JP5422378B2 - Electrochemical element with terminal and mounting structure including the same - Google Patents

Electrochemical element with terminal and mounting structure including the same Download PDF

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JP5422378B2
JP5422378B2 JP2009507407A JP2009507407A JP5422378B2 JP 5422378 B2 JP5422378 B2 JP 5422378B2 JP 2009507407 A JP2009507407 A JP 2009507407A JP 2009507407 A JP2009507407 A JP 2009507407A JP 5422378 B2 JP5422378 B2 JP 5422378B2
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flat plate
plate portion
terminal
electrode
circuit board
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JPWO2008120455A1 (en
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知一 三田村
忠義 高橋
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/547—Terminals characterised by the disposition of the terminals on the cells
    • H01M50/548—Terminals characterised by the disposition of the terminals on the cells on opposite sides of the cell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/74—Terminals, e.g. extensions of current collectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78—Cases; Housings; Encapsulations; Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/216—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for button or coin cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/552—Terminals characterised by their shape
    • H01M50/559—Terminals adapted for cells having curved cross-section, e.g. round, elliptic or button cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Battery Mounting, Suspending (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Sealing Battery Cases Or Jackets (AREA)

Description

本発明は、端子付き電気化学素子およびこれを含む実装構造体に関し、特に端子形状と電気化学素子の回路基板への実装形態に関する。電気化学素子には、携帯用電子機器等に用いられるコイン型やボタン型形状をした電池やキャパシタ等が含まれる。また、本発明は、端子付き電気化学素子の回路基板への実装方法に関する。   The present invention relates to an electrochemical element with a terminal and a mounting structure including the same, and more particularly to a terminal shape and a mounting form of the electrochemical element on a circuit board. Electrochemical elements include coin-type and button-type batteries, capacitors, and the like used for portable electronic devices and the like. Moreover, this invention relates to the mounting method to the circuit board of the electrochemical element with a terminal.

携帯用電子機器のバックアップ電源として、小型のコイン型やボタン型形状をした電気化学素子が広く用いられている。これらの電気化学素子は、互いに対向配置された外径の異なる第１電極缶と第２電極缶とを有する。各電極缶の所定箇所には、通常、端子が溶接されている。これらの端子は、例えばリフロー法による表面実装により、携帯用電子機器等の回路基板に半田付けされる。電気化学素子には、電池とキャパシタが含まれる。   As a backup power source for portable electronic devices, electrochemical devices having a small coin shape or button shape are widely used. These electrochemical elements have a first electrode can and a second electrode can that are arranged opposite to each other and have different outer diameters. A terminal is usually welded to a predetermined location of each electrode can. These terminals are soldered to a circuit board of a portable electronic device or the like, for example, by surface mounting by a reflow method. Electrochemical elements include batteries and capacitors.

近年、携帯用電子機器の小型化、薄型化が進む中で、部品や回路基板等についても小型化、薄型化が要求されている。表面実装用の電気化学素子についても、以下のように、様々な提案がなされている。   In recent years, as portable electronic devices have become smaller and thinner, components and circuit boards have been required to be smaller and thinner. Various proposals have been made for surface mount electrochemical elements as follows.

特許文献１では、回路基板側に位置する電極缶に接続された端子の形状を工夫することにより、実装面積の削減が図られている。   In Patent Document 1, the mounting area is reduced by devising the shape of the terminal connected to the electrode can located on the circuit board side.

特許文献２では、従来は外径の大きい方の電極缶の底部外面に溶接されていた端子を、電極缶側面に溶接することが提案されている。これにより、端子付き電気化学素子の高さを端子の厚み分だけ減らすことができる。   Patent Document 2 proposes welding a terminal, which has been conventionally welded to the outer surface of the bottom of the electrode can having the larger outer diameter, to the side surface of the electrode can. Thereby, the height of the electrochemical element with a terminal can be reduced by the thickness of the terminal.

特許文献３では、一方の電極缶の底部外面を直接回路基板に半田付けすることにより、実装面積の削減が図られている。   In Patent Document 3, the mounting area is reduced by soldering the outer surface of the bottom of one electrode can directly to a circuit board.

特許文献４では、電気化学素子の外周に内接する四角形で囲まれた領域中に端子を設置することにより、実装面積の削減が図られている。   In Patent Document 4, a mounting area is reduced by installing a terminal in a region surrounded by a rectangle inscribed in the outer periphery of the electrochemical element.

特許文献５では、回路基板に貫通孔を設け、貫通孔に端子付き電気化学素子を収容し、リベットにより、端子を回路基板に接続することが提案されている。   Patent Document 5 proposes that a through hole is provided in a circuit board, an electrochemical element with a terminal is accommodated in the through hole, and the terminal is connected to the circuit board by a rivet.

特開２００３−９２１０２号公報JP 2003-92102 A 特開２００４−１６５５３７号公報JP 2004-165537 A 特開２００４−３２７２０１号公報JP 2004-327201 A 特開２００５−３１７８５０号公報JP 2005-317850 A 特開２００７−２４２６２９号公報JP 2007-242629 A

特許文献１および４の提案は、実装面積の削減には有効であるが、回路基板に接続された端子付き電気化学素子の高さを低減できるものではない。また、回路基板に設置する際の位置決めが容易ではない。   The proposals in Patent Documents 1 and 4 are effective in reducing the mounting area, but cannot reduce the height of the electrochemical element with terminals connected to the circuit board. Moreover, positioning when installing on a circuit board is not easy.

特許文献２および３の提案は、端子付き電気化学素子の高さを端子の厚み分だけ減少させることができるが、これ以上の低背化は困難である。   The proposals in Patent Documents 2 and 3 can reduce the height of the electrochemical element with a terminal by the thickness of the terminal, but it is difficult to further reduce the height.

特許文献５は、回路基板に接続された電気化学素子の低背化には有効であるが、リフロー法による回路基板への半田付けができず、回路基板への接続が煩雑になる。   Patent Document 5 is effective in reducing the height of an electrochemical element connected to a circuit board, but cannot be soldered to the circuit board by the reflow method, and connection to the circuit board becomes complicated.

