CN108871024B - Heat exchange combined structure - Google Patents
Heat exchange combined structure Download PDFInfo
- Publication number
- CN108871024B CN108871024B CN201710468754.3A CN201710468754A CN108871024B CN 108871024 B CN108871024 B CN 108871024B CN 201710468754 A CN201710468754 A CN 201710468754A CN 108871024 B CN108871024 B CN 108871024B
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- heat exchange
- cover plate
- particle size
- capillary
- chamber
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- 239000000843 powder Substances 0.000 claims abstract description 65
- 239000002245 particle Substances 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000005245 sintering Methods 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000011148 porous material Substances 0.000 description 7
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000011796 hollow space material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention provides a heat exchange combined structure, which comprises a temperature-equalizing plate and a heat pipe connected with the temperature-equalizing plate, wherein capillary tissues are covered in the temperature-equalizing plate and a pipe body of the heat pipe, and the particle diameter of metal powder forming the capillary tissues in the pipe body of the heat pipe is larger than that of the metal powder forming the capillary tissues in the temperature-equalizing plate on the premise that the capillary tissues have the same thickness; on the premise that the capillary structures have different thicknesses, the particle size of the capillary structures in the tube body forming the heat pipe is smaller than the particle size of the metal powder forming the capillary structures in the temperature-uniforming plate. The invention can optimize the heat transfer effect of the heat exchange combined structure.
Description
Technical Field
The invention relates to the field of heat exchange composite structures, in particular to a heat exchange composite structure combining a temperature-equalizing plate and a heat pipe.
Background
The existing temperature equalization plate is a plate-shaped heat exchanger, working fluid is injected into the interior of the plate-shaped heat exchanger in a vacuum environment, and the function of heat exchange is executed by the liquid-gas phase change of the working fluid. The existing temperature equalization plate has a plate-shaped appearance, which generally consists of two cover plates covered together, and two plate surfaces with large surface areas are respectively used as a heating end and a radiating end. The inside of the vapor chamber is generally provided with a capillary structure (wick structure) to accelerate vaporization and flow of the working fluid.
In order to remove the heat generated by the operation of electronic components more quickly, a temperature equalization plate and a heat pipe are combined as a heat dissipation device. Taiwan patent No. M488038 discloses a heat dissipation device with a capillary member, which includes a capillary member having a block body close to a first capillary structure in a housing and a penetrating portion extending from the block body and close to a second capillary structure in a heat pipe. Taiwan patent No. M517314 discloses a heat dissipation device, in which an open end of a heat pipe is inserted into an opening on a top side of a housing, and an extended portion integrally extends from the open end and is connected to a bottom side of the housing in a cavity of the housing. Taiwan patent No. M522331 discloses a heat pipe and vapor chamber assembly structure, in which a stopper at an opening of the heat pipe corresponds to an annular wall of a housing. Taiwan patent No. M532047 discloses a combination structure of a vapor chamber and a heat pipe, wherein a vertical plate is provided in a lower housing for allowing the heat pipe to pass therethrough, and a capillary structure extending from the inside of the heat pipe can be attached to the capillary structure in the housing. Taiwan patent No. M533401 discloses a heat dissipation device, in which a capillary material having at least one fiber bundle in a heat pipe can contact the capillary material in a housing. Taiwan patent No. M534370 also discloses a combination structure of a vapor chamber and a heat pipe, in which a fixing section of the heat pipe is connected to an upper metal shell of the vapor chamber, so as to connect the capillary tissue in the heat pipe with the capillary tissue in the shell.
Disclosure of Invention
The present invention provides a heat exchange combination structure capable of optimizing heat transfer and heat dissipation effects, aiming at the above-mentioned disadvantages of the prior art.
