CN101782342B - Heat pipe and method for manufacturing capillary structure thereof - Google Patents
Heat pipe and method for manufacturing capillary structure thereof Download PDFInfo
- Publication number
- CN101782342B CN101782342B CN200910300209.9A CN200910300209A CN101782342B CN 101782342 B CN101782342 B CN 101782342B CN 200910300209 A CN200910300209 A CN 200910300209A CN 101782342 B CN101782342 B CN 101782342B
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- Prior art keywords
- capillary structure
- capillary
- heat pipe
- porosity
- shell
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Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 238000005323 electroforming Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 230000003213 activating effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 230000003292 diminished effect Effects 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract description 19
- 230000035699 permeability Effects 0.000 abstract description 5
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000001112 coagulating effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a heat pipe, which comprises a shell and a capillary structure arranged inside the shell, wherein the capillary structure comprises a bottom layer and a plurality of protrusions convexly arranged on the bottom layer; the bottom layer is combined with the shell; the protrusions are alternately arrange so as to form a groove between every two adjacent protrusions; the part of the bottom layer close to the bottom ends of the grooves is formed as a ditch part of the grooves; and the capillary radius and the porosity of the capillary structure of the groove area is smaller than these of the protrusions area. The capillary structure helps to raise the permeability and liquidity of working fluid in the heat pipe so as to ensure good heat transfer performance of the heat pipe. The invention also relates to a method for manufacturing the capillary structure of the heat pipe.
Description
Technical field
The present invention relates to a kind of heat transfer unit (HTU), particularly a kind of preparation method that is applied to heat pipe and the capillary structure thereof in electronic element radiating field.
Background technology
At present, because heat pipe has faster heat transfer rate, and be widely used in the electronic element radiating field.
Heat pipe commonly used comprises a closed container, be located at a liquid-sucking core in the closed container and an amount of hydraulic fluid, and this heat pipe one end is evaporation ends and the other end is condensation end.When the heat pipe evaporation ends is heated, the hydraulic fluid carburation by evaporation, steam condenses into liquid after condensation end is emitted heat flowing under the small pressure reduction, and liquid is back to evaporation ends under the capillary force effect of liquid-sucking core, thereby makes heat reach rapidly condensation end by the heat pipe evaporation ends.And the service behaviour of heat pipe is subjected to the impact of capillary force and permeability two factors, this two factor changes along with the size of the capillary porosity of the capillary structure of liquid-sucking core, when the capillary porosity hour, it has larger capillary force, can drive coagulating liq and enter in the capillary structure and to evaporation ends and reflux, but then, the frictional force and the viscous force that reduce hydraulic fluid is refluxed of capillary porosity increase, be that hydraulic fluid backflow resistance increases, cause the hydraulic fluid back-flow velocity slow, easily make properties of product bad.And when the capillary porosity was larger, hydraulic fluid was subject to less backflow resistance, and still, the capillary force that coagulating liq sucks capillary structure also can reduce thereupon, is unfavorable for the backflow of hydraulic fluid, equally easily causes properties of product bad.
Summary of the invention
In view of this, be necessary to provide a kind of heat pipe of better performances.
A kind of heat pipe, comprise shell and be located at the interior capillary structure of shell, described capillary structure comprises bottom and is convexly set in some projections on the described bottom, described bottom is incorporated on the described shell, described bulge clearance setting, thereby form a groove between every two adjacent projections, described bottom forms the ditch section of groove near the part of groove bottom, and capillary radius and the porosity of the capillary radius of the capillary structure in described ditch section zone and the capillary structure of the more described elevated regions of porosity are little.
A kind of preparation method of capillary structure of heat pipe comprises: according to aperture and the porosity of required capillary structure, and the base material of selecting the porous sponge close with porosity with the aperture of capillary structure to make as capillary structure; The plating front activating is processed, and electroplates the top layer to form on the sponge surface; The sponge that will have a plating top layer is inserted and carries out electroforming in the electrotyping bath; The capillary copper fine texture that electroforming is good carries out high temperature sintering, removes the spongy tissue in the copper mesh, forms the capillary structure with three-dimensional netted cross-linked structure; To have the capillary structure cutting of three-dimensional netted cross-linked structure or be pressed into needed groove shape, make capillary structure comprise a bottom and be formed at spaced some projections and groove on the described bottom, capillary radius and the porosity of the capillary radius of the capillary structure in described ditch section zone and the capillary structure of the more described elevated regions of porosity are little.
