US20100181048A1 - Heat pipe - Google Patents
Heat pipe Download PDFInfo
- Publication number
- US20100181048A1 US20100181048A1 US12/483,228 US48322809A US2010181048A1 US 20100181048 A1 US20100181048 A1 US 20100181048A1 US 48322809 A US48322809 A US 48322809A US 2010181048 A1 US2010181048 A1 US 2010181048A1
- Authority
- US
- United States
- Prior art keywords
- protrusions
- casing
- heat pipe
- bottom layer
- wick structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000011148 porous material Substances 0.000 claims abstract description 15
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 241000826860 Trapezium Species 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Definitions
- the present invention relates generally to an apparatus for transfer or dissipation of heat from heat-generating components, and more particularly to a heat pipe applicable in electronic products such as personal computers for removing heat from electronic components installed therein.
- a heat pipe is usually a vacuum casing containing therein a working medium, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as the “evaporator section”) to another section thereof (typically referring to as the “condenser section”).
- a wick structure is provided inside the heat pipe for drawing the working medium back to the evaporator section after it is condensed at the condenser section.
- the wick structure currently available for the heat pipe includes fine grooves integrally formed at the inner wall of the casing, screen mesh or fiber inserted into the casing and held against the inner wall thereof, or sintered powders combined to the inner wall of the casing by sintering process.
- the wick structure provided in the heat pipe is expected to provide a high capillary force and contain more working medium in the wick structure.
- FIG. 1 is a partially cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention.
- FIG. 2 is a microscopic view of a portion of a wick structure of the heat pipe of FIG. 1 .
- FIG. 3 shows a cross-sectional view of a heat pipe in accordance with a second embodiment of the present invention.
- a flat heat pipe 10 includes a casing 11 and a three-dimensional cross-linkage wick structure 13 received in the casing 11 , wherein the wick structure 13 has a plurality of pores therein and is saturated with a working medium.
- the casing 11 is made of a highly thermally conductive material such as copper or aluminum and has an evaporator section at one end thereof and a condenser section at an opposite end thereof.
- the casing 11 includes a bottom plate 112 at a bottom side thereof and an upper plate 111 at a top side thereof opposite to the bottom plate 112 .
- the wick structure 13 is made of a highly thermally conductive metal material such as copper or aluminum.
- the plurality of pores in the wick structure 13 provides a capillary action for drawing the working medium condensed at the condenser section back to the evaporator section.
- the wick structure 13 includes a bottom layer 131 and a plurality of protrusions 132 extending upwardly from the bottom layer 131 .
- the bottom layer 131 is flat and attached to the bottom plate 112 .
- the protrusions 132 are extended over an entire length of the heat pipe 10 , from the evaporator section to the condenser section of the casing 11 .
- a top of the protrusion 132 is attached to the upper plate 111 , thereby supporting the top plate 11 to improve the robustness and flatness of the heat pipe 10 .
- the protrusion 132 has a trapezium-shaped transverse cross section. In other alternative embodiments, the protrusion 132 can have a triangle-shaped or a rectangle-shaped transverse cross section.
- the protrusions 132 are spaced from each other, whereby a groove 133 is defined between two adjacent protrusions 132 .
- the groove 133 is used as a vapor channel.
- the groove 133 extends longitudinally from the evaporator section to the condenser section of the casing 11 .
- the bottom layer 131 has a connection portion 135 corresponding to and located just under the groove 133 , wherein the connection portion 135 of the bottom layer 131 is formed between and connects with the two adjacent protrusions 132 .
- the protrusion 132 has a greater pore size than the connection portion 135 of the bottom layer 131 , whereby the protrusion 132 has a lower flow resistance for the working medium and can contain more working medium condensed at the condenser section in the pores of the protrusion 132 .
- the connection portion 135 of the bottom layer 131 has a smaller pore size than the protrusion 132 , whereby the connection portion 135 has a larger capillary action than the protrusion 132 .
