TWM524501U - Heat dissipation device with reinforcement support structure - Google Patents

Heat dissipation device with reinforcement support structure Download PDF

Info

Publication number
TWM524501U
TWM524501U TW105204477U TW105204477U TWM524501U TW M524501 U TWM524501 U TW M524501U TW 105204477 U TW105204477 U TW 105204477U TW 105204477 U TW105204477 U TW 105204477U TW M524501 U TWM524501 U TW M524501U
Authority
TW
Taiwan
Prior art keywords
reinforcing support
hot plate
support structure
dissipating device
heat
Prior art date
Application number
TW105204477U
Other languages
Chinese (zh)
Inventor
Sin-Wei He
Chih-Ren Huang
Chao-Hao Yeh
Original Assignee
Forcecon Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forcecon Technology Co Ltd filed Critical Forcecon Technology Co Ltd
Priority to TW105204477U priority Critical patent/TWM524501U/en
Publication of TWM524501U publication Critical patent/TWM524501U/en

Links

Description

具補強支撐結構之散熱裝置Heat sink with reinforcing support structure

本創作係涉及一種散熱裝置,特別是指一種具有補強支撐結構之散熱裝置創新結構型態揭示者。The present invention relates to a heat dissipating device, and more particularly to an innovative structural type revealer of a heat dissipating device having a reinforcing supporting structure.

按,隨著一些電子、電腦設備規模及運作效能的擴增,使得其運作時所產生的熱溫隨之大增,造成其對應的散熱裝置結構設置亦必須相對擴增規模以為因應。According to the expansion of the scale and operational efficiency of some electronic and computer equipment, the thermal temperature generated during operation is greatly increased, and the corresponding heat sink structure setting must also be compared with the scale of amplification.

承續上段所述,電子、電腦設備中通常會設置熱板型態的散熱裝置,以解決較大面積的散熱需求,然而,所述熱板的設置面積擴增至一定程度時,其組裝上往往會出現一些問題點。As mentioned in the previous paragraph, hot plate type heat dissipating devices are usually installed in electronic and computer equipment to solve the heat dissipation requirement of a large area. However, when the setting area of the hot plate is expanded to a certain extent, the assembly is performed. There are often some problems.

舉例而言,因熱板為中空殼體型態,按照一般機械設計的合理性,當其面積擴增時,高度理應相對增高以獲得較佳結構強度,但是,目前諸多電子、電腦設備為了達到薄形化的設計要求,往往會將熱板的高度限制在一薄形化規格範圍內(如3mm ),惟如此一來,勢必造成熱板結構強度相對減弱的情形,而且在此結構型態下,當熱板被鎖固在發熱源所屬的基板上時,熱板的底壁往往會因為被預設的底部支撐架反向逼迫而產生饋縮變形現象,此種現象可能導致原本已相當扁薄的熱板內部腔室高度因此大幅縮減甚至消失,從而嚴重影響原本預設應達到的散熱效能。For example, because the hot plate is a hollow shell type, according to the rationality of the general mechanical design, when the area is enlarged, the height should be relatively increased to obtain better structural strength, but at present, many electronic and computer equipment are To achieve the thin design requirements, the height of the hot plate is often limited to a thin gauge (such as 3mm), but this will inevitably lead to a relatively weak structural strength of the hot plate, and in this configuration In the state, when the hot plate is locked on the substrate to which the heat source belongs, the bottom wall of the hot plate tends to be deformed by the reverse pressing of the preset bottom support frame, which may result in the original The height of the inner chamber of the relatively thin hot plate is thus greatly reduced or even disappeared, thus seriously affecting the heat dissipation performance that should be achieved by the preset.

是以,針對上述習知散熱裝置結構所存在之問題點, 如何開發一種更具理想實用性之創新結構,實係相關業者須再努力研發突破之目標及方向。Therefore, in view of the problems existing in the above-mentioned conventional heat sink structure, how to develop an innovative structure with more ideal and practicality, the relevant industry players must further strive to develop the goal and direction of breakthrough.

本創作之主要目的,係在提供一種具補強支撐結構之散熱裝置,其所欲解決之技術問題,係針對如何研發出一種更具理想實用性之新式散熱裝置結構型態為目標加以創新突破。The main purpose of this creation is to provide a heat sink with a reinforcing support structure. The technical problem to be solved is to make an innovative breakthrough in how to develop a new type of heat sink structure that is more ideal and practical.

本創作解決問題之技術特點,主要在於所述散熱裝置係包括:一熱板,為板狀中空殼體型態,該熱板包括一蓋板及一受熱基板,該熱板內則設有一真空腔,該真空腔內容設有工作液;至少一鎖設穿孔,設於該熱板的至少一處且貫穿該蓋板及受熱基板;至少一補強支撐墊片,呈面狀貼靠狀態組設於該熱板的受熱基板至少一處,用以作為該熱板鎖設固定時之面狀剛性補強支撐結構。The technical feature of the present invention is that the heat dissipating device comprises: a hot plate, which is a plate-shaped hollow shell type, the hot plate comprises a cover plate and a heated substrate, and the hot plate is provided with a a vacuum chamber, the vacuum chamber is provided with a working fluid; at least one locking perforation is provided at at least one portion of the hot plate and penetrates the cover plate and the heated substrate; at least one reinforcing support spacer is in a planar contact state group The heat-receiving substrate is disposed at least at one of the heat-receiving plates to serve as a planar rigid reinforcing support structure when the hot plate is locked and fixed.

藉此創新獨特設計,使本創作對照先前技術而言,當散熱裝置鎖組定位於發熱源時,得以利用該補強支撐墊片作為反向抵迫作用力之剛性承受面,藉此而能夠有效防止熱板直接被抵迫而發生變形損壞及真空腔塌陷等問題,達到大幅提昇熱板組裝受力強度之實用進步性。With this innovative and unique design, this creation can effectively utilize the reinforcing support pad as a rigid bearing surface for the reverse abutting force when the heat sink lock group is positioned at the heat source according to the prior art, thereby being effective Preventing the hot plate from being directly resisted, causing deformation damage and vacuum chamber collapse, etc., and achieving practical improvement of the strength of the hot plate assembly.

請參閱第1、2、3、4、5圖所示,係本創作具補強支撐結構之散熱裝置的較佳實施例,惟此等實施例僅供說明之用,在專利申請上並不受此結構之限制。所述散熱裝置A係包括下述構成:一熱板10,為板狀中空殼體型態,該熱板10包括一蓋板11及一受熱基板12,該熱板10內則設有一真空腔13 (僅標註於第3、4圖),該真空腔13內容設有工作液14;至少一鎖設穿孔15,設於該熱板10的至少一處且貫穿該蓋板11及受熱基板12;至少一補強支撐墊片20,呈面狀貼靠狀態組設於該熱板10的受熱基板12至少一處,用以供作為該熱板10鎖設固定時之面狀剛性補強支撐結構。Please refer to Figures 1, 2, 3, 4, and 5 for a preferred embodiment of the heat sink having a reinforcing support structure. However, these embodiments are for illustrative purposes only and are not applicable to patent applications. The limitations of this structure. The heat dissipating device A comprises the following structure: a hot plate 10, which is a plate-shaped hollow shell type, the hot plate 10 includes a cover plate 11 and a heated substrate 12, and a vacuum is arranged in the hot plate 10. a cavity 13 (only shown in Figures 3 and 4), the vacuum chamber 13 is provided with a working fluid 14; at least one locking through hole 15 is provided at at least one of the hot plate 10 and penetrates the cover plate 11 and the heated substrate 12; at least one reinforcing support spacer 20 is disposed at least in one of the heat receiving substrates 12 of the hot plate 10 in a planar contact state for providing a planar rigid reinforcing support structure when the hot plate 10 is locked and fixed. .

藉由上述結構組成設計,本創作所揭散熱裝置A實際應用上如第1至5圖所示,係用以藉由螺鎖元件30鎖組於一發熱源40上,該發熱源40係可設於一基座50上,且該基座50於發熱源40的二側係設有定位支架60,以供支撐於散熱裝置A的熱板10所設受熱基板12底部,該定位支架60並設有供螺鎖元件30鎖組定位之鎖合部位61,其中該散熱裝置A欲鎖組於發熱源40之前須先將該補強支撐墊片20先組設貼靠於熱板10的受熱基板12底部,如此一來,當散熱裝置A如第5圖所示鎖組於發熱源40上並透過螺鎖元件30鎖組定位時,該基座50所設定位支架60的預定頂撐部位62之向上反向抵迫之作用力會由該補強支撐墊片20加以承受,藉此而能夠有效防止熱板10的受熱基板12直接被抵迫而變形損壞之問題發生。With the above-mentioned structural composition design, the heat sink device A disclosed in the present application is actually used as shown in FIGS. 1 to 5 to be locked on a heat source 40 by a screw lock member 30, and the heat source 40 can be The positioning base 60 is disposed on the two sides of the heat source 40 for supporting the bottom of the heat receiving substrate 12 of the heat sink 10 of the heat sink A. The positioning bracket 60 is disposed on the base 50. The locking portion 61 for positioning the locking component 30 is provided. Before the heat dissipating device A is to be locked to the heat generating source 40, the reinforcing supporting gasket 20 is first assembled to the heated substrate of the hot plate 10. At the bottom of the 12, when the heat sink A is locked on the heat source 40 as shown in FIG. 5 and positioned through the lock group of the screw lock member 30, the predetermined struts 62 of the base bracket 60 of the base 50 are set. The force of the upward reverse bias is received by the reinforcing support pad 20, whereby the problem that the heated substrate 12 of the hot plate 10 is directly resisted and deformed and damaged can be effectively prevented.

如第2、3圖所示,其中該補強支撐墊片20係可包括間隔成對配置的二補強支撐區塊21,該二補強支撐區塊21之間係藉由一連接架22相連,且該連接架22一處更朝一側凸伸形成一定位片23,該定位片23具一透孔24與該熱板10之鎖設穿孔15相對位。As shown in the second and third embodiments, the reinforcing support spacer 20 may include two reinforcing support blocks 21 arranged in pairs, and the two reinforcing support blocks 21 are connected by a connecting frame 22, and The connecting frame 22 protrudes toward one side to form a positioning piece 23, and the positioning piece 23 has a through hole 24 opposite to the locking through hole 15 of the hot plate 10.

如第6圖所示,其中該補強支撐墊片20B亦可設成長形延伸面狀型態,且該補強支撐墊片20B一處具一穿透孔25與該熱板10之鎖設穿孔15相對位。As shown in FIG. 6 , the reinforcing support pad 20B can also be provided with a long extended shape, and the reinforcing support pad 20B has a through hole 25 and a locking through hole 15 of the hot plate 10 . Relative position.

如第7圖所示,其中該補強支撐墊片20C亦可為複數個分別配置於該熱板10的受熱基板12間隔處,且該補強支撐墊片20C設為下述任一種輪廓形狀:圓形、三角形、多邊形。As shown in FIG. 7, the reinforcing support spacer 20C may be a plurality of spacers disposed on the heat receiving substrate 12 of the hot plate 10, and the reinforcing support spacer 20C is set to any of the following contour shapes: Shape, triangle, polygon.

如第2、4圖及第6、7圖所示,其中該熱板10於各補強支撐墊片20組設位置之間、各補強支撐墊片20的臨側位置任至少其中一者,更可設有真空腔延伸部16,藉以擴增該真空腔13的設置體積。此部份如第7圖所揭真空腔延伸部16,係為設在各補強支撐墊片20組設位置之間的實施型態,而第2、4圖及第6圖所揭真空腔延伸部16則為設在補強支撐墊片20臨側位置的實施型態。As shown in the second and fourth figures and the sixth and seventh figures, wherein the hot plate 10 is at least one of the positions of the reinforcing support spacers 20 and the lateral positions of the reinforcing support spacers 20, A vacuum chamber extension 16 may be provided to amplify the set volume of the vacuum chamber 13. The portion of the vacuum chamber extending portion 16 as shown in FIG. 7 is an embodiment disposed between the positions of the reinforcing support spacers 20, and the vacuum chambers disclosed in the second, fourth and sixth figures are extended. The portion 16 is an embodiment in which the reinforcing support pad 20 is disposed on the side of the support.

如第2、4圖所示,其中該熱板10之受熱基板12供該補強支撐墊片20組設的區域更可設有內凹面26,以供該補強支撐墊片20嵌入配合;藉此以使該補強支撐墊片20組設呈現內嵌狀態,以利於該受熱基板12與發熱源40之間的平整貼靠。As shown in the second and fourth embodiments, the region of the heat-receiving substrate 12 of the hot plate 10 for the reinforcing support spacer 20 is further provided with a concave surface 26 for the reinforcing support spacer 20 to be fitted; The reinforcing support spacers 20 are assembled to be in an embedded state to facilitate the flat contact between the heated substrate 12 and the heat source 40.

如第1至5圖所示,其中該熱板10之蓋板11更可組設定位有一鰭片散熱組70;藉此以輔助熱板10獲得更佳散熱效率。As shown in the first to fifth embodiments, the cover plate 11 of the hot plate 10 can be set to have a fin heat dissipation group 70; thereby, the auxiliary heat plate 10 can obtain better heat dissipation efficiency.

功效說明: 本創作所揭「具補強支撐結構之散熱裝置」主要藉由所述熱板、鎖設穿孔及補強支撐墊片等所構成之創新獨特結構型態與技術特徵,使本創作對照[先前技術]所提習知結構而言,得以利用該補強支撐墊片作為反向抵迫作用力之剛性承受面,藉此而能夠有效防止熱板直接被抵迫而發生變形損壞及真空腔塌陷等問題,從而達到大幅提昇熱板組裝受力強度與散熱裝置安裝品質之實用進步性。Efficacy Description: This work reveals that the "heat-dissipating device with reinforcing support structure" mainly uses the innovative unique structure and technical features of the hot plate, locking perforation and reinforcing support gasket to make this creation contrast [ In the prior art, the reinforcing support pad can be used as a rigid bearing surface for the reverse abutting force, thereby effectively preventing the hot plate from being directly resisted and deforming and causing the vacuum cavity to collapse. Such problems, in order to achieve a substantial increase in the strength of the hot plate assembly and the practical progress of the heat sink installation quality.

A‧‧‧散熱裝置
10‧‧‧熱板
11‧‧‧蓋板
12‧‧‧受熱基板
13‧‧‧真空腔
14‧‧‧工作液
15‧‧‧鎖設穿孔
16‧‧‧真空腔延伸部
20、20B、20C‧‧‧補強支撐墊片
21‧‧‧補強支撐區塊
22‧‧‧連接架
23‧‧‧定位片
24‧‧‧透孔
25‧‧‧穿透孔
26‧‧‧內凹面
30‧‧‧螺鎖元件
40‧‧‧發熱源
50‧‧‧基座
60‧‧‧定位支架
61‧‧‧鎖合部位
62‧‧‧頂撐部位
70‧‧‧鰭片散熱組
A‧‧‧ Heat sink 10‧‧‧Hot plate 11‧‧‧ Cover 12‧‧‧ Heated substrate 13‧‧‧ Vacuum chamber 14‧‧‧Working liquid 15‧‧‧ Locking perforation 16‧‧‧ Vacuum chamber extension Ministry 20, 20B, 20C‧‧‧ Reinforced support gasket 21‧‧‧ Reinforcement support block 22‧‧‧ Connection bracket 23‧‧‧ Positioning piece 24‧‧‧through hole 25‧‧‧through hole 26‧‧‧ Concave surface 30‧‧‧ Screw-locking element 40‧‧‧Fever source 50‧‧‧Base 60.‧‧ Positioning bracket 61‧‧‧Locking part 62‧‧‧Top support part 70‧‧‧Fin heat dissipation group

第1圖係本創作散熱裝置結構較佳實施例之組合狀態立體圖。 第2圖係本創作散熱裝置之仰視角度分解立體圖。 第3圖係本創作散熱裝置之俯視角度分解立體圖。 第4圖係本創作散熱裝置與發熱源之間呈分解狀態之剖視圖。 第5圖係本創作散熱裝置與發熱源之間呈組合狀態之剖視圖。 第6圖係本創作之補強支撐墊片型態另一實施例圖。 第7圖係本創作之補強支撐墊片型態又一實施例圖。Fig. 1 is a perspective view showing a combined state of a preferred embodiment of the heat sink structure of the present invention. Fig. 2 is a perspective view of the bottom view of the heat sink of the present invention. Fig. 3 is a perspective exploded perspective view of the heat sink of the present invention. Fig. 4 is a cross-sectional view showing the decomposition state between the heat sink and the heat source of the present invention. Figure 5 is a cross-sectional view showing the combined state between the heat sink and the heat source. Fig. 6 is a view showing another embodiment of the reinforcing support spacer pattern of the present invention. Fig. 7 is a view showing still another embodiment of the reinforcing support spacer pattern of the present invention.

A‧‧‧散熱裝置 A‧‧‧heat sink

10‧‧‧熱板 10‧‧‧Hot board

11‧‧‧蓋板 11‧‧‧ Cover

12‧‧‧受熱基板 12‧‧‧heated substrate

20‧‧‧補強支撐墊片 20‧‧‧Reinforced support gasket

21‧‧‧補強支撐區塊 21‧‧‧ reinforcing support block

22‧‧‧連接架 22‧‧‧Connecting frame

23‧‧‧定位片 23‧‧‧ Positioning film

24‧‧‧透孔 24‧‧‧through hole

30‧‧‧螺鎖元件 30‧‧‧Spiral lock components

40‧‧‧發熱源 40‧‧‧heat source

50‧‧‧基座 50‧‧‧ pedestal

60‧‧‧定位支架 60‧‧‧ positioning bracket

61‧‧‧鎖合部位 61‧‧‧Locking parts

62‧‧‧頂撐部位 62‧‧‧Top support

70‧‧‧鰭片散熱組 70‧‧‧Fin Heat Dissipation Group

Claims (7)

一種具補強支撐結構之散熱裝置,所述散熱裝置包括: 一熱板,為板狀中空殼體型態,該熱板包括一蓋板以及一受熱基板,該熱板內則設有一真空腔,該真空腔內容設有工作液; 至少一鎖設穿孔,設於該熱板的至少一處且貫穿該蓋板及受熱基板; 至少一補強支撐墊片,呈面狀貼靠狀態組設於該熱板的受熱基板至少一處,用以供作為該熱板鎖設固定時之面狀剛性補強支撐結構。A heat dissipating device having a reinforcing support structure, the heat dissipating device comprising: a hot plate, a plate-shaped hollow shell type, the hot plate comprising a cover plate and a heated substrate, wherein the heat plate is provided with a vacuum chamber The vacuum chamber is provided with a working fluid; at least one locking perforation is provided at at least one portion of the hot plate and penetrates the cover plate and the heated substrate; at least one reinforcing support spacer is disposed in a planar contact state The heat receiving plate of the hot plate has at least one place for providing a planar rigid reinforcing support structure when the hot plate is locked and fixed. 如申請專利範圍第1項所述之具補強支撐結構之散熱裝置,其中該補強支撐墊片係包括間隔成對配置的二補強支撐區塊,該二補強支撐區塊之間係藉由一連接架相連,且該連接架一處更朝一側凸伸形成一定位片,該定位片具一透孔與該熱板之鎖設穿孔相對位。The heat dissipating device with a reinforcing support structure according to claim 1, wherein the reinforcing support pad comprises two reinforcing support blocks arranged in pairs, and the two reinforcing support blocks are connected by a connection The brackets are connected, and the connecting bracket protrudes toward one side to form a positioning piece, and the positioning piece has a through hole opposite to the locking perforation of the hot plate. 如申請專利範圍第1項所述之具補強支撐結構之散熱裝置,其中該 補強支撐墊片係設成長形延伸面狀型態,且該補強支撐墊片一處具一穿透孔與該熱板之鎖設穿孔相對位。The heat dissipating device with a reinforcing support structure according to the first aspect of the invention, wherein the reinforcing support pad is formed with a long extending shape, and the reinforcing support pad has a through hole and the heat. The lock of the plate is opposite to the position of the perforation. 如申請專利範圍第1項所述之具補強支撐結構之散熱裝置,其中該 補強支撐墊片係為複數個分別配置於該熱板的受熱基板間隔處,且該補強支撐墊片設為下述任一種輪廓形狀:圓形、三角形、多邊形。The heat dissipating device with a reinforcing support structure according to claim 1, wherein the reinforcing support spacer is disposed at a plurality of spaced apart intervals of the heated substrate, and the reinforcing support spacer is set as follows Any of the contour shapes: circle, triangle, polygon. 如申請專利範圍第2、3或4項所述之具補強支撐結構之散熱裝置,其中該熱板於各補強支撐墊片組設位置之間、各補強支撐墊片的臨側位置任至少其中一者,係更設有真空腔延伸部,藉以擴增該真空腔的設置體積。The heat dissipating device with a reinforcing support structure as described in claim 2, 3 or 4, wherein the hot plate is at least between the positions of the reinforcing support pads and the lateral positions of the reinforcing support pads. In one case, a vacuum chamber extension is further provided to amplify the set volume of the vacuum chamber. 如申請專利範圍第2、3或4項所述之具補強支撐結構之散熱裝置,其中該熱板之受熱基板供該補強支撐墊片組設的區域係更設有內凹面,以供該補強支撐墊片嵌入配合。The heat dissipating device with a reinforcing support structure as described in claim 2, 3 or 4, wherein the heated substrate of the hot plate is provided with a concave surface for the reinforcing support pad to provide reinforcement. The support spacers are fitted into the mating. 如申請專利範圍第1項所述之具補強支撐結構之散熱裝置,其中該 熱板之蓋板係更組設定位有一鰭片散熱組。The heat dissipating device with a reinforcing support structure according to claim 1, wherein the cover plate of the hot plate is set to have a fin heat dissipation group.
TW105204477U 2016-03-31 2016-03-31 Heat dissipation device with reinforcement support structure TWM524501U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW105204477U TWM524501U (en) 2016-03-31 2016-03-31 Heat dissipation device with reinforcement support structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105204477U TWM524501U (en) 2016-03-31 2016-03-31 Heat dissipation device with reinforcement support structure

Publications (1)

Publication Number Publication Date
TWM524501U true TWM524501U (en) 2016-06-21

Family

ID=56757870

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105204477U TWM524501U (en) 2016-03-31 2016-03-31 Heat dissipation device with reinforcement support structure

Country Status (1)

Country Link
TW (1) TWM524501U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106055054A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Novel heat dissipation device with reinforcing and supporting structure
CN106061209A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Heat dissipation device with reinforcing support structure
CN106061210A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Heat dissipation device with reinforcing support structure
CN106055053A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Novel heat dissipating device with reinforcing and supporting structure
TWI761698B (en) * 2019-08-20 2022-04-21 奇鋐科技股份有限公司 Heat transfer assembly
TWI771177B (en) * 2019-08-20 2022-07-11 奇鋐科技股份有限公司 Heat transfer assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106055054A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Novel heat dissipation device with reinforcing and supporting structure
CN106061209A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Heat dissipation device with reinforcing support structure
CN106061210A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Heat dissipation device with reinforcing support structure
CN106055053A (en) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 Novel heat dissipating device with reinforcing and supporting structure
TWI761698B (en) * 2019-08-20 2022-04-21 奇鋐科技股份有限公司 Heat transfer assembly
TWI771177B (en) * 2019-08-20 2022-07-11 奇鋐科技股份有限公司 Heat transfer assembly

Similar Documents

Publication Publication Date Title
TWM524501U (en) Heat dissipation device with reinforcement support structure
US9664458B2 (en) Supporting structure for vapor chamber
TW201725354A (en) Thin vapor chamber structure
US10859323B2 (en) Vapor chamber and manufacturing method for the same
TWM605285U (en) Vapor chamber structure
WO2021046827A1 (en) Heat-homogenizing plate, heat sink and terminal
CN102215658B (en) Radiating device combination and electronic device using same
TWI541487B (en) Mean temperature plate support structure
US10112272B2 (en) Manufacturing method of vapor chamber
TW201728866A (en) Heat dissipating device and a method for increasing the heat conduction of the heat dissipating device
TWI607687B (en) Circuit board module having heat dissipation structure
TWM588235U (en) Reinforcement structure of heat conduction member
TWM464634U (en) Vapor chamber with supporting structure
TWI634303B (en) Vapor chamber
TWM586039U (en) Thermal insulation device and electronic device chassis assembly
TWI726424B (en) Heat transfer member reinforcement structure
TWI621823B (en) Temperature-uniforming plate that provides a improved rigidity and heat dissipation
TWI544205B (en) Fixing structure for heat dissipation element
TWI727430B (en) Heat transfer component reinforcement structure
TWI645151B (en) Flat heat pipe loop and heat dissipation module thereof
CN101453858B (en) Heat Radiation device
CN101193533B (en) Radiator combination
JP3194454U (en) Structure of the vapor chamber
US20120273168A1 (en) Heat dissipation device with heat pipe
TWM588234U (en) Reinforcement structure of heat transfer element

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees