CN214046500U

CN214046500U - Heat dissipation assembly, heat dissipation device and electronic equipment

Info

Publication number: CN214046500U
Application number: CN202023268618.6U
Authority: CN
Inventors: 胡冬生; 寨虎
Original assignee: Nanchang OFilm Display Technology Co Ltd
Current assignee: Nanchang OFilm Display Technology Co Ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-08-24
Anticipated expiration: 2030-12-30

Abstract

The application discloses a heat dissipation assembly, a heat dissipation device and electronic equipment. The heat dissipation assembly comprises a first base body, a second base body and a third base body. The first base body comprises a first surface and a second surface, the first surface is provided with a plurality of capillary grooves, the second surface is provided with a plurality of supporting parts, and gaps among the supporting parts are communicated to form a heat dissipation cavity; the second base body includes a third surface provided with a plurality of the supporting portions; the third substrate comprises a fourth surface provided with a plurality of capillary grooves. Above-mentioned radiator unit is through designing capillary groove and supporting part simultaneously on the two sides at first base member, when being used for the heat dissipation, the produced heat of heating element can realize once conducting heat between the capillary groove of third base member and the supporting part of first base member, realizes once conducting heat between the supporting part of first base member and the capillary groove of second base member, and the radiator unit of this application can realize twice conducting heat, has promoted radiator unit's heat dispersion.

Description

Heat dissipation assembly, heat dissipation device and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment heat dissipation, in particular to a heat dissipation assembly, a heat dissipation device and electronic equipment.

Background

The existing electronic equipment usually adopts a Vapor Chamber (VC), the Vapor chamber utilizes the phase change evaporation of a cooling working medium in a sealed space to rapidly diffuse heat to a cavity, the working medium is condensed into liquid at a condensation end and then flows back to a heating element end through capillary force and gravity, and the heat transfer performance of the Vapor chamber is dozens to hundreds times of that of a natural heat conducting material.

In the process of implementing the present application, the inventor finds that at least the following problems exist in the prior art: the soaking plates are heat conduction between two-dimensional surfaces, only one-time phase change heat transfer can be realized, and the phenomenon of overhigh temperature in the using process still exists for high-power electronic components.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a heat dissipation assembly, a heat dissipation device and an electronic apparatus to solve the above problems.

An embodiment of the present application provides a heat dissipation assembly, including:

the first base body comprises a first surface and a second surface which are opposite, the first surface is provided with a plurality of capillary grooves, the second surface is provided with a plurality of supporting parts, and gaps among the supporting parts are communicated to form a heat dissipation cavity;

the second substrate is arranged on the first surface and comprises a third surface opposite to the first surface, the third surface is provided with a plurality of supporting parts, one ends of the supporting parts, far away from the third surface, are abutted with the plurality of capillary grooves of the first surface, each capillary groove of the first surface is communicated with the heat dissipation cavity of the second substrate, and the periphery of the third surface is hermetically connected with the periphery of the first surface; and

the third substrate is arranged on the second surface, the third substrate comprises a fourth surface opposite to the second surface, the fourth surface is provided with a plurality of capillary grooves, the capillary grooves of the fourth surface are abutted to one ends, far away from the second surface, of the supporting parts of the second surface, each capillary groove of the fourth surface is communicated with the heat dissipation cavity of the first substrate, and the periphery of the fourth surface is hermetically connected with the periphery of the second surface.

Above-mentioned radiator unit is through the both sides at first base member design capillary groove and supporting part simultaneously, and locate first base member between second base member and the third base member, when being used for the heat dissipation, the produced heat of heating element can realize once conducting heat between the capillary groove of third base member and the supporting part of first base member, realize once conducting heat between the supporting part of first base member and the capillary groove of second base member, the radiator unit of this application can realize twice conducting heat, radiator unit's heat dispersion has been promoted.

In some embodiments, each capillary groove is defined by two adjacent capillary walls and the periphery of the corresponding surface, and the two adjacent capillary walls are arranged side by side.

