CN110740614A - Vapor chamber, manufacturing method thereof and electronic equipment - Google Patents
Vapor chamber, manufacturing method thereof and electronic equipment Download PDFInfo
- Publication number
- CN110740614A CN110740614A CN201910972714.1A CN201910972714A CN110740614A CN 110740614 A CN110740614 A CN 110740614A CN 201910972714 A CN201910972714 A CN 201910972714A CN 110740614 A CN110740614 A CN 110740614A
- Authority
- CN
- China
- Prior art keywords
- substrate
- chamber
- cavity
- semi
- solution medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The application relates to a soaking plate and a preparation method of the soaking plate, wherein the soaking plate comprises a substrate, a second substrate, a sealed inner cavity formed between the substrate and the second substrate, a solution medium located in the inner cavity, and a semipermeable membrane dividing the inner cavity into a th cavity and a second cavity, wherein the solution medium in the th cavity generates gas due to thermal evaporation, the gas enters the second cavity, and is liquefied and releases heat when meeting cold in the second cavity, so that the concentration of the solution medium in the second cavity is smaller than that of the solution medium in the th cavity, and the backflow of a solvent is completed.
Description
Technical Field
The application relates to the technical field of vapor chambers, in particular to vapor chambers, a preparation method thereof and electronic equipment.
Background
The inside capillary structure that is equipped with of traditional soaking plate, the backward flow of liquid mainly is realized through capillary action through capillary structure, and capillary structure mainly is copper powder or metal mesh grid, need fix inside the soaking plate through high temperature sintering, and the technology is complicated, and the cost is great.
Disclosure of Invention
In th aspect of the present application, embodiment provides soaking plates, so as to solve the technical problems of complicated structure and high cost of the soaking plates.
soaking plates, comprising:
th substrate;
a second substrate disposed opposite the th substrate, wherein a sealed cavity is formed between the th substrate and the second substrate;
a solution medium located in the lumen; and
a semi-permeable membrane positioned within said inner chamber and dividing said inner chamber into an th chamber and a second chamber;
wherein, the solvent in the solution medium in the th cavity produces gas because of being heated evaporation, gas can permeate the semipermeable membrane gets into the second cavity, and meet cold liquefaction and release heat in the second cavity, make simultaneously the concentration of solution medium in the second cavity is less than the concentration of solution medium in the th cavity, thereby make solvent in the solution medium in the second cavity pass through the semipermeable membrane flows back to the th cavity.
The soaking plate comprises an inner cavity formed by an th substrate and a second substrate, a semi-permeable membrane is arranged in the inner cavity and divides the inner cavity into a th cavity and a second cavity, the soaking plate with an evaporation area and a condensation area is manufactured, environmental heat can be transferred from the evaporation area to the condensation area and released in the condensation area, a solvent of a solution medium in the second cavity can flow back to the th cavity through the semi-permeable membrane, and therefore heat quick transfer and quick return of the solvent of the solution medium are achieved.
In a second aspect of the present application, provides a preparation method of soaking plates, so as to solve the technical problems of complicated preparation process and high cost of the soaking plates.
The preparation method of soaking plates comprises the following steps:
providing an th substrate and a semi-permeable membrane;
affixing the semi-permeable membrane to the th substrate;
providing a second substrate;
covering the second substrate on the side of the th substrate on which the semipermeable membrane is provided;
connecting the edge of the th substrate and the edge of the second substrate to form an inner cavity between the th substrate and the second substrate, the inner cavity being divided into a th chamber and a second chamber by the semi-permeable membrane
Injecting a solution medium into the th chamber or the second chamber;
wherein the solution medium in the th cavity produces gas because of being heated evaporation, gas can permeate the semipermeable membrane gets into the second cavity, and meets cold liquefaction and releases heat in the second cavity, makes simultaneously the concentration of solution medium in the second cavity is less than the concentration of solution medium in the th cavity, thereby makes the solvent in the solution medium in the second cavity flow back to the th cavity through the semipermeable membrane.
According to the preparation method of the soaking plate, the semipermeable membrane is fixed on the th substrate, the edge of the second substrate is fixed with the edge of the th substrate, the inner cavity formed by the th substrate and the second substrate is divided into the th cavity and the second cavity by the semipermeable membrane, and solution media are injected into the th cavity and the second cavity, so that the soaking plate comprising the evaporation region and the condensation region can be prepared.
In a third aspect of the present application, embodiment provides electronic devices, so as to solve the technical problems of complex manufacturing process and high cost of the vapor chamber.
electronic equipment comprises electronic components and a vapor chamber, wherein the vapor chamber comprises an evaporation region and a condensation region, the th cavity is located in the evaporation region, the second cavity is located in the condensation region, the evaporation region is in contact with the electronic components, the electronic components can generate heat when in work, the evaporation region can absorb the heat and transmit the heat to the condensation region, and the condensation region can release the heat.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1a is an exploded view of an electronic device provided in example;
FIG. 1b is an enlarged view of the structure of the portion F of the electronic device shown in FIG. 1 a;
FIG. 2a is a front view of a vapor chamber provided in the embodiment of ;
FIG. 2b is a perspective view of the heat spreader plate of FIG. 2a in an embodiment , wherein the th substrate is removed;
FIG. 3 is a top view of the soaking plate of FIG. 2b, wherein the solvent of the solution medium in the th chamber evaporates to generate gas and penetrates the semi-permeable membrane into the second chamber;
FIG. 4 is a top view of the soaking plate of FIG. 2b, wherein the solvent permeating semi-permeable membrane of the solution medium in the second chamber flows back to the th chamber;
FIG. 5 is a cross-sectional view at I-I of the soaking plate shown in FIG. 2a, and corresponds to the embodiment of FIG. 2 b;
FIG. 6 is a perspective view of the heat spreader of FIG. 2a in another embodiment , wherein the th substrate is removed;
FIG. 7 is a cross-sectional view at I-I of the soaking plate shown in FIG. 2a, and corresponds to the embodiment of FIG. 6;
FIG. 8 is a cross-sectional view I-I of the heat spreader plate of FIG. 2a in another embodiment ;
FIG. 9 is a cross-sectional view I-I of the heat spreader plate of FIG. 2a in an alternative embodiment of ;
FIG. 10 is a flow chart of a method for manufacturing vapor chamber according to example ;
fig. 11 is a flow chart of a method for manufacturing a vapor chamber according to another embodiment.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Referring to fig. 1a and 1b, in an embodiment , electronic devices 500 are provided, where each of the electronic devices 500 includes a display screen assembly 510, a middle frame 520, and a battery cover 530, the display screen assembly 510 and the battery cover 530 are respectively fixed to two sides of the middle frame 520 and form an external structure of the electronic device 500 together with a partial structure of the middle frame 520, a main board 540 and an electronic component 560 are provided in the electronic device 500, it is understood that the electronic component 560 may be a battery or a camera assembly 550 or other electronic components, and is not limited thereto.
As shown in fig. 1b, in , kinds of vapor chamber 10 are provided, where the vapor chamber 10 is a heat transfer element that transfers heat by means of phase change of its internal working fluid, and includes an evaporation region 170 and a condensation region 180, where the evaporation region 170 can absorb heat and transfer the heat to the condensation region 180, and the condensation region 180 can release the heat, the evaporation region 170 of the vapor chamber 10 is in contact with an electronic component 560 that can generate heat, and may be fixed or not, and the condensation region 180 is away from the electronic component 560 that can generate heat, and the heat generated by the electronic component 560 during operation can be absorbed by the evaporation region 170 and transferred to the condensation region 180, and the condensation region 180 releases the heat to the environment, so that the heat of the electronic component 560 can be cooled down quickly, and the influence of the high temperature on the normal operation of the electronic component 560 is avoided.
As shown in fig. 2a to 3, in embodiment, the soaking plate 10 includes th substrate 20, a second substrate 30, a solution medium and a semipermeable membrane 130 between the th substrate 20 and the second substrate 30, an inner cavity 100 is formed between the th substrate 20 and the second substrate 30, a th opening 201 and a second opening 301 are provided between the th substrate 20 and the second substrate 30, the th opening 201 is sealed by a th cover 202, the second opening 301 is sealed by a second cover 302, in embodiment, the th cover 202 and the second cover 302 are non-detachable structures, the th opening 201 and the second opening 301 are sealed by welding, the th substrate 20 and the second substrate 30 are made of a metal material such as pure copper or nickel alloy, etc., the th substrate 20 and the second substrate 30 have a thickness of 0.1mm to 0.12mm, it is understood that the th substrate 20 and the second substrate 30 may be made of other materials such as material with a thickness of 0.1mm to 0.12mm, or may be made of other materials with different properties according to the soaking plate 20 and the soaking plate 30.
As shown in fig. 3 and 4, in the embodiment, in the thickness direction of the soaking plate 10, the end of the semi-permeable membrane 130 is fixed to the th substrate 20, and the other end is fixed to the second substrate 30. in the plane formed by the length direction, i.e., the X direction, and the width direction, i.e., the Y direction, of the soaking plate 10, the semi-permeable membrane 130 has a bent structure, and both sides of the semi-permeable membrane 130 extend to the edge of the soaking plate 10, respectively, the plane formed by the X direction and the Y direction is perpendicular to the thickness direction of the soaking plate 10. it can be understood that the semi-permeable membrane 130 is fixed in the inner chamber 100 and divides the inner chamber 100 into the th chamber 110 and the second chamber 120, the th chamber 110 is located in the evaporation zone 170, the second chamber 120 is located in the condensation zone 180, and the th chamber 110 and the second.
