TW202110312A - Heat transfer assembly - Google Patents

Abstract

A heat transfer assembly includes a first plate, a second plate, and an engaging unit. The first plate has a first side and a second side, and the second plate has a third side and a fourth side. The third side is attached to the first side, which defines a sealed chamber between the first and second plates. The fourth side has an accommodating portion that is in thermal contact with at least a heat source. The engaging unit is disposed adjacent to the accommodating portion, and engaged with the heat source, thereby allowing the heat transfer assembly to be in direct contact with the heat source. Therefore, a lower thermal resistance can be achieved by the direct contact, and no penetration to the heat transfer assembly prevents the assembly from vacuum leaks.

Description

Combination structure of heat dissipation device

A combination structure of a heat dissipation device, especially a heat dissipation device combination structure that does not need to penetrate through a heat dissipation device having an airtight chamber and can provide a heat dissipation device that can be closely combined with a heat source.

With the improvement of the performance of current electronic equipment, the electronic components used for processing signals and calculations also generate higher heat than the previous electronic components. The most commonly used general heat dissipation components include heat pipes, radiators, uniform temperature plates and other components. , And further increase the heat dissipation performance by directly contacting the electronic components that can generate heat to prevent the electronic components from being burned due to excessive temperature. The uniform temperature plate is a large-scale surface-to-surface heat conduction application, which is different from the point-to-point heat conduction method of the heat pipe, and is suitable for use in a narrow space. The prior art is to use a uniform temperature plate in combination with a substrate and conduct the heat of the heating element on the substrate through the uniform temperature plate. The prior art is mainly in the position where the uniform temperature plate avoids the cavity, that is, the uniform temperature plate is closed The four outer couplings are each formed with a through hole and a copper column with an inner thread is penetrated. At least one hole is opened in the position where the copper column is arranged on the substrate relative to the temperature equalizing plate, and then a screw lock element is used to lock simultaneously The copper pillars and holes are inserted to fix the temperature equalizing plate on the substrate, but this fixing method is because the copper pillars are arranged at the four coupling positions of the equalizing plate, and the distance from the heating element is relatively long, the equalizing plate After fixing, it cannot be closely attached to the heating element, resulting in thermal resistance; in order to improve the aforementioned problem of inability to adhere closely, the industry directly corresponds to the copper pillars placed in the vicinity of the location where the temperature equalizing plate and the heating element are attached. Therefore, the copper pillars directly penetrate the parts of the uniform temperature plate with the cavity, although the tightness during assembly can be increased to prevent thermal resistance, but the cavity of the uniform temperature plate loses airtightness after being damaged by the penetration of the copper pillars , The inside of the chamber no longer has a vacuum state, and because the copper pillar penetrates to destroy the chamber, the flow path of the working fluid inside may be obstructed, resulting in reduced heat transfer efficiency, and even serious leakage may occur. The uniform temperature plate loses its heat transfer function. Furthermore, the three cases of US Patent Nos. 7066240 and 6302192 and 7100680 disclose a uniform temperature plate structure. 5. Referring to Figures 9 and 10, a body 51 has a first plate 511 and a second plate 512 that are separated from each other, and are positioned on the periphery of the body. An outer protrusion 513 is provided to connect the outer protrusion 513 to form a closed cavity 514; a groove 5111 is located on the first plate 511 and away from the outer protrusion 513, and is opposite to the second plate 512 Connection; an opening 52 penetrates the groove 5111 of the first plate 511 and the second plate 512, and the groove 5111 includes a ring-shaped outer surface 5112, and a ring-shaped edge surface corresponding to the second plate 512 5121 is connected so that the opening 52 is independently isolated from the body 51; a spacer 53 extends and contacts between the first flat plate 511 and the second flat plate 512; a capillary fiber structure 54 is provided in the closed cavity 514, although A structure has a supporting structure and an air-tight effect by the design of the groove 5111, but the space of the vapor-liquid circulation chamber inside the uniform temperature plate is greatly reduced due to the arrangement of the groove. The arrangement makes the contact area between the uniform temperature plate and the heat source smaller, so not only the heat transfer efficiency is reduced, the contact area is also greatly reduced. Therefore, the conventional knowledge has the following shortcomings: 1. It is easy to produce thermal resistance; 2. The heat dissipation area is reduced; 3. The heat transfer efficiency is reduced.

Therefore, in order to solve the shortcomings of the above-mentioned conventional technology, the main purpose of the present invention is to provide a heat dissipation device combination structure that does not need to penetrate through an airtight chamber to provide a heat dissipation device and a heat source tightly combined. In order to achieve the above objective, the present invention provides a heat sink combination structure, which includes: a first plate body, a second plate body, and a joining component; The first plate body has a first side and a second side; the second plate body has a third side and a fourth side, and the third side corresponds to the aforementioned first side. The first and second plates jointly define a closed chamber, the fourth side has a heat receiving part, and the heat receiving part contacts and conducts heat with at least one heat source. The coupling part is correspondingly arranged adjacent to the heat receiving part and has one end Combine with this heat source. Through the combination structure of the heat dissipation device of the present invention, the heat dissipation device can be tightly integrated with the heat source without penetrating the heat dissipation device, and the airtightness of the closed chamber inside the heat dissipation device can be protected.

Please refer to Figures 1 and 2, which are a three-dimensional exploded combined cross-sectional view of the first embodiment of the heat dissipation device combination structure of the present invention. As shown in the figure, the heat dissipation device combination structure 1 of the present invention includes: a first plate body 11, a The second board body 12, a connecting member 13; The first plate body 11 has a first side 111 and a second side 112, and the first and second sides 111, 112 are separately provided on the upper and lower sides of the first plate body 11. The second plate body 12 has a third side 121 and a fourth side 122. The third side 121 corresponds to the aforementioned first side 111, and the first and second plates 11, 12 jointly define A closed chamber 14, the fourth side 122 has a heat receiving part 123, and the heat receiving part 123 is in contact with at least one heat source 2 and conducts heat. The coupling member 13 is arranged adjacent to the heat receiving portion 123, and one end is coupled with the heat source 2. The coupling member 13 in this embodiment has a first coupling element 131 and a second coupling element 132 and a A third coupling element 133 and a fourth coupling element 134. The coupling part 13 is configured to be integrally extended from the fourth side 122 of the second plate body 12, or through integrated injection or welding, or through glue or devil. The felts are connected to each other in either way. The first, second, third, and fourth coupling elements 131, 132, 133, and 134 are correspondingly arranged adjacent to the heat source 2 and one end is hook-coupled to the heat source 2 with each other. The material of the first and second plates 11, 12 is any one of copper, aluminum, stainless steel, or titanium. The first and second plates 11, 12 can be made of the same material or can be used in combination. The first side 111 of the first plate 11 is provided with a hydrophilic plating layer 141 corresponding to the location of the sealed chamber 14, and the hydrophilic plating layer 141 increases the vapor-liquid circulation efficiency of the working liquid in the sealed chamber 14. Please refer to FIG. 3, which is a combined cross-sectional view of the second embodiment of the heat sink combination structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as the foregoing first embodiment, so it will not be repeated here, but this embodiment The difference between this example and the aforementioned first embodiment is that the third side 121 in the closed chamber 14 has a capillary structure 4, and the capillary structure 4 is a mesh body or a fibrous body or a porous structure. In any case, when the capillary structure 4 is a porous structure, it can be formed in a partial or laminated manner through electrochemical deposition, electroforming, 3D printing, or printing. When choosing to form a porous structure through electrochemical deposition, the material is copper, nickel, aluminum, or any metal with good thermal conductivity. If the mesh body is selected as the capillary structure, the material of the mesh body is any one of copper, aluminum, stainless steel, or titanium. Of course, it can also be arranged by mixing and matching laminated materials. Please refer to FIG. 4, which is a combined cross-sectional view of the third embodiment of the heat sink combination structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as the foregoing second embodiment, so it will not be repeated here, but this embodiment The difference between this example and the aforementioned second embodiment is that the first side 111 of the first plate 11 extends to the third side 121 of the second plate 12 with a plurality of convex bodies 123, and the capillary structure 4 is formed on the first side 111 of the second plate 12. On the surfaces of three sides 121, the convex bodies 123 abut one side of the capillary structure 4, and the opposite side of the convex bodies 123 is concave. Please refer to FIG. 5, which is a perspective exploded anatomical view of the fourth embodiment of the heat sink combination structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that this embodiment is provided with a combined buckle 3 on the peripheral side of the heat source. The combined buckle 3 is a dovetail seat structure, and the coupling member 13 is a dovetail groove. The combined buckle 3 corresponds to a dovetail to engage with the aforementioned coupling member 13. Please refer to FIG. 6, which is a combined cross-sectional view of the fifth embodiment of the heat dissipation device combination structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be repeated here. The difference between this example and the aforementioned first embodiment is that one of the free ends of the coupling members 13 corresponds to the plurality of holes 21 provided on the 2 peripheral sides of the heat source, and the free ends of the coupling members 13 are penetrated with the holes 21 at one end of the heat source. 21. One end of the connecting member 13 passing through the hole 21 is restricted and fixed through a C-shaped buckle 5. Please refer to Figures 7 and 8, which are a perspective exploded view of the sixth embodiment of the heat sink combination structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the coupling member 13 has a set portion 136 that is sleeved on the outside of the first and second plate bodies 11, 12, and the coupling member 13 has at least one extension end 137 on one side. At least one hole 21 is provided on the 2 peripheral side of the heat source, and the extension ends 137 are inserted and assembled corresponding to the aforementioned hole 21. The main purpose of this creation is to provide a heat dissipation device with a vacuum airtight chamber through the matching assembly of the coupling parts 13 and the combination fastener 3, which can be fixed to the heat source without penetrating, so as to maintain the working fluid inside the heat dissipation device. The normal operation of the vapor-liquid circulation and the improvement of the internal vapor-liquid circulation efficiency through the use of the hydrophilic coating and the capillary structure.

1: Combination structure of heat sink 11: The first board 111: first side 112: second side 12: The second board 121: third side 122: fourth side 123: Heated Department 13: Combining parts 131: The first binding element 132: The second binding element 133: The third binding element 134: The fourth binding element 136: Set Department 137: Extension 14: Closed chamber 2: heating source 21: Hole 3: Combination buckle 4: Capillary structure 5: C-shaped buckle

Figure 1 is a three-dimensional exploded view of the first embodiment of the combination structure of the heat sink of the present invention; Figure 2 is a combined cross-sectional view of the first embodiment of the heat sink combination structure of the present invention; Figure 3 is a combined cross-sectional view of the second embodiment of the heat sink combination structure of the present invention; Figure 4 is a combined cross-sectional view of the third embodiment of the heat sink combination structure of the present invention; Fig. 5 is a three-dimensional exploded view of the fourth embodiment of the combination structure of the heat sink of the present invention; Figure 6 is a combined cross-sectional view of the fifth embodiment of the heat sink combination structure of the present invention; Figure 7 is a perspective exploded view of the sixth embodiment of the heat sink combination structure of the present invention; Figure 8 is a perspective exploded view of the sixth embodiment of the heat sink combination structure of the present invention; Figure 9 is a schematic diagram of a conventional heat sink; Figure 10 is a schematic cross-sectional view of a conventional heat sink.

1: Combination structure of heat sink

11: The first board

111: first side

112: second side

12: The second board

121: third side

122: fourth side

13: Combining parts

14: Closed chamber

141: Hydrophilic coating

123: Heated Department

124: Receiving Department

2: heating source

Claims (15)

A fixing structure for a heat sink, which includes: A first board having a first side and a second side; A second plate body has a third side and a fourth side. The third side covers the first side correspondingly, and the first and second plates jointly define a sealed chamber. There is a heat-receiving part on four sides, and the heat-receiving part contacts at least one heat source and conducts heat; A coupling component is adjacent to the heat receiving part and one end is coupled with the heat source. The heat dissipation device coupling structure according to claim 1, wherein the first side has a hydrophilic coating. The heat dissipation device combination structure according to claim 1, wherein a capillary structure is formed on the third side surface opposite to the closed chamber. The heat dissipating device combination structure according to claim 3, wherein the capillary structure is any one of a mesh body, a fibrous body, or a structure having a porous property. The heat dissipation device combination structure according to claim 3, wherein the capillary structure is formed by electrochemical deposition, electroforming, 3D printing or printing. The heat dissipation device combination structure according to claim 5, wherein the material of the electrochemical deposition is any one of copper, nickel, aluminum, or a metal with good thermal conductivity. The heat dissipation device combination structure according to claim 4, wherein the material of the mesh body is any one of copper, aluminum, stainless steel, or titanium. The heat dissipation device combination structure according to claim 1, wherein the first and second plate systems are made of any one of copper, aluminum, stainless steel, or titanium. The heat dissipating device coupling structure according to claim 1, wherein the coupling member and the second plate body are connected and fixed to each other by any method of integral coating, welding, gluing, or devil felt. The heat dissipating device combination structure according to claim 3, wherein the first side surface extends a plurality of protrusions toward the third side surface, and the free end of the protrusion abuts against the capillary structure. The heat dissipating device coupling structure according to claim 1, wherein the coupling component has a first coupling element and a second coupling element, a third coupling element and a fourth coupling element, the first and second coupling elements The third and fourth combination elements are hooked and combined with the heat source. The heat dissipating device coupling structure according to claim 1, wherein a combination fastener is a dovetail structure and is adjacent to the peripheral side of the heat source, the coupling component is a dovetail, and the combination The component correspondingly forms a dovetail groove to engage with the aforementioned coupling component. The heat sink coupling structure according to claim 1, wherein the coupling parts have a free end corresponding to the plurality of holes provided on the peripheral side of the heat source, and the free ends of the coupling parts penetrate the holes corresponding to the It is set and clamped through a C-shaped buckle. The heat dissipating device coupling structure according to claim 1, wherein the coupling member has a set of parts sleeved on the outside of the first and second plates, and one side of the coupling member has at least one extension end, and the heat generating At least one hole is provided on the side of the source, and the extension ends are corresponding to the aforementioned hole insertion assembly. The heat dissipating device coupling structure according to claim 1, wherein the coupling member and the second plate body are integrally formed.

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