TWI687643B - Vapor chamber - Google Patents
Vapor chamber Download PDFInfo
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- TWI687643B TWI687643B TW108116273A TW108116273A TWI687643B TW I687643 B TWI687643 B TW I687643B TW 108116273 A TW108116273 A TW 108116273A TW 108116273 A TW108116273 A TW 108116273A TW I687643 B TWI687643 B TW I687643B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
本發明係為一散熱裝置,特別是一種由具有強化層的上板或是下板所構成的均溫板。 The invention is a heat dissipation device, especially a temperature equalizing plate composed of an upper plate or a lower plate with a strengthening layer.
均溫板此種散熱裝置,特別是薄型的均溫板,容易發生變形的情況,特別是在進行組裝作業中,將均溫板貼附熱源的時後,因此,要如何提升均溫板在結構上的強度,同時又不會妨礙到均溫板的正常運作,一直是業界亟需解決的問題。 The heat dissipation device of the temperature equalizing plate, especially the thin type temperature equalizing plate, is prone to deformation. Especially when the temperature equalizing plate is attached to the heat source during the assembly operation, how to improve the temperature equalizing plate in The structural strength, at the same time, will not hinder the normal operation of the temperature equalizing plate, which has always been a problem that the industry needs to solve.
本發明要解決的技術問題在於,針對現有技術存在的上述不足,提供一種均溫板,其上板或下板具有強化層,能夠確保均溫板正常運作的同時,提高其結構強度和使用可靠性。 The technical problem to be solved by the present invention is to provide a temperature-equalizing plate for the above-mentioned deficiencies in the prior art. The upper or lower plate has a reinforcement layer, which can ensure the normal operation of the temperature-equating plate while improving its structural strength and reliable use. Sex.
本發明解決其技術問題所採用的技術方案是提供一種均溫板,包括一上板以及一下板。下板貼合上板,並與上板共同夾設出一作用空間,下板可與一熱源熱接觸。上板和下板中的至少一者,在遠離作用空間的側,形成一強化層。 The technical solution adopted by the present invention to solve its technical problem is to provide a temperature-equalizing plate, including an upper plate and a lower plate. The lower plate is attached to the upper plate, and a working space is interposed with the upper plate, and the lower plate can be in thermal contact with a heat source. At least one of the upper plate and the lower plate forms a strengthening layer on the side away from the working space.
較佳地,強化層在金屬強度上優於上板或是下板,並且在導熱性上劣於上板或是下板。 Preferably, the reinforcement layer is superior to the upper or lower plate in terms of metal strength, and is inferior to the upper or lower plate in thermal conductivity.
較佳地,衡量金屬強度的標準選自下列之一指標:維氏硬 度、拉伸強度以及彈性係數。 Preferably, the standard for measuring the strength of the metal is selected from one of the following indicators: Vickers hardness Degree, tensile strength and elastic coefficient.
較佳地,衡量導熱性的標準為熱傳導係數。 Preferably, the criterion for measuring thermal conductivity is the thermal conductivity coefficient.
較佳地,構成強化層的主要材料選自下列之一:鎳、不鏽鋼與鈦。 Preferably, the main material constituting the strengthening layer is selected from one of the following: nickel, stainless steel and titanium.
較佳地,強化層具有抗腐蝕性。 Preferably, the reinforcement layer has corrosion resistance.
較佳地,上板於面對作用空間的側形成有一第一毛細結構,下板於面對作用空間的側形成有一第二毛細結構,且第一毛細結構與第二毛細結構之間,形成有至少一支撐結構。 Preferably, the upper plate forms a first capillary structure on the side facing the working space, the lower plate forms a second capillary structure on the side facing the working space, and between the first capillary structure and the second capillary structure is formed There is at least one support structure.
較佳地,均溫板更包括一導熱塊設置於下板與熱源之間,構成導熱塊之主要材料為純銅。 Preferably, the temperature equalizing plate further includes a heat conduction block disposed between the lower plate and the heat source. The main material of the heat conduction block is pure copper.
較佳地,下板的導熱性優於上板的導熱性。 Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the upper plate.
較佳地,下板具有一凸台結構,凸台結構與熱源熱接觸。 Preferably, the lower plate has a boss structure, and the boss structure is in thermal contact with the heat source.
較佳地,當下板在遠離作用空間的側形成強化層時,強化層形成於凸台結構與熱源之間。 Preferably, when the lower plate forms a strengthening layer on the side away from the working space, the strengthening layer is formed between the boss structure and the heat source.
較佳地,當下板在遠離作用空間的側形成強化層時,強化層於凸台結構處形成一開放空間,顯露出凸台結構。 Preferably, when the lower plate forms a reinforcement layer on the side away from the working space, the reinforcement layer forms an open space at the boss structure to reveal the boss structure.
較佳地,均溫板更包括一導熱塊設置於凸台結構與熱源之間,構成導熱塊之主要材料為純銅。 Preferably, the temperature equalizing plate further includes a heat conduction block disposed between the boss structure and the heat source, and the main material constituting the heat conduction block is pure copper.
較佳地,均溫板更包括一固定架貼合下板,固定架包括一鎖固部。 Preferably, the temperature equalizing plate further includes a fixing frame that fits the lower plate, and the fixing frame includes a locking portion.
較佳地,當熱源固定於一承載板上時,固定架的鎖固部可與承載板固定在一起。 Preferably, when the heat source is fixed on a bearing plate, the locking portion of the fixing frame can be fixed together with the bearing plate.
較佳地,下板之導熱性優於上板之導熱性。 Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the upper plate.
較佳地,下板之導熱性優於固定架之導熱性。 Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the fixing frame.
較佳地,固定架之金屬強度優於下板之金屬強度。 Preferably, the metal strength of the fixing frame is better than the metal strength of the lower plate.
較佳地,構成下板之主要材料為純銅,構成固定架之主要材料選自下列之一:銅合金、不鏽鋼、塑鋼與鋁合金。 Preferably, the main material constituting the lower plate is pure copper, and the main material constituting the fixing frame is selected from one of the following: copper alloy, stainless steel, plastic steel and aluminum alloy.
較佳地,均溫板更包括一導熱塊設置於固定架與熱源之間,構成導熱塊之主要材料為純銅。 Preferably, the temperature equalizing plate further includes a heat conduction block disposed between the fixing frame and the heat source. The main material of the heat conduction block is pure copper.
較佳地,更包括一固定架,固定架包括一鎖固部,當下板在遠離作用空間的側形成強化層時,固定架貼合強化層。 Preferably, the fixing frame further includes a fixing frame, and the fixing frame includes a locking portion. When the lower plate forms a strengthening layer on the side away from the working space, the fixing frame is attached to the strengthening layer.
較佳地當熱源固定於一承載板上時,固定架的鎖固部可與承載板固定在一起。 Preferably, when the heat source is fixed on a bearing plate, the locking portion of the fixing frame can be fixed together with the bearing plate.
較佳地,下板之導熱性優於或等於上板的導熱性。 Preferably, the thermal conductivity of the lower plate is better than or equal to the thermal conductivity of the upper plate.
較佳地,下板之導熱性優於固定架之導熱性。 Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the fixing frame.
較佳地,下板的導熱性優於強化層之導熱性。 Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the reinforcement layer.
較佳地,固定架或是強化層之金屬強度優於下板之金屬強度。 Preferably, the metal strength of the fixing frame or the reinforcement layer is better than the metal strength of the lower plate.
較佳地,構成下板之主要材料為純銅,構成固定架之主要材料選自下列之一:銅合金、不鏽鋼、塑鋼與鋁合金,而構成強化層的主要材料選自下列之一:鎳、不鏽鋼與鈦。 Preferably, the main material constituting the lower plate is pure copper, the main material constituting the fixing frame is selected from one of the following: copper alloy, stainless steel, plastic steel and aluminum alloy, and the main material constituting the strengthening layer is selected from one of the following: nickel, Stainless steel and titanium.
較佳地,均溫板更包括一導熱塊設置於固定架與熱源之間,構成導熱塊之主要材料為純銅。 Preferably, the temperature equalizing plate further includes a heat conduction block disposed between the fixing frame and the heat source. The main material of the heat conduction block is pure copper.
1、2、3‧‧‧均溫板 1, 2, 3 ‧‧‧ temperature plate
11、21、31‧‧‧上板 11, 21, 31
12、22、32‧‧‧下板 12, 22, 32
121‧‧‧凸台結構 121‧‧‧Boss structure
13、23、33‧‧‧固定架 13, 23, 33‧‧‧ Fixing frame
13A、13B、33A、33B‧‧‧架體 13A, 13B, 33A, 33B ‧‧‧ frame
131、231、331‧‧‧開放空間 131, 231, 331‧‧‧ open space
132、232、332‧‧‧鎖固部 132, 232, 332
133、333‧‧‧缺口 133, 333‧‧‧ Notch
14、24、34‧‧‧作用空間 14, 24, 34
15、25、35‧‧‧第一毛細結構 15, 25, 35 ‧‧‧ capillary structure
16、26、36‧‧‧第二毛細結構 16, 26, 36‧‧‧Second capillary structure
17、27、37‧‧‧支撐結構 17, 27, 37 ‧‧‧ support structure
19、29、39‧‧‧強化層 19, 29, 39 ‧‧‧ strengthen layer
19A、29A、39A‧‧‧開放空間 19A, 29A, 39A‧‧‧ open space
38‧‧‧導熱塊 38‧‧‧ thermal block
4‧‧‧熱源 4‧‧‧heat source
5‧‧‧承載板 5‧‧‧Bearing plate
51‧‧‧穿孔 51‧‧‧Perforation
6‧‧‧螺絲 6‧‧‧screw
第1A圖至第1B圖分別是依據本發明之第一實施例所提供均溫板的立體分解示意圖以及側面示意圖。 FIGS. 1A to 1B are respectively a three-dimensional exploded schematic diagram and a side schematic diagram of a temperature equalizing plate according to the first embodiment of the present invention.
第1C圖至第1E圖是依據本發明的第一實施例所提供均溫板中固定架的多種實施方式的結構示意圖。 FIGS. 1C to 1E are structural schematic diagrams of various implementations of the fixing frame in the temperature equalizing plate according to the first embodiment of the present invention.
第1F圖是依據本發明的第一實施例所提供的均溫板中強化層具有開放空間時的結構示意圖。 FIG. 1F is a schematic diagram of the structure when the strengthening layer in the temperature equalizing plate according to the first embodiment of the present invention has an open space.
第2A圖至第2B圖分別是依據本發明之第二實施例所提供均溫板的立體分解示意圖以及側面示意圖。 FIGS. 2A to 2B are respectively a three-dimensional exploded schematic diagram and a side schematic diagram of a temperature equalizing plate according to a second embodiment of the present invention.
第2C圖是依據本發明的第二實施例所提供的均溫板中強化層具有開放空間時的結構示意圖。 FIG. 2C is a schematic diagram of the structure when the strengthening layer in the temperature equalizing plate according to the second embodiment of the present invention has an open space.
第3A圖至第3B圖分別是依據本發明之第三實施例所提供均溫板的立體分解示意圖以及側面示意圖。 FIGS. 3A to 3B are respectively a three-dimensional exploded schematic diagram and a side schematic diagram of a temperature equalizing plate according to a third embodiment of the present invention.
第3C圖至第3E圖是依據本發明的第三實施例所提供均溫板中固定架的多種實施方式的結構示意圖。 FIGS. 3C to 3E are structural schematic diagrams of various implementations of a fixing frame in a temperature equalizing plate according to a third embodiment of the present invention.
第3F圖是依據本發明的第一實施例所提供的均溫板中強化層具有開放空間時的結構示意圖。 FIG. 3F is a schematic diagram of the structure when the strengthening layer in the temperature equalizing plate according to the first embodiment of the present invention has an open space.
請參考第1A圖至第1B圖,其係依據本發明之第一實施例所提供之均溫板的立體分解示意圖以及側面示意圖。 Please refer to FIG. 1A to FIG. 1B, which are a three-dimensional exploded schematic diagram and a side schematic diagram of the temperature equalizing plate according to the first embodiment of the present invention.
第一實施例係提供一種均溫板1,其至少包括一上板11、一下板12以及一固定架13。均溫板1的下板12可與至少一熱源4做熱接觸,熱源4則固定於一承載板5上。均溫板1的上板11與下板12,係經由貼合或壓合
後而形成一作用空間14,上板11在面對作用空間14的該側(內側)形成有一第一毛細結構15,而下板12在面對作用空間14的該側(內側)則形成有一第二毛細結構16,而在上板11的第一毛細結構15與下板12的第二毛細結構16之間,形成有一支撐結構17例如毛細粉柱或是編織網等。
The first embodiment provides a
為了能夠加強均溫板1在結構上的強度,本實施例除了在作用空間14內設置有支撐結構17之外,也特別在均溫板1的上板11和下板12中至少一者的外側,也就是遠離作用空間14的該側,形成一強化層19。從第1B圖所示的剖面示意圖可以觀察到,此為均溫板1的上板11外覆蓋或是形成有強化層19,而且下板12外也可覆蓋或是形成有強化層19的一種情況。由此可知,強化層19可視產品規格與需求形成於上板11與下板12的外側,或是僅形成在上板11或是下板12的外側,本發明並不予以限制。
In order to strengthen the structural strength of the
本實施例中所採用的強化層19,其金屬強度優於上板11或是下板12,但是在導熱性上則劣於上板11或是下板12,其中衡量金屬強度的標準選自下列之一指標:維氏硬度、拉伸強度以及彈性係數,而衡量導熱性的標準為熱傳導係數。因應上述的設計規則,本實施所採用構成上板11的主要材料可選自銅合金,而構成下板12的主要材料可選自純銅,而構成該強化層19的主要材料選自下列之一:鎳、不鏽鋼與鈦。此外,強化層19在材料特性上也具有抗腐蝕性,以期提高均溫板1的可靠度與使用年限。
The
此外,本實施例所提供的均溫板1,可選擇讓下板12的導熱性優於上板11的導熱性,使得上板11外側的溫度不致過高,影響均溫板1應用標的例如手機或是平板電腦的手感溫度。
In addition, the
本實施例所提供的下板12可在部分的區域形成至少一凸台
結構121,並藉此凸出的結構來與至少一熱源4做熱接觸,熱接觸包括凸台結構121直接貼附熱源4,或是與熱源4之間設置有導熱膏或其他元件或是組成而間接地接觸。此外,凸台結構121的設置,可讓均溫板1與熱源4做熱接觸時,凸台結構121與下板12的其他部位有一個高低差,因而比較不會壓迫或是阻礙到承載板5上其他的電子元件的設置,增加安裝的彈性與便利。此外,當下板12在遠離作用空間14的該側形成強化層19時,強化層19則會形成於下板12的凸台結構121與熱源4之間。不過,在依據本發明的其他實施例中,設置在下板12外側的強化層19,其設置方式也可如第1F圖所示,僅部分地形成在下板12的外側,也就是讓強化層19具有一開放空間19A,此時下板12就不會透過強化層19來與熱源4做熱接觸。
The
在本實施例中考慮到均溫板1的安裝便利性與穩固性,因此設置有固定架13,並藉由銲接或其他手段而讓固定架13貼合於下板12外側的強化層19,而當固定架13與熱源4的承載板5固定在一起時,下板12的凸台結構121可產生一個緊迫著熱源4的壓力,使得熱源4所產生的熱能可以快速且完整地經由強化層19而傳遞至凸台結構121,之後再藉由均溫板1的作用而傳遞出去。而在本實施例中,固定架13包括一開放空間131以及至少一鎖固部132,並且讓下板12的凸台結構121以及強化層19位於開放空間131內,或是讓凸台結構121以及強化層19可自開放空間131而更往外延伸或突出,本發明並不予以限制。
In this embodiment, considering the installation convenience and stability of the
在本實施例中,形成於固定架13上的鎖固部132係用來與承載板5固定在一起,固定架13的鎖固部132的採用一母螺柱的結構,並對應地在承載板5上形成有一穿孔51,如此一來,就可藉由一螺絲6穿過穿孔51
後而鎖合於鎖固部(母螺柱)132後,將下板12外側的強化層19、固定架13以及承載板5(包含熱源4)三者組裝在一起。當然,在其他實施例中,固定架13的鎖固部132也可從母螺柱而替換為一公螺柱,並在承載板5上形成穿孔51,因而當公螺柱穿過該穿孔51後,再藉由一螺帽(圖中未示)固定公螺柱而完成組裝。此外,在其他實施例中,也可將固定架13的鎖固部132形成一螺孔的結構,其同樣也可藉由一螺絲6穿過承載板5上的穿孔51後鎖固於該螺孔內而完成組裝,本發明並不予以限制。
In this embodiment, the locking
在本實施例中,選擇構成固定架13之主要材料則可選自銅合金、不鏽鋼、塑鋼或是鋁合金,考量的因素主要是著重在其金屬的強度,使得均溫板1在安裝的過程中不易產生變形,其中衡量金屬強度的標準包括維氏硬度、拉伸強度或彈性係數等。
In this embodiment, the main material of the fixing
本實施例中所提供的均溫板1,在設計規則上,包括有讓強化層19在金屬強度上優於上板11或是下板12、讓強化層19的導熱性劣於上板11或是下板12、讓下板12之導熱性優於上板11之導熱性、讓下板12之導熱性優於固定架13之導熱性或是讓固定架13之金屬強度優於下板12之金屬強度等,實際運用時可視情況採用上述所列之規則。
In the design rules of the
在本實施例中,固定架13的開放空間131如第1A圖以及第1C圖所示,為一鏤空架體而定義出該開放空間131,因而可以讓下板12的凸台結構121以及強化層19位於該開放空間131內,如此就不會增加均溫板1的整體厚度。不過,固定架13上所形成的開放空間131,也可有不同的變化與結構,舉例來說,開放空間131可如第1D圖所示,是由一個具有缺口的鏤空架體所形成,其仍然可以讓凸台結構121與強化層19容置於此空間內,此時,
固定架13的結構,是一個具有缺口133或是類似C型的架體。此外,開放空間131也可如第1E圖所示,將固定架13直接由至少兩個獨立的架體13A、13B所組成,架體13A、13B之間自然就形成一個開放空間131來讓凸台結構121與強化層19得以置入於其中。此外,若是如第1F圖所示強化層19僅部分形成在下板12外側並且顯露出凸台結構121時,就僅會有凸台結構121位在固定架13的開放空間內並與熱源4做熱接觸。
In this embodiment, as shown in FIGS. 1A and 1C, the
請參考第2A圖至第2B圖,其係依據本發明之第二實施例所提供之均溫板立體分解示意圖以及側面示意圖。 Please refer to FIG. 2A to FIG. 2B, which are a three-dimensional exploded schematic diagram and a side schematic diagram of a temperature equalizing plate according to a second embodiment of the present invention.
第二實施例係提供一種均溫板2,其至少包括一上板21、一下板22以及一固定架23,固定架23包括至少一鎖固部232。均溫板2的下板22可與至少一熱源4做熱接觸,熱源4則固定於一承載板5上。均溫板2的上板21與下板22,係經由貼合或壓合後而形成一作用空間24,上板21在面對作用空間24的該側(內側)形成有一第一毛細結構25,而下板22在面對作用空間24的該側(內側)則形成有一第二毛細結構26,而在上板21的第一毛細結構25與下板22的第二毛細結構26之間,形成有一支撐結構27例如毛細粉柱或是編織網等。
The second embodiment provides a
為了能夠加強均溫板2在結構上的強度,本實施例除了在作用空間24內設置有支撐結構27之外,也特別在均溫板2的上板21和下板22中至少之一者的外側,也就是遠離作用空間24的該側,形成一強化層29,從第2B圖所示的剖面示意圖可以觀察到,此為均溫板2的上板21外覆蓋或是形成有強化層29,而下板22外也覆蓋或是形成有強化層29的情況。強化層29可視產品規格與需求形成於上板21與下板22的外側,或是僅形成在上板21
或是下板22的外側,本發明並不予以限制。
In order to enhance the structural strength of the
本實施例中所採用的強化層29,其金屬強度優於上板21或是下板22,但是在導熱性上則劣於上板21或是下板22,其中衡量金屬強度的標準選自下列之一指標:維氏硬度、拉伸強度以及彈性係數,而衡量導熱性的標準為熱傳導係數。因應上述的設計規則,本實施所採用構成上板21的主要材料可選自銅合金,而構成下板22的主要材料可選自純銅,而構成該強化層29的主要材料選自下列之一:鎳、不鏽鋼與鈦。此外,強化層29在材料特性上也具有抗腐蝕性,以期提高均溫板2的可靠度與使用年限。
The
此外,本實施例所提供的均溫板2,可選擇讓下板22的導熱性優於上板21的導熱性,使得上板21外側的溫度不致過高,影響均溫板2應用標的例如手機或是平板電腦的手感溫度。
In addition, the
本實施例中考慮到均溫板2的安裝便利性與穩固性,因此設置有固定架23,並藉由銲接或其他手段而讓固定架23貼合於下板22外側的強化層29。當固定架23與熱源4的承載板5固定在一起時便可產生一個緊迫著熱源4的壓力,使得熱源4所產生的熱能可以快速且完整地經由強化層29而傳遞至下板22,之後再藉由均溫板2內部的作用而傳遞出去。而在本實施例中,固定架23包括至少一鎖固部232。
In this embodiment, considering the ease of installation and stability of the
在本實施例中,形成於固定架23上的鎖固部232係用來與承載板5固定在一起,固定架23的鎖固部232的採用一母螺柱的結構,並對應地在承載板5上形成有一穿孔51,如此一來,就可藉由一螺絲6穿過穿孔51後而鎖合於鎖固部(母螺柱)232後,將下板22外側的強化層29、固定架23以及承載板5(包含熱源4)三者組裝在一起。當然,在其他實施例中,固定架23
的鎖固部232也可從母螺柱而替換為一公螺柱,並在承載板5上形成穿孔51,因而當公螺柱穿過該穿孔51後,再藉由一螺帽(圖中未示)固定公螺柱而完成組裝。此外,在其他實施例中,也可將固定架23的鎖固部232形成一螺孔的結構,其同樣也可藉由一螺絲6穿過承載板5上的穿孔51後鎖固於該螺孔內而完成組裝,本發明並不予以限制。
In this embodiment, the locking
在本實施例中,選擇構成固定架23之主要材料則可選自銅合金、不鏽鋼、塑鋼或是鋁合金,考量的因素主要是著重在其金屬的強度,使得均溫板2在安裝的過程中不易產生變形,其中,衡量金屬強度的標準包括維氏硬度、拉伸強度或彈性係數等。
In this embodiment, the main material for forming the fixing
本實施例中所提供的均溫板2,在設計規則上,包括有讓強化層29在金屬強度上優於上板21或是下板22、讓強化層29的導熱性劣於上板21或是下板22、讓下板22之導熱性優於上板21之導熱性、讓下板22之導熱性優於固定架23之導熱性、或是讓固定架23之金屬強度優於下板22之金屬強度等,實際運用時可視情況採用上述所列之規則。
The design of the
在依據本發明的其他實施例中,設置在下板22外側的強化層29,其設置方式也可如第2C圖所示,僅部分地形成在下板22的外側,也就是讓強化層29具有一開放空間29A,此時下板22就不會透過強化層29來與固定架23或是熱源4做熱接觸,也就是說,熱源4所產生的熱能,會先傳遞至固定架23,之後再傳遞至下板22而進入均溫板2的內部進行散熱。
In other embodiments according to the present invention, the
請參考第3A圖至第3B圖,其係依據本發明之第三實施例所提供之均溫板立體分解示意圖以及側面示意圖。 Please refer to FIG. 3A to FIG. 3B, which are a three-dimensional exploded schematic diagram and a side schematic diagram of a temperature equalizing plate according to a third embodiment of the present invention.
第三實施例係提供一種均溫板3,其包括至少一上板31、一
下板32、一固定架33以及一導熱塊38。均溫板3可與至少一熱源4做熱接觸,熱源4則固定於一承載板5上。均溫板3的上板31與下板32,係經由貼台或壓合後而形成一作用空間34,上板31在面對作用空間34的該側(內側)形成有一第一毛細結構35,而下板32在面對作用空間34的該側(內側)則形成有一第二毛細結構36,而在上板31的第一毛細結構35與下板32的第二毛細結構36之間,形成有一支撐結構37例如毛細粉柱或是編織網等。
The third embodiment provides a
為了能夠加強均溫板3在結構上的強度,本實施例除了在作用空間34內設置有支撐結構37之外,也特別在均溫板3的上板31和下板32中至少一者的外側,也就是遠離作用空間34的該側,形成一強化層39,從第3B圖所示的剖面示意圖可以觀察到,均溫板3的上板31外覆蓋或是形成有強化層39,而下板32外也可覆蓋或是形成有強化層39,此強化層39可視產品規格與需求形成於上板31與下板32的外側,或是僅形成在上板31或是下板32的外側,本發明並不予以限制。
In order to enhance the structural strength of the
本實施例中所採用的強化層39,其金屬強度優於上板31或是下板32,但是在導熱性上則劣於上板31或是下板32,其中衡量金屬強度的標準選自下列之一指標:維氏硬度、拉伸強度以及彈性係數,而衡量導熱性的標準為熱傳導係數。因應上述的設計規則,本實施所採用構成上板31的主要材料可選自銅合金,而構成下板32的主要材料可選自純銅,而構成該強化層39的主要材料選自下列之一:鎳、不鏽鋼與鈦。此外,強化層39在材料特性上也具有抗腐蝕性,以期提高均溫板3的可靠度與使用年限。
The
此外,本實施例所提供的均溫板3,可選擇讓下板32的導熱性優於上板31的導熱性,使得上板31外側的溫度不致過高,影響均溫板3應
用標的例如手機或是平板電腦的手感溫度。
In addition, the
此外,在本實施例中,導熱塊38的一面係藉由銲接或其他固定手段貼合於下板32外側的強化層39上,而導熱塊38的另一面則與至少一熱源4做熱接觸,熱接觸包括導熱塊38直接貼附熱源4,或是與熱源4之間設置有導熱膏或其他元件或組成而間接地接觸。而當導熱塊38分別與強化層39以及熱源4結合時,熱源4所產生的熱能就可藉由導熱塊38而傳遞至強化層39,並進一步傳遞至下板32後而進入均溫板3內進行後續的散熱。
In addition, in this embodiment, one side of the
本實施例中考慮到均溫板3的安裝便利性與穩固性,因此設置有固定架33,並藉由銲接或其他手段而讓固定架33貼合於下板32外側的強化層39,而當固定架33與熱源4的承載板5固定在一起時,便可產生一個緊迫著熱源4的壓力,使得熱源4所產生的熱能可以快速且完整地經由強化層39而傳遞至下板32,之後再藉由均溫板3的作用而傳遞出去。而在本實施例中,固定架33包括一開放空間331以及至少一鎖固部332,並且讓導熱塊38位於該開放空間331內,也就是在水平高度上,固定架33跟導熱塊38是重疊的,如此便可減少均溫板3的整體厚度。
In this embodiment, considering the installation convenience and stability of the
在本實施例中,形成於固定架33上的鎖固部332係用來與承載板5固定在一起,固定架33的鎖固部332的採用一母螺柱的結構,並對應地在承載板5上形成有一穿孔51,如此一來,就可藉由一螺絲6穿過穿孔51後而鎖合於鎖固部(母螺柱)332後,將下板32外側的強化層39、固定架33以及承載板5(包含熱源4)三者組裝在一起。當然,在其他實施例中,固定架33的鎖固部332也可從母螺柱而替換為一公螺柱,並在承載板5上形成穿孔51,因而當公螺柱穿過該穿孔51後,再藉由一螺帽(圖中未示)固定公螺柱而
完成組裝。此外,在其他實施例中,也可將固定架33的鎖固部132形成一螺孔的結構,其同樣也可藉由一螺絲6穿過承載板5上的穿孔51後鎖固於該螺孔內而完成組裝,本發明並不予以限制。
In this embodiment, the locking
在本實施例中,構成上板31之主要材料為銅合金,構成下板32之主要材料為純銅,構成強化層39的主要材料選自下列之一:鎳、不鏽鋼與鈦,構成導熱塊38的主要材料可選自純銅,構成固定架33之主要材料則可選自銅合金、不鏽鋼、塑鋼或是鋁合金。如此的安排是因為純銅的導熱性較銅合金好,因此導熱塊38能更有效率地將熱能從熱源4傳遞至強化層39。此外,在本實施例中,固定架33之主要材料選用銅合金、不鏽鋼、塑鋼或是鋁合金的原因,在於考慮其金屬的強度,讓均溫板3在安裝的過程中不易產生變形。在本實施例中,衡量導熱性的標準為導熱係數,而衡量金屬強度的標準包括維氏硬度、拉伸強度或彈性係數等。
In this embodiment, the main material constituting the
本實施例中所提供的均溫板3,在設計規則上,包括有讓強化層39在金屬強度上優於上板31、下板32或是導熱塊38、讓強化層39的導熱性劣於上板31、下板32或是導熱塊38、讓下板32之導熱性優於上板31之導熱性、讓下板32之導熱性優於固定架33之導熱性、讓固定架33之金屬強度優於下板32之金屬強度等,實際運用時可視情況採用上述所列之規則。
The design rules of the
在本實施例中,固定架33的開放空間331如第3A圖以及第3C圖所示,為一鏤空架體而定義出該開放空間331,因而可以讓導熱塊38位於該開放空間331內,如此就不會增加均溫板3的整體厚度。不過,固定架33上所形成的開放空間331,也可有不同的變化與結構,舉例來說,開放空間331可如第3D圖所示,是一個具有缺口的鏤空部,其仍然可以讓導熱塊38
容置於此空間內,此時,固定架33的結構,是一個具有缺口333或是類似C型的架體。此外,開放空間331也可如第3E圖所示,讓固定架33由至少二獨立的架體33A、33B所組成,而架體33A、33B之間自然就形成一個開放空間331來讓導熱塊38得以置入於其中。
In this embodiment, as shown in FIGS. 3A and 3C, the
在依據本發明的其他實施例中,設置在下板32外側的強化層39,其設置方式也可如第3F圖所示,僅部分地形成在下板32的外側,也就是讓強化層39具有一開放空間39A,此時導熱塊38位在此開放空間39A內,因此下板32就不會如第3B圖所示透過強化層39來與熱源4做熱接觸,而是可以透過導熱塊38來與熱源4做熱接觸。而在此種情況下,固定架33也就不會如第3B圖所示貼合固定在強化層39,而是透過此開放空間39A而貼合在下板32上。
In other embodiments according to the present invention, the
以上概述了依據本發明之數個實施例的內容,使得本技術領域中具有通常知識者可以理解本發明所揭露的發明技術。在本技術領域中具有通常知識者應該理解,他們可以容易地使用本揭露作為基礎,來設計或修改用於實施與在此所介紹實施例相同的目的及/或達到相同優點的其他結構,本發明並不予以限制。 The above summarizes the contents of several embodiments according to the present invention, so that those skilled in the art can understand the invention disclosed in the present invention. Those of ordinary skill in the art should understand that they can easily use this disclosure as a basis to design or modify other structures for implementing the same purposes and/or achieving the same advantages as the embodiments described herein. The invention is not restricted.
本發明所提到的方向用語,例如[上]、[下]、[內]、[外]、[側]等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明及理解本發明,而非用以限制本發明。 Directional terms mentioned in the present invention, such as [upper], [lower], [inner], [outer], [side], etc., only refer to the directions of the attached drawings. Therefore, the directional terminology is used to illustrate and understand the present invention, not to limit the present invention.
1‧‧‧均溫板 1‧‧‧average temperature plate
11‧‧‧上板 11‧‧‧Upboard
12‧‧‧下板 12‧‧‧Lower plate
121‧‧‧凸台結構 121‧‧‧Boss structure
13‧‧‧固定架 13‧‧‧Fixing frame
131‧‧‧開放空間 131‧‧‧ open space
132‧‧‧鎖固部 132‧‧‧Locking Department
14‧‧‧作用空間 14‧‧‧Function space
15‧‧‧第一毛細結構 15‧‧‧The first capillary structure
16‧‧‧第二毛細結構 16‧‧‧Second capillary structure
17‧‧‧支撐結構 17‧‧‧Support structure
19‧‧‧強化層 19‧‧‧Enhancement layer
4‧‧‧熱源 4‧‧‧heat source
5‧‧‧承載板 5‧‧‧Bearing plate
51‧‧‧穿孔 51‧‧‧Perforation
6‧‧‧螺絲 6‧‧‧screw
Claims (19)
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TW108116273A TWI687643B (en) | 2019-05-10 | 2019-05-10 | Vapor chamber |
US16/818,244 US20200355445A1 (en) | 2019-05-10 | 2020-03-13 | Vapor chamber |
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TW108116273A TWI687643B (en) | 2019-05-10 | 2019-05-10 | Vapor chamber |
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TWI687643B true TWI687643B (en) | 2020-03-11 |
TW202041823A TW202041823A (en) | 2020-11-16 |
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JP6934093B1 (en) * | 2020-07-13 | 2021-09-08 | レノボ・シンガポール・プライベート・リミテッド | Electronic equipment and cooling modules |
JP2023043486A (en) * | 2021-09-16 | 2023-03-29 | レノボ・シンガポール・プライベート・リミテッド | Electronic apparatus |
TWI823693B (en) * | 2022-11-30 | 2023-11-21 | 訊凱國際股份有限公司 | Vapor chamber |
TWI834586B (en) * | 2023-08-22 | 2024-03-01 | 一詮精密工業股份有限公司 | Vapor chamber with vertical locking structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101505579A (en) * | 2008-02-05 | 2009-08-12 | 台达电子工业股份有限公司 | Heat radiation module and support member thereof |
TWM505790U (en) * | 2015-01-20 | 2015-07-21 | Chaun Choung Technology Corp | Isothermal plate fastening structure |
TWM522332U (en) * | 2016-01-29 | 2016-05-21 | Taiwan Microloops Corp | Dual material heat spreader and upper shell member thereof |
JP2018115813A (en) * | 2017-01-18 | 2018-07-26 | 大日本印刷株式会社 | Vapor chamber, metal sheet assembly for vapor chamber, and manufacturing method of vapor chamber |
TWI649528B (en) * | 2017-03-13 | 2019-02-01 | 謝基生 | Diffusion method of small area cold surface and its flat cold plate |
Family Cites Families (1)
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US5864466A (en) * | 1994-07-19 | 1999-01-26 | Remsburg; Ralph | Thermosyphon-powered jet-impingement cooling device |
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- 2019-05-10 TW TW108116273A patent/TWI687643B/en active
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2020
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101505579A (en) * | 2008-02-05 | 2009-08-12 | 台达电子工业股份有限公司 | Heat radiation module and support member thereof |
TWM505790U (en) * | 2015-01-20 | 2015-07-21 | Chaun Choung Technology Corp | Isothermal plate fastening structure |
TWM522332U (en) * | 2016-01-29 | 2016-05-21 | Taiwan Microloops Corp | Dual material heat spreader and upper shell member thereof |
JP2018115813A (en) * | 2017-01-18 | 2018-07-26 | 大日本印刷株式会社 | Vapor chamber, metal sheet assembly for vapor chamber, and manufacturing method of vapor chamber |
TWI649528B (en) * | 2017-03-13 | 2019-02-01 | 謝基生 | Diffusion method of small area cold surface and its flat cold plate |
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US20200355445A1 (en) | 2020-11-12 |
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