CN108801015A - Temperature equalizing plate - Google Patents
Temperature equalizing plate Download PDFInfo
- Publication number
- CN108801015A CN108801015A CN201710442386.5A CN201710442386A CN108801015A CN 108801015 A CN108801015 A CN 108801015A CN 201710442386 A CN201710442386 A CN 201710442386A CN 108801015 A CN108801015 A CN 108801015A
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- Prior art keywords
- capillary
- cover board
- powder
- temperature
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000843 powder Substances 0.000 claims abstract description 133
- 239000002184 metal Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 230000015572 biosynthetic process Effects 0.000 claims description 15
- 239000007787 solid Substances 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 206010037660 Pyrexia Diseases 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 206010020112 Hirsutism Diseases 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Abstract
The invention provides a temperature-uniforming plate, wherein a plate body of the temperature-uniforming plate comprises a first cover plate and a second cover plate which are oppositely covered, a first cavity is formed between the first cover plate and the second cover plate in a hollow manner, and the second cover plate comprises a protruding part protruding towards the outer side of the plate body. The inner surface of the plate body is distributed with a capillary structure which comprises a plurality of capillary parts, wherein the capillary parts on the inner surface of the protruding part of the second cover plate close to the heating source can be formed by metal powder with the powder grain diameter larger than that of the capillary parts on other inner surfaces, and the powder thickness can be thicker. Therefore, the invention can optimize the heat transfer effect of the temperature equalizing plate.
Description
Technical field
The present invention relates to temperature-uniforming plate fields, having the temperature-uniforming plate close to the protruding portion of pyrotoxin more particularly, to a kind of.
Background technology
Existing temperature-uniforming plate is a kind of Platelike heat pipe, in injecting working fluid in the environment of inner vacuum, by workflow
The liquid-gas phase transitionization of body executes the function of heat exchange.Existing temperature-uniforming plate has platelike profile, the lid generally closed by two-phase lid
Plate is formed, using two plate faces of high surface area respectively as heating end and radiating end.The inside of temperature-uniforming plate is then typically provided hair
Thin tissue (wick structure) is to accelerate the vaporization and flowing of working fluid.
TaiWan, China patent No. M497253 discloses a kind of temperature-uniforming plate, and the inner face of heat affected zone is fine metal powder, and is radiated
The inner face in area is then crude metal powder, uses the back-flow velocity for increasing working fluid.
Invention content
The technical problem to be solved in the present invention is, for deficiencies of the prior art, provides a kind of temperature-uniforming plate,
Capillary is formed by using the powder of greater particle size compared to the inside of temperature-uniforming plate, in the inside of the protruding portion close to pyrotoxin
Portion can optimize heat transfer and heat dissipation effect.
The technical solution adopted by the present invention to solve the technical problems is to provide a kind of temperature-uniforming plate, including plate body and capillary group
It knits, which includes one first cover board and one second cover board that opposite lid closes, in being between first cover board and second cover board
It is empty and form a first chamber, wherein second cover board includes the outside protruding portion outstanding to the plate body；The capillary structure
It is exposed in the first chamber, which includes one first capillary portion, one second capillary portion and a third capillary portion,
In, which is fixed at the protruding portion of second cover board, which is with the first powder diameter
Metal powder sintered formation；The second capillary portion be fixed on the protruding portion of second cover board with exterior domain at, second capillary
Portion is to be less than the first powder diameter with the metal powder sintered formation with the second powder diameter and the second powder diameter；The third hair
Thin portion is fixed at first cover board, and opposite with the first capillary portion and the second capillary portion across the first chamber, wherein
The third capillary portion is to be less than first powder with the metal powder sintered formation with third powder diameter and the third powder diameter
Diameter.
Preferably, the second powder diameter is equal to the third powder diameter, which is 80 to 120 mesh.
Preferably, the first powder diameter is 80 to 120 mesh, the second powder diameter or the third powder diameter are 200 to 300
Mesh.
