US20100243212A1 - Non-flat vapor chamber with stiffening plate - Google Patents
Non-flat vapor chamber with stiffening plate Download PDFInfo
- Publication number
- US20100243212A1 US20100243212A1 US12/411,727 US41172709A US2010243212A1 US 20100243212 A1 US20100243212 A1 US 20100243212A1 US 41172709 A US41172709 A US 41172709A US 2010243212 A1 US2010243212 A1 US 2010243212A1
- Authority
- US
- United States
- Prior art keywords
- lower case
- vapor chamber
- plate
- stiffening plate
- case plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a vapor chamber, and more particularly to a non-flat vapor chamber with a stiffening plate.
- Vapor chamber has been used extensively in electronic devices, and the vapor chamber is generally attached onto heat generating components of a printed circuit board for dissipating waste heat produced by the heat generating components, so that the electronic components can be operated at a normal working temperature without the risk of being burned or damaged.
- a printed circuit board includes various different electronic components, and these components are installed with a height difference with respect to a distal surface of the printed circuit board instead of being installed flatly on the surface, and a general flat vapor chamber cannot be applied to such non-flat surface.
- a non-flat vapor chamber wherein a protrusion is formed on the surface of the vapor chamber, and a containing space corresponding to the protrusion is formed inside the vapor chamber, and the protrusion is aligned precisely with the heat generating components of the printed circuit board to overcome the aforementioned problem. If no support body is installed in the vapor chamber and at a position corresponding to the protrusion, then the external case plate of the vapor chamber and the capillary tissue in the vapor chamber will be depressed and collapsed, after the interior of the vapor chamber is vacuumed and used for a long time. Therefore, the non-flat vapor chamber generally includes an upper case plate, a lower case plate, a working fluid, a capillary tissue and a support body, and the aforementioned protrusion is usually formed at the lower case plate.
- the manufacturing procedure of the aforementioned non-flat vapor chambers is described as follows. Firstly, a protrusion is formed on the lower case plate, and a capillary tissue is attached onto internal walls of the upper and lower case plates, and both ends of the support body abut the capillary tissue, and a portion of the support body is contained in a containing space for abutting the internal walls of the upper and lower case plates, and the upper and lower case plates are engaged with each other and form a crevice between the upper and lower case plates, and then a working fluid is filled, and finally the interior of the vapor chamber is vacuumed and the crevice is sealed to complete the manufacture of the non-flat vapor chamber.
- the non-flat vapor chambers of this sort still have the following problems in the actual manufacturing process. Since the support body is generally comprised of a plurality of cylindrical bodies, and the cross-sectional area of the cylindrical bodies is much smaller than the area of the lower case plate of the vapor chamber, and a portion of cylindrical bodies are contained in a containing space formed inside the protrusion and abutted against the upper and lower case plates and the capillary tissue. If the interior of the vapor chamber is vacuumed, the upper and lower case plates will be depressed the pressure, and marks of the plurality of cylindrical bodies will be formed on the surface of the vapor chamber since the cross-sectional area of the cylindrical bodies is much smaller than the surface area of the vapor chamber.
- a larger pressure is exerted onto the surface of the vapor chamber and the marks of the cylindrical bodies are formed on the surface of the vapor chamber. Therefore, the surface of the vapor chamber cannot be maintained as a flat surface or attached closely with the heat generating component, and the thermal conduction performance is lowered.
- the inventor of the present invention based on years of experience in the related industry to develop a non-flat vapor chamber with a stiffening plate in accordance with the present invention to overcome the shortcomings of the prior art.
- the present invention provides a non-flat vapor chamber comprising a casing, a capillary tissue, a stiffening plate, a support structure and a working fluid
- the casing includes a lower case plate and an upper case plate sealed with the lower case plate, and a partial area of the lower case plate is protruded downward to form a chamber therein, and a retaining portion is formed around the chamber
- the capillary tissue is disposed on internal walls of the upper and lower case plates
- the stiffening plate with a plurality of through holes is disposed on the retaining portion
- the support structure is contained in the casing, and upper and lower ends of the support structure are coupled to the capillary tissue and the stiffening plate respectively, and the working fluid is filled into the casing.
