although the two are the principles of gas-liquid phase change, the difference is that the heat pipe only has the linear effective heat conducting capacity in a single direction, and the VC is equivalent to the dimension-increasing from a line to a surface, so that the heat can be better taken away from all directions.
The VC heat dissipation plate is of a sheet structure, heat can be conducted to a plurality of horizontal directions, condensation efficiency is higher, contact area between the VC heat dissipation plate and a heat source and contact area between the VC heat dissipation plate and a heat dissipation medium are larger, and surface temperature can be more uniform. The VC soaking plate can be directly contacted with a heat source without a substrate, so that the thermal resistance can be further reduced.
With the diversification and high performance of the mobile phone, the power consumption of the mobile phone chip is improved, so that the 5G internal structure is designed to be more compact. This means that additional heat dissipation material is required to meet the more heat dissipation requirement of 5G mobile phone. The VC soaking plate has higher heat dissipation efficiency and larger heat dissipation area, and is widely favored by 5G mobile phones. However, the existing heat dissipation plate is usually formed by covering an upper cover and a lower cover, and a plurality of copper columns for supporting are further arranged in the heat dissipation plate, and the copper columns are small in size and are single, so that the heat dissipation plate is complicated in connection with the upper cover or the lower cover in a welding or etching manner, the manufacturing time of the heat dissipation plate is increased, and the process is complicated. Therefore, a new VC copper sheet heat sink is needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide an ultrathin VC copper sheet heat dissipation plate for a 5G mobile phone, and aims to solve the technical problems that an existing heat dissipation plate is inconvenient to install and complex in machining process due to the fact that a copper column is adopted as a supporting structure.
In order to achieve the purpose, the utility model provides an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone, which comprises an upper cover and a lower cover, wherein the lower cover is covered on the surface of the upper cover, a filling cavity is formed between the upper cover and the lower cover, cooling liquid is filled in the filling cavity, capillary structures are arranged in the upper cover and the lower cover, a wavy support structure is arranged in the filling cavity, and through holes are formed in the side surfaces of the upper part and the lower part of the support structure.
Preferably, the supporting structure is a copper sheet capable of being bent freely, and the supporting structure is in contact with the bottom surface of the upper cover and the surface of the lower cover.
Preferably, a bump is arranged on the side surface of the lower cover, a flow channel is etched on the bump, and the flow channel extends to the inside of the lower cover.
Preferably, the capillary structure is provided with a wave-shaped through hole matched with the support structure.
Preferably, the support structure does not contact the inner walls of the upper and lower covers.
Preferably, the cooling liquid is pure water or deionized water.
Preferably, the heat dissipation plate is any one or more of red copper, phosphor bronze or stainless steel.
Preferably, the thickness of the radiating plate is not more than 0.5 mm.
Preferably, the corners of the upper cover and the lower cover are provided with mounting holes.
The technical scheme of the utility model has the beneficial effects that:
the ultrathin VC copper sheet heat dissipation plate for the 5G mobile phone mainly comprises an upper cover, a lower cover, a capillary structure and a supporting structure, wherein a filling cavity is formed between the upper cover and the lower cover, the capillary structure and the supporting structure are arranged in the filling cavity, the capillary structure adopts a copper mesh micro-structure, the supporting structure adopts an integrated wavy copper sheet, the integral heat dissipation effect of the heat dissipation plate is ensured, the supporting structure is also ensured to be convenient to install, the heat dissipation plate is convenient to process, and the processing time is saved. All set up the through-hole in bearing structure upper portion and the side of lower part, guarantee that the coolant liquid can be full of fast and fill the chamber, bearing structure can not obstruct the flow of coolant liquid.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone according to the present invention;
FIG. 2 is a schematic structural diagram of a lower cover of an embodiment of an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone according to the utility model;
FIG. 3 is an exploded view of an embodiment of an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone according to the present invention;
FIG. 4 is a schematic view of a supporting structure of an embodiment of an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone according to the present invention;
fig. 5 is a schematic structural diagram of another embodiment of an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone according to the present invention.
In the figure: 1 upper cover, 11 mounting holes, 2 lower cover, 3 filling cavities, 4 capillary structures, 5 supporting structures, 51 through holes, 6 bulges and 61 flow channels.
Detailed Description
In the following, the embodiments of the present invention will be described in detail with reference to the drawings in the following, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model provides an ultrathin VC copper sheet heat dissipation plate for a 5G mobile phone, which comprises an upper cover 1 and a lower cover 2 covered on the surface of the upper cover, wherein a filling cavity 3 is formed between the upper cover 1 and the lower cover 2, the filling cavity 3 is filled with cooling liquid, capillary structures 4 are arranged in the upper cover 1 and the lower cover 2, a wavy support structure 5 is arranged in the filling cavity 3, and through holes 51 are formed in the side surfaces of the upper part and the lower part of the support structure 5.
The utility model relates to an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone, which is used for dissipating heat of electronic products, such as mobile phones, tablet computers and the like, and mainly comprises an upper cover 1, a lower cover 2, a capillary structure 4 and a supporting structure 5, wherein a filling cavity 3 is formed between the upper cover 1 and the lower cover 2, the capillary structure 4 and the supporting structure 5 are arranged in the filling cavity 3, the upper cover 1 and the lower cover 2 can be made of metal materials, and the copper heat dissipation effect is good, so that the heat dissipation plate adopts a copper sheet, the capillary structure 4 adopts a copper net micro-structure, and the supporting structure adopts a copper sheet, thereby ensuring the integral heat dissipation effect of the heat dissipation plate. The side surfaces of the upper part and the lower part of the supporting structure 5 are provided with the through holes 51, so that the cooling liquid can be filled with the filling cavity quickly, and the supporting structure cannot obstruct the flow of the cooling liquid.
In a preferred embodiment, referring to fig. 1 and 3, the support structure 5 of the VC copper sheet heat sink plate of the present invention is a flexible copper sheet, and the support structure 5 contacts with the bottom surface of the upper cover 1 and the surface of the lower cover 2. The supporting structure 5 mainly plays a role in supporting the upper cover and the lower cover, and prevents deformation in the using process and influence on the using effect; the supporting structure 5 is made of a copper sheet and is arranged into a one-piece wavy structure which can be bent at will, and when the supporting structure is installed, the supporting structure is required to be in contact with the bottom surface of the upper cover 1 and the surface of the lower cover 2 so as to ensure that the supporting function can be achieved; compared with the traditional copper column, the one-piece copper sheet is simple to manufacture, convenient to install and capable of greatly shortening the processing time.
In a preferred embodiment, referring to fig. 1 and 2, the VC copper sheet heat sink plate of the present invention has a bump 6 on a side surface of the lower cover 2, a flow channel 61 is etched on the bump 6, and the flow channel 61 extends to an inside of the lower cover 2. The convex block 6 is arranged on any side surface of the lower cover 2, the flow channel 61 on the convex block 6 is used for ensuring that the cooling liquid can rapidly flow into the heat dissipation plate, and the flow channel 61 can also be arranged into an inclined flow channel.
In a preferred embodiment, referring to fig. 2 and 5, the capillary structure 4 of the VC copper sheet heat sink of the present invention is provided with a wave-shaped through hole 41 corresponding to the support structure 5. The structure of the wavy through holes 41 changes along with the change of the shape of the support structure 5, and the number of the capillary structures 4 can be one or two, as shown in fig. 5, when one capillary structure is arranged, the capillary structure is installed in the upper cover 1, only the support structure is installed in the lower cover 2, and the wavy through holes do not need to be arranged in the capillary structure; when the capillary structure is provided in two, as shown in fig. 2, the capillary structures are installed in the upper cap 1 and the lower cap 2, respectively.
In a preferred embodiment, referring to fig. 1 and 3, the support structure 5 of the VC copper sheet heatsink of the utility model does not contact the inner walls of the upper and lower covers. The inner wall indicates the lateral wall of upper cover and lower cover, and bearing structure 5 does not contact with the inside of upper cover and lower cover when installing, because bearing structure 5 when the installation, transversely installs at the packing intracavity, after bearing structure 5 upper end and lower extreme and the lateral wall of upper cover and lower cover contact, can lead to the coolant liquid to flow very slowly at the packing intracavity, reach quick radiating effect, consequently when setting up, bearing structure 5's upper end and lower extreme do not all contact with the inner wall of upper cover and lower cover.