- the condensed working medium at the condenser section of the casing 11 can flow more rapidly from the upper plate 111 toward the bottom plate 112 via the protrusion 132 under the capillary action of the connection portion 135 . Then the condensed working medium flows along the bottom layer 131 from the condenser section to the evaporator section of the casing 11 for another heat transfer cycle.
- FIG. 2 shows a microscopic view of a portion of the wick structure 13 , in which the wick structure 13 has a large porosity and three-dimensional interlocking, whereby the wick structure 13 can have a better performance in the absorption and delivery of the condensed working medium than the conventional wick structure: mesh, sintered powder or tiny grooves.
- the wick structure 13 is formed by first preparing a sponge with a predetermined porosity and pore size. Then the sponge is activated so that it can be electroplated with a metallic layer thereon. Thereafter, the electroplated sponge is put in a tank for subject to electrocasting whereby a copper (or aluminum) wicking structure is formed on the metallic layer, thereby to obtain a semifinished product. The semifinished is then heated at a high temperature to remove the sponge therefrom and sinter the copper wicking structure. Finally, the sintered copper wicking structure is pressed to form the grooves 133 in the sintered copper wicking structure to thereby obtain the wick structure 13 , wherein the protrusions 132 have larger pores therein and the connection portions 135 have smaller pores therein.
- FIG. 3 shows a round heat pipe 20 according to a second embodiment of the present invention.
- the casing 21 of the heat pipe 20 has a ring-like transverse cross section.
- the wick structure 23 is received in the casing 21 and defines a vapor channel 24 therein.
- the bottom layer 231 of the wick structure 23 is attached to an inner peripheral surface of the casing 21 .
- the plurality of protrusions 232 extends radially and inwardly from the bottom layer 231 towards a center of the round heat pipe 20 , in which a vapor channel 24 which communicates with a groove between two adjacent protrusions 232 is extended.
- the wick structure 23 is formed by the same method for forming the wick structure 13 , except that they have a flat shape and a ring-like shape, respectively.
Abstract
Description
- 1. Technical Field
- The present invention relates generally to an apparatus for transfer or dissipation of heat from heat-generating components, and more particularly to a heat pipe applicable in electronic products such as personal computers for removing heat from electronic components installed therein.
- 2. Description of Related Art
- Currently, heat pipes are widely used for removing heat from heat-generating components such as central processing units (CPUs) of computers. A heat pipe is usually a vacuum casing containing therein a working medium, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from one section of the heat pipe (typically referring to as the “evaporator section”) to another section thereof (typically referring to as the “condenser section”). Preferably, a wick structure is provided inside the heat pipe for drawing the working medium back to the evaporator section after it is condensed at the condenser section. The wick structure currently available for the heat pipe includes fine grooves integrally formed at the inner wall of the casing, screen mesh or fiber inserted into the casing and held against the inner wall thereof, or sintered powders combined to the inner wall of the casing by sintering process.
- In order to draw the condensate back from the condenser section to the evaporator section timely, the wick structure provided in the heat pipe is expected to provide a high capillary force and contain more working medium in the wick structure.
- Therefore, it is desirable to provide a heat pipe with an improved heat transfer capability, whose wick structure provides a high capillary force and contains more working medium therein.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is a partially cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention. -
FIG. 2 is a microscopic view of a portion of a wick structure of the heat pipe ofFIG. 1 . -
FIG. 3 shows a cross-sectional view of a heat pipe in accordance with a second embodiment of the present invention. - Referring to
FIGS. 1 and 2 , a flat heat pipe 10 includes acasing 11 and a three-dimensionalcross-linkage wick structure 13 received in thecasing 11, wherein thewick structure 13 has a plurality of pores therein and is saturated with a working medium. - The
casing 11 is made of a highly thermally conductive material such as copper or aluminum and has an evaporator section at one end thereof and a condenser section at an opposite end thereof. Thecasing 11 includes abottom plate 112 at a bottom side thereof and anupper plate 111 at a top side thereof opposite to thebottom plate 112. - The
wick structure 13 is made of a highly thermally conductive metal material such as copper or aluminum. The plurality of pores in thewick structure 13 provides a capillary action for drawing the working medium condensed at the condenser section back to the evaporator section. - The
wick structure 13 includes abottom layer 131 and a plurality ofprotrusions 132 extending upwardly from thebottom layer 131. Thebottom layer 131 is flat and attached to thebottom plate 112. Theprotrusions 132 are extended over an entire length of the heat pipe 10, from the evaporator section to the condenser section of thecasing 11. A top of theprotrusion 132 is attached to theupper plate 111, thereby supporting thetop plate 11 to improve the robustness and flatness of the heat pipe 10. Theprotrusion 132 has a trapezium-shaped transverse cross section. In other alternative embodiments, theprotrusion 132 can have a triangle-shaped or a rectangle-shaped transverse cross section. Theprotrusions 132 are spaced from each other, whereby agroove 133 is defined between twoadjacent protrusions 132. Thegroove 133 is used as a vapor channel. Thegroove 133 extends longitudinally from the evaporator section to the condenser section of thecasing 11. Thebottom layer 131 has aconnection portion 135 corresponding to and located just under thegroove 133, wherein theconnection portion 135 of thebottom layer 131 is formed between and connects with the twoadjacent protrusions 132. - The
protrusion 132 has a greater pore size than theconnection portion 135 of thebottom layer 131, whereby theprotrusion 132 has a lower flow resistance for the working medium and can contain more working medium condensed at the condenser section in the pores of theprotrusion 132. Theconnection portion 135 of thebottom layer 131 has a smaller pore size than theprotrusion 132, whereby theconnection portion 135 has a larger capillary action than theprotrusion 132. Thus, the condensed working medium at the condenser section of thecasing 11 can flow more rapidly from theupper plate 111 toward thebottom plate 112 via theprotrusion 132 under the capillary action of theconnection portion 135. Then the condensed working medium flows along thebottom layer 131 from the condenser section to the evaporator section of thecasing 11 for another heat transfer cycle. -
FIG. 2 shows a microscopic view of a portion of thewick structure 13, in which thewick structure 13 has a large porosity and three-dimensional interlocking, whereby thewick structure 13 can have a better performance in the absorption and delivery of the condensed working medium than the conventional wick structure: mesh, sintered powder or tiny grooves. - The
wick structure 13 is formed by first preparing a sponge with a predetermined porosity and pore size. Then the sponge is activated so that it can be electroplated with a metallic layer thereon. Thereafter, the electroplated sponge is put in a tank for subject to electrocasting whereby a copper (or aluminum) wicking structure is formed on the metallic layer, thereby to obtain a semifinished product. The semifinished is then heated at a high temperature to remove the sponge therefrom and sinter the copper wicking structure. Finally, the sintered copper wicking structure is pressed to form thegrooves 133 in the sintered copper wicking structure to thereby obtain thewick structure 13, wherein theprotrusions 132 have larger pores therein and theconnection portions 135 have smaller pores therein. -
