WO2022255081A1

WO2022255081A1 - Electronic apparatus

Info

Publication number: WO2022255081A1
Application number: PCT/JP2022/020449
Authority: WO
Inventors: 慶次郎小島; 啓人米森; 朗人内藤
Original assignee: 株式会社村田製作所
Priority date: 2021-06-02
Filing date: 2022-05-17
Publication date: 2022-12-08

Abstract

An electronic apparatus 1 is provided with a heat-dissipating member 10 having an internal space, a circuit board 30 on which an electronic component 20 is mounted, and at least one connector 40 connecting the heat-dissipating member 10 and the circuit board 30. The heat-dissipating member 10 comprises a first inner wall surface 11a and a second inner wall surface 12a opposing each other in a thickness direction, a first outer wall surface 11b opposite the first inner wall surface 11a, and a second outer wall surface 12b opposite the second inner wall surface 12a. The electronic component 20 is directly or indirectly in contact with the first outer wall surface 11b of the heat-dissipating member 10. The connector 40 is formed by mating a first connection member 41 disposed on the first outer wall surface 11b of the heat-dissipating member 10 with a second connection member 42 disposed on the circuit board 30.

Description

Electronics

The present invention relates to electronic equipment.

In recent years, the amount of heat generated has increased due to the high integration and high performance of electronic components included in electronic devices. In addition, as electronic devices become smaller, heat generation density increases, so heat dissipation measures have become important. This situation is particularly noticeable in the field of mobile terminals such as smartphones and tablets. A graphite sheet or the like is often used as a heat countermeasure member, but its heat transfer capacity is not sufficient, so the use of various heat countermeasure members has been investigated. Among others, use of a heat radiating member having an internal space, such as a vapor chamber, is being studied because it is possible to diffuse heat very effectively.

A heat dissipating member having an internal space is generally mounted on an electronic device as a single unit or as a sheet metal integrated type that is fixed to a sheet metal according to the outer shape.
In such an electronic device, a heat dissipating member having an internal space is connected to an electronic component such as a CPU (Central Processing Unit) via a grease-like or sheet-like TIM (Thermal Interface Material).

Here, from the viewpoint of efficiently diffusing the heat of the electronic component, the heat dissipating member having the internal space must always maintain contact with the electronic component. Contact pressure is important. If the contact pressure between the heat dissipating member having an internal space and the electronic component is too weak, a sufficient heat dissipating effect may not be obtained. On the other hand, if the contact pressure between the heat dissipating member having an internal space and the electronic component is too strong, the pressure may cause the electronic component to malfunction.
Therefore, various studies have been made on methods for contacting a heat dissipation member having an internal space and an electronic component.

In Patent Document 1, a first sheet and a second sheet are provided, and one main surface of the first sheet and one main surface of the second sheet are joined so as to face each other. a housing having an internal space between one main surface of the first sheet and one main surface of the second sheet; a hydraulic fluid enclosed in the internal space of the housing; A wick disposed thereon, and a support fixed to the first sheet at an outer edge of the other main surface of the first sheet, and in plan view of the main surface of the first sheet, A vapor chamber is disclosed in which a part of the outer edge of the support is located outside the outer edge of the other main surface of the first sheet when viewed from the central portion of the housing.
Further, in Patent Document 1, a through hole is provided in the outer edge of a support of a vapor chamber, which is a heat dissipation member, and a fastener such as a bolt is used to prevent contact between the vapor chamber and an electronic component such as a semiconductor element or a battery. A method of securing is disclosed.

WO2019/026786

However, in the method described in Patent Document 1, it is necessary to provide through-holes for passing fasteners such as bolts in the support that constitutes the vapor chamber and the circuit board or the like that fixes the vapor chamber. Since the internal structure of the vapor chamber cannot be provided in the portion having the through hole, there is a problem that a sufficient heat dissipation effect cannot be obtained. Moreover, when a plurality of heat sources are to be handled by one vapor chamber, there is also a problem that the influence of the through holes is increased. In addition, when the circuit board has a large number of wirings, it is necessary to provide through-holes while avoiding the wiring or to provide wiring while avoiding the through-holes, which limits the design.