Preferably, there is the first powder thickness, the second capillary portion to have the second powder thickness and should in the first capillary portion
Second powder thickness is less than first powder thickness.
Preferably, there is the first powder thickness, the third capillary portion to have third powder thickness and should in the first capillary portion
Third powder thickness is less than first powder thickness.
Preferably, the inside of the protruding portion forms the second chamber for being connected to the first chamber, and the temperature-uniforming plate further includes
Multiple support columns, multiple support column be distributed in the first chamber and the second chamber and be resisted against first cover board and this
Between two cover boards.
Preferably, multiple support column is with the metal powder sintered formation with the 4th powder diameter, and the 4th powder
Diameter is more than the first powder diameter.
Preferably, the 4th powder diameter is 60 to 100 mesh.
The present invention also provides a kind of temperature-uniforming plate, including plate body and capillary structure, which includes one first that opposite lid closes
Cover board and one second cover board, form a first chamber, wherein this second between first cover board and second cover board to be hollow
Cover board includes the outside protruding portion outstanding to the plate body；The capillary structure is exposed in the first chamber, the capillary structure
Including one first capillary portion, one second capillary portion and a third capillary portion, wherein second cover board is fixed in the first capillary portion
The protruding portion and have first thickness；The protruding portion of second cover board is fixed at exterior domain and to have in the second capillary portion
There is second thickness, and the second thickness is less than the first thickness；The third capillary portion is fixed at first cover board and with the
Three thickness, and the third thickness is less than the first thickness.
Preferably, the capillary structure is with metal powder sintered formation, the powder of the metal powder in the first capillary portion is formed
Grain size is more than the powder diameter for the metal powder for forming the second capillary portion or the third capillary portion.
Preferably, the powder diameter for forming the metal powder in the first capillary portion is 80 to 120 mesh.
Preferably, the powder diameter for forming the metal powder in the second capillary portion or the third capillary portion is 200 to 300 mesh.
Preferably, the inside of the protruding portion forms the second chamber for being connected to the first chamber, and the temperature-uniforming plate further includes
Multiple support columns, multiple support column be distributed in the first chamber and the second chamber and be resisted against first cover board and this
Between two cover boards.
Preferably, the capillary structure and multiple support column be all with metal powder sintered formation, and form multiple support
The powder diameter of the metal powder of column is more than the powder diameter for the metal powder for forming the capillary structure.
Preferably, the powder diameter for forming the metal powder of multiple support column is 60 to 100 mesh.
The present invention also provides a kind of temperature-uniforming plate, including plate body and capillary structure, which includes one first that opposite lid closes
Cover board and one second cover board, form a first chamber, wherein this second between first cover board and second cover board to be hollow
Cover board includes the outside protruding portion outstanding to the plate body；The capillary structure is exposed in the first chamber, the capillary structure
Including one first capillary portion, one second capillary portion and a third capillary portion, wherein second cover board is fixed in the first capillary portion
The protruding portion, the first capillary portion have the first capillary aperture；The protrusion of second cover board is fixed in the second capillary portion
Portion with exterior domain at, which there is the second capillary aperture and the second capillary aperture to be less than the first capillary aperture；
The third capillary portion is fixed at first cover board, and across the first chamber and the first capillary portion and the second capillary portion phase
It is right, wherein there is third capillary aperture and the third capillary aperture to be less than the first capillary aperture in the third capillary portion.
Preferably, there is first thickness, the second capillary portion to have second thickness and the second thickness in the first capillary portion
Less than the first thickness.
Preferably, there is first thickness, the third capillary portion to have third thickness and the third thickness in the first capillary portion
Less than the first thickness.
Preferably, the temperature-uniforming plate further includes being distributed in the first chamber and being resisted against first cover board and second cover board
Between multiple support columns.
Preferably, any support column be capillary structure or solid construction or be capillary structure and solid construction combination.