Therefore, the capillary groove has the advantages that the manufacturing process of the capillary groove is simplified on the premise of ensuring the heat conducting performance of the capillary groove by meeting the structure.

In some embodiments, each capillary wall is provided with a communication opening to communicate two adjacent capillary grooves.

So, capillary groove is through satisfying above-mentioned structure, guarantees that the clearance between a plurality of capillary grooves is linked together, is favorable to promoting the heat conductivility of capillary groove.

In some embodiments, the communication openings of two adjacent capillary walls are staggered.

So, the intercommunication mouth of two adjacent capillary walls is through satisfying the setting of staggering, when being used for the heat dissipation, more is favorable to heat-conducting medium's quick through and backward flow.

In some embodiments, the capillary groove satisfies the following relationship:

D/W is more than or equal to 0.5 and less than or equal to 2, wherein D is the height value of the capillary wall along the direction vertical to the first surface, and W is the width value between two adjacent capillary walls.

Therefore, the D/W value of the capillary groove meets the range, and the heat dissipation performance of the capillary groove is guaranteed. However, when the value of D/W is less than 0.5, the width between two adjacent capillary walls is large, which reduces the capillary force of the capillary grooves and is not favorable for the backflow of the heat transfer medium. When the value of D/W is larger than 2, the height value of the capillary wall is larger, so that the heat dissipation capability of the capillary groove is reduced, and the heat dissipation performance of the capillary groove is not ensured.

In some embodiments, the height of the capillary wall is less than the height of the support in a direction perpendicular to the first surface.

So, through satisfying above-mentioned structural relation between capillary groove and the supporting part, can guarantee radiating component's condensation ability and heat conductivity phase-match for radiating component can dispel the heat smoothly, can not take place the not good condition of heat dispersion because of the insufficient heat dispersion that arouses of condensation ability.

In some embodiments, the height of the capillary walls ranges from 40 μm to 100 μm; and/or the height of the support part ranges from 80 μm to 200 μm.

Therefore, the capillary wall can ensure that the heat dissipation assembly has the characteristics of lightness and thinness under the condition of having heat dissipation performance by meeting the height range. However, when the height of the capillary wall is less than 40 μm, the capillary wall has weak heat conduction capability of the capillary groove formed therein, which affects the heat dissipation performance of the heat dissipation assembly. When the height of the capillary groove is greater than 100 μm, the height of the capillary wall is large, which is not favorable for thinning the heat dissipation assembly. The supporting part can ensure that the heat dissipation assembly has the characteristics of lightness and thinness under the condition of having condensation performance by meeting the height range. However, when the height of the supporting portion is less than 80 μm, the condensing ability of the surface where the supporting portion is located is not strong, which affects the heat dissipation performance of the heat dissipation assembly. When the height of the supporting portion is greater than 200 μm, the height of the supporting portion is too large to facilitate the thinning of the heat dissipation assembly.

In some embodiments, the heat dissipation assembly comprises:

the first surface of one of the two adjacent first base bodies is opposite to the second surface of the other one of the two adjacent first base bodies, the periphery of the first surface is in sealing connection with the periphery of the second surface, and one end, far away from the second surface, of the support parts of the second surface is abutted with the capillary grooves of the first surface.

Therefore, the heat dissipation assembly can realize multiple times of heat dissipation through the plurality of first base bodies arranged in the second base body and the third base body and the first surfaces and the second surfaces of the two adjacent first base bodies are arranged oppositely, and the heat dissipation capability of the heat dissipation assembly is improved.

An embodiment of the present application further provides a heat dissipation apparatus, including:

the heat dissipating assembly as described above; and

and the heat conducting medium is packaged between the heat dissipation cavity formed by the supporting part and the plurality of capillary grooves which are abutted.

