TWI621823B - Temperature-uniforming plate that provides a improved rigidity and heat dissipation - Google Patents

Abstract

The invention provides a temperature equalizing plate which has the effects of rigidity and heat conduction gain, and mainly comprises: a substrate, wherein a bottom surface of the heat conducting surface of the bottom is provided for the heat-extracting surface of the heat source; a cover plate is spaced apart from the substrate The peripheral side of the cover plate is combined with the peripheral side of the substrate by a joint edge; a vacuum chamber is formed by an inner closed space formed by a frame surrounding, and has a capillary structure, a support body and a working fluid therein; and a support heat conduction seat, Provided in the vacuum chamber and abutting the substrate and the cover plate, including a main seat portion and a plurality of extension arms, and the position of the main seat portion corresponds to the heat-extracting surface of the heat source, and the lateral convex elongation of the extension arm The degree exceeds the range of the heat-extracting surface of the heat source, and each of the extending arms and the substrate and the cover plate are provided with locking holes for locking.

Description

Equalization plate with both rigid and thermal gain effects

The invention relates to a temperature equalizing plate; in particular to a novel structural type revealer of a uniform temperature plate which has both a rigidity and a heat conduction gain effect.

The conventional uniform temperature plate structure design generally includes a substrate and a cover plate, and the substrate and the cover plate are fixedly coupled to the periphery to define an inner hollow chamber therebetween, the inner hollow chamber The capillary structure and the working fluid are provided therein; further, in order to increase the support rigidity between the substrate and the cover plate, a type in which a spacer support member is added to the inner hollow chamber is further provided.

However, looking at the average temperature plate structure, it is found that there are still some problems and shortcomings in the practical application experience. For example, the heat source is relative to the heat source (such as CPU) for heat dissipation. The setting area is usually larger than the area of the heat source, so as to achieve better heat dissipation effect. However, the relative positioning problem between the temperature equalizing plate and the heat source is relatively caused by the industry. Although the industry can lock the temperature equalizing plate alone. It is fixed on the shell structure of the electronic device, but this type of structure may cause a problem that the heat source and the temperature equalizing plate have poor abutment and affect the heat conduction benefit.

Another manufacturer adopts a perforation method in the uniform temperature plate for the locking bolt to be locked and set on the screw hole provided in the circuit board of the electronic device. However, the conventional structure is locked after the heat source is locked. The inner hollow chamber corresponding to the area where the heat source contacts the contact is often easy because the support strength is insufficient, and the local heat conduction surface deformation and feeding phenomenon cannot be withstood due to the strong pressure, thereby causing a problem that the heat conduction efficiency is greatly attenuated, and the problem is The thinned uniform temperature plate structure is particularly obvious. Therefore, how to achieve both structural support strength and heat transfer efficiency is an important technical issue worthy of continuous consideration by the relevant industry.

Therefore, in view of the problems existing in the above-mentioned conventional uniform temperature plate structure, how to develop an innovative structure that can be more ideal and practical, and it is necessary for the relevant industry to think again about the goals and directions of breakthrough; in view of this, the invention People have been engaged in the manufacturing development and design experience of related products for many years. After detailed design and careful evaluation of the above objectives, the invention has finally become practical.

The main object of the present invention is to provide a temperature equalizing plate which has both rigidity and thermal conductivity gain effects, and the technical problem to be solved is to develop a new type of uniform temperature plate structure type which is more ideal and practical. The goal is to think about innovative breakthroughs.

The technical feature of the present invention is mainly that the temperature equalizing plate comprises: a substrate having a heat conducting surface at a bottom thereof, wherein the heat emitting surface is partially used for a heat-extracting surface of a heat source; The cover plate and the substrate are arranged in a spaced relationship with each other, and the peripheral side of the cover plate and the peripheral side of the substrate are combined with each other to form a closed state; a vacuum chamber is formed by a joint frame between the substrate and the cover plate. The inner closed space is formed, and at least one side of the substrate is provided with a capillary structure, a support body and a working fluid, and the support body is supported between the substrate and the cover plate; and a supporting heat conducting seat is rigid heat conduction. The material is configured to be positioned in the vacuum chamber and abuts between the substrate and the cover plate, and the supporting heat conducting seat comprises a main seat portion and a plurality of extension arms laterally protruding from the side of the autonomous seat; and the position of the main seat portion It must correspond to the heat-extracting surface of the heat source, and the lateral convex elongation of the extension arm must exceed the heat-extracting surface of the heat source; and the extension arms supporting the heat-conducting seat and the substrate and the cover plate are provided with relative positions. Use perforation.

The main effect and advantage of the present invention is that the portion of the temperature equalizing plate corresponding to the heat generating source can pass through the arrangement of the supporting heat conducting seat, thereby achieving the advantages and practical advancement of both the better structural support strength and the heat transfer benefit.

Another main object of the present invention is to provide an inner concave edge between the adjacent two extending arms by the side of the main seat portion of the supporting heat conducting seat, the inner concave edge being inner with respect to the side of the heat source Another technical feature of the reduced-face shape is to further amplify the heat dissipation area of the side of the support heat-conducting seat to achieve better heat dissipation.

Please refer to the first, second, third, fourth, and fifth embodiments, which are preferred embodiments of the present invention, which have both a rigid and a thermally conductive gain effect, but these embodiments are for illustrative purposes only, and are in the patent application. It is not restricted by this structure.

The temperature equalizing plate A comprises the following structure: a substrate 10 having a heat conducting surface 11 at the bottom thereof, and a partial area of the heat conducting surface 11 is used for heat extraction of a heat source 05 (such as a CPU). a cover plate 20 is disposed in a spaced relationship with the substrate 10, and the peripheral side of the cover plate 20 and the peripheral side of the substrate 10 are combined with each other by a joint edge 21 to form a closed state; a vacuum chamber 30, The inner closed space formed by the joint edge 21 between the substrate 10 and the cover 20 is formed, and at least one side of the vacuum chamber 30 is disposed on one side of the substrate 10 The capillary structure 31, the support body 32 and the working fluid (not shown in the drawing), wherein the support body 32 is supported between the substrate 10 and the cover plate 20; a supporting heat conducting seat 40 is a rigid heat conductive material (such as a copper, iron, aluminum, etc., disposed in the vacuum chamber 30 and abutting between the substrate 10 and the cover plate 20, the supporting heat conducting seat 40 includes a main seat portion 41 and the main seat portion 41 a plurality of extension arms 42 projecting laterally; and wherein the position of the main seat portion 41 corresponds to the thermal conductivity of the heat source 05 In the range of the surface 06, the lateral protrusions of the extension arms 42 must extend beyond the heat-extracting surface 06 of the heat source 05; in addition, the extension arms 42 of the support heat-conducting seat 40 and the substrate 10 and the cover The plate 20 is provided with locking holes 425, 105, 205 for the opposite positions.

As shown in the first and third figures, in this example, the side of the main seat portion 41 of the supporting heat conducting seat 40 is further provided with an inner concave edge 43 between the adjacent two extending arms 42. The inner concave edge 43 is provided. The side of the heat-generating source 05 is an indented surface shape; in this example, the shape of the inner concave edge 43 can be mainly used to further expand the heat dissipation area of the side of the supporting heat-conducting seat 40. To achieve better heat dissipation.

As shown in Fig. 1, in this example, the side edges of the main seat portion 41 of the support heat transfer seat 40 are provided with four extension arms 42 which are individually projected in four directions.

As shown in FIG. 1 , in this example, the capillary structure 31 disposed in the vacuum chamber 30 is in the form of a metal mesh body, and the capillary structure 31 further has a relief venting portion corresponding to the contour shape of the heat conducting seat 40 . 311.

As shown in FIG. 1 to FIG. 5, in this example, the heat generating source 05 (such as a CPU) is mounted on a circuit board 50. The top surface of the cover 20 is provided with a pressing frame 60, and the pressing frame 60 is provided. a plurality of locking legs 61 having a locking hole 62, and locking holes 62 of the locking legs 61 and locking holes for the extending arms 42 of the supporting heat conducting seat 40, the substrate 10 and the cover plate 20 425, 105, 205 are opposite positions, and a screw hole 51 is disposed at a position opposite to the circuit board 50, so that the lock hole 62 is sequentially worn by the bolt 70, and the locking holes 425, 105, 205 are repeatedly screwed to The screw hole 51 allows the combined state of the heat source 05 and the temperature equalization plate A to be positioned.

Wherein, the temperature equalizing plate A is in a thin gauge form, that is, the outer height of the substrate 10 to the cover plate 20 is less than 2 mm.

With the above-mentioned structural composition and technical features, the uniform temperature plate A of the present invention is mainly provided with the structural form of the supporting heat conducting seat 40 between the substrate 10 and the cover plate 20 in the vacuum chamber 30. Through the supporting heat conducting seat 40, the main seat portion 41 and the plurality of extending arms 42 are included, and the position of the main seat portion 41 corresponds to the heat-extracting surface 06 of the heat source 05, and the lateral protruding elongation of the extending arm 42 exceeds the heat-extracting surface. In the range of 06, the extension arms 42 of the heat-conducting support 40 and the substrate 10 and the cover 20 are provided with locking holes 425, 105, and 205, and the bolts 70 are sequentially passed through the top of the cover plate 20. The locking hole 62 of the 60, the locking holes 425, 105, 205 are repeatedly screwed to the screw hole 51 provided in the circuit board 50, so that the combined state of the heat source 05 and the temperature equalizing plate A is obtained; The arrangement of the supporting heat conducting seat 40 can form a rigid supporting structure at a position corresponding to the heat exporting surface 06 of the heat source 05 of the vacuum chamber 30, so that when the pressing frame 60 locks the temperature equalizing plate A against the heat source 05 The substrate 10 and the cover 20 of the temperature equalization plate A can be effectively prevented from being deformed and contracted due to pressure. In addition, it is ensured that the heat-conducting surface 11 of the substrate 10 and the heat-extracting surface 05 of the heat-generating source 05 are in close contact with each other to ensure the best heat conduction benefit; in addition, since the supporting heat-conducting seat 40 itself is a heat-conducting material, in addition to the foregoing The support function is more endothermic, and the absorbed heat diffusion is conducted into the vacuum chamber 30, thereby achieving the effect of rapid heat dissipation.

Advantages of the Invention: The "average temperature plate having both rigidity and thermal conductivity gain effect" disclosed by the present invention mainly comprises the substrate, the cover plate, the vacuum chamber, and the vacuum chamber and abuts against the substrate and the cover plate. a supporting heat conducting seat, wherein the supporting heat conducting seat comprises a main seat portion and a plurality of extending arms, and a position of the main seat portion corresponds to a heat-extracting surface of the heat source, and a lateral convex elongation of the extending arm is required to exceed Innovative unique structural types and technical features, such as the range of heat-extracting surfaces, enable the present invention to allow the portion of the temperature-averaging plate corresponding to the heat-generating source to pass through the supporting heat-conducting seat in comparison with the conventional structure proposed in [Prior Art] The setting is to achieve the advantages and practical advancement of taking into consideration the better structural support strength and heat transfer efficiency.

05‧‧‧heat source

06‧‧‧Hot export surface

A‧‧‧Wall plate

10‧‧‧Substrate

105‧‧‧Perforation for locking

11‧‧‧heat conduction surface

20‧‧‧ Cover

205‧‧‧Perforation for locking

21‧‧‧ combined side

30‧‧‧vacuum chamber

31‧‧‧Muscle tissue

311‧‧‧ Avoiding the Department

32‧‧‧Support

40‧‧‧Supporting heat conduction seat

41‧‧‧Main seat

42‧‧‧Extension arm

425‧‧‧Perforation for locking

43‧‧‧ concave edge

50‧‧‧ circuit substrate

51‧‧‧ screw holes

60‧‧‧Repression frame

61‧‧‧Lock feet

62‧‧‧Keyhole

70‧‧‧ bolt

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a preferred embodiment of the present invention. Figure 2 is a perspective view of a combination of preferred embodiments of the present invention. Figure 3 is a partial plan view of a preferred embodiment of the present invention. Figure 4 is an exploded cross-sectional view of a preferred embodiment of the present invention. Figure 5 is a cross-sectional view of a combination of preferred embodiments of the present invention.

Claims (6)

A temperature equalizing plate having both a rigid and a heat conduction gain effect, the temperature equalizing plate comprising: a substrate having a heat conducting surface at a bottom thereof, wherein a partial area of the heat conducting surface is used for a heat extraction surface of a heat source a cover plate is disposed in a spaced relationship with the substrate, and the peripheral side of the cover plate and the peripheral side of the substrate are combined with each other to form a closed state by a bonding edge; a vacuum chamber is formed by the substrate and the cover Forming an inner closed space formed by a joint frame between the two plates, and the vacuum chamber is provided with at least one capillary structure, a support body and a working fluid on one side of the substrate, wherein the support body Between the substrate and the cover plate; a supporting heat conducting seat, formed of a rigid heat conductive material, disposed in the vacuum chamber and abutting between the substrate and the cover plate, the supporting heat conducting seat comprises a a main seat portion and a plurality of extending arms projecting laterally from a side of the main seat portion; and wherein the position of the main seat portion is corresponding to a range of heat-extracting surfaces of the heat source, and sides of the extending arms Toward the convexity, it must exceed the hair Heat removal surface of the source range; and wherein the thermally conductive base supporting each of the extension arm and the substrate and the cover plate is provided with perforations opposite locking position. The temperature equalizing plate having the rigidity and the heat conduction gain effect as described in claim 1, wherein the side of the main seat portion of the supporting heat conducting seat is further provided with a concave edge between the adjacent two extending arms. The inner concave edge has an indented surface shape with respect to a side of the heat generating source. A temperature equalizing plate having a rigid and thermally conductive gain effect as described in claim 2, wherein the side of the main seat portion of the supporting heat conducting seat is provided with four extending arms that are equally convex in four directions. . The temperature equalizing plate having the rigidity and the heat conduction gain effect as described in claim 3, wherein the capillary structure disposed in the vacuum chamber is a metal mesh type, and the capillary structure is more suitable for supporting the heat conducting seat. The contour shape has a venting passage. A temperature equalizing plate having a rigid and thermally conductive gain effect as described in claim 4, wherein the heat generating source is mounted on a circuit board, and a top surface of the cover is provided with a pressing frame, and the pressing frame is provided a plurality of locking holes with locking holes, and the locking holes of the locking legs are opposite to the extending arms of the supporting heat conducting seat, the locking holes for the substrate and the cover plate, and the circuit substrate is opposite A screw hole is arranged at the position to sequentially insert the locking hole by the bolt, and the locking hole is screwed to the screw hole, so that the combined state of the heat source and the temperature equalizing plate is obtained. The temperature equalizing plate having the rigidity and the heat conduction gain effect as described in the first aspect of the patent application, wherein the temperature equalizing plate is in a thin gauge form, that is, the outer height of the substrate to the cover is less than 2mm.