本発明は、従来よりも低背化が可能であり、回路基板への実装も容易な端子付き電気化学素子およびこれを含む実装構造体を提供するものである。
すなわち、本発明は、第１電極缶、第２電極缶、第１電極缶の底部内面に電気的に接続された第１電極、第２電極缶の底部内面に電気的に接続された第２電極、第１電極缶の底部外面に電気的に接続された第１端子、および第２電極缶の底部外面に電気的に接続された第２端子を具備し、第１端子は、第１電極缶の底部外面に接合された第１極性本体部と、第１電極缶の底部外面に対向しない第１極性平板部とを有し、第２端子は、第２電極缶の底部外面に接合された第２極性本体部と、第２電極缶の底部外面に対向しない第２極性平板部とを有し、第１極性平板部と第２極性平板部とは、同一平面に位置し、かつ前記平面が、第１電極缶の底部外面と第２電極缶の底部外面との間に位置する、端子付き電気化学素子に関する。
第１極性平板部および第２極性平板部は、それぞれ回路基板のランドパターンに半田付けされる部位である。
第１極性平板部と第２極性平板部とが位置する平面とは、第１極性平板部のランドパターンとの接合面と、第２極性平板部のランドパターンとの接合面と、が位置する平面である。なお、ランドパターンの高さが異なる場合、第１極性平板部と第２極性平板部の高さを、ランドパターンの高さに応じて多少変更してもよい。このような態様の電気化学素子および実装構造体も、第１極性平板部と第２極性平板部とが同一平面に位置する態様と実質的に同じと考えることができ、本発明の効果を奏することができる。ただし、第１極性平板部と第２極性平板部の高さの差は、０．５ｍｍ以下であることが好ましい。 The present invention provides a terminal-attached electrochemical element that can be reduced in height and can be easily mounted on a circuit board, and a mounting structure including the same.
That is, the present invention provides the first electrode can, the second electrode can, the first electrode electrically connected to the bottom inner surface of the first electrode can, and the second electrode electrically connected to the bottom inner surface of the second electrode can. An electrode, a first terminal electrically connected to the outer surface of the bottom of the first electrode can, and a second terminal electrically connected to the outer surface of the bottom of the second electrode can, the first terminal being a first electrode The first polar body part joined to the outer surface of the bottom of the can and the first polar flat plate part not facing the outer surface of the bottom of the first electrode can, and the second terminal is joined to the outer surface of the bottom of the second electrode can. The second polarity main body portion and the second polarity flat plate portion that does not oppose the bottom outer surface of the second electrode can, the first polarity flat plate portion and the second polarity flat plate portion are located in the same plane, and The electrochemical device with a terminal in which a plane is located between the bottom outer surface of a 1st electrode can and the bottom outer surface of a 2nd electrode can.
The first polarity flat plate portion and the second polarity flat plate portion are portions soldered to the land pattern of the circuit board, respectively.
The plane on which the first polarity flat plate portion and the second polarity flat plate portion are located is the position where the bonding surface with the land pattern of the first polarity flat plate portion and the bonding surface with the land pattern of the second polarity flat plate portion are located. It is a plane. In addition, when the height of a land pattern differs, the height of a 1st polarity flat plate part and a 2nd polarity flat plate part may be changed a little according to the height of a land pattern. The electrochemical element and mounting structure of such an aspect can also be considered to be substantially the same as the aspect in which the first polar flat plate portion and the second polar flat plate portion are located on the same plane, and the effects of the present invention are exhibited. be able to. However, the difference in height between the first polar flat plate portion and the second polar flat plate portion is preferably 0.5 mm or less.

本発明の好ましい一態様では、第１端子または第２端子は、更に、第１極性平板部および第２極性平板部と同一平面に位置する補助平板部を有する。第１極性平板部および第２極性平板部を回路基板のランドパターンに半田付けする前に、補助平板部を回路基板に接着することにより、半田付けを効率良く行うことができる。以下、補助平板部を有さない端子付き電気化学素子を第１態様の電気化学素子、補助平板部を有する端子付き電気化学素子を第２態様の電気化学素子、と称する。
なお、補助平板部と、第１極性平板部および第２極性平板部との高さを、ランドパターンの高さに応じて多少変更してもよい。このような態様の電気化学素子および実装構造体も、補助平板部と第１極性平板部と第２極性平板部とが同一平面に位置する態様と実質的に同じと考えることができ、本発明の効果を奏することができる。ただし、補助平板部と第１極性平板部との高さの差および補助平板部と第２極性平板部との高さの差は、それぞれ０．５ｍｍ以下であることが好ましい。 In a preferred aspect of the present invention, the first terminal or the second terminal further includes an auxiliary flat plate portion located in the same plane as the first polar flat plate portion and the second polar flat plate portion. Before the first polar flat plate portion and the second polar flat plate portion are soldered to the land pattern of the circuit board, the auxiliary flat plate portion is bonded to the circuit board, so that the soldering can be performed efficiently. Hereinafter, the electrochemical element with a terminal having no auxiliary flat plate portion is referred to as an electrochemical element of the first aspect, and the electrochemical element with a terminal having an auxiliary flat plate portion is referred to as an electrochemical element of the second aspect.
The heights of the auxiliary flat plate portion, the first polar flat plate portion, and the second polar flat plate portion may be slightly changed according to the height of the land pattern. The electrochemical element and the mounting structure of such an aspect can be considered to be substantially the same as the aspect in which the auxiliary flat plate portion, the first polar flat plate portion, and the second polar flat plate portion are located on the same plane. The effect of can be produced. However, the difference in height between the auxiliary flat plate portion and the first polar flat plate portion and the difference in height between the auxiliary flat plate portion and the second polar flat plate portion are preferably 0.5 mm or less, respectively.

電気化学素子を、第１極性平板部および第２極性平板部とが位置する平面の法線方向から見たとき、電気化学素子の形状は「円の形状」であることが好ましい。ただし、「円の形状」は、厳密な真円形である必要はなく、例えば円径に近い楕円形のように、ほぼ円形であればよい。   When the electrochemical device is viewed from the normal direction of the plane on which the first polar flat plate portion and the second polar flat plate portion are located, the shape of the electrochemical device is preferably a “circular shape”. However, the “circle shape” does not have to be a strict true circle, and may be substantially circular, for example, an ellipse close to a circle diameter.

電気化学素子の第１極性平板部および第２極性平板部は、前記円（すなわち電気化学素子の上面図の輪郭）に外接する四角形で囲まれた領域中に納まるように配置されていることが好ましい。   The first polar flat plate portion and the second polar flat plate portion of the electrochemical element may be arranged so as to fit in a region surrounded by a rectangle circumscribing the circle (that is, the outline of the top view of the electrochemical element). preferable.

第１端子または第２端子が、補助平板部を有する場合、補助平板部も、前記円（すなわち電気化学素子の上面図の輪郭）に外接する四角形で囲まれた領域中に納まるように配置されていることが好ましい。   In the case where the first terminal or the second terminal has an auxiliary flat plate portion, the auxiliary flat plate portion is also disposed so as to be contained in a region surrounded by a rectangle circumscribing the circle (that is, the outline of the top view of the electrochemical element). It is preferable.

本発明は、電気化学素子が、電池またはキャパシタである場合に有効である。   The present invention is effective when the electrochemical device is a battery or a capacitor.

本発明は、また、貫通孔もしくは凹部とランドパターンとを有する回路基板、および前記貫通孔もしくは凹部に装填された第１態様の端子付き電気化学素子を具備し、第１極性平板部および第２極性平板部が、ランドパターンに半田付けされている、実装構造体に関する。   The present invention also includes a circuit board having a through hole or recess and a land pattern, and the electrochemical element with a terminal of the first aspect loaded in the through hole or recess, and the first polar flat plate portion and the second plate portion. The present invention relates to a mounting structure in which a polar flat plate portion is soldered to a land pattern.

本発明は、また、貫通孔もしくは凹部とランドパターンとを有する回路基板、および貫通孔もしくは凹部に装填された第２態様の端子付き電気化学素子を具備し、第１極性平板部および第２極性平板部が、ランドパターンに半田付けされており、補助平板部が、回路基板に接着されている、実装構造体に関する。   The present invention also includes a circuit board having a through hole or recess and a land pattern, and an electrochemical element with a terminal of the second aspect loaded in the through hole or recess, and the first polarity flat plate portion and the second polarity. The present invention relates to a mounting structure in which a flat plate portion is soldered to a land pattern and an auxiliary flat plate portion is bonded to a circuit board.

本発明は、更に、第１態様の電気化学素子の回路基板への実装方法であって、（i）貫通孔もしくは凹部とランドパターンとを有する回路基板を供給する工程、（ii）貫通孔もしくは凹部に、電気化学素子を装填する工程、および（iii）リフロー法により、第１極性平板部および第２極性平板部を、ランドパターンに半田付けする工程、を含む端子付き電気化学素子の回路基板への実装方法に関する。   The present invention further relates to a method for mounting the electrochemical device of the first aspect on a circuit board, wherein (i) a step of supplying a circuit board having a through hole or a recess and a land pattern, (ii) a through hole or A circuit board for an electrochemical element with a terminal, comprising: loading an electrochemical element into the recess; and (iii) soldering the first polar flat plate part and the second polar flat plate part to the land pattern by a reflow method. Related to the implementation method.