As shown in fig. 3 and 4, the semi-permeable membrane 130 has an L-shaped structure in the thickness direction perpendicular to the soaking plate 10, wherein sides extend to edges of the soaking plate 10, and sides extend to adjacent edges, in another embodiment, the semi-permeable membrane 130 may have a U-shape or a C-shape in the thickness direction perpendicular to the soaking plate 10, that is, both sides of the semi-permeable membrane 130 extend to the same edge of the soaking plate 10, so that the -th chamber 110 and the second chamber 120 are arranged along both the length direction and the width direction of the soaking plate 10, it is understood that the semi-permeable membrane 130 may also have a straight shape, and both sides extend to two opposite edges of the soaking plate 10.
As shown in fig. 3 and 4, in the embodiment, a solution medium is disposed in the first chamber 110, a solution medium is disposed in the second chamber 120, the solution medium in the first 0 chamber 110 and the solution medium in the second chamber 120 are separated by the semipermeable membrane 130, the second chamber 110 corresponds to the evaporation zone 170 of the soaking plate 10, the second chamber 120 corresponds to the condensation zone 180 of the soaking plate 10, the 2 opening 201 and the second opening 301 are respectively located in the evaporation zone 170 and the condensation zone 180, and the 3 opening 201 is communicated with the second chamber 110, the second opening is communicated with the second chamber 120, in the embodiment, the solution medium in the second chamber 110 is not filled with the entire space of the second 638 chamber 110, the solution medium in the second chamber 120 is not filled with the entire space of the second chamber 120, it is understood that the solution medium in the second 6 chamber 110 is the same as the solution medium in the second chamber 120, i.e., the solution medium in the second 359 chamber 110, the solution medium 120 in the second chamber 120 is the same as the solution medium in the second chamber 120, and the second chamber 120, the solution medium in the second chamber 110, the second chamber 120 is also the same as the solution medium in the same as the water medium in the embodiment, the water medium in the concentration of the second chamber 110, the second chamber 120, the water medium in the second chamber 120, the water medium of the second chamber 120, the water medium of the embodiment, the water medium of the second chamber 120, the embodiment, the water medium of the same concentration of the embodiment, the water medium of the second chamber 120, the water medium of the same concentration of the second chamber 120, the embodiment.
As shown in fig. 3 to 5, the solution medium in the th chamber 110 is heated to generate gas which can permeate the semi-permeable membrane 130 and enter the second chamber 120, because the condensation zone 180 does not absorb heat from the environment, the temperature of the condensation zone 180 is lower than that of the evaporation zone 170, the gas is liquefied in the condensation zone 180 and dissolved in the solution medium in the second chamber 120, so that the concentration of the solution medium in the th chamber 110 is higher than that of the solution medium in the second chamber 120, the solvent of the solution medium in the second chamber 120 can permeate the semi-permeable membrane 130 and enter the th chamber 110 and be dissolved in the solution medium in the th chamber 110, so that the concentration of the solution medium in the th chamber 110 is decreased and the concentration of the solution medium in the second chamber 120 is increased until the concentration of the solution medium in the th chamber 110 is equal to that the concentration of the solution medium in the second chamber 120, it can be understood that the gas releases heat after being liquefied in the second chamber 120, the heat is released to the environment through the condensation zone 180, and the heat is transferred from the condensation zone 170 to the condensation zone 180.
It is understood that the semi-permeable membrane 130 has a bent structure such that the th chamber 110 and the second chamber 120 are in contact in both the length direction, i.e., the X direction, and the width direction, i.e., the Y direction, of the soaking plate 10, i.e., the evaporation zone 170 and the condensation zone 180 can transfer heat in both the length direction, i.e., the X direction, and the width direction, i.e., the Y direction, of the soaking plate 10, such that the soaking plate 10 can transfer heat in both the X direction and the Y direction, when the semi-permeable membrane 130 is L-shaped, heat can be transferred between the evaporation zone 170 and the condensation zone 180 in both the X direction and the Y direction, when the semi-permeable membrane 130 is U-shaped or C-shaped, heat can be transferred between the evaporation zone 170 and the condensation zone 180 in three directions, including two opposite directions of the X direction and the Y direction, or two opposite.