Temperature-uniforming plate of the present invention includes having the plate body for covering the first cover board and the second cover board that close relatively, EDS maps in the plate body
There is capillary structure, is more than other inner faces close to the capillary aperture in the capillary portion on the inner face of the protruding portion of the second cover board of pyrotoxin
On capillary portion capillary aperture, thickness also can be thicker；When capillary structure is with metal powder sintered formation, close to fever
Capillary portion on the inner face of the protruding portion of second cover board in source is more than the metal powder in the capillary portion on other inner faces using powder diameter
End is formed, and powder thickness also can be thicker.In this way, the present invention can optimize heat transfer and the heat dissipation effect of temperature-uniforming plate.
Description of the drawings
Fig. 1 is the part-structure diagrammatic cross-section of the temperature-uniforming plate of the present invention.
Fig. 2 is another part structural profile illustration of the temperature-uniforming plate of the present invention.
Fig. 3 is the another part-structure diagrammatic cross-section of the temperature-uniforming plate of the present invention.
Specific implementation mode
For convenience of description, ratio when each structure, tissue or the component of the temperature-uniforming plate in schema of the present invention disobey its application,
And according to the amplification for illustrating to need to carry out inequality proportion, this is not to limit the implementation of temperature-uniforming plate of the present invention.
So-called plate body below the present invention refers to having two opposite surfaces in appearance, and the area on two surfaces is remote
More than the sidewall area between two surfaces, generally formed using two cover plate combinations for mutually covering conjunction.Secondly, according to opposite effect
Two cover boards can be distinguished into contact or close to pyrotoxin cover board and play the cover board of cooling effect, the geometry of the two can
Identical or different, side wall can then be provided in which be integrally formed by least one two cover boards, however, the present invention is not limited thereto.Though below with flat
Iso-surface patch illustrates two cover boards, but any cover board can also be designed as arc or other shapes according to needs.Furthermore plate body is interior
Portion forms a hollow chamber in hollow form, for convenience of description, macroscopically by the conjunction of two cover plate lids and the chamber between two cover boards
Room is following so-called first chamber, as absolutely empty in inside the be formed in plate body of plate face bumps profile using any cover board
Between be then following so-called second chamber or third chamber etc..
So-called capillary structure or structure below the present invention refer to having multiple pores in tissue or structure or being connected
Hole hole, generally mesh grid it is powder sintered or combine it is both above-mentioned formed, and capillary aperture or capillary can be used
Density describes.When mesh grid have less mesh number or using larger particles it is powder sintered when, capillary aperture is big, and capillary is close
It spends relatively low；Otherwise the small person in capillary aperture, then capillary density is higher.It should be understood that capillary aperture herein, with statistical amount
It measures, can be indicated with a numerical value or a numberical range, it is not all identical for necessity with each capillary aperture.
Fig. 1 is the part-structure diagrammatic cross-section of the temperature-uniforming plate of the present invention.Fig. 2 is another part of the temperature-uniforming plate of the present invention
Structural profile illustration.It please refers to Fig.1 to Fig. 2, a plate body 20 of temperature-uniforming plate 10 of the invention includes one first cover board 22 and tool
There is one second cover board 24 of a protruding portion 26.In an embodiment, the first cover board 22 and the second cover board 24 that opposite lid closes define
A hollow space inside plate body 20, is indicated with first chamber 12；Second cover board 24 is outstanding prominent to the outside of plate body 20
The inside in portion 26 then forms a second chamber 14, and second chamber 14 can be connected to first chamber 12.The geometric form of protruding portion 26
Shape, size, position and quantity can be only depending on demand, in figure to illustrate.The temperature-uniforming plate 10 of the present invention is in use, fever
Source 40 be usually contact the second cover board 24 protruding portion 26 outer surface, therefore with temperature-uniforming plate 10 from the point of view of, the second cover board 24 can be considered
Heating end；Relatively, the first cover board 22 is then radiating end.
