TWM505790U - Isothermal plate fastening structure - Google Patents

Description

Temperature-average board locking structure 【0001】

This creation is about a uniform temperature plate, especially a temperature-average plate locking structure.

【0002】

The Vapor chamber is a high-performance heat sink that can quickly transfer a local heat source to a large-area plate. Because the temperature equalizing plate has high heat transfer capability, light weight, simple structure and multi-purpose characteristics, and can transfer a large amount of heat without power consumption, it has been widely used in the high-performance heat dissipating component market, such as server, communication, high-order. Graphics card, high efficiency LED heat sink components, etc.

[0003]

However, in order to meet the light and thin demands of today's electronic devices, the temperature equalization plate must also be designed to be thin and light, thereby reducing the overall thickness of the electronic device. In this regard, how to design the uniform temperature plate locking structure, and the uniform temperature plate can be firmly and fixedly combined on the electronic heating element, so as to dissipate heat from the electronic heating element, that is, the motivation of the creator.

[0004]

In view of this, in order to achieve the above objectives, the creator has devoted himself to researching and cooperating with the application of theory, and finally proposed a creation that is reasonable in design and effective in improving the above-mentioned defects.

[0005]

One of the aims of the present invention is to provide a temperature equalization plate locking structure for firmly bonding a temperature equalizing plate to an electronic heating element for heat dissipation.

[0006]

One of the purposes of this creation is to provide a uniform temperature plate locking structure, thereby increasing the strength of the uniform temperature plate and preventing the deformation of the temperature uniform plate.

【0007】

In order to achieve the above purpose, the present invention is a temperature-average board locking structure for fixing on an electronic heating element, including a fixing frame, a temperature equalizing plate and a plurality of locking members. The fixing frame comprises a ring frame and a supporting plate extending inward from the ring frame. The ring frame is provided with a plurality of openings. A surface of the supporting plate is formed below the top surface of the ring frame to form a receiving groove, and the supporting plate has a hollow groove. The temperature equalizing plate is disposed on the fixing frame, and a plurality of perforations are formed corresponding to the openings, and the uniform temperature plate is formed with a contact convex surface and a heat conductive convex surface, and the contact convex surface protrudes from the hollow groove, and the heat conductive convex surface is received in the cavity. The plurality of locks respectively pass through the corresponding through holes and the respective holes, and the temperature equalizing plate is fixed on the electronic heating element through the fasteners, and the contact convex surface is attached to the electronic heating element.

[0008]

Compared with the prior art, the uniform temperature plate locking structure of the present invention places the temperature equalizing plate in the fixing frame, and then fixes it on the electronic heating element by using a plurality of locking members, wherein the temperature equalizing plate passes through the setting of the fixing frame. The strength is increased, so that the thinned uniform temperature plate can be prevented from being deformed. Furthermore, the uniform temperature plate of the present invention has a contact convex surface and a heat conductive convex surface, and the contact convex surface protrudes from the hollow groove to directly heat the electronic heating element, and the heat conduction convex surface is large. Contact the support plate of the fixed frame in an area to increase the conduction area and increase the heat dissipation speed. Accordingly, the uniform temperature plate locking structure can stably and uniformly combine the temperature equalizing plate on the electronic heating element, thereby achieving the purpose of dissipating heat from the electronic heating element and reducing the overall thickness of the electronic device.

[0024]

1‧‧‧Homothermal plate locking structure

[0025]

2‧‧‧Electronic heating element

[0026]

3‧‧‧Circuit board

[0027]

4‧‧‧ bolt

[0028]

10‧‧‧Fixed frame

[0029]

11‧‧‧ ring frame

[0030]

110‧‧‧Opening

[0031]

111‧‧‧ lugs

[0032]

12‧‧‧Support board

[0033]

120‧‧‧ 容容

[0034]

121‧‧‧ empty slots

[0035]

20‧‧‧Homothermal board

[0036]

200‧‧‧Perforation

[0037]

201‧‧‧Contact convex surface

[0038]

202‧‧‧thermal convex

[0039]

21‧‧‧Muscle tissue

[0040]

211‧‧‧ powder sintered capillary structure

[0041]

212‧‧‧Metal mesh capillary structure

[0042]

30‧‧‧Locker

[0043]

31‧‧‧Locking sleeve

【0009】

FIG. 1 is a perspective exploded view showing the structure of the uniform temperature plate locking structure of the present invention;

[0010]

2 is a schematic perspective view of the uniform temperature plate locking structure of the present invention;

[0011]

Figure 3 is a combined sectional view of the temperature-average board locking structure of the present invention;

[0012]

Figure 4 is a schematic view showing the use of the uniform temperature plate locking structure of the present invention.

[0013]

The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.

[0014]

Please refer to FIG. 1 to FIG. 3 , which are respectively a three-dimensional exploded view, a three-dimensional appearance diagram and a combined sectional view of the uniform temperature plate locking structure of the present invention. The present invention provides a temperature equalization plate locking structure 1 including a fixing frame 10, a temperature equalizing plate 20 and a plurality of locking members 30. The temperature equalizing plate 20 is disposed on the fixing frame 10, and the locking members 30 are disposed through the fixing frame 10 and the temperature equalizing plate 20, thereby being locked at a positioning position.

[0015]

The fixing frame 10 includes a ring frame 11 and a supporting plate 12 extending inward from the ring frame 11. The ring frame 11 is provided with a plurality of openings 110. One surface of the support plate 12 is lower than a top surface of the ring frame 11 and defines a receiving groove 120. The support plate 12 has a hollow slot 121.

[0016]

In an embodiment of the present invention, the ring frame 11 has a pair of lugs 111, and the openings 110 are respectively located on the pair of lugs 111. In addition, the hollow slot 121 is located at the center of the support plate 12, and the openings 110 are located at opposite sides of the hollow slot 121. In actual implementation, the number of the openings 110 and the lugs 111 is not limited and can be adjusted according to actual needs.

[0017]

The temperature equalizing plate 20 is disposed on the fixing frame 10, and a plurality of through holes 200 are provided for the openings. The inside of the temperature equalizing plate 20 is provided with a hollow chamber, and a plurality of capillary structures 21 (refer to FIG. 3) are disposed in the hollow chamber, and the capillary structures 21 comprise a powder sintered capillary structure 211 and a metal mesh capillary structure 212, but the actual implementation is performed. The setting type of the capillary structure is not limited.

[0018]

Moreover, one side of the temperature equalizing plate 20 is formed with a contact convex surface 201 and a heat conductive convex surface 202. After the temperature equalizing plate 20 is disposed on the fixing frame 10 , the contact convex surface 201 protrudes from the hollow groove 121 of the fixing frame 10 , and the heat conducting convex surface 202 is received in the receiving groove 120 of the fixing frame 10 . The structure of the uniform temperature plate 20 will be described in more detail later.

[0019]

Preferably, the contact convex surface 201 and the heat conductive convex surface 202 are formed in a step shape on a side of the temperature equalizing plate 10 facing the support plate 12, and the contact convex surface 201 is located outside the heat conductive convex surface 202, and the temperature is uniform. The perforations 200 of the plate 20 are spaced apart from the side edges of the thermally conductive convex surface 202.

[0020]

Furthermore, the fasteners 30 respectively pass through the corresponding through holes 200 and the openings 110. In this embodiment, the temperature equalization plate locking structure 1 further includes a plurality of locking sleeves 31 disposed corresponding to the plurality of locking members 30. The locking sleeves 31 respectively pass through the corresponding through holes 200 and the openings 110 , and each of the locking members 30 is correspondingly disposed in each of the locking sleeves 31 . The locking sleeve 31 is arranged to prevent the locks 30 from damaging the temperature equalizing plate 20 during the locking process. Preferably, the lock 30 can be configured as a stud.

[0021]

Please refer to FIG. 4 again, which is a schematic diagram of the use of the uniform temperature plate locking structure of the present invention. The uniform temperature plate locking structure 1 of the present invention is used for fixing on an electronic heating element 2 to dissipate heat from the electronic heating element 2. In this embodiment, the electronic heating element 2 is disposed on a circuit board 3, and the circuit board 3 is further provided with a plurality of bolts 4.

[0022]

In use, the temperature equalizing plate 20 and the fasteners 30 are coupled to the fixing frame 10, and the combination of the bolts 4 and the locking members 30 (studs) can correspond to the temperature equalizing plate locking structure 1 The electronic heating element 2 is locked. Accordingly, the contact convex surface 201 of the temperature equalizing plate 20 can closely adhere to the electronic heating element 2, and the heat generated when the electronic heating element 2 operates can be quickly conducted to the temperature equalizing plate 20, and then heat is dissipated.

[0023]

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Other equivalent variations of the patent spirit using the present invention are all within the scope of the patent.

1‧‧‧Homothermal plate locking structure

10‧‧‧Fixed frame

11‧‧‧ ring frame

110‧‧‧Opening

12‧‧‧Support board

121‧‧‧ empty slots

20‧‧‧Homothermal board

21‧‧‧Muscle tissue

211‧‧‧ powder sintering

212‧‧‧Metal net

201‧‧‧Contact convex surface

202‧‧‧thermal convex

30‧‧‧Locker

31‧‧‧Locking sleeve

Claims (8)

[Item 1] A temperature equalization plate locking structure for fixing on an electronic heating element, comprising:
A fixed frame includes a ring frame and a support plate extending inwardly from the ring frame, the ring frame is provided with a plurality of openings, and a surface of the support plate is lower than a top surface of the ring frame to form a cavity And the support plate has a hollow slot;
a uniform temperature plate disposed on the fixing frame and having a plurality of perforations corresponding to the openings, wherein the temperature equalizing plate is formed with a contact convex surface and a heat conducting convex surface, the contact convex surface protruding the hollowing groove, the thermal conductive convex surface The plurality of fasteners are respectively inserted into the corresponding through holes and the openings, and the temperature equalizing plate is fixed on the electronic heating element through the fasteners, the contact convex surface Attaching the electronic heating element. [Item 2] The temperature equalization plate locking structure according to claim 1, wherein the ring frame has a pair of lugs, and the opening holes are respectively located on the pair of lugs. [Item 3] The uniform temperature plate locking structure according to claim 1, wherein the hollowing groove is located at a center of the supporting plate, and the opening holes are located at opposite sides of the hollowing groove. [Item 4] The uniform temperature plate locking structure according to claim 1, wherein the contact convex surface and the heat conductive convex surface are formed in a step shape on a side of the temperature equalizing plate facing the support plate, and the contact convex surface is located on the heat conductive convex surface. Outside. [Item 5] The uniform temperature plate locking structure according to claim 1, wherein the perforations are spaced apart from the side edges of the thermally conductive convex surface. [Item 6] The temperature-average board locking structure according to claim 1, further comprising a plurality of locking sleeves corresponding to the plurality of locking sleeves, wherein the locking sleeves respectively pass through the corresponding perforations and the openings Each of the fasteners is correspondingly disposed in each of the locking sleeves. [Item 7] The uniform temperature plate locking structure according to claim 1, wherein the temperature equalizing plate is provided with a plurality of capillary structures, and the capillary structure comprises a powder sintered capillary structure and a metal mesh capillary structure. [Item 8] The uniform temperature plate locking structure according to claim 1, wherein the locking member is a stud.