CN107645826A - A kind of Switching Power Supply integrated chip board layout structure - Google Patents
A kind of Switching Power Supply integrated chip board layout structure Download PDFInfo
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- CN107645826A CN107645826A CN201710846731.1A CN201710846731A CN107645826A CN 107645826 A CN107645826 A CN 107645826A CN 201710846731 A CN201710846731 A CN 201710846731A CN 107645826 A CN107645826 A CN 107645826A
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- power supply
- integrated chip
- switching power
- supply integrated
- layout structure
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Abstract
The present invention discloses a kind of Switching Power Supply integrated chip board layout structure, including printed circuit board (PCB), and the front of printed circuit board (PCB) establishes positive GND networks, at least five vias are set on positive GND networks；Printed circuit back lays back side GND networks.The present invention not only establishes GND networks in printing front, and increase GND networks in printed circuit back, simultaneously at least five vias are made a call on positive GND networks, increase number of vias, while conveyance capacity is effectively ensured, increase the area of dissipation of Switching Power Supply integrated chip, reduce the temperature of Switching Power Supply integrated chip, the power attenuation of Switching Power Supply integrated chip is reduced, saves the energy, reduces the power cost of client.
Description
Technical field
The present invention relates to Switching Power Supply integrated chip board layout construction applications, and in particular to a kind of new Switching Power Supply
Integrated chip board layout structure.
Background technology
With developing rapidly for Internet technology, people are increasing to the demand of server.In present informationized society
Under the background of extensive application, how improving the efficiency of server, save the energy and reduce cost be one of server technology
Important development direction.
Server board upper switch power supply integrated chip is a kind of control of integrated switch power voltage conversion, compensation, anti-
The functions such as feedback, protection are widely used in the voltage conversion of various DC-DCs in the controller of one.
At present in the layout of Switching Power Supply integrated chip, heat dissipation plate is directly with printed circuit plate weld, and heat dissipation plate is with printing
The contact area of circuit board is too small, causes area of dissipation inadequate, when heat caused by Switching Power Supply progress Power convert can not
Dissipating in time causes Switching Power Supply integrated chip temperature to raise, and reduces power supply integrated chip operating efficiency.
The content of the invention
To solve the above problems, the present invention provides a kind of new Switching Power Supply integrated chip board layout structure, to carry
High chip operation efficiency, save the energy.
The technical scheme is that：A kind of Switching Power Supply integrated chip board layout structure, including printed circuit board (PCB), print
Positive GND networks are established in the front of printed circuit board, and at least five vias are set on positive GND networks；Printed circuit back is spread
If back side GND networks.
Further, heat dissipation plate is welded on positive GND networks.
Further, the size of positive GND networks is identical with heat dissipation plate size.
Further, the size of back side GND networks is not less than the size of positive GND networks.
Further, 9 vias are set on positive GND networks.
Further, Switching Power Supply integrated chip is TPS53353 chips.
Switching Power Supply integrated chip board layout structure provided by the invention, GND networks not only are established in printing front, and
Increase GND networks in printed circuit back, while at least five vias made a call on positive GND networks, increase number of vias,
While conveyance capacity is effectively ensured, increase the area of dissipation of Switching Power Supply integrated chip, reduce Switching Power Supply integrated chip
Temperature, reduce the power attenuation of Switching Power Supply integrated chip, save the energy, reduce the power cost of client.
Brief description of the drawings
Fig. 1 is specific embodiment of the invention Switching Power Supply integrated chip board front partial layout schematic diagram.
Fig. 2 is specific embodiment of the invention Switching Power Supply integrated chip board back side partial layout schematic diagram.
In figure, 1- heat dissipation plates, 2- vias, 3- back sides GND networks.
Embodiment
Below in conjunction with the accompanying drawings and the present invention will be described in detail by specific embodiment, and following examples are to the present invention
Explanation, and the invention is not limited in implementation below.
As illustrated in fig. 1 and 2, the Switching Power Supply integrated chip board layout structure that the present embodiment provides, including printed circuit
Positive GND networks are established in plate, the front of printed circuit board (PCB), and at least five vias 2 are set on the positive GND networks, it is preferable that this
Nine vias 2 are made a call in embodiment on positive GND networks, ensure conveyance capacity.The back side laying back side GND nets of printed circuit board (PCB)
Network 3, increase the area of dissipation of Switching Power Supply integrated chip.
When in use, heat dissipation plate 1 is welded on positive GND networks, the size of positive GND networks should be with the size of heat dissipation plate 1
It is identical.
In addition, the size of back side GND networks 3 should be not less than the size of positive GND networks, further to increase radiating surface
Product.
It should be noted that because the other positions of printed circuit board (PCB) are not related to inventive point, therefore the accompanying drawing of the present embodiment is only
The partial schematic diagram of printed circuit board (PCB) is provided, and is laid out to represent clear, line layout represents for grey in figure.
Switching Power Supply integrated chip can be TPS53353 chips.
Below by taking TPS53353 chips as an example, illustrate that the present embodiment provides shadow of the layout structure to chip cooling effect
Ring.
Existing TPS53353 chip layouts do not have back side GND networks 3, when TPS53353 normal works are in 20A Working mould
During formula, caused heat is about 1.5W, according to 27.2 °C/W of temperature rise coefficient in TPS53353 technical manuals, under conventional in layout
TPS53353 rise temperature be：
1.5W*27.2°C/W=40°C
And the layout after the present embodiment improvement, the temperature that TPS53353 rises is 1.5W*27.2 °/2C/W=20 °C.
Under conditions of 25 degree of room temperature, the temperature of conventional in layout chip is laid out chip temperature after being improved for 65 degree is 45
Degree, according to TPS53353 chip controls switch temperature and the relation of impedance, the impedance of controlling switch can be allowed to decline 0.04 milliohm,
Therefore the energy saved is I*I*R*2=0.032W.
Usual every server has 30 groups or so of Switching Power Supply control chip, and the layout structure of the present embodiment can be every
The energy about 1W that platform server is saved, save client's power cost.
Disclosed above is only the preferred embodiment of the present invention, but the present invention is not limited to this, any this area
What technical staff can think does not have creative change, and some improvement made without departing from the principles of the present invention and
Retouching, should all be within the scope of the present invention.
Claims (6)
- A kind of 1. Switching Power Supply integrated chip board layout structure, it is characterised in that including printed circuit board (PCB), printed circuit board (PCB) Positive GND networks are established in front, and at least five vias are set on positive GND networks；Printed circuit back lays back side GND nets Network.
- 2. Switching Power Supply integrated chip board layout structure according to claim 1, it is characterised in that positive GND networks Upper welding heat dissipation plate.
- 3. Switching Power Supply integrated chip board layout structure according to claim 2, it is characterised in that positive GND networks Size it is identical with heat dissipation plate size.
- 4. the Switching Power Supply integrated chip board layout structure according to claim 1,2 or 3, it is characterised in that back side GND The size of network is not less than the size of positive GND networks.
- 5. the Switching Power Supply integrated chip board layout structure according to claim 1,2 or 3, it is characterised in that positive GND 9 vias are set on network.
- 6. the Switching Power Supply integrated chip board layout structure according to claim 1,2 or 3, it is characterised in that switch electricity Source integrated chip is TPS53353 chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710846731.1A CN107645826A (en) | 2017-09-19 | 2017-09-19 | A kind of Switching Power Supply integrated chip board layout structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710846731.1A CN107645826A (en) | 2017-09-19 | 2017-09-19 | A kind of Switching Power Supply integrated chip board layout structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107645826A true CN107645826A (en) | 2018-01-30 |
Family
ID=61111844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710846731.1A Pending CN107645826A (en) | 2017-09-19 | 2017-09-19 | A kind of Switching Power Supply integrated chip board layout structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107645826A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982630A (en) * | 1997-11-06 | 1999-11-09 | Intel Corporation | Printed circuit board that provides improved thermal dissipation |
| US6173883B1 (en) * | 1998-11-17 | 2001-01-16 | Motorola, Inc. | Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium |
| CN1984531A (en) * | 2006-04-30 | 2007-06-20 | 华为技术有限公司 | Allocation wiring structure of printing circuit board |
| CN104010432A (en) * | 2013-02-26 | 2014-08-27 | 联发科技股份有限公司 | Printed circuit board structure with heat dissipation function |
-
2017
- 2017-09-19 CN CN201710846731.1A patent/CN107645826A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982630A (en) * | 1997-11-06 | 1999-11-09 | Intel Corporation | Printed circuit board that provides improved thermal dissipation |
| US6173883B1 (en) * | 1998-11-17 | 2001-01-16 | Motorola, Inc. | Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium |
| CN1984531A (en) * | 2006-04-30 | 2007-06-20 | 华为技术有限公司 | Allocation wiring structure of printing circuit board |
| CN104010432A (en) * | 2013-02-26 | 2014-08-27 | 联发科技股份有限公司 | Printed circuit board structure with heat dissipation function |
Non-Patent Citations (1)
| Title |
|---|
| TEXAS INSTRUMENTS: "TPS53353EVM-744", 《TI：HTTP://WWW.TI.COM.CN/PRODUCT/CN/TPS53353/TECHNICALDOCUMENTS》 * |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180130 |