The heat dissipation device is characterized in that the capillary grooves and the supporting parts are simultaneously designed on two sides of the first base body, the first base body is arranged between the second base body and the third base body, when the heat dissipation device is used for heat dissipation, heat generated by the heating element is transferred to the heat dissipation assembly, one-time phase change heat transfer is realized between the capillary grooves of the third base body and the supporting parts of the first base body by the heat conduction medium, one-time phase change heat transfer is realized between the supporting parts of the first base body and the capillary grooves of the second base body by the heat conduction medium, two-time phase change heat transfer is realized by the heat dissipation device, and the heat dissipation performance of the heat dissipation device is improved.

An embodiment of the present application further provides an electronic device including the heat dissipation apparatus as described above.

Above-mentioned electronic equipment is through the both sides at first base member design capillary groove and supporting part simultaneously, and locate first base member between second base member and the third base member, when being used for the heat dissipation, the produced heat transfer of heating element gives radiator unit, heat-conducting medium realizes once phase transition heat transfer between the capillary groove of third base member and the supporting part of first base member, heat-conducting medium realizes once phase transition heat transfer between the supporting part of first base member and the capillary groove of second base member, electronic equipment of this application has realized twice morphological phase transition heat transfer, radiator unit's heat dispersion has been promoted.

Drawings

Fig. 1 is a schematic partial structural view of a heat dissipation assembly according to a first embodiment of the present application.

Fig. 2 is a schematic partial structural view of a heat dissipation assembly according to a second embodiment of the present application.

Fig. 3 is a top view of the plurality of capillary channels of fig. 2.

Fig. 4 is a schematic structural diagram of an electronic device according to a third embodiment of the present application.

Description of the main elements

Electronic device 1000

Heat sink assembly

100, 200

First substrate

10, 210

First surface

12, 212

Second surface

14, 214

Second substrate

20, 220

Third surface

22, 222

Third base

30, 230

Fourth surface

32, 232

Capillary groove

40, 240

Capillary

wall

42, 242

Communication port 44

Support portion

50, 250

Heat dissipation chamber

52, 252

Housing 60

Heating element 70

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means three or more unless specifically defined otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, a heat dissipation assembly 100 is provided in a first embodiment of the present application, in which the heat dissipation assembly 100 includes a first substrate 10, a second substrate 20, and a third substrate 30.

The first base body 10 comprises a first surface 12 and a second surface 14 which are opposite, the first surface 12 is provided with a plurality of capillary grooves 40, the second surface 14 is provided with a plurality of supporting parts 50, and gaps among the plurality of supporting parts 50 are communicated to form a heat dissipation cavity 52; the second substrate 20 is arranged on the first surface 12, the second substrate 20 includes a third surface 22 opposite to the first surface 12, the third surface 22 is provided with a plurality of supporting portions 50, one end of each of the plurality of supporting portions 50 far away from the third surface 22 abuts against the plurality of capillary grooves 40 of the first surface 12, each capillary groove 40 of the first surface 12 is communicated with the heat dissipation cavity 22 of the second substrate 20, and the periphery of the third surface 22 is hermetically connected with the periphery of the first surface 12; the third base 30 is disposed on the second surface 14, the third base 30 includes a fourth surface 32 opposite to the second surface 14, the fourth surface 32 has a plurality of capillary grooves 40, the plurality of capillary grooves 40 of the fourth surface 32 are abutted to one ends of the plurality of supporting portions 50 of the second surface 14 far from the second surface 14, each capillary groove 40 of the fourth surface 32 is communicated with a heat dissipation cavity 52 of the first base 10, and a periphery of the fourth surface 32 is hermetically connected to a periphery of the second surface 14.

In the heat dissipation assembly 100, the capillary grooves 40 and the supporting portions 50 are respectively designed on the first surface 12 and the second surface 14 of the first base 10, the first base 10 is disposed between the second base 20 and the third base 30, the supporting portions 50 of the second base 20 are disposed in contact with the capillary grooves 40 of the first base 10, so as to form a group of heat conduction assemblies, and the capillary grooves 40 of the third base 30 are disposed in contact with the supporting portions 50 of the first base 10, so as to form another group of heat conduction assemblies. When the heat dissipation device or the electronic device 1000 is used for heat dissipation, heat generated by the heating element 70 can be primarily transferred in the heat conduction assembly formed by the third substrate 30 and the first substrate 10, and can be primarily transferred again in the heat conduction assembly formed by the second substrate 20 and the first substrate 10, that is, the heat dissipation assembly 100 can achieve twice heat transfer, and the heat dissipation performance of the heat dissipation assembly 100 can be significantly improved.

