CN211601670U - Temperature equalizing plate structure - Google Patents
Temperature equalizing plate structure Download PDFInfo
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- CN211601670U CN211601670U CN201922489494.5U CN201922489494U CN211601670U CN 211601670 U CN211601670 U CN 211601670U CN 201922489494 U CN201922489494 U CN 201922489494U CN 211601670 U CN211601670 U CN 211601670U
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Abstract
The utility model provides a temperature-uniforming plate structure contains: a first plate body and a second plate body which are thinned through mechanical processing, wherein the first plate body is provided with a first side, a second side and an opening; the second plate body is provided with a third side and a fourth side, the first plate body and the second plate body are correspondingly covered to jointly define an airtight cavity, and a working liquid is filled in the airtight cavity; a heat conducting block is arranged corresponding to the opening and provided with a first surface and a second surface; the first capillary structure layer is arranged on the first side of the first plate body; and a second capillary structure layer formed on the second surface of the heat conducting block, wherein the first and second plate bodies can be complemented by the heat conducting block when the overall structural strength and flatness are insufficient due to thinning.
Description
Technical Field
The utility model relates to a temperature-uniforming plate structure especially indicates a temperature-uniforming plate structure of temperature-uniforming plate structural strength after multiplicable slimming.
Background
The temperature equalizing plate is a common heat transfer element and has a rapid heat conduction effect, and the temperature equalizing plate is also widely applied to various heat dissipation fields.
In the prior art, with the thinning or miniaturization of various electronic devices or apparatuses, the space for arranging electronic elements inside is also narrowed, so the space for arranging heat dissipation and heat conduction elements inside is also extremely limited, therefore, the heat dissipation and heat conduction elements must be thinned or miniaturized along with the thinning or miniaturization of the electronic devices, for a thinned temperature equalization plate, in the years of the technical field, the thinned temperature equalization plate needs to be realized, the volume and the thickness of each component of the temperature equalization plate whole must be thinned one by one, the thickness of the capillary structures of the upper plate body, the lower plate body and the inside is included, the height of the inner cavity of the temperature equalization plate after edge sealing is completed after superposition is also reduced (reduced), the mechanical strength of the plate body is influenced after the thinned upper plate body and the lower plate body of the temperature equalization plate are reduced and thinned along with the thickness, and the conditions of deformation, even the extremely small extrusion collision deformation, the breakage and the like are easily generated.
In addition, after the plate body or the pipe body is thinned by machining, the whole structure of the material becomes thin after the material is stretched and extended, the degree of remolding is limited, the supporting degree and the structural strength are reduced, excessive remolding cannot be realized, or bending is easy to break or break, so that poor sealing degree is caused, defective products are generated, and the contact strength is insufficient.
Therefore, the thinned temperature equalizing plate has the following disadvantages:
1. the whole plate becomes thinner and lighter, but the strength becomes worse.
2. The bosses are not easily stretched or stamped.
3. The strength and the flatness of the formed boss are extremely poor.
4. The thinner thickness of the boss can not be used to manufacture the capillary structure (groove) by machining and cutting the pin.
5. The substrate thickness becomes thin and the relative chamber becomes large, but the overall structural strength becomes poor.
How to improve the mechanical strength of the thinned vapor chamber, which is the first important goal of the skilled person.
SUMMERY OF THE UTILITY MODEL
Accordingly, in order to effectively solve the above problems, the present invention provides a temperature equalization plate structure that has excellent mechanical strength even after being thinned.
In order to achieve the above object, the present invention provides a vapor chamber structure, which comprises:
a first plate body and a second plate body which are thinned through mechanical processing, wherein the first plate body is provided with a first side, a second side and an opening; the second plate body is provided with a third side and a fourth side, the first plate body and the second plate body are correspondingly covered to jointly define an airtight chamber, and a working liquid is filled in the airtight chamber;
a heat conducting block, which is arranged corresponding to the opening and is provided with a first surface and a second surface;
the first capillary structure layer is arranged on the first side of the first plate body;
and the first capillary structure layer and the second capillary structure layer are mutually connected or disconnected.
The samming plate structure, wherein: the first plate body is provided with a convex part, the convex part is formed by protruding the first side to the second side, the opening is correspondingly arranged on the convex part, the convex part forms a pit on the first side, and the heat conducting block is cut to be even or lower than the pit.
The samming plate structure, wherein: the first capillary structure layer and the second capillary structure layer are any one of sintered powder, a grid body, grooves and a fiber body.
The samming plate structure, wherein: the heat conducting block, the first plate body and the second plate body are made of any one of gold, silver, iron, copper, aluminum, stainless steel, copper alloy, aluminum alloy, titanium alloy, commercial pure titanium and ceramic.
The samming plate structure, wherein: the first plate body and the second plate body are arranged in the airtight cavity, and the first plate body and the second plate body are mutually overlapped.
The samming plate structure, wherein: the third capillary structure is any one of sintered powder, a mesh body, and a fiber body.
The samming plate structure, wherein: the heat conducting block and the first plate body are combined in any one of welding, tight fitting and bonding.
The samming plate structure, wherein: the heat conducting block is attached to the surface of the convex part and corresponds to the opening.
The samming plate structure, wherein: the heat conduction block is embedded in the opening on the convex part.
The samming plate structure, wherein: the heat conduction block is embedded in the opening.
The structural strength of the first plate body and the second plate body after being thinned through secondary stretching or stamping can be maintained through the arrangement of the heat conducting block, and the first plate body does not lose the structural strength due to thinning after stretching.
Drawings
Fig. 1 is an exploded perspective view of a first embodiment of the vapor chamber structure of the present invention;
FIG. 2 is a sectional view of the first embodiment of the vapor chamber structure of the present invention;
FIG. 3 is a sectional view of a second embodiment of the vapor chamber structure of the present invention;
FIG. 4 is a sectional view of a third embodiment of the vapor chamber structure of the present invention;
FIG. 5 is an exploded cross-sectional view of a fourth embodiment of the vapor chamber structure of the present invention;
fig. 6 is a combined cross-sectional view of a fifth embodiment of the vapor chamber structure of the present invention.
Description of reference numerals: a first plate body 11; a first side 111; a second side 112; an opening 113; a second plate body 12; a third side 121; a fourth side 122; a heat-conducting block 13; a first face 131; a second face 132; a first capillary structure layer 14; a second capillary structure layer 15; a gas-tight chamber 16; a working liquid 17; a convex portion 18; a third capillary structure layer 19.
Detailed Description
The above objects, together with the structure and functional characteristics of the invention, will be best understood from the following description of the preferred embodiments when read in connection with the accompanying drawings.
Please refer to fig. 1 and fig. 2, which are three-dimensional exploded and assembled sectional views illustrating a first embodiment of a vapor chamber structure of the present invention, as shown in the drawings, the vapor chamber structure of the present invention comprises: a first plate body 11 and a second plate body 12, a heat conducting block 13, a first capillary structure layer 14 and a second capillary structure layer 15 which are thinned through mechanical processing;
the first board 11 has a first side 111, a second side 112 and an opening 113, the first side 111 and the second side 112 are respectively disposed on the upper and lower sides of the first board 11, and the opening 113 is respectively communicated with the first side 111 and the second side 112.
The heat conducting block 13 is disposed corresponding to the opening 113, the heat conducting block 13 has a first surface 131 and a second surface 132, the heat conducting block 13 and the first plate 11 are combined by any one of welding, tight fitting, bonding, gluing, screwing or clamping, the area size of the heat conducting block 13 is larger than that of the opening 113 and is attached to the second side 112 surface of the first plate 11 (i.e. the second side 112 surface near the peripheral side of the opening 113), the first plate 11 is disposed with the first capillary structure layer 14 disposed on the first side 111 of the first plate 11 corresponding to the opening 113, the second surface 132 of the heat conducting block 13 is disposed with the second capillary structure layer 15, and the first and second capillary structure layers 14 and 15 can be connected or disconnected.
The first capillary structure layer 14 is disposed on the first side 111 of the first plate 11; the second capillary structure layer 14 is formed on the second surface 132 of the heat conducting block 13.
The first and second capillary structure layers 14 and 15 are any one of sintered powder, a mesh body, grooves and a fiber body.
The heat conducting block 13 and the first and second plate bodies 11, 12 are made of any one of gold, silver, iron, copper, aluminum, stainless steel, copper alloy, aluminum alloy, titanium alloy, commercially pure titanium, and ceramic, and the first and second plate bodies 11, 12 and the heat conducting block 13 may be made of the same material or different materials.
The second plate 12 has a third side 121 and a fourth side 122, the first and second plates 121, 122 are covered correspondingly to define an airtight chamber 16, and filled with a working fluid 17 to form the uniform temperature plate structure of the present invention.
Please refer to fig. 3, which is a combined cross-sectional view of a second embodiment of the temperature equalizing plate structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the difference between this embodiment and the first embodiment lies in that the area size of the heat conducting block 13 is smaller than or equal to the area of the opening, the embodiment selects to embed (clamp and tightly fit) the heat conducting block 13 in the opening 113 (see fig. 1 and 2), the first plate 11 is provided with the first capillary structure layer 14 disposed on the first side 111 of the first plate 11, the second surface 132 of the heat conducting block 13 is provided with the second capillary structure layer 15, and the first and second capillary structure layers 14 and 15 are connected or disconnected.
Please refer to fig. 4, which is a combined cross-sectional view of a third embodiment of the temperature equalizing plate structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the difference between this embodiment and the first embodiment is that this embodiment further includes a third capillary structure layer 19, the third capillary structure layer 19 is disposed in the airtight chamber 16 and on the first and second plate bodies 11 and 12, and the third capillary structure layer 19 is any one of sintered powder, a mesh body, and a fiber body.
Please refer to fig. 5, which is an exploded cross-sectional view of a fourth embodiment of the temperature equalizing plate structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, and therefore will not be described herein, but the difference between this embodiment and the first embodiment is that the first plate 11 has a protrusion 18, the protrusion 18 is formed by protruding from the first side 111 to the second side 112, the opening 113 is correspondingly formed on the protrusion 18, the protrusion 18 forms a concave on the first side 111, the heat conducting block 13 is cut to be equal to or lower than the concave pit, the heat conducting block 13 is attached to the surface of the convex part 18 and corresponds to the opening 113, the first plate body 11 is provided with the first capillary structure layer 14 disposed on the first side 111 of the first plate body 11, the second capillary structure layer 15 is disposed on the second surface 132 of the heat conducting block 13, and the first and second capillary structure layers 14 and 15 are connected to each other.
Please refer to fig. 6, which is a combined cross-sectional view of a fifth embodiment of the temperature equalizing plate structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the fourth embodiment, and therefore will not be described herein again, but the difference between this embodiment and the second embodiment is that the heat conducting block 13 is embedded in the opening 113 on the protruding portion 18.
The scheme mainly aims to ensure that when the temperature-equalizing plate is thinned or a thinner plate body is selected as a basic plate body of the temperature-equalizing plate, the plate body can be subjected to plastic forming processing such as mechanical processing, extension, drawing or rolling, and the like, so that the plate body can be limited in plastic deformation, for example, a boss contacted with a heating source is extended.
Referring to fig. 1 to 6, the present application proposes to provide an opening 113 penetrating through the first plate 11 on the first plate 11, and to provide a heat conduction block 13 by attaching or embedding, and to reinforce the mechanical strength of the first plate 11 through the heat conduction block 13, and to provide the second capillary structure layer 15 on the second surface 132 of the heat conduction block 13 opposite to the airtight chamber 16, and the second capillary structure layer 15 is directly connected to the first capillary structure layer 14 of the first plate 11, so as to increase the heat conduction effect and the vapor-liquid circulation effect, and further, when the unit volume is not changed, the first and second plates 11, 12 are thinned by mechanical processing, so as to increase the space of the internal airtight chamber, thereby increasing the vapor-liquid circulation efficiency, and the heat conduction block 13 enhances the structural strength of the thinned first plate 11, in addition, when the first and second plate bodies 11 and 12 are thinned and the overall structural strength and flatness are insufficient, the heat conduction block 13 can be used for compensation.
Claims (10)
1. A vapor chamber structure, comprising:
a first plate body and a second plate body which are thinned through mechanical processing, wherein the first plate body is provided with a first side, a second side and an opening; the second plate body is provided with a third side and a fourth side, the first plate body and the second plate body are correspondingly covered to jointly define an airtight chamber, and a working liquid is filled in the airtight chamber;
a heat conducting block, which is arranged corresponding to the opening and is provided with a first surface and a second surface;
the first capillary structure layer is arranged on the first side of the first plate body;
and the first capillary structure layer and the second capillary structure layer are mutually connected or disconnected.
2. The vapor plate structure of claim 1, wherein: the first plate body is provided with a convex part, the convex part is formed by protruding the first side to the second side, the opening is correspondingly arranged on the convex part, the convex part forms a pit on the first side, and the heat conducting block is cut to be even or lower than the pit.
3. The vapor plate structure of claim 1, wherein: the first capillary structure layer and the second capillary structure layer are any one of sintered powder, a grid body, grooves and a fiber body.
4. The vapor plate structure of claim 1, wherein: the heat conducting block, the first plate body and the second plate body are made of any one of gold, silver, iron, copper, aluminum, stainless steel, copper alloy, aluminum alloy, titanium alloy, commercial pure titanium and ceramic.
5. The vapor plate structure of claim 1, wherein: the first plate body and the second plate body are arranged in the airtight cavity, and the first plate body and the second plate body are mutually overlapped.
6. The vapor plate structure of claim 5, wherein: the third capillary structure is any one of sintered powder, a mesh body, and a fiber body.
7. The vapor plate structure of claim 1, wherein: the heat conducting block and the first plate body are combined in any one of welding, tight fitting and bonding.
8. The vapor plate structure of claim 2, wherein: the heat conducting block is attached to the surface of the convex part and corresponds to the opening.
9. The vapor plate structure of claim 2, wherein: the heat conduction block is embedded in the opening on the convex part.
10. The vapor plate structure of claim 1, wherein: the heat conduction block is embedded in the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922489494.5U CN211601670U (en) | 2019-12-30 | 2019-12-30 | Temperature equalizing plate structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922489494.5U CN211601670U (en) | 2019-12-30 | 2019-12-30 | Temperature equalizing plate structure |
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| CN211601670U true CN211601670U (en) | 2020-09-29 |
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| CN201922489494.5U Active CN211601670U (en) | 2019-12-30 | 2019-12-30 | Temperature equalizing plate structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111059946A (en) * | 2019-12-30 | 2020-04-24 | 深圳兴奇宏科技有限公司 | Temperature equalizing plate structure |
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- 2019-12-30 CN CN201922489494.5U patent/CN211601670U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111059946A (en) * | 2019-12-30 | 2020-04-24 | 深圳兴奇宏科技有限公司 | Temperature equalizing plate structure |
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