The vapor chamber 10 of the present application, the inner chamber 100 is provided with a semi-permeable membrane 130, the vapor chamber 10 is divided into an evaporation zone 170 and a condensation zone 180, a gas or a solvent can permeate the semi-permeable membrane 130, after the evaporation zone 170 absorbs heat from the environment, the solvent of the solution medium in the chamber 110 of the th compartment 110 absorbs heat and evaporates to generate a gas, so that the temperature of the environment where the evaporation zone 170 is located is lowered, the gas can permeate the semi-permeable membrane 130 into the second compartment 120 to be liquefied and released, and is dissolved in the solution medium in the second compartment 120, so that the temperature of the second compartment 120 is raised, the heat is transferred to the environment through the condensation zone 180, the transfer of the ambient heat from the evaporation zone 170 to the condensation zone 180 is completed, so that the vapor chamber 10 has the function of transferring ambient heat, the concentration of the solution medium in the chamber 110 of the th compartment 110 is heated to generate a gas, the concentration of the solution medium in the chamber 110 of the th compartment 110 is raised, the gas is liquefied after permeating the semi-permeable membrane 130 and is transferred to the solution medium in the second compartment 120, the concentration of the solution medium in the second compartment 120 of the semi-permeable membrane 120 is lowered and is lowered, so that the concentration of the solution medium in the second compartment 120 in the second compartment 110 is lower than the concentration of the solution medium in the semi-permeable membrane 120, so that the concentration of the solution medium in the second compartment 110 is increased, so that the heat-permeable membrane 130 is transferred, the heat-permeable membrane 130 is transferred, the heat-permeable membrane 130 in the heat-permeable membrane 130 is transferred in the second compartment 180, so that the heat-condensing zone 180, the heat-transferring medium in the second compartment 120, the heat-permeable membrane 35.
In the embodiment, the semi-permeable membrane 130 is located in the inner cavity 100 near the edges or corners of the soaking plate 10, so that the area of the evaporation zone 170 is smaller than the area of the condensation zone 180. when the soaking plate 10 is used for heat transfer, the evaporation zone 170 has a smaller area, can rapidly increase the temperature after absorbing the ambient heat and rapidly generate gas, and the condensation zone 180 has a larger area, has a larger space for heat dissipation, has a faster heat dissipation speed, and enables the ambient heat to be rapidly transferred from the evaporation zone 170 to the condensation zone 180.
As shown in fig. 2b and 3, in the embodiment, the soaking plate 10 includes a support 140 fixed to the inner cavity 100. the support 140 is fixed to the inner cavity 100 by means of double-sided tape or welding, specifically, in the thickness direction of the soaking plate 10, the end of the support 140 is welded or adhered to the th substrate 20, and the other end is welded or adhered to the second substrate 30. the semi-permeable membrane 130 is attached to the support 140, and the shape and size of the support 140 are the same as those of the semi-permeable membrane 130. the support 140 is located on the side of the semi-permeable membrane 130 facing the th chamber 110 or on the side of the semi-permeable membrane 130 facing the second chamber 120. in another embodiment, the support 140 is a planar structure and is disposed in the thickness direction perpendicular to the soaking plate 10, and the edge of the support 140 is fixed to the edge.
As shown in fig. 2b, in the implementation, the supporting portion 140 is opened with a through hole 141, such that a partial structure of the semipermeable membrane 130 is exposed to the chamber 110 and the second chamber 120 at the same time, such that the gas generated by the evaporation of the solvent of the solution medium in the chamber 110 can pass through the through hole 141 and permeate through the semipermeable membrane 130 into the second chamber 120, or the gas generated by the evaporation of the solvent of the solution medium in the second chamber 120 can pass through the through hole 141 and permeate through the semipermeable membrane 130 into the chamber 110. in another embodiment, the supporting portion 140 is a mesh structure, such that a partial structure of the semipermeable membrane 130 is exposed to the chamber 110 and the second chamber 120 at the same time, such that the solvent of the solution medium in the chamber 110 or the gas generated by the heating of the solution medium in the second chamber 120 can pass through the supporting portion 140 and permeate through the semipermeable membrane 130 into the second chamber 120 or the chamber 110. the supporting portion 140 has a supporting effect on the semipermeable membrane 130, and the fixing of the semipermeable membrane 130 to the inner chamber 100 by the supporting portion 140 does not affect the effect of the solvent of the solution medium 130 in the second chamber 110 and .
As shown in fig. 6 and 7, in the embodiment, the semi-permeable membrane 130 and the supporting portion 140 are enclosed to form a square frame structure, the supporting portion 140 is fixed to the surface of the second substrate 30, the other is fixed to the surface of the th substrate 20, the th substrate 20, the second substrate 30 and the semi-permeable membrane 130 are enclosed to form a th chamber 110, the space of the inner cavity 100 except the th chamber 110 forms a second chamber 120, the second chamber 120 encloses the th chamber 110, that is, the condensation zone 180 encloses the evaporation zone 170 in the direction perpendicular to the thickness direction of the soaking plate 10, that is, the Z direction, the heat of the evaporation zone 170 can be dissipated to the condensation zone 180 through the periphery, and then the solvent of the solution medium in the second chamber 120 can flow back into the th chamber 110, and the heat transfer and liquid backflow speeds are fast.
As shown in FIG. 8, in the embodiment, part of the structure of the semi-permeable membrane 130 is perpendicular to the thickness direction of the soaking plate 10, i.e., Z direction, and part of the structure is parallel to the thickness direction of the soaking plate 10. the th chamber 110 and the second chamber 120 are stacked, and the th chamber 110 has a smaller area in the plane formed by the XY directions of the soaking plate 10 and is smaller than the second chamber 120 has in the plane formed by the XY directions of the soaking plate 10. the heat of the evaporation zone 170 can be transferred to the condensation zone 180 in the thickness direction of the soaking plate 10, i.e., Z direction, and can also be transferred to the condensation zone 180 in the plane formed by the XY directions.
As shown in fig. 9, in the embodiment, the semi-permeable membrane 130 and the support part 140 are in a planar structure between the th substrate 20 and the second substrate 30, the semi-permeable membrane 130 is disposed in the Z direction perpendicular to the thickness direction of the soaking plate 10, and the outer circumference of the semi-permeable membrane 130 is fixed to the edge of the soaking plate 10, it is understood that the th chamber 110 and the second chamber 120 are stacked in the thickness direction of the soaking plate 10.
As shown in fig. 10, in the embodiment, methods for preparing the soaking plate 10 are provided, which comprise the following steps:
providing a substrate 20 and a semi-permeable membrane 130;
affixing the semi-permeable membrane 130 to the -th substrate 20;
providing a second substrate 30;
covering the th substrate 20 with the second substrate 30 on the side thereof where the semipermeable membrane 130 is provided;
connecting the edge of the th substrate 20 and the edge of the second substrate 30 to form an inner cavity 100 between the th substrate 20 and the second substrate 30, the semi-permeable membrane 130 dividing the inner cavity 100 into a th chamber 110 and a second chamber 120, and
solution medium is injected into the th chamber 110 or the second chamber 120;
the soaking plate 10 comprises an evaporation zone 170 and a condensation zone 180, the th chamber 110 is located in the evaporation zone 170, the second chamber 120 is located in the condensation zone 180, the evaporation zone 170 can absorb heat to enable the solution medium in the th chamber 110 to be heated and evaporated to generate gas, the gas can penetrate through the semi-permeable membrane 130 to enter the second chamber 120 and be liquefied in the second chamber 120 to be dissolved in the solution medium in the second chamber 120 and release heat, the concentration of the solution medium in the second chamber 120 is smaller than that of the solution medium in the th chamber 110, and therefore the solvent in the solution medium in the second chamber 120 flows back to the th chamber 110 through the semi-permeable membrane 130.
In the embodiment, the th substrate 20 and the semi-permeable membrane 130 are provided, the material of the th substrate 20 is a metal material, and the thickness of the th substrate 20 is 0.1mm to 0.12mm, it is understood that the material of the th substrate 20 may be other materials with better heat conductivity, and the thickness of the th substrate 20 may be other dimensions according to the selected materials, so that only the use strength of the soaking plate 10 needs to be ensured.
As shown in fig. 11, in the embodiment, after the step of providing the th substrate 20 and the semi-permeable membrane 130 and before the step of fixing the semi-permeable membrane 130 to the th substrate 20, the method further includes the steps of providing a support 140 and fixing the semi-permeable membrane 130 to the support 140. specifically, the support 140 is provided with through holes 141 or the support 140 is a net structure, and the semi-permeable membrane 130 is attached to the support 140 by adhesion or mechanical fixation, the shape and size of the support 140 are the same as those of the semi-permeable membrane 130, or the size of the semi-permeable membrane 130 is slightly smaller than that of the support 140, but the semi-permeable membrane 130 is required to cover the through holes 141 or the meshes of the support 140.
As shown in fig. 11, in the embodiment, the step of fixing the semi-permeable membrane 130 to the th substrate 20 includes fixing the support 140 to the th substrate 20 by bonding or welding, so that the semi-permeable membrane 130 is fixed to the th substrate 20, specifically, attaching a double-sided adhesive to an edge of the support 140 provided with the semi-permeable membrane 130, and vertically or nearly vertically placing the support 140 on the surface of the th substrate 20, so that the double-sided adhesive is attached to the th substrate 20, the support 140 may be parallel to the thickness direction of the th substrate 20, or may be slightly inclined, which is not limited herein.
In another embodiment, the th substrate 20 and the supporting portion 140 are made of metal, the supporting portion 140 is vertically disposed after the supporting portion 140 is disposed at the set position, and the edge of the supporting portion 140 and the th substrate 20 are fixed together by welding at , so as to prevent the supporting portion 140 from moving.
In the embodiment in which the semi-permeable membrane 130 is perpendicular to the thickness direction of the soaking plate 10, the supporting part 140 needs to be stacked on the th substrate 20, the edge of the supporting part 140 needs to be bonded or welded to the edge of the th substrate 20, and a gap exists between the supporting part 140 and the th substrate 20.
As shown in FIG. 11, in the embodiment, a second substrate 30 is provided, and the shape, size and material of the second substrate 30 are the same as those of the substrate 20. it is understood that the shape, size and material of the second substrate 30 may be different from those of the substrate 20 according to the actual design requirements, and is not limited herein.
As shown in fig. 11, in embodiment, the second substrate 30 is disposed to cover the side of the th substrate 20 on which the semipermeable membrane 130 is disposed, specifically, the second substrate 30 is disposed to the side of the th substrate 20 such that the supporting part 140 is perpendicular or substantially perpendicular to the thickness direction of the second substrate 30 and the second substrate 30 is parallel or substantially parallel to the th substrate 20, the supporting part 140 is fixed to the surface of the second substrate 30 by bonding or welding such that the supporting part 140 is fixed to the th substrate 20 and the end is fixed to the second substrate 30 in the thickness direction of the soaking plate 10.
In the embodiment where the semi-permeable membrane 130 is perpendicular to the thickness direction of the soaking plate 10, the second substrate 30 is disposed on the side of the semi-permeable membrane 130 facing away from the th substrate 20, and the edges of the th substrate 20 and the second substrate 30 are fixed, as described in detail in the step of connecting the edge of the th substrate 20 and the edge of the second substrate 30.
As shown in FIG. 11, in the embodiment, the edge of the base plate 20 and the edge of the second base plate 30 are connected, the inner cavity 100 is formed between the 0 th base plate 20 and the second base plate 30, and the semi-permeable membrane 130 divides the inner cavity 100 into the 1 th chamber 110 and the second chamber 120. specifically, the edge of the th base plate 20 and the edge of the second base plate 30 are fixed by bonding or welding to form the inner cavity 100, and a th opening 201 and a second opening 301 are reserved, and the inner cavity 100 can be communicated with the outside through the th opening 201 and the second opening 301. it can be understood that the edge of the th base plate 20 and the edge of the second base plate 30 are not completely closed, so that the spaced th opening 201 and the second opening 301 are formed, the th opening 201 is located in the evaporation area 170 and communicated with the th chamber 110, so that the th chamber 110 is communicated with the outside, the second opening 301 is located in the condensation area 180 and communicated with the second chamber 180, so that the second chamber 180 is.
In the embodiment, as shown in fig. 11, solution medium is injected into the th chamber 110 or the second chamber 120 through the 0 th opening 201 and the solution medium in the th chamber 110 is injected into the th chamber 110 by using a drain tube, and the solution medium in the second chamber 120 is injected into the second chamber 120 by using a drain tube, it is understood that the solution medium in the th chamber 110 does not fill the th chamber 110, the solution medium in the second chamber 120 does not fill the second chamber 120, and it is avoided that the solution medium in the th chamber 110 or the gas generated when the solution medium in the second chamber 120 is heated does not have an accommodating space, it is understood that the step of injecting solution medium into the th chamber 110 or the second chamber 120 may be adjusted according to actual needs, for example, when preparing the soaking plate as shown in fig. 6 and 7, the solution medium is injected into the th chamber 110, and then the th substrate 20 is connected to the edge of the second substrate 30.
As shown in fig. 11, in the embodiment, the th chamber 110 is evacuated through the th opening 201, and the second chamber 120 is evacuated through the second opening 301, so that a negative pressure is formed in the th chamber 110 and the second chamber 120, and the solvent of the solution medium in the th chamber 110 can evaporate at a lower temperature, for example, the solvent can evaporate to generate gas at 40 ℃ or 50 ℃ so as to facilitate heat transfer at a lower temperature.
The method for manufacturing the soaking plate 10 includes the steps of fixing the semi-permeable membrane 130 to the support plate 140, fixing the end of the support part 140 to the th substrate 20 by means of bonding or welding, and fixing the other 0 end of the support part 140 to the second substrate 30 by means of bonding or welding, fixedly connecting the edge of the 1 th substrate 20 to the edge of the second substrate 30 to form the inner cavity 100, reserving the th opening 201 and the second opening 301, dividing the inner cavity 100 into the th chamber 110 and the second chamber 120 by the semi-permeable membrane 130, injecting a solution medium into the th chamber 110 through the th opening 201 and vacuumizing the th chamber 110, injecting a solution medium into the second chamber 120 through the second opening 301 and vacuumizing the second chamber 120, then sealing the th opening 201 and the second opening 301 respectively to form the soaking plate 10, wherein the th chamber 110 is located in the evaporation region 170, the second chamber 120 is located in the condensation region , the vapor-liquid medium is capable of absorbing heat and converting the heat into a vapor-liquid material capable of reducing the heat transfer from the vapor-liquid material of the soaking plate 130 to the vapor-liquid-vapor-phase condensation region 180 process, and the soaking plate 130 is manufactured by a simple process for reducing the heat transfer process of the soaking plate 130.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (15)
1, soaking plate, characterized by comprising:
th substrate;
a second substrate disposed opposite the th substrate, wherein a sealed cavity is formed between the th substrate and the second substrate;
a solution medium located in the lumen; and
a semi-permeable membrane positioned within said inner chamber and dividing said inner chamber into an th chamber and a second chamber;
wherein, the solvent in the solution medium in the th cavity produces gas because of being heated evaporation, gas can permeate the semipermeable membrane gets into the second cavity, and meet cold liquefaction and release heat in the second cavity, make simultaneously the concentration of solution medium in the second cavity is less than the concentration of solution medium in the th cavity, thereby make solvent in the solution medium in the second cavity pass through the semipermeable membrane flows back to the th cavity.