In a preferred embodiment, the cooling liquid of the VC copper sheet heat dissipation plate of the present invention is pure water or deionized water. The cooling liquid is filled in the filling cavity, and plays a cooling role when the heat dissipation plate circularly dissipates heat.
In a preferred embodiment, the VC copper sheet heat sink plate of the present invention is any one or more of red copper, phosphor bronze or stainless steel.
In a preferred embodiment, the thickness of the VC copper sheet radiating plate is not more than 0.5mm, and the preferred thickness is 0.3 mm.
In a preferred embodiment, referring to fig. 1 and 3, the VC copper sheet heat sink plate of the present invention has mounting holes 11 formed at the corners of the upper cover 1 and the lower cover 2. Four mounting holes 11 are provided, and four fasteners such as screws or bolts are further provided in the mounting holes, mainly for fixing the upper cover 1 and the lower cover 2.
The utility model relates to an ultrathin VC copper sheet heat dissipation plate for a 5G mobile phone, which has the working principle that:
1. the heat dissipation plate base, namely the lower cover 2, is heated, the heat source heats the capillary structure 4 in the heat dissipation plate filling cavity 3, and the capillary structure is a copper mesh micro-body structure, so that a copper mesh micro-evaporator is formed in the heat dissipation plate, and heat absorption is realized;
2. the cooling liquid is heated and quickly evaporated into hot air under the vacuum ultralow pressure environment in the filling cavity 3, and continuously absorbs heat;
3. the VC heat dissipation plate adopts a vacuum technology, hot air circulates more quickly in a copper mesh micro-environment, and heat conduction is realized;
4. the hot air rises after being heated and is radiated after meeting the cold source on the upper part of the radiating plate and is condensed into liquid again to realize radiation;
5. the condensed cooling liquid flows back to an evaporation source at the bottom of the heat dissipation plate through a copper mesh micro-structure capillary pipeline to flow back; the reflowed cooling liquid is heated by the evaporator and then gasified again, and the heat absorption, heat conduction and heat dissipation are carried out through the capillary structure, and the steps are repeated, so that the heat dissipation of the heat dissipation plate is realized.
The utility model relates to an ultrathin VC copper sheet heat dissipation plate for a 5G mobile phone, wherein the inner cavity of the ultrathin VC copper sheet heat dissipation plate is a vacuum cavity with a capillary structure and is made of copper. When heat is conducted into the cavity from the heat source, the cooling liquid in the cavity starts to generate the gasification phenomenon of the cooling liquid after being heated in a low-vacuum environment, at the moment, heat energy is absorbed, the volume rapidly expands, the whole cavity is rapidly filled with gaseous cooling medium, and the condensation phenomenon can be generated when the gaseous working medium contacts a relatively cold area. The heat accumulated during evaporation is released by the condensation phenomenon, and the condensed cooling liquid returns to the evaporation heat source through the capillary pipeline of the capillary structure, so that the operation is repeated in the cavity.
The above description is only a part of or preferred embodiments of the present invention, and neither the text nor the drawings should be construed as limiting the scope of the present invention, and all equivalent structural changes, which are made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (9)
1. The utility model provides a 5G is ultra-thin type VC copper sheet heating panel for cell-phone which characterized in that: the cooling device comprises an upper cover and a lower cover, wherein the lower cover is covered on the surface of the upper cover, a filling cavity is formed between the upper cover and the lower cover, cooling liquid is filled in the filling cavity, capillary structures are arranged in the upper cover and the lower cover, a wavy supporting structure is arranged in the filling cavity, and through holes are formed in the side surfaces of the upper portion and the lower portion of the supporting structure.