The technical scheme adopted by the invention for solving the technical problem is to provide a heat exchange combined structure, which comprises a temperature-equalizing plate and a heat pipe connected with the temperature-equalizing plate, wherein the temperature-equalizing plate comprises a first cover plate, a second cover plate and a first capillary structure, the first cover plate and the second cover plate are oppositely covered, the first cover plate and the second cover plate are hollow to form a first cavity, the first capillary structure is exposed in the first cavity, and the first capillary structure is formed by sintering metal powder with a first powder particle size and has a first thickness; the heat pipe comprises a pipe body and a second capillary structure, wherein the pipe body is hollow to form a second chamber, the second chamber is communicated with the first chamber, the second capillary structure is arranged in the pipe body and exposed in the second chamber, the second capillary structure is formed by sintering metal powder with a second powder particle size and has the first thickness, and the second powder particle size is larger than the first powder particle size.
Preferably, the tube includes an open end and a closed end connected to the vapor chamber, and the open end is fixed to an opening of the vapor chamber by high frequency, brazing or laser welding.
Preferably, the heat exchange assembly further comprises a working fluid filled in the first chamber and the second chamber.
Preferably, the tube body is a circular tube, an elliptical tube or a flat tube.
Preferably, the first capillary tissue abuts the second capillary tissue.
Preferably, the heat exchange assembly further includes a plurality of support pillars distributed in the first chamber and abutting against the first cover plate and the second cover plate.
Preferably, any of the support posts is a capillary structure or a solid structure or a combination of a capillary structure and a solid structure.
Preferably, the plurality of supporting pillars are sintered from metal powder having a third powder particle size, which is larger than the first powder particle size.
The invention also provides a heat exchange combined structure, which comprises a temperature-equalizing plate and a heat pipe connected with the temperature-equalizing plate, wherein the temperature-equalizing plate comprises a first cover plate, a second cover plate and a first capillary structure, the first cover plate and the second cover plate are oppositely covered, a first cavity is formed between the first cover plate and the second cover plate in a hollow manner, the first capillary structure is exposed in the first cavity, and the first capillary structure is formed by sintering metal powder with a first powder particle size and has a first thickness; the heat pipe comprises a pipe body and a second capillary structure, wherein the pipe body is hollow to form a second chamber, the second chamber is communicated with the first chamber, the second capillary structure is arranged in the pipe body and exposed in the second chamber, the second capillary structure is formed by sintering metal powder with a second powder particle size and has a second thickness different from the first thickness, and the second powder particle size is smaller than the first powder particle size.
Preferably, the tube includes an open end and a closed end connected to the vapor chamber, and the open end is fixed to an opening of the vapor chamber by high frequency, brazing or laser welding.
Preferably, the heat exchange assembly further comprises a working fluid filled in the first chamber and the second chamber.
Preferably, the tube body is a circular tube, an elliptical tube or a flat tube.
Preferably, the first capillary tissue abuts the second capillary tissue.
Preferably, the heat exchange assembly further includes a plurality of support pillars distributed in the first chamber and abutting against the first cover plate and the second cover plate.
Preferably, any of the support posts is a capillary structure or a solid structure or a combination of a capillary structure and a solid structure.
Preferably, the plurality of supporting pillars are sintered from metal powder having a third powder particle size, which is larger than the first powder particle size.
The heat exchange combined structure comprises a temperature-equalizing plate and a heat pipe connected with the temperature-equalizing plate, wherein capillary tissues are covered in the temperature-equalizing plate and the pipe body of the heat pipe, and the particle diameter of metal powder forming the capillary tissues in the pipe body of the heat pipe is larger than that of the metal powder forming the capillary tissues in the temperature-equalizing plate on the premise that the capillary tissues have the same thickness, so that the heat transfer and heat dissipation effects of the temperature-equalizing plate can be optimized; on the premise that the capillary structures have different thicknesses, the powder particle size of the metal powder forming the capillary structures in the tube body of the heat pipe is smaller than that of the metal powder forming the capillary structures in the temperature-uniforming plate, so that the heat transfer and heat dissipation effects of the temperature-uniforming plate can be optimized.
Drawings
Fig. 1 is a partially exploded view of the heat exchange assembly of the present invention.
Fig. 2 is a partial structural cross-sectional view of the heat exchange assembly of the present invention.
Fig. 3 is a sectional view of another part of the heat exchange assembly of the present invention.
Detailed Description
For convenience of illustration, the structures, structures or components of the vapor chamber and the heat pipe in the drawings of the present invention are not scaled according to their applications, but are enlarged in unequal proportions according to the illustration, which is not intended to limit the implementation of the vapor chamber and the heat pipe.
The plate body is characterized in that the plate body is provided with two opposite surfaces in appearance, the area of the two surfaces is far larger than the area of the side wall between the two surfaces, and the plate body can be generally formed by combining two cover plates which are mutually covered. Secondly, the two cover plates can be divided into a cover plate for contacting or being close to the heat generating source and a cover plate for dissipating heat according to the relative action, the geometric shapes of the two cover plates can be the same or different, and the side wall can be provided by integrally forming at least one of the two cover plates, but the invention is not limited thereto. Although two cover plates are illustrated as planar, any cover plate may be curved or have other shapes as desired. Furthermore, the interior of the plate body is hollow to form a hollow chamber, for convenience of description, a chamber which is covered by the two cover plates in a macroscopic view and is between the two plate bodies is referred to as a first chamber below, and a hollow space inside other assemblies such as a heat pipe and the like or other structures is referred to as a second chamber or a third chamber below.
The capillary structure or structure referred to below in the present invention refers to a structure or structure having a plurality of pores or interconnected cavities, and is generally formed by weaving a mesh or sintering powder or combining the above two. In the case of sintering using metal powder, when sintering is performed using powder having a larger powder particle diameter, the capillary pore diameter is large and the capillary density is low; in the case of using a woven mesh, when the woven mesh used has a smaller mesh number, the capillary pore size is large and the capillary density is low; conversely, if the pore size of the capillary is small, the capillary density is high. It is understood that the capillary pore size or particle size herein, as measured statistically, may be expressed as a number or a range of numbers, and it is not necessary that each capillary pore size or particle size be identical.
Fig. 1 is a partially exploded view of the heat exchange assembly of the present invention. Fig. 2 is a partial structural cross-sectional view of the heat exchange assembly of the present invention. Referring to fig. 1 to 2, the heat exchange assembly 5 includes a temperature-uniforming plate 10 and one or more heat pipes 70 connected to the temperature-uniforming plate 10. In one embodiment, the vapor chamber 10 includes a first cover plate 22 and a second cover plate 24. The first and second oppositely-closed cover plates 22 and 24 define a hollow space inside the vapor chamber 10, which is represented by the first chamber 12. Next, the vapor chamber 10 further includes a first capillary structure 50 exposed in the first chamber 12 and disposed on the inner surfaces of the first cover plate 22 and the second cover plate 24. A working fluid (not shown) is disposed in the first chamber 12, and the first capillary tissue 50 contacts the working fluid.
With continued reference to fig. 1-2, the vapor chamber 10 has one or more openings 25, the openings 25 are disposed on the sidewalls 28 of the first cover plate 22 and/or the second cover plate 24; in practice, the side walls 28 of the first and second cover plates 22 and 24 may be respectively washed out with a portion of the penetration, and the first and second cover plates 22 and 24 are closed to each other to form a complete opening 25, and the opening 25 may be defined by an extension 29 slightly protruding from the side wall 28. However, the present invention is not limited thereto, and the opening 25 may be implemented by only providing a penetrating point on the sidewall of the first cover 22 or the second cover 24 (in the present embodiment), or by providing a penetrating point on the surface of the first cover 22 or the second cover 24. Next, the first capillary tissue 50 is distributed on the inner face 221 of the first cover plate 22, the inner face 241 of the second cover plate 24 and the inner face 281 of the side wall 28, and is adjacent to the edge of the opening 25.
Referring to fig. 1 to 2, the heat pipe 70 connected to the vapor chamber 10 includes a tube 72 and a second capillary structure 74, wherein the tube 72 is hollow to form a second chamber 73, and the second capillary structure 74 is disposed in the tube 72 and exposed to the second chamber 73. In one embodiment, the tube 72 includes an open end 75 connected to the opening 25 of the temperature-uniforming plate 10 and a closed end 77 at the distal end, when the tube 72 is fixed to the opening 25 of the temperature-uniforming plate 10, the second chamber 73 can be communicated with the first chamber 12, and the working fluid can be filled in the first chamber 12 and the second chamber 73. Further, the tube 72 may be a circular tube, an elliptical tube, or a flat tube in a cross-section of the open end 75 of the tube 72, but the present invention is not limited thereto. Further, the tube 72 may be straight or curved between the open end 75 and the closed end 77. The heat pipe 70 and the vapor-temperature plate 10 can be fixed by placing the open end 75 of the pipe 72 at the extension 29 of the vapor-temperature plate 10, and then fixing the open end 75 to the opening 25 in the vapor-temperature plate 10 by high frequency, brazing or laser welding, so that the second capillary structure 74 in the pipe 72 abuts against the first capillary structure 50 of the vapor-temperature plate 10.
Referring to fig. 1-2, the first capillary structure 50 is formed by sintering metal powder having a first powder particle size and has a first thickness, and the second capillary structure 74 is formed by sintering metal powder having a second powder particle size and has a second thickness. In an embodiment of the present invention, under the condition that the first thickness and the second thickness are equal, the particle size of the metal powder forming the second capillary structure 74 in the tube 72 is larger than the particle size of the metal powder forming the first capillary structure 50 in the vapor chamber 10. In another embodiment of the present invention, under the condition that the first thickness and the second thickness are different, the powder particle diameter of the metal powder forming the second capillary structure 74 in the tube 72 is smaller than the powder particle diameter of the metal powder forming the first capillary structure 50 in the vapor chamber 10.
Fig. 3 is a sectional view of another part of the heat exchange assembly of the present invention. Referring to fig. 1 to 3, the temperature-uniforming plate 10 further includes a plurality of supporting pillars 60 distributed in the first chamber 12 and abutting against the first cover plate 22 and the second cover plate 24. In one embodiment, the supporting pillars 60 may be solid, smooth or rough (e.g., with grooves or protrusions) in surface; or as a whole (e.g., with capillary pores distributed therein); or a combination of solid and capillary structures. In the case where the supporting pillars 60 are also formed by sintering metal powder, the particle diameter of the metal powder (third powder particle diameter) forming the plurality of supporting pillars 60 is larger than the particle diameter of the metal powder (first powder particle diameter) forming the first capillary structure 50.
It should be noted that the detailed description given above with reference to the drawings is only an embodiment provided for illustrating the technical contents and features of the present invention, and those skilled in the art of the present invention should be able to make various simple modifications, substitutions or reductions of components without departing from the spirit of the present invention after understanding the technical contents and features of the present invention, and therefore, the present invention should fall within the scope of the claims of the present invention.
Claims (16)
1. A heat exchange assembly, comprising:
the temperature equalizing plate comprises a first cover plate, a second cover plate and a first capillary structure, wherein the first cover plate and the second cover plate are oppositely covered, a first cavity is formed between the first cover plate and the second cover plate in a hollow mode, the first capillary structure is exposed in the first cavity, and the first capillary structure is formed by sintering metal powder with a first powder particle size and has a first thickness; and
the heat pipe connected with the temperature equalizing plate comprises a pipe body and a second capillary structure, wherein the pipe body is hollow to form a second chamber, the second chamber is communicated with the first chamber, the second capillary structure is arranged in the pipe body and exposed in the second chamber, the second capillary structure is formed by sintering metal powder with a second powder particle size and has the first thickness, and the second powder particle size is larger than the first powder particle size.
2. The heat exchange assembly of claim 1 wherein the tube includes an open end and a closed end connected to the vapor plate, the open end being secured to an opening in the vapor plate by high frequency, brazing or laser welding.
3. The heat exchange assembly of claim 1 further comprising a working fluid filled in the first and second chambers.
4. A heat exchange assembly as claimed in claim 1, wherein the tube is a round, oval or flat tube.
5. The heat exchange assembly of claim 1 wherein the first wicking structure is adjacent to the second wicking structure.
6. The heat exchange assembly of claim 1 further comprising a plurality of support posts disposed in the first chamber and abutting between the first cover plate and the second cover plate.
7. The heat exchange assembly of claim 6 wherein any of the support posts are capillary structures or solid structures or a combination of capillary and solid structures.
8. The heat exchange assembly as recited in claim 6 wherein the plurality of support posts are sintered from a metal powder having a third powder particle size, the third powder particle size being larger than the first powder particle size.
9. A heat exchange assembly, comprising:
the temperature equalizing plate comprises a first cover plate, a second cover plate and a first capillary structure, wherein the first cover plate and the second cover plate are oppositely covered, a first cavity is formed between the first cover plate and the second cover plate in a hollow mode, the first capillary structure is exposed in the first cavity, and the first capillary structure is formed by sintering metal powder with a first powder particle size and has a first thickness; and
the heat pipe connected with the temperature equalizing plate comprises a pipe body and a second capillary structure, wherein the pipe body is hollow to form a second chamber, the second chamber is communicated with the first chamber, the second capillary structure is arranged in the pipe body and exposed in the second chamber, the second capillary structure is formed by sintering metal powder with a second powder particle size and has a second thickness different from the first thickness, and the second powder particle size is smaller than the first powder particle size.
10. The heat exchange assembly of claim 9 wherein the tube includes an open end and a closed end connected to the vapor plate, the open end being secured to an opening in the vapor plate by high frequency, brazing or laser welding.
11. The heat exchange assembly as claimed in claim 9, further comprising a working fluid filled in the first and second chambers.
12. A heat exchange assembly as claimed in claim 9, wherein the tube is a round, oval or flat tube.
13. The heat exchange assembly of claim 9 wherein the first wicking structure abuts the second wicking structure.
14. The heat exchange assembly of claim 9 further comprising a plurality of support posts disposed in the first chamber and abutting between the first cover plate and the second cover plate.
15. The heat exchange assembly of claim 14 wherein any of the support posts are capillary structures or solid structures or a combination of capillary and solid structures.
16. The heat exchange assembly as recited in claim 14 wherein the plurality of support posts are sintered from a metal powder having a third powder particle size, the third powder particle size being larger than the first powder particle size.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106115807A TW201901109A (en) | 2017-05-12 | 2017-05-12 | Heat exchange combined structure |
| TW106115807 | 2017-05-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108871024A CN108871024A (en) | 2018-11-23 |
| CN108871024B true CN108871024B (en) | 2020-01-07 |
Family
ID=64321096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710468754.3A Active CN108871024B (en) | 2017-05-12 | 2017-06-20 | Heat exchange combined structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108871024B (en) |
| TW (1) | TW201901109A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111761049B (en) * | 2019-04-01 | 2022-08-05 | 广州力及热管理科技有限公司 | Metal paste for manufacturing capillary structure in uniform temperature plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200626861A (en) * | 2005-01-21 | 2006-08-01 | Foxconn Tech Co Ltd | A wick structure for a heat pipe and method for making thereof |
| CN201811624U (en) * | 2010-06-30 | 2011-04-27 | 双鸿科技股份有限公司 | Thin type heat pipe with composite capillary structure |
| CN105865243A (en) * | 2016-05-14 | 2016-08-17 | 广东工业大学 | Novel flat plate thiele tube and preparation method thereof |
| CN206862180U (en) * | 2017-05-12 | 2018-01-09 | 双鸿科技股份有限公司 | Heat exchange combined structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100795753B1 (en) * | 2006-06-26 | 2008-01-21 | (주)셀시아테크놀러지스한국 | Flat type heat transfer device and its manufacturing method |
-
2017
- 2017-05-12 TW TW106115807A patent/TW201901109A/en unknown
- 2017-06-20 CN CN201710468754.3A patent/CN108871024B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200626861A (en) * | 2005-01-21 | 2006-08-01 | Foxconn Tech Co Ltd | A wick structure for a heat pipe and method for making thereof |
| CN201811624U (en) * | 2010-06-30 | 2011-04-27 | 双鸿科技股份有限公司 | Thin type heat pipe with composite capillary structure |
| CN105865243A (en) * | 2016-05-14 | 2016-08-17 | 广东工业大学 | Novel flat plate thiele tube and preparation method thereof |
| CN206862180U (en) * | 2017-05-12 | 2018-01-09 | 双鸿科技股份有限公司 | Heat exchange combined structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201901109A (en) | 2019-01-01 |
| CN108871024A (en) | 2018-11-23 |
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