CN113038797B - Electronic device - Google Patents
Electronic device Download PDFInfo
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- CN113038797B CN113038797B CN202110272342.9A CN202110272342A CN113038797B CN 113038797 B CN113038797 B CN 113038797B CN 202110272342 A CN202110272342 A CN 202110272342A CN 113038797 B CN113038797 B CN 113038797B
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- heat dissipation
- board
- sub
- electronic device
- dissipation area
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
Abstract
The application discloses electronic equipment relates to electronic equipment technical field. The electronic device specifically includes: a middle frame and a soaking plate; the middle frame is provided with heat dissipation holes; the vapor chamber is provided with a first heat dissipation area and a second heat dissipation area, at least part of the first heat dissipation area is arranged around the second heat dissipation area, the first heat dissipation area is connected with the middle frame, the second heat dissipation area is arranged in the heat dissipation hole, and the second heat dissipation area is provided with a first groove for accommodating an electronic device; the thickness of the soaking plate corresponding to the first heat dissipation area is smaller than that of the soaking plate corresponding to the second heat dissipation area. In the embodiment of the application, the thickness of the electronic equipment is reduced, the electronic equipment is lighter and thinner, the heat dissipation area of the heat dissipation plate is increased, and the heat dissipation capacity of the electronic equipment is improved.
Description
Technical Field
The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.
Background
With the rapid development of electronic technology, electronic devices have become indispensable tools in people's daily life. In the process of using the electronic equipment, the electronic equipment often generates heat, and once the heat cannot be quickly dissipated, the performance of the electronic equipment is affected, so that devices such as a soaking plate and the like are usually arranged in the electronic equipment to improve the heat dissipation capacity of the electronic equipment.
In the related art, the heat spreader is generally provided in the inner frame of the electronic apparatus. Meanwhile, in order to avoid the increase of the thickness of the electronic equipment caused by the overlapping of the soaking plate and the flexible circuit board connected with the main board, the soaking plate and the flexible circuit board are usually arranged in the groove of the middle frame of the mobile phone in a side-by-side tiled mode. However, this results in poor heat dissipation from the heat spreader plate and thus poor heat dissipation from the electronic device.
Disclosure of Invention
The embodiment of the application aims to provide electronic equipment, and the problem that the radiating capacity of a soaking plate is poor and further the radiating capacity of the electronic equipment is poor can be solved.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides an electronic device, where the electronic device includes: a middle frame and a soaking plate;
the middle frame is provided with heat dissipation holes;
the vapor chamber is provided with a first heat dissipation area and a second heat dissipation area, at least part of the first heat dissipation area is arranged around the second heat dissipation area, the first heat dissipation area is connected with the middle frame, the second heat dissipation area is arranged in the heat dissipation hole, and the second heat dissipation area is provided with a first groove for accommodating an electronic device;
the thickness of the soaking plate corresponding to the first heat dissipation area is smaller than that of the soaking plate corresponding to the second heat dissipation area.
In this application embodiment, be equipped with first heat dissipation district and second heat dissipation district through the heating panel, the thickness of first heat dissipation district is less than the thickness of second heat dissipation district, be equivalent to promptly and set up the heating panel to the structure of not uniform thickness to set up the first recess that is used for holding electronic device (for example, flexible circuit board etc.) in the second heat dissipation district, thereby both reduced electronic equipment's thickness, made electronic equipment more frivolous, promoted the heat radiating area of heating panel again, and then promoted electronic equipment's heat-sinking capability.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 isbase:Sub>A schematic cross-sectional view taken along the line A-A in FIG. 1;
FIG. 3 is an enlarged view of the location C of FIG. 2;
FIG. 4 is an enlarged view of position D of FIG. 2;
FIG. 5 is a schematic view of the vapor chamber according to the embodiment of the present invention;
FIG. 6 is a second schematic structural view of the vapor chamber according to the embodiment of the present application;
FIG. 7 is a schematic cross-sectional view taken along line B-B of FIG. 6;
FIG. 8 is an enlarged view of the location E in FIG. 7;
fig. 9 is an enlarged view of the position F in fig. 7.
Description of reference numerals:
10: a middle frame; 20: a vapor chamber; 30: an electronic device; 101: heat dissipation holes; 21: a first heat dissipation area; 22: a second heat dissipation area; 23: a first groove; 201: a first sub-board; 202: a second sub-board; 2011: a connecting wall; 2012: a daughter board body; 2013: a second groove; 2021: a third groove; 203: a receiving cavity.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be implemented in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The electronic device provided in the embodiments of the present application is described in detail with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
The electronic device according to the embodiment of the application can be a smart phone, a computer, a multimedia player, an electronic reader, a wearable device, a camera and the like.
Referring to fig. 1, a schematic structural diagram of an electronic device according to an embodiment of the present application is shown. Referring to fig. 2,base:Sub>A schematic cross-sectional view alongbase:Sub>A-base:Sub>A in fig. 1 is shown. Referring to fig. 3, an enlarged view of the C position in fig. 2 is shown. Referring to fig. 4, an enlarged view of position D in fig. 2 is shown.
In this embodiment, the electronic device may specifically include: a middle frame 10 and a soaking plate 20; the middle frame 10 is provided with heat dissipation holes 101; the vapor chamber 20 is provided with a first heat dissipation area 21 and a second heat dissipation area 22, at least part of the first heat dissipation area 21 is arranged around the second heat dissipation area 22, the first heat dissipation area 21 is connected with the middle frame 10, the second heat dissipation area 22 is arranged in the heat dissipation hole 101, and the second heat dissipation area 22 is provided with a first groove 23 for accommodating the electronic device 30; the thickness of the soaking plate 20 corresponding to the first heat dissipation area 21 is smaller than that of the soaking plate 20 corresponding to the second heat dissipation area 22.
In a part of the electronic device, the middle frame 10 may be understood as a housing of the electronic device or a part of the housing, which is not limited in the embodiments of the present application.
In the embodiment of the present application, the shape of the soaking plate 20 can be set according to the specific layout in the electronic device, and since the soaking plate 20 is of a structure similar to a plate shape, the shape of the soaking plate 20 can be easily set to be an irregular structure (i.e., an irregular shape such as a non-rectangular shape and a triangular shape) by machining, so that the area of the soaking plate 20 can be effectively increased, and the heat dissipation capability of the electronic device can be further improved.
In the embodiment of the present application, the thickness of the soaking plate 20 corresponding to the first heat dissipation region 21 is smaller than the thickness of the soaking plate 20 corresponding to the second heat dissipation region 22, that is, it is equivalent to arranging the soaking plate 20 in a non-uniform thickness structure with thin edges. In practical application, the thickness of the first heat dissipation area 21 connected with the middle frame 10 is reduced, so that the thickness of the connection part of the soaking plate 20 and the middle frame 10 can be effectively reduced, and the whole thickness of the electronic device can be reduced.
In practical application, in order to avoid the problem that the thickness of the electronic device is increased due to the fact that the middle frame 10 and the soaking plate 20 are directly stacked, in the embodiment of the application, the heat dissipation hole 101 is formed in the middle frame 10, so that the second heat dissipation area 22 is arranged in the heat dissipation hole 101, the thickness of the middle frame 10 and the soaking plate 20 which are stacked can be effectively reduced, and the thickness of the electronic device is further reduced.
In the embodiment of the present application, in order to simplify the connection difficulty between the middle frame 10 and the soaking plate 20 and improve the connection strength between the middle frame 10 and the soaking plate 20, the heat dissipation hole 101 may be provided as a step hole, and the first heat dissipation region 21 is fixed on the step surface of the step hole by means of bonding, welding, or the like. As shown in fig. 4, the first heat dissipation area 21 may be overlapped on the middle frame 10, and the first heat dissipation area 21 and the middle frame 10 are connected by bonding, welding, or the like. Thus, since the first heat dissipation portion 21 has a sufficient contact area with the center frame 10, the strength between the first heat dissipation portion 21 and the center frame 10 is strong regardless of bonding or welding.
In the embodiment of the present application, the first heat dissipation area 21 is at least partially disposed around the circumference of the second heat dissipation area 22, that is, the first heat dissipation area 21 is disposed along the circumferential edge of the second heat dissipation area 22. In practical applications, the first heat dissipation region 21 is thinner than the second heat dissipation region 22, but can also dissipate heat effectively. The first heat dissipation area 21 may be disposed as an annular area around the circumferential edge of the middle frame 10 according to the internal space of the electronic device, and may also be formed as an "L" shape, a "U" shape, or disposed on two opposite sides of the middle frame 10.
In the embodiment of the present application, the thickness of the first heat dissipation area 21 is smaller than the thickness of the second heat dissipation area 22, so that the thickness of the first heat dissipation area 21 connected to the middle frame 10 can be effectively reduced, the space volume occupied by the soaking plate 20 in the middle frame 10 is saved, and a larger setting space is reserved for other devices in the electronic apparatus.
In the embodiment of the present application, bonding may be understood as bonding by glue or double-sided adhesive, and a person skilled in the art may select and set the bonding according to actual situations, which is not limited in the embodiment of the present application.
In the embodiment of the present application, the soaking plate 20 may be made of a high-strength material, including but not limited to a stainless steel plate, a zirconium alloy plate, a nickel alloy plate, a titanium alloy plate, a chromium alloy plate, and the like. In practical applications, the soaking plate 20 can be formed by any one or more of the above manners in combination, so that the strength of the soaking plate 20 is improved, the deformation resistance of the soaking plate 20 is improved, and the problem that the soaking plate 20 is easy to deform to cause heat dissipation performance failure is solved. In the embodiment of the application, vapor chamber 20 adopts the not thickness structural design that varies to still adopt the preparation of above-mentioned high strength material, consequently, center 10 need not to carry out the large tracts of land to vapor chamber 20 and supports, thereby can set up the second heat dissipation district 22 that thickness is thicker, intensity is stronger on vapor chamber 20 in the louvre 101 of center 10, just so can effectively avoid the increase of electronic equipment thickness.
In the embodiment of the present application, the first groove 23 for accommodating the electronic device 30 is disposed in the second heat dissipation area 22, so that the internal structure of the electronic device is more compact, the size of the electronic device is effectively reduced, and the electronic device is lighter. Specifically, the electronic device 30 may include, but is not limited to, a flexible circuit board, a main board, a sub-board, and the like, and in the embodiment of the present application, the flexible circuit board is only used as an example for explanation, and other references may be performed.
In this application embodiment, set up the first recess 23 that holds electronic device 30 on second heat dissipation district 22 to in setting up electronic device 30 such as flexible circuit board in first recess 23, compare in the mode that traditional soaking board 20 and flexible circuit board tiled side by side, in this application embodiment, the area of soaking board 20 can effectively increase, and then the heat-sinking capability of soaking board 20 can effectively promote.
Referring to fig. 5, one of the structural schematic diagrams of the soaking plate according to the embodiment of the present application is shown. Referring to fig. 6, a second schematic structural view of the soaking plate according to the embodiment of the present application is shown. Referring to fig. 7, a schematic cross-sectional structure along the direction B-B in fig. 6 is shown. Referring to fig. 8, an enlarged view of the position E in fig. 7 is shown. Referring to fig. 9, an enlarged view of position F in fig. 7 is shown.
In the embodiment of the present application, the soaking plate 20 may specifically include: a first sub-board 201 and a second sub-board 202; the first daughter board 201 comprises a connecting wall 2011 and a daughter board main body 2012, wherein the connecting wall 2011 is at least partially arranged around the daughter board main body 2012, the thickness of the connecting wall 2011 is smaller than that of the daughter board main body 2012, and the connecting wall 2011 forms the first heat dissipation area 21 and is connected with the middle frame 10; the second daughter board 202 covers the daughter board main body 2012 to form a second heat dissipation area 22, and is disposed in the heat dissipation hole 101; the first groove 23 is disposed on a side of the second sub-board 202 away from the first sub-board 201.
In the embodiment of the present application, the first sub-board 201 and the second sub-board 202 of the vapor chamber 20 may be sealed by edge welding, so that the connection strength between the first sub-board 201 and the second sub-board 202 is increased. It can be understood that the first heat dissipation area 21 is formed by the connecting wall 2011, that is, the connecting wall 2011 is connected to the middle frame 10, and since the thickness of the connecting wall 2011 is smaller, the thickness of the connecting portion between the connecting wall 2011 and the middle frame 10 can also be effectively reduced, and the thickness of the electronic device can be thinner and thinner.
In this embodiment, the second daughter board 202 is covered on the daughter board main body 2012 of the first daughter board 201, and since the thickness of the daughter board main body 2012 is greater than the thickness of the connecting wall 2011, the area corresponding to the daughter board main body 2012 can be the same as the area of the second daughter board 202, and the daughter board main body 2012 can play a role in guiding and limiting the installation of the second daughter board 202, so that the second daughter board 202 can be more easily assembled and fixed with the first daughter board 201.
In practical applications, the connecting wall 2011 and the daughter board main body 2012 can be integrally formed, so as to improve the strength of the first daughter board 201. The thickness of the connection wall 2011 is smaller than the thickness of the daughter board main body 2012, that is, it is equivalent to the structure in which the first daughter board 201 is provided with a thin edge and a thick middle. The area of the first sub-board 201 corresponding to the connecting wall 2011 may be thinned by etching or numerical control machining (CNC machining). In practical applications, because CNC machining accuracy is higher and is suitable for various shapes and sizes, the shape design of the connecting wall 2011 can be more flexible and machining accuracy can be higher by CNC machining. Alternatively, the thickness of the connection wall 2011 corresponding to the first sub-board 201 may be any value from 0.1mm to 0.2mm.
In the embodiment of the present application, the connection wall 2011 or the first heat dissipation area 21 and the middle frame 10 may be connected by glue, double-sided tape or welding, which is simple, convenient and efficient.
In the embodiment of the present application, the first groove 23 is disposed on the side of the second sub-board 202 away from the first sub-board 201, and the first groove 23 may penetrate through the second sub-board 202, or the first groove 23 extends from the second sub-board 202 to the first sub-board 201. In the actual processing process, the area of the second sub-board 202 corresponding to the first groove 23 can be directly cut off, and because the second sub-board 202 is overlapped with the first sub-board 201, the first groove 23 is a groove formed by using the first sub-board 201 as a groove bottom and using the second sub-board 202 as a groove wall, and the depth of the first groove 23 is equal to the thickness of the second sub-board 202. Thus, the first groove 23 is simpler to machine, lower in cost and higher in precision.
In the embodiment of the present application, in order to enable the first recess 23 to accommodate more devices including, but not limited to, a flexible circuit board, a thinning design may be further performed in a region of the first sub-board 201 corresponding to the first recess 23, that is, the first recess 23 extends from the second sub-board 202 to the first sub-board 201. In practical applications, the area of the first sub-board 201 corresponding to the first groove 23 may be realized by etching or CNC machining. Specifically, the thickness of the first sub-board 201 corresponding to the area of the first groove 23 may be set to be 0.15mm to 0.25mm, so that the volume of the first groove 23 is larger, which is beneficial to the assembly of the flexible circuit board in the first groove 23.
In practical applications, the area between the first groove 23 and the connecting wall 2011 of the soaking plate 20 may be hollowed to improve the heat dissipation performance of the soaking plate 20. Specifically, a second groove 2013 is further formed in the side surface of the daughter board main body 2012, which is close to the second daughter board 202; the second groove 2013 and the second sub-board 202 form a receiving cavity 203, and the receiving cavity 203 is used for receiving a capillary heat dissipation structure to improve heat dissipation capability. In the embodiment of the application, the capillary heat dissipation structures such as the copper wire mesh and the copper wire are arranged in the accommodating cavity 203, so that the heat dissipation performance of the vapor chamber 20 can be effectively improved. Since the thickness of the daughter board main body 2012 of the first daughter board 201 is thick, the processing of the second groove 2013 may be simple, and may be implemented by etching or CNC processing.
In the embodiment of the present application, in order to further increase the volume of the accommodating chamber 203, a third groove 2021 may be further provided on the second sub-board 202 at a position opposite to the second groove 2013, and the third groove 2021 is communicated with the second groove 2013 to form the accommodating chamber 203. In practical application, the accommodating cavity 203 has a larger volume, can accommodate more capillary heat dissipation structures such as copper meshes or copper wires, and the like, can make the heat conduction performance of the vapor chamber 20 better, and is more favorable for heat dissipation of electronic equipment.
In summary, the electronic device according to the embodiment of the present application at least includes the following advantages:
in this application embodiment, be equipped with first radiating area and second radiating area through the heating panel, the thickness of first radiating area is less than the thickness of second radiating area, set up the heating panel into the structure of not uniform thickness promptly, and set up the first recess that is used for holding electronic device (for example, flexible circuit board etc.) in the second radiating area, thereby both reduced electronic equipment's thickness, make electronic equipment more frivolous, the heat radiating area of heating panel has been promoted again, and then electronic equipment's heat-sinking capability has been promoted.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. An electronic device, characterized in that the electronic device comprises: a middle frame and a soaking plate;
the middle frame is provided with heat dissipation holes;
the vapor chamber is provided with a first heat dissipation area and a second heat dissipation area, at least part of the first heat dissipation area is arranged around the second heat dissipation area, the first heat dissipation area is connected with the middle frame, the second heat dissipation area is arranged in the heat dissipation hole, and the second heat dissipation area is provided with a first groove for accommodating an electronic device;
the thickness of the soaking plate corresponding to the first heat dissipation area is smaller than that of the soaking plate corresponding to the second heat dissipation area;
the vapor chamber includes: a first sub-board and a second sub-board; the first sub-board comprises a connecting wall and a sub-board main body, thinning processing is realized on the first sub-board corresponding to the area of the connecting wall in an etching or numerical control processing mode, the second sub-board is covered on the sub-board main body, and the thickness of the connecting wall is smaller than that of the sub-board main body;
the first groove is arranged on the side face, far away from the first sub-board, of the second sub-board, penetrates through the second sub-board, or extends from the second sub-board to the first sub-board; and the area of the first sub-plate corresponding to the first groove is thinned by etching or numerical control machining.
2. The electronic device of claim 1,
at least part of the connecting wall of the first sub-board is arranged around the sub-board main body, and the connecting wall forms the first heat dissipation area and is connected with the middle frame;
the second sub-board forms the second heat dissipation area and is arranged in the heat dissipation hole.
3. The electronic device of claim 2, wherein the connecting wall is of unitary construction with the daughter board body.
4. The electronic device of claim 2, wherein a second recess is further disposed on a side of the daughter board body adjacent to the second daughter board;
the second groove and the second sub-board form an accommodating cavity, and the accommodating cavity is used for accommodating a heat dissipation structure.
5. The electronic device as claimed in claim 4, wherein a third recess is formed in the second sub-board at a position opposite to the second recess, and the third recess communicates with the second recess to form the receiving cavity.
6. The electronic device according to claim 2, wherein the thickness of the connecting wall is 0.1mm to 0.2mm.
7. The electronic device of claim 2, wherein the thickness of the first sub-board corresponding to the first groove area is 0.15mm to 0.25mm.
8. The electronic device of claim 1, wherein the heat dissipation hole is a stepped hole, and the first heat dissipation area is bonded or welded to a stepped surface of the stepped hole.
9. The electronic apparatus according to claim 1, wherein the soaking plate is at least one of a stainless steel plate, a zirconium alloy plate, a nickel alloy plate, a titanium alloy plate, and a chromium alloy plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110272342.9A CN113038797B (en) | 2021-03-12 | 2021-03-12 | Electronic device |
| PCT/CN2022/080264 WO2022188847A1 (en) | 2021-03-12 | 2022-03-11 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110272342.9A CN113038797B (en) | 2021-03-12 | 2021-03-12 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113038797A CN113038797A (en) | 2021-06-25 |
| CN113038797B true CN113038797B (en) | 2023-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110272342.9A Active CN113038797B (en) | 2021-03-12 | 2021-03-12 | Electronic device |
Country Status (2)
| Country | Link |
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| CN (1) | CN113038797B (en) |
| WO (1) | WO2022188847A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113038797B (en) * | 2021-03-12 | 2023-04-07 | 维沃移动通信有限公司 | Electronic device |
| CN113939121B (en) * | 2021-10-08 | 2023-07-18 | 展讯通信（深圳）有限公司 | Electronic equipment shell with heat dissipation function and heat dissipation control method |
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| CN105338783A (en) * | 2014-07-01 | 2016-02-17 | 联想(北京)有限公司 | Heat dissipation device for electronic equipment |
| TW201636560A (en) * | 2015-04-01 | 2016-10-16 | Hwa Tek Material Co Ltd | Uniformly heating plate and manufacturing method thereof |
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| CN201623955U (en) * | 2010-03-09 | 2010-11-03 | 索士亚科技股份有限公司 | Thinned temperature equalizing plate and heat dissipating module with same |
| CN202364516U (en) * | 2011-11-04 | 2012-08-01 | 迈萪科技股份有限公司 | Temperature balancing device |
| CN203859973U (en) * | 2014-04-28 | 2014-10-01 | 游本俊 | Temperature equalization plate with good heat conducting effect |
| CN110740611A (en) * | 2018-07-20 | 2020-01-31 | 深圳富泰宏精密工业有限公司 | Radiator and electronic device with same |
| CN209563090U (en) * | 2018-11-30 | 2019-10-29 | 维沃移动通信有限公司 | Terminal device |
| CN110035643A (en) * | 2019-05-23 | 2019-07-19 | Oppo广东移动通信有限公司 | Radiating subassembly and electronic equipment |
| CN110167322B (en) * | 2019-06-12 | 2021-02-02 | Oppo广东移动通信有限公司 | Shell and electronic equipment |
| CN210183778U (en) * | 2019-06-18 | 2020-03-24 | Oppo广东移动通信有限公司 | Shell and electronic equipment |
| CN211378609U (en) * | 2020-01-02 | 2020-08-28 | 阳光电源股份有限公司 | Temperature equalizing plate, radiator and electrical equipment |
| CN210670224U (en) * | 2020-02-11 | 2020-06-02 | Oppo广东移动通信有限公司 | Middle frame and electronic equipment |
| CN113038797B (en) * | 2021-03-12 | 2023-04-07 | 维沃移动通信有限公司 | Electronic device |
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2021
- 2021-03-12 CN CN202110272342.9A patent/CN113038797B/en active Active
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2022
- 2022-03-11 WO PCT/CN2022/080264 patent/WO2022188847A1/en active Application Filing
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| DE202014101861U1 (en) * | 2013-06-10 | 2014-05-23 | Chin-Juh Wong | Heat-dissipating, cooling protective cover |
| JP3192556U (en) * | 2013-06-10 | 2014-08-21 | 金柱 翁 | Thermal cooling protection cover |
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| TW201636560A (en) * | 2015-04-01 | 2016-10-16 | Hwa Tek Material Co Ltd | Uniformly heating plate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
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| WO2022188847A1 (en) | 2022-09-15 |
| CN113038797A (en) | 2021-06-25 |
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