CN112702892A

CN112702892A - Electronic device

Info

Publication number: CN112702892A
Application number: CN202011517129.1A
Authority: CN
Inventors: 姚彦青; 李能智
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-12-21
Filing date: 2020-12-21
Publication date: 2021-04-23
Also published as: WO2022135262A1

Abstract

The application discloses electronic equipment relates to communication equipment technical field. The utility model provides an electronic equipment, includes the center subassembly, the center subassembly includes center body and soaking board, be equipped with the recess on the center body, the soaking board set up in the recess and with this body coupling of center, the recess has first region and second region, electronic equipment still includes mainboard and battery, first region with the mainboard sets up relatively, the second region with the battery sets up relatively, the soaking board covers first region with the second region. The problem that the radiating effect is not good that electronic equipment exists is effectively alleviated to this application embodiment.

Description

Electronic device

Technical Field

The application belongs to the technical field of communication equipment, and particularly relates to electronic equipment.

Background

With the progress of technology, some terminal devices are developed better and better, wherein the more prominent expression is as follows: the development is gradually carried out from 4G to 5G terminal equipment. However, with the upgrade of the terminal device, the heating power also increases, and thus the heat dissipation performance of the terminal device is more and more emphasized. In the related art, the heat dissipation is mainly performed by sticking graphite heat dissipation fins or by adopting heat pipes, but the heat dissipation effect is poor, and the temperature of the terminal equipment is increased to influence normal use or influence user experience.

Disclosure of Invention

An object of the embodiments of the present application is to provide a middle frame assembly and an electronic device, which can at least alleviate the problem of poor heat dissipation effect.

In order to solve the technical problem, the present application is implemented as follows:

an embodiment of the present application provides an electronic device, which includes: the middle frame assembly comprises a middle frame body and a soaking plate, a groove is formed in the middle frame body, the soaking plate is arranged in the groove and connected with the middle frame body, a first region and a second region are formed in the groove, the electronic equipment further comprises a mainboard and a battery, the first region is arranged opposite to the mainboard, the second region is arranged opposite to the battery, and the soaking plate covers the first region and the second region.

In the embodiment of the application, the middle frame assembly comprises a middle frame body and a soaking plate, the soaking plate is arranged in the groove of the middle frame body and covers a first area and a second area of the groove, and as some power devices and batteries on the mainboard are heat source pieces, the first area is arranged opposite to the mainboard, and the second area is arranged opposite to the batteries, the soaking plate can extend from the mainboard area to the battery area; and, in the general condition, the frame body has the large tracts of land to keep away the space, sets up the soaking plate in the recess and is connected with the center body, can also improve the bulk strength of center subassembly to save space. Therefore, the electronic equipment disclosed by the embodiment of the application has better heat dissipation efficiency and higher strength at the same time so as to meet higher requirements of the electronic equipment.

Drawings

Fig. 1 is a disassembled schematic view of an electronic device disclosed in an embodiment of the present application;

FIG. 2 is a disassembled schematic view of a center frame assembly disclosed in an embodiment of the present application;

FIG. 3 is a schematic diagram of a middle frame body disclosed in an embodiment of the present application;

FIG. 4 is a schematic view of a first form of vapor chamber disclosed in an embodiment of the present application;

FIG. 5 is a cross-sectional view A-A of FIG. 4;

FIG. 6 is a schematic view of a second form of vapor chamber disclosed in an embodiment of the present application;

FIG. 7 is a cross-sectional view taken along line B-B of FIG. 6;

FIG. 8 is a schematic view of a third form of vapor chamber disclosed in an embodiment of the present application;

FIG. 9 is a cross-sectional view of C-C in FIG. 8;

FIG. 10 is a cross-sectional view of one of the forms D-D of FIG. 8;

FIG. 11 is a cross-sectional view of another version of D-D of FIG. 8;

FIG. 12 is a schematic view of a middle frame assembly with a first connection disclosed in an embodiment of the present application;

FIG. 13 is a cross-sectional view of one of the forms E-E of FIG. 12;

FIG. 14 is a cross-sectional view of one of the forms F-F in FIG. 12;

FIG. 15 is a cross-sectional view of another version of E-E of FIG. 12;

FIG. 16 is a cross-sectional view of another version of F-F of FIG. 12;

FIG. 17 is a schematic view of a middle frame assembly using a second connection method according to an embodiment of the present disclosure;

FIG. 18 is a cross-sectional view taken along line G-G in FIG. 17.

Description of reference numerals:

100-a middle frame assembly; 110-middle frame body; 111-grooves; 1111 — a first region; 1112-a second region; 1113-through hole; 112-a first edge; 120-soaking plate; 121-a first cover plate; 1211 — a first trough; 122-a second cover plate; 1221-a second trough; 1222-a third trough; 123-capillary layer; 124-steam chamber; 125-a second edge; 1251-notch; 126-avoidance space; 130-PGS thermal conductive plate;

200-a main board;

300-a display module;

400-a battery;

500-cell cover;

600-camera module.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The wearable device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings by specific embodiments and application scenarios thereof.

As shown in fig. 1 to 18, an electronic apparatus according to an embodiment of the present application includes a middle frame assembly 100, a main board 200, and a battery 400, where the middle frame assembly 100 includes a middle frame body 110 and a soaking plate 120.

The middle frame body 110 is a basic mounting member of the electronic device, and can play a supporting role, and the middle frame body 110 also provides a mounting base for some electrical elements of the electronic device, such as the main board 200, the battery 400, the antenna, and the like. The middle frame body 110 can be made of metal, such as aluminum alloy, and the strength and stability of the whole electronic device can be improved by adopting the middle frame body 110 made of metal, and the heat dissipation performance of some electric elements of the electronic device can be improved by the middle frame body 110 made of metal due to the fact that the metal has good heat conductivity. Meanwhile, the metal middle frame body 110 has a smaller thickness under the condition of the same strength, and is beneficial to development of electronic equipment towards the direction of lightness and thinness.

It should be understood that the middle frame body 110 may also be made of a hard non-metal material, and the material of the middle frame body 110 is not limited in the embodiments of the present application.

A groove 111 is formed on one side surface of the middle frame body 110, the vapor chamber 120 can be disposed in the groove 111, and the vapor chamber 120 is connected to the middle frame body 110, so that the middle frame body 110 and the vapor chamber 120 jointly form an integrated middle frame structure. The vapor chamber 120 mainly plays a role in heat dissipation, and the heat dissipation efficiency of the electronic equipment can be improved through the integrated middle frame structure formed by the middle frame body 110 and the vapor chamber 120 together, so that the electronic equipment is kept in a reasonable temperature range during operation.

The groove 111 is divided into a first region 1111 and a second region 1112 according to the positional relationship of the groove 111 with different electric elements, and when the soaking plate 120 is disposed in the groove 111 and connected to the middle frame body 110, the first region 1111 is disposed opposite to the main board 200, and the second region 1112 is disposed opposite to the battery 400. In order to realize heat dissipation of electrical components (such as power devices, a battery 400, and a camera module 600) of an electronic device, the soaking plate 120 covers the first region 1111 and the second region 1112, so that the soaking plate 120 is disposed opposite to the motherboard 200 and the battery 400 at the same time, and since the motherboard 200 and the battery 400 are both mounted on the middle frame body 110, the soaking plate 120 has a certain contact relationship with the motherboard 200 and the battery 400, so that heat transfer can occur between the soaking plate 120 and the motherboard 200 and the battery 400, thereby achieving the heat dissipation effect of the electrical components of the electronic device.

In the embodiment of the present application, the soaking plate 120 is disposed in the groove 111 of the middle frame body 110 and extends from the main board 200 region to the battery 400 region, compared with the heat dissipation manner in the related art, the contact area between the soaking plate 120 and the electrical component is invisibly increased, and the heat dissipation efficiency of the electrical component is improved to a certain extent; in addition, in a normal situation, the middle frame body 110 has a large area, and the soaking plate 120 is disposed in the groove 111 and connected to the middle frame body 110, so that the soaking plate 120 and the middle frame body 110 jointly form a whole middle frame structure, which can improve the overall strength of the middle frame assembly 100 and save space. Therefore, the electronic equipment disclosed by the embodiment of the application has better heat dissipation efficiency and higher strength, and meets the requirement of electronic equipment for higher performance.