Continue referring to figs. 1 to Fig. 2, capillary structure 50 is exposed in first chamber 12 and second chamber 14, is set to first
On the inner face of cover board 22 and the second cover board 24.A working fluid (not painted on figure) is equipped in first chamber 12, capillary structure 50 connects
Touch working fluid.Secondly, capillary structure 50 include one first capillary portion 52 with one first capillary aperture and a first thickness,
One second capillary portion 54 with one second capillary aperture and a second thickness and with a third capillary aperture and a third
One third capillary portion 56 of thickness.In an embodiment, the first capillary portion 52 is fixed at the protruding portion 26 of the second cover board 24
The protruding portion 26 of the second cover board 24 is fixed on the inner face 241 at exterior domain, third capillary portion in inner face 261, the second capillary portion 54
56 are fixed on the inner face 221 at the first cover board 22, and across first chamber 12 and second chamber 14 and with the second capillary portion 54
And first capillary portion 52 it is opposite.
Continue referring to figs. 1 to Fig. 2, in an embodiment, the second capillary aperture is less than the first capillary aperture, and third capillary
Aperture is also smaller than the first capillary aperture.Secondly, second thickness is less than first thickness, and third thickness is less than first thickness.?
Capillary structure 50 is the first capillary portion 52, the second capillary portion 54 and third in the case of being formed in a manner of metal powder sintered
Capillary portion 56 can select the metal powder sintered formation of the first powder diameter, the second powder diameter and third powder diameter respectively, wherein the
Two powder diameters are less than the first powder diameter, and third powder diameter is less than the first powder diameter.When implementation, citing but unlimited, first
Powder diameter is 80 to 120 mesh, and the second powder diameter or/and third powder diameter are then 200 to 300 mesh, wherein the bigger expression gold of mesh number
It is smaller to belong to powder diameter.Furthermore the second powder diameter and third powder diameter then can be identical or different.It should be understood that capillary structure
50, which also can be selected metal net, forms, and under equal area, the more, mesh is closeer for mesh number, is formed by capillary aperture
Smaller.Therefore in the case where capillary structure 50 is formed in a manner of metal net, the metal in the first capillary portion 52 is formed
The mesh number of mesh grid will be less than the mesh number for the metal net for forming the second capillary portion 54 or formation third capillary portion 56.
The present invention and background technology are compared, the capillary structure of existing temperature-uniforming plate, most common second capillary portion and third
Capillary portion is for equal thickness and by the metal net institute shape of metal powder or same metal mesh number with equal powder diameter
At the thermal resistance of such design can highest.When temperature-uniforming plate has projection design outstanding, the first capillary portion and the second capillary portion
(or third capillary portion) is formed by the metal net of metal powder or same metal mesh number with equal powder diameter, but
When the thickness in the first capillary portion is more than the thickness in the second capillary portion, thermal resistance is better than the former.When the thickness and shape for considering capillary portion
In the presence of having reciprocation between powder diameter at the metal powder in capillary portion, the present invention uses the metal powder with larger powder diameter
End forms the first capillary portion, and thermal resistance is instead better than the above two schemes, especially when the thickness in the first capillary portion is significantly greater than the
When two capillary portions (or third capillary portion) thermal resistance performance it is further preferred that.The test result that the present invention carries out such as table one：
Table one
Fig. 3 is the another part-structure diagrammatic cross-section of the temperature-uniforming plate of the present invention.It please refers to Fig.1 to Fig. 3, temperature-uniforming plate 10 is more
It is multiple between the first cover board 22 and second cover board 24 including being distributed in first chamber 12 and second chamber 14 and being resisted against
Support column 60.In an embodiment, support column 60 can be solid, smooth surface or coarse (such as with groove or bumps)
Structure；Or generally capillary structure (such as hairiness broad pore distribution is wherein)；Or combine solid and capillary structure.It is supporting
In the case that column 60 is also formed in a manner of metal powder sintered, the powder diameter for forming the metal powder of these support columns 60 is more than
Form the powder diameter of the metal powder of capillary structure 50.When implementation, citing but unlimited, when the first powder diameter of selection be 80 to
When 120 mesh, support column 60 is with the metal powder sintered formation of the 4th powder diameter, wherein the 4th powder diameter can be 60 to 100
Mesh.
