CN1984531A - Allocation wiring structure of printing circuit board - Google Patents
Allocation wiring structure of printing circuit board Download PDFInfo
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- CN1984531A CN1984531A CN 200610079025 CN200610079025A CN1984531A CN 1984531 A CN1984531 A CN 1984531A CN 200610079025 CN200610079025 CN 200610079025 CN 200610079025 A CN200610079025 A CN 200610079025A CN 1984531 A CN1984531 A CN 1984531A
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Abstract
The invention is used for overcoming the heat of chip transmitted to PCB. It comprises: the bounding pad of the heated chip and the bounding pad of metallic shielding box, both are connected using copper sheet. The heat via holes or heat buried holes or heat blind holes under the bounding pad of the heated chip has less quantities and densities, and the copper pour on the portion of PCB except the top portion of PCB is less than the top portion of PCB near the heated chip. By the invention the heat from BCP is transmitted to direction of the metallic shielding box.
Description
Technical field
The present invention relates to communication and electronic technology field, especially relate to a kind of allocation wiring structure of printing circuit board.
Background technology
Along with the development of radio communication and chip encapsulation technology, increasing function is integrated in the mobile phone.Obviously increasing also correspondingly appears in the power consumption of mobile phone, and especially performance is more outstanding in third generation mobile phone.Third generation mobile phone adopts CDMA2000 (Code-Division Multiple Access, code division multiple access) or WCDMA (Wideband CDMA, Wideband Code Division Multiple Access (WCDMA)) technology, the PA that uses in this technology (Power Amplifier, power amplifier) chip efficient is far below the second generation mobile phone PA chip that adopts GSM (GlobalSystem for Mobile Communications, global system for mobile communications) technology.When maximum power transmission, third generation mobile phone hear rate increases more than 50% than second generation mobile phone, and this moment, third generation mobile phone PA chip caloric value was approximately about 1W, accounted for the 50-60% of mobile phone gross calorific power.And common third generation mobile phone PA chip physical dimension greatly about 3mm * 3mm * 1mm between 6mm * 6mm * 1mm, therefore have very high unit volume density of heat flow rate and temperature rise, device and surface around can having influence on can cause that especially the temperature rise of mobile phone surface local is too high.Simultaneously, because the inner space of mobile phone is limited, can't adopt heat dissipation technologys such as fan, radiator, heat pipe, so the radiating management of mobile phone PA chip is the problem that will be eager to solve now.
At present, common third generation mobile phone PA chip adopts QFN (Quad Flat No-lead, quad flat non-pin) encapsulation.The upward view of QFN encapsulation as shown in Figure 1, the internal structure of this encapsulation is as shown in Figure 2.See figures.1.and.2, QFN encapsulation is a kind of no pin package, is square or rectangle, and the package bottom middle position has a large-area hot weld dish 12 to be used for heat conduction, has around the encapsulation of large bonding pad to realize the conductive welding disk 11 that is electrically connected.This encapsulation mainly comprises conductive welding disk 21, hot weld dish 22, mold (mould) 23 and die (nude film) 24 4 parts, wherein conductive welding disk and hot weld dish are metal material, mold is FR4 (epoxy resin and glass fibre synthetic plate) material, die is the core of chip, can produce heat during work.And from material behavior, the conductive coefficient of copper is 333W/m-K, and the conductive coefficient of FR4 is 0.285W/m-K.Because metal and FR4 conductive coefficient differ usually more than 100 times, so metal material is the main path of heat conduction.The heat that the encapsulating structure of PA chip and material behavior decision Die produce mainly conducts by the hot weld dish of package bottom.
Now, when producing, mainly adopt by mobile phone three kinds of radiator structures that the PA chip is dispelled the heat.A kind of radiator structure such as Fig. 3, shown in Figure 4, Fig. 3 is the device top layer placement-and-routing of PCB, and Fig. 4 is the wiring of internal layer one deck, and wherein the shadow region is the Pu Tong district of PCB floor among the figure.With reference to Fig. 3 and Fig. 4, PCB under the hot weld dish of PA chip (Printed Circuit Board, printed circuit board) is provided with pad 31, offer the hot hole 41 of some on this pad, this hot hole is hot via hole or hot buried via hole or hot blind hole, and the quantity of this hot hole is the manufacturer's recommended value of PA chip, is furnished with electric capacity or resistance 33 around the PA chip, 32 are metallic shield box pad, and 42 are the position of metallic shield box projection on this layer.Hot weld dish with the PA chip during use directly is welded on the pad 31 of PCB, and hot hole 41 can be with main heat diffusion in the copper ground plate.If the two-sided cloth device of the PCB of mobile phone can't be offered straight-through hot via hole, then realize by the bottom of PCB and the hot blind hole of top layer and the hot buried via hole in intermediate layer, as much as possible the heat of PA chip is reached PCB with minimum thermal resistance from the hot weld dish.
Adopt this radiator structure to play very big effect, but from system's thermal design angle, there is significant disadvantages in this radiator structure to controlling local power amplifier temperature rise.Below clamshell phone and stick-type phone are described respectively, the structure of clamshell phone as shown in Figure 5, this mobile phone comprises mobile phone loam cake 51, mobile phone lower cover 52, button 53, PCB54, metallic shield box 55, PA chip 56 and battery 57.If adopting the mobile phone of this radiator structure is clamshell phone, because the restriction in mobile phone space, PA chip 56 and PCB54 are very short from button 53 surface distances, and the main heat of PA chip 56 directly passes to 53 of buttons through PCB54, causes the mobile phone surface temperature too high.The structure of stick-type phone as shown in Figure 6, this mobile phone comprises LCD (Liquid Crystal Display, LCDs) 61, button 62, metallic shield box 63, PA chip 64, battery 65 and PCB66.If adopting the mobile phone of this radiator structure is stick-type phone, PA chip 64 and PCB66 are long than clamshell phone from button 62 surface distances, and surface temperature rise is more easy to control, but the thermally sensitive ear contact zone that is human body, this district requires to have very strict temperature rise control.Simultaneously, PA chip 64 and PCB66 are very short from the surface distance of LCD61, the main heat of PA chip 64 directly passes to LCD61 through PCB66, and LCD61 is a heat-sensitive device, and the heat of PA chip 64 also can have influence on operate as normal and the long term reliability of LCD61.
Another kind of radiator structure as shown in Figure 7, this radiator structure lays heat conductive pad 71 at the top of PA chip.Adopt this radiator structure from the mobile phone back side heat to be distributed again the heat of PA chip by the heat conductive pad 61 guiding mobile phone back sides.
For the QFN encapsulating structure of PA chip, heat is mainly spread out of by the hot weld dish of Die below.The top of chip is the mold part, and conductive coefficient is 0.7W/m-K only, and heat conductivility is relatively poor.Simultaneously, because heat conductive pad 71 need hold the deviation of mould manufacturing and assembling, so this heat conductive pad should have the thickness about 1-2mm, thickness is bigger, is difficult for heat conduction.Therefore and the conductive coefficient of heat conductive pad also only is about 1W/m-K, adopts this radiator structure lower to the temperature efficiency that reduces the PA chip, and the thickness of common metal shielding box only is about 0.2mm-0.3mm, can not realize good cooling-down effect.
Another radiator structure as shown in Figure 8, this radiator structure adopts integrated cast aluminium shielding box 81.This shielding box thickness often reaches about 1mm, is equivalent to add a radiator on the PA chip, also can guarantee good cooling-down effect even heat transfer efficiency is low between PA chip and shielding box.But adopt this radiator structure cost far above common shielding box, on the low and middle-end mobile phone, be difficult to adopt.
Summary of the invention
The problem to be solved in the present invention provides a kind of allocation wiring structure of printing circuit board, to overcome the euthermic chip heat mainly to the transmission of PCB direction, can not effectively control the defective of direction of heat flow.
Realization principle of the present invention is the encapsulating structure that has the hot weld dish according to the euthermic chip bottom, by euthermic chip pad, copper sheet and metallic shield box pad that conductive coefficient is big, with the heat guiding metallic shield box of euthermic chip, thereby control hot-fluid direction of transfer reduces the heat conduction to PCB.And metallic shield box thickness is 0.2mm-2mm, and expanding area reaches more than 10 times of euthermic chip usually, and the temperature rise that can effectively guarantee euthermic chip can be carried out good heat radiating to euthermic chip within the design tolerance band.
For achieving the above object, the invention provides a kind of allocation wiring structure of printing circuit board, comprise euthermic chip pad and metallic shield box pad, wherein directly link to each other with copper sheet between euthermic chip pad and the metallic shield box pad.
According to one aspect of the present invention, described euthermic chip adopts the QFN encapsulation, also can adopt other bottom to have the encapsulation of hot weld dish.
According to another aspect of the present invention, the length of described copper sheet is in 2mm.
According to another aspect of the present invention, described euthermic chip arranges that near described metallic shield box for realizing that thermal resistance minimizes, the spacing between this euthermic chip and the metallic shield box is in 2mm.
According to another aspect of the present invention, no electric capacity or resistance between described euthermic chip and the described metallic shield box.
According to another aspect of the present invention, be furnished with hot hole under the described euthermic chip pad, be used for radio frequency ground connection and isolation.
According to another aspect of the present invention, described hot hole is hot via hole, hot buried via hole or hot blind hole.
According to another aspect of the present invention, only to PCB top layer shop copper near euthermic chip.
Compared with prior art, the present invention has the following advantages:
Adopt the present invention, the heat of euthermic chip is mainly dispersed by copper sheet and metallic shield box, can control the hot-fluid direction of transfer, reduce heat conduction to PCB, thereby can avoid the mobile phone surface temperature too high to clamshell phone, can avoid the operate as normal and the long term reliability of the heat effects heat-sensitive device of euthermic chip to stick-type phone.
Further, adopt temperature rise that the present invention can effectively guarantee euthermic chip within the design tolerance band, can carry out good heat radiating euthermic chip.
In addition, installation of the present invention and welding procedure are implemented convenient and reliable, and cost is low.
Description of drawings
Fig. 1 is the upward view of QFN encapsulation;
Fig. 2 is the cut-away view of QFN encapsulation;
Fig. 3 is the device PCB top layer wiring diagram of a kind of radiator structure of prior art;
The wiring diagram of PCB internal layer one deck of Fig. 4 Fig. 3 radiator structure;
Fig. 5 is the structure chart of clamshell phone;
Fig. 6 is the structure chart of stick-type phone;
Fig. 7 is a kind of radiator structure figure of prior art;
Fig. 8 is a kind of radiator structure figure of prior art;
Fig. 9 is a kind of device PCB of the present invention top layer wiring diagram;
Figure 10 is the wiring diagram of PCB internal layer one deck of Fig. 9 wire structures.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail:
A kind of device PCB of the present invention top layer wiring diagram as shown in Figure 9, the wiring diagram of PCB internal layer one deck is as shown in figure 10.With reference to Fig. 9 and Figure 10, euthermic chip of the present invention is the PA chip, on the PCB under the hot weld dish of PA chip, be provided with pad 91, offer the hot via hole 101 of some on this pad, 92 are metallic shield box pad, 102 are the position of metallic shield box projection on this layer, and 93 is the copper sheet of connection pads 91 and metallic shield box pad 92.
Compare with existing radiator structure shown in Figure 4 with Fig. 3, directly link to each other with copper sheet 93 between pad 91 among the present invention under the PA chip and the metallic shield box pad 92, and the length that makes this copper sheet 93 is in 2mm, and the PA chip arranged near the metallic shield box, for realizing that thermal resistance minimizes, the spacing between this PA chip and the metallic shield box is in 2mm; The present invention removes electric capacity or the resistance between PA chip and the metallic shield box, and guaranteeing does not have device between this PA chip and the metallic shield box; Simultaneously, the present invention reduces the quantity and the density of the hot hole under the PA chip bonding pad, and this hot hole is hot via hole or hot buried via hole or hot blind hole, this hot hole can be removed from the heat radiation angle, but the needs of consideration radio frequency ground connection and isolation still keeps a small amount of hot hole 101; In addition, the present invention reduces or removes the interior shop copper of PCB layer under the PA chip bonding pad, and except that the close PCB top layer of PA chip, copper is not all spread in all the other PCB layer corresponding positions.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (8)
1, a kind of allocation wiring structure of printing circuit board comprises euthermic chip pad and metallic shield box pad, it is characterized in that, directly links to each other with copper sheet between described euthermic chip pad and the metallic shield box pad.
2, PCB routing structure according to claim 1 is characterized in that, described euthermic chip adopts the bottom to have the encapsulation of hot weld dish.
3, PCB routing structure according to claim 1 is characterized in that the length of described copper sheet is in 2mm.
4, PCB routing structure according to claim 1 is characterized in that the spacing between described euthermic chip and the described metallic shield box is in 2mm.
5, PCB routing structure according to claim 1 is characterized in that no electric capacity or resistance between described euthermic chip and the described metallic shield box.
6, PCB routing structure according to claim 1 is characterized in that, is furnished with hot hole under the described euthermic chip pad, is used for radio frequency ground connection and isolation.
7, as PCB routing structure as described in the claim 6, it is characterized in that described hot hole is hot via hole, hot buried via hole or hot blind hole.
8, PCB routing structure according to claim 1 is characterized in that, only to the printed circuit board top layer shop copper near euthermic chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610079025 CN1984531A (en) | 2006-04-30 | 2006-04-30 | Allocation wiring structure of printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610079025 CN1984531A (en) | 2006-04-30 | 2006-04-30 | Allocation wiring structure of printing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1984531A true CN1984531A (en) | 2007-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610079025 Pending CN1984531A (en) | 2006-04-30 | 2006-04-30 | Allocation wiring structure of printing circuit board |
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| CN (1) | CN1984531A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101742814B (en) * | 2009-12-22 | 2011-08-24 | 华为终端有限公司 | Printed circuit board shielding method and printed circuit board |
| CN101650753B (en) * | 2008-08-15 | 2012-06-13 | 英业达股份有限公司 | Arrangement method |
| CN106793458A (en) * | 2016-12-15 | 2017-05-31 | 北京小鸟看看科技有限公司 | Printed circuit board, printing buck plate and electronic equipment for heating element |
| CN107567273A (en) * | 2017-10-25 | 2018-01-09 | 南京尤尼泰信息科技有限公司 | A kind of shielding box |
| CN107645826A (en) * | 2017-09-19 | 2018-01-30 | 郑州云海信息技术有限公司 | A kind of Switching Power Supply integrated chip board layout structure |
| CN107967380A (en) * | 2017-11-15 | 2018-04-27 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board and its layout designs |
| CN108495465A (en) * | 2018-03-28 | 2018-09-04 | 四川斐讯信息技术有限公司 | A kind of shielding case encapsulation creation method and create system |
| CN110106624A (en) * | 2019-05-06 | 2019-08-09 | 上海意瑶电气有限公司 | A kind of driver heat-resisting method when settlement computer straight-bar machines high speed commutation |
| CN114206090A (en) * | 2021-11-30 | 2022-03-18 | 四川天邑康和通信股份有限公司 | Method capable of effectively solving mutual winding of PON/all-optical gateway heating and shielding signals |
-
2006
- 2006-04-30 CN CN 200610079025 patent/CN1984531A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101650753B (en) * | 2008-08-15 | 2012-06-13 | 英业达股份有限公司 | Arrangement method |
| CN101742814B (en) * | 2009-12-22 | 2011-08-24 | 华为终端有限公司 | Printed circuit board shielding method and printed circuit board |
| CN106793458B (en) * | 2016-12-15 | 2023-11-24 | 北京小鸟看看科技有限公司 | Printed circuit board, printed assembly board and electronic equipment for heating element |
| CN106793458A (en) * | 2016-12-15 | 2017-05-31 | 北京小鸟看看科技有限公司 | Printed circuit board, printing buck plate and electronic equipment for heating element |
| CN107645826A (en) * | 2017-09-19 | 2018-01-30 | 郑州云海信息技术有限公司 | A kind of Switching Power Supply integrated chip board layout structure |
| CN107567273A (en) * | 2017-10-25 | 2018-01-09 | 南京尤尼泰信息科技有限公司 | A kind of shielding box |
| CN107567273B (en) * | 2017-10-25 | 2024-04-12 | 南京尤尼泰信息科技有限公司 | Shielding box |
| CN107967380A (en) * | 2017-11-15 | 2018-04-27 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board and its layout designs |
| CN107967380B (en) * | 2017-11-15 | 2021-09-07 | 晶晨半导体(上海)股份有限公司 | Layout design method of printed circuit board |
| CN108495465A (en) * | 2018-03-28 | 2018-09-04 | 四川斐讯信息技术有限公司 | A kind of shielding case encapsulation creation method and create system |
| CN110106624A (en) * | 2019-05-06 | 2019-08-09 | 上海意瑶电气有限公司 | A kind of driver heat-resisting method when settlement computer straight-bar machines high speed commutation |
| CN114206090A (en) * | 2021-11-30 | 2022-03-18 | 四川天邑康和通信股份有限公司 | Method capable of effectively solving mutual winding of PON/all-optical gateway heating and shielding signals |
| CN114206090B (en) * | 2021-11-30 | 2024-04-16 | 四川天邑康和通信股份有限公司 | Method capable of effectively solving mutual winding of PON/all-optical gateway heating and shielding signals |
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Open date: 20070620 |