In the above-mentioned heat pipe, the capillary structure in described ditch section zone has capillary radius and the porosity different from the capillary structure of described elevated regions, thereby make the hydraulic fluid backflow drag reduction in the larger zone of the capillary radius of this capillary structure and porosity, and the hydraulic fluid capillary force in the zone of the capillary radius of this capillary structure and porosity increases, the permeability that is conducive to improve the working fluid in the heat pipe makes heat pipe have good heat transfer property with mobile.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Description of drawings
Fig. 1 is the heat pipe generalized section radially of first embodiment of the invention.
Fig. 2 is the photo schematic diagram that the capillary structure in the heat pipe shown in Figure 1 passes through microscope photographing.
Fig. 3 is the heat pipe generalized section radially of second embodiment of the invention.
The specific embodiment
Figure 1 shows that the heat pipe in a preferred embodiment of the present invention, this heat pipe is template, and it comprises a shell 11 and is formed at a capillary structure 13 on these shell 11 inwalls.Be filled with an amount of hydraulic fluid in this heat pipe, this hydraulic fluid is selected the liquid of low boiling stable chemical nature, such as ethanol, water etc.
This shell 11 is to be made by heat conductivility good material such as copper, albronze etc., the lower house 112 that it comprises a upper shell 111 that is positioned at the top and is positioned at the below.
This capillary structure 13 by heat conductivility preferably metal material make, such as copper or aluminium etc.Figure 2 shows that this capillary structure by the photo schematic diagram of microscope photographing, this capillary structure 13 has three-dimensional netted cross-linked structure, and this structure has three-dimensional shape with respect to netted (mesh) two-dimension plane structure; Has larger capillary force with respect to groove (groove) structure; Have more complete cross-linked network and larger porosity with respect to sintered powder (sinter power) structure, and when stressed compacting, also be difficult for broken.
Referring again to Fig. 1, in the present embodiment, this capillary structure 13 is groove-shaped, and it comprises a bottom 131 and is convexly set in some protruding 132 on this bottom 131.This bottom 131 is plate, and its bottom surface fits tightly on the lower house 112 of this shell 11.These projections 132 are trapezoidal, and its end face is resisted against on the upper shell 111 of this shell 11.These protruding 132 intervals arrange, thereby form the groove 133 of an inversion trapezoidal shape in every 132 adjacent of two projections, this bottom 131 forms the ditch section 135 of groove 133 near the part of groove 133 bottoms, the capillary structure in described ditch section 135 zones has capillary radius and the porosity different from the capillary structure in described protruding 132 zones, in the present embodiment, capillary radius and the porosity of the capillary structure in more protruding 132 zones of capillary structure in described ditch section 135 zones are little.
In the above-mentioned heat pipe, because the capillary structure in described ditch section 135 zones has capillary radius and the porosity different from the capillary structure in described protruding 132 zones, thereby make the hydraulic fluid backflow drag reduction in the larger zone (projection 132 zones among the first embodiment) of the capillary radius of this capillary structure 13 and porosity, and the hydraulic fluid capillary force in the zone of the capillary radius of this capillary structure 13 and porosity (ditch section 135 zones among the first embodiment) increases, the permeability that is conducive to improve the working fluid in the heat pipe makes heat pipe have good heat transfer property with mobile.Further, because capillary radius and the porosity of the capillary structure in described protruding 132 zones are relatively large, therefore it has preferably permeability, thereby can make the hydraulic fluid (near the hydraulic fluid of radiator or other radiators) on upper strata flow to swimmingly lower floor by described protruding 132, in addition, described protruding 132 can increase the disengagement area of hydraulic fluid effectively, therefore, are conducive to strengthen heat radiation and the heat biography effect of heat pipe.Moreover, described protruding 132 end face is resisted against on the upper shell 111 of this shell 11, the bottom surface of described bottom 131 fits tightly on the lower house 112 of this shell 11, can play shell 11 and strengthen and supporting role, has higher crushing resistance and flatness to guarantee heat pipe.
