CN214852419U - Electronic apparatus and vapor chamber - Google Patents

Abstract

The utility model relates to an electronic equipment and vacuum cavity soaking plate, stress when this electronic equipment can alleviate vacuum cavity soaking plate or base plate flexure. An electronic device (100) is provided with: a substrate (110); a heating element (111) disposed on the upper surface (110a) of the substrate; a shield cover (112) which is arranged to surround the periphery of the heating element and has an opening (112 b); and a vacuum chamber vapor chamber (120) that faces the upper surface of the substrate and is directly or indirectly joined to the heat generating element via the opening, the vacuum chamber vapor chamber comprising: a chamber body section (123) having a housing (123a), a working fluid sealed in the housing, and a wick disposed in the housing; and a shield part (121) disposed on the housing, the shield cover being fitted to the shield part.

Description

Electronic apparatus and vapor chamber

Technical Field

The utility model relates to an electronic equipment. The utility model also relates to a vacuum cavity soaking plate.

Background

In recent years, the amount of heat generated by high integration and high performance of devices has increased. In addition, as the miniaturization of products progresses and the heat generation density increases, a countermeasure against heat dissipation becomes important. This situation is particularly significant in the field of mobile terminals such as smart phones, tablet computers, and the like. Though a graphite sheet or the like is often used as the heat countermeasure component, the amount of heat transport is not sufficient, and therefore, the use of various heat countermeasure components has been studied. Among them, the use of a Vapor Chamber (Vapor Chamber) as a planar heat pipe has been studied because heat can be diffused very efficiently.

The vapor chamber is a member in which a proper amount of working fluid that is easily volatilized is sealed in a flat closed container. The working fluid is vaporized by heat from the heat source, moves in the internal space, and then returns to the liquid by releasing heat to the outside. The working liquid returned to the liquid is again transported to the vicinity of the heat source through a capillary structure called a wick, and is vaporized again. By repeating this process, the vapor chamber can autonomously operate without external power, and two-dimensionally and high-speed heat diffusion can be performed by utilizing the latent heat of evaporation and the latent heat of condensation of the working fluid.

Patent document 1 describes a vacuum chamber vapor chamber for cooling a device to be cooled mounted on a substrate, the vacuum chamber vapor chamber including: a chamber body having a sealed space in which a working fluid is sealed, and a mounting surface mounted on a surface of the device to be cooled opposite to a surface mounted on the substrate, and receiving heat of the device to be cooled; and a heat conduction unit for conducting heat from the chamber body to the substrate. Patent document 1 also describes that the thermally conductive portion is formed continuously over the entire circumference, and is electrically connected to the ground electrode to have a ground potential, thereby providing the thermally conductive portion with a function as a magnetic shield.

Patent document 2 describes a surface-mount electronic component including a circuit board, a relatively high heat-generating electronic component element mounted on an upper surface of the circuit board, a plurality of terminal electrodes formed on a lower surface of the circuit board and bonded to a motherboard, and a shield case covering an upper surface of the circuit board, wherein an inner surface of the shield case is bonded to the relatively high heat-generating electronic component element, and a metal support is bonded between the upper surface of the circuit board and the inner surface of the shield case.

Patent document 1: japanese patent laid-open publication No. 2018-162949

Patent document 2: japanese patent laid-open publication No. 2003-283168

In the vapor chamber described in patent document 1, heat of the chamber body is conducted to the substrate through the heat conduction portion, and the heat of the chamber body can be released to the substrate. Therefore, the heat transport efficiency of the vapor chamber can be improved.

In the surface-mount electronic component described in patent document 2, heat generated from an electronic component element having a large heat generation property is conducted to the shield case, and a part of the heat of the shield case is conducted to the metal support. Therefore, the heat conduction path is dispersed and the heat conduction path is lengthened, so that the thermal resistance of the electronic component element having a large heat generation property can be reduced.

However, when the vapor chamber or the substrate described in patent document 1 is bent, the stress applied to the heat conduction unit is not relaxed and is accumulated in the heat conduction unit. Similarly, when the shield case or the circuit board described in patent document 2 is bent, stress applied to the metal support is not relaxed and is accumulated in the metal support.

SUMMERY OF THE UTILITY MODEL

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic device capable of relaxing stress when a vapor chamber or a substrate in a vacuum chamber is bent. Further, it is an object of the present invention to provide a vapor chamber used for the electronic device.

The utility model discloses an electronic equipment possesses: a substrate; a heating element disposed on an upper surface of the substrate; a shield cover configured to surround the periphery of the heating element and having an opening; and a vacuum chamber vapor chamber that faces the upper surface of the substrate and is directly or indirectly joined to the heat generating element via the opening, the vacuum chamber vapor chamber comprising: a chamber body section having a casing, a working fluid sealed in the casing, and a wick disposed in the casing; and a shield part disposed on the housing, the shield part being fitted to the shield cover.

The utility model discloses a vacuum cavity soaking plate possesses: a chamber body section having a casing, a working fluid sealed in the casing, and a wick disposed in the casing; and a shield part disposed on the housing, the shield part having a fitting unit.

According to the present invention, an electronic apparatus capable of relaxing stress when a vacuum chamber vapor chamber or a substrate is deflected can be provided.

Drawings

Fig. 1A is a cross-sectional view schematically showing an example of an electronic device according to a first embodiment of the present invention. FIG. 1B is a top view of the electronic device shown in FIG. 1A as sectioned at section line X-X'.

Fig. 2A is a cross-sectional view schematically showing an example of an electronic device according to a second embodiment of the present invention. Fig. 2B is a top view of the electronic device shown in fig. 2A as sectioned at section line X-X'.

Fig. 3 is a cross-sectional view schematically showing an example of an electronic device according to a third embodiment of the present invention.

Fig. 4A is a cross-sectional view schematically showing an example of an electronic device according to a fourth embodiment of the present invention. Fig. 4B is a cross-sectional view schematically showing another example of an electronic device according to a fourth embodiment of the present invention.

Fig. 5A is a cross-sectional view schematically showing an example of an electronic device according to a fifth embodiment of the present invention. Fig. 5B is a cross-sectional view schematically showing another example of an electronic device according to a fifth embodiment of the present invention.