The heat conduction assembly of the present application refers to an assembly of a plurality of capillary grooves 40 and a plurality of support portions 50 required for primary heat transfer or primary phase change heat transfer.

It is understood that in other embodiments, the heat dissipation assembly 100 can be used to manufacture a heat spreader, which can be used as a heat dissipation device of the electronic apparatus 1000, and the heat spreader manufactured by the heat dissipation assembly 100 of the present application has better heat dissipation performance than a conventional heat spreader.

In this embodiment, the first substrate 10, the second substrate 20 and the third substrate 30 have a substantially plate shape, the periphery of the first surface 12 of the first substrate 10 and the periphery of the third surface 22 of the second substrate 20 may be hermetically connected by welding, and the periphery of the second surface 14 of the first substrate 10 and the periphery of the fourth surface 32 of the third substrate 30 may be hermetically connected by welding.

In the present embodiment, the first substrate 10, the second substrate 20, and the third substrate 30 have a height (thickness) in a direction perpendicular to the first surface 12 in a range of approximately 40 μm to 50 μm. The base body meets the height range, and can ensure that the base body has good heat-conducting property and has the characteristics of lightness and thinness. However, when the height of the base is less than 40 μm, the base is thin, which may cause the base to be easily deformed by heat, which is not favorable for securing the heat dissipation performance of the heat dissipation assembly 100 for a long period of time. When the height of the base is greater than 50 μm, the base is thicker, which is not favorable for ensuring the lightness and thinness of the heat dissipating module 100.

In this embodiment, each capillary groove 40 is formed by surrounding two adjacent capillary walls 42 and the peripheral edge of the corresponding surface, the capillary walls 42 are substantially plate-shaped, the two adjacent capillary walls 42 are arranged side by side, and a plurality of capillary grooves 40 are formed between the plurality of capillary walls 42 arranged side by side and the peripheral edge of the corresponding surface. The height of the capillary walls 42 in a direction perpendicular to the first surface 12 is the depth of the capillary channels 40.

In the present embodiment, each capillary groove 40 satisfies the following relational expression:

D/W is less than or equal to 0.5 and less than or equal to 2, wherein D (mum) is the height value of the capillary walls 42 along the direction vertical to the first surface 12, and W (mum) is the width value between two adjacent capillary walls 42. The capillary grooves 40 satisfy the above range, which is advantageous in ensuring the heat radiation performance of the capillary grooves 40. However, when the value of D/W is less than 0.5, the width between two adjacent capillary walls 42 is large, which reduces the capillary force of the capillary grooves 40 and is not favorable for the backflow of the heat transfer medium. When the value of D/W is greater than 2, the height of the capillary wall 42 is larger, that is, the depth of the capillary groove 40 is larger, which can increase the capillary force of the capillary groove 40, however, this reduces the heat dissipation capability of the capillary groove 40 and is not favorable for ensuring the heat dissipation capability of the capillary groove 40.

It will be appreciated that in other embodiments, the value of D/W is preferably equal to 1, where capillary forces of capillary channels 40 are most effective.

In this embodiment, the height range of the capillary wall 42 is approximately 40 μm to 100 μm, and the capillary wall 42 satisfies the height range, so that the heat dissipation assembly 100 can be light and thin while ensuring good heat dissipation performance. However, when the height of the capillary wall 42 is less than 40 μm, the depth of the capillary groove 40 is too small, which results in weak heat conduction capability of the heat dissipation assembly 100 and affects the heat dissipation performance of the heat dissipation assembly 100. When the height of the capillary wall 42 is greater than 100 μm, the height of the capillary wall 42 is too large to facilitate the thinning of the heat dissipation assembly 100.