- the present invention overcomes the uneven surface drawback of the conventional vapor chamber caused by the internal support body of the vapor chamber by using the stiffening plate and the retaining portion, so that the surface of a vacuumed non-flat vapor chamber will not be depressed or marked to assure a flat surface of the vapor chamber.
- the stiffening plate does not occupy any of the thermal conducting space in the vapor chamber, and the design of having a through hole on the stiffening plate prevents the working fluid in the vapor chamber from being blocked by the stiffening plate to assure the expected thermal conduction performance of the vapor chamber.
- the structure of the stiffening plate and the retaining portion allows the vapor chamber of the invention to use the support structure of a conventional vapor chamber, and thus it is not necessary to redesign the support structure for manufacturing the non-flat vapor chamber of the present invention, so as to save the product development time.
- the internal volume can be increased to improve the heat dissipation performance.
- FIG. 1 is an exploded view of a lower case plate and a stiffening plate of the present invention
- FIG. 2 is an exploded view of the present invention
- FIG. 3 is a perspective view of the present invention
- FIG. 4 is a cross-sectional view of Section 4 - 4 of FIG. 3 ;
- FIG. 5 is a bottom view of a stiffening plate in accordance with another preferred embodiment of the present invention.
- FIG. 6 is a bottom view of a stiffening plate in accordance with a further preferred embodiment of the present invention.
- FIG. 7 is an exploded view of another preferred embodiment of the present invention.
- the present invention provides a non-flat vapor chamber with a stiffening plate 1 , comprising a casing 10 , a capillary tissue 20 , a stiffening plate 30 , a support structure 40 and a working fluid 50 .
- the casing 10 includes a lower case plate 11 and an upper case plate 12 sealed and coupled to the lower case plate 11 , wherein a cavity b is formed between the upper case plate 12 and the lower case plate 11 , and a partial area of the lower case plate 11 is protruded downward to form a chamber 111 therein, and a retaining portion 112 is formed and enclosed by the periphery of the chamber 111 .
- the retaining portion 112 is formed at a plurality of corner plates 1121 of the lower case plate 11 , and the corner plates 1121 are disposed at the four corners of the chamber 111 respectively, but the invention is not limited to such arrangement only, and the corner plates 1121 may be designed at two opposite corners only.
- the capillary tissue 20 is disposed on internal walls of the upper case plate 12 and the lower case plate 11 .
- the stiffening plate 30 is installed on the retaining portion 112 and has a plurality of through holes 31 .
- the stiffening plate 30 is in a rectangular shape and has a protruding edge 32 extended separately from the corners of the stiffening plate 30 , such that a gap d is formed between the lateral side of the stiffening plate 30 and the internal wall of the lower case plate 11 for providing a buffer distance between the stiffening plate 30 and the lower case plate 11 to prevent the volume of the stiffening plate 30 from being expanded by high temperature, compressing with the lower case plate 11 or damaging the vapor chamber 1 .
- the support structure 40 is contained in the casing 10 , and upper and lower ends of the support structure 40 are coupled with the capillary tissue 20 and the stiffening plate 30 respectively, and a working fluid 50 (as shown in FIG. 4 ) is filled into the casing 10 .
- the invention further comprises a filling and degassing tube 60 , an upper case plate 12 and a lower case plate 11 , both having a notch 113 , 121 , and the notches 113 , 121 constitute an orifice c for passing the filling and degassing tube 60 .
- the filling and degassing tube 60 is provided for vacuuming the interior of the vapor chamber 1 and filling the working fluid 50 .
- the stiffening plate 30 installed at the retaining portion 112 can provide a supporting force to the support structure 40 if the interior of the vapor chamber 1 is vacuumed, so that the upper case plate 12 and the lower case plate 11 will not be depressed by the vacuum pressure.
- the stiffening plate 30 is supported at the bottom of the support structure 40 , and thus the support structure 40 will not be damaged by insufficient supporting force.
- the internal volume of the vapor chamber 1 can be increased to improve the heat dissipation performance of the vapor chamber 1 .
- the through holes 31 of the two preferred embodiments are in a rectangular bar shape and a circular shape respectively, but not limited to such arrangement only.
- the through hole 31 is provided for allowing the working fluid 50 to flow between the lower case plate 11 and the lower case plate 12 without any hindrance.
- the retaining portion 112 is formed on a surrounding wall 1122 of the lower case plate 11 , wherein the surrounding wall 1122 can provide a better supporting force than the corner plate 1121 , since the support area is situated at the periphery of the stiffening plate 30 .
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A non-flat vapor chamber includes a casing, a capillary tissue, a stiffening plate, a support structure and a working fluid. The casing includes a lower case plate and an upper case plate sealed with the lower case plate. The lower case plate has a partial area protruded downward to form a chamber and a retaining portion formed within the chamber. A capillary tissue is installed on internal walls of the upper and lower case plates. The stiffening plate with a through hole is installed onto the retaining portion, and the casing contains a support structure. Upper and lower ends of the support structure abut the capillary tissue and the stiffening plate. A working fluid is filled into the casing, such that a support action is provided by pressing the stiffening plate at the retaining portion for stiffening the upper case plate of a vacuumed vapor chamber.
Description
- 1. Field of the Invention
- The present invention relates to a vapor chamber, and more particularly to a non-flat vapor chamber with a stiffening plate.
- 2. Description of Prior Art
- Vapor chamber has been used extensively in electronic devices, and the vapor chamber is generally attached onto heat generating components of a printed circuit board for dissipating waste heat produced by the heat generating components, so that the electronic components can be operated at a normal working temperature without the risk of being burned or damaged. However, a printed circuit board includes various different electronic components, and these components are installed with a height difference with respect to a distal surface of the printed circuit board instead of being installed flatly on the surface, and a general flat vapor chamber cannot be applied to such non-flat surface.
- Therefore, a non-flat vapor chamber was introduced, wherein a protrusion is formed on the surface of the vapor chamber, and a containing space corresponding to the protrusion is formed inside the vapor chamber, and the protrusion is aligned precisely with the heat generating components of the printed circuit board to overcome the aforementioned problem. If no support body is installed in the vapor chamber and at a position corresponding to the protrusion, then the external case plate of the vapor chamber and the capillary tissue in the vapor chamber will be depressed and collapsed, after the interior of the vapor chamber is vacuumed and used for a long time. Therefore, the non-flat vapor chamber generally includes an upper case plate, a lower case plate, a working fluid, a capillary tissue and a support body, and the aforementioned protrusion is usually formed at the lower case plate.
- The manufacturing procedure of the aforementioned non-flat vapor chambers is described as follows. Firstly, a protrusion is formed on the lower case plate, and a capillary tissue is attached onto internal walls of the upper and lower case plates, and both ends of the support body abut the capillary tissue, and a portion of the support body is contained in a containing space for abutting the internal walls of the upper and lower case plates, and the upper and lower case plates are engaged with each other and form a crevice between the upper and lower case plates, and then a working fluid is filled, and finally the interior of the vapor chamber is vacuumed and the crevice is sealed to complete the manufacture of the non-flat vapor chamber.
- However, the non-flat vapor chambers of this sort still have the following problems in the actual manufacturing process. Since the support body is generally comprised of a plurality of cylindrical bodies, and the cross-sectional area of the cylindrical bodies is much smaller than the area of the lower case plate of the vapor chamber, and a portion of cylindrical bodies are contained in a containing space formed inside the protrusion and abutted against the upper and lower case plates and the capillary tissue. If the interior of the vapor chamber is vacuumed, the upper and lower case plates will be depressed the pressure, and marks of the plurality of cylindrical bodies will be formed on the surface of the vapor chamber since the cross-sectional area of the cylindrical bodies is much smaller than the surface area of the vapor chamber. A larger pressure is exerted onto the surface of the vapor chamber and the marks of the cylindrical bodies are formed on the surface of the vapor chamber. Therefore, the surface of the vapor chamber cannot be maintained as a flat surface or attached closely with the heat generating component, and the thermal conduction performance is lowered.
- If the dimensions and the periphery of the cylindrical bodies are increased, the issue of forming marks on the surface of the vapor chamber can be solved, but such arrangement will occupy much of the internal space of the vapor chamber and lower the thermal conduction performance.
