CN206739948U - Temperature equalizing plate - Google Patents
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- CN206739948U CN206739948U CN201720426114.1U CN201720426114U CN206739948U CN 206739948 U CN206739948 U CN 206739948U CN 201720426114 U CN201720426114 U CN 201720426114U CN 206739948 U CN206739948 U CN 206739948U
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- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000012530 fluid Substances 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 abstract 1
- 239000011148 porous material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011796 hollow space material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及热传导技术领域,尤其是涉及一种均温板。The utility model relates to the technical field of heat conduction, in particular to a uniform temperature plate.
背景技术Background technique
现有的均温板为一种板状热管,于内部真空的环境内注入工作液体,藉由工作流体的液气相变化执行热交换的功能。现有的均温板具有板状外形,其一般由两相盖合的盖板所组成,利用大表面积的两板面分别作为受热端和散热端。均温板的内部则一般设有毛细组织(wick structure)以加速工作流体的汽化和流动。The existing vapor chamber is a plate-shaped heat pipe, which injects working fluid into the internal vacuum environment, and performs the function of heat exchange through the liquid-gas phase change of the working fluid. Existing vapor chambers have a plate-like shape, and are generally composed of two-phase cover plates, using the two plate surfaces with large surface areas as the heating end and the heat dissipation end respectively. The interior of the vapor chamber is generally provided with a wick structure to accelerate the vaporization and flow of the working fluid.
中国台湾专利号I524047揭露一种具有复合毛细结构的均温板,复合毛细结构分别具有储液、传输和支撑功能。美国专利号6,082,443则揭露于均温板内设置金属网状的结构于两盖板之间以增加工作流体于气态时的辐射面积。China Taiwan Patent No. I524047 discloses a vapor chamber with a composite capillary structure, and the composite capillary structure has the functions of liquid storage, transmission and support respectively. US Patent No. 6,082,443 discloses that a metal mesh structure is arranged in the chamber between two cover plates to increase the radiation area of the working fluid in gaseous state.
实用新型内容Utility model content
本实用新型要解决的技术问题在于,针对现有技术存在的上述不足,提供一种均温板,其内置贴近发热源的金属块,能够加速传导来自发热源的热量。The technical problem to be solved by the utility model is to provide a vapor chamber with a built-in metal block close to the heat source, which can accelerate the conduction of heat from the heat source.
本实用新型解决其技术问题所采用的技术方案是提供一种均温板,包括板体、金属块以及毛细组织,该板体内部呈中空状而形成一第一腔室,且该板体具有向该板体的外面突出的一突出部,其中,该突出部的内部形成一第二腔室;该金属块设置于该第二腔室中且具有面向该第一腔室的一第一表面;该毛细组织暴露于该第一腔室中,其设置于该板体的内面上以及该金属块的该第一表面上。The technical scheme adopted by the utility model to solve the technical problem is to provide a uniform temperature plate, which includes a plate body, a metal block and capillary tissue. The inside of the plate body is hollow to form a first chamber, and the plate body has a protruding portion protruding to the outside of the plate body, wherein a second cavity is formed inside the protruding portion; the metal block is disposed in the second cavity and has a first surface facing the first cavity ; The capillary tissue is exposed in the first chamber, which is disposed on the inner surface of the plate body and the first surface of the metal block.
较佳地,该金属块的该第一表面形成有与该毛细组织结合的多个呈平行或网状的沟槽、或多个柱状突起结构。Preferably, the first surface of the metal block is formed with a plurality of parallel or mesh-shaped grooves or a plurality of columnar protrusion structures combined with the capillary tissue.
较佳地,该多个沟槽或柱状突起结构以蚀刻方式形成。Preferably, the plurality of grooves or columnar protrusion structures are formed by etching.
较佳地,该金属块以烧结方式或硬焊方式与该突出部结合,并且固定于该第二腔室中。Preferably, the metal block is combined with the protruding part by sintering or brazing, and is fixed in the second cavity.
较佳地,该毛细组织包括具有一第一毛细孔径的一第一毛细部和具有一第二毛细孔径的一第二毛细部,该第一毛细孔径和该第二毛细孔径相同或相异。Preferably, the capillary structure includes a first capillary portion with a first capillary diameter and a second capillary portion with a second capillary diameter, the first capillary diameter and the second capillary diameter are the same or different.
较佳地,该第一毛细部和该第二毛细部为层叠地或相邻并排地设置于该板体的内面和该金属块的该第一表面上。Preferably, the first capillary portion and the second capillary portion are stacked or adjacently arranged on the inner surface of the plate body and the first surface of the metal block.
较佳地,该第一毛细部和该第二毛细部为相邻并排时,该第二毛细部设置于该金属块的该第一表面上且该第一毛细部包围该第二毛细部并设置于该板体的内面,该第一毛细孔径大于该第二毛细孔径。Preferably, when the first capillary portion and the second capillary portion are adjacent to each other, the second capillary portion is disposed on the first surface of the metal block and the first capillary portion surrounds the second capillary portion and It is arranged on the inner surface of the plate body, and the first capillary diameter is larger than the second capillary diameter.
较佳地,该板体由一第一盖板和具有该突出部的一第二盖板相对盖合,该第一毛细部贴附于该第一盖板的内面上并且该第二毛细部贴附于该第二盖板的内面上和该金属块的该第一表面上。Preferably, the plate body is relatively covered by a first cover plate and a second cover plate having the protruding portion, the first capillary portion is attached to the inner surface of the first cover plate and the second capillary portion It is attached to the inner surface of the second cover plate and the first surface of the metal block.
较佳地,该第一毛细孔径大于该第二毛细孔径。Preferably, the first capillary diameter is larger than the second capillary diameter.
较佳地,该均温板还包括分布于该第一腔室中并抵顶于该第一盖板和该第二盖板之间的支撑柱结构。Preferably, the temperature chamber further includes a support column structure distributed in the first chamber and abutted between the first cover plate and the second cover plate.
较佳地,该支撑柱结构为一毛细结构或一实心结构或毛细结构与实心结构的结合。Preferably, the support column structure is a capillary structure or a solid structure or a combination of capillary structure and solid structure.
较佳地,该毛细组织为一编织网或由粉末烧结或部分为编织网部分由粉末烧结。Preferably, the capillary structure is a woven mesh or sintered from powder or partly woven mesh and partly sintered from powder.
较佳地,该均温板还于该第一腔室内设有工作流体,该毛细组织接触该工作流体。Preferably, the vapor chamber is further provided with a working fluid in the first chamber, and the capillary tissue is in contact with the working fluid.
较佳地,该金属块以铜或金为材料。Preferably, the metal block is made of copper or gold.
较佳地,该均温板还包括分布于该第一腔室中并抵顶于该板体的内面的多个支撑柱。Preferably, the temperature chamber further includes a plurality of support columns distributed in the first chamber and abutting against the inner surface of the plate body.
较佳地,该多个支撑柱接触该毛细组织,且任一该支撑柱为一毛细结构或一实心结构或毛细结构与实心结构的结合。Preferably, the plurality of supporting pillars contact the capillary tissue, and any one of the supporting pillars is a capillary structure or a solid structure or a combination of capillary and solid structures.
本实用新型均温板,其内置一金属块于贴近发热源的盖板中,从而加速传导来自发热源的热量,且均温板的两盖板内面和腔室中的支撑柱皆可覆有毛细结构或组织,盖板内面的毛细组织可具有相异的毛细孔径,以进一步优化均温板的热传效果。The uniform temperature plate of the utility model has a built-in metal block in the cover plate close to the heat source, thereby accelerating the conduction of heat from the heat source, and the inner surfaces of the two cover plates of the uniform temperature plate and the support columns in the chamber can be covered with Capillary structure or tissue, the capillary structure on the inner surface of the cover plate can have different capillary pore diameters to further optimize the heat transfer effect of the vapor chamber.
附图说明Description of drawings
图1为本实用新型的均温板的部分结构立体分解示意图。Fig. 1 is a three-dimensional exploded schematic diagram of a partial structure of a temperature chamber of the present invention.
图2为本实用新型的均温板的部分结构剖面示意图。Fig. 2 is a schematic cross-sectional view of part of the structure of the temperature chamber of the present invention.
图3为本实用新型的均温板的另一部分结构剖面示意图。Fig. 3 is a schematic cross-sectional view of another part of the vapor chamber of the present invention.
图4为本实用新型的均温板的又一部分结构剖面示意图。Fig. 4 is a schematic cross-sectional view of another part of the vapor chamber of the present invention.
图5为本实用新型的均温板的再一部分结构剖面示意图。Fig. 5 is a schematic cross-sectional view of another part of the vapor chamber of the present invention.
具体实施方式detailed description
为方便说明,本实用新型图式中的均温板的各结构、组织或部件不依其应用时的比例,而依据说明需要进行不等比例的放大,此并非用以限制本实用新型均温板的实施。For the convenience of description, the structures, structures or parts of the chambers in the diagrams of the utility model are not in accordance with the proportions when they are used, but need to be magnified in different proportions according to the description, which is not intended to limit the temperature chambers of the utility model implementation.
本实用新型以下所称的金属块,是指具有连续、实心的固体结构,且具有良好的热传导性;较佳地,以铜或金为材料的铜块或金块为主。其次,金属块的几何形状依据欲放置处的均温板的板体形状而定,其一或多个表面可以适当的方式,例如蚀刻的方式,形成呈平行或网状的沟槽、或多个柱状突起结构以加强和其它结构或组织结合、固定或利于其它结构或组织的形成。The metal block referred to below in the present invention refers to a continuous, solid solid structure with good thermal conductivity; preferably, copper or gold blocks are mainly made of copper or gold. Secondly, the geometric shape of the metal block depends on the shape of the vapor chamber to be placed, and one or more of its surfaces can be formed in an appropriate manner, such as etching, to form parallel or reticular grooves, or multiple A columnar protruding structure to strengthen the combination with other structures or tissues, fix or facilitate the formation of other structures or tissues.
本实用新型以下所称的板体,是指外观上有相对的两个表面,且该两个表面的面积远大于两表面之间的侧壁面积,其一般可利用相盖合的两盖板组合而成。其次,依据相对作用可将两盖板区分成用以接触或贴近发热源的盖板和起散热作用的盖板,两者的几何形状可相同或相异,侧壁则可由两盖板至少之一一体成型地提供,但本实用新型不限于此。以下虽以平面绘制或说明两盖板,但任一盖板亦可依据需要而设计为弧形或其它形状。再者,板体的内部呈中空状而形成一中空腔室,为方便说明,宏观上由两盖板盖合且介于两板体之间的腔室为以下所称的第一腔室,至于利用任一盖板的板面凹凸轮廓所形成于板体内部的中空空间则为以下所称的第二腔室或第三腔室等等。The plate body referred to below in the utility model refers to two opposite surfaces on the appearance, and the area of the two surfaces is much larger than the side wall area between the two surfaces, which generally can be covered by two cover plates. combined. Secondly, according to the relative function, the two cover plates can be divided into the cover plate for contacting or close to the heat source and the cover plate for heat dissipation. - provided integrally, but the utility model is not limited thereto. Although the two cover plates are drawn or described as planes below, either cover plate can also be designed as an arc or other shapes as required. Furthermore, the inside of the plate body is hollow to form a hollow chamber. For convenience of description, the chamber covered by two cover plates macroscopically and between the two plate bodies is called the first chamber below. As for the hollow space inside the plate body formed by the concave-convex contour of any cover plate, it is referred to as the second chamber or the third chamber and the like below.
本实用新型以下所称的毛细组织或结构,是指组织或结构中具有多个毛细孔或相连通的孔洞空穴,一般为编织网或粉末烧结或结合上述两者所形成,并且可用毛细孔径或毛细密度描述。当编织网具有较松散的交织分布或使用较大颗粒的粉末烧结时,毛细孔径大,毛细密度较低;反之毛细孔径小者,则毛细密度较高。可以理解地,此处的毛细孔径,以统计上的量测得到,可以以一数值或一数值范围表示,并非以每个毛细孔径皆完全相同为必要。The capillary structure or structure referred to below in the utility model refers to a plurality of capillary pores or interconnected holes in the tissue or structure, which are generally formed by woven mesh or powder sintering or a combination of the above two, and the capillary diameter can be used or capillary density description. When the woven mesh has a looser interweaving distribution or is sintered with larger particles of powder, the capillary pore size is large and the capillary density is low; otherwise, the capillary pore size is small, and the capillary density is high. It can be understood that the capillary diameter here is obtained by statistical measurement, and can be represented by a value or a range of values, and it is not necessary that each capillary diameter is exactly the same.
图1为本实用新型的均温板的部分结构立体分解示意图。图2为本实用新型的均温板的部分结构剖面示意图。图3为本实用新型的均温板的另一部分结构剖面示意图。请参考图1至图3,均温板10包括一板体20和内置于板体20中的一金属块30,其中板体20包括一第一盖板22和具有一突出部26的一第二盖板24。于一实施例中,相对盖合的第一盖板22和第二盖板24界定了板体20内部的一中空空间,以第一腔室12表示;第二盖板24向板体20的外面突出的突出部26的内部则形成一第二腔室14。突出部26的几何形状、大小、位置和数量可依需求而定,图中仅为例示说明。其次,金属块30被设置于第二腔室14中,金属块30面向第一腔室12的表面于此标示为第一表面31。金属块30可藉由适当的方式,例如以烧结方式或硬焊方式和第二盖板24的突出部26结合,并固定于第二腔室14中。Fig. 1 is a three-dimensional exploded schematic diagram of a partial structure of a temperature chamber of the present invention. Fig. 2 is a schematic cross-sectional view of part of the structure of the temperature chamber of the present invention. Fig. 3 is a schematic cross-sectional view of another part of the vapor chamber of the present invention. Please refer to FIG. 1 to FIG. 3 , the uniform temperature plate 10 includes a plate body 20 and a metal block 30 built in the plate body 20 , wherein the plate body 20 includes a first cover plate 22 and a first protruding portion 26 Two cover plates 24. In one embodiment, the first cover plate 22 and the second cover plate 24 that are relatively closed define a hollow space inside the plate body 20, represented by the first cavity 12; The inside of the protruding portion 26 forms a second cavity 14 . The geometric shape, size, position and quantity of the protrusions 26 can be determined according to requirements, and the figure is only an example for illustration. Secondly, the metal block 30 is disposed in the second chamber 14 , and the surface of the metal block 30 facing the first chamber 12 is denoted as the first surface 31 here. The metal block 30 can be combined with the protruding portion 26 of the second cover plate 24 by a suitable method, such as sintering or brazing, and fixed in the second chamber 14 .
续参考图1至图3,本实用新型的均温板10在应用时,发热源40一般会接触第二盖板24的突出部26的外表面,故就均温板10来看,第二盖板24可视为受热端;相对地,第一盖板22则为散热端。本实用新型的均温板10内置金属块30,利用贴近发热源40的金属块30加速传导来自发热源40的热量。1 to 3, when the vapor chamber 10 of the present invention is in use, the heat source 40 will generally contact the outer surface of the protrusion 26 of the second cover plate 24, so as far as the vapor chamber 10 is concerned, the second The cover plate 24 can be regarded as a heat-receiving end; in contrast, the first cover plate 22 is a heat-dissipating end. The vapor chamber 10 of the utility model has a built-in metal block 30 , and the metal block 30 close to the heat source 40 is used to accelerate the conduction of heat from the heat source 40 .
再者,图4为本实用新型的均温板的又一部分结构剖面示意图。请参考图2至图4,毛细组织50暴露于第一腔室12中,其设置于第一盖板22和第二盖板24的内面上以及金属块30的第一表面31上。第一腔室12内设有一工作流体(图上未绘),毛细组织50接触工作流体。其次,毛细组织50包括具有一第一毛细孔径的一第一毛细部52和具有一第二毛细孔径的一第二毛细部54,其中,第一毛细孔径和第二毛细孔径相同或相异。于一实施例中,第一毛细部52贴附形成于第一盖板22的内面221上,第二毛细部54则贴附形成于第二盖板24的内面241上和金属块30的第一表面31上,则第一毛细部52和第二毛细部54是层叠地设置于第二盖板24的内面241上和金属块30的第一表面31上。其次,第一毛细孔径较第二毛细孔径大,即第一毛细部52的毛细密度低于第二毛细部54的毛细密度。Furthermore, FIG. 4 is a schematic cross-sectional view of another part of the structure of the temperature chamber of the present invention. Referring to FIG. 2 to FIG. 4 , the capillary tissue 50 is exposed in the first chamber 12 , and is disposed on inner surfaces of the first cover plate 22 and the second cover plate 24 and on the first surface 31 of the metal block 30 . A working fluid (not shown in the figure) is provided in the first chamber 12 , and the capillary tissue 50 is in contact with the working fluid. Secondly, the capillary structure 50 includes a first capillary portion 52 with a first capillary diameter and a second capillary portion 54 with a second capillary diameter, wherein the first capillary diameter and the second capillary diameter are the same or different. In one embodiment, the first capillary portion 52 is attached and formed on the inner surface 221 of the first cover plate 22 , and the second capillary portion 54 is attached and formed on the inner surface 241 of the second cover plate 24 and the second capillary portion of the metal block 30 . On the first surface 31 , the first capillary portion 52 and the second capillary portion 54 are stacked on the inner surface 241 of the second cover plate 24 and on the first surface 31 of the metal block 30 . Secondly, the first capillary diameter is larger than the second capillary diameter, that is, the capillary density of the first capillary portion 52 is lower than that of the second capillary portion 54 .
可以选择地,第一毛细部和第二毛细部亦可相邻并排地设置于板体的内面上和金属块的第一表面上。于一例中,毛细孔径小的第二毛细部设置于金属块的第一表面上,第二毛细部周围则是毛细孔径大的第一毛细部。是以,较佳地,本实用新型的毛细组织包括至少两种不同毛细孔径的毛细部,如此可依据工作流体的性质来优化传热和汽化的速率。Optionally, the first capillary portion and the second capillary portion may also be arranged adjacently and side by side on the inner surface of the plate body and on the first surface of the metal block. In one example, the second capillary portion with small capillary diameter is disposed on the first surface of the metal block, and the surrounding of the second capillary portion is the first capillary portion with large capillary diameter. Therefore, preferably, the capillary structure of the present invention includes at least two capillary portions with different capillary diameters, so that the heat transfer and vaporization rates can be optimized according to the properties of the working fluid.
图5为本实用新型的均温板的再一部分结构剖面示意图。请参考图1至图5,均温板10更包括分布于第一腔室12中并抵顶于第一盖板22和该第二盖板24之间的一支撑柱结构60。于一实施例中,支撑柱结构60包括多个支撑柱,分散于第一腔室12中。其次,多个支撑柱接触第一毛细部52和第二毛细部54。支撑柱可以是实心、表面平滑或粗糙(例如具有沟槽或凹凸)的结构;或是整体为毛细结构(例如有毛细孔分布其中);或是结合实心和毛细的结构,如此可帮助工作流体的气液流动和热传速率。是以,支撑柱结构60可以兼具支撑和优化热传之效。Fig. 5 is a schematic cross-sectional view of another part of the vapor chamber of the present invention. Please refer to FIG. 1 to FIG. 5 , the chamber 10 further includes a support column structure 60 distributed in the first chamber 12 and abutting against between the first cover plate 22 and the second cover plate 24 . In one embodiment, the support column structure 60 includes a plurality of support columns dispersed in the first chamber 12 . Second, the plurality of support posts contact the first capillary portion 52 and the second capillary portion 54 . The support column can be solid, with a smooth or rough surface (for example, with grooves or bumps); or a capillary structure as a whole (for example, with capillary pores distributed in it); or a combination of solid and capillary structures, which can help the working fluid The gas-liquid flow and heat transfer rate. Therefore, the support column structure 60 can simultaneously support and optimize heat transfer.
在此必须说明的是,以上配合图式所做的详细描述,仅是为了说明本实用新型的技术内容及特征而提供的实施方式,凡在本实用新型领域中的普通技术人员,在了解本实用新型的技术内容及特征之后,于不违背本实用新型的精神下,所做的种种简单的修饰、替换或构件的减省,皆应属于本实用新型的权利要求范围之内。It must be noted here that the above detailed description in conjunction with the drawings is only an embodiment provided to illustrate the technical content and characteristics of the present utility model. After the technical content and features of the utility model, without violating the spirit of the utility model, all kinds of simple modifications, replacements or reduction of components should fall within the scope of the claims of the utility model.
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TW106205262U TWM544619U (en) | 2017-04-14 | 2017-04-14 | Vapor chamber |
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CN108731525A (en) * | 2017-04-14 | 2018-11-02 | 双鸿科技股份有限公司 | Temperature equalizing plate |
CN112616242A (en) * | 2020-12-08 | 2021-04-06 | 武汉光迅科技股份有限公司 | Circuit board and manufacturing method thereof |
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CN111050523B (en) * | 2018-10-12 | 2022-03-15 | 宏达国际电子股份有限公司 | Thermal transfer module and method of manufacturing the same |
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2017
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CN108731525A (en) * | 2017-04-14 | 2018-11-02 | 双鸿科技股份有限公司 | Temperature equalizing plate |
CN112616242A (en) * | 2020-12-08 | 2021-04-06 | 武汉光迅科技股份有限公司 | Circuit board and manufacturing method thereof |
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