Herein it should be noted that, the above detailed description done of cooperation schema, merely to illustrating the technology of the present invention
Content and feature and the embodiment provided, those of ordinary skill in all fields of the present invention, in the technology for understanding the present invention
After appearance and feature, under the spirit without prejudice to the present invention, the economization of the various simple modifications, replacement or the component that are done, all
It should belong within scope of the presently claimed invention.
Claims (20)
1. a kind of temperature-uniforming plate, which is characterized in that including：
Plate body comprising it is opposite to cover one first cover board and one second cover board closed, be between first cover board and second cover board
It is hollow and formed a first chamber, wherein second cover board includes the outside protruding portion outstanding to the plate body；And
Capillary structure is exposed in the first chamber, which includes one first capillary portion, one second capillary portion and one the
Three capillary portions, wherein
The first capillary portion is fixed at the protruding portion of second cover board, which is with the first powder diameter
Metal powder sintered formation；
The second capillary portion be fixed on the protruding portion of second cover board with exterior domain at, which is to have second
The metal powder sintered formation of powder diameter and the second powder diameter are less than the first powder diameter；And
The third capillary portion is fixed at first cover board, and across the first chamber and the first capillary portion and second capillary
Portion is opposite, wherein the third capillary portion be with the metal powder sintered formation with third powder diameter and the third powder diameter it is small
In the first powder diameter.
2. temperature-uniforming plate as described in claim 1, which is characterized in that the second powder diameter is equal to the third powder diameter, this first
Powder diameter is 80 to 120 mesh.
3. temperature-uniforming plate as described in claim 1, which is characterized in that the first powder diameter is 80 to 120 mesh, the second powder diameter
Or the third powder diameter is 200 to 300 mesh.
4. temperature-uniforming plate as described in claim 1, which is characterized in that the first capillary portion has the first powder thickness, this second
Capillary portion has the second powder thickness and second powder thickness is less than first powder thickness.
5. temperature-uniforming plate as described in claim 1, which is characterized in that the first capillary portion has the first powder thickness, the third
Capillary portion has third powder thickness and the third powder thickness is less than first powder thickness.
6. temperature-uniforming plate as described in claim 1, which is characterized in that the inside of the protruding portion, which is formed, is connected to the one of the first chamber
Second chamber, and the temperature-uniforming plate further includes multiple support columns, multiple support column is distributed in the first chamber and the second chamber
In and be resisted against between first cover board and second cover board.
7. temperature-uniforming plate as claimed in claim 6, which is characterized in that multiple support column is with the metal with the 4th powder diameter
Powder sintered formation, and the 4th powder diameter is more than the first powder diameter.
8. temperature-uniforming plate as claimed in claim 7, which is characterized in that the 4th powder diameter is 60 to 100 mesh.
9. a kind of temperature-uniforming plate, which is characterized in that including：
Plate body comprising it is opposite to cover one first cover board and one second cover board closed, be between first cover board and second cover board
It is hollow and formed a first chamber, wherein second cover board includes the outside protruding portion outstanding to the plate body；And
Capillary structure is exposed in the first chamber, which includes one first capillary portion, one second capillary portion and one the
Three capillary portions, wherein
The first capillary portion is fixed on the protruding portion of second cover board and has first thickness；
The protruding portion of second cover board is fixed at exterior domain and to have a second thickness in the second capillary portion, and this is second thick
Degree is less than the first thickness；And
Third thickness is fixed at first cover board and has in the third capillary portion, and the third thickness is less than the first thickness.