本発明は、更に、第２態様の電気化学素子の回路基板への実装方法であって、（i）貫通孔もしくは凹部とランドパターンとを有する回路基板を供給する工程、（ii）貫通孔もしくは凹部に、電気化学素子を装填する工程、（iii）補助平板部を回路基板に接着する工程、および（iv）リフロー法により、第１極性平板部および第２極性平板部を、ランドパターンに半田付けする工程、を含む端子付き電気化学素子の回路基板への実装方法に関する。   The present invention further relates to a method for mounting the electrochemical element of the second aspect on a circuit board, wherein (i) a step of supplying a circuit board having a through hole or a recess and a land pattern, (ii) a through hole or A step of loading the electrochemical element in the recess, (iii) a step of bonding the auxiliary flat plate portion to the circuit board, and (iv) soldering the first polar flat plate portion and the second polar flat plate portion to the land pattern by the reflow method. The process of attaching to a circuit board of the electrochemical element with a terminal including the process of attaching.

従来の実装構造体は、回路基板と端子と電気化学素子との厚みが積算された高さを有する。一方、上記のような端子付き電気化学素子を、回路基板に予め設けられた貫通孔もしくは凹部に装填する場合、電気化学素子本体は、回路基板に埋まったような状態となる。よって、実装構造体の飛躍的な低背化が可能となる。また、上記のような端子付き電気化学素子を用いることにより、従来に比べて、電気化学素子の回路基板への実装が容易となる。   The conventional mounting structure has a height obtained by integrating the thicknesses of the circuit board, the terminal, and the electrochemical element. On the other hand, when the electrochemical element with a terminal as described above is loaded into a through hole or a recess provided in advance in the circuit board, the electrochemical element body is in a state of being buried in the circuit board. Therefore, the mounting structure can be dramatically reduced in height. Further, by using the electrochemical element with a terminal as described above, it becomes easier to mount the electrochemical element on the circuit board as compared with the conventional case.

本発明の第１実施形態に係る端子付き電気化学素子の上面図である。It is a top view of the electrochemical element with a terminal concerning a 1st embodiment of the present invention. 本発明の第１実施形態に係る端子付き電気化学素子の側面図である。It is a side view of the electrochemical device with a terminal concerning a 1st embodiment of the present invention. 本発明の第２実施形態に係る実装構造体の上面図である。It is a top view of the mounting structure concerning a 2nd embodiment of the present invention. 本発明の第２実施形態に係る実装構造体の一部を断面にした側面図である。It is the side view which made a section of a mounting structure concerning a 2nd embodiment of the present invention a section. 本発明の第３実施形態に係る端子付き電気化学素子の上面図である。It is a top view of the electrochemical element with a terminal concerning a 3rd embodiment of the present invention. 本発明の第３実施形態に係る端子付き電気化学素子の側面図である。It is a side view of the electrochemical element with a terminal concerning a 3rd embodiment of the present invention. 本発明の第４実施形態に係る端子付き電気化学素子の上面図である。It is a top view of the electrochemical element with a terminal concerning a 4th embodiment of the present invention. 本発明の第４実施形態に係る端子付き電気化学素子の側面図である。It is a side view of the electrochemical element with a terminal concerning a 4th embodiment of the present invention. 本発明の第５実施形態に係る実装構造体の上面図である。It is a top view of the mounting structure concerning a 5th embodiment of the present invention. 本発明の第５実施形態に係る実装構造体の側面図である。It is a side view of the mounting structure concerning a 5th embodiment of the present invention. 本発明の実施例１に係る実装構造体の一部を断面にした側面図である。It is the side view which made a part of mounting structure concerning Example 1 of the present invention a section. 本発明の実施例２に係る実装構造体の一部を断面にした側面図である。It is the side view which made a part of mounting structure concerning Example 2 of the present invention a section. 比較例１に係る従来の実装構造体の側面図である。It is a side view of the conventional mounting structure concerning the comparative example 1.

第１実施形態
図１は、本発明の第１態様の端子付き電気化学素子の一例を示す上面図である。図２は同じ端子付き電気化学素子の側面図である。
電気化学素子は、互いに対向配置された第１電極缶１１と第２電極缶１２とを有する。第１電極缶１１の外径は第２電極缶１２の外径より大きくなっており、第２電極缶１２はその底部外面を除いて第１電極缶１１に収容されている。第１電極缶１１の底部内面には第１電極（図示せず）が電気的に接続されており、第２電極缶１２の底部内面には第２電極（図示せず）が電気的に接続されている。第１電極缶１１の側部内面は、絶縁材料１３を介して、第２電極缶１２の側部外面に密着している。第１電極缶１１および第２電極缶１２は、それぞれステンレス鋼等の金属製である。 First Embodiment FIG. 1 is a top view showing an example of a terminal-equipped electrochemical element according to the first aspect of the present invention. FIG. 2 is a side view of the same electrochemical device with a terminal.
The electrochemical element includes a first electrode can 11 and a second electrode can 12 that are arranged to face each other. The outer diameter of the 1st electrode can 11 is larger than the outer diameter of the 2nd electrode can 12, and the 2nd electrode can 12 is accommodated in the 1st electrode can 11 except the bottom part outer surface. A first electrode (not shown) is electrically connected to the inner surface of the bottom of the first electrode can 11, and a second electrode (not shown) is electrically connected to the inner surface of the bottom of the second electrode can 12. Has been. The inner surface of the side portion of the first electrode can 11 is in close contact with the outer surface of the side portion of the second electrode can 12 via the insulating material 13. The first electrode can 11 and the second electrode can 12 are each made of metal such as stainless steel.

第１電極缶１１の底部外面に電気的に接続された第１端子１４は、段部１４ｘを有するように加工された金属板からなり、段部１４ｘの両側に第１極性本体部１４ｙおよび第１極性平板部１４ｚを有する。本体部１４ｙは、第１電極缶１１の底部外面に接合されている。平板部１４ｚは、第１電極缶１１の底部外面と第２電極缶１２の底部外面との間に位置している。第１電極缶１１の底部外面に対向しない平板部１４ｚは、リフロー炉を通過する際に、回路基板に設けられたランドパターンに半田付けされる。   The first terminal 14 electrically connected to the outer surface of the bottom portion of the first electrode can 11 is made of a metal plate processed to have a step portion 14x, and the first polarity main body portion 14y and the first polar body portion 14y are formed on both sides of the step portion 14x. It has 1 polar flat plate part 14z. The main body 14 y is joined to the outer surface of the bottom of the first electrode can 11. The flat plate portion 14 z is located between the bottom outer surface of the first electrode can 11 and the bottom outer surface of the second electrode can 12. The flat plate portion 14z that does not face the bottom outer surface of the first electrode can 11 is soldered to a land pattern provided on the circuit board when passing through the reflow furnace.

第２電極缶１２の底部外面に電気的に接続された第２端子１５は、段部１５ｘを有するように加工された金属板からなり、段部１５ｘの両側に第２極性本体部１５ｙおよび第２極性平板部１５ｚを有する。本体部１５ｙは、第２電極缶１２の底部外面に接合されている。平板部１５ｚは、第１電極缶１１の底部外面と第２電極缶１２の底部外面との間に位置している。第２電極缶１２の底部外面に対向しない平板部１５ｚは、リフロー炉を通過する際に、回路基板に設けられたランドパターンに半田付けされる。   The second terminal 15 electrically connected to the bottom outer surface of the second electrode can 12 is made of a metal plate processed so as to have a step portion 15x, and the second polarity main body portion 15y and the second polar body portion 15y are formed on both sides of the step portion 15x. It has a bipolar plate portion 15z. The main body portion 15 y is joined to the bottom outer surface of the second electrode can 12. The flat plate portion 15 z is located between the bottom outer surface of the first electrode can 11 and the bottom outer surface of the second electrode can 12. The flat plate portion 15z that does not face the bottom outer surface of the second electrode can 12 is soldered to a land pattern provided on the circuit board when passing through the reflow furnace.

第１端子１４および第２端子１５は、それぞれステンレス鋼等の金属製である。平板部１４ｚおよび平板部１５ｚは、それぞれ第１電極缶１１および第２電極缶１２の底部外面に、レーザー溶接等により接合されている。平板部１４ｚおよび平板部１５ｚには、通常、十分な半田付け強度を確保するために、それぞれ半田メッキが施されている。   The first terminal 14 and the second terminal 15 are each made of metal such as stainless steel. The flat plate portion 14z and the flat plate portion 15z are joined to the outer surfaces of the bottom portions of the first electrode can 11 and the second electrode can 12 by laser welding or the like, respectively. The flat plate portion 14z and the flat plate portion 15z are usually plated with solder in order to ensure sufficient soldering strength.

第１端子１４の段部１４ｘおよび第２端子１５の段部１５ｘの高さは、それぞれ、平板部１４ｚおよび平板部１５ｚが同一平面に位置するように調節されている。よって、平板部１４ｚおよび平板部１５ｚが位置する平面は、第１電極缶１１の底部外面と第２電極缶１２の底部外面との間に位置することになる。なお、平板部１４ｚおよび１５ｚが第２電極缶の底部外面と同じ平面に位置する場合も本発明に含まれる。すなわち、第２端子は、段部１５ｘを有してもよく、有さなくてもよい。   The heights of the step portion 14x of the first terminal 14 and the step portion 15x of the second terminal 15 are adjusted so that the flat plate portion 14z and the flat plate portion 15z are located on the same plane, respectively. Therefore, the flat surface on which the flat plate portion 14z and the flat plate portion 15z are located is located between the bottom outer surface of the first electrode can 11 and the bottom outer surface of the second electrode can 12. Note that the present invention also includes the case where the flat plate portions 14z and 15z are located on the same plane as the bottom outer surface of the second electrode can. That is, the second terminal may or may not have the step portion 15x.

なお、本発明は、第１電極缶が正極、第２電極缶が負極である場合、および、第１電極缶が負極、第２電極缶が正極である場合、の両方に適用できる。   The present invention can be applied to both the case where the first electrode can is a positive electrode and the second electrode can is a negative electrode, and the case where the first electrode can is a negative electrode and the second electrode can is a positive electrode.

第２実施形態
図３は、本発明の第１態様の端子付き電気化学素子を含む実装構造体の一例を示す上面図である。図４は同じ実装構造体の側面図である。ただし、実装構造体を構成する回路基板については、電気化学素子と接続されるランドパターン周辺部のみを示す。また、図４では、回路基板、第１端子および第２端子だけを断面で示す。 2nd Embodiment FIG. 3: is a top view which shows an example of the mounting structure containing the electrochemical element with a terminal of the 1st aspect of this invention. FIG. 4 is a side view of the same mounting structure. However, only the peripheral part of the land pattern connected to the electrochemical element is shown for the circuit board constituting the mounting structure. In FIG. 4, only the circuit board, the first terminal, and the second terminal are shown in cross section.

回路基板２６には、予め貫通孔２７が形成されている。貫通孔には、図１および図２に示した電気化学素子と、第１端子１４の段部１４ｘから本体部１４ｙまでの部分が装填されている。この状態で、第１端子１４の平板部１４ｚおよび第２端子１５の平板部１５ｚが、リフロー法により、回路基板２６の表面に設けられたランドパターン２８、２９に半田付けされる。よって、端子付き電気化学素子は、回路基板２６に埋設されたような状態となり、実装構造体の低背化が可能となる。   A through hole 27 is formed in the circuit board 26 in advance. The electrochemical element shown in FIGS. 1 and 2 and a portion from the step portion 14x to the main body portion 14y of the first terminal 14 are loaded in the through hole. In this state, the flat plate portion 14z of the first terminal 14 and the flat plate portion 15z of the second terminal 15 are soldered to the land patterns 28 and 29 provided on the surface of the circuit board 26 by the reflow method. Therefore, the electrochemical element with a terminal is in a state of being embedded in the circuit board 26, and the mounting structure can be reduced in height.

貫通孔の代わりに回路基板２６に予め凹部を形成しておき、電気化学素子を凹部に装填する場合も、実装構造体の低背化が可能である。   Even when a recess is formed in advance in the circuit board 26 instead of the through hole and an electrochemical element is loaded in the recess, the mounting structure can be reduced in height.

第３実施形態
図５は、本発明の第１態様の端子付き電気化学素子の他の一例を示す上面図である。図６は同じ端子付き電気化学素子の側面図である。この端子付き電気化学素子は、第１端子２４および第２端子２５の形状が異なる点以外、図１および図２に示した端子付き電気化学素子と同じ構造を有する。 3rd Embodiment FIG. 5: is a top view which shows another example of the electrochemical element with a terminal of the 1st aspect of this invention. FIG. 6 is a side view of the same electrochemical device with a terminal. This electrochemical device with a terminal has the same structure as the electrochemical device with a terminal shown in FIGS. 1 and 2 except that the shapes of the first terminal 24 and the second terminal 25 are different.

第１電極缶１１の底部外面に電気的に接続された第１端子２４は、段部２４ｘを有するように加工された金属板からなり、段部２４ｘの両側に第１極性本体部２４ｙおよび第１極性平板部２４ｚを有する。同様に、第２電極缶１２の底部外面に電気的に接続された第２端子２５は、段部２５ｘを有するように加工された金属板からなり、段部２５ｘの両側に第２極性本体部２５ｙおよび第２極性平板部２５ｚを有する。   The first terminal 24 electrically connected to the outer surface of the bottom of the first electrode can 11 is made of a metal plate processed so as to have a step portion 24x. It has a unipolar flat plate portion 24z. Similarly, the second terminal 25 electrically connected to the outer surface of the bottom portion of the second electrode can 12 is made of a metal plate processed to have a step portion 25x, and the second polar body portion is formed on both sides of the step portion 25x. 25y and a second polar flat plate portion 25z.

本体部２４ｙおよび本体部２５ｙの形状は、特に限定されないが、ランドパターンに半田付けされる平板部２４ｚおよび平板部２５ｚは、いずれも、ほぼ三角形の先端部を有する。
ここで、電気化学素子を、第１極性平板部２４ｚと第２極性平板部２５ｚとが位置する平面の法線方向から見たとき、電気化学素子の形状は、円形となっている。平板部２４ｚおよび平板部２５ｚは、この円に外接する四角形で囲まれた領域中に納められている。これにより、実装面積を小さくすることが可能となる。円に外接する四角形は、正四角形、長方形、平行四辺形、菱形などのいずれでも良いが、正四角形であることが最も好ましい。 The shapes of the main body portion 24y and the main body portion 25y are not particularly limited, but both the flat plate portion 24z and the flat plate portion 25z that are soldered to the land pattern have substantially triangular tip portions.
Here, when the electrochemical element is viewed from the normal direction of the plane where the first polar flat plate portion 24z and the second polar flat plate portion 25z are located, the shape of the electrochemical element is circular. The flat plate portion 24z and the flat plate portion 25z are housed in a region surrounded by a rectangle circumscribing the circle. As a result, the mounting area can be reduced. The quadrilateral circumscribing the circle may be any of a regular tetragon, a rectangle, a parallelogram, a rhombus, etc., but is most preferably a regular tetragon.