Below with the manufacture method of the capillary structure 13 in the above-mentioned heat pipe of electro-coppering capillary structure simple declaration.
According to product structure and hot biography amount, calculate required capillary force and capillary radius, with aperture and the porosity of determining capillary structure; The base material of selecting the porous sponge (polyester, polyethers) close with porosity with the aperture of capillary structure to make as capillary structure; The plating front activating is processed, and porous sponge is carried out necessary washing, ungrease treatment, activates afterwards into plating and processes (or spraying conductive paint, conductive oil, chemical plating etc.), electroplates the top layer to form on the sponge surface; Electroplate thickening and process, the sponge that will have afterwards a plating top layer is inserted and carries out electroforming in the electrotyping bath, after reaching certain thickness, takes out, and casts post processing; The capillary copper fine texture that electroforming is good carries out high temperature sintering, removes the spongy tissue in the copper mesh, namely forms the capillary structure with three-dimensional netted cross-linked structure; To have the capillary structure cutting of three-dimensional netted cross-linked structure or be pressed into needed groove shape, be trapezoidal in this enforcement, namely makes above-mentioned capillary structure 13.
In the above-mentioned manufacture method, can be according to product needed, select different porous sponges as the making base material of capillary structure different parts, so that the different parts of capillary structure has different capillary radius and porosity, can make projection 132 and the ditch section 135 of above-mentioned capillary structure 13 have different capillary radius and porosity, thereby reach reasonable layout capillary force and infiltrative effect.In addition, in the above-mentioned manufacture method, also can select identical porous sponge as the making base material of capillary structure, then press the different parts of the capillary structure of making by the method for compacting, shrink because being squeezed at the down trodden position of this capillary structure, thereby capillary radius and the porosity at this position are diminished, also form groove 133 in this place simultaneously.
Figure 3 shows that the second embodiment of heat pipe of the present invention, different from the heat pipe among the first embodiment is, the shell 21 of this heat pipe is annular, the bottom 231 of this capillary structure 23 also is annular, the bottom surface of this bottom 231 fits on the whole inwall of this shell 21, described protruding 232 radially extend, and its end face interval setting, are not resisted against on the shell 21 of heat pipe.
Certainly, the shape of the capillary structure 13 of above-mentioned heat pipe, 23 projection 132 and groove 133 also is not limited to trapezoidal, also can be square, triangle etc.
Claims (8)
1. heat pipe, comprise shell and be located at the interior capillary structure of shell, it is characterized in that: described capillary structure comprises bottom and is convexly set in some projections on the described bottom, described bottom is incorporated on the described shell, described bulge clearance setting, thereby between every two adjacent projections, form a groove, described bottom forms the ditch section of groove near the part of groove bottom, and capillary radius and the porosity of the capillary radius of the capillary structure in described ditch section zone and the capillary structure of the more described elevated regions of porosity are little.
2. heat pipe as claimed in claim 1, it is characterized in that: described heat pipe is template, the shell of described heat pipe comprises the upper shell that is positioned at the top and is positioned at the lower house of below, described bottom is plate, its bottom surface fits on the lower house of this shell, and the end face of described projection is resisted against on the upper shell of this shell.
3. heat pipe as claimed in claim 1, it is characterized in that: described heat pipe is circular ring type, and the bottom of described this capillary structure also is annular, and the bottom surface of described bottom fits on the inwall of described shell, and described projection is radially extended, and its end face interval arranges.
4. heat pipe as claimed in claim 1, it is characterized in that: described projection and groove are trapezoidal, triangle or square.
5. heat pipe as claimed in claim 1, it is characterized in that: described capillary structure has three-dimensional netted cross-linked structure.