Furthermore, in the method described in Patent Document 1, when the vapor chamber is made thin, the space in which the vapor can move becomes narrow, so there is a problem that the influence of the through holes increases, and from the viewpoint of strength, it is difficult to provide through holes. There was also the problem of difficulty. In addition, even if a through hole is provided in the outer periphery of the vapor chamber, the pressure difference between the part through which the fixture passes and the other part will make it difficult to keep the vapor chamber smooth, which will affect the electronic components. There was also a problem that it could not be brought into proper contact.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device in which a heat radiating member and an electronic component can be brought into proper contact without providing a through hole, the heat radiating effect of the heat radiating member can be ensured, and design restrictions can be relaxed. .

An electronic device according to the present invention includes a heat dissipation member having an internal space, a circuit board on which electronic components are mounted, and at least one connector connecting the heat dissipation member and the circuit board. A first inner wall surface and a second inner wall surface facing each other in the vertical direction, a first outer wall surface located on the opposite side of the first inner wall surface, and a second outer wall surface located on the opposite side of the second inner wall surface. and the electronic component is in direct or indirect contact with the first outer wall surface, and the connector includes a first connection member arranged on the first outer wall surface of the heat radiating member, and the circuit board. It is fitted with a second connection member arranged thereon.

SUMMARY OF THE INVENTION According to the present invention, it is an object of the present invention to provide an electronic device in which a heat dissipating member and an electronic component can be properly contacted without providing a through hole, the heat dissipating effect of the heat dissipating member can be ensured, and design restrictions can be relaxed. and

FIG. 1 is a schematic diagram showing an example of an electronic device according to a first embodiment of the invention. FIG. 2 is a cross-sectional view schematically showing an example of the vapor chamber. FIG. 3A is a perspective view schematically showing an example of a connector; FIG. 3B is a cross-sectional view of the connector shown in FIG. 3A along line AA. FIG. 4A is a perspective view schematically showing an example of a first connection member; 4B is a cross-sectional view along line BB of the first connecting member shown in FIG. 4A. FIG. 4C is a cross-sectional view schematically showing another example of the first connecting member. FIG. 5A is a perspective view schematically showing an example of a connector having a claw structure. FIG. 5B is a perspective view schematically showing an example of a connector having a bellows structure; FIG. 5C is a perspective view schematically showing an example of using a connector having a bellows structure. FIG. 5D is a perspective view schematically showing an example of a connector having a screw mechanism; FIG. 5E is a cross-sectional view along line CC of the connector with the screw mechanism shown in FIG. 5D. FIG. 6A is a cross-sectional view schematically showing an example of an electronic device according to a second embodiment of the invention. 6B is a cross-sectional view along line DD of the heat dissipation member constituting the electronic device according to the second embodiment shown in FIG. 6A. FIG. 7 is a cross-sectional view schematically showing an example of an electronic device according to the third embodiment of the invention. FIG. 8A is a cross-sectional view schematically showing an example of an electronic device according to another embodiment of the invention. FIG. 8B is a cross-sectional view schematically showing another example of an electronic device according to another embodiment of the invention. FIG. 9 is a cross-sectional view schematically showing an example of the layout of the electronic device of the invention. FIG. 10 is a cross-sectional view schematically showing another example of the layout of the electronic device of the invention.

An electronic device according to the present invention will be described below.
However, the present invention is not limited to the following embodiments, and can be appropriately modified and applied without changing the gist of the present invention.

Each embodiment shown below is an example, and it goes without saying that partial replacement or combination of configurations shown in different embodiments is possible. In the second and subsequent embodiments, descriptions of matters common to the first embodiment will be omitted, and only different points will be described. In particular, similar actions and effects due to similar configurations will not be mentioned sequentially for each embodiment.

In the following description, when each embodiment is not particularly distinguished, it is simply referred to as "the electronic device of the present invention".

The drawings shown below are schematic, and their dimensions, aspect ratio, etc. may differ from the actual product.

[First embodiment]
FIG. 1 is a cross-sectional view schematically showing an example of an electronic device according to a first embodiment of the invention.
The electronic device 1 shown in FIG. 1 includes a heat dissipation member 10 having an internal space, a circuit board 30 on which an electronic component 20 is mounted, and at least one connector 40 connecting the heat dissipation member 10 and the circuit board 30.
The heat dissipating member 10 includes a first inner wall surface 11a and a second inner wall surface 12a facing each other in the thickness direction, a first outer wall surface 11b located on the opposite side of the first inner wall surface 11a, and an opposite side of the second inner wall surface 12a. The electronic component 20 is in direct or indirect contact with the first outer wall surface 11b of the heat dissipating member 10 .
The connector 40 is formed by fitting a first connection member 41 arranged on the first outer wall surface 11 b of the heat dissipation member 10 and a second connection member 42 arranged on the circuit board 30 .

In the electronic device 1 of the present invention, the heat dissipating member 10 and the electronic component 20 are connected by the connector 40, so there is no need to provide through holes in the heat dissipating member 10 and the circuit board 30 for passing fasteners such as bolts. .
Therefore, the heat dissipation member 10 and the electronic component 20 can be appropriately brought into contact with each other, and the heat dissipation effect of the heat dissipation member 10 can be ensured.
Further, in the electronic device 1 of the present invention, when the circuit board 30 is composed of a plurality of layers, the effect of installing the connector 40 is limited to the wiring of the outermost layer of the circuit board 30, so that the design restrictions can be relaxed. can be done.

The heat radiating member 10 may be a metal plate having an internal space, but is preferably a heat pipe, more preferably a flat heat pipe called a vapor chamber.
When the heat-dissipating member 10 is a vapor chamber, the heat-dissipating member has a working fluid enclosed in an internal space and a wick arranged in the internal space.
The vapor chamber will be described below.

FIG. 2 is a cross-sectional view schematically showing an example of the vapor chamber.
As shown in FIG. 2, the vapor chamber 10A includes a housing 13, a working fluid 14 enclosed in the housing 13, a first inner wall surface 11a and a second inner wall surface 12a facing each other in the thickness direction, and a second inner wall surface 12a. It has a wick 15 provided on the first inner wall surface 11a and a plurality of struts 16 provided on the second inner wall surface 12a. The housing 13 has an internal space 17 inside, and the first inner wall surface 11 a and the second inner wall surface 12 a are supported by columns 16 in order to secure the internal space 17 .

The working fluid 14 exists in the wick 15 as a liquid phase. Further, the working fluid 14 mainly exists in the gas phase within the internal space 17 .

Although not shown in FIG. 2, the electronic component 20 directly or indirectly contacts the first outer wall surface 11b located on the opposite side of the first inner wall surface 11a.
The heat of the electronic component 20 causes the working fluid 14 present in the wick 15 right above the electronic component 20 to vaporize.

The vaporized working fluid 14 moves inside the housing 13 and condenses near the outer edge of the housing 13 to become a liquid phase.
The hydraulic fluid 14 in the liquid phase is absorbed by the wick 15 due to the capillary force of the wick 15 , moves again in the wick 15 toward the electronic component 20 , and acts to absorb heat from the electronic component 20 .
The electronic component 20 is cooled by the vapor chamber 10A as the working fluid 14 circulates and moves in the housing 13 in this way.

The housing 13 is preferably composed of a first sheet 11 and a second sheet 12 that face each other and whose outer edges are joined. Materials for the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for use as a vapor chamber, such as thermal conductivity, strength, softness, and flexibility. The material that constitutes the first sheet 11 and the second sheet 12 is preferably a metal, such as copper, nickel, aluminum, magnesium, titanium, iron, or an alloy containing them as a main component. is copper. The materials forming the first sheet 11 and the second sheet 12 may be the same or different, but are preferably the same.

When the housing 13 is composed of the first sheet 11 and the second sheet 12, the first sheet 11 and the second sheet 12 are joined together at their outer edge portions. The method of such bonding is not particularly limited, but for example, laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic bonding or resin sealing can be used, which is preferable. can use laser welding, resistance welding or brazing.

Although the thicknesses of the first sheet 11 and the second sheet 12 are not particularly limited, they are each preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and still more preferably 40 μm or more and 60 μm or less. The thicknesses of the first sheet 11 and the second sheet 12 may be the same or different. Also, the thickness of each sheet of the first sheet 11 and the second sheet 12 may be the same over the entire area, or may be thin in part.
In addition, when the convex portion constituting the wick 15 is integrated with the first sheet 11, the thickness of the first sheet 11 is the thickness of the portion not in contact with the convex portion. Further, when the struts 16 are integrated with the second sheet 12 , the thickness of the second sheet 12 is the thickness of the portion not in contact with the struts 16 .

The shape of the housing 13 is not particularly limited. For example, the top view shape of the housing may be a polygon such as a triangle or rectangle, a circle, an ellipse, or a combination of these.

Although the thickness of the entire vapor chamber 10A is not particularly limited, it is preferably 50 μm or more and 500 μm or less.

The working fluid 14 is not particularly limited as long as it can cause a gas-liquid phase change in the environment inside the housing 13, and for example, water, alcohols, CFC alternatives, etc. can be used. For example, working fluid 14 is an aqueous compound, preferably water.

The wick 15 is not particularly limited as long as it has a capillary structure capable of moving the working fluid 14 by capillary force. The capillary structure of the wick 15 may be a known structure used in conventional vapor chambers. Examples of the capillary structure include microstructures having unevenness such as pores, grooves, and projections, such as porous structures, fiber structures, groove structures, network structures, and the like.

The wick 15 is preferably provided inside the housing 13 continuously from the evaporating section to the condensing section. At least part of the wick 15 may be integral with the housing 13 .

The wick 15 may have a mesh, nonwoven fabric, or porous body on the surface of the first inner wall surface 11a. For example, as shown in FIG. 2, the wick 15 is composed of a plurality of projections arranged at predetermined intervals on the first inner wall surface 11a, and a mesh, non-woven fabric or porous material arranged on the projections. may be Alternatively, the wick 15 may be composed of a mesh, non-woven fabric, or porous material placed directly on the first inner wall surface 11a.

When the wick 15 has a plurality of projections on the first inner wall surface 11a, the working fluid 14 can be held between the projections, so the heat transport capability of the vapor chamber 10A can be improved.
In this specification, the convex portion refers to a portion relatively higher than the surroundings, and in addition to the portion protruding from the inner wall surface, the concave portion formed on the inner wall surface, such as a groove, is relatively high. Including the part where is high.

The shape of the convex portion is not particularly limited, but examples include a cylindrical shape, a prismatic shape, a truncated cone shape, a truncated pyramid shape, and the like. Moreover, the shape of the protrusion may be wall-like, that is, a shape in which a groove is formed between adjacent protrusions.

The struts 16 support the first seat 11 and the second seat 12 from inside. By arranging the struts 16 inside the housing 13, deformation of the housing 13 is suppressed when the pressure inside the housing 13 is reduced or when an external pressure is applied from the outside of the housing 13. can be done. The support 16 may be supported directly in contact with the first sheet 11 or the second sheet 12, or may be supported via another member such as a wick.

The shape of the strut 16 is not particularly limited, but examples thereof include a cylindrical shape, a prismatic shape, a truncated cone shape, a truncated pyramid shape, and the like.

The pillars 16 may be evenly arranged, for example, in a grid pattern so that the distance between the pillars is constant. Evenly distributed struts 16 ensure uniform strength throughout the vapor chamber.

The vapor chamber is not limited to the above embodiments, and various applications and modifications can be made within the scope of the present invention regarding the configuration of the vapor chamber, manufacturing conditions, and the like.

The electronic device 1 of the present invention includes a connector 40, and the connector 40 is formed by fitting a first connection member 41 and a second connection member 42 together.

FIG. 3A is a perspective view schematically showing an example of a connector; FIG. 3B is a cross-sectional view of the connector shown in FIG. 3A along line AA.
3A and 3B, the first connecting member 41 is a receptacle (male type), and the second connecting member 42 is a plug receptacle (female type). By fitting the first connection member 41 and the second connection member 42 together, the connector 40 functions.

In FIGS. 3A and 3B, the first connection member 41 is shown as a receptacle and the second connection member 42 is shown as a plug receptacle. good.

FIG. 4A is a perspective view schematically showing an example of a first connection member; 4B is a cross-sectional view along line BB of the first connecting member shown in FIG. 4A. FIG. 4C is a cross-sectional view schematically showing another example of the first connecting member.
As shown in FIGS. 4A, 4B, and 4C, the first connection member 41 includes a planar base member 43 extending in the XY directions, and a cylindrical terminal 44 extending on the base member 43 in the Z direction. Prepare.

The base member 43 is not particularly limited as long as it has characteristics suitable for use as a connector base (base portion), such as thermal conductivity, strength, flexibility, flexibility, and the like.
The base member 43 is preferably made of resin. As the resin, any commonly used insulating resin can be used. For example, LCP (Liquid Crystal Polymer) or the like may be used. The base member 43 is molded by insert molding, for example.

The terminal 44 has a cylindrical portion extending in the Z direction. The cross section of the terminal 44 along the XY direction is circular, but is not limited to this, and may be elliptical, rectangular, polygonal, or the like. The terminal 44 may have any shape as long as it can be fitted with the terminal of the other party (second connection member) to be connected.

Terminal 44 may have a continuous mating shape, as shown in FIG. 4C. Since the terminal 44 has a continuously fittable shape, the first connecting member 41 can be firmly fitted to the second connecting member.
Although not shown in FIG. 4C, when the terminal 44 has a continuous fittable shape, the terminal of the other party to be connected (the second connection member) also has a continuous fittable shape.

The terminal 44 is preferably made of metal such as copper or copper alloy. Also, the surfaces of the terminals 44 may be plated with, for example, Ni plating and Au plating.
Also, the terminal 44 may be made of resin as long as it has characteristics suitable for use as a terminal of a connector, such as thermal conductivity, strength, flexibility, and the like.

It should be noted that the terminal 44 may have a cavity inside, or may be filled with a material forming the terminal 44 .

The size and thickness of the base member 43 and the size, thickness and height of the terminals 44 are not particularly limited as long as the heat dissipation member 10 and the electronic component 20 can be in contact with each other. That is, it may be appropriately set according to the size, thickness, etc. of the heat radiating member 10 and the electronic component 20 .

Similarly, the second connection member 42 includes a planar base member along the XY directions and a tubular terminal extending in the Z direction on the base member. The base member of the second connection member 42 may be of the same material and shape as the base member 43 of the first connection member 41 . The terminals of the second connecting member 42 may also be made of the same material and have the same shape as the terminals 44 of the first connecting member 41 , but have a shape that can be fitted with the terminals 44 of the first connecting member 41 .

The first connection member 41 is arranged on the first outer wall surface 11 b of the heat dissipation member 10 .
When arranging the first connecting member 41 on the first outer wall surface 11b of the heat radiating member 10, it may be adhered using a known method such as brazing, soldering, adhesive, TIM, or the like.

The second connection member 42 is arranged on the circuit board 30 .
When arranging the second connection member 42 on the circuit board 30, it may be adhered using a known method such as wax, solder, adhesive, TIM, or the like.

The connector may have at least one selected from a claw structure, a bellows structure, and a screw mechanism.

FIG. 5A is a perspective view schematically showing an example of a connector having a claw structure.
A connector 50 shown in FIG. 5A is formed by fitting a first connection member 51 and a second connection member 52 together. The first connection member 51 includes a planar base member 53 along the XY directions, and a tubular terminal 54 extending on the base member 53 in the Z direction. The second connection member 52 includes a planar base member 55 along the XY directions, and a cylindrical terminal 56 extending on the base member 55 in the Z direction. The first connecting member 51 has a base member 53 with a claw 57 and a base member 55 of the second connecting member 52 with a recess 58 for the claw.

In the connector 50, it is possible to prevent the first connecting member 51 and the second connecting member 52 from separating due to the claw 57 being caught in the claw recess 58.

Note that FIG. 5A describes an example in which the base member 53 of the first connection member 51 has the claw 57 and the base member 55 of the second connection member 52 has the claw recess 58 . The base member 53 of the connecting member 51 may comprise a claw recess and the base member 55 of the second connecting member 52 may comprise a claw.

FIG. 5B is a perspective view schematically showing an example of a connector having a bellows structure; FIG. 5C is a perspective view schematically showing an example of using a connector having a bellows structure.
A connector 60 shown in FIGS. 5B and 5C is formed by fitting a first connection member 61 and a second connection member 62 together. The first connection member 61 includes a base member 63 and a tubular terminal 64 extending on the base member 63 . The second connection member 62 also includes a base member 65 and a cylindrical terminal 66 extending on the base member 65 . In the connector 60, the terminal 64 of the first connecting member 61 and the terminal 66 of the second connecting member 62 have a bellows structure.
Since the terminal 64 of the first connection member 61 and the terminal 66 of the second connection member 62 have a bellows structure, flexibility can be imparted to the connector 60, and the connector 60 can be bent as shown in FIG. 5C. It can also be used with

FIG. 5D is a perspective view schematically showing an example of a connector having a screw mechanism; FIG. 5E is a cross-sectional view along line CC of the connector with the screw mechanism shown in FIG. 5D.
A connector 70 shown in FIGS. 5D and 5E is formed by fitting a first connection member 71 and a second connection member 72 together. The first connection member 71 includes a planar base member 73 along the XY directions, and a tubular terminal 74 extending on the base member 73 in the Z direction. The second connection member 72 includes a planar base member 75 along the XY directions, and a cylindrical terminal 76 extending on the base member 75 in the Z direction. In the connector 70, the terminal 74 of the first connection member 71 is a male screw, and the terminal 76 of the second connection member 72 is a female screw, forming a screw mechanism. A terminal 76 of the second connection member 72 has a knob portion 78 . The knob portion 78 can rotate in conjunction with the terminal 76 . For example, the screw can be tightened or loosened by rotating the knob 78 in the direction of the arrow shown in FIG. 5D.

5D and 5E show an example in which the terminal 74 of the first connection member 71 has a male screw and the terminal 76 of the second connection member 72 has a female screw. A screw, the terminal 76 of the second connection member 72 may be a male screw.

The electronic device 1 of the present invention includes a circuit board 30 on which electronic components 20 are mounted.

The electronic component 20 is not particularly limited, but includes, for example, a CPU, a GPU (Graphical Processing Unit), and the like.

The circuit board 30 is not particularly limited, but may be, for example, a known structure in which a copper wiring board is provided on the surface of a glass epoxy board. The circuit board 30 may have a single-layer structure or a multi-layer structure.

The size and thickness of the electronic component 20 and the circuit board 30 are not particularly limited, and may be appropriately set according to the application.

The electronic component 20 is in direct or indirect contact with the first outer wall surface 11b of the heat dissipation member 10 .
In the case of indirect contact, the electronic component 20 may be in contact with the first outer wall surface 11b of the heat dissipation member 10 via solder, solder, adhesive, TIM, or the like.

[Second embodiment]
FIG. 6A is a cross-sectional view schematically showing an example of an electronic device according to a second embodiment of the invention. FIG. 6B is a cross-sectional view along line DD of the heat dissipating member constituting the electronic device according to the second embodiment shown in FIG. 6A.
In the electronic device 2 shown in FIG. 6A, the heat dissipation member 10 has a plurality of

posts

16a and 16b arranged in the internal space 17 so as to support the first inner wall surface 11a and the second inner wall surface 12a from inside. When viewed from the thickness direction, the support 16a is positioned to overlap the connector 40, and the support 16b is positioned not to overlap the connector 40. As shown in FIG.
In the heat dissipating member 10 shown in FIG. 6B, the area surrounded by the dashed line represents the position overlapping the connector 40, and the support columns 16a are densely arranged in the area surrounded by the dashed line. On the other hand, the area not surrounded by the dashed line represents the position where it does not overlap the connector 40, and the struts 16b are loosely arranged in the area not surrounded by the dashed line.
Therefore, when viewed from the thickness direction, the ratio of the cross-sectional area of the support 16a to the area of the area overlapping the connector 40 (the area surrounded by the dashed line) is the ratio of the area not overlapping the connector 40 (the area not surrounded by the dashed line). It is larger than the ratio of the cross-sectional area of the strut 16b to the area.

In the electronic device 2 shown in FIG. 6A and the heat dissipation member 10 shown in FIG. 6B, the minimum distance between the columns 16a that overlap the connector 40 when viewed from the thickness direction is the distance between the columns 16b that do not overlap the connector 40. Less than the minimum distance.

In the heat dissipating member 10, by arranging the struts 16a so that the density of the struts increases in the vicinity of the connector 40, deformation of the heat dissipating member 10 when an external pressure is applied from the outside can be more preferably suppressed. can be done.

[Third Embodiment]
FIG. 7 is a cross-sectional view schematically showing an example of an electronic device according to the third embodiment of the invention.
The electronic device 3 shown in FIG. 7 includes a heat dissipating member 10 having an internal space, a circuit board 30 on which an electronic component 20 is mounted, and a first connector 40A and a second connector 40B connecting the heat dissipating member 10 and the circuit board 30. , provided. The second connector 40B is positioned farther from the electronic component 20 than the first connector 40A when viewed in the thickness direction.
The heat dissipating member 10 includes a first inner wall surface 11a and a second inner wall surface 12a facing each other in the thickness direction, a first outer wall surface 11b located on the opposite side of the first inner wall surface 11a, and an opposite side of the second inner wall surface 12a. The electronic component 20 is in direct or indirect contact with the first outer wall surface 11b of the heat dissipation member 10 .
The first connector 40A is formed by fitting a first connection member 41A and a second connection member 42A together, and the second connector 40B is formed by fitting a first connection member 41B and a second connection member 42B together.

In the electronic device 3 shown in FIG. 7, the heat conductivity of the second connector 40B is preferably higher than the heat conductivity of the first connector 40A.
The first connector 40A and the second connector 40B play the role of appropriately contacting the heat dissipation member 10 and the electronic component 20, which is the heat source, and also serve as a heat dissipation path. Since the second connector 40B farther from the electronic component 20 has a higher thermal conductivity than the first connector 40A, the heat dissipation effect of the heat dissipation member 10 can be further improved.

In the first connector 40A, the terminals forming the first connection member 41A and the second connection member 42A are preferably made of resin.
The thermal conductivity of the first connector 40A can be lowered by using resin for the terminals forming the first connection member 41A and the second connection member 42A.

In the first connector 40A, the terminals forming the first connection member 41A and the second connection member 42A preferably have cavities inside.
Since the terminals forming the first connecting member 41A and the second connecting member 42A have cavities inside, the thermal conductivity of the first connector 40A can be lowered.

In the second connector 40B, the terminals forming the first connection member 41B and the second connection member 42B are preferably made of metal.
The thermal conductivity of the second connector 40B can be increased by using metal for the terminals that constitute the first connection member 41B and the second connection member 42B.

In the second connector 40B, the terminals forming the first connection member 41B and the second connection member 42B are preferably filled with metal.
The heat conductivity of the second connector 40B can be increased by filling the metal inside the terminals that constitute the first connection member 41B and the second connection member 42B.

Although not shown in FIG. 7, the second connector 40B may be arranged on the ground electrode.

[Other embodiments]
The electronic device of the present invention is not limited to the above-described embodiments, and various configurations, arrangements, etc. of the electronic device can be modified in various ways within the scope of the present invention.

FIG. 8A is a cross-sectional view schematically showing an example of an electronic device according to another embodiment of the invention. FIG. 8B is a cross-sectional view schematically showing another example of an electronic device according to another embodiment of the invention.
Electronic equipment 4A shown in FIG. 8A and electronic equipment 4B shown in FIG. a connector 40;
The heat dissipating member 10 includes a first inner wall surface 11a and a second inner wall surface 12a facing each other in the thickness direction, a first outer wall surface 11b located on the opposite side of the first inner wall surface 11a, and an opposite side of the second inner wall surface 12a. The electronic component 20 is in direct or indirect contact with the first outer wall surface 11b of the heat dissipating member 10 .

In FIG. 8A, the connector 40 is formed by fitting a first connection member 41 arranged on the first outer wall surface 11b of the heat dissipation member 10 and a second connection member 42 arranged on the circuit board 30 .
In FIG. 8A, the heat radiating member 10 has a connector accommodating portion 80 on the first outer wall surface 11b, so that the heat radiating member 10 and the connector 40 can be firmly fixed.

In FIG. 8B, the first connection member 41 integrated with the housing 13 of the heat dissipation member 10 and the second connection member 42 arranged on the circuit board 30 are fitted.
In FIG. 8B , since the first connection member 41 is integrated with the housing 13 of the heat dissipation member 10 , separation of the first connection member 41 from the housing 13 can be suppressed.

A layout example of the electronic device of the present invention will be described below.

FIG. 9 is a cross-sectional view schematically showing an example of the layout of the electronic device of the invention.
The electronic device 5 shown in FIG. 9 includes a heat dissipation member 10 having an internal space, a circuit board 30 on which a first electronic component 20A is mounted, a first connector 40A connecting the heat dissipation member 10 and the circuit board 30, a heat dissipation member 10 and a second connector 40B that connects the second electronic component 20B.
The heat dissipating member 10 includes a first inner wall surface 11a and a second inner wall surface 12a facing each other in the thickness direction, a first outer wall surface 11b located on the opposite side of the first inner wall surface 11a, and an opposite side of the second inner wall surface 12a. , and the first electronic component 20A is in direct or indirect contact with the first outer wall surface 11b of the heat dissipation member .
The first connector 40A is formed by fitting a first connecting member 41A and a second connecting member 42A. The second connector 40B is arranged on the second electronic component 20B, and is formed by fitting the first connecting member 41B and the second connecting member 42B.
Examples of the second electronic component 20B include a battery and a power supply.

FIG. 10 is a cross-sectional view schematically showing another example of the layout of the electronic device of the invention.
An electronic device 6 shown in FIG. 10 includes a heat dissipation member 10 having an internal space, a circuit board 30 on which an electronic component 20 is mounted, and a first connector 40A connecting the heat dissipation member 10 and the circuit board 30 .
The heat dissipating member 10 includes a first inner wall surface 11a and a second inner wall surface 12a facing each other in the thickness direction, a first outer wall surface 11b located on the opposite side of the first inner wall surface 11a, and an opposite side of the second inner wall surface 12a. The electronic component 20 is in direct or indirect contact with the first outer wall surface 11b of the heat dissipating member 10 .
The second outer wall surface 12b of the heat dissipation member 10 is in contact with the midframe 90, on which the second connector 40B is arranged.
The first connector 40A is formed by fitting a first connecting member 41A and a second connecting member 42A, and the second connector 40B is formed by fitting a first connecting member 41B and a second connecting member 42B.
Although not shown in FIG. 10, the second connector 40B is connected to other members constituting the electronic device 6. As shown in FIG.

The electronic device of the present invention can be used for a wide range of applications in fields such as personal digital assistants. For example, it can be used to lower the temperature of a heat source such as a CPU and extend the operating time of electronic equipment, and can be applied to smartphones, tablet terminals, laptop computers, and the like.

1, 2, 3, 4A, 4B, 5, 6 Electronic device 10 Heat dissipation member 10A Vapor chamber 11 First sheet 11a First inner wall surface 11b First outer wall surface 12 Second sheet 12a Second inner wall surface 12b Second outer wall surface 13 housing 14 hydraulic fluid 15

wick

16, 16a, 16b support 17 internal space 20 electronic component 20A first electronic component 20B second electronic component 30

circuit board

40, 50, 60, 70 connector 40A first connector 40B

second connector

41, 41A, 41B, 51, 61, 71

First connection member

42, 42A, 42B, 52, 62, 72

Second connection member

43, 53, 55, 63, 65, 73, 75

Base member

44, 54, 56, 64 , 66, 74, 76 Terminal 57 Claw 58 Claw recess 78 Knob portion 80 Connector housing portion 90 Midframe

Claims

a heat dissipating member having an internal space;
a circuit board on which electronic components are mounted;
At least one connector that connects the heat dissipation member and the circuit board,
The heat dissipating member includes a first inner wall surface and a second inner wall surface facing each other in a thickness direction, a first outer wall surface positioned opposite to the first inner wall surface, and a first outer wall surface positioned opposite to the second inner wall surface. a second outer wall surface, wherein the electronic component is in direct or indirect contact with the first outer wall surface;
The electronic device according to claim 1, wherein the connector is formed by fitting together a first connecting member arranged on the first outer wall surface of the heat radiating member and a second connecting member arranged on the circuit board.
2. The electronic device according to claim 1, wherein said heat radiating member has a working fluid enclosed in said internal space and a wick arranged in said internal space.
The electronic device according to claim 1 or 2, wherein the heat radiating member has a plurality of pillars arranged in the internal space so as to support the first inner wall surface and the second inner wall surface from the inside.
4. The pillar according to claim 3, wherein the ratio of the cross-sectional area of the support to the area of the region overlapping with the connector when viewed from the thickness direction is greater than the ratio of the cross-sectional area of the support to the area of the region not overlapping the connector. electronics.
5. The electronic device according to claim 3, wherein a minimum distance between the pillars overlapping the connector when viewed in the thickness direction is smaller than a minimum distance between the pillars not overlapping the connector. .
The connector has a first connector and a second connector farther from the electronic component than the first connector when viewed in the thickness direction,
6. The electronic device according to claim 1, wherein said second connector has a higher thermal conductivity than said first connector.
7. The electronic device according to claim 1, wherein said connector has at least one selected from a claw structure, a bellows structure, and a screw mechanism.