- In view of the shortcomings of the prior art, the inventor of the present invention based on years of experience in the related industry to develop a non-flat vapor chamber with a stiffening plate in accordance with the present invention to overcome the shortcomings of the prior art.
- It is a primary objective of the present invention to provide a non-flat vapor chamber with a stiffening plate, wherein a supporting force is provided by pressing a stiffening plate at a retaining portion, such that an upper case plate corresponding to the position of the stiffening plate will not be depressed by the vacuumed vapor chamber to assure a flat surface of the vapor chamber and the desired thermal conduction performance of the vapor chamber.
- To achieve the foregoing objective, the present invention provides a non-flat vapor chamber comprising a casing, a capillary tissue, a stiffening plate, a support structure and a working fluid, wherein the casing includes a lower case plate and an upper case plate sealed with the lower case plate, and a partial area of the lower case plate is protruded downward to form a chamber therein, and a retaining portion is formed around the chamber, and the capillary tissue is disposed on internal walls of the upper and lower case plates, and the stiffening plate with a plurality of through holes is disposed on the retaining portion, and the support structure is contained in the casing, and upper and lower ends of the support structure are coupled to the capillary tissue and the stiffening plate respectively, and the working fluid is filled into the casing.
- Compared with the prior art, the present invention overcomes the uneven surface drawback of the conventional vapor chamber caused by the internal support body of the vapor chamber by using the stiffening plate and the retaining portion, so that the surface of a vacuumed non-flat vapor chamber will not be depressed or marked to assure a flat surface of the vapor chamber. In addition, the stiffening plate does not occupy any of the thermal conducting space in the vapor chamber, and the design of having a through hole on the stiffening plate prevents the working fluid in the vapor chamber from being blocked by the stiffening plate to assure the expected thermal conduction performance of the vapor chamber. The structure of the stiffening plate and the retaining portion allows the vapor chamber of the invention to use the support structure of a conventional vapor chamber, and thus it is not necessary to redesign the support structure for manufacturing the non-flat vapor chamber of the present invention, so as to save the product development time. With the design of the non-flat vapor chamber of the invention, the internal volume can be increased to improve the heat dissipation performance.
-
FIG. 1 is an exploded view of a lower case plate and a stiffening plate of the present invention; -
FIG. 2 is an exploded view of the present invention; -
FIG. 3 is a perspective view of the present invention; -
FIG. 4 is a cross-sectional view of Section 4-4 ofFIG. 3 ; -
FIG. 5 is a bottom view of a stiffening plate in accordance with another preferred embodiment of the present invention; -
FIG. 6 is a bottom view of a stiffening plate in accordance with a further preferred embodiment of the present invention; and -
FIG. 7 is an exploded view of another preferred embodiment of the present invention. - The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of preferred embodiments with reference to the accompanying drawings, and the preferred embodiments are used for illustrating the present invention only, but not intended to limit the scope of the invention.
- With reference to
FIGS. 1 and 2 for an exploded view of a lower case plate and a stiffening plate and an exploded view of the present invention respectively, the present invention provides a non-flat vapor chamber with astiffening plate 1, comprising acasing 10, acapillary tissue 20, astiffening plate 30, asupport structure 40 and a workingfluid 50. - The
casing 10 includes alower case plate 11 and anupper case plate 12 sealed and coupled to thelower case plate 11, wherein a cavity b is formed between theupper case plate 12 and thelower case plate 11, and a partial area of thelower case plate 11 is protruded downward to form achamber 111 therein, and aretaining portion 112 is formed and enclosed by the periphery of thechamber 111. In this preferred embodiment, theretaining portion 112 is formed at a plurality ofcorner plates 1121 of thelower case plate 11, and thecorner plates 1121 are disposed at the four corners of thechamber 111 respectively, but the invention is not limited to such arrangement only, and thecorner plates 1121 may be designed at two opposite corners only. Thecapillary tissue 20 is disposed on internal walls of theupper case plate 12 and thelower case plate 11. - The
stiffening plate 30 is installed on theretaining portion 112 and has a plurality of throughholes 31. In addition, thestiffening plate 30 is in a rectangular shape and has aprotruding edge 32 extended separately from the corners of thestiffening plate 30, such that a gap d is formed between the lateral side of thestiffening plate 30 and the internal wall of thelower case plate 11 for providing a buffer distance between thestiffening plate 30 and thelower case plate 11 to prevent the volume of thestiffening plate 30 from being expanded by high temperature, compressing with thelower case plate 11 or damaging thevapor chamber 1. - The
support structure 40 is contained in thecasing 10, and upper and lower ends of thesupport structure 40 are coupled with thecapillary tissue 20 and thestiffening plate 30 respectively, and a working fluid 50 (as shown inFIG. 4 ) is filled into thecasing 10. - With reference to
FIGS. 3 and 4 for a perspective view of the present invention and a cross-sectional view of Section 4-4 ofFIG. 3 respectively, the invention further comprises a filling anddegassing tube 60, anupper case plate 12 and alower case plate 11, both having anotch notches tube 60. The filling anddegassing tube 60 is provided for vacuuming the interior of thevapor chamber 1 and filling the workingfluid 50. - In
FIG. 4 , thestiffening plate 30 installed at theretaining portion 112 can provide a supporting force to thesupport structure 40 if the interior of thevapor chamber 1 is vacuumed, so that theupper case plate 12 and thelower case plate 11 will not be depressed by the vacuum pressure. In addition, thestiffening plate 30 is supported at the bottom of thesupport structure 40, and thus thesupport structure 40 will not be damaged by insufficient supporting force. With thechamber 111, the internal volume of thevapor chamber 1 can be increased to improve the heat dissipation performance of thevapor chamber 1. - With reference to
FIG. 5 for a bottom view of a stiffening plate in accordance with another preferred embodiment of the present invention andFIG. 6 for a bottom view of a stiffening plate in accordance with a further preferred embodiment of the present invention, the throughholes 31 of the two preferred embodiments are in a rectangular bar shape and a circular shape respectively, but not limited to such arrangement only. The throughhole 31 is provided for allowing the workingfluid 50 to flow between thelower case plate 11 and thelower case plate 12 without any hindrance. - With reference to
FIG. 7 for an exploded view of another preferred embodiment of the present invention, theretaining portion 112 is formed on a surroundingwall 1122 of thelower case plate 11, wherein the surroundingwall 1122 can provide a better supporting force than thecorner plate 1121, since the support area is situated at the periphery of thestiffening plate 30. - In summation of the description above, the present invention overcome the shortcomings of the prior art, and complies with the requirements of patent application and is thus duly filed for patent application. While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.
Claims (8)
1. A non-flat vapor chamber comprising:
a casing, including a lower case plate and an upper case plate sealed with the lower case plate, and partial area of the lower case plate being protruded downward to form a chamber therein, and a retaining portion being formed around the chamber;
a capillary tissue, disposed on internal walls of the upper and lower case plates;
a stiffening plate, disposed on the retaining portion, and having a plurality of through holes;
a support structure, contained in the casing, and having upper and lower ends coupled to the capillary tissue and the stiffening plate respectively; and
a working fluid, filled into the casing.
2. The non-flat vapor chamber of claim 1 , wherein the retaining portion is formed at the lower case plate and disposed separately at a plurality of corner plates at corners of the chamber.
3. The non-flat vapor chamber of claim 1 , wherein the retaining portion is formed on a surrounding wall of the lower case plate.
4. The non-flat vapor chamber of claim 1 , wherein the retaining portion and the lower case plate have internal surfaces constituting a height difference, such that a distal surface of the stiffening plate is aligned evenly with the internal surface of the lower case plate.
5. The non-flat vapor chamber of claim 1 , wherein the through hole is in a rectangular-bar shape.
6. The non-flat vapor chamber of claim 1 , wherein the through hole is in a circular shape.
7. The non-flat vapor chamber of claim 1 , wherein the stiffening plate is substantially in a rectangular shape, having a protruding edge extended from the corners of the stiffening plate, such that a gap is formed between a lateral side of the stiffening plate and the internal wall of the lower case plate.
8. The non-flat vapor chamber of claim 1 , further comprising a filling and degassing tube, and the upper and lower case plates having a notch each, and the notches constituting an orifice for passing the filling and degassing tube.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/411,727 US20100243212A1 (en) | 2009-03-26 | 2009-03-26 | Non-flat vapor chamber with stiffening plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/411,727 US20100243212A1 (en) | 2009-03-26 | 2009-03-26 | Non-flat vapor chamber with stiffening plate |
Publications (1)
Publication Number | Publication Date |
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US20100243212A1 true US20100243212A1 (en) | 2010-09-30 |
Family
ID=42782686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/411,727 Abandoned US20100243212A1 (en) | 2009-03-26 | 2009-03-26 | Non-flat vapor chamber with stiffening plate |
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US (1) | US20100243212A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150129175A1 (en) * | 2012-11-13 | 2015-05-14 | Delta Electronics, Inc. | Thermosyphon heat sink |
US20170350657A1 (en) * | 2016-06-02 | 2017-12-07 | Tai-Sol Electronics Co., Ltd. | Heat spreader with a liquid-vapor separation structure |
US10551133B2 (en) | 2012-09-20 | 2020-02-04 | Thermal Corp. | Reinforced heat-transfer device, heat-transfer system, and method of reinforcing a heat-transfer device |
US20200223565A1 (en) * | 2012-11-20 | 2020-07-16 | Lockheed Martin Corporation | Heat pipe with axial wick |
CN111912274A (en) * | 2019-05-10 | 2020-11-10 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
US10999952B1 (en) * | 2020-01-02 | 2021-05-04 | Taiwan Microloops Corp. | Vapor chamber and manufacturing method thereof |
US20220065551A1 (en) * | 2020-08-27 | 2022-03-03 | Shinko Electric Industries Co., Ltd. | Loop heat pipe |
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US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US20020056542A1 (en) * | 1995-12-21 | 2002-05-16 | Masaaki Yamamoto | Flat type heat pipe |
US20070089865A1 (en) * | 2003-06-26 | 2007-04-26 | Rosenfeld John H | Brazed wick for a heat transfer device and method of making same |
-
2009
- 2009-03-26 US US12/411,727 patent/US20100243212A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020056542A1 (en) * | 1995-12-21 | 2002-05-16 | Masaaki Yamamoto | Flat type heat pipe |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US20070089865A1 (en) * | 2003-06-26 | 2007-04-26 | Rosenfeld John H | Brazed wick for a heat transfer device and method of making same |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10551133B2 (en) | 2012-09-20 | 2020-02-04 | Thermal Corp. | Reinforced heat-transfer device, heat-transfer system, and method of reinforcing a heat-transfer device |
US20150129175A1 (en) * | 2012-11-13 | 2015-05-14 | Delta Electronics, Inc. | Thermosyphon heat sink |
US11486652B2 (en) * | 2012-11-13 | 2022-11-01 | Delta Electronics, Inc. | Thermosyphon heat sink |
US20200223565A1 (en) * | 2012-11-20 | 2020-07-16 | Lockheed Martin Corporation | Heat pipe with axial wick |
US11745901B2 (en) * | 2012-11-20 | 2023-09-05 | Lockheed Martin Corporation | Heat pipe with axial wick |
US20170350657A1 (en) * | 2016-06-02 | 2017-12-07 | Tai-Sol Electronics Co., Ltd. | Heat spreader with a liquid-vapor separation structure |
CN111912274A (en) * | 2019-05-10 | 2020-11-10 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
US10999952B1 (en) * | 2020-01-02 | 2021-05-04 | Taiwan Microloops Corp. | Vapor chamber and manufacturing method thereof |
US20220065551A1 (en) * | 2020-08-27 | 2022-03-03 | Shinko Electric Industries Co., Ltd. | Loop heat pipe |
US11802740B2 (en) * | 2020-08-27 | 2023-10-31 | Shinko Electric Industries Co., Ltd. | Loop heat pipe with reinforcing member |
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Legal Events
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AS | Assignment |
Owner name: CELSIA TECHNOLOGIES TAIWAN, INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEYER IV, GEORGE ANTHONY;SUN, CHIEN-HUNG;CHEN, CHIEH-PING;REEL/FRAME:022455/0279 Effective date: 20090204 |
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