CN220755332U - Electronic equipment - Google Patents

Abstract

The application relates to the technical field of electronic equipment heat dissipation, and provides electronic equipment, which comprises: a functional module; the equipment shell is arranged on the functional module, a sealing cavity is formed in the equipment shell, the sealing cavity comprises a condensation area and an evaporation area, and the projection of the functional module on the equipment shell is positioned in the evaporation area; and the heat dissipation medium is filled in the sealing cavity, absorbs heat in the evaporation area and releases heat in the condensation area. The application provides an electronic equipment sets up the equipment shell that has sealed chamber on the function module in electronic equipment, is located the evaporation zone with the projection of function module at equipment shell to fill heat dissipation medium in whole sealed chamber, thereby the heat that the function module sent can be absorbed through the heat dissipation medium in evaporation zone, and release through the heat dissipation medium in condensation zone, can improve the heat derivation that produces in the function module course of working from this, reduce the inside temperature of electronic equipment.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment heat dissipation, in particular to electronic equipment.

Background

With the advent of the 5G communications era, electronic computing processing capabilities have been greatly improved, and power consumption density of electronic devices has rapidly increased, resulting in severe overtemperature risks associated with operating temperatures of electronic devices. Therefore, the electronic device is maintained in a certain working temperature range by adopting an efficient heat dissipation mode, and the electronic device has important significance for improving the reliability of products and the user experience.

At present, the heat dissipation of a functional module in electronic equipment is limited, and heat generated in the working process is difficult to directly lead out, so that the internal temperature of the electronic equipment is too high, and the normal operation of the whole machine is very easy to influence.

Disclosure of Invention

The application provides electronic equipment for improve the heat dissipation of the functional module in the current electronic equipment limited, the heat that produces in the course of the work is difficult to direct derive, causes the too high problem of electronic equipment inside temperature.

The application provides an electronic device, comprising:

a functional module;

the equipment shell is arranged on the functional module, a sealing cavity is formed in the equipment shell, the sealing cavity comprises a condensation area and an evaporation area, and the projection of the functional module on the equipment shell is positioned in the evaporation area;

and the heat dissipation medium is filled in the sealing cavity, absorbs heat in the evaporation area and releases heat in the condensation area.

According to an electronic device provided herein, the device housing includes: the first cover plate, the second cover plate and the adhesive layer;

the first cover plate is arranged at intervals with the second cover plate, the adhesive layer is adhered to the peripheral edge area between the first cover plate and the second cover plate, and the adhesive layer, the first cover plate and the second cover plate jointly form the sealing cavity.

According to the electronic equipment provided by the application, the first cover plate is arranged on the functional module, the second cover plate is a transparent cover plate, and/or the adhesive layer is transparent optical adhesive.

According to the electronic device provided by the application, the second cover plate and/or one side of the first cover plate, which is close to the second cover plate, is provided with the pattern.

According to an electronic device provided by the present application, the electronic device further includes:

the first heat conduction layer is arranged between the functional module and the equipment shell.

According to an electronic device provided in the present application, further includes: a circuit board; the functional module comprises: a shield and a chip;

the chip is arranged on the circuit board, the shielding cover is arranged outside the chip, the first heat conduction layer is arranged between the shielding cover and the equipment shell, and the projection of the chip on the equipment shell is positioned in the evaporation area.

According to the electronic equipment that this application provided, be equipped with the louvre on the shield cover, electronic equipment still includes: a second heat conductive layer;

the second heat conduction layer is at least partially penetrated in the heat dissipation hole, one surface of the second heat conduction layer covers the chip, and the other surface of the second heat conduction layer is abutted with the first heat conduction layer through the heat dissipation hole.

According to an electronic device provided by the present application, the electronic device further includes:

the support structure is arranged between the equipment shell and the shielding cover in a laminated mode, and the third heat conduction layer is close to the equipment shell.

According to the electronic equipment provided by the application, the first heat conduction layer and the third heat conduction layer are graphite layers, and the second heat conduction layer is a silica gel layer.

According to the electronic equipment provided by the application, the heat dissipation medium is pure water or alcohol.

According to the electronic equipment, the equipment shell with the sealing cavity is arranged on the functional module in the electronic equipment, the functional module is located in the evaporation area in the projection of the equipment shell and is filled with the heat dissipation medium in the whole sealing cavity, so that heat emitted by the functional module can be absorbed through the heat dissipation medium in the evaporation area and released through the heat dissipation medium in the condensation area, heat generated in the working process of the functional module can be effectively led out, the temperature inside the electronic equipment is reduced, and the safety and stability of the electronic equipment in operation are improved.

Drawings

For a clearer description of the present application or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an electronic device provided herein;

FIG. 2 is a side view of the device housing provided herein;

FIG. 3 is a top view of the device housing provided herein;

FIG. 4 is a top view of the device housing provided herein;

reference numerals:

10. a functional module; 101. a shield; 102. a chip; 20. an equipment housing; 200. sealing the cavity; 201. a condensation zone; 202. an evaporation zone; 203. a first cover plate; 204. a second cover plate; 205. an adhesive layer; 30. a heat dissipation medium; 40. a first heat conductive layer; 50. a circuit board; 60. a second heat conductive layer; 70. a support structure; 80. and a third heat conducting layer.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the present application will be clearly and completely described below with reference to the drawings in the present application, and it is apparent that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the embodiments of the present application, it should be noted that, the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or a positional relationship based on the orientation or the positional relationship shown in the drawings, which are merely for convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

The electronic device provided by the present application is described below with reference to fig. 1-3. The electronic device may include a mobile terminal such as a cell phone, tablet computer, notebook computer, palm top computer, wearable device, smart bracelet, etc.

As shown in fig. 1, the present application provides an electronic device, which includes a functional module 10, a device case 20, and a heat dissipation medium 30. The functional module 10 is an electronic component, such as a chip, having a certain function.

In this embodiment, the device housing 20 may have different specific implementations in different electronic devices. For example, in a cell phone, the device housing 20 may be a cell phone back case/cover. It can be understood that the mobile phone rear shell/rear cover occupies nearly half of the outer surface of the mobile phone, and the structure of the mobile phone rear shell/rear cover is improved, so that heat can be dissipated through the mobile phone rear shell/rear cover, the heat dissipation area of the mobile phone is greatly increased, and the heat dissipation capacity of the mobile phone is improved. It is understood that the present application is applicable not only to cellular phones, but also to other electronic devices having a large-area housing. Such as a notebook computer, tablet computer, etc., to which this application is not bound.

The device housing 20 is arranged on the functional module 10, and a sealing cavity 200 is formed in the device housing 20, wherein the sealing cavity 200 comprises a condensation area 201 and an evaporation area 202, and the projection of the functional module 10 on the device housing 20 is positioned in the evaporation area 202, namely the evaporation area 202 corresponds to the functional module 10. As shown in fig. 2, the heat dissipation medium 30 is filled in the sealed cavity 200, the heat dissipation medium 30 is not fully filled in the sealed cavity 200, the whole volume of the sealed cavity 200 is larger than the volume occupied by the heat dissipation medium 30 in the sealed cavity 200, that is, the heat dissipation medium 30 occupies only part of the space in the sealed cavity 200, and the other spaces are vacuum or filled with air. The heat dissipating medium can absorb heat in the evaporation zone and release heat in the condensation zone, so that the heat dissipating medium 30 can flow in the sealed cavity, and conduct out heat generated during operation.

In the operation process of the electronic device, firstly, heat generated during the operation of the functional module 10 is conducted to the evaporation area 202 of the device housing 20, and the heat dissipation medium 30 inside the evaporation area 202 rapidly absorbs the heat and converts the heat into steam, so that a large amount of heat energy is taken away. Based on the latent heat, the hot vapor from the evaporation zone 202 diffuses from the high pressure zone to the condensation zone 201, which rapidly condenses to a liquid and releases thermal energy when the vapor contacts the inner walls of the stack at a lower temperature. Finally, the heat dissipation media 30 flow back to the evaporation area 202, and finally form a two-phase circulation system with concurrent vapor, so as to effectively reduce the temperature of the functional module 10.

According to the electronic equipment provided by the embodiment of the application, the equipment shell 20 with the sealing cavity 200 is arranged on the functional module 10 in the electronic equipment, the functional module 10 is located in the evaporation area 202 in the projection of the equipment shell 20, and the whole sealing cavity 200 is filled with the heat dissipation medium 30, so that heat emitted by the functional module 10 can be absorbed through the heat dissipation medium in the evaporation area 202 and released through the heat dissipation medium in the condensation area 201, and therefore, heat generated in the working process of the functional module 10 can be effectively led out, the temperature inside the electronic equipment is reduced, and the safety and stability of the electronic equipment in operation are improved.

In some embodiments, as shown in fig. 1-3, the device housing 20 includes: a first cover plate 203, a second cover plate 204 and an adhesive layer 205. The first cover 203 is spaced from the second cover 204. As shown in fig. 2, the adhesive layer 205 adheres to the peripheral edge region between the first cover plate 203 and the second cover plate 204, and the adhesive layer 205, the first cover plate 203 and the second cover plate 204 together form a sealed cavity 200.

In this application, the thicknesses of the first cover plate 203 and the second cover plate 204, and the interval between the first cover plate 203 and the second cover plate 204 may be comprehensively determined according to factors such as design strength and heat dissipation requirements of the electronic device. In general, the spacing between the first cover plate 203 and the second cover plate 204 does not exceed the minimum thickness in the first cover plate 203 and the second cover plate 204.

The area of the adhesive layer 205 on the plane parallel to the first cover plate 203 can be comprehensively determined according to the design strength of the electronic device, the heat dissipation requirement, and other factors. Generally, the larger the area, the higher the design strength, but the heat dissipation capability is correspondingly reduced. Conversely, the smaller the area, the lower the design strength, but the heat dissipation capacity will be correspondingly improved.

Illustratively, in this embodiment, the thickness of the first cover plate 203 is 0.3mm, the thickness of the second cover plate 204 is 0.3mm, the first cover plate 203 is spaced from the second cover plate 204 by 0.15-0.2mm, the adhesive layer 205 is a gap between the first cover plate 203 and the second cover plate 204, and the adhesive layer 205 is configured with the sealing cavity 200 at the center of the first cover plate 203 and the second cover plate 204.

Illustratively, as shown in fig. 4, an edge area (a position between the first cover plate 203 and the second cover plate 204 except the sealing cavity 200) around the device housing 20 is provided with an adhesive layer 205, and the thickness of the adhesive layer 205 (the length of the first cover plate 203 and the second cover plate 204 in the stacking direction) is adjusted according to the distance between the first cover plate 203 and the second cover plate 204, which is generally 0.15-0.2mm. To secure the sealing effect, the width of the adhesive layer 205 (the minimum length perpendicular to the stacking direction of the first cover plate 203 and the second cover plate 204) is greater than the thickness thereof, and the width of the adhesive layer 205 is generally 1.5mm to 2mm. Thereby effectively avoiding the heat dissipation medium 30 in the sealing cavity 200 from contacting the outside, and dissipating heat from the whole sealing cavity 200 despite the large width of the adhesive layer 205The area is still large. Taking a 6.81inch screen mobile phone as an example, the equipment shell is a battery cover of the mobile phone, and the area of the battery cover is 11272.9mm ² The adhesive layer 205 is positioned at the edge area around the sealing cavity 200, and the area 654.76mm of the peripheral adhesive layer 205 ² The effective heat dissipation area is 10618.14mm ² The ratio is 94.2%.

In an example, the first cover plate 203 is disposed on the functional module 10. The second cover 204 is a transparent cover, and the adhesive layer 205 is a transparent optical adhesive. The user can see the first cover plate 203 through the second cover plate 204 and the sealing chamber 200, and can see the heat dissipation medium 30 flowing inside the device housing 20 from the outside without being affected by the adhesive layer 205.

In other examples, only the second cover plate 204 may be provided as a transparent cover plate, and a non-transparent and colored adhesive layer 205 may be used to allow a user to see only the flow of fluid within the sealed cavity 200 through the second cover plate 204. Alternatively, the second cover 204 may be provided as a non-transparent cover and the adhesive layer 205 may be provided as a transparent optical adhesive, so that a user may see the flowing heat dissipation medium 30 through the adhesive layer 205 from the side.

Meanwhile, a pattern may be further disposed on a side of the second cover 204 or the first cover 203, which is close to the second cover 204, or on a side of the second cover 204 and the first cover 203, which is close to the second cover 204, at least one of the second cover 204 and the adhesive layer 205 is made of a transparent material, so that a user can observe the pattern on the device housing 20 while observing the flow of the heat dissipation medium 30 through the second cover 204 or the adhesive layer 205.

In some embodiments, as shown in fig. 1 to 3, the electronic device further includes: the first thermally conductive layer 40. The first heat conductive layer 40 is disposed between the functional module 10 and the device housing 20.

The first heat conducting layer 40 is used for directly contacting the functional module 10 and the device housing 20, and is used for transferring heat on the functional module 10 to the device housing 20 so as to improve heat exchange efficiency. The first thermally conductive layer 40 may be a graphite layer or other material having a relatively high thermal conductivity.

In this embodiment, the electronic device further includes: a circuit board 50; the functional module 10 includes: a shield 101 and a chip 102; the circuit board 50 is a printed circuit board, the chip 102 is disposed on the circuit board 50, the shielding cover 101 is covered outside the chip 102, the first heat conductive layer 40 is disposed between the shielding cover 101 and the device housing 20, and as shown in fig. 3, the projection of the chip 102 on the device housing is located in the evaporation area 202. The projection direction may be a stacking direction of the first cover plate 203 and the second cover plate 204.

In this application, the shielding cover 101 is disposed on the circuit board 50, and forms a shielding space for accommodating the chip 102 in cooperation with the circuit board 50, where the shielding cover 101 prevents external electromagnetic radiation on one hand and also prevents influence of external electromagnetic signals on the chip 102 on the other hand.

In the operation process of the electronic device provided in this embodiment, heat generated during the operation of the chip 102 is conducted to the evaporation area 202 of the device housing 20 through the shielding cover 101 and the first heat conducting layer 40, and the heat dissipation medium 30 inside the evaporation area 202 rapidly absorbs the heat and converts the heat into steam, so as to take away a large amount of heat energy. Based on the latent heat, the hot vapor from the evaporation zone 202 diffuses from the high pressure zone to the condensation zone 201, which rapidly condenses to a liquid and releases thermal energy when the vapor contacts the inner walls of the stack at a lower temperature. Finally, the heat dissipation medium 30 flows back to the evaporation area 202, thereby effectively reducing the temperature of the functional module 10.

In order to avoid the influence of the shielding cover 101 on the heat dissipation of the chip 102, as shown in fig. 1, the shielding cover 101 is provided with heat dissipation holes, and the corresponding electronic device further includes: and a second thermally conductive layer 60. The second heat conductive layer 60 may be a silicone layer. The second heat conducting layer 60 is at least partially penetrating through the heat dissipation hole, one surface of the second heat conducting layer 60 covers the chip, and the other surface of the second heat conducting layer 60 is abutted to the first heat conducting layer 40 through the heat dissipation hole. Thus, heat generated during operation of the chip 102 is transferred to the evaporation zone 202 of the device housing 20 through the second thermally conductive layer 60 and the first thermally conductive layer 40 in sequence.

Based on the above embodiments, in one embodiment, as shown in fig. 1 to 3, the electronic device further includes: a support structure 70 and a third thermally conductive layer 80. The third heat conductive layer 80, the support structure 70, and the first heat conductive layer 40 are sequentially stacked between the device housing 20 and the shield 101, with the third heat conductive layer 80 disposed proximate to the device housing 20.

Specifically, the support structure 70 is used to support the entire device housing 20, typically a metal structure. By adopting the metal structure, not only can support be provided, but also the heat conduction capacity of the metal can be utilized, and the influence of the support structure on the heat dissipation of the electronic equipment is reduced. In some embodiments, these metal structures may also act as antenna mounts within the electronic device.

A third thermally conductive layer 80 is disposed between the support structure 70 and the device housing 20 for transferring heat between the support structure 70 and the device housing 20. To enhance thermal conductivity, the support structure 70 is typically made of a metal that has good thermal conductivity. Thus, heat generated during operation of the chip 102 is transferred to the evaporation zone 202 of the device housing 20 via the second thermally conductive layer 60, the first thermally conductive layer 40, the support structure 70, and the third thermally conductive layer 80 in that order.

In one example, the first thermally conductive layer 40 may be optionally a graphite layer, with the first thermally conductive layer 40 being used for thermal conduction between the second thermally conductive layer 60 and the support structure 70.

In another example, the third thermally conductive layer 80 may alternatively be a graphite layer, with the third thermally conductive layer 80 being used for thermal conduction between the support structure 70 and the device housing 20.

In yet another example, the second thermally conductive layer 60 may alternatively be a silicone layer. The second thermally conductive layer 60 is used for thermal conduction between the chip 102 and the first thermally conductive layer 40.

Based on the above embodiment, in one example, pure water or alcohol may be used as the heat dissipation medium 30 in order to enhance the heat conduction performance of the device housing 20.

It is understood that, according to the working environment of the electronic device and the heat dissipation requirement of the functional module 10, other heat-conducting materials that are easy to change phase may be used as the heat dissipation medium 30.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims (10)

1. An electronic device, comprising:

a functional module;

the equipment shell is arranged on the functional module, a sealing cavity is formed in the equipment shell, the sealing cavity comprises a condensation area and an evaporation area, and the projection of the functional module on the equipment shell is positioned in the evaporation area;

and the heat dissipation medium is filled in the sealing cavity, absorbs heat in the evaporation area and releases heat in the condensation area.

2. The electronic device of claim 1, wherein the device housing comprises: the first cover plate, the second cover plate and the adhesive layer;

the first cover plate is arranged at intervals with the second cover plate, the adhesive layer is adhered to the peripheral edge area between the first cover plate and the second cover plate, and the adhesive layer, the first cover plate and the second cover plate jointly form the sealing cavity.

3. The electronic device of claim 2, wherein the first cover plate is disposed on the functional module, the second cover plate is a transparent cover plate, and/or the adhesive layer is a transparent optical adhesive.

4. An electronic device according to claim 3, characterized in that the second cover plate and/or the first cover plate is provided with a pattern on the side close to the second cover plate.

5. The electronic device of claim 1, wherein the electronic device further comprises:

the first heat conduction layer is arranged between the functional module and the equipment shell.

6. The electronic device of claim 5, further comprising: a circuit board; the functional module comprises: a shield and a chip;

the chip is arranged on the circuit board, the shielding cover is arranged outside the chip, the first heat conduction layer is arranged between the shielding cover and the equipment shell, and the projection of the chip on the equipment shell is positioned in the evaporation area.

7. The electronic device of claim 6, wherein the shielding case is provided with a heat dissipation hole, and the electronic device further comprises: a second heat conductive layer;

the second heat conduction layer is at least partially penetrated in the heat dissipation hole, one surface of the second heat conduction layer covers the chip, and the other surface of the second heat conduction layer is abutted with the first heat conduction layer through the heat dissipation hole.

8. The electronic device of claim 7, wherein the electronic device further comprises:

the support structure is arranged between the equipment shell and the shielding cover in a laminated mode, and the third heat conduction layer is close to the equipment shell.

9. The electronic device of claim 8, wherein the first thermally conductive layer and the third thermally conductive layer are graphite layers and the second thermally conductive layer is a silicone layer.

10. The electronic device of any one of claims 1-9, wherein the heat dissipation medium is pure water or alcohol.