In the present embodiment, the support portion 50 is substantially cylindrical. In other embodiments, the supporting portion 50 may also be triangular prism, quadrangular prism or polygonal prism. The height of the supporting portion 50 is greater than the height of the capillary wall 42 in the direction perpendicular to the first surface 12, so that the heat dissipation assembly 100 has sufficient condensation capacity to dissipate the heat transferred by the capillary grooves 40, and the heat dissipation performance of the heat dissipation assembly 100 can be ensured.

The height of the support 50 is in the range of approximately 80 μm to 200 μm. The supporting portion 50 satisfies this height range, and can be light and thin while ensuring the good condensation performance of the heat dissipation assembly 100. However, when the height of the supporting portion 50 is less than 80 μm, the condensation capability of the heat dissipation assembly 100 formed by the supporting portion 50 is not strong, and the heat cannot be dissipated in time, which may result in poor heat dissipation performance of the heat dissipation assembly 100. When the height of the supporting portion 50 is greater than 200 μm, the height of the supporting portion 50 is too large to facilitate the thinning of the heat dissipation assembly 100.

It is understood that in other embodiments, the height of the capillary groove 40 is preferably 50 μm, and the height of the support portion 50 is preferably 100 μm.

In this embodiment, the first, second and

third bases

10, 20 and 30 may be made of a copper material, and the capillary grooves 40 and the supporting portions 50 may be made by etching corresponding surfaces of the first, second and

third bases

10, 20 and 30 using an etching method.

It is understood that in other embodiments, other materials with good thermal conductivity and hardness, such as aluminum, nickel, etc., can be used for the first substrate 10, the second substrate 20, and the third substrate 30.

It is understood that, in other embodiments, the capillary grooves 40 and the supporting portions 50 may be fabricated in a pre-fabricated manner, and then the capillary grooves 40 and the supporting portions 50 are disposed on the corresponding surfaces of the first base 10, the second base 20, and the third base 30.

In this embodiment, the capillary grooves 40 are disposed on the fourth surface 32 in a manner substantially similar to the capillary grooves 40 on the first surface 12, and the supports 50 are disposed on the third surface 22 in a manner substantially similar to the supports 50 on the second surface 14.

It is understood that in other embodiments, the capillary grooves 40 may be disposed on the first surface 12 in a manner similar to the capillary grooves 40 on the fourth surface 32, or in a manner dissimilar to the capillary grooves 40 on the fourth surface 32; the support portion 50 may be disposed on the second surface 14 in a manner similar to the support portion 50 disposed on the third surface 22, and may not be disposed on the third surface 22.

In the present embodiment, the plurality of capillary grooves 40 of the first surface 12 are abutted against the plurality of supporting portions 50 of the third surface 22, and the plurality of supporting portions 50 of the second surface 14 are abutted against the plurality of capillary grooves 40 of the fourth surface 32, that is, the first substrate 10, the second substrate 20 and the third substrate 30 are abutted against each other, so that the first substrate 10, the second substrate 20 and the third substrate 30 can conduct heat mutually, the heat transfer can be enhanced, and the heat dissipation performance of the heat dissipation assembly 100 can be enhanced. Wherein the support portion 50 also has the function of supporting the corresponding base.

In the present embodiment, the gaps between the supporting portions 50 are communicated to form a heat dissipation cavity 52, and the heat dissipation cavity 52 is used for packaging the heat conducting medium. The heat sink assembly 100 may transfer heat generated from the heat generating element 70 using a phase change of a heat conductive medium.

Referring to fig. 2, a second embodiment of the present application provides a structural schematic diagram of a heat dissipation assembly 200. The heat dissipation assembly 200 in this embodiment is substantially similar to the heat dissipation assembly 100 in the first embodiment, except that: in this embodiment, the number of the first bases 210 is two, the first surface 212 of one of the two first bases 210 is disposed opposite to the second surface 214 of the other first base, the periphery of the first surface 212 is hermetically connected to the periphery of the oppositely disposed second surface 214, one ends of the supporting portions 250 of the second surface 214, which are far away from the second surface 214, are abutted to the capillary grooves 240 of the oppositely disposed first surface 212, the remaining corresponding second surfaces 214 are disposed opposite to the fourth surface 323 of the third base 230, and the remaining corresponding first surfaces 212 are disposed opposite to the third surface 222 of the second base 220. That is, the heat dissipation assembly 200 of the present application can realize tertiary heat transfer, enhance the heat dissipation capability of the heat dissipation assembly 200, and is suitable for the electronic device 1000 with a large heat generation amount.

It is understood that, in other embodiments, the number of the first bases 210 in the heat dissipation assembly 200 may also be three, four, five or more, wherein the first surface 212 of one of the adjacent first bases 210 is disposed opposite to the second surface 214 of the other one, and the periphery of the first surface 212 is in sealed connection with the periphery of the opposite second surface 214, one end of the plurality of supporting portions 250 of the second surface 214, which is far away from the second surface 214, abuts against the plurality of capillary grooves 240 of the opposite first surface 212, the plurality of first bases 210 are disposed between the second base 220 and the third base 230, the outermost first surface 212 of the plurality of first bases 210 is disposed opposite to the third surface 222 of the second base 220, and the outermost second surface 214 of the plurality of first bases 210 is disposed opposite to the fourth surface 232 of the third base 230. The plurality of capillary grooves 240 between the adjacent surfaces are abutted against the plurality of supports 250, and each capillary groove 240 is communicated with a heat dissipation cavity 252 formed by the plurality of supports 250.

Referring to fig. 3, in the present embodiment, each capillary wall 242 is provided with a communication opening 44, and the communication opening 44 enables communication between two adjacent capillary grooves 240. By designing the communication port 44 to communicate the plurality of capillary grooves 240 with each other, it is advantageous for the heat transfer medium to flow between the plurality of capillary grooves 240, and the heat transfer medium can be uniformly located in the plurality of capillary grooves 240 and transfer heat generated by the heat generating element 70.

In some embodiments, the communication openings 44 of two adjacent capillary walls 242 may be correspondingly disposed, that is, all the communication openings 44 are disposed on the corresponding capillary wall 242 along the same direction.

In other embodiments, the communication openings 44 of two adjacent capillary walls 242 are staggered. It can be understood that the communication openings 44 of two adjacent capillary walls 242 are staggered, so that the heat transfer medium can flow back from the cold end to the hot end via the capillary grooves 240 more quickly to dissipate heat. Wherein the cold end may be understood as the end of the heat conducting assembly away from the heating element 70 and the hot end may be understood as the end of the heat conducting assembly close to the heating element 70.

Referring to fig. 4, a third embodiment of the present application provides an electronic device 1000, where the electronic device 1000 at least includes a housing 60 and a heat dissipation device disposed in the housing 60.

In this embodiment, the heat dissipation device includes the heat dissipation assembly in the first embodiment or the second embodiment and the heat conductive medium encapsulated in the heat dissipation assembly. The present application takes the heat dissipation assembly 100 in the first embodiment as an example, and specifically, the heat conducting medium may be filled between the heat dissipation cavity 52 formed by the supporting portion 50 and the plurality of capillary grooves 40 in contact therewith.

It should be noted that the heat-conducting medium is in a liquid state at normal temperature, changes into a gaseous state after being heated, moves from the high-temperature region (the capillary groove 40) to the low-temperature region (the support portion 50), and is liquefied by contacting with the low-temperature elements (the second surface 14 and the third surface 22) after reaching the low-temperature region, so as to transfer heat from the high-temperature region to the low-temperature region.

In this embodiment, when the heat sink is applied, the third substrate 30 of the heat sink is bonded to the heating element 70, and the second substrate 20 is bonded to the non-heating element. At this time, the heat transfer occurs between the third substrate 30 attached to the heating element 70, so that the heat-conducting medium in the third substrate 30 and the first substrate 10 is vaporized and moves to the supporting portion 50 of the first substrate 10, and the heat is conducted to the second surface 14 of the first substrate 10, and the heat-conducting medium in the third substrate 30 and the first substrate 10 is condensed and liquefied, and returns to the plurality of capillary grooves 40 of the third substrate 30. After the heat is conducted to the second surface 14 of the first substrate 10, a portion of the heat is transferred from the second surface 14 of the first substrate 10 to the first surface 12 of the first substrate 10, so that the heat-conducting medium in the first substrate 10 and the second substrate 20 is heated, vaporized, moved to the third surface 22 of the second substrate 20, and transferred to the third surface 22 of the second substrate 20, and further transferred to the non-heat-generating elements, and the heat-conducting medium in the first substrate 10 and the second substrate 20 is condensed and liquefied, and then returned to the plurality of capillary grooves 40 of the first substrate 10.

It is understood that in other embodiments, the heat transfer medium may be, but is not limited to, water, methanol, acetone.

In the present embodiment, the heat generating element 70 in the electronic apparatus 1000 may be, for example, a power supply or a heat generating chip.

It is understood that in other embodiments, the heat sink can be directly attached to the heat generating element 70, or can be attached to the heat generating element 70 by other heat conducting elements.

It is understood that in other embodiments, the third substrate 30 of the heat sink can be attached to the heat generating component 70, the second substrate 20 can be attached to the non-heat generating component, and the second substrate 20 can also be attached to other heat generating components. When the two sides of the heat dissipation device are both attached to the heating elements 70, a heat equalizing effect is formed between the two heating elements 70, and when the heat generated by one is more and the temperature is sharply increased, the heat can be transferred to the other through the heat dissipation device, so that the local overheating phenomenon is prevented.

It is to be understood that the structure of the electronic device 1000 is not limited to the electronic device 1000, and may include more or less components than those described, or some components may be combined, some components may be separated, or different components may be arranged.

The electronic device 1000 of the present embodiment may be a mobile phone or a smart phone, a portable game device, a laptop computer, a tablet computer, a portable internet device, a music player, and a data storage device, other handheld devices, and devices such as a watch, an earphone, a pendant, an earphone, an electronic cigarette, etc., and may also be other wearable devices or head-mounted devices.

The electronic device 1000 may also be any of a number of electronic devices 1000, including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital assistants, portable multimedia players, motion picture experts group audio layer players, portable medical devices, and digital cameras, and combinations thereof.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A heat sink assembly, comprising:

2. The heat dissipation assembly of claim 1, wherein each capillary groove is defined by two adjacent capillary walls and a peripheral edge of the corresponding surface, and the two adjacent capillary walls are arranged side by side.

3. The heat dissipating assembly of claim 2, wherein each capillary wall is provided with a communication opening to communicate two adjacent capillary grooves.

4. The heat dissipation assembly of claim 3, wherein the communication openings of two adjacent capillary walls are staggered.

5. The heat removal assembly of claim 2, wherein the capillary groove satisfies the relationship:

6. The heat removal assembly of claim 2, wherein the height of the capillary walls is less than the height of the supports in a direction perpendicular to the first surface.

7. The heat removal assembly of claim 5, wherein the capillary walls have a height in a range of 40 μ ι η to 100 μ ι η; and/or the height of the support part ranges from 80 μm to 200 μm.

8. The heat dissipation assembly of any of claims 1-7, wherein the heat dissipation assembly comprises:

the first surface of one of the two adjacent first base bodies is opposite to the second surface of the other one of the two adjacent first base bodies, the periphery of the first surface is in sealing connection with the periphery of the opposite second surface, and one ends of the supporting parts of the second surface, which are far away from the second surface, are abutted with the capillary grooves of the opposite first surface.

9. A heat dissipating device, comprising:

the heat dissipation assembly of any one of claims 1-8; and

10. An electronic device comprising the heat dissipating apparatus according to claim 9.