6. the preparation method of the capillary structure of a heat pipe comprises:
According to aperture and the porosity of required capillary structure, the base material of selecting the porous sponge close with porosity with the aperture of capillary structure to make as capillary structure;
The plating front activating is processed, and electroplates the top layer to form on the sponge surface;
The sponge that will have a plating top layer is inserted and carries out electroforming in the electrotyping bath;
The capillary copper fine texture that electroforming is good carries out high temperature sintering, removes the spongy tissue in the copper mesh, forms the capillary structure with three-dimensional netted cross-linked structure;
To have the capillary structure cutting of three-dimensional netted cross-linked structure or be pressed into needed groove shape, make capillary structure comprise a bottom and be formed at spaced some projections and groove on the described bottom, capillary radius and the porosity of the capillary radius of the capillary structure in described ditch section zone and the capillary structure of the more described elevated regions of porosity are little.
7. the preparation method of the capillary structure of heat pipe as claimed in claim 6 is characterized in that: select different porous sponges as the making base material of capillary structure different parts, so that the different parts of capillary structure has different capillary radius and porosity.
8. the preparation method of the capillary structure of heat pipe as claimed in claim 6, it is characterized in that: select identical porous sponge as the making base material of capillary structure, then press the different parts of the capillary structure of making by the method for compacting, shrink because being squeezed at the down trodden position of described capillary structure, thereby capillary radius and the porosity at this position are diminished, also form described groove in this place simultaneously.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910300209.9A CN101782342B (en) | 2009-01-16 | 2009-01-16 | Heat pipe and method for manufacturing capillary structure thereof |
| US12/483,228 US20100181048A1 (en) | 2009-01-16 | 2009-06-11 | Heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910300209.9A CN101782342B (en) | 2009-01-16 | 2009-01-16 | Heat pipe and method for manufacturing capillary structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101782342A CN101782342A (en) | 2010-07-21 |
| CN101782342B true CN101782342B (en) | 2013-03-20 |
Family
ID=42336017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910300209.9A Expired - Fee Related CN101782342B (en) | 2009-01-16 | 2009-01-16 | Heat pipe and method for manufacturing capillary structure thereof |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100181048A1 (en) |
| CN (1) | CN101782342B (en) |
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Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102109286B (en) * | 2011-03-04 | 2012-09-19 | 东莞汉旭五金塑胶科技有限公司 | Heat radiator assembly |
| US20120227934A1 (en) * | 2011-03-11 | 2012-09-13 | Kunshan Jue-Chung Electronics Co. | Heat pipe having a composite wick structure and method for making the same |
| EP2527776A1 (en) * | 2011-05-24 | 2012-11-28 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
| FR2976739A3 (en) * | 2011-06-16 | 2012-12-21 | Renault Sa | Thermal regulation device for battery of electric storage cells to provide electrical supply to vehicle i.e. car, has enclosure provided with walls with part that is in contact with circuit, where coolant is circulated in circuit |
| US20130032312A1 (en) * | 2011-08-04 | 2013-02-07 | Ching-Chung Wang | Vapor chamber capillary formation method and structure thereof |
| US9170058B2 (en) * | 2012-02-22 | 2015-10-27 | Asia Vital Components Co., Ltd. | Heat pipe heat dissipation structure |
| CN103317137B (en) * | 2012-03-19 | 2016-10-19 | 富瑞精密组件（昆山）有限公司 | Manufacturing method of thermotube and heat pipe |
| US9121645B2 (en) | 2013-02-11 | 2015-09-01 | Google Inc. | Variable thickness heat pipe |
| US20150114606A1 (en) * | 2013-10-29 | 2015-04-30 | Louisiana Tech University Research Foundation; a Division of Louisiana Tech University Foundation, | Capillary Action Heat Exchanger |
| US9746247B2 (en) * | 2014-01-28 | 2017-08-29 | Phononic Devices, Inc. | Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser |
| JP6477254B2 (en) | 2014-05-30 | 2019-03-06 | 三菱マテリアル株式会社 | Porous aluminum composite and method for producing porous aluminum composite |
| JP6237500B2 (en) * | 2014-07-02 | 2017-11-29 | 三菱マテリアル株式会社 | Porous aluminum heat exchange member |
| US10356945B2 (en) * | 2015-01-08 | 2019-07-16 | General Electric Company | System and method for thermal management using vapor chamber |
| US20160305715A1 (en) * | 2015-04-14 | 2016-10-20 | Celsia Technologies Taiwan, Inc. | Phase-changing heat dissipater and manufacturing method thereof |
| TWI563238B (en) * | 2015-04-16 | 2016-12-21 | Celsia Technologies Taiwan Inc | Manufacturing method of phase change type heat sink |
| CN107360695B (en) * | 2016-05-09 | 2019-07-23 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
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| CN111527367B (en) * | 2017-12-28 | 2021-11-05 | 古河电气工业株式会社 | Heat pipe |
| CN212673920U (en) * | 2017-12-28 | 2021-03-09 | 古河电气工业株式会社 | Heat radiator |
| FR3083036A1 (en) * | 2018-06-21 | 2019-12-27 | Valeo Systemes Thermiques | COOLING DEVICE OF AN ELECTRIC MOTOR FOR A MOTOR VEHICLE |
| CN109295484A (en) * | 2018-11-02 | 2019-02-01 | 江西华度电子新材料有限公司 | A kind of anti-oxidant hot plate liquid-sucking core and preparation method thereof |
| JP7350543B2 (en) * | 2019-07-10 | 2023-09-26 | 株式会社フジクラ | Vapor chamber and vapor chamber manufacturing method |
| CN111290554A (en) * | 2020-04-01 | 2020-06-16 | 联想(北京)有限公司 | Heat conduction device and processing method thereof |
| CN113532171A (en) * | 2020-04-22 | 2021-10-22 | 华为技术有限公司 | Temperature-uniforming plate and electronic equipment |
| CN113664206A (en) * | 2020-05-15 | 2021-11-19 | 苏州铜宝锐新材料有限公司 | Method for manufacturing heat transfer structure |
| CN219776443U (en) * | 2021-03-05 | 2023-09-29 | 古河电气工业株式会社 | Heat pipe |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3598180A (en) * | 1970-07-06 | 1971-08-10 | Robert David Moore Jr | Heat transfer surface structure |
| US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
| US6650544B1 (en) * | 2002-07-26 | 2003-11-18 | Tai-Sol Electronics, Co., Ltd. | Integrated circuit chip cooling structure with vertical mounting through holes |
| CN1901176A (en) * | 2005-07-22 | 2007-01-24 | 富准精密工业(深圳)有限公司 | Air-tightness chamber heat radiation structure and its producing method |
| CN101163388A (en) * | 2007-11-27 | 2008-04-16 | 艾建华 | Heat radiating capillary structure, heat conducting component and method for making the heat radiating capillary structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6896039B2 (en) * | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| KR20030065686A (en) * | 2002-01-30 | 2003-08-09 | 삼성전기주식회사 | Heat pipe and method thereof |
| WO2006007721A1 (en) * | 2004-07-21 | 2006-01-26 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
| US20080142196A1 (en) * | 2006-12-17 | 2008-06-19 | Jian-Dih Jeng | Heat Pipe with Advanced Capillary Structure |
| US8356657B2 (en) * | 2007-12-19 | 2013-01-22 | Teledyne Scientific & Imaging, Llc | Heat pipe system |
-
2009
- 2009-01-16 CN CN200910300209.9A patent/CN101782342B/en not_active Expired - Fee Related
- 2009-06-11 US US12/483,228 patent/US20100181048A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3598180A (en) * | 1970-07-06 | 1971-08-10 | Robert David Moore Jr | Heat transfer surface structure |
| US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
| US6650544B1 (en) * | 2002-07-26 | 2003-11-18 | Tai-Sol Electronics, Co., Ltd. | Integrated circuit chip cooling structure with vertical mounting through holes |
| CN1901176A (en) * | 2005-07-22 | 2007-01-24 | 富准精密工业(深圳)有限公司 | Air-tightness chamber heat radiation structure and its producing method |
| CN101163388A (en) * | 2007-11-27 | 2008-04-16 | 艾建华 | Heat radiating capillary structure, heat conducting component and method for making the heat radiating capillary structure |
Non-Patent Citations (1)
| Title |
|---|
| JP昭63-183387A 1988.07.28 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI639807B (en) * | 2017-12-15 | 2018-11-01 | 奇鋐科技股份有限公司 | Anti-pressure structure of heat dissipation device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100181048A1 (en) | 2010-07-22 |
| CN101782342A (en) | 2010-07-21 |
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