TWI761698B - Heat transfer assembly - Google Patents

Abstract

A heat transfer assembly includes a first plate, a second plate, and an engaging unit. The first plate has a first side and a second side, and the second plate has a third side and a fourth side. The third side is attached to the first side, which defines a sealed chamber between the first and second plates. The fourth side has an accommodating portion that is in thermal contact with at least a heat source. The engaging unit is disposed adjacent to the accommodating portion, and engaged with the heat source, thereby allowing the heat transfer assembly to be in direct contact with the heat source. Therefore, a lower thermal resistance can be achieved by the direct contact, and no penetration to the heat transfer assembly prevents the assembly from vacuum leaks.

Description

Combined structure of heat sink

A heat-dissipating device combining structure, especially a heat-dissipating device combining structure that can provide a heat-dissipating device that can be tightly combined with a heat-generating source without penetrating a heat-dissipating device with an airtight chamber.

With the improvement of the performance of current electronic equipment, the electronic components that process signals and operations generate relatively higher heat than the previous electronic components. The most commonly used general heat dissipation components include heat pipes, radiators, vapor chambers and other components. , and further increase the heat dissipation efficiency by directly contacting the electronic components that will generate heat, preventing the electronic components from being overheated and burning.

Vapor chamber is a large-scale surface-to-surface heat transfer application, which is different from the point-to-point heat transfer method of heat pipes, and is suitable for use in narrow spaces.

Conventionally, the vapor chamber is used in combination with a substrate, and the heat of the heating elements on the substrate is conducted through the vapor chamber. The conventional technique is mainly that the vapor chamber avoids the part of the chamber, that is, the vapor chamber is closed. The outer four couplings are each formed with a through hole and a copper column with an internal screw thread is penetrated. At least one hole is opened on the base plate relative to the position where the copper column is arranged on the temperature equalizing plate, and then a screw locking element is used to screw at the same time. The copper posts and holes are pierced to fix the temperature equalizing plate on the substrate. However, in this fixing method, since the copper posts are arranged at the four couplings of the temperature equalizing plate, the distance from the heating element is relatively far. After fixing, it cannot be closely attached to the heating element, resulting in thermal resistance phenomenon; in order to improve the aforementioned problem of inability to closely attach, the industry will directly set the copper column in the vicinity of the position where the temperature equalizing plate and the heating element are attached. Therefore, the copper pillars directly penetrate the part of the vapor chamber with the chamber. Although the tightness during assembly can be increased to prevent the occurrence of thermal resistance, the chamber of the vapor chamber loses airtightness after being damaged by the penetration of the copper pillars. , the interior of the chamber no longer has a vacuum state, and the If the chamber is damaged, the flow path of the working fluid in the chamber may be obstructed, resulting in reduced heat transfer efficiency, and even serious leakage may occur, thereby making the vapor chamber lose its heat transfer effect.

Furthermore, US Pat. Nos. 7,066,240, 6,302,192 and 7,100,680 disclose a vapor chamber structure. Referring to Figs. 9 and 10, a body 51 has a first flat plate 511 and a second flat plate 512 separated from each other, and is located at the periphery of the body. An outer protrusion 513 is provided to connect the outer protrusion 513 to form a closed chamber 514 ; a groove 5111 is located on the first plate 511 away from the outer protrusion 513 and is in contact with the second plate 512 Connection; an opening 52 penetrates the groove 5111 of the first plate 511 and the second plate 512, and the groove 5111 includes an annular outer surface 5112 and a corresponding annular edge surface on the second plate 512 5121 are connected, so that the opening 52 is independently isolated from the body 51; a spacer 53 extends and contacts between the first flat plate 511 and the second flat plate 512; a capillary fiber structure 54 is provided in the closed chamber 514, although this A structure has a supporting structure and an airtight effect due to the design of the groove 5111, but due to the setting of the groove, the chamber space for the vapor-liquid circulation inside the temperature chamber is greatly reduced. The setting makes the contact area between the vapor chamber and the heat source smaller, so not only the heat transfer efficiency is reduced, but the contact area is also greatly reduced.

Therefore, the conventional one has the following disadvantages: 1. It is easy to generate thermal resistance phenomenon; 2. The heat dissipation area is reduced; 3. The heat transfer efficiency is reduced.

Therefore, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a heat-dissipating device combining structure that can provide a heat-dissipating device and a heat-generating source tightly without penetrating through an air-tight chamber.

In order to achieve the above-mentioned purpose, the present invention provides a combination structure of a heat dissipation device, comprising: a first plate body, a second plate body, and a combination part; the first plate body has a first side and a second plate side; the second plate body has a third side and a fourth side, the third side and the first side are covered correspondingly, and the first and second plate bodies together define a In the closed chamber, the fourth side has a heat receiving part, the heat receiving part is in contact with at least one heat source for heat conduction, the combining part is correspondingly disposed adjacent to the heat receiving part, and one end is combined with the heat source.

Through the combination structure of the heat dissipation device of the present invention, the heat dissipation device can be tightly combined with the heat source without penetration, and the airtightness of the airtight chamber inside the heat dissipation device can be protected.

1: Combined structure of heat sink

11: The first board body

111: First side

112: Second side

12: Second board body

121: Third side

122: Fourth side

123: Heating Department

13: Combine parts

131: First binding element

132: Second binding element

133: Third binding element

134: Fourth binding element

136: Set Department

137: Extension

14: airtight chamber

2: heat source

21: Holes

3: Combination buckle

4: capillary structure

5: C-type buckle

Figure 1 is an exploded perspective view of the first embodiment of the combined structure of the heat dissipation device of the present invention; Figure 2 is a cross-sectional view of the combined structure of the heat dissipation device of the first embodiment of the present invention; Figure 3 is the combined structure of the heat dissipation device of the present invention Fig. 4 is a combined cross-sectional view of the second embodiment of the present invention; Fig. 4 is a combined cross-sectional view of the third embodiment of the heat sink combination structure of the present invention; Fig. 5 is an exploded perspective view of the fourth embodiment of the heat sink combination structure of the present invention; Fig. 6 Fig. 7 is an exploded perspective view of the sixth embodiment of the heat dissipation device coupling structure of the present invention; Fig. 8 is the sixth embodiment of the heat dissipation device coupling structure of the present invention. An exploded perspective view of an embodiment; FIG. 9 is a schematic diagram of a conventional heat dissipation device; and FIG. 10 is a schematic cross-sectional view of a conventional heat dissipation device.

Please refer to Figures 1 and 2, which are three-dimensional exploded combined cross-sectional views of the first embodiment of the heat dissipation device combination structure of the present invention. As shown in the figures, the heat dissipation device combination structure 1 of the present invention includes: a first plate body 11, a The second plate body 12 and a combination part 13; the first plate body 11 has a first side 111 and a second side 112, the first and second sides 111 and 112 are respectively provided with the first plate body 11 upper and lower sides.

The second board 12 has a third side 121 and a fourth side 122 , the third side 121 is covered with the first side 111 correspondingly, and the first and second boards 11 and 12 are jointly defined In a closed chamber 14 , the fourth side 122 has a heat receiving portion 123 , and the heat receiving portion 123 is in contact with at least one heat source 2 for heat conduction.

The coupling member 13 is disposed adjacent to the heat receiving portion 123, and one end is coupled with the heat source 2. The coupling member 13 in this embodiment has a first coupling element 131, a second coupling element 132, and a The third coupling element 133 and a fourth coupling element 134, the coupling part 13 is selected to be integrally extended from the fourth side 122 of the second board 12, or through integral injection or welding, or through glue or devil Felts are interconnected in any way.

The first, second, third, and fourth combination elements 131 , 132 , 133 , 134 are disposed adjacent to the heat source 2 correspondingly, and one end of the first, second, third, and fourth combination elements 131 , 132 , 133 , and 134 are mutually hooked and combined with the heat source 2 .

The first and second plates 11 and 12 are made of copper, aluminum, stainless steel or titanium. The first and second plates 11 and 12 can be made of the same material or can be mixed together.

The first side 111 of the first plate body 11 is provided with a hydrophilic coating layer 141 corresponding to the portion of the closed chamber 14 , and through the hydrophilic coating layer 141 , the vapor-liquid circulation efficiency of the working liquid in the closed chamber 14 is increased.

Please refer to FIG. 3 , which is a combined cross-sectional view of the second embodiment of the heat dissipation device combination structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here, but this embodiment The difference between the first embodiment and the first embodiment is that the third side 121 in the closed chamber 14 has a capillary structure 4, and the capillary structure 4 is a mesh body or a fibrous body or a structure body with porous properties. Either, when the capillary structure 4 is a porous structure, it can be formed by electrochemical deposition or electroforming or 3D printing or printing in a partial or laminated manner.

When the porous structure is formed by electrochemical deposition, its material is copper, nickel, aluminum or any metal with good thermal conductivity.

If the mesh body is selected as the capillary structure, the material of the mesh body is any one of copper, aluminum, stainless steel, or titanium, and of course, it can also be set by mixing and matching layers of materials.

Please refer to FIG. 4 , which is a combined cross-sectional view of the third embodiment of the heat dissipation device combination structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the second embodiment, so it will not be repeated here, but this embodiment The difference between the second embodiment and the second embodiment is that the first side 111 of the first plate body 11 faces the second plate body 12 The third side 121 extends a plurality of protrusions 123, the capillary structure 4 is formed on the surface of the third side 121, the protrusions 123 abut one side of the capillary structure 4, and the opposite side of the protrusions 123 is Concave shape.

Please refer to FIG. 5, which is a three-dimensional exploded sectional view of the fourth embodiment of the combined structure of the heat dissipation device of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that in this embodiment, a combined fastener 3 is provided on the peripheral side of the heating source, the combined fastener 3 is a dovetail seat structure, and the coupling part 13 is a dovetail groove, and The combined fastener 3 is correspondingly fitted with the aforementioned combining member 13 .

Please refer to FIG. 6 , which is a cross-sectional view of the fifth embodiment of the combined structure of the heat sink according to the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. This is the embodiment. The difference between the first embodiment and the first embodiment is that one end of the free end of the coupling members 13 corresponds to the plurality of holes 21 provided on the peripheral side of the heat source 2, and the coupling members 13 are provided with the holes at one end of the free end. 21. One end of the combination member 13 passing through the hole 21 is limited and fixed by a C-shaped buckle 5.

Please refer to FIGS. 7 and 8, which are exploded perspective views of the sixth embodiment of the combined structure of the heat sink according to the present invention. As shown in the figures, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the coupling member 13 has a sleeve portion 136 that is sleeved on the outside of the first and second plate bodies 11 and 12 , and one side of the coupling member 13 has at least one extension end 137 . , at least one hole 21 is provided on the peripheral side of the heat source 2 , and the extending ends 137 are corresponding to the above-mentioned holes 21 to be inserted and assembled.

The main purpose of the present invention is to provide a heat sink with a vacuum airtight chamber through the corresponding fitting of the combination parts 13 and the combination fastener 3, which can be fixed with the heat source without penetration, so as to maintain the working fluid inside the heat sink. The normal operation of the vapor-liquid circulation and the improvement of the internal vapor-liquid circulation efficiency through the combination of the hydrophilic coating and the capillary structure.

1: Combined structure of heat sink

11: The first board body

111: First side

112: Second side

12: Second board body

121: Third side

122: Fourth side

13: Combine parts

14: airtight chamber

141: Hydrophilic coating

123: Heating Department

124: Receiving Department

2: heat source

Claims (10)

A combined structure of a heat dissipation device, comprising: a first plate body having a first side and a second side; a second plate body having a third side and a fourth side, the third side being the same as the aforementioned The first side is covered correspondingly, and the first and second plate bodies together define a closed chamber, the fourth side has a heat receiving part, and the heat receiving part is in contact with at least one heat source for heat conduction; a combination part, with The heat receiving part is adjacent, and one end is combined with the heat source, and the combination part and the second plate are connected and fixed to each other by any method of integral injection, welding, gluing, devil felt or integral molding. The heat sink combination structure according to claim 1, wherein the first side has a hydrophilic coating. The heat dissipation device combination structure according to claim 1, wherein a capillary structure is formed on the third side surface opposite to the airtight chamber. The heat dissipation device combination structure according to claim 3, wherein the capillary structure is any one of a mesh body, a fibrous body, or a structure body with porous properties. The heat dissipation device combination structure according to claim 3, wherein the capillary structure is formed by electrochemical deposition or electroforming or 3D printing or printing. The heat sink combination structure according to claim 5, wherein the material of the electrochemical deposition is copper, nickel, aluminum, or any metal with good thermal conductivity. The heat dissipation device combination structure according to claim 4, wherein the material of the mesh body is any one of copper, aluminum, stainless steel, or titanium. The heat dissipation device combination structure according to claim 1, wherein the first and second plate systems are made of copper, aluminum, stainless steel, or titanium. The heat sink combination structure according to claim 3, wherein the first side surface A plurality of convex bodies are extended to the third side surface, and the free ends of the convex parts abut against the capillary structure. The heat dissipation device combining structure of claim 1, wherein the combining component has a first combining element, a second combining element, a third combining element, and a fourth combining element, the first and second combining elements , 3 and 4 combining elements are hooked together with the heating source.

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