2. The soaking plate according to claim 1, wherein in the thickness direction of the soaking plate, the end of the semi-permeable membrane is fixed on the th substrate, the other end is fixed on the second substrate, in the thickness direction perpendicular to the soaking plate, the semi-permeable membrane is of a bent structure, and two sides of the semi-permeable membrane extend to the same edge or two adjacent edges of the soaking plate.
3. The soaking plate according to claim 1, wherein the semi-permeable membrane end is fixed on the th substrate and the other end is fixed on the second substrate in the thickness direction of the soaking plate, the semi-permeable membrane is in a straight structure in the thickness direction perpendicular to the soaking plate, and two sides of the semi-permeable membrane extend to two opposite edges of the soaking plate.
4. The soaking plate according to claim 1, wherein the semi-permeable membrane is provided in a direction perpendicular to the thickness direction of the soaking plate, and the outer periphery of the semi-permeable membrane is fixed to the edge of the soaking plate.
5. The soaking plate according to any one of claims 1 to 4, comprising a support fixed to the inner cavity, wherein the semi-permeable membrane is attached to the support, and the support is penetrated by the solvent of the solution medium in the th cavity or the solvent of the solution medium in the second cavity.
6. The soaking plate according to claim 5, wherein the supporting part is provided with through holes or is of a net structure.
The preparation method of the soaking plate of 7 and kinds is characterized by comprising the following steps:
providing an th substrate and a semi-permeable membrane;
affixing the semi-permeable membrane to the th substrate;
providing a second substrate;
covering the second substrate on the side of the th substrate on which the semipermeable membrane is provided;
connecting the edge of the th substrate and the edge of the second substrate to form an inner cavity between the th substrate and the second substrate, the inner cavity being divided into a th chamber and a second chamber by the semi-permeable membrane
Injecting a solution medium into the th chamber or the second chamber;
wherein the solution medium in the th cavity produces gas because of being heated evaporation, gas can permeate the semipermeable membrane gets into the second cavity, and meets cold liquefaction and releases heat in the second cavity, makes simultaneously the concentration of solution medium in the second cavity is less than the concentration of solution medium in the th cavity, thereby makes the solvent in the solution medium in the second cavity flow back to the th cavity through the semipermeable membrane.
8. The method for producing a vapor chamber according to claim 7, further comprising, after the step of providing the th substrate and the semipermeable membrane and before the step of fixing the semipermeable membrane to the th substrate, the steps of:
providing a support portion and fixing the semi-permeable membrane to the support portion.
9. The method for producing a vapor chamber according to claim 8, wherein the step of fixing the semipermeable membrane to the th substrate comprises,
the supporting part is fixed to the th substrate by bonding or welding, so that the semi-permeable membrane is fixed to the th substrate.
10. The method according to claim 8, wherein the step of covering the second substrate on the side of the th substrate on which the semipermeable membrane is provided further comprises the steps of:
and fixing the supporting part to the second substrate in a bonding or welding manner, so that the semi-permeable membrane is fixed to the second substrate.
11. The method for producing a vapor chamber according to claim 7, wherein the step of joining the edge of the th substrate and the edge of the second substrate comprises,
fixing the edge of the th substrate and the edge of the second substrate by bonding or welding, and reserving a th opening and a second opening, wherein the th opening is communicated with the th chamber, and the second opening is communicated with the second chamber.
12. The method for preparing a vapor chamber according to claim 11, wherein the step of injecting the solution medium into the th chamber or the second chamber comprises:
solution medium is injected into the th chamber through the th opening, and solution medium is injected into the second chamber through the second opening.
13. The method for preparing a soaking plate according to claim 12, wherein after the step of injecting the solution medium into the th chamber through the th opening and the step of injecting the solution medium into the second chamber through the second opening, the method further comprises the following steps:
evacuating the th chamber through the th opening and evacuating the second chamber through the second opening.
14. The method according to claim 13, wherein after the step of evacuating the th chamber through the th opening and the second chamber through the second opening, the method further comprises the steps of:
sealing the th opening and sealing the second opening.
15, kinds of electronic equipment, characterized by, include electronic components and the soaking plate of any of claims 1 ~ 6, the soaking plate includes evaporation zone and condensation zone, the th cavity is located the evaporation zone, the second cavity is located the condensation zone, the evaporation zone contacts with the electronic components, the electronic components can produce heat when working, the evaporation zone can absorb heat and transmit heat to the condensation zone, the condensation zone can release heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910972714.1A CN110740614B (en) | 2019-10-14 | 2019-10-14 | Vapor chamber, manufacturing method thereof and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910972714.1A CN110740614B (en) | 2019-10-14 | 2019-10-14 | Vapor chamber, manufacturing method thereof and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110740614A true CN110740614A (en) | 2020-01-31 |
| CN110740614B CN110740614B (en) | 2020-07-07 |
Family
ID=69269993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910972714.1A Active CN110740614B (en) | 2019-10-14 | 2019-10-14 | Vapor chamber, manufacturing method thereof and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110740614B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115259093A (en) * | 2021-09-17 | 2022-11-01 | 罗雅男 | High-density plate type ozone generator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103033077A (en) * | 2011-09-30 | 2013-04-10 | 富瑞精密组件（昆山）有限公司 | Heat pipe |
| CN103398613A (en) * | 2013-07-22 | 2013-11-20 | 施金城 | Vapor chamber and method for manufacturing same |
| CN206556484U (en) * | 2017-01-26 | 2017-10-13 | 广州华钻电子科技有限公司 | A kind of new type superthin soaking plate |
| CN206724766U (en) * | 2017-05-04 | 2017-12-08 | 广州华钻电子科技有限公司 | A kind of loop soaking plate |
| CN208779995U (en) * | 2018-06-22 | 2019-04-23 | 广东工业大学 | A kind of soaking plate |
-
2019
- 2019-10-14 CN CN201910972714.1A patent/CN110740614B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103033077A (en) * | 2011-09-30 | 2013-04-10 | 富瑞精密组件（昆山）有限公司 | Heat pipe |
| CN103398613A (en) * | 2013-07-22 | 2013-11-20 | 施金城 | Vapor chamber and method for manufacturing same |
| CN206556484U (en) * | 2017-01-26 | 2017-10-13 | 广州华钻电子科技有限公司 | A kind of new type superthin soaking plate |
| CN206724766U (en) * | 2017-05-04 | 2017-12-08 | 广州华钻电子科技有限公司 | A kind of loop soaking plate |
| CN208779995U (en) * | 2018-06-22 | 2019-04-23 | 广东工业大学 | A kind of soaking plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115259093A (en) * | 2021-09-17 | 2022-11-01 | 罗雅男 | High-density plate type ozone generator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110740614B (en) | 2020-07-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2021203825A1 (en) | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus | |
| US6679318B2 (en) | Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability | |
| CN113606972B (en) | Preparation method of flexible ultrathin vapor chamber | |
| US4118756A (en) | Heat pipe thermal mounting plate for cooling electronic circuit cards | |
| US20100326630A1 (en) | Heat spreader with vapor chamber and method for manufacturing the same | |
| CN111447793B (en) | Heat dissipation device, preparation method of heat dissipation device and electronic equipment | |
| CN211429852U (en) | Heat dissipation plate and electronic device with same | |
| Liew et al. | Flexible thermal ground planes fabricated with printed circuit board technology | |
| CN107421364B (en) | Temperature equalizing plate structure and manufacturing method thereof | |
| CN111964501A (en) | Flat heat pipe, preparation method thereof and heat exchanger | |
| CN210108104U (en) | Temperature equalizing plate | |
| US20210071963A1 (en) | Bendable Flat Heat Pipe Devices, Systems, and Methods | |
| WO2021018004A1 (en) | Heat conduction device and terminal device | |
| CN105698581A (en) | Light, thin and pressing-resistant flat heat pipe with high installation adaptability | |
| US20200016705A1 (en) | Thermal-control, truss-plate apparatus and method | |
| CN110740614A (en) | Vapor chamber, manufacturing method thereof and electronic equipment | |
| TW202126979A (en) | Ultra-thin vapor chamber with double side wick structure and manufacturing method thereof | |
| TWI819157B (en) | Ultra-thin vapor chamber and manufacturing method thereof | |
| EP3657540A1 (en) | Chip-on-film heat dissipation structure, manufacturing method thereof, and display device | |
| US20200191497A1 (en) | Deployable Radiator Devices, Systems, and Methods Utilizing Composite Laminates | |
| WO2023093125A1 (en) | Vapor chamber comprising microstructure layer | |
| CN110763056B (en) | Heat pipe, preparation method thereof and electronic equipment | |
| JP7173402B2 (en) | vapor chamber | |
| CN215644533U (en) | Spontaneous heat dissipation photovoltaic module structure | |
| CN214407103U (en) | Flexible soaking plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |