TWM547094U - Vapor chamber - Google Patents
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- TWM547094U TWM547094U TW106206394U TW106206394U TWM547094U TW M547094 U TWM547094 U TW M547094U TW 106206394 U TW106206394 U TW 106206394U TW 106206394 U TW106206394 U TW 106206394U TW M547094 U TWM547094 U TW M547094U
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本創作涉及一種均溫板的領域，尤其是一種具有突出部貼近發熱源的均溫板。 The present invention relates to the field of a uniform temperature plate, in particular to a temperature equalizing plate having a protruding portion close to a heat source.
習知的均溫板為一種板狀熱管，於內部真空的環境內注入工作液體，藉由工作流體的液氣相變化執行熱交換之功能。習知的均溫板具有板狀外型，其一般由兩相蓋合的蓋板所組成，利用大表面積的兩板面分別作為受熱端和散熱端。均溫板的內部則一般設有毛細組織(wick structure)以加速工作流體的汽化和流動。 The conventional temperature equalizing plate is a plate-shaped heat pipe, which injects a working liquid into an internal vacuum environment, and performs a heat exchange function by a liquid-gas phase change of the working fluid. The conventional temperature equalizing plate has a plate-like shape, which is generally composed of a two-phase cover plate, and the two plates with a large surface area are respectively used as a heat receiving end and a heat radiating end. The interior of the temperature equalization plate is generally provided with a wick structure to accelerate the vaporization and flow of the working fluid.
台灣專利號M497253揭露一種均溫板，其受熱區的內面為細金屬粉末，而散熱區的內面則為粗金屬粉末，藉以增加工作流體的回流速度。 Taiwan Patent No. M497253 discloses a temperature equalizing plate whose inner surface of the heat receiving zone is a fine metal powder, and the inner surface of the heat radiating zone is a coarse metal powder, thereby increasing the return flow rate of the working fluid.
本案提供一種均溫板，在接近發熱源的突出部採用較大粒徑的粉末所形成的毛細部，其可優化傳熱和散熱的效果。 The present invention provides a temperature equalizing plate, which adopts a capillary portion formed by a powder having a larger particle diameter in a protruding portion close to a heat source, which can optimize the effects of heat transfer and heat dissipation.
依據上述，一種均溫板，包括：一板體，其包括相對蓋合的一第一蓋板和一第二蓋板，該第一蓋板和該第二蓋板之間為中空而形成一第一腔室，其中，該第二蓋板包括向該板體的外面突出的一突出部；及一毛細組織暴露於該第一腔室中，該毛細組織包 括一第一毛細部、一第二毛細部和一第三毛細部，其中，該第一毛細部固定於該第二蓋板的該突出部處，該第一毛細部係以一第一粉粒徑的金屬粉末燒結形成；該第二毛細部固定於該第二蓋板的該突出部以外處，該第二毛細部係以一第二粉粒徑的金屬粉末燒結形成且該第二粉粒徑小於該第一粉粒徑；及該第三毛細部固定於該第一蓋板處，且隔著該第一腔室與該第一毛細部及該第二毛細部相對，其中，該第三毛細部係以一第三粉粒徑的金屬粉末燒結形成且該第三粉粒徑小於該第一粉粒徑。 According to the above, a temperature equalizing plate includes: a plate body including a first cover plate and a second cover plate that are oppositely closed, wherein the first cover plate and the second cover plate are hollow to form a plate a first chamber, wherein the second cover includes a protrusion protruding toward an outer surface of the plate; and a capillary tissue is exposed in the first chamber, the capillary tissue package a first capillary portion, a second capillary portion and a third capillary portion, wherein the first capillary portion is fixed to the protruding portion of the second cover portion, and the first capillary portion is a first powder Forming a metal powder of a particle size; the second capillary portion is fixed outside the protruding portion of the second cover plate, and the second capillary portion is formed by sintering a metal powder having a second powder particle size and the second powder The particle size is smaller than the first powder particle diameter; and the third capillary portion is fixed to the first cover portion, and is opposite to the first capillary portion and the second capillary portion via the first chamber, wherein The third capillary portion is formed by sintering a metal powder having a third powder particle diameter and the third powder particle diameter is smaller than the first powder particle diameter.
一例中，該第二粉粒徑等於該第三粉粒徑，該第一粉粒徑為80至120目。 In one example, the second powder particle size is equal to the third powder particle size, and the first powder particle size is 80 to 120 mesh.
一例中，該第一粉粒徑為80至120目，以及該第二粉粒徑或該第三粉粒徑為200至300目。 In one example, the first powder has a particle size of 80 to 120 mesh, and the second powder particle or the third powder has a particle size of 200 to 300 mesh.
一例中，該第一毛細部具有一第一粉末厚度，該第二毛細部具有一第二粉末厚度且該第二粉末厚度小於該第一粉末厚度。 In one example, the first capillary portion has a first powder thickness, the second capillary portion has a second powder thickness and the second powder thickness is less than the first powder thickness.
一例中，該第一毛細部具有一第一粉末厚度，該第三毛細部具有一第三粉末厚度且該第三粉末厚度小於該第一粉末厚度。 In one example, the first capillary portion has a first powder thickness, the third capillary portion has a third powder thickness and the third powder thickness is less than the first powder thickness.
一例中，該突出部的內部形成連通該第一腔室的一第二腔室，且更包括複數個支撐柱分布於該第一腔室和該第二腔室中並抵頂於該第一蓋板和該第二蓋板之間。 In one example, the interior of the protrusion forms a second chamber that communicates with the first chamber, and further includes a plurality of support columns distributed in the first chamber and the second chamber and abutting the first Between the cover plate and the second cover plate.
一例中，該些支撐柱係以一第四粉粒徑的金屬粉末燒結形成，且該第四粉粒徑大於該第一粉粒徑。 In one example, the support columns are formed by sintering a metal powder having a fourth powder particle size, and the fourth powder particle size is greater than the first powder particle size.
一例中，該第四粉粒徑為60至100目。 In one example, the fourth powder has a particle size of 60 to 100 mesh.
依據上述，一種均溫板，包括：一板體，其包括相對蓋合的一第一蓋板和一第二蓋板，該第一蓋板和該第二蓋板之間為中空而形成一第一腔室，其中，該第二蓋板包括一向該板體的外面突出的一突出部；及一毛細組織暴露於該第一腔室中，該毛細組織包括一第一毛細部、一第二毛細部和一第三毛細部，其中，該第一毛細部固定於該第二蓋板的該突出部並具有一第一厚度；該第二毛細部固定於該第二蓋板的該突出部以外處並具有一第二厚度，且該第二厚度小於該第一厚度；及該第三毛細部固定於該第一蓋板處並具有一第三厚度，且該第三厚度小於該第一厚度。 According to the above, a temperature equalizing plate includes: a plate body including a first cover plate and a second cover plate that are oppositely closed, wherein the first cover plate and the second cover plate are hollow to form a plate a first chamber, wherein the second cover includes a protrusion protruding toward an outer surface of the plate body; and a capillary tissue is exposed in the first chamber, the capillary structure including a first capillary portion, a first a second capillary portion and a third capillary portion, wherein the first capillary portion is fixed to the protruding portion of the second cover plate and has a first thickness; the second capillary portion is fixed to the protrusion of the second cover portion Outside the portion and having a second thickness, and the second thickness is smaller than the first thickness; and the third capillary portion is fixed to the first cover and has a third thickness, and the third thickness is smaller than the first a thickness.
一例中，該毛細組織係以金屬粉末燒結形成，形成該第一毛細部的金屬粉粒徑大於形成該第二毛細部或該第三毛細部的金屬粉粒徑。 In one example, the capillary structure is formed by sintering a metal powder, and the particle size of the metal powder forming the first capillary portion is larger than the particle size of the metal powder forming the second capillary portion or the third capillary portion.
一例中，形成該第一毛細部的金屬粉粒徑為80至120目。 In one example, the metal powder having the first capillary portion has a particle diameter of 80 to 120 mesh.
一例中，形成該第二毛細部或該第三毛細部的金屬粉粒徑為200至300目。 In one example, the metal powder having the second capillary portion or the third capillary portion has a particle diameter of 200 to 300 mesh.
一例中，該突出部的內部形成連通該第一腔室的一第二腔室，且更包括複數個支撐柱分布於該第一腔室和該第二腔室中並抵頂於該第一蓋板和該第二蓋板之間。 In one example, the interior of the protrusion forms a second chamber that communicates with the first chamber, and further includes a plurality of support columns distributed in the first chamber and the second chamber and abutting the first Between the cover plate and the second cover plate.
一例中，該毛細組織和該些支撐柱皆以金屬粉末燒結形成，形成該些支撐柱的金屬粉粒徑大於形成該毛細組織的金屬粉粒徑。 In one example, the capillary structure and the support columns are formed by sintering a metal powder, and the particle size of the metal powder forming the support columns is larger than the particle size of the metal powder forming the capillary structure.
一例中，形成該些支撐柱的金屬粉粒徑為60至100目。 In one example, the metal powder forming the support columns has a particle size of 60 to 100 mesh.
依據上述，一種均溫板，包括：一板體，其包括相對蓋合的一第一蓋板和一第二蓋板，該第一蓋板和該第二蓋板之間為中空而形成一第一腔室，其中，該第二蓋板包括一向該板體的外面突出的一突出部；及一毛細組織暴露於該第一腔室中，該毛細組織包括一第一毛細部、一第二毛細部和一第三毛細部，其中，該第一毛細部固定於該第二蓋板的該突出部，該第一毛細部具有一第一毛細孔徑；該第二毛細部固定於該第二蓋板的該突出部以外處，該第二毛細部具有一第二毛細孔徑且該第二毛細孔徑小於該第一毛細孔徑；及該第三毛細部固定於該第一蓋板處，且隔著該第一腔室與該第一毛細部及該第二毛細部相對，其中，該第三毛細部具有一第三毛細孔徑且該第三毛細孔徑小於該第一毛細孔徑。 According to the above, a temperature equalizing plate includes: a plate body including a first cover plate and a second cover plate that are oppositely closed, wherein the first cover plate and the second cover plate are hollow to form a plate a first chamber, wherein the second cover includes a protrusion protruding toward an outer surface of the plate body; and a capillary tissue is exposed in the first chamber, the capillary structure including a first capillary portion, a first a second capillary portion and a third capillary portion, wherein the first capillary portion is fixed to the protruding portion of the second cover portion, the first capillary portion has a first capillary aperture; and the second capillary portion is fixed to the first capillary portion Outside the protruding portion of the second cover, the second capillary portion has a second capillary aperture and the second capillary aperture is smaller than the first capillary aperture; and the third capillary portion is fixed to the first cover portion, and The first capillary portion is opposite to the first capillary portion and the second capillary portion, wherein the third capillary portion has a third capillary aperture and the third capillary aperture is smaller than the first capillary aperture.
一例中，該第一毛細部具有一第一厚度，該第二毛細部具有一第二厚度且該第二厚度小於該第一厚度。 In one example, the first capillary portion has a first thickness, the second capillary portion has a second thickness, and the second thickness is less than the first thickness.
一例中，該第一毛細部具有一第一厚度，該第三毛細部具有一第三厚度且該第三厚度小於該第一厚度。 In one example, the first capillary portion has a first thickness, the third capillary portion has a third thickness, and the third thickness is less than the first thickness.
一例中，均溫板更包括分布於該第一腔室中並抵頂於該第一蓋板和該第二蓋板以及該突出部之間的複數個支撐柱。 In one example, the temperature equalization plate further includes a plurality of support columns distributed in the first chamber and abutting between the first cover and the second cover and the protrusion.
一例中，任一該支撐柱為一毛細結構或一實心結構或混合上述兩者。 In one example, either of the support columns is a capillary structure or a solid structure or a mixture of the two.
依據上述，一種均溫板，包括相對蓋合的一第一蓋板和一第二蓋板組成的板體，其內面分布了毛細組織，接近發熱源的第二 蓋板的突出部的內面上的毛細部可使用大於其他內面上的毛細部的粉粒徑形成，其粉末厚度亦可較厚。上述的設計可優化均溫板的熱傳效果。 According to the above, a temperature equalizing plate comprises a first cover plate and a second cover plate which are oppositely covered, wherein the inner surface is distributed with capillary structure, and the second is close to the heat source. The capillary portion on the inner surface of the protruding portion of the cover plate may be formed using a powder particle size larger than the capillary portion on the other inner surface, and the powder thickness may be thick. The above design optimizes the heat transfer effect of the temperature equalization plate.
10‧‧‧均溫板 10‧‧‧Wall plate
12‧‧‧第一腔室 12‧‧‧ first chamber
14‧‧‧第二腔室 14‧‧‧Second chamber
20‧‧‧板體 20‧‧‧ board
22‧‧‧第一蓋板 22‧‧‧First cover
221‧‧‧內面 221‧‧‧ inside
24‧‧‧第二蓋板 24‧‧‧second cover
241‧‧‧內面 241‧‧‧ inside
26‧‧‧突出部 26‧‧‧Protruding
261‧‧‧內面 261‧‧‧ inside
40‧‧‧發熱源 40‧‧‧heat source
50‧‧‧毛細組織 50‧‧‧Muscle tissue
52‧‧‧第一毛細部 52‧‧‧First Capillary
54‧‧‧第二毛細部 54‧‧‧Second Capillary
56‧‧‧第三毛細部 56‧‧‧ third capillary
60‧‧‧支撐柱 60‧‧‧Support column
圖1為本案之均溫板的部分結構剖面示意圖。 Fig. 1 is a schematic cross-sectional view showing a part of a structure of a temperature equalizing plate of the present invention.
圖2為本案之均溫板的另一部分結構剖面示意圖。 Fig. 2 is a schematic cross-sectional view showing another part of the temperature equalizing plate of the present invention.
圖3為本案之均溫板的又一部分結構剖面示意圖。 Fig. 3 is a schematic cross-sectional view showing still another part of the temperature equalizing plate of the present invention.
為方便說明，本案圖式中的均溫板的各結構、組織或部件不依其應用時的比例，而依據說明需要進行不等比例的放大，此並非用以限制本案均溫板的實施。 For convenience of explanation, the structures, structures or components of the temperature equalizing plate in the drawing of the present invention are not in accordance with the proportions at the time of application, and the unequal scale amplification is required according to the description, which is not intended to limit the implementation of the temperature equalizing plate in the present case.
本案以下所稱的板體，是指外觀上有相對的兩個表面的面積遠大於兩表面之間的側壁面積，其一般可利用相蓋合的兩蓋板組合而成。其次，依據相對作用可將兩蓋板區分成作為接觸或貼近發熱源的蓋板和作為散熱作用的蓋板，兩者的幾何形狀可相同或相異，側壁則可由兩蓋板之至少之一一體成型地提供，但本案不限於此。以下雖以平面繪製或說明兩蓋板，但任一蓋板亦可依據需要而設計為弧形或其他形狀。再者，板體的內部呈中空狀而形成一中空腔室，為方便說明，巨觀上由兩蓋板蓋合且介於兩板體之間的腔室為以下所稱的第一腔室，至於利用任一蓋板的板面凹凸輪廓所形成於板體內部的中空空間則為以下所稱的第二腔室或第三腔室等等。 The term "plate body" as used in the present invention means that the two surfaces having opposite surfaces are much larger than the area of the side wall between the two surfaces, and generally can be formed by combining two cover plates which are covered by the phase. Secondly, according to the relative action, the two cover plates can be divided into a cover plate which is in contact with or close to the heat source and a cover plate which serves as a heat dissipation, and the geometric shapes of the two can be the same or different, and the side wall can be at least one of the two cover plates. Provided in one piece, but the case is not limited to this. Although the two covers are drawn or illustrated below, any of the covers may be curved or otherwise shaped as needed. Furthermore, the interior of the plate body is hollow to form a hollow chamber. For convenience of explanation, the chamber covered by the two cover plates and interposed between the two plates is a first chamber referred to below. As for the hollow space formed inside the plate body by the uneven contour of the plate surface of any of the cover plates, it is a second chamber or a third chamber or the like as hereinafter referred to.
本案以下所稱的毛細組織或結構，是指組織或結構中具有多個毛細孔或相連通的孔洞空穴，一般為編織網或粉末燒結或結合上述兩者所形成，並且可用毛細孔徑或毛細密度描述。當編織網具有較少的網目數或使用較大顆粒的粉末燒結時，毛細孔徑大，毛細密度較低；反之毛細孔徑小者，則毛細密度較高。可以理解的，此處的毛細孔徑，以統計上的量測得到者，可以以一數值或一數值範圍表示，並非以每個毛細孔徑皆完全相同為必要。 The term "wool structure or structure" as used hereinafter refers to a cavity or a plurality of pores or interconnected pores in a structure or structure, which is generally formed by woven mesh or powder sintering or a combination of the above, and can be used with capillary pores or capillary. Density description. When the woven mesh has a small mesh number or a powder using a larger particle, the capillary diameter is large and the capillary density is low; whereas if the capillary diameter is small, the capillary density is high. It can be understood that the capillary diameter here, which is measured by statistical measurement, can be expressed by a numerical value or a numerical range, and it is not necessary that each capillary diameter is completely the same.
圖1為本案之均溫板的部分結構剖面示意圖。圖2為本案之均溫板的另一部分結構剖面示意圖。請參考圖1至圖2，均溫板10的一板體20包括一第一蓋板22和具有一突出部26的一第二蓋板24。於一實施例中，相對蓋合的第一蓋板22和第二蓋板24界定了板體20內部的一中空空間，以第一腔室12表示；第二蓋板24向板體20的外面突出的突出部26的內部則形成一第二腔室14，且第二腔室14可與第一腔室12連通。突出部26的幾何形狀、大小、位置和數量可依需求而定，圖中僅為例示說明。本案的均溫板10在應用時，發熱源40一般是接觸第二蓋板24的突出部26的外表面，故對均溫板10來看，第二蓋板24可視為受熱端；相對地，第一蓋板22則為散熱端。 Fig. 1 is a schematic cross-sectional view showing a part of a structure of a temperature equalizing plate of the present invention. Fig. 2 is a schematic cross-sectional view showing another part of the temperature equalizing plate of the present invention. Referring to FIG. 1 to FIG. 2, a plate body 20 of the temperature equalizing plate 10 includes a first cover plate 22 and a second cover plate 24 having a protruding portion 26. In an embodiment, the first cover 22 and the second cover 24 opposite to each other define a hollow space inside the board 20, which is represented by the first chamber 12; and the second cover 24 is directed to the board 20. The interior of the outwardly projecting projection 26 defines a second chamber 14 and the second chamber 14 is communicable with the first chamber 12. The geometry, size, location, and number of protrusions 26 may be as desired, and are merely illustrative in the figures. When the temperature equalizing plate 10 of the present case is applied, the heat source 40 generally contacts the outer surface of the protruding portion 26 of the second cover plate 24, so that the second cover plate 24 can be regarded as the heated end when viewed from the temperature equalizing plate 10; The first cover 22 is a heat dissipation end.
續參考圖1至圖2，毛細組織50暴露於第一腔室12和第二腔室14中，其設置於第一蓋板22和第二蓋板24的內面上。第一腔室12內設有一工作流體(圖上未繪)，毛細組織50接觸工作流體。其次，毛細組織50包括具有一第一毛細孔徑和一第一厚度的一第一毛細 部52、具有一第二毛細孔徑和一第二厚度的一第二毛細部54、以及具有一第三毛細孔徑和一第三厚度的一第三毛細部56。於一實施例中，第一毛細部52固定於第二蓋板24的突出部26處的內面261，第二毛細部54固定於第二蓋板24的突出部26以外處的內面241，第三毛細部56固定於第一蓋板22處的內面221上，且隔著第一腔室12和第二腔室14而與第一毛細部52及第二毛細部54相對。 1 to 2, the capillary structure 50 is exposed in the first chamber 12 and the second chamber 14, which are disposed on the inner faces of the first cover 22 and the second cover 24. A working fluid (not shown) is disposed in the first chamber 12, and the capillary structure 50 contacts the working fluid. Second, the capillary structure 50 includes a first capillary having a first capillary aperture and a first thickness. The portion 52 has a second capillary portion 54 having a second capillary aperture and a second thickness, and a third capillary portion 56 having a third capillary aperture and a third thickness. In one embodiment, the first capillary portion 52 is fixed to the inner surface 261 of the protruding portion 26 of the second cover plate 24, and the second capillary portion 54 is fixed to the inner surface 241 of the second cover plate 24 outside the protruding portion 26. The third capillary portion 56 is fixed to the inner surface 221 of the first cover 22 and faces the first capillary portion 52 and the second capillary portion 54 via the first chamber 12 and the second chamber 14.
續參考圖1至圖2，於一實施例中，第二毛細孔徑小於第一毛細孔徑，並且第三毛細孔徑亦小於第一毛細孔徑。其次，第二厚度小於第一厚度，並且第三厚度小於第一厚度。在毛細組織50以金屬粉末燒結的方式形成的情況時，第一毛細部52、第二毛細部54和第三毛細部56可分別選用第一粉粒徑、第二粉粒徑和第三粉粒徑的金屬粉末燒結形成，其中，第二粉粒徑小於第一粉粒徑，且第三粉粒徑小於該第一粉粒徑。實施時，舉例但不限地，第一粉粒徑為80至120目，第二粉粒徑或/和第三粉粒徑則為200至300目，其中，目數愈大表示金屬粉粒徑愈小。再者，第二粉粒徑和第三粉粒徑則可以相同或相異。可以理解的，毛細組織50亦可選用金屬編織網形成，在相同面積下，網目數愈多者，網目愈密，所形成的毛細孔徑愈小。是以，在毛細組織50以金屬粉末燒結的方式形成的情況時，形成第一毛細部52的金屬編織網的網目數將少於形成第二毛細部54或形成第三毛細部56的金屬編織網的網目數。 Continuing to refer to FIGS. 1 through 2, in an embodiment, the second capillary aperture is smaller than the first capillary aperture, and the third capillary aperture is also smaller than the first capillary aperture. Second, the second thickness is less than the first thickness and the third thickness is less than the first thickness. In the case where the capillary structure 50 is formed by sintering the metal powder, the first capillary portion 52, the second capillary portion 54, and the third capillary portion 56 may be selected from the first powder particle diameter, the second powder particle diameter, and the third powder, respectively. The metal powder of the particle size is formed by sintering, wherein the second powder particle diameter is smaller than the first powder particle diameter, and the third powder particle diameter is smaller than the first powder particle diameter. When implemented, by way of example and not limitation, the first powder has a particle size of 80 to 120 mesh, and the second powder particle size and/or the third powder particle size is 200 to 300 mesh, wherein the larger the mesh number, the metal powder The smaller the diameter. Further, the second powder particle diameter and the third powder particle diameter may be the same or different. It can be understood that the capillary structure 50 can also be formed by using a metal woven mesh. Under the same area, the more the number of meshes, the denser the mesh, and the smaller the capillary diameter formed. Therefore, in the case where the capillary structure 50 is formed by sintering the metal powder, the number of meshes of the metal woven mesh forming the first capillary portion 52 will be less than that of the metal woven fabric forming the second capillary portion 54 or forming the third capillary portion 56. The number of nets in the net.
圖3為本案之均溫板的又一部分結構剖面示意圖。請參考圖1 至圖3，均溫板10更包括分布於第一腔室12和第二腔室14中並抵頂於第一蓋板22和該第二蓋板24之間的複數個支撐柱60。於一實施例中，支撐柱60可以是實心、表面平滑或粗糙(例如具有溝槽或凹凸)的結構；或是整體為毛細結構(例如有毛細孔分布其中)；或是結合實心和毛細的結構。在支撐柱60亦以金屬粉末燒結的方式形成的情況時，形成該些支撐柱60的金屬粉粒徑大於形成毛細組織50的金屬粉粒徑。實施時，舉例但不限地，當選用的第一粉粒徑為80至120目時，支撐柱60以第四粉粒徑的金屬粉末燒結形成，其中，第四粉粒徑可以為60至100目。 Fig. 3 is a schematic cross-sectional view showing still another part of the temperature equalizing plate of the present invention. Please refer to Figure 1 As shown in FIG. 3, the temperature equalization plate 10 further includes a plurality of support columns 60 distributed in the first chamber 12 and the second chamber 14 and abutting between the first cover plate 22 and the second cover plate 24. In one embodiment, the support post 60 may be solid, smooth or rough (eg, having grooves or reliefs); or integral as a capillary structure (eg, with capillary pores distributed therein); or combined with solid and capillary structure. In the case where the support columns 60 are also formed by sintering the metal powder, the particle size of the metal powder forming the support columns 60 is larger than the particle size of the metal powder forming the capillary structure 50. When implemented, by way of example and not limitation, when the first powder particle size selected is 80 to 120 mesh, the support column 60 is formed by sintering a metal powder having a fourth powder particle size, wherein the fourth powder particle size may be 60 to 100 mesh.
在此必須說明者為，以上配合圖式所為之詳細描述，僅係為了說明本創作之技術內容及特徵而提供之一實施方式，凡在本創作領域中具有一般通常知識之人，在瞭解本創作之技術內容及特徵之後，於不違背本創作之精神下，所為之種種簡單之修飾、替換或構件之減省，皆應屬於以下所揭示之申請專利範圍之內。 It must be noted that the detailed descriptions of the above drawings are merely for the purpose of explaining the technical contents and features of the present invention. Anyone who has general knowledge in the field of creation is aware of this. After the technical content and characteristics of the creation, all kinds of simple modifications, substitutions or reductions of components are subject to the scope of the patent application disclosed below without departing from the spirit of the creation.
10‧‧‧均溫板 10‧‧‧Wall plate
12‧‧‧第一腔室 12‧‧‧ first chamber
14‧‧‧第二腔室 14‧‧‧Second chamber
20‧‧‧板體 20‧‧‧ board
22‧‧‧第一蓋板 22‧‧‧First cover
221‧‧‧內面 221‧‧‧ inside
24‧‧‧第二蓋板 24‧‧‧second cover
241‧‧‧內面 241‧‧‧ inside
26‧‧‧突出部 26‧‧‧Protruding
261‧‧‧內面 261‧‧‧ inside
40‧‧‧發熱源 40‧‧‧heat source
50‧‧‧毛細組織 50‧‧‧Muscle tissue
52‧‧‧第一毛細部 52‧‧‧First Capillary
54‧‧‧第二毛細部 54‧‧‧Second Capillary
56‧‧‧第三毛細部 56‧‧‧ third capillary
Claims (20)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106206394U TWM547094U (en) | 2017-05-05 | 2017-05-05 | Vapor chamber |
| CN201720682798.1U CN206919724U (en) | 2017-05-05 | 2017-06-13 | Temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106206394U TWM547094U (en) | 2017-05-05 | 2017-05-05 | Vapor chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM547094U true TWM547094U (en) | 2017-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106206394U TWM547094U (en) | 2017-05-05 | 2017-05-05 | Vapor chamber |
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| Country | Link |
|---|---|
| CN (1) | CN206919724U (en) |
| TW (1) | TWM547094U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI768335B (en) * | 2019-05-10 | 2022-06-21 | 訊凱國際股份有限公司 | Vapor chamber and manufacturing method of the same |
| US20230012459A1 (en) * | 2021-07-08 | 2023-01-12 | Dongguan Luxshare Technologies Co., Ltd | Thermal conductive device and manufacturing method thereof, electrical connector and electronic device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI654404B (en) * | 2017-05-05 | 2019-03-21 | 雙鴻科技股份有限公司 | Temperature plate |
| JP6747625B2 (en) * | 2018-07-31 | 2020-08-26 | 株式会社村田製作所 | Vapor chamber |
| TW202130960A (en) * | 2020-02-04 | 2021-08-16 | 建準電機工業股份有限公司 | Temperature regulating board |
| CN113976886B (en) * | 2020-07-08 | 2023-08-15 | 苏州铜宝锐新材料有限公司 | Porous structure, temperature equalizing plate, manufacturing method and application thereof |
-
2017
- 2017-05-05 TW TW106206394U patent/TWM547094U/en unknown
- 2017-06-13 CN CN201720682798.1U patent/CN206919724U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI768335B (en) * | 2019-05-10 | 2022-06-21 | 訊凱國際股份有限公司 | Vapor chamber and manufacturing method of the same |
| US20230012459A1 (en) * | 2021-07-08 | 2023-01-12 | Dongguan Luxshare Technologies Co., Ltd | Thermal conductive device and manufacturing method thereof, electrical connector and electronic device |
| TWI793843B (en) * | 2021-07-08 | 2023-02-21 | 大陸商東莞立訊技術有限公司 | Thermal conductive device and manufacturing method thereof, electrical connector, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN206919724U (en) | 2018-01-23 |
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