FIG. 3 shows a round heat pipe 20 according to a second embodiment of the present invention. Thecasing 21 of the heat pipe 20 has a ring-like transverse cross section. Thewick structure 23 is received in thecasing 21 and defines avapor channel 24 therein. Thebottom layer 231 of thewick structure 23 is attached to an inner peripheral surface of thecasing 21. The plurality ofprotrusions 232 extends radially and inwardly from thebottom layer 231 towards a center of the round heat pipe 20, in which avapor channel 24 which communicates with a groove between twoadjacent protrusions 232 is extended. Thewick structure 23 is formed by the same method for forming thewick structure 13, except that they have a flat shape and a ring-like shape, respectively. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910300209.9A CN101782342B (en) | 2009-01-16 | 2009-01-16 | Heat pipe and method for manufacturing capillary structure thereof |
CN200910300209.9 | 2009-01-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100181048A1 true US20100181048A1 (en) | 2010-07-22 |
Family
ID=42336017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/483,228 Abandoned US20100181048A1 (en) | 2009-01-16 | 2009-06-11 | Heat pipe |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100181048A1 (en) |
CN (1) | CN101782342B (en) |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120222836A1 (en) * | 2011-03-04 | 2012-09-06 | Tsung-Hsien Huang | Heat sink assembly |
US20120227934A1 (en) * | 2011-03-11 | 2012-09-13 | Kunshan Jue-Chung Electronics Co. | Heat pipe having a composite wick structure and method for making the same |
EP2527776A1 (en) * | 2011-05-24 | 2012-11-28 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
FR2976739A3 (en) * | 2011-06-16 | 2012-12-21 | Renault Sa | Thermal regulation device for battery of electric storage cells to provide electrical supply to vehicle i.e. car, has enclosure provided with walls with part that is in contact with circuit, where coolant is circulated in circuit |
US20130032312A1 (en) * | 2011-08-04 | 2013-02-07 | Ching-Chung Wang | Vapor chamber capillary formation method and structure thereof |
US20130213611A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
US20150114606A1 (en) * | 2013-10-29 | 2015-04-30 | Louisiana Tech University Research Foundation; a Division of Louisiana Tech University Foundation, | Capillary Action Heat Exchanger |
US20150211803A1 (en) * | 2014-01-28 | 2015-07-30 | Phononic Devices, Inc. | Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser |
US9121645B2 (en) | 2013-02-11 | 2015-09-01 | Google Inc. | Variable thickness heat pipe |
US20160305715A1 (en) * | 2015-04-14 | 2016-10-20 | Celsia Technologies Taiwan, Inc. | Phase-changing heat dissipater and manufacturing method thereof |
US20170064868A1 (en) * | 2015-01-08 | 2017-03-02 | General Electric Company | System and method for thermal management using vapor chamber |
US20170153072A1 (en) * | 2014-07-02 | 2017-06-01 | Mitsubishi Materials Corporation | Porous aluminum heat exchanger |
US20170325356A1 (en) * | 2016-05-09 | 2017-11-09 | Fukui Precision Component (Shenzhen) Co., Ltd. | Ultrathin heat dissipation structure and a method for manufacturing same |
US10458718B2 (en) * | 2017-11-29 | 2019-10-29 | Asia Vital Components Co., Ltd. | Airtight penetration structure for heat dissipation device |
FR3083036A1 (en) * | 2018-06-21 | 2019-12-27 | Valeo Systemes Thermiques | COOLING DEVICE OF AN ELECTRIC MOTOR FOR A MOTOR VEHICLE |
US20200326135A1 (en) * | 2017-12-28 | 2020-10-15 | Furukawa Electric Co., Ltd. | Heat pipe |
US20200326131A1 (en) * | 2017-12-28 | 2020-10-15 | Furukawa Electric Co., Ltd. | Heat sink |
JP2021014936A (en) * | 2019-07-10 | 2021-02-12 | 株式会社フジクラ | Vapor chamber and method of manufacturing the same |
US10981230B2 (en) | 2014-05-30 | 2021-04-20 | Mitsubishi Materials Corporation | Porous aluminum complex and method of producing porous aluminum complex |
US11035621B2 (en) | 2016-06-21 | 2021-06-15 | Ge Aviation Systems Llc | Electronics cooling with multi-phase heat exchange and heat spreader |
US20210310751A1 (en) * | 2020-04-01 | 2021-10-07 | Lenovo (Beijing) Co., Ltd. | Heat conductiing device |