2. The ultra-thin VC copper sheet heat dissipation plate for the 5G mobile phone according to claim 1, wherein the supporting structure is a copper sheet capable of being bent freely, and the supporting structure is in contact with the bottom surface of the upper cover and the surface of the lower cover.
3. The ultra-thin VC copper sheet heat dissipation plate for the 5G mobile phone according to claim 1, wherein a bump is arranged on the side surface of the lower cover, a flow channel is etched on the bump, and the flow channel extends to the inside of the lower cover.
4. The ultra-thin VC copper sheet heat dissipation plate for the 5G mobile phone according to claim 1, wherein the capillary structure is provided with a wave-shaped through hole matched with the supporting structure.
5. The ultra-thin VC copper sheet heat dissipation plate for the 5G mobile phone according to claim 1, wherein the supporting structure is not in contact with the inner walls of the upper cover and the lower cover.
6. The ultra-thin VC copper sheet heat dissipation plate for the 5G mobile phone according to claim 1, wherein the cooling liquid is pure water or deionized water.
7. The ultra-thin VC copper sheet heat dissipation plate for the 5G mobile phone according to claim 1, wherein the heat dissipation plate is any one or more of red copper, phosphor bronze or stainless steel.
8. The ultra-thin VC copper sheet radiating plate for the 5G mobile phone according to claim 1, wherein the thickness of the radiating plate is not more than 0.5 mm.
9. The ultra-thin VC copper sheet heat dissipation plate for the 5G mobile phone according to claim 1, wherein the corners of the upper cover and the lower cover are provided with mounting holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122174485.4U CN216058030U (en) | 2021-09-08 | 2021-09-08 | Ultra-thin VC copper sheet heat dissipation plate for 5G mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122174485.4U CN216058030U (en) | 2021-09-08 | 2021-09-08 | Ultra-thin VC copper sheet heat dissipation plate for 5G mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216058030U true CN216058030U (en) | 2022-03-15 |
Family
ID=80536197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122174485.4U Active CN216058030U (en) | 2021-09-08 | 2021-09-08 | Ultra-thin VC copper sheet heat dissipation plate for 5G mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216058030U (en) |
-
2021
- 2021-09-08 CN CN202122174485.4U patent/CN216058030U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW202037871A (en) | Flexible vapor chamber | |
| WO2022033289A1 (en) | Flat plate heat pipe and manufacturing method therefor, and heat exchanger | |
| WO2021082414A1 (en) | Temperature equalization component and electronic device | |
| TW200936024A (en) | Heat dissipation module and supporting element thereof | |
| CN111863746B (en) | Heat abstractor, circuit board and electronic equipment | |
| KR20050039436A (en) | Heat spreader, heat sink, heat exchanger and pdp chassis base | |
| CN201844724U (en) | Flat-plate soaking plate | |
| CN217217301U (en) | Electronic product | |
| CN111811305A (en) | Flexible temperature-equalizing plate | |
| WO2005071747A1 (en) | Heat pipe radiator of heat-generating electronic component | |
| CN113242672A (en) | Vapor chamber and electronic apparatus | |
| KR20080041979A (en) | Heat dissipating system having a heat dissipating cavity body | |
| CN110572981B (en) | Heat conduction device and terminal equipment | |
| CN114899160A (en) | 3D temperature-uniforming plate and radiator with same | |
| CN216058030U (en) | Ultra-thin VC copper sheet heat dissipation plate for 5G mobile phone | |
| TWM615244U (en) | Heat pipe structure | |
| CN210014478U (en) | Radiator, air condensing units and air conditioner | |
| CN210014476U (en) | Radiator, air condensing units and air conditioner | |
| CN210014475U (en) | Radiator, air condensing units and air conditioner | |
| CN210014477U (en) | Radiator, air condensing units and air conditioner | |
| CN113710072A (en) | Ultra-thin VC copper sheet heat dissipation plate for 5G mobile phone | |
| CN108601286B (en) | Electronic device | |
| CN218585974U (en) | Heat radiator | |
| JP3165057U (en) | Heat dissipation device driven by pressure gradient accompanying evaporation and condensation of refrigerant | |
| TWM259945U (en) | Heat sink with fluid medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |