CN217563854U - PCB with groove - Google Patents

PCB with groove Download PDF

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Publication number
CN217563854U
CN217563854U CN202220950396.6U CN202220950396U CN217563854U CN 217563854 U CN217563854 U CN 217563854U CN 202220950396 U CN202220950396 U CN 202220950396U CN 217563854 U CN217563854 U CN 217563854U
Authority
CN
China
Prior art keywords
component
pcb
groove
pcb board
metal ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220950396.6U
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Chinese (zh)
Inventor
张淼
鞠青印
何彬
罗文�
吉加良
廖志敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MFS TECHNOLOGY (HUNAN) CO LTD
Original Assignee
MFS TECHNOLOGY (HUNAN) CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN202220950396.6U priority Critical patent/CN217563854U/en
Application granted granted Critical
Publication of CN217563854U publication Critical patent/CN217563854U/en
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Abstract

The utility model provides a PCB board with a groove, which comprises a PCB board, a metal ring, a first component and a second component, wherein the metal ring and the first component are both arranged on the PCB board, and the inner ring of the metal ring is provided with a groove; the second component is connected to the PCB through the groove; under the processing precision of the control groove, the utility model can realize the high-precision and high-efficiency surface mounting device, occupies less area of the PCB and is more suitable for the installation of the components on the compact PCB; the quantity of becket can set up a plurality ofly, and first component setting is in a plurality of becket region for enclosing, installs the back in the recess on the becket that corresponds with the second component, can form the overlapping of covering of first component and second component, and the area occupied of PCB board has further been saved to this mode, covers superimposed mode through the device simultaneously, enables components and parts and obtains better output effect.

Description

PCB with groove
Technical Field
The utility model relates to a novel PCB technical field, in particular to PCB board with recess.
Background
As mobile terminal electronic products represented by mobile phones are emerging, the requirements on the space structure of such electronic products are higher and higher. The surface of a conventional PCB (Printed Circuit Board) is covered with ink or is a solder surface, and if an optical device with a non-metallic pin, such as an IR (infrared) lamp cover, needs to be fixed by a through hole and a screw. The Through Hole + screw mode needs a larger Hole min1.0mmNPTH (Non mounting Through Hole) and machining efficiency is low, installation efficiency is low, precision is poor, and the area of the PCB board needs to be large.
SUMMERY OF THE UTILITY MODEL
The utility model provides a PCB board with recess to at the bottom of solving the installation effectiveness among the prior art, the precision is poor and occupy the big technical problem of area of PCB board.
In order to achieve the above purpose, the technical scheme of the utility model is realized as follows:
the utility model provides a PCB board with recess, include: the device comprises a PCB, a metal ring, a first component and a second component; the metal ring and the first component are arranged on the PCB, a groove is formed in the inner side of the metal ring, and the pin of the second component is fixed in the groove.
Further, the number of the metal rings is multiple.
Further, the first component is arranged in an area enclosed by the plurality of metal rings.
Further, the depth of the groove is 0.1-0.228 mm.
Further, the surface of the metal ring is provided with a gold-plated treatment layer or a silver-plated treatment layer or a nickel-palladium-gold treatment layer or a tin-plated treatment layer or an OSP treatment layer.
Further, the number of the metal rings is greater than or equal to the number of pins of the second component.
Furthermore, the pins of the second component are fixed in the grooves in a glue bonding mode.
Further, the pins of the second component are fixed in the grooves by welding.
The utility model has the advantages that:
1. the second component can be accurately installed by accurately arranging the metal rings;
2. the pins of the second component are bonded or welded in the grooves of the metal ring, so that the second component can be fixed, the mounting efficiency of the second component is improved, meanwhile, the occupied area of the PCB can be saved through the design, holes are not needed, and the PCB is more suitable for a PCB with a compact structure;
3. the quantity of becket can set up a plurality ofly, and first component setting is in a plurality of becket region for enclosing, installs the back in the recess on the becket that corresponds with the second component, can form the overlapping of covering of first component and second component, and the area occupied of PCB board has further been saved to this mode, covers superimposed mode through the device simultaneously, enables components and parts and obtains better output effect.
Drawings
Fig. 1 is a schematic front structural view of the present invention;
FIG. 2 is a diagram illustrating a distribution of a plurality of metal rings on a PCB;
description of reference numerals:
1. a PCB board; 2. a metal ring; 3. a groove; 4. a first component.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. In the description of the present invention, the related orientation or positional relationship is based on the orientation or positional relationship shown in fig. 1, wherein "up" and "down" refer to the up-down direction of fig. 1. It is to be understood that such directional terms are merely for convenience in describing the present invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must be in a particular orientation, constructed and operative in a particular orientation, and therefore should not be taken as limiting the invention.
In addition, the descriptions of "first", "second", etc. in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number or order of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Referring to fig. a PCB board with a groove is provided in an embodiment of the present application, including: the PCB comprises a PCB board 1, a metal ring 2, a first component 4 and a second component; the metal ring 2 and the first component 4 are arranged on the PCB board 1, a groove 3 is formed on the inner side of the metal ring 2, and pins of the second component are fixed in the groove 3.
In this embodiment, the leads of the first component 4 and the second component may be metal leads, such as: conventional electronic components, may also be non-metallic pins, such as: the shape of the groove 3 can be various shapes such as a circle, a rectangle and the like, when the second component is installed, the pins of the second component are firstly respectively inserted into the corresponding grooves 3 and fixed, and the fixing modes at the position are various, such as glue bonding, welding and the like.
In some other embodiments, the number of the metal rings 2 is plural; first component 4 sets up a plurality of in the region that the becket 2 enclosed, install the second component back in the recess 3 on the becket 2 that corresponds, can form the overlapping of covering of first component 4 and second component, the area occupied of PCB board 1 has further been saved to this mode, covers superimposed mode through components and parts simultaneously, enables components and parts and obtains better output effect, if: the remote controller is installed in such a way, so that the remote control range of the remote controller can be improved.
In some other embodiments, the depth of the groove 3 is between 0.1 and 0.228 mm.
In some other embodiments, the material of the metal ring 2 is preferably copper, which can increase the conductivity of the metal ring 2.
In some other embodiments, the metal ring 2 is processed by PCB surface treatment except HASL (Hot Air cooler Level), the surface layer of the metal ring 2 has a gold or silver or nickel-palladium or tin treatment layer or OSP (Organic Solder resist film) treatment layer, etc.;
in some other embodiments, the number of the metal rings 2 is greater than or equal to the number of the pins of the second component, and the pins of each second component can be fixed in the grooves 3 on different metal rings 2, so that the second component is fixed more firmly.
In some other embodiments, the groove 3 is filled with glue, the pins of the second component extend into the groove 3, and the pins of the second component are adhered to the PCB board 1 through the glue.
In some other embodiments, the groove 3 is filled with solder paste, the pins of the second component extend into the groove 3, and the pins of the second component are connected to the PCB board 1 by soldering.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the scope of the present invention. Moreover, the technical solutions of the present invention between the various embodiments can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are combined and contradictory or cannot be realized, it should be considered that the combination of the technical solutions does not exist, and the present invention is not within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (8)

1. A PCB board with a groove, comprising: the PCB comprises a PCB (1), a metal ring (2), a first component (4) and a second component; the metal ring (2) and the first component (4) are arranged on the PCB (1), a groove (3) is formed in the inner side of the metal ring (2), and pins of the second component are fixed in the groove (3).
2. The grooved PCB of claim 1, wherein the metal ring (2) is plural in number.
3. -a PCB board with grooves according to claim 2, characterised in that the first component (4) is arranged in the area enclosed by a plurality of metal rings (2).
4. -a PCB board with grooves according to claim 1, characterised in that the depth of the grooves (3) is between 0.1 and 0.228 mm.
5. The grooved PCB of claim 1, wherein the surface of the metal ring (2) has a gold-plated or silver-plated or nickel-palladium-gold-plated or tin-plated or OSP-plated layer.
6. -PCB board with grooves according to claim 1, characterised in that the number of metal rings (2) is greater than or equal to the number of pins of the second component.
7. -PCB board with grooves according to any of the claims 1 to 6, characterized in that the pins of the second component are fixed in the grooves (3) by means of glue bonding.
8. -PCB board with grooves according to any of the claims 1 to 6, characterised in that the pins of the second component are fixed in the grooves (3) by means of soldering.
CN202220950396.6U 2022-04-22 2022-04-22 PCB with groove Active CN217563854U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220950396.6U CN217563854U (en) 2022-04-22 2022-04-22 PCB with groove

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220950396.6U CN217563854U (en) 2022-04-22 2022-04-22 PCB with groove

Publications (1)

Publication Number Publication Date
CN217563854U true CN217563854U (en) 2022-10-11

Family

ID=83472805

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220950396.6U Active CN217563854U (en) 2022-04-22 2022-04-22 PCB with groove

Country Status (1)

Country Link
CN (1) CN217563854U (en)

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