Fig. 6A is a cross-sectional view schematically showing an example of an electronic device according to a sixth embodiment of the present invention. Fig. 6B is a top view of the electronic device shown in fig. 6A as sectioned at section line X-X'.

Fig. 7 is a cross-sectional view schematically showing an example of an electronic device according to a seventh embodiment of the present invention.

Fig. 8 is a cross-sectional view schematically showing an example of an electronic device according to an eighth embodiment of the present invention.

Fig. 9 is a cross-sectional view schematically showing an example of an electronic device of a comparative system.

Fig. 10A and 10B are perspective views showing examples of the shape of the shield case.

Fig. 11A is a perspective view showing an example of the shape of the first portion constituting the shield portion. Fig. 11B is a perspective view showing an example of the shape of the second portion constituting the shield portion.

Fig. 12A and 12B are perspective views showing an example of a method of manufacturing a shield part constituting an electronic device according to a sixth embodiment of the present invention.

Description of reference numerals: 100. 200, 300, 400 ', 500', 600, 700, 800, 900 … electronic device, length of a first part of a 1021al … shielding part, thickness of a first part of a 1021at … shielding part, length of a second part of a 1021bl … shielding part, thickness of a second part of a 1021bt … shielding part, upper surface of a 110, 210, 310, 410, 510, 610, 710, 810, 910 … substrate, 110a … substrate, 111, 211, 311, 411, 511, 611, 711, 811, 911 … heat generating element, 112, 212, 312, 412, 512, 612, 712, 812, 912 … shielding cover, protrusion of 112a, 512a … shielding cover, opening of 112b … shielding cover, outer surface of 112d … shielding cover, sidewall of 112e … shielding cover, sidewall of 112f … shielding cover, top surface of 112, 213, 313, 413, 513, 613, 925, 120, 925 …, 120, 813, 220 heat conductive resin, 320, 520. 620, 720, 820, 920 … vapor chamber heat spreader, 121, 221, 321, 421, 521, 621, 721, 821 … shield, 121a, 221a, 421a, 521a, 621a, 1021a … shield, 121B, 221B, 521B, 621B, 1021B … shield, 121c, 221c, 521c, 621c … shield, 121e … shield inner surface, 122, 222, 322, 422, 522, 622, 722, 822, 922 … heat conductive bonding material, 123, 223, 323, 423, 523, 623, 723, 823 … chamber body, 123a, 823c … housing, 221e … top surface, 321a … first metal layer, 321B … second metal layer, 412c … shield front end, 421d …, 521d … gap, 521e c … resin bend portion …, 35611 a 6, … d 611, 18B, 27 a, … B, 3673727 convex portion, 823b … second sheet, 823d … working fluid, 823e … wick, 823f … outer edge, 823g … pillar, 823h … vapor flow path, 924 … copper plate, P1, P2, Q1, Q2 … line, T … vacuum chamber heat spreader thickness direction, S … vacuum chamber heat spreader surface direction.

Detailed Description

The electronic device and the vapor chamber of the present invention will be described below.

The present invention is not limited to the following configuration, and can be applied with appropriate modifications without departing from the scope of the present invention. In addition, a configuration in which two or more preferred configurations of the present invention described below are combined is also the present invention.

The embodiments described below are examples, and it is needless to say that substitution or combination of the components described in the different embodiments can be performed. In the second embodiment and thereafter, the description of the same matters as in the first embodiment is omitted, and only the differences will be described. In particular, the same operational effects brought about by the same configurations are not mentioned in turn in accordance with each embodiment.

In the following description, the embodiments are simply referred to as "electronic device of the present invention" and "vacuum chamber vapor chamber of the present invention" without particularly distinguishing them.

[ first embodiment ]

Fig. 1A is a cross-sectional view schematically showing an example of an electronic device according to a first embodiment of the present invention. FIG. 1B is a top view of the electronic device shown in FIG. 1A as sectioned at section line X-X'.

The electronic device 100 shown in fig. 1A and 1B includes: the heat generating device includes a substrate 110, a heat generating element 111 disposed on an upper surface 110a of the substrate 110, a shield case 112 having an opening 112b and disposed so as to surround the periphery of the heat generating element 111, and a vacuum chamber heat equalizing plate 120 facing the upper surface 110a of the substrate 110 and bonded to the heat generating element 111 through the opening 112b of the shield case 112 by a thermally conductive resin 113. The chamber soaking plate 120 includes a chamber body 123 and a shield portion 121, and the shield portion 121 is bonded to the substrate 110 side of the case 123a of the chamber body 123 with a thermally conductive bonding material 122. The shield 121 is fitted to the shield case 112.

In the electronic device according to the first embodiment of the present invention, the shield portion is fitted to the shield case, whereby stress at the time of bending the vapor chamber or the substrate can be effectively relaxed.

In the electronic apparatus according to the first embodiment of the present invention, as shown in fig. 1A, the heat generating element and the vacuum chamber vapor chamber are joined via the opening of the shield case, and the shield portion is fitted to the shield case, whereby heat can be efficiently conducted. This is because the distance between the heat generating element as the heat source and the vapor chamber of the vacuum chamber can be made close. Further, this is because the heat generating element can be bonded to the vacuum chamber soaking plate without passing through the shield case, and the heat transferred from the lower portion of the heat generating element to the substrate can be conducted to the vacuum chamber soaking plate through the shield case and the shield portion. For example, as in the electronic apparatus 900 of the comparative system shown in fig. 9, in a configuration in which the copper plate 924 is bonded to the vacuum chamber soaking plate 920 using the thermally conductive bonding material 922, the thermally conductive resin 925 is disposed between the shield case 912 and the copper plate 924 disposed on the substrate 910, and the thermally conductive resin 913 is sandwiched between the shield case 912 and the heat generating element 911, the shield case 912 is interposed between the heat generating element 911 and the vacuum chamber soaking plate 920, and both surfaces between the heat generating element 913 and the shield case 912 and between the shield case 912 and the vacuum chamber soaking plate 920 are bonded by the thermally conductive resins 911 and 925, so heat cannot be diffused efficiently.

In the electronic apparatus according to the first embodiment of the present invention, the vapor chamber also functions as the top surface of the shield case, and has excellent shielding properties.

In the embodiment shown in fig. 1A, the shielding part 121 has a first portion 121A extending in the thickness direction T of the vacuum chamber soaking plate and a second portion 121b extending in the surface direction S of the vacuum chamber soaking plate, and the hole 121c of the shielding part 121 is fitted to the protrusion 112a of the shield cover 112. As shown in fig. 1A, at least a part of the inner surface 121e of the shield preferably covers at least a part of the outer surface 112d of the shield cover 112.

In the present specification, unless otherwise specified, the term "thickness direction" refers to the thickness direction of the vapor chamber in the vacuum chamber. In addition, the term "plane direction" refers to the plane direction of the vapor chamber in the vacuum chamber.

In the electronic device according to the first aspect of the present invention, the shield portion is fitted to the shield cover. Preferably, the shield portion has a hole, a recess, a projection, or other fitting means. The size of the fitting unit is not particularly limited, and may be set as appropriate according to the size of the electronic device, the shield portion, and the like.

In the electronic device according to the first aspect of the present invention, it is preferable that the shield portion has a hole or a recess, and the projection of the shield cover is fitted into the hole or the recess, or the shield portion has a projection, and the hole or the recess of the shield cover is fitted into the projection.

The number of the fitting units of the shield portion is not limited to one or two or more, but for example, when a frame is formed continuously with the plane direction as the circumferential direction in the shield portion and the shape of the frame is a quadrangle when viewed from the top surface, it is preferable that one or more fitting units are provided on each side of the quadrangle, and it is preferable that the shield portion has four or more fitting units.

In the electronic apparatus according to the first aspect of the present invention, it is preferable that the shield portion has a first portion extending in the thickness direction of the vapor chamber in the vacuum chamber. The shield portion may be constituted by only the first portion, or may be constituted by the first portion and other portions such as a second portion and a third portion described later.

The first portion may be not only completely parallel to the thickness direction but also at an angle of a certain degree with respect to the thickness direction, for example, at an angle of 30 ° or less with respect to the thickness direction. The first portion preferably has an angle of 15 ° or less, more preferably 10 ° or less, further preferably 5 ° or less, and particularly preferably 1 ° or less with respect to the thickness direction.

Since the shield portion is intended to be fitted to the shield cover, the first portion preferably forms a frame continuous in the circumferential direction so as to be in contact with and surround the outer surface of the shield cover (see fig. 11A). The shape of the frame formed at the first portion when viewed from the vapor chamber side of the vacuum chamber may be circular or square, and is not limited. For example, the shape of the shield case may be determined as appropriate.

The length of the first portion in the thickness direction T (for example, 1021al in fig. 11A) may be appropriately set according to the type, size, and the like of the electronic device, and may be, for example, 0.10mm to 50mm, or 1.0mm to 10 mm.

The thickness of the first portion in the surface direction S (for example, 1021at in fig. 11A) may be set as appropriate, and may be, for example, 0.01mm to 10mm, or 0.10mm to 1.0 mm.

In the present specification, the term "frame" means a shape that is continuous in the circumferential direction and has a ring shape, or a shape in which a portion in the circumferential direction has a defect portion. The length of the defective portion in the circumferential direction is preferably 25% or less, more preferably 20% or less, still more preferably 15% or less, and particularly preferably 10% or less.

In the electronic apparatus according to the first embodiment of the present invention, it is preferable that the shield portion has a second portion extending in the direction of the vacuum chamber vapor chamber plane from the side of the vacuum chamber vapor chamber side (for example, the upper side in fig. 1) of the first portion, in addition to the first portion. Preferably, the second portion is connected to the chamber body.

The second portion may be not only completely parallel to the plane direction but also at an angle of a certain degree with respect to the plane direction, for example, at an angle of 30 ° or less with respect to the plane direction. The second portion preferably has an angle of 15 ° or less, more preferably 10 ° or less, further preferably 5 ° or less, and particularly preferably 1 ° or less with respect to the plane direction.

As shown in fig. 11B, the second portion preferably forms a frame.

The length of the second portion in the surface direction S (for example, 1021bl in fig. 11B) may be appropriately set according to the type, size, and the like of the electronic device, and may be, for example, 0.10mm to 100mm, or 1.0mm to 10 mm.

The thickness of the second portion in the thickness direction T (1021 bt in fig. 11B) may be set as appropriate, and may be, for example, 0.01mm to 10mm, or 0.10mm to 1.0 mm.

As shown in fig. 1A, the shielding portion preferably has a first portion extending in the thickness direction and a second portion extending in the vacuum chamber soaking plate surface direction from the vacuum chamber soaking plate side of the first portion, and more preferably the shielding portion has a first portion extending in the thickness direction and forming a frame continuous with the surface direction as the circumferential direction and a second portion extending in the frame inner direction from the vacuum chamber soaking plate side of the first portion to the first portion and forming a frame continuous with the surface direction as the circumferential direction.

As shown in fig. 1A, the electronic device of the present invention preferably: the shield portion has a first portion extending in the thickness direction of the vacuum chamber vapor chamber, and the first portion has a hole penetrating in the surface direction of the vacuum chamber vapor chamber or a recess recessed in the surface direction of the vacuum chamber vapor chamber. As described above, the shield portion has the hole or the recess, and the shield cover has the projection, so that the shield cover and the shield portion can be fitted to each other.

However, the electronic device of the present invention may be configured such that the shield portion is fitted to the shield case, and the fitting unit is not limited to the above. For example, the shield portion may have a projection, the shield cover may have a hole or a recess, and the projection of the shield portion may be fitted in the hole or the recess of the shield cover. The fitting means may be any means capable of fitting the shield portion and the shield cover, and various fitting means may be used. The shield portion is preferably fitted so as to surround the outer surface of the shield case, but may be fitted so as to surround the outer surface of the shield portion.

In the electronic apparatus of the present invention, the shield part may be formed integrally with the chamber body part or may be formed separately from the chamber body part, but from the viewpoint of productivity, it is preferably formed separately as shown in fig. 1A.

When the shield part is formed separately from the chamber body part, it is preferable that the shield part is bonded to the chamber body part with a thermally conductive bonding material as shown in fig. 1A. The thermally conductive bonding material preferably has a thermal conductivity of 10W/mK or more, more preferably 50W/mK or more, and still more preferably 100W/mK or more.

The thermally conductive bonding material is preferably a material having a small elastic modulus, and for example, the elastic modulus is preferably 50GPa or less, more preferably 1GPa or less. By using a thermally conductive bonding material having a small elastic modulus, the stress at the time of bending can be relaxed more efficiently.

The thermally conductive bonding material is preferably solder, a filler-containing adhesive, or a brazing material, and is preferably solder or a filler-containing adhesive.

Further, in the case where the shield portion and the chamber main body portion are integrally formed, a thermally conductive bonding material for bonding the shield portion and the chamber main body portion is not required.

The shielding portion may be made of a material capable of shielding electromagnetic waves, and is not particularly limited, but is preferably made of metal, and is preferably made of metal having high thermal conductivity. Specifically, the thermal conductivity is preferably 10W/mK or more, more preferably 50W/mK or more, and still more preferably 100W/mK or more. By using a metal, particularly a metal having a high thermal conductivity as described above, heat can be more efficiently conducted.

The metal constituting the shield portion is preferably a metal having a high tensile strength, and preferably a metal having a tensile strength higher than 300 MPa. By using a metal having a high tensile strength as described above, the stress at the time of bending can be effectively relaxed.

The metal constituting the shield portion is preferably copper, aluminum, stainless steel, titanium, or an alloy thereof, more preferably aluminum, copper, or a copper alloy, and still more preferably copper or a copper alloy. The copper alloy may be phosphor bronze, corson copper, titanium copper, or zinc white copper, but is not limited thereto.

The shield cover is disposed so as to surround the periphery of the heating element and has an opening. Preferably, the shield case is bonded to or embedded in the upper surface of the substrate.

Preferably, the shield case has a side wall portion extending in the thickness direction, and a substrate side (lower side in fig. 1A) of the side wall portion is joined to the substrate or embedded in the substrate. Preferably, the side wall portion of the shield case is formed as a frame continuous in the circumferential direction, and has a shape in which the side surface of the heat generating element is surrounded by the side wall portion. As shown in fig. 1A, the outer surface of the frame formed by the side wall portion of the shield case is preferably in contact with the inner surface of the frame formed by the first portion of the shield portion.

Preferably, the shield case further includes a top surface portion (e.g., 112f in fig. 1A) on the side of the side wall portion closer to the vapor chamber of the vacuum chamber (upper side in fig. 1A), and the opening portion is formed in the top surface portion. Preferably, the top surface portion is a portion extending in a plane direction.

The shape of the opening of the shield case is not limited, and the heating element and the vapor chamber of the vacuum chamber may be joined through the opening. For example, the electronic device of the present invention may be square (see fig. 10A) or circular (see fig. 10B) when viewed from the upper surface side of the substrate. The shield case may have a plurality of openings, but usually one opening is used for bonding the heat spreader plate and the heating element in the vacuum chamber.

Preferably, the opening is formed so that the entire heat generating element can be viewed from the opening when viewed from the upper surface side of the substrate.

The electronic device of the present invention can efficiently diffuse heat generated from the heating element by joining the vacuum chamber vapor chamber and the heating element via the opening.

The shield cover is fitted to the shield portion. Preferably, the shield cover has a hole, a recess, a projection, and other fitting means.

In the electronic device according to the present invention, it is preferable that the shield cover has a protrusion, and the protrusion is fitted into a hole or a recess of the shield portion, or the shield cover has a hole or a recess, and the hole or the recess is fitted into a protrusion of the shield portion. The size of the fitting unit is not particularly limited, and may be set as appropriate according to the size of the electronic device, the shield case, or the like.

In the electronic device according to the first aspect of the present invention, it is preferable that the shield portion has a hole or a recess, and the projection of the shield case is fitted into the hole or the recess, or that the shield portion has a projection, and the hole or the recess of the shield case is fitted into the projection.

The number of the fitting units of the shield case is not limited to one or two or more, but for example, when the shield case is formed as a frame which is continuous with the plane direction as the circumferential direction and has a quadrangular shape when viewed from the upper surface, it is preferable that one or more fitting units are provided on each side of the quadrangular shape, and it is preferable that four or more fitting units are provided on the shield case.

The shield case is not particularly limited as long as it is made of a material capable of shielding electromagnetic waves, but is preferably made of metal. Examples of the metal constituting the shield case include stainless steel, copper, aluminum, and magnesium, but stainless steel or copper is particularly preferable, and copper is more preferable. The kind of stainless steel is not limited, and various stainless steels can be used.

The thermally conductive resin is not limited to a resin material having thermal conductivity.

In fig. 1A, the heating element 111 is indirectly bonded to the vacuum chamber vapor chamber via the heat conductive resin 113, but in the first embodiment of the present invention, the heating element may be directly bonded to the vacuum chamber vapor chamber, and in this case, the heat conductive resin is not required.

In the electronic apparatus shown in fig. 1A, the chamber body 123 includes a casing 123a, a working fluid (not shown) sealed in the casing 123a, and a wick (not shown) disposed in the casing 123 a. In the first embodiment, the vacuum chamber soaking plate may have the above-described configuration, and the configuration of a conventionally known vacuum chamber soaking plate may be used without limitation, and the conventionally known vacuum chamber soaking plate may be appropriately modified and used.

In the chamber main body portion, the configuration of the casing is not particularly limited, but may be configured by, for example, a first sheet and a second sheet facing each other with outer edges joined to each other, and a steam flow path formed of a hollow is usually provided. The arrangement of the working liquid and the liquid absorbing core is not limited as long as the working liquid and the liquid absorbing core can function as a vapor chamber of the vacuum chamber, but the liquid absorbing core is preferably arranged on the inner wall surface of at least one of the first sheet and the second sheet. Preferably, one or more than two pillars are disposed between the first sheet and the second sheet.

The shape of the housing is not particularly limited. For example, the planar shape of the case (the shape viewed from the upper side of the drawing in fig. 1A) may be a polygon such as a square or a triangle, a circle, an ellipse, a combination of these shapes, or the like.

The first sheet and the second sheet constituting the case may be overlapped so that the ends thereof coincide with each other, or may be overlapped so that the ends thereof are offset.

The material constituting the first sheet and the second sheet is not particularly limited as long as it has suitable properties for use as a vapor chamber in a vacuum chamber, for example, thermal conductivity, strength, flexibility, and the like. The material constituting the first sheet and the second sheet is preferably a metal, and examples thereof include copper, nickel, aluminum, magnesium, titanium, iron, and the like, or an alloy containing these as a main component. The material constituting the first sheet and the second sheet is particularly preferably copper or a copper alloy.

The material constituting the first sheet may be different from the material constituting the second sheet. For example, by using a material having high strength for the first sheet, stress applied to the case can be dispersed. Further, by making the materials of the two different, one function can be obtained by one sheet and the other function can be obtained by the other sheet. The above-mentioned function is not particularly limited, but examples thereof include a heat conduction function and an electromagnetic wave shielding function.

The thickness of the first sheet and the second sheet is not particularly limited, but if the first sheet and the second sheet are too thin, the strength of the case is reduced and deformation is likely to occur. Therefore, the thicknesses of the first sheet and the second sheet are preferably 20 μm or more, and more preferably 30 μm or more, respectively. On the other hand, if the first sheet and the second sheet are too thick, it becomes difficult to make the entire vacuum chamber vapor chamber thinner. Therefore, the thicknesses of the first sheet and the second sheet are preferably 200 μm or less, more preferably 150 μm or less, and still more preferably 100 μm or less, respectively. The thicknesses of the first sheet and the second sheet may be the same or different.

In the chamber main body portion, the thickness of the first sheet may be constant, or there may be a thick portion and a thin portion. Likewise, the thickness of the second sheet may be constant, or there may be thicker and thinner portions. Further, the second sheet of the portion not in contact with the stay may be recessed inward of the case.

The support column supports the first sheet and the second sheet from inside. By disposing the support in the casing, the casing can be suppressed from being deformed when the pressure inside the casing is reduced, when external pressure is applied from the outside of the casing, or the like. The support may be supported by being directly in contact with the first sheet or the second sheet, or may be supported by another member such as a wick. The support column may be integrated with the first sheet or the second sheet, and may be formed by etching the inner wall surface of the first sheet or the second sheet, for example.

The shape of the support is not particularly limited, but examples thereof include a cylindrical shape, a prismatic shape, a truncated cone shape, and a truncated pyramid shape.

The arrangement of the pillars is not particularly limited, but it is preferable to arrange the pillars uniformly, for example, in a lattice pattern so that the distance between the pillars is constant. By arranging the support columns uniformly, uniform strength can be ensured throughout the vapor chamber.

The working fluid may be one that can undergo a gas-liquid phase change in the environment inside the housing, and is not particularly limited, and water, alcohols, alternative freon, and the like may be used, for example. The working fluid is preferably an aqueous compound, more preferably water.

The wick is not particularly limited as long as it has a capillary structure that can move the working fluid by capillary force. The capillary structure of the wick may be a known structure used in a conventional vapor chamber. Examples of the capillary structure include a microstructure having irregularities such as pores, grooves, and projections, for example, a porous structure, a fibrous structure, a grooved structure, and a mesh structure. These capillary structures constitute liquid flow paths.

The material of the wick is not particularly limited, and for example, a metal porous film, a mesh, a nonwoven fabric, a sintered body, a porous body, or the like formed by etching or metal processing can be used. The mesh serving as a material of the wick may be made of, for example, a metal mesh, a resin mesh, or a surface-coated mesh thereof, and is preferably made of a copper mesh, a stainless steel (SUS) mesh, or a polyester mesh. The sintered body of the material to be the wick may be, for example, a porous sintered metal body or a porous sintered ceramic body, and is preferably a porous sintered body of copper or nickel. The porous body serving as a material of the liquid absorbing core may be, for example, a metal porous body, a ceramic porous body, a resin porous body, or the like.

The method of manufacturing the chamber body portion may be a method capable of obtaining the above-described configuration, and is not particularly limited. For example, the working fluid can be obtained by stacking a first sheet on which a wick is disposed and a second sheet on which a strut is disposed, bonding the sheets with an opening for sealing the working fluid left, placing the working fluid into the case from the opening, and then sealing the opening.

The method of joining the first sheet and the second sheet is not particularly limited, but examples thereof include laser welding, resistance welding, diffusion joining, brazing, TIG welding (tungsten-inert gas welding), ultrasonic joining, and resin sealing. Among these methods, laser welding, resistance welding, or brazing is preferable.

The chamber body and the shield portion may be formed integrally or separately, and in the case of forming integrally, the vacuum chamber vapor chamber can be obtained by joining a first sheet and a second sheet having a portion to be the shield portion. In the case of forming the chamber body portion separately, the shield portion can be bonded by the above-described thermally conductive bonding material after the chamber body portion is formed, thereby obtaining the vapor chamber.

The heating element is disposed on the upper surface of the substrate. The heat generating element may be an element that generates heat by operating the element, and examples thereof include, but are not limited to, a processor, an LED, a power amplifier, and a camera module.

The substrate is not particularly limited, and may be a flexible substrate or a rigid substrate. The substrate may be, for example, a printed circuit board composed of a flat substrate such as a glass epoxy substrate, a ceramic substrate, or a phenol paper substrate. The substrate may be a multilayer wiring board, and may be configured by a double-sided substrate, a multilayer substrate, a build-up substrate, or the like, but is not particularly limited.

The electronic device of the present invention is not limited to this, and examples thereof include a smartphone, a tablet terminal, a notebook computer, a game device, a wearable device, and a vehicle-mounted device.

[ second embodiment ]

In the electronic device according to the second aspect of the present invention, the first portion forms a frame that is continuous with a plane direction as a circumferential direction, the second portion forms a top surface of the frame formed by the first portion, and the shield portion is disposed so as to cover the opening of the shield case.

Fig. 2A is a cross-sectional view schematically showing an example of an electronic device according to a second embodiment of the present invention. Fig. 2B is a top view of the electronic device shown in fig. 2A as sectioned at section line X-X'.

In the electronic apparatus 200 shown in fig. 2A and 2B, the shield portion 221 includes a first portion 221a extending in the thickness direction T and forming a frame continuous with the surface direction S as a circumferential direction, and a second portion 221B extending in the surface direction S and forming a top surface 221e of the frame formed by the first portion 221 a. In the electronic apparatus 200, the first portion 221a forming the frame is arranged around the second portion 221b of the plane, and the first portion 221a and the second portion 221b form a recess arranged so as to cover the outer periphery of the shield cover 212. The shield portion 221 can function as a top surface of the shield cover 212 by covering the opening of the shield cover 212.

[ third embodiment ]

In an electronic device according to a third aspect of the present invention, the shield portion has a laminated structure including two or more metal layers. More preferably, the laminated structure includes a first metal layer of copper or a copper alloy or aluminum, and a second metal layer of stainless steel or nickel.

Fig. 3 is a cross-sectional view schematically showing an example of an electronic device according to a third embodiment of the present invention.

In the electronic apparatus 300 shown in fig. 3, the shield portion 321 has a laminated structure composed of a first metal layer 321A and a second metal layer 321B.

As shown in fig. 3, when the first metal layer is disposed on the shield case side and the second metal layer is disposed on the opposite side to the shield case, the first metal layer is preferably a layer of copper, a copper alloy, or aluminum, and the second metal layer is preferably a layer of stainless steel or nickel. In this way, the strength and thermal conductivity of the shield can be improved. Specifically, the first metal layer/the second metal layer may be made of copper/stainless steel, copper alloy/stainless steel, copper/nickel, or the like.

In the case where the shield part has a double-layer structure as shown in fig. 3, the thickness of the first metal layer may be 0.01mm to 5.0mm, and the thickness of the second metal layer may be 0.01mm to 5.0 mm.

Although the shield portion has a two-layer structure in fig. 3, the shield portion in the third embodiment may be formed of three or more metal layers. The number of layers is not limited, but is preferably ten or less, more preferably five or less, and further preferably three or less from the viewpoint of productivity.

The laminated structure can be produced by bonding a metal plate constituting the first metal layer and a metal plate constituting the second metal layer, or by plating the metal plates.

[ fourth embodiment ]

In the electronic apparatus according to the fourth embodiment of the present invention, the first portion extends in the thickness direction of the vacuum chamber vapor chamber, and forms a frame that is continuous in the circumferential direction with respect to the surface direction of the vacuum chamber vapor chamber, and is bent in the outer direction of the frame.

Fig. 4A is a cross-sectional view schematically showing an example of an electronic device according to a fourth embodiment of the present invention.

In the electronic apparatus 400 shown in fig. 4A, the first portion 421a of the shield portion 421 is formed in a frame shape, and has a bent portion 421d bent in the outer direction of the frame. Preferably, the bent portion is present at a tip of the first portion opposite to the vapor chamber in the vacuum chamber. In this way, stress can be effectively relaxed when the vapor chamber or the substrate in the vacuum chamber is deflected.

In the electronic apparatus according to the fourth embodiment of the present invention, the front end of the shield case on the side of the vapor chamber of the vacuum chamber may be bent toward the heating element.

Fig. 4B is a cross-sectional view schematically showing another example of an electronic device according to a fourth embodiment of the present invention.

In the electronic apparatus 400' shown in fig. 4B, the front end 412c of the shield 412 on the vacuum chamber vapor chamber 420 side is bent toward the heat generating element 411 side. In this way, even when the vapor chamber or the substrate in the vacuum chamber is deflected, the stress can be effectively relaxed.

[ fifth embodiment ]

In the electronic apparatus according to the fifth aspect of the present invention, the shield portion has a first portion extending in the thickness direction of the vacuum chamber vapor chamber, the first portion has a hole penetrating in the plane direction of the vacuum chamber vapor chamber or a recess recessed in the plane direction of the vacuum chamber vapor chamber, the shield cover has a projection projecting in the plane direction, the projection is fitted into the hole or the recess, and a gap is provided between the projection and the hole or the recess.

Fig. 5A is a cross-sectional view schematically showing an example of an electronic device according to a fifth embodiment of the present invention.

In the electronic device 500 shown in fig. 5A, a hole 521c penetrating in the plane direction is formed in the first portion 521a of the shield 521, the shield cover 512 has a projection 512a projecting in the plane direction, and the projection 512a is fitted into the hole 521c of the shield. Further, a gap 521d is provided between the projection 512a and the hole 521 c. In this way, stress can be effectively relaxed when the vapor chamber or the substrate in the vacuum chamber is deflected.

In the electronic device according to the fifth embodiment of the present invention, it is also preferable that the gap has a resin.

Fig. 5B is a cross-sectional view schematically showing another example of an electronic device according to a fifth embodiment of the present invention.

In the electronic apparatus 500' shown in fig. 5B, a gap 521d between the hole 521c and the protrusion 512a has a resin 521 e. In this way, stress can be more effectively relaxed when the vapor chamber or the substrate in the vacuum chamber is deflected.

The resin is not particularly limited, but a resin having high flexibility is preferable, and examples thereof include silicon, epoxy resin, and polyurethane.

[ sixth embodiment ]

In the electronic device according to the sixth aspect of the present invention, the first portion extends in the thickness direction to form a frame continuous with the plane direction as the circumferential direction, the second portion extends from the vacuum chamber soaking plate side of the first portion toward the inner side direction of the frame formed at the first portion, and forms a frame continuous with the plane direction as the circumferential direction, the shielding portion further includes a third portion extending in the thickness direction from the inner peripheral portion of the frame formed at the second portion, and the third portion is in contact with the side surface of the heat generating element.

Fig. 6A is a cross-sectional view schematically showing an example of an electronic device according to a sixth embodiment of the present invention. Fig. 6B is a top view of the electronic device shown in fig. 6A as sectioned at section line X-X'.

In the electronic apparatus 600 shown in fig. 6A and 6B, the shield portion 621 includes a first portion 621a extending in the thickness direction and forming a frame continuous with the surface direction as the circumferential direction, a second portion 621B extending from the side of the vacuum chamber heat collecting plate of the first portion 621a (upper side in fig. 6A) toward the inside of the frame formed in the surface direction and the first portion 621a and forming a frame continuous with the surface direction as the circumferential direction, and a third portion 621d extending from the inner peripheral portion of the frame formed in the second portion 621B in the thickness direction. The third portion 621d is disposed in contact with the side surface 611a of the heat generating element 611, so that heat can be efficiently conducted from the heat generating element 611 to the heat equalizing plate 620 in the vacuum chamber.

The third portion may be not only completely parallel to the thickness direction but also at an angle of a certain degree with respect to the thickness direction, for example, at an angle of 30 ° or less with respect to the thickness direction. The third portion preferably has an angle of 15 ° or less, more preferably 10 ° or less, further preferably 5 ° or less, and particularly preferably 1 ° or less with respect to the thickness direction.

The third portion contacting the side surface of the heating element may be curved or bent. The shield portion may have one or two or more third portions, and in the case of a plurality of third portions, at least one of the third portions may be in contact with the side surface of the heat generating element. Of course, the heating element may be held by a plurality of third portions.

A method of manufacturing the shield part constituting the electronic device according to the sixth embodiment of the present invention is not particularly limited, but the shield part having the shape shown in fig. 12B can be easily manufactured by forming notches in lines P1 and P2 of the top surface of the cover-shaped shield part shown in fig. 12A and bending the same at lines Q1 and Q2, for example.

[ seventh embodiment ]

In an electronic device according to a seventh aspect of the present invention, the chamber body has one or two or more convex portions on the substrate side, and the shield portion is disposed on at least one of the convex portions. In the seventh embodiment, since the cavity main body portion has the convex portion, the hollow region inside the case can be enlarged, and therefore, the heat diffusion capability is excellent.

Fig. 7 is a cross-sectional view schematically showing an example of an electronic device according to a seventh embodiment of the present invention.

In the electronic apparatus 700 shown in fig. 7, the chamber main body 723 has a projection 723b, and a shield 721 is disposed on the projection. In fig. 7, the shield portion 721 is formed only by the first portion extending in the thickness direction, but the shape of the shield portion in the seventh embodiment is not limited thereto, and may be appropriately modified in addition to the shapes exemplified in the first to sixth embodiments. For example, the second portion may be provided extending in the planar direction from the vapor chamber side (upper side in fig. 7) of the first portion, or the third portion may be provided.

In the vacuum chamber soaking plate 720 of fig. 7, the shield portion 721 is disposed as a separate body on the convex portion 723b of the chamber main body portion 723, and the convex portion 723b and the shield portion 721 are joined by the thermally conductive joining material 722, but the shield portion 721 may be formed integrally with the chamber main body portion 723.

In a seventh embodiment of the present invention, the convex portion is formed integrally with the chamber body portion. The number of the projections may be one, or two or more. For example, eight or less may be used, or four or less may be used. From the viewpoint of productivity, one projection is preferable, and all the shielding portions are preferably arranged on one projection.

The height of the projection is not particularly limited, and may be appropriately set according to the type of electronic device, and may be, for example, 0.01mm or more and 1.0mm or less.

[ eighth embodiment ]

In an electronic apparatus according to an eighth embodiment of the present invention, the chamber main body includes: a housing formed of a first sheet and a second sheet opposed to each other and having outer edges joined to each other; the working fluid is sealed in the shell; a liquid absorbing core disposed on an inner wall surface of at least one of the first sheet and the second sheet; and a support column disposed between the first sheet and the second sheet to support the first sheet and the second sheet from inside. With the above configuration, heat can be more efficiently conducted.

Fig. 8 is a cross-sectional view schematically showing an example of an electronic device according to an eighth embodiment of the present invention.

In the electronic apparatus 800 shown in fig. 8, the chamber main body 823 includes: a case 823c made of a first sheet 823a and a second sheet 823b facing each other; working fluid 823d sealed in the case 823 c; and a wick 823e disposed on the inner wall surface of the first sheet 823 a. The first sheet 823a and the second sheet 823b are joined and sealed to each other at the outer edge 823 f. Further, a plurality of pillars 823g are arranged between the first sheet 823a and the second sheet 823b to support the first sheet 823a and the second sheet 823b from inside.

A steam flow path 823h formed of a hollow is provided in the casing 823 c. The vapor flow path 823h is a flow path through which the working liquid 823d in a gas phase moves, and communicates with the surface of the casing 823 c. In fig. 8, a hollow space between the inner wall surface of the second sheet 823b and the wick 823e constitutes a vapor flow path 823 h. In order to secure the vapor flow path 823h, the first sheet 823a and the second sheet 823b are supported by the stay 823 g.

The wick disposed on the inner wall surface of the first sheet does not necessarily need to be disposed on the entire inner wall surface of the first sheet, and may be partially disposed.

[ other embodiments ]

The electronic device of the present invention is not limited to the above-described embodiments, and various applications and modifications can be made within the scope of the present invention with respect to the configuration, manufacturing conditions, and the like of the electronic device.

The vapor chamber constituting the electronic device of the present invention is also one of the present invention. That is, the vapor chamber of the present invention includes a chamber body portion having a casing, a working fluid sealed in the casing, and a wick disposed in the casing, and a shield portion disposed in the casing, and the shield portion has an engaging means. The vapor chamber of the present invention, having the above-described structure, can effectively diffuse heat of the electronic device by engaging the shield cover with the shield portion on the substrate on which the heating element is disposed.

The fitting means is not particularly limited, and conventionally known fitting means can be used. For example, the target member may have a hole or a recess in the case where the target member has a protrusion, or may have a protrusion in the case where the target member has a hole or a recess.

The utility model discloses a vacuum cavity soaking plate can adopt and constitute foretell the utility model discloses an electronic equipment's vacuum cavity soaking plate the same mode.

For example, the shielding portion preferably has a first portion extending in the thickness direction of the vapor chamber in the vacuum chamber.

Preferably, the shield portion has a first portion extending in the thickness direction of the vacuum chamber vapor chamber, and the first portion has a hole penetrating in the surface direction of the vacuum chamber vapor chamber or a recess recessed in the surface direction of the vacuum chamber vapor chamber.

Preferably, the first portion is formed as a frame continuous with the vapor chamber surface direction of the vacuum chamber as a circumferential direction, and is bent in an outer direction of the frame.

The shield portion may be formed integrally with the chamber body portion, or may be formed separately from the chamber body portion.

Preferably, the shielding portion has a first portion extending in the thickness direction of the vacuum chamber soaking plate and a second portion extending in the surface direction of the vacuum chamber soaking plate from the vacuum chamber soaking plate side of the first portion, and more preferably has a first portion extending in the thickness direction and forming a frame continuous with the surface direction as a circumferential direction and a second portion extending in the inner direction of the frame formed from the vacuum chamber soaking plate side of the first portion to the first portion and forming a frame continuous with the surface direction as a circumferential direction.

Preferably, the first portion is formed as a frame that is continuous with the vapor chamber surface direction of the vacuum chamber as a circumferential direction, the second portion extends from the vacuum chamber vapor chamber side of the first portion toward the vacuum chamber vapor chamber surface direction and toward the inside of the frame formed by the first portion, and is formed as a frame that is continuous with the surface direction as a circumferential direction, the shielding portion further includes a third portion that extends from the inner peripheral portion of the frame formed by the second portion in the thickness direction of the vacuum chamber vapor chamber, and the third portion is in contact with the side surface of the heat generating element.

Preferably, the first portion forms a frame that is continuous with the plane direction as a circumferential direction, and the second portion extends in the vacuum chamber soaking plate plane direction from the vacuum chamber soaking plate side of the first portion, and forms a top surface of the frame formed by the first portion.

Preferably, the shield portion has a laminated structure including two or more metal layers, and the laminated structure includes a first metal layer of copper, a copper alloy, or aluminum, and a second metal layer of stainless steel or nickel.

Preferably, the shield portion is bonded to the chamber body portion with a thermally conductive bonding material, and the thermally conductive bonding material is solder, a filler-containing adhesive, or a brazing material.

Preferably, the chamber body has one or more convex portions on the substrate side, and the shield portion is disposed on at least one of the convex portions.

Preferably, the chamber body includes: a housing formed of a first sheet and a second sheet opposed to each other and having outer edges joined to each other; the working fluid is sealed in the shell; a liquid absorbing core disposed on an inner wall surface of at least one of the first sheet and the second sheet; and a support column disposed between the first sheet and the second sheet to support the first sheet and the second sheet from inside.

The utility model discloses an electronic equipment and vacuum cavity soaking plate can use in extensive usage in fields such as mobile information terminal. For example, the present invention can be used for reducing the temperature of a heat source such as a CPU and extending the use time of an electronic device, and can be used for a smartphone, a tablet PC, a notebook PC, and the like.

Claims (18)

1. An electronic device is characterized by comprising:

a substrate;

a heating element disposed on an upper surface of the substrate;

a shield cover configured to surround the periphery of the heating element and having an opening; and

a vapor chamber that faces the upper surface of the substrate and is directly or indirectly joined to the heating element via the opening,

the vapor chamber comprises: a chamber body section including a casing, a working fluid sealed in the casing, and a wick disposed in the casing; and a shield part disposed on the housing,

the shield part is fitted to the shield cover.

2. The electronic device of claim 1,

the shielding portion has a first portion extending in the thickness direction of the vapor chamber.

3. The electronic device of claim 2,

the shielding part has a hole penetrating in the direction of the vacuum chamber vapor chamber surface or a concave part recessed in the direction of the vacuum chamber vapor chamber surface at the first portion,

the shield case has a projection projecting in the plane direction,

the protrusion is fitted in the hole or the recess.

4. The electronic device of claim 3,

a gap is provided between the protrusion and the hole or the recess.

5. The electronic device of claim 4,

the gap has a resin.

6. The electronic device of claim 2,

the first portion is formed as a continuous frame having a circumferential direction as a plane direction of the vapor chamber, and is bent in an outer direction of the frame.

7. The electronic device of claim 1,

the shield portion is formed integrally with the chamber body portion.

8. The electronic device of claim 1,

the shield part is formed separately from the chamber body part.

9. The electronic device of claim 8,

the shield part includes:

a first portion extending in the thickness direction of the vapor chamber; and

and a second portion extending in the direction of the surface of the vacuum chamber vapor chamber from the side of the vacuum chamber vapor chamber of the first portion.

10. The electronic device of claim 9,

the first portion is formed as a continuous frame having a vapor chamber surface direction of the vacuum chamber as a circumferential direction,

the second portion extends from the vapor chamber side of the first portion toward the inner side of the frame formed at the first portion, and forms a continuous frame with the plane direction as the circumferential direction,

the shielding part further comprises a third part extending from the inner peripheral part of the frame formed by the second part in the thickness direction of the vapor chamber of the vacuum chamber,

the third portion is in contact with a side surface of the heating element.

11. The electronic device of claim 9,

the first portion is formed as a frame continuous with the plane direction as a circumferential direction,

the second portion forms a top surface of the frame formed by the first portion,

the shield portion is disposed to cover the opening of the shield case.

12. The electronic device of claim 8,

the shield portion has a laminated structure including two or more metal layers.

13. The electronic device of claim 12,

the above laminated structure includes a first metal layer of copper or a copper alloy or aluminum, and a second metal layer of stainless steel or nickel.

14. The electronic device of claim 8,

the shield portion is bonded to the chamber body portion with a thermally conductive bonding material.

15. The electronic device of claim 14,

the thermally conductive bonding material is a solder, a filler-containing adhesive, or a brazing material.

16. The electronic device of claim 1,

the chamber body has one or two or more projections on the substrate side, and the shield is disposed on at least one of the projections.

17. The electronic device according to any one of claims 1 to 16,

the chamber body includes:

a housing formed of a first sheet and a second sheet opposed to each other and having outer edges joined to each other;

a working fluid sealed in the housing;

a liquid absorbing core disposed on an inner wall surface of at least one of the first sheet and the second sheet; and

and a support column disposed between the first sheet and the second sheet to support the first sheet and the second sheet from inside.

18. A vapor chamber comprising:

a chamber body section including a casing, a working fluid sealed in the casing, and a wick disposed in the casing; and

a shield part configured on the shell,

the shield part has a fitting unit.

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