第４実施形態
図７は、本発明の第２態様の端子付き電気化学素子の一例を示す上面図である。図８は同じ端子付き電気化学素子の側面図である。この端子付き電気化学素子は、第２端子３５の形状が異なる点以外、図５および図６に示した端子付き電気化学素子と同じ構造を有する。 4th Embodiment FIG. 7: is a top view which shows an example of the electrochemical element with a terminal of the 2nd aspect of this invention. FIG. 8 is a side view of the same electrochemical device with terminals. This electrochemical element with a terminal has the same structure as the electrochemical element with a terminal shown in FIGS. 5 and 6 except that the shape of the second terminal 35 is different.

第２端子３５は、Ｔ字状の金属板からなる。Ｔ字状の本体部３５ｙは、第２電極缶１２の底部外面に接合されている。本体部３５ｙの３つの先端近くには、それぞれ段部３５ｘａ、段部３５ｘｂおよび段部３５ｘｃならびに各段部に続く平板部３５ｚａ、平板部３５ｚｂおよび平板部３５ｚｃが形成されている。平板部３５ｚａ、平板部３５ｚｂおよび平板部３５ｚｃは、いずれも第１電極缶１１の底部外面と第２電極缶１２の底部外面との間に位置している。   The second terminal 35 is made of a T-shaped metal plate. The T-shaped main body portion 35 y is joined to the bottom outer surface of the second electrode can 12. Near the three tips of the main body portion 35y, a step portion 35xa, a step portion 35xb and a step portion 35xc, and a flat plate portion 35za, a flat plate portion 35zb and a flat plate portion 35zc following each step portion are formed. The flat plate portion 35za, the flat plate portion 35zb, and the flat plate portion 35zc are all located between the bottom outer surface of the first electrode can 11 and the bottom outer surface of the second electrode can 12.

第１端子２４の段部２４ｘの高さと、第２端子３５の３つの段部の高さは、それぞれ、第１端子の平板部２４ｚと、第２端子の３つの平板部とが、同一平面に位置するように調節されている。よって、平板部２４ｚ、平板部３５ｚａ、平板部３５ｚｂおよび平板部３５ｚｃが位置する平面は、第１電極缶１１の底部外面と第２電極缶１２の底部外面との間に位置することになる。   The height of the stepped portion 24x of the first terminal 24 and the height of the three stepped portions of the second terminal 35 are such that the flat plate portion 24z of the first terminal and the three flat plate portions of the second terminal are the same plane. It is adjusted to be located at. Therefore, the flat surface on which the flat plate portion 24z, the flat plate portion 35za, the flat plate portion 35zb, and the flat plate portion 35zc are located is located between the bottom outer surface of the first electrode can 11 and the bottom outer surface of the second electrode can 12.

第２端子が有する３つの平板部のうち、少なくとも１つは、実装の際に回路基板に設けられたランドパターンに接続され、残りの平板部は、補助平板部として機能する。補助平板部は、回路基板がリフロー炉に導入される前に、回路基板に接着される。これにより、リフロー炉に導入される前に、端子付き電気化学素子を回路基板に固定することができ、半田付けを効率良く行うことができる。   At least one of the three flat plate portions of the second terminal is connected to a land pattern provided on the circuit board during mounting, and the remaining flat plate portion functions as an auxiliary flat plate portion. The auxiliary flat plate portion is bonded to the circuit board before the circuit board is introduced into the reflow furnace. Thereby, before introducing into a reflow furnace, the electrochemical element with a terminal can be fixed to a circuit board, and soldering can be performed efficiently.

例えば、平板部２４ｚの反対側に位置する平板部３５ｚａが、ランドパターンに半田付けにより接続される。この場合、平板部３５ｚａには、通常、半田メッキが施される。互いに反対側に位置する平板部３５ｚｂおよび平板部３５ｚｃは、リフロー炉に導入される前に、回路基板に接着される。平板部３５ｚｂおよび平板部３５ｚｃと、回路基板との接着には、例えば耐熱性を有するエポキシ系接着剤が好適に用いられる。   For example, the flat plate portion 35za located on the opposite side of the flat plate portion 24z is connected to the land pattern by soldering. In this case, solder plating is usually applied to the flat plate portion 35za. The flat plate portion 35zb and the flat plate portion 35zc located on opposite sides are bonded to the circuit board before being introduced into the reflow furnace. For bonding the flat plate portion 35zb and the flat plate portion 35zc to the circuit board, for example, an epoxy adhesive having heat resistance is preferably used.

電気化学素子を、平板部２４ｚと平板部３５ｚとが位置する平面の法線方向から見たとき、平板部２４ｚ、平板部３５ｚａ、平板部３５ｚｂおよび平板部３５ｚｃは、いずれも電気化学素子に外接する四角形で囲まれた領域中に納められている。これにより、補助平板部を設けた場合でも、実装面積を小さくすることが可能となる。なお、各平板部は、それぞれ四角形の頂点に沿って配置することが好ましい。よって、回路基板もしくはランドパターンと接続される第２端子の平板部の数は、１〜３つであることが好ましい。   When the electrochemical device is viewed from the normal direction of the plane where the flat plate portion 24z and the flat plate portion 35z are located, the flat plate portion 24z, the flat plate portion 35za, the flat plate portion 35zb, and the flat plate portion 35zc are all circumscribed to the electrochemical device. It is stored in the area surrounded by a square. Thereby, even when an auxiliary flat plate portion is provided, the mounting area can be reduced. In addition, it is preferable to arrange | position each flat plate part along a square vertex, respectively. Therefore, the number of flat plate portions of the second terminal connected to the circuit board or the land pattern is preferably 1 to 3.

第５実施形態
図９は、本発明の第２態様の端子付き電気化学素子を含む実装構造体の一例を示す上面図である。図１０は同じ実装構造体の側面図である。ただし、実装構造体を構成する回路基板については、電気化学素子と接続されるランドパターン周辺部のみを示す。 Fifth Embodiment FIG. 9 is a top view showing an example of a mounting structure including a terminal-attached electrochemical element according to the second aspect of the present invention. FIG. 10 is a side view of the same mounting structure. However, only the peripheral part of the land pattern connected to the electrochemical element is shown for the circuit board constituting the mounting structure.

回路基板４６には、予め凹部４７が形成されている。凹部４７には、電気化学素子および第１端子２４の段部２４ｘから本体部２４ｙまでの部分が装填されている。この状態で、まず、第２端子の平板部３５ｚｂおよび平板部３５ｚｃを、耐熱性を有する接着剤により、回路基板に接着する。これにより、電気化学素子が回路基板に固定される。   A recess 47 is formed in the circuit board 46 in advance. The recess 47 is loaded with the electrochemical element and the portion of the first terminal 24 from the step 24x to the main body 24y. In this state, first, the flat plate portion 35zb and the flat plate portion 35zc of the second terminal are bonded to the circuit board with a heat-resistant adhesive. Thereby, an electrochemical element is fixed to a circuit board.

次に、第１端子２４の平板部２４ｚおよび第２端子３５の平板部３５ｚａが、リフロー法により、回路基板１１の表面に設けられたランドパターン４８、４９に半田付けされる。その結果、端子付き電気化学素子は、回路基板４６に埋設されたような状態となる。これにより、実装構造体の低背化が可能となるだけでなく、半田付けの精度もしくは効率が向上する。   Next, the flat plate portion 24z of the first terminal 24 and the flat plate portion 35za of the second terminal 35 are soldered to the land patterns 48 and 49 provided on the surface of the circuit board 11 by a reflow method. As a result, the electrochemical element with a terminal is in a state of being embedded in the circuit board 46. As a result, not only the mounting structure can be lowered, but also the accuracy or efficiency of soldering can be improved.

凹部の代わりに回路基板４６に予め貫通孔を形成しておき、電気化学素子を貫通孔に装填する場合も、実装構造体の低背化が可能である。   Even when a through hole is formed in advance in the circuit board 46 instead of the recess and an electrochemical element is loaded into the through hole, the mounting structure can be reduced in height.

図９に示すように、実装面積を小さくするために、回路基板のランドパターンに接合される平板部の面積を非常に小さくする場合、リフロー法で半田付けする際に、電気化学素子が回路基板上で位置ずれを生じる場合がある。これを抑制する観点から、ランドパターンに接合される平板部の他に、回路基板に接着するための補助平板部を設けることが好ましい。補助平板部を回路基板に接着することにより、電気化学素子が装填された回路基板がリフロー炉を通過する際、回路基板による電気化学素子の保持が安定する。よって、回路基板の貫通孔や凹部に電気化学素子が宙吊り状態になることがなく、位置ずれを抑制することができる。   As shown in FIG. 9, in order to reduce the mounting area, when the area of the flat plate portion to be joined to the land pattern of the circuit board is very small, the electrochemical element is mounted on the circuit board when soldering by the reflow method. Misalignment may occur at the top. From the viewpoint of suppressing this, it is preferable to provide an auxiliary flat plate portion for bonding to the circuit board in addition to the flat plate portion bonded to the land pattern. By adhering the auxiliary flat plate portion to the circuit board, when the circuit board loaded with the electrochemical element passes through the reflow furnace, the holding of the electrochemical element by the circuit board is stabilized. Therefore, the electrochemical element is not suspended in the through hole or the concave portion of the circuit board, and displacement can be suppressed.

なお、図７および図９では、４つの平板部がいずれも電気化学素子に外接する四角形で囲まれた領域中に納まるように配置されているが、四角形の領域外に平板部が配置されていてもよい。その場合でも、電気化学素子の回路基板への保持安定性は十分に向上する。   In FIGS. 7 and 9, the four flat plate portions are arranged so as to fit in the region surrounded by the rectangle circumscribing the electrochemical element, but the flat plate portion is arranged outside the square region. May be. Even in that case, the holding stability of the electrochemical element on the circuit board is sufficiently improved.

回路基板（厚み０．９ｍｍ）が有する所定の貫通孔１０７に、図５に示す端子付き電気化学素子（直径６ｍｍ、厚みＬ＝１．４ｍｍのボタン形電池）を実装することにより、図１１に示すような実装構造体を作製した。この実装構造体は両面に電子部品が実装されている。
まず、回路基板１０６の一方の面に電子部品ＣおよびＤを実装する。次に、他方の面に電子部品ＡおよびＢと電気化学素子を同時に実装する。
電子部品Ａの高さｄは１．２ｍｍ、電子部品Ｃの高さｅは１．０ｍｍである。一方、電気化学素子の厚みＬは１．４ｍｍである。よって、ｅ＜ｄ＜Ｌの関係がある。なお、上記寸法は図１１の実寸法とは無関係である。また、ランドの厚みは無視できる。 By mounting the electrochemical element with a terminal (button type battery having a diameter of 6 mm and a thickness L = 1.4 mm) shown in FIG. A mounting structure as shown was fabricated. This mounting structure has electronic components mounted on both sides.
First, electronic components C and D are mounted on one surface of the circuit board 106. Next, the electronic components A and B and the electrochemical device are simultaneously mounted on the other surface.
The height d of the electronic component A is 1.2 mm, and the height e of the electronic component C is 1.0 mm. On the other hand, the thickness L of the electrochemical element is 1.4 mm. Therefore, there is a relationship of e <d <L. In addition, the said dimension is unrelated to the actual dimension of FIG. The land thickness is negligible.

電気化学素子を構成する正極缶１０１および負極缶１０２は、それぞれステンレス鋼製とし、正極缶１０１の外径（直径６ｍｍ）を負極缶１０２の外径より大きくした。
正極缶１０１の底部外面に電気的に接続する第１端子１０４は、ステンレス鋼製の金属板（厚み０．１ｍｍ）を、段部１０４ｘ（高さ１．２ｍｍ）を有するように加工して形成した。段部１０４ｘの両側には、長方形の本体部１０４ｙと、上面がほぼ三角形の平板部１０４ｚを設けた。本体部１０４ｙは、正極缶１０１の底部外面に溶接により接合した。 The positive electrode can 101 and the negative electrode can 102 constituting the electrochemical element were each made of stainless steel, and the outer diameter (diameter 6 mm) of the positive electrode can 101 was made larger than the outer diameter of the negative electrode can 102.
The first terminal 104 electrically connected to the outer surface of the bottom of the positive electrode can 101 is formed by processing a stainless steel metal plate (thickness 0.1 mm) so as to have a stepped portion 104x (height 1.2 mm). did. On both sides of the stepped portion 104x, a rectangular main body portion 104y and a flat plate portion 104z whose upper surface is substantially triangular are provided. The main body 104y was joined to the outer surface of the bottom of the positive electrode can 101 by welding.

負極缶１０２の底部外面に電気的に接続する第２端子１０５は、ステンレス鋼製の金属板（厚み０．１ｍｍ）を、段部１０５ｘ（高さ０．３ｍｍ）を有するように加工して形成した。段部１０５ｘの両側には、長方形の本体部１０５ｙと、上面がほぼ三角形の平板部１０５ｚを設けた。本体部１０５ｙは、負極缶１０２の底部外面に溶接により接合した。   The second terminal 105 electrically connected to the bottom outer surface of the negative electrode can 102 is formed by processing a stainless steel metal plate (thickness 0.1 mm) so as to have a step portion 105x (height 0.3 mm). did. On both sides of the step portion 105x, a rectangular main body portion 105y and a flat plate portion 105z whose upper surface is substantially triangular are provided. The main body 105y was joined to the bottom outer surface of the negative electrode can 102 by welding.

第１端子の平板部１０４ｚおよび第２端子の平板部１０５ｚが位置する平面は、正極缶１０１の底部外面と負極缶１０２の底部外面との間に位置した。
回路基板１０６には、第１端子の平板部１０４ｚおよび第２端子の平板部１０５ｚに対応した形状を有するランドパターン１０８および１０９をそれぞれ形成した。 The plane on which the flat plate portion 104z of the first terminal and the flat plate portion 105z of the second terminal are located was located between the bottom outer surface of the positive electrode can 101 and the bottom outer surface of the negative electrode can 102.
Land patterns 108 and 109 having shapes corresponding to the flat plate portion 104z of the first terminal and the flat plate portion 105z of the second terminal were formed on the circuit board 106, respectively.

第１端子の本体部１０４ｙの外面と、回路基板１０６の近い方の表面との距離ｂは、０．３ｍｍであった。
第２端子の本体部１０５ｙの外面と、回路基板１０６の近い方の表面との距離ａは、０．４ｍｍであった。 The distance b between the outer surface of the main body 104y of the first terminal and the surface closer to the circuit board 106 was 0.3 mm.
The distance a between the outer surface of the main body portion 105y of the second terminal and the surface closer to the circuit board 106 was 0.4 mm.

上記のように、ｅ＜ｄ＜Ｌの関係があるにも係わらず、実装構造体における電気化学素子の高さは、回路基板の両面において、それぞれ最大の高さを有する電子部品よりも低くすることができた。一般に電気化学素子の厚みは、両面実装回路基板における他の電子部品よりも突出して大きいため、実装構造体の薄型化を阻害する主要因となっていた。一方、上記構成によれば、回路基板の貫通孔に電気化学素子が埋まったような状態となる。よって、上記構成は、実装構造体の薄型化に有効である。   As described above, despite the relationship of e <d <L, the height of the electrochemical element in the mounting structure is set lower than the electronic components having the maximum height on both sides of the circuit board. I was able to. In general, the thickness of the electrochemical device is larger than other electronic components on the double-sided mounting circuit board, and thus has been a main factor that hinders the thickness reduction of the mounting structure. On the other hand, according to the above configuration, the electrochemical element is buried in the through hole of the circuit board. Therefore, the above configuration is effective for reducing the thickness of the mounting structure.

実施例１と同じ電気化学素子（直径６ｍｍ、厚み１．４ｍｍのボタン形電池）を用い、図１２に示すような実装構造体を作製した。ここでは、回路基板（厚み０．９ｍｍ）２０６が有する所定の凹部（深さ０．７ｍｍ、回路基板の厚み０．２ｍｍ）２０７に、端子付き電気化学素子を装填した。   Using the same electrochemical element as in Example 1 (button type battery having a diameter of 6 mm and a thickness of 1.4 mm), a mounting structure as shown in FIG. 12 was produced. Here, the electrochemical element with a terminal was loaded into a predetermined recess (depth 0.7 mm, circuit board thickness 0.2 mm) 207 of the circuit board (thickness 0.9 mm) 206.

正極缶１０１の底部外面に電気的に接続する第１端子２０４は、ステンレス鋼製の金属板（厚み０．１ｍｍ）を、段部２０４ｘ（高さ０．７ｍｍ）を有するように加工して形成した。段部２０４ｘの両側には、長方形の本体部２０４ｙと、上面がほぼ三角形の平板部２０４ｚを設けた。本体部２０４ｙは、正極缶１０１の底部外面に溶接により接合した。   The first terminal 204 electrically connected to the bottom outer surface of the positive electrode can 101 is formed by processing a stainless steel metal plate (thickness 0.1 mm) so as to have a step portion 204x (height 0.7 mm). did. On both sides of the stepped portion 204x, a rectangular main body portion 204y and a flat plate portion 204z having a substantially triangular upper surface were provided. The main body 204y was joined to the outer surface of the bottom of the positive electrode can 101 by welding.

負極缶１０２の底部外面に電気的に接続する第２端子２０５は、Ｔ字状のステンレス鋼製の金属板（厚み０．１ｍｍ）を加工して作製した。すなわち、金属板の３つの先端近くに、それぞれ段部２０５ｘａ、段部２０５ｘｂおよび段部２０５ｘｃ（いずれも高さ０．８ｍｍ）ならびに各段部に続く上面がほぼ三角形の平板部２０５ｚａ、平板部２０５ｚｂ（図示せず）および平板部２０５ｚｃを形成した。本体部２０５ｙは、負極缶１０２の底部外面に溶接により接合した。   The second terminal 205 electrically connected to the bottom outer surface of the negative electrode can 102 was produced by processing a T-shaped stainless steel metal plate (thickness: 0.1 mm). That is, near the three tips of the metal plate, a step portion 205xa, a step portion 205xb and a step portion 205xc (all of which have a height of 0.8 mm), and a flat plate portion 205za and a flat plate portion 205zb each having a substantially upper surface following each step portion. (Not shown) and a flat plate portion 205zc were formed. The main body 205y was joined to the outer surface of the bottom of the negative electrode can 102 by welding.

第１端子の平板部２０４ｚならびに第２端子の平板部２０５ｚａ、平板部２０５ｚｂおよび平板部２０５ｚｃが位置する平面は、正極缶１０１の底部外面と負極缶１０２の底部外面との間に位置しており、正極缶の底部外面からの距離は、０．６ｍｍであった。
回路基板２０６には、第１端子の平板部２０４ｚおよび第２端子の平板部２０５ｚａに対応した形状を有するランドパターン２０８および２０９をそれぞれ形成した。第１端子の平板部２０４ｚおよび第２端子の平板部２０５ｚａには、それぞれ半田メッキを施した。 The plane where the flat plate portion 204z of the first terminal and the flat plate portion 205za, flat plate portion 205zb, and flat plate portion 205zc of the second terminal are located is located between the bottom outer surface of the positive electrode can 101 and the bottom outer surface of the negative electrode can 102. The distance from the outer surface of the bottom of the positive electrode can was 0.6 mm.
On the circuit board 206, land patterns 208 and 209 having shapes corresponding to the flat plate portion 204z of the first terminal and the flat plate portion 205za of the second terminal were formed, respectively. Solder plating was applied to the flat plate portion 204z of the first terminal and the flat plate portion 205za of the second terminal.

第２端子の平板部２０５ｚｂおよび平板部２０５ｚｃには、それぞれエポキシ樹脂系接着剤を塗布し、これらを回路基板に接着した。その後、リフロー法により、第１端子の平板部２０４ｚおよび第２端子の平板部２０５ｚａを、ランドパターン２０８および２０９に半田付けした。その結果、リフロー炉中を移動する際に、電気化学素子の回路基板に対する位置ずれを防止することができた。   An epoxy resin adhesive was applied to the flat plate portion 205zb and the flat plate portion 205zc of the second terminal, respectively, and these were bonded to the circuit board. Thereafter, the flat plate portion 204z of the first terminal and the flat plate portion 205za of the second terminal were soldered to the land patterns 208 and 209 by a reflow method. As a result, it was possible to prevent displacement of the electrochemical element relative to the circuit board when moving in the reflow furnace.

《比較例１》
実施例１と同じ電気化学素子（直径６ｍｍ、厚み１．４ｍｍのボタン形電池）を用い、図１３に示すような従来の実装構造体を作製した。ここでは、貫通孔もしくは凹部を有さない回路基板（厚み０．９ｍｍ）３０６の表面に、端子付き電気化学素子を装着した。 << Comparative Example 1 >>
A conventional mounting structure as shown in FIG. 13 was produced using the same electrochemical element as in Example 1 (button type battery having a diameter of 6 mm and a thickness of 1.4 mm). Here, an electrochemical element with a terminal was mounted on the surface of a circuit board (thickness 0.9 mm) 306 having no through-holes or recesses.

負極缶１０２の底部外面に電気的に接続する第２端子３０５は、ステンレス鋼製の金属板（厚み０．１ｍｍ）を、段部３０５ｘ（高さ１．４ｍｍ）を有するように加工して形成した。段部３０５ｘの両側には、長方形の本体部３０５ｙと、上面がほぼ四角形の平板部３０５ｚを設けた。本体部３０５ｙは、負極缶１０２の底部外面に溶接により接合した。   The second terminal 305 electrically connected to the bottom outer surface of the negative electrode can 102 is formed by processing a stainless steel metal plate (thickness 0.1 mm) so as to have a step 305x (height 1.4 mm). did. On both sides of the step portion 305x, a rectangular main body portion 305y and a flat plate portion 305z having a substantially rectangular upper surface were provided. The main body 305y was joined to the outer surface of the bottom of the negative electrode can 102 by welding.

正極缶１０１に接続する第１端子３０４は、Ｌ字状であり、正極缶１０１の側面に接合される接合部３０４ｙと、ランドパターンに半田付けされる平板部３０４ｚからなる。この場合、第１端子を電気化学素子の側面に接合することにより、実装構造体の高さを低減している。   The first terminal 304 connected to the positive electrode can 101 is L-shaped, and includes a joining portion 304y joined to the side surface of the positive electrode can 101 and a flat plate portion 304z soldered to the land pattern. In this case, the height of the mounting structure is reduced by bonding the first terminal to the side surface of the electrochemical element.

比較例１の実装構造体の高さは、電気化学素子の厚み１．４ｍｍと、第２端子の厚み０．１ｍｍと、回路基板の厚み０．９ｍｍとの合計（２．４ｍｍ）となる。一方、実施例２の実装構造体の高さは、電気化学素子の厚み１．４ｍｍと、第１および第２端子の厚み０．２ｍｍと、回路基板の凹部の厚み０．２ｍｍとの合計（１．８ｍｍ）となる。よって、実施例２の実装構造体の高さは、比較例１よりも０．６ｍｍの低背化が実現されている。よって、機器の薄型化に有利となる。   The height of the mounting structure of Comparative Example 1 is the sum (2.4 mm) of the thickness of the electrochemical element of 1.4 mm, the thickness of the second terminal of 0.1 mm, and the thickness of the circuit board of 0.9 mm. On the other hand, the height of the mounting structure of Example 2 is the sum of the thickness of the electrochemical element 1.4 mm, the thickness of the first and second terminals 0.2 mm, and the thickness of the recess of the circuit board 0.2 mm ( 1.8 mm). Therefore, the height of the mounting structure of Example 2 is 0.6 mm lower than that of Comparative Example 1. Therefore, it is advantageous for reducing the thickness of the device.

本発明は、低背化が要求される実装構造体において有効であり、特に回路基板の両面に他の電子部品が実装される場合に有効である。本発明により、携帯用電子機器等の薄型化に対応することが容易となる。   The present invention is effective in a mounting structure requiring a reduction in height, and is particularly effective when other electronic components are mounted on both sides of a circuit board. According to the present invention, it becomes easy to cope with the thinning of portable electronic devices and the like.

Claims (9)

第１電極缶、第２電極缶、前記第１電極缶の底部内面に電気的に接続された第１電極、前記第２電極缶の底部内面に電気的に接続された第２電極、前記第１電極缶の底部外面に電気的に接続された第１端子、および前記第２電極缶の底部外面に電気的に接続された第２端子を具備し、
前記第１端子は、前記第１電極缶の底部外面に接合された第１極性本体部と、前記第１電極缶の底部外面に対向しない第１極性平板部とを有し、
前記第２端子は、前記第２電極缶の底部外面に接合された第２極性本体部と、前記第２電極缶の底部外面に対向しない第２極性平板部とを有し、
前記第１極性平板部と前記第２極性平板部とは、同一平面に位置し、かつ前記平面が、前記第１電極缶の底部外面と前記第２電極缶の底部外面との間に位置する、端子付き電気化学素子。 A first electrode can, a second electrode can, a first electrode electrically connected to a bottom inner surface of the first electrode can, a second electrode electrically connected to a bottom inner surface of the second electrode can, A first terminal electrically connected to the bottom outer surface of the one electrode can, and a second terminal electrically connected to the bottom outer surface of the second electrode can,
The first terminal has a first polarity main body joined to the outer surface of the bottom of the first electrode can, and a first polar flat plate not facing the outer surface of the bottom of the first electrode can.
The second terminal has a second polarity main body joined to the bottom outer surface of the second electrode can, and a second polarity flat plate not facing the bottom outer surface of the second electrode can,
The first polarity flat plate portion and the second polarity flat plate portion are located on the same plane, and the plane is located between the bottom outer surface of the first electrode can and the bottom outer surface of the second electrode can. , Electrochemical element with terminal. 前記第１端子または前記第２端子は、更に、前記第１極性平板部と前記第２極性平板部と同一平面に位置する補助平板部を有する、請求項１記載の端子付き電気化学素子。   2. The electrochemical device with a terminal according to claim 1, wherein the first terminal or the second terminal further includes an auxiliary flat plate portion positioned in the same plane as the first polar flat plate portion and the second polar flat plate portion. 前記平面の法線方向から見た形状が円の形状であり、前記第１極性平板部および前記第２極性平板部が、前記円に外接する四角形で囲まれた領域中に納まるように配置されている、請求項１または２記載の端子付き電気化学素子。   The shape seen from the normal direction of the plane is a circular shape, and the first polar flat plate portion and the second polar flat plate portion are arranged so as to fit in a region surrounded by a rectangle circumscribing the circle. The electrochemical device with a terminal according to claim 1 or 2. 前記平面の法線方向から見た形状が円の形状であり、前記第１極性平板部、前記第２極性平板部および前記補助平板部が、前記円に外接する四角形で囲まれた領域中に納まるように配置されている、請求項２記載の端子付き電気化学素子。   The shape seen from the normal direction of the plane is a circle shape, and the first polar flat plate portion, the second polar flat plate portion and the auxiliary flat plate portion are in a region surrounded by a rectangle circumscribing the circle. The electrochemical device with a terminal according to claim 2, which is disposed so as to be accommodated. 前記電気化学素子が、電池またはキャパシタである、請求項１〜４のいずれかに記載の端子付き電気化学素子。   The electrochemical element with a terminal in any one of Claims 1-4 whose said electrochemical element is a battery or a capacitor. 貫通孔もしくは凹部とランドパターンとを有する回路基板、および前記貫通孔もしくは凹部に装填された請求項１〜５のいずれかに記載の端子付き電気化学素子を具備し、
前記第１極性平板部および前記第２極性平板部が、前記ランドパターンに半田付けされている、実装構造体。 A circuit board having a through hole or recess and a land pattern, and the electrochemical element with a terminal according to any one of claims 1 to 5 loaded in the through hole or recess,
The mounting structure in which the first polar flat plate portion and the second polar flat plate portion are soldered to the land pattern. 貫通孔もしくは凹部とランドパターンとを有する回路基板、および前記貫通孔もしくは凹部に装填された請求項２〜５のいずれかに記載の端子付き電気化学素子を具備し、
前記第１極性平板部および前記第２極性平板部が、前記ランドパターンに半田付けされており、
前記補助平板部が、前記回路基板に接着されている、実装構造体。 A circuit board having a through hole or recess and a land pattern, and the electrochemical element with a terminal according to any one of claims 2 to 5 loaded in the through hole or recess,
The first polar flat plate portion and the second polar flat plate portion are soldered to the land pattern;
A mounting structure in which the auxiliary flat plate portion is bonded to the circuit board. 請求項１〜５のいずれかに記載の電気化学素子の回路基板への実装方法であって、
貫通孔もしくは凹部とランドパターンとを有する回路基板を供給する工程、
前記貫通孔もしくは凹部に、前記電気化学素子を装填する工程、および
リフロー法により、前記第１極性平板部および前記第２極性平板部を、前記ランドパターンに半田付けする工程、を含む端子付き電気化学素子の回路基板への実装方法。 A method for mounting the electrochemical element according to any one of claims 1 to 5 on a circuit board,
Supplying a circuit board having a through-hole or recess and a land pattern;
Loading the electrochemical element into the through hole or recess, and soldering the first polar flat plate portion and the second polar flat plate portion to the land pattern by a reflow method. A method for mounting chemical elements on circuit boards. 請求項２〜５のいずれかに記載の電気化学素子の回路基板への実装方法であって、
貫通孔もしくは凹部とランドパターンとを有する回路基板を供給する工程、
前記貫通孔もしくは凹部に、前記電気化学素子を装填する工程、
前記補助平板部を回路基板に接着する工程、および
リフロー法により、前記第１極性平板部および前記第２極性平板部を、前記ランドパターンに半田付けする工程、を含む端子付き電気化学素子の回路基板への実装方法。 A method for mounting the electrochemical element according to any one of claims 2 to 5 on a circuit board,
Supplying a circuit board having a through-hole or recess and a land pattern;
Loading the electrochemical element into the through hole or recess;
A circuit for an electrochemical element with a terminal, comprising: bonding the auxiliary flat plate portion to a circuit board; and soldering the first polar flat plate portion and the second polar flat plate portion to the land pattern by a reflow method. Mounting method on the board.
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