US11340022B2 (en) * | 2017-04-28 | 2022-05-24 | Murata Manufacturing Co., Ltd. | Vapor chamber having pillars with decreasing cross-sectional area |
WO2022185908A1 (en) * | 2021-03-05 | 2022-09-09 | 古河電気工業株式会社 | Heat pipe |
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TWI563238B (en) * | 2015-04-16 | 2016-12-21 | Celsia Technologies Taiwan Inc | Manufacturing method of phase change type heat sink |
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CN107617751B (en) * | 2017-09-14 | 2019-05-24 | 西安交通大学 | A kind of electro spindle cooling based on modified rotating heat pipe axle center |
TWI639807B (en) * | 2017-12-15 | 2018-11-01 | 奇鋐科技股份有限公司 | Anti-pressure structure of heat dissipation device |
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CN113664206A (en) * | 2020-05-15 | 2021-11-19 | 苏州铜宝锐新材料有限公司 | Method for manufacturing heat transfer structure |
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US3598180A (en) * | 1970-07-06 | 1971-08-10 | Robert David Moore Jr | Heat transfer surface structure |
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US20070084587A1 (en) * | 2004-07-21 | 2007-04-19 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
US20080142196A1 (en) * | 2006-12-17 | 2008-06-19 | Jian-Dih Jeng | Heat Pipe with Advanced Capillary Structure |
US20090159242A1 (en) * | 2007-12-19 | 2009-06-25 | Teledyne Licensing, Llc | Heat pipe system |
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CN101163388A (en) * | 2007-11-27 | 2008-04-16 | 艾建华 | Heat radiating capillary structure, heat conducting component and method for making the heat radiating capillary structure |
-
2009
- 2009-01-16 CN CN200910300209.9A patent/CN101782342B/en not_active Expired - Fee Related
- 2009-06-11 US US12/483,228 patent/US20100181048A1/en not_active Abandoned
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US3598180A (en) * | 1970-07-06 | 1971-08-10 | Robert David Moore Jr | Heat transfer surface structure |
US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
US6896039B2 (en) * | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US20030141045A1 (en) * | 2002-01-30 | 2003-07-31 | Samsung Electro-Mechanics Co., Ltd. | Heat pipe and method of manufacturing the same |
US6650544B1 (en) * | 2002-07-26 | 2003-11-18 | Tai-Sol Electronics, Co., Ltd. | Integrated circuit chip cooling structure with vertical mounting through holes |
US20070084587A1 (en) * | 2004-07-21 | 2007-04-19 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
US20070017814A1 (en) * | 2005-07-22 | 2007-01-25 | Ching-Bai Hwang | Heat spreader with vapor chamber defined therein and method of manufacturing the same |
US20080142196A1 (en) * | 2006-12-17 | 2008-06-19 | Jian-Dih Jeng | Heat Pipe with Advanced Capillary Structure |
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Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9175911B2 (en) * | 2011-03-04 | 2015-11-03 | Tsung-Hsien Huang | Heat sink assembly |
US20120222836A1 (en) * | 2011-03-04 | 2012-09-06 | Tsung-Hsien Huang | Heat sink assembly |
US20120227934A1 (en) * | 2011-03-11 | 2012-09-13 | Kunshan Jue-Chung Electronics Co. | Heat pipe having a composite wick structure and method for making the same |
EP2527776A1 (en) * | 2011-05-24 | 2012-11-28 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
WO2012160128A1 (en) * | 2011-05-24 | 2012-11-29 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
US11168944B2 (en) | 2011-05-24 | 2021-11-09 | Aavid Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
US20220128312A1 (en) * | 2011-05-24 | 2022-04-28 | Aavid Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
FR2976739A3 (en) * | 2011-06-16 | 2012-12-21 | Renault Sa | Thermal regulation device for battery of electric storage cells to provide electrical supply to vehicle i.e. car, has enclosure provided with walls with part that is in contact with circuit, where coolant is circulated in circuit |
US20130032312A1 (en) * | 2011-08-04 | 2013-02-07 | Ching-Chung Wang | Vapor chamber capillary formation method and structure thereof |
US9170058B2 (en) * | 2012-02-22 | 2015-10-27 | Asia Vital Components Co., Ltd. | Heat pipe heat dissipation structure |
US20130213611A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
US9121645B2 (en) | 2013-02-11 | 2015-09-01 | Google Inc. | Variable thickness heat pipe |
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CN101782342A (en) | 2010-07-21 |
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