CN206164577U - Router that thermal diffusivity is good - Google Patents
Router that thermal diffusivity is good Download PDFInfo
- Publication number
- CN206164577U CN206164577U CN201621268825.2U CN201621268825U CN206164577U CN 206164577 U CN206164577 U CN 206164577U CN 201621268825 U CN201621268825 U CN 201621268825U CN 206164577 U CN206164577 U CN 206164577U
- Authority
- CN
- China
- Prior art keywords
- semiconductor heat
- dissipating piece
- router
- thermal diffusivity
- dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a router that thermal diffusivity is good, including the circuit edition of books body (1) and encapsulation box, still include semiconductor cooling fin (2), the butt is held with semiconductor cooling fin's (2) refrigeration respectively to the surface of the circuit edition of books body (1) positive chip element (102) and capacity cell (101) and the pin welding point at the circuit edition of books body (1) back, the circuit edition of books body (1) is provided with independent source of power interface (104) of semiconductor cooling fin (2). The problem of present router because of the poor unstable operation who results in of heat dispersion can be overcome to this scheme.
Description
Technical field
The utility model is related to a kind of router, more particularly to the router that a kind of thermal diffusivity is good.
Background technology
Router (Router), is each LAN, the equipment of wide area network in connection internet, and it can be according to the situation of channel
Route is automatically selected and sets, with optimal path, by tandem sending signal.Router is the hinge of internet, " traffic
Police ".At present router has been widely used for all trades and professions, and the product of various different class has become realizes various backbone networks
The main force of inside connection, key internetworking and backbone network and internet interconnection business.Between route and switch
The main distinction is exactly that switch occurs in the OSI Reference Model second layer (data link layer), and route and occur in third layer, i.e. net
Network layers.This difference determines that route and switch need to use different control information during mobile message, so two
Person realizes that the mode of respective function is different.
For now, its weak heat-dissipating for the router of the similar site such as Internet bar.Generally, it route body
Product very little, without rational heat dissipation design in machine, and Internet bar is typically 24 HOUR ACCESS, therefore router radiating has become and asked
Topic, the overheated most direct impact of router is exactly fluctuation of service.
The content of the invention
In view of this, the purpose of this utility model is to provide a kind of good router of thermal diffusivity, overcomes route at present
Device caused fluctuation of service because of heat dispersion difference.
The utility model solves above-mentioned technical problem by following technological means：
A kind of good router of thermal diffusivity, including circuit board body and packaging cartridge, it is described also including semiconductor heat-dissipating piece
The pin pad on the surface and the circuit board body back side of the positive chip component of circuit board body and capacity cell respectively with
The refrigeration end of semiconductor heat-dissipating piece is abutted, and the circuit board body is provided with the independent current source interface of semiconductor heat-dissipating piece.
What is reached has technical effect that：The heating of router is mainly the various power components on circuit board, therefore we
Case installs the effect that corresponding semiconductor heat-dissipating piece reaches radiating on power component surface, and the principle is led with current this technology
The conventional meanses in domain are identical, but at present technology all have ignored a major issue, that is, the pin weldering of these power components
Contact can also produce substantial amounts of heat in real work, temperature is too high can affect circuit newly can be so as to affect whole equipment
Operation, therefore semiconductor heat-dissipating element is set in corresponding Pin locations in this programme, under normal circumstances semiconductor element is not
Therefore conductive had not only solved heat dissipation problem but also without interference with circuit.
As the further improvement of this programme, number and chip component and the capacity cell number of the semiconductor heat-dissipating piece
Sum is identical, and each element one semiconductor heat-dissipating piece of correspondence, the semiconductor heat-dissipating piece of the same side is connected to each other by insulation board
Connect, packaging cartridge inwall be provided with insulation board edge relative to draw-in groove, the entirety that semiconductor heat-dissipating piece and insulation board are formed leads to
The spacing fixation of draw-in groove is crossed, all semiconductor heat-dissipating pieces share power interface.
Because semiconductor element itself has radiating end, if not in time radiating will also result in impact, therefore in order to reduce
Semiconductor heat-dissipating piece, arranged for each element in this programme, rather than blindness is arranged to a monoblock, so both subtracts
Lack the heat of semiconductor heat-dissipating element generation itself and do not affect its integral heat sink performance.
As the further improvement of this programme, area and the corresponding element surface of the semiconductor heat-dissipating piece refrigeration end
Product is identical.
As the further improvement of this programme, connected by the way of parallel connection between the semiconductor heat-dissipating piece, and
Connection mode can be effectively ensured its job stability.
Used as the further improvement of this programme, the packaging cartridge is provided with corresponding with semiconductor heat-dissipating piece radiating end leading to
Air holes.Arranging ventilating opening can accelerate the radiating efficiency of semiconductor heat-dissipating piece radiating end.
The beneficial effects of the utility model：Compare with the router of traditional heat sinking function, this programme is by circuit
The positive and negative of plate arranges the semiconductor heat-dissipating piece of heat sinking function, only carries out radiating to chip component and compares compared with simple, we
Radiating effect in case is substantially more significantly.
Description of the drawings
Fig. 1 is the utility model configuration structure schematic diagram；
Fig. 2 is the structural representation of this practical circuit plate body.
Specific embodiment
The utility model is described in detail below with reference to accompanying drawing：
As shown in Figure 1 and Figure 2：
A kind of good router of thermal diffusivity, including circuit board body 1 and packaging cartridge, also including semiconductor heat-dissipating piece 2, institute
State surface and the pin weldering at the back side of circuit board body 1 of the positive chip component 102 of circuit board body 1 and capacity cell 101
Contact is abutted respectively with the refrigeration end of semiconductor heat-dissipating piece 2, and the circuit board body 1 is provided with the independence of semiconductor heat-dissipating piece 2
Power interface 104.
What wherein above-mentioned semiconductor heat-dissipating piece 2 was selected is the finished product produced on market, can be worked after energization, by
It is required under conditions of feature just to excite in general semiconductor heat-dissipating piece, therefore independent power supply is set in the present embodiment
Interface 104 can excited by supporting transformer frequency response, because these are all prior arts, not do excessive in the present embodiment
Illustrate, but it is worth emphasizing that the semiconductor heat-dissipating piece 2 used in the present embodiment is ceramic radiating fin, have under normal temperature good
Insulation effect.
As the further improvement of this programme, number and chip component 102 and the capacity cell of the semiconductor heat-dissipating piece 2
101 number sums are identical, and each element one semiconductor heat-dissipating piece 2 of correspondence, the semiconductor heat-dissipating piece 2 of the same side passes through to each other
Insulation board 201 connects, packaging cartridge inwall be provided with the edge of insulation board 201 relative to draw-in groove, semiconductor heat-dissipating piece 2 with insulation
Plate 201 formed entirely through the spacing fixation of draw-in groove, all semiconductor heat-dissipating pieces 2 share power interface 104.
I.e. each element is respectively provided with corresponding semiconductor heat-dissipating piece 2, and between semiconductor heat-dissipating piece 2 insulation board is used
201 connections so that the semiconductor heat-dissipating piece 2 of homonymy forms a whole plate, is easily installed fixation.
As the further improvement of this programme, area and the corresponding element table of the refrigeration end of semiconductor heat-dissipating piece 2
Area is identical.
Used as the further improvement of this programme, the semiconductor heat-dissipating piece 2 is connected each other by the way of parallel connection.
Used as the further improvement of this programme, the packaging cartridge is provided with corresponding with the radiating end of semiconductor heat-dissipating piece 2
Air vent.
Above example is only unrestricted to illustrate the technical solution of the utility model, although with reference to preferred embodiment pair
The utility model has been described in detail, it will be understood by those within the art that, can be to technology of the present utility model
Scheme is modified or equivalent, and without deviating from the objective and scope of technical solutions of the utility model, it all should cover
In the middle of right of the present utility model.
Claims (5)
1. the good router of a kind of thermal diffusivity, including circuit board body (1) and packaging cartridge, it is characterised in that：Also include partly leading
Surface and the circuit of body fin (2), the positive chip component (102) of the circuit board body (1) and capacity cell (101)
The pin pad at plate body (1) back side is abutted respectively with the refrigeration end of semiconductor heat-dissipating piece (2), the circuit board body (1)
It is provided with the independent current source interface (104) of semiconductor heat-dissipating piece (2).
2. the good router of a kind of thermal diffusivity according to claim 1, it is characterised in that：The semiconductor heat-dissipating piece
(2) number is identical with chip component (102) and capacity cell (101) number sum, and each element one semiconductor of correspondence dissipates
Backing (2), the semiconductor heat-dissipating piece (2) of the same side is connected to each other by insulation board (201), packaging cartridge inwall be provided with absolutely
Listrium (201) edge relative to draw-in groove, semiconductor heat-dissipating piece (2) is spacing entirely through draw-in groove with what insulation board (201) was formed
Fixed, all semiconductor heat-dissipating pieces (2) share power interface (104).
3. the good router of a kind of thermal diffusivity according to claim 2, it is characterised in that：The semiconductor heat-dissipating piece
(2) area of refrigeration end is identical with corresponding element surface product.
4. the good router of a kind of thermal diffusivity according to claim 2, it is characterised in that：The semiconductor heat-dissipating piece
(2) connected by the way of parallel connection between.
5. the good router of a kind of thermal diffusivity according to claim 1, it is characterised in that：The packaging cartridge be provided with
The corresponding air vent of semiconductor heat-dissipating piece (2) radiating end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621268825.2U CN206164577U (en) | 2016-11-23 | 2016-11-23 | Router that thermal diffusivity is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621268825.2U CN206164577U (en) | 2016-11-23 | 2016-11-23 | Router that thermal diffusivity is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206164577U true CN206164577U (en) | 2017-05-10 |
Family
ID=58660949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621268825.2U Expired - Fee Related CN206164577U (en) | 2016-11-23 | 2016-11-23 | Router that thermal diffusivity is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206164577U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107438350A (en) * | 2017-07-13 | 2017-12-05 | 深圳市智通电子有限公司 | A kind of passive heat radiation device and its manufacture method |
| CN109417862A (en) * | 2018-09-30 | 2019-03-01 | 北京比特大陆科技有限公司 | Circuit board calculates equipment and cooling cabinet |
-
2016
- 2016-11-23 CN CN201621268825.2U patent/CN206164577U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107438350A (en) * | 2017-07-13 | 2017-12-05 | 深圳市智通电子有限公司 | A kind of passive heat radiation device and its manufacture method |
| CN107438350B (en) * | 2017-07-13 | 2019-09-20 | 深圳市智通电子有限公司 | A kind of passive heat radiation device |
| CN109417862A (en) * | 2018-09-30 | 2019-03-01 | 北京比特大陆科技有限公司 | Circuit board calculates equipment and cooling cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170510 Termination date: 20171123 |