In some alternative embodiments, at least a portion of the inner edge of the groove 111 is formed with a first rim 112, the first rim 112 is used to support the soaking plate 120 after the soaking plate 120 is disposed in the groove 111, and the soaking plate 120 is connected to the first rim 112. Specifically, the surface of the middle frame body 110 and the edge of the groove 111 sink for a certain distance toward the bottom end of the groove 111, and the end surface formed after sinking is the first edge 112. When the soaking plate 120 is disposed in the groove 111, the edge region of the soaking plate 120 overlaps the first edge 112, thereby supporting the soaking plate 120.

It should be understood that all edges of the groove 111 may be formed with the first edge 112, and a part of the edges of the groove 111 may be formed with the first edge 112, and the rest is not formed with the first edge 112, and the specific manner may be selected according to actual situations.

Further, at least a part of the outer edge of the soaking plate 120 is formed with a second rim 125, and when the soaking plate 120 is disposed in the groove 111, the second rim 125 at the edge of the soaking plate 120 is supported by the first rim 112 at the edge of the groove 111. In order to prevent the soaking plate 120 from being separated from the middle frame body 110, the second edge 125 is fixedly connected to the first edge 112. For example, the double-sided adhesive tape is used for bonding, the adhesive is used for dispensing, the hot melt adhesive is used for bonding, and the welding is used. Of course, any other manner capable of fixedly connecting the second edge 125 and the first edge 112 may be adopted between the second edge 125 and the first edge 112, and the embodiment of the present application is not limited to the manner of fixedly connecting the second edge 125 and the first edge 112.

It is to be understood that the second edge 125 may be formed at the entire edge of the soaking plate 120, or the second edge 125 may be formed at a part of the edge of the soaking plate 120, and the second edge 125 may not be formed at the remaining part, and the specific manner may be selected according to the actual situation.

In addition, the second rim 125 at the edge of the soaking plate 120 is generally matched with the first rim 112 at the edge of the groove 111 to facilitate the fixed connection of the soaking plate 120 with the middle frame body 110.

In some optional embodiments, the soaking plate 120 includes a first cover plate 121, a second cover plate 122, and a capillary layer 123, the first cover plate 121 and the second cover plate 122 are stacked, the capillary layer 123 is sandwiched between the first cover plate 121 and the second cover plate 122, and a vapor cavity 124 is formed between the capillary layer 123 and the first cover plate 121. Optionally, the edge of the first cover plate 121 and the edge of the second cover plate 122 are connected by welding, so as to improve the overall strength of the soaking plate 120 and ensure that the components of the soaking plate 120 are not easily separated.

The second cover 122 is located at a side close to the main board 200 and the battery 400, and the first cover 121 is located at a side far from the main board 200 and the battery 400. In order to improve the heat transfer efficiency between the soaking plate 120 and the power device and the battery 400 on the main plate 200 and achieve a better heat dissipation effect, the first groove 1211 is disposed on a side surface of the second cover plate 122 facing the first cover plate 121, the capillary layer 123 is disposed in the first groove 1211, and the distance between the main plate 200 and the battery 400 and the capillary layer 123 is reduced to a certain extent by the arrangement of the first groove 1211, which is beneficial to heat transfer.

In order to enable the soaking plate 120 to have a heat transfer function, a second slot 1221 is arranged on the surface of the second cover plate 122 opposite to the first cover plate 121, and the opening of the second slot 1221 faces the capillary layer 123, so that the second slot 1221 and the capillary layer 123 together enclose a steam cavity 124, the steam cavity 124 is used for containing a working fluid, and the steam cavity 124 has a certain vacuum degree therein, so that a low-vacuum-degree environment is formed.

The capillary layer 123 can be a metal mesh grid or a micro-groove, wherein the metal mesh grid comprises a copper mesh, an aluminum mesh or a titanium mesh; the working fluid in liquid form can be returned from the cold end to the evaporation end through the capillary layer 123 to ensure that the evaporation end has enough working fluid. It should be understood that the capillary layer 123 may also be any other structure having a function of guiding the working fluid, and the embodiment of the present application is not limited to the specific form of the capillary layer 123.

The working fluid contained within the vapor chamber 124 includes water or a particle suspension.

The specific working principle of the vapor chamber 120 is as follows:

in the using process, some heat-generating power devices or batteries 400 on the motherboard 200 transfer the generated heat to the first cover plate 121, and at this time, the area of the first cover plate 121 in contact with the power devices or batteries 400 is a heated end, that is, the heated end is an evaporation end; the region of the soaking plate 120 for transferring heat to other structures is a cooling end, when heat is transferred from the power device or the battery 400 to a heated end, the working fluid at the heated end undergoes a liquid phase vaporization phenomenon in a low vacuum environment and is converted into a gas, and the working fluid can absorb and carry a large amount of latent heat due to the phase change phenomenon and is mentioned to rapidly expand to fill the whole vapor cavity 124; the gas is condensed at the cooling end when meeting cold and is converted into liquid, a large amount of heat is released in the condensation process, and the liquid working fluid flows back to the evaporation end along the capillary layer 123, and the processes are performed circularly, so that the heat dissipation of the power device or the battery 400 is realized.

Referring to fig. 4 and 5, in the soaking plate 120 of the first form, each edge of the first cover plate 121 extends outward and protrudes beyond a corresponding edge of the second cover plate 122, so that a second edge 125 is formed at each edge of the first cover plate 121, that is, each edge of the first cover plate 121 extends outward to form a wing-like structure. When the soaking plate 120 is disposed in the groove 111 of the middle frame body 110, the second edge 125 of each edge of the first cover plate 121 is correspondingly overlapped on the first edge 112 at the edge of the groove 111, and the second edge 125 is supported by the first edge 112. Therefore, positioning of the heat spreader 120 in the thickness direction of the electronic apparatus is achieved by the cooperation of the first rim 112 and the second rim 125.

Based on above-mentioned soaking board of first form, offered breach 1251 on the second border 125 of each edge of first apron 121, for example, rectangle breach, arc breach, triangle-shaped breach, trapezoidal breach etc. it is corresponding, set up the arch (not shown in the figure) that corresponds respectively with breach 1251 on the lateral wall of first border 112, so, when soaking board 120 sets up in the recess 111 of center body 110, breach 1251 and the protruding cooperation of first border 112 department of second border 125 department, thereby, through breach 1251 and bellied mutually supporting, realized the location of soaking board 120 on electronic equipment's length direction and width direction.

The soaking plate 120 in the above form can be mutually overlapped and fixed with the first edges 112 arranged at the edges of the groove 111 by arranging the second edges 125 at the edges of the first cover plate 121, so that the flatness of one side of the soaking plate 120 departing from the middle frame body 110 is ensured, and the mode is more suitable for electronic equipment with higher requirements on flatness.

Referring to fig. 6 and 7, in the soaking plate 120 of the second form, each edge of the second cover plate 122 extends outward and protrudes from the first cover plate 121, and the surface of the second cover plate 122 opposite to the first cover plate 121 is recessed toward a direction away from the first cover plate 121, so that a third slot 1222 is formed on the surface of the second cover plate 122 opposite to the first cover plate 121, the first cover plate 121 is disposed in the third slot 1222, each edge of the third slot 1222 is a second edge 125, that is, each edge of the third slot 1222 extends outward to form a structure similar to a wing. When the soaking plate 120 is disposed in the groove 111 of the middle frame body 110, the second rim 125 of each edge of the third groove 1222 is correspondingly overlapped on the first rim 112 at the edge of the groove 111, so that the second rim 125 is supported by the first rim 112, and the soaking plate 120 is positioned in the thickness direction of the electronic device by the mutual matching of the first rim 112 and the second rim 125. Here, the second groove 1221 is opened on the bottom end surface of the third groove 1222.

Further, a notch 1251, such as a rectangular notch, an arc notch, a triangular notch, a trapezoid notch, etc., is formed on the second edge 125 at each edge of the third slot 1222, and correspondingly, a protrusion (not shown) corresponding to the notch 1251 is formed on the sidewall of the first edge 112. When the soaking plate 120 is disposed in the groove 111 of the middle frame body 110, the notch 1251 at the second edge 125 cooperates with the protrusion at the first edge 112, so that the soaking plate 120 is positioned in the length direction and the width direction of the electronic device by the cooperation of the notch 1251 and the protrusion.

The soaking plate 120 of the above-described aspect can ensure reliability of pulling the battery 400 when the second edges 125 are provided at the respective edges of the third groove 1222 (or the respective edges of the second cover plate 122) and the first edges 112 provided at the respective edges of the groove 111 are overlapped and fixed to each other, and is more suitable for electronic devices using a large-capacity battery 400.

Referring to fig. 8 to 10, in the vapor chamber 120 of the third form, since the groove 111 of the middle frame body 110 is divided into a first zone 1111 facing the main plate 200 and a second zone 1112 facing the battery 400, the vapor chamber 120 covers the first zone 1111 and the second zone 1112, and thus, the vapor chamber 120 is also divided into a third zone opposite to the first zone 1111 and a fourth zone opposite to the second zone 1112.

Further, in the third region of the soaking plate 120, the edges of the first cover plate 121 and the edges of the second cover plate 122 are not provided with the second edges 125, so that the edges of the first cover plate 121 are respectively aligned with the edges of the second cover plate 122. In the fourth region of the soaking plate 120, the edges of the first cover plate 121 extend outward and protrude from the second cover plate 122, so that a second edge 125 is formed at each edge of the first cover plate 121 in the fourth region, that is, each edge of the first cover plate 121 in the fourth region extends outward to form a wing-like structure. When the soaking plate 120 is disposed in the groove 111 of the middle frame body 110, the second edge 125 of each edge of the first cover plate 121 located in the fourth region is correspondingly overlapped on the first edge 112 of each edge of the groove 111, and the portion of the soaking plate 120 located in the third region is attached to the first region 1111 of the groove 111, so that the second edge 125 of each edge of the first cover plate 121 located in the fourth region is mutually matched with the first edge 112 of each edge of the groove 111, and the portion of the second cover plate 122 located in the third region is mutually matched with the first region 1111 of the groove 111, thereby positioning the soaking plate 120 in the thickness direction of the electronic device is realized.

Further, a notch 1251, such as a rectangular notch, an arc notch, a triangular notch, a trapezoid notch, etc., is formed on the second edge 125 of the first cover plate 121 at each edge of the fourth area, and correspondingly, a protrusion (not shown in the figure) corresponding to the notch 1251 is disposed on the sidewall of the first edge 112. Thus, when the soaking plate 120 is disposed in the groove 111 of the middle frame body 110, the notch 1251 at the second edge 125 is matched with the protrusion at the first edge 112, so that the positioning of the soaking plate 120 in the length direction and the width direction of the electronic device is realized by the mutual matching of the notch 1251 and the protrusion.

In other embodiments, the notch 1251 may not be formed on the second edge 125, for example, by the cooperation between the portion of the second cover 122 located in the third region and the first region 1111 of the groove 111, the thermal spreader 120 may be positioned in the length direction and the width direction of the electronic device.

Referring to fig. 8, 9 and 11, in the soaking plate 120 of the fourth form, since the groove 111 of the middle frame body 110 is divided into a first region 1111 facing the main plate 200 and a second region 1112 facing the battery 400, the soaking plate 120 covers the first region 1111 and the second region 1112, and thus, the soaking plate 120 can be also divided into a third region opposite to the first region 1111 and a fourth region opposite to the second region 1112.

Further, in the third region of the soaking plate 120, the edges of the first cover plate 121 and the edges of the second cover plate 122 are not provided with the second edges 125, so that the edges of the first cover plate 121 are respectively aligned with the edges of the second cover plate 122. In the fourth region of the soaking plate 120, the edges of the second cover plate 122 extend outward and protrude from the first cover plate 121, so that a second edge 125 is formed at each edge of the second cover plate 122 in the fourth region, that is, each edge of the second cover plate 122 in the fourth region extends outward to form a wing-like structure. When the soaking plate 120 is disposed in the groove 111 of the middle frame body 110, the second edge 125 of the second cover plate 122 located at each edge of the fourth region is correspondingly overlapped on the first edge 112 of each edge of the groove 111, the portion of the soaking plate 120 located in the third region is attached to the first region 1111 of the groove 111, that is, the portion of the second cover plate 122 located in the third region is attached to the first region 1111 of the groove 111, so that the positioning of the soaking plate 120 in the thickness direction of the electronic device is realized by the second edge 125 of the second cover plate 122 located at each edge of the fourth region being mutually matched with the first edge 112 corresponding to the edge of the groove 111, and the portion of the second cover plate 122 located in the third region being mutually matched with the first region 1111 of the groove 111.

Further, a notch 1251, such as a rectangular notch, an arc notch, a triangular notch, a trapezoid notch, etc., is formed on the second edge 125 of the second cover plate 122 at each edge of the fourth area, and correspondingly, a protrusion (not shown in the figure) corresponding to the notch 1251 is disposed on the sidewall of the first edge 112. Thus, when the soaking plate 120 is embedded in the groove 111 of the middle frame body 110, the notch 1251 at the second edge 125 is matched with the protrusion at the first edge 112, so that the soaking plate 120 is positioned in the length direction and the width direction of the electronic device by the mutual matching of the notch 1251 and the protrusion.

As for the heat spreader 120 of the first form or the second form, it should be understood that the second edge 125 of each edge of the first cover plate 121 or the second edge 125 of each edge of the second cover plate 122 and the first edge 112 of each edge of the groove 111 may be fixed by double-sided adhesive, dispensing adhesive, hot melt adhesive or welding, so as to ensure the firmness of the fixed connection between the first overlapping edge and the second overlapping edge, further ensure the firmness of the fixed connection between the heat spreader 120 and the middle frame body 110, and improve the overall strength of the middle frame assembly 100 to a certain extent.

As for the vapor chamber 120 in the third form, it should be understood that the second edge 125 of the first cover plate 121 located at each edge of the fourth area and the first edge 112 located at the second area 1112 may be fixed by double-sided adhesive, dispensing adhesive, hot-melt adhesive, or welding, so as to ensure the firmness of the fixed connection between the first edge 112 and the second edge 125; moreover, the surface of the second cover plate 122 located in the third area is attached to the bottom surface of the groove 111 located in the first area 1111, and double-sided tape bonding or adhesive dispensing bonding is adopted, so that the firmness of the fixed connection between the third area of the second cover plate 122 and the first area 1111 of the groove 111 is ensured. Therefore, the firmness of the fixed connection between the vapor chamber 120 and the middle frame body 110 is ensured, and the overall strength of the middle frame assembly 100 is improved to a certain extent.

With respect to the vapor chamber 120 of the fourth form, it should be understood that the second edge 125 of the second cover plate 122 located at each edge of the fourth area and the first edge 112 located at the second area 1112 may be fixed by double-sided adhesive, dispensing adhesive, hot-melt adhesive, or welding, so as to ensure the firmness of the fixed connection between the first edge 112 and the second edge 125; moreover, the surface of the second cover plate 122 located in the third area is attached to the bottom surface of the groove 111 located in the first area 1111, and double-sided tape bonding or adhesive dispensing bonding is adopted, so that the firmness of the fixed connection between the third area of the second cover plate 122 and the first area 1111 of the groove 111 is ensured. Therefore, the firmness of the fixed connection between the vapor chamber 120 and the middle frame body 110 is ensured, and the overall strength of the middle frame assembly 100 is improved to a certain extent.

In some alternative embodiments, the first cover plate 121 is made of stainless steel or titanium alloy or copper alloy; the second cover plate 122 is made of stainless steel, titanium alloy or copper alloy, so that the overall strength of the soaking plate 120 is ensured, and meanwhile, the soaking plate 120 is not easy to corrode.

The first cover plate 121 and the second cover plate 122 are both manufactured by etching or stamping processes, so that the manufacturing efficiency is improved, and the processing precision is ensured.

The capillary layer 123 is erected between the first cover plate 121 and the second cover plate 122, and the steam cavity 124 is enclosed between the capillary layer 123 and the first cover plate 121. In order to ensure that the inner sides of the first cover plate 121 and the second cover plate 122 are not affected by the vacuum environment and the working fluid in the steam chamber 124, plating layers, specifically, a copper plating layer, a nickel plating layer, or a gold plating layer, are disposed on the inner layers of the first cover plate 121 and the second cover plate 122, so as to ensure that the inner layers of the first cover plate 121 and the second cover plate 122 are not damaged.

In order to improve the heat transfer efficiency, the soaking plate 120 is optionally attached to the power device and the battery 400 on the motherboard 200, so that the first region 1111 of the groove 111 is partially hollowed, for example, a position corresponding to the camera module 600 in the first region 1111 of the groove 111 is hollowed. Of course, the first region 1111 of the groove 111 may be hollowed out at a position corresponding to another power device, so that the third region of the soaking plate 120 can be directly attached to the power device. At the same time, the second region 1112 of the groove 111 is entirely hollowed out so that the fourth region of the soaking plate 120 can be directly attached to the battery 400. Therefore, the soaking plate 120 is attached to the power device and the battery 400 on the main board 200, so that the soaking plate 120 can efficiently absorb heat on the power device and the battery 400 and transmit the heat to other areas, and a good heat dissipation effect is achieved.

Of course, the grooves 111 may be all penetrating in the first region 1111, and in this case, the mounting of the main board 200 may not be affected.

In the embodiment of the present application, in order to further promote electronic device's radiating efficiency, one side that deviates from center body 110 at soaking plate 120 has set up PGS (Pyrolytic Graphite Sheet, PGS) heat-conducting plate 130, the middle part region of PGS heat-conducting plate 130 covers on soaking plate 120, the marginal zone covers on center body 110, heat on power device and the battery 400 is absorbed the back by soaking plate 120, transmitted for PGS heat-conducting plate 130, transmit to other components through PGS heat-conducting plate 130, thereby, the heat transfer efficiency has been promoted, it has good radiating effect to have guaranteed electronic device.

In a specific embodiment, the middle region of the PGS heat-conducting plate 130 is bonded to the soaking plate 120, and the edge region is bonded to the middle frame body 110, so that the PGS heat-conducting plate 130, the soaking plate 120 and the middle frame body 110 are spliced together to form the integrated middle frame assembly 100. The middle frame assembly 100 can be used for mounting structures such as the main board 200 and the battery 400 and radiating some power devices and the battery 400.

Furthermore, a through hole 1113 for penetrating a heat source is formed in the first region 1111 of the groove 111, and the heat source includes a camera module, a power device, and the like. In a concrete embodiment, the heat source piece can be camera module 600, be equipped with on soaking plate 120 and dodge space 126, also promptly, the regional excision relative with camera module 600 on soaking plate 120, so that when soaking plate 120 installs to center body 110, can expose camera module 600, thereby, bond PGS heat-conducting plate 130 when on soaking plate 120 and center body 110, PGS heat-conducting plate 130 can directly laminate mutually with camera module 600, thereby, directly be camera module 600 transmission heat through PGS heat-conducting plate 130, in order to dispel the heat to camera module 600.

It should be noted here that, when the space allows, the soaking plate 120 can also be directly covered on the camera module 600 to directly transfer heat for the camera module 600 through the soaking plate 120, so as to dissipate heat of the camera module 600, and at this time, the PGS heat-conducting plate 130 is bonded to the side of the soaking plate 120 away from the middle frame body 110. Of course, the PGS heat-conducting plate 130 may not be provided, and the soaking plate 120 may be used to dissipate heat of the camera module 600. When the space is not allowed, the avoiding space 126 may be disposed on the soaking plate 120, so that the PGS heat-conducting plate 130 directly covers the camera module 600, thereby achieving heat dissipation of the camera module 600.

The electronic device disclosed in the embodiment of the present application further includes a display module 300 and a battery cover 500, the display module 300 and the battery cover 500 are respectively disposed on two sides of the middle frame assembly 100, generally, the display module 300 is fixed on one side of the middle frame assembly 100 by an adhesive manner, and the battery cover 500 is fixed on the other side of the middle frame assembly 100 by a clamping manner.

An inner cavity is defined between the battery cover 500 and the middle frame assembly 100, the main board 200 and the battery 400 are disposed in the inner cavity, and the relative position of the main board 200 and the battery 400 is not limited. Also, the main board 200 and the battery 400 are both connected to the middle frame assembly 100. Thus, the middle frame assembly 100 not only realizes the fixed installation of the main board 200 and the battery 400, but also can transmit the heat of the power device on the main board 200 and the battery 400 to other positions, and realizes the heat dissipation of the power device and the battery 400 which generate heat on the main board 200.

The electronic device disclosed in the embodiment of the present application may be an electronic device such as a smart phone, a tablet computer, an electronic book reader, a wearable device (such as a smart watch), a game console, and the embodiment of the present application does not limit a specific form of the electronic device.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides an electronic equipment, its characterized in that, includes the center subassembly, the center subassembly includes center body and soaking board, be equipped with the recess on the center body, the soaking board set up in the recess and with this body coupling of center, the recess has first region and second region, electronic equipment still includes mainboard and battery, first region with the mainboard sets up relatively, the second region with the battery sets up relatively, the soaking board covers first region with the second region.

2. The electronic device of claim 1, wherein at least a portion of an inner side edge of the groove is formed with a first rim, and at least a portion of an outer side edge of the heat spreader is formed with a second rim capable of overlapping engagement with and being relatively fixed to the first rim.

3. The electronic device according to claim 2, wherein the vapor chamber comprises a first cover plate, a second cover plate, and a capillary layer, the first cover plate and the second cover plate are stacked and connected, the capillary layer is sandwiched between the first cover plate and the second cover plate, and a vapor chamber is formed between the capillary layer and the first cover plate.

4. The electronic device of claim 3, wherein a first groove is formed in a side surface of the first cover plate facing the second cover plate, a second groove is formed in a side surface of the second cover plate facing the first cover plate, the capillary layer is arranged in the second groove, and the vapor cavity is enclosed between the capillary layer and the first groove.

5. The electronic device of claim 3, wherein each edge of the first cover extends outward and protrudes from the second cover to form the second edge.

6. The electronic device of claim 5, wherein each of the second edges of the first cover plate is notched.

7. The electronic device of claim 3, wherein a third slot is disposed on a side of the second cover, the first cover is disposed in the third slot, and edges of the second cover extend outward and protrude from the first cover to form the second edge.

8. The electronic device of claim 7, wherein each of the second edges of the second cover plate is notched.

9. The electronic apparatus according to claim 3, wherein the soaking plate has a third region disposed opposite to the first region and a fourth region disposed opposite to the second region;

the edges of the first cover plate and the edges of the second cover plate are respectively aligned and arranged in the third area;

and the edges of the first cover plate extend outwards and protrude out of the second cover plate to form the second edge, or a third groove body is arranged on one side face of the second cover plate, the first cover plate is arranged in the third groove body, and the edges of the second cover plate extend outwards and protrude out of the first cover plate to form the second edge.

10. The electronic device according to claim 9, wherein in the fourth area, each of the second edges of the first cover plate is notched, or each of the second overlaps of the second cover plate is notched.

11. The electronic device according to any one of claims 1 to 10, further comprising a PGS heat-conducting plate covering a side of the soaking plate facing away from the middle frame body, the PGS heat-conducting plate being connected to both the soaking plate and the middle frame body.

12. The electronic equipment according to claim 11, further comprising a camera module, wherein a through hole is formed in the first region of the middle frame body, an avoiding space is formed on the soaking plate, the camera module is arranged in the through hole in a penetrating manner and the avoiding space, the PGS heat-conducting plate is adhered to the soaking plate and the middle frame body, and the PGS heat-conducting plate is attached to the camera module.