10. temperature-uniforming plate as claimed in claim 9, which is characterized in that the capillary structure is formed with metal powder sintered formation
The powder diameter of the metal powder in the first capillary portion is more than the metal powder for forming the second capillary portion or the third capillary portion
Powder diameter.
11. temperature-uniforming plate as claimed in claim 9, which is characterized in that form the powder diameter of the metal powder in the first capillary portion
For 80 to 120 mesh.
12. temperature-uniforming plate as claimed in claim 11, which is characterized in that form the gold in the second capillary portion or the third capillary portion
The powder diameter for belonging to powder is 200 to 300 mesh.
13. temperature-uniforming plate as claimed in claim 9, which is characterized in that the inside of the protruding portion, which is formed, is connected to the first chamber
One second chamber, and the temperature-uniforming plate further includes multiple support columns, multiple support column is distributed in the first chamber and second chamber
In room and it is resisted against between first cover board and second cover board.
14. temperature-uniforming plate as claimed in claim 13, which is characterized in that the capillary structure and multiple support column are all with metal powder
End sintering is formed, and the powder diameter for forming the metal powder of multiple support column is more than the metal powder for forming the capillary structure
Powder diameter.
15. temperature-uniforming plate as claimed in claim 14, which is characterized in that form the powder diameter of the metal powder of multiple support column
For 60 to 100 mesh.
16. a kind of temperature-uniforming plate, which is characterized in that including：
Plate body comprising it is opposite to cover one first cover board and one second cover board closed, be between first cover board and second cover board
It is hollow and formed a first chamber, wherein second cover board includes the outside protruding portion outstanding to the plate body；And
Capillary structure is exposed in the first chamber, which includes one first capillary portion, one second capillary portion and one the
Three capillary portions, wherein
The protruding portion of second cover board is fixed in the first capillary portion, which has the first capillary aperture；
The second capillary portion be fixed on the protruding portion of second cover board with exterior domain at, which has the second capillary
Aperture and the second capillary aperture are less than the first capillary aperture；And
The third capillary portion is fixed at first cover board, and across the first chamber and the first capillary portion and second capillary
Portion is opposite, wherein there is third capillary aperture and the third capillary aperture to be less than the first capillary aperture in the third capillary portion.
17. temperature-uniforming plate as claimed in claim 16, which is characterized in that the first capillary portion have first thickness, this second mao
Thin portion has second thickness and the second thickness is less than the first thickness.
18. temperature-uniforming plate as claimed in claim 16, which is characterized in that the first capillary portion has first thickness, the third hair
Thin portion has third thickness and the third thickness is less than the first thickness.
19. temperature-uniforming plate as claimed in claim 16, which is characterized in that the temperature-uniforming plate further includes being distributed in the first chamber simultaneously
The multiple support columns being resisted against between first cover board and second cover board.
20. temperature-uniforming plate as claimed in claim 19, which is characterized in that any support column be capillary structure or solid construction or
For the combination of capillary structure and solid construction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106115011A TWI654404B (en) | 2017-05-05 | 2017-05-05 | Temperature plate |
| TW106115011 | 2017-05-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108801015A true CN108801015A (en) | 2018-11-13 |
Family
ID=64094539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710442386.5A Pending CN108801015A (en) | 2017-05-05 | 2017-06-13 | Temperature equalizing plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108801015A (en) |
| TW (1) | TWI654404B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447792A (en) * | 2020-04-08 | 2020-07-24 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN111595187A (en) * | 2020-05-11 | 2020-08-28 | 奇鋐科技股份有限公司 | Composite capillary structure of vapor chamber |
| CN111912274A (en) * | 2019-05-10 | 2020-11-10 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| WO2021244448A1 (en) * | 2020-06-01 | 2021-12-09 | 华为技术有限公司 | Vapor chamber and electronic device |
| US11873982B2 (en) | 2020-05-14 | 2024-01-16 | Signify Holding B.V. | Vapor chamber element |
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