JP2007027527A - Board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board which can increase the positional accuracy of an electronic component fixed to the main body of the board and can make the board thin, and also to provide a method for manufacturing the board. <P>SOLUTION: The board has a body 11, a recess 21 formed on the board body 11 and nearly corresponding in size to the outer shape of a capacitor component 13, the capacitor component 13 positioned on the recess 21, and notches 22 formed in the board body 11 forming side surfaces of the recess 21. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate and a method for manufacturing the substrate, and more particularly to a substrate for fixing an electronic component to a through-hole or a recess formed in a substrate body and a method for manufacturing the substrate.

  Conventionally, there is a substrate in which a recess is formed in a substrate body, and an electronic component such as a capacitor component is built in the recess.

  FIG. 1 is a cross-sectional view of a conventional substrate incorporating an electronic component, and FIG. 2 is a plan view of the substrate shown in FIG.

  With reference to FIGS. 1 and 2, a conventional substrate 100 will be described with reference to an example in which a capacitor component 117 is used as an electronic component.

  The substrate 100 includes a substrate body 101, through vias 106 and 107, an upper wiring 109, protective films 110 and 114, lower wirings 112 and 113, an external connection terminal 115, a wiring 116, a capacitor component 117, Resin 123.

  A concave portion 102 and through holes 103 and 104 are formed in the substrate body 101. The recess 102 is for arranging the capacitor component 117 and is formed larger than the outer shape of the capacitor component 117. A gap A for filling the resin 123 is provided between the side surface 102 </ b> A of the recess 102 and the side surface 117 </ b> C of the capacitor component 117. The resin 123 functions as an adhesive for fixing the capacitor component 117 to the substrate body 101. In addition, the size of the gap A for filling the resin 123 needs to be 100 μm or more.

  The through hole 103 is formed so as to penetrate the substrate body 101 that forms the bottom surface 102 </ b> B of the recess 102. The through hole 104 is formed so as to penetrate from the upper surface 101A to the lower surface 101B of the substrate main body 101.

  The through via 106 is provided in the through hole 104 and electrically connects the upper wiring 109 and the lower wiring 112. The through via 107 is provided in the through hole 103 and electrically connects the wiring 116 and the lower wiring 114. The through vias 106 and 107 are formed, for example, by depositing a conductive metal by electrolytic plating.

  The upper wiring 109 is provided on the upper surface 101A of the substrate body 101. The upper wiring 109 has a pad 109A to which a signal terminal of the semiconductor chip 125 is connected. The protective film 110 is provided so as to cover the upper wiring 109 other than the pad 109A and the upper surface 101A of the substrate body 101 with the pad 109A exposed.

  The lower wirings 112 and 113 are provided on the lower surface 101B of the substrate body 101. The lower wiring 112 has a pad 112A connected to the solder ball 115 and is electrically connected to the through via 106. The lower wiring 113 has a pad 113A on which a solder ball 115 is disposed, and is electrically connected to the through via 107.

  The protective film 114 is provided so as to cover the lower wirings 112 and 113 other than the pads 112A and 113A and the lower surface 101B of the substrate body 101 with the pads 112A and 113A exposed.

  The external connection terminals 115 are provided on the pads 112A and 113A, respectively. The external connection terminal 115 is a terminal electrically connected to the circuit board 127. The wiring 116 is provided on the substrate body 101 corresponding to the bottom surface 102 </ b> B of the recess 102. The wiring 116 is electrically connected to the lower wiring 113 through the through via 107.

The capacitor component 117 includes a through electrode 118 and terminals 119 and 120 provided at both ends of the through electrode 118. The terminal 119 is electrically connected to the wiring 116 through the solder 122. Each terminal 120 is electrically connected to one of a power supply terminal and a ground terminal (not shown) of the semiconductor chip 125. The capacitor component 117 is fixed to the substrate body 101 with a resin 123 in a state where the terminal 119 and the wiring 116 are electrically connected (see, for example, Patent Document 1).
JP 2000-349225 A

  However, in the substrate 100, the concave portion 102 in which the capacitor component 117 is disposed is formed larger than the outer shape of the capacitor component 117, and the resin 123 is filled between the side surface 102A of the concave portion 102 and the side surface 117C of the capacitor component 117. Since the gap A is provided, there is a problem that it is difficult to improve the positional accuracy of the capacitor component 117. When the position accuracy of the capacitor component 117 is poor, it is difficult to connect the semiconductor chip 125 to the capacitor component 117.

  In addition, a wiring pattern including the wiring 116, the through via 107, and the lower wiring 113 is provided on the substrate body 101 between the bottom surface 102B of the recess 102 and the lower wiring 113, and the terminal 119 of the capacitor component 117 and the pad 113A are connected. There is a problem in that the substrate 100 cannot be thinned because they are electrically connected to each other.

  Therefore, the present invention has been made in view of the above-described problems, and an object thereof is to provide a substrate that can improve the positional accuracy of an electronic component fixed to a substrate body and can be thinned, and a method for manufacturing the substrate. And

  According to one aspect of the present invention, there is provided a substrate including a substrate body, a recess formed in the substrate body, and an electronic component disposed in the recess, and the shape of the recess is an outer shape of the electronic component. And a notch is provided in the substrate main body forming the side surface of the recess.

  According to the present invention, the position of the electronic component is regulated by the substrate body that forms the recess and the position accuracy of the electronic component is improved by substantially matching the recess formed in the substrate body with the outer shape of the electronic component. Can do. In addition, by providing a notch portion in the substrate body forming the side surface of the recess, for example, an electronic component whose positional accuracy is improved by filling the notch portion with an adhesive can be fixed to the substrate body.

  According to another aspect of the present invention, there is provided a substrate including a substrate body, a through portion formed in the substrate body, and an electronic component disposed in the through portion, wherein the shape of the through portion is Provided is a substrate characterized in that it substantially matches the outer shape of the electronic component and is provided with a notch in the substrate body forming the side surface of the penetrating portion.

  According to the present invention, the position of the electronic component is regulated by the substrate body forming the side surface of the penetrating portion by substantially matching the outer shape of the electronic component with the penetrating portion formed in the substrate main body, and the position accuracy of the electronic component Can be improved. Further, by providing the notch in the substrate body forming the side surface of the penetrating part, for example, an electronic component whose positional accuracy is improved by filling the notch with an adhesive can be fixed to the substrate body.

  Further, the thickness of the substrate body may be substantially equal to the thickness of the electronic component. By making the thickness of the substrate body substantially equal to the thickness of the electronic component, the substrate can be thinned.

  According to another aspect of the present invention, there is provided a method for manufacturing a substrate, comprising: a substrate body; a recess formed in the substrate body; and an electronic component disposed in the recess. A recess forming step for forming a recess that substantially matches the outer shape of the component, a notch forming step for forming a notch in a substrate body that forms a side surface of the recess, and an electronic component for arranging the electronic component in the recess There is provided a method for manufacturing a substrate, comprising: an arranging step; and an electronic component fixing step of fixing an electronic component to the substrate body by providing an adhesive in the notch.

  According to the present invention, a concave portion that substantially matches the outer shape of the electronic component is formed, and the electronic component is disposed in the concave portion, whereby the position of the electronic component is regulated by the substrate body that forms the concave portion, and the positional accuracy of the electronic component is determined. Can be improved. In addition, by forming a notch in the substrate body that forms the side surface of the recess and providing an adhesive in the notch, an electronic component with improved positional accuracy can be fixed to the substrate body.

  According to another aspect of the present invention, there is provided a method for manufacturing a substrate, comprising: a substrate body; a penetrating portion formed in the substrate body; and an electronic component disposed in the penetrating portion. A penetrating part forming step for forming a penetrating part that substantially matches the outer shape of the electronic component; a notch forming step for forming a notch part in a substrate body that forms a side surface of the penetrating part; and an electron in the penetrating part. There is provided a method for manufacturing a substrate, comprising: an electronic component arranging step for arranging components; and an electronic component fixing step for fixing the electronic component to a substrate body by providing an adhesive in the notch.

  According to the present invention, by forming a penetrating portion that substantially matches the outer shape of the electronic component and disposing the electronic component in the penetrating portion, the position of the electronic component is regulated by the substrate body that forms the penetrating portion, and the electronic component The positional accuracy can be improved. Further, by forming a notch in the substrate body that forms the side surface of the penetrating part and providing an adhesive in the notch, an electronic component with improved positional accuracy can be fixed to the substrate body.

  According to the present invention, it is possible to improve the positional accuracy of the electronic component fixed to the board body and to reduce the thickness.

  Next, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 3 is a cross-sectional view of the substrate according to the first embodiment of the present invention, and FIG. 4 is a plan view of the substrate shown in FIG. In the present embodiment, the following description is given by taking as an example the case where the capacitor component 13 is used as an electronic component.

  Referring to FIGS. 3 and 4, the substrate 10 includes a substrate body 11, connection pins 12, a capacitor component 13 that is an electronic component, and an external connection terminal 17. The substrate 10 is a substrate for electrically connecting the semiconductor chip 15 and a circuit substrate 18 (for example, a mother board), and is used as, for example, an interposer. The semiconductor chip 15 connected to the substrate 10 has a power terminal 16A, a ground terminal 16B, and a signal terminal 16C. As the semiconductor chip 15, for example, a high-frequency semiconductor chip can be used.

  5 is a cross-sectional view of the substrate body, and FIG. 6 is a plan view of the substrate body shown in FIG.

  With reference to FIGS. 5 and 6, the substrate body 11 is formed with a recess 21, a notch 22, openings 23 and 26, and a through hole 25.

  The recess 21 is formed in the substrate body 11 corresponding to the mounting area of the semiconductor chip 15. The recess 21 is a space for arranging the capacitor component 13. The shape of the recess 21 substantially matches the outer shape of the capacitor component 13, and the depth D1 of the recess 21 is formed to be substantially equal to the thickness M1 of the capacitor component 13 (D1 = M1).

  The gap between the side surface 21A of the recess 21 and the capacitor component 13 can be set to 50 μm to 100 μm, for example. In addition, the thickness M2 of the substrate body 11 located below the recess 21 can be set to 200 μm to 300 μm, for example.

  In this way, by providing the substrate body 11 with the recess 21 having a shape that substantially matches the outer shape of the capacitor component 13, the position of the capacitor component 13 is regulated by the substrate body 11 that forms the recess 21. The positional accuracy can be improved.

  The notches 22 are respectively formed in the substrate body 11 that faces the corner portions 13A to 13D of the capacitor component 13 among the substrate body 11 that forms the side surface 21A of the recess 21 (see FIG. 4). The notch 22 is configured integrally with the recess 21.

  The cut-out portion 22 in plan view has a fan shape with a part of a circle cut out. The diameter R1 of the notch 22 can be set to 0.5 mm, for example.

  Thus, by providing the notch 22 in the substrate body 11 that forms the side surface 21 </ b> A of the recess 21, it becomes possible to provide the resin 19 as an adhesive in the notch 22, and the resin 19 improves the positional accuracy. The capacitor component 13 can be fixed to the substrate body 11.

  The opening 23 is provided in the substrate body 11 that forms the bottom surface 21 </ b> B of the recess 21. The opening 23 is formed so as to penetrate the substrate body 11 facing the terminal 32 of the capacitor component 13. The opening 23 is formed integrally with the recess 21. The opening 23 is for exposing the terminal 32 of the capacitor component 13. The diameter R2 of the opening 23 is set to be larger than the diameters of the terminal 32 and the external connection terminal 17 of the capacitor component 13. Further, the substrate body 11 that forms the opening 23 prevents the external connection terminal 17 connected to the terminal 32 from coming into contact with the other external connection terminal 17.

  Thus, by forming the opening 23 that exposes the terminal 32 of the capacitor component 13 in the substrate body 11 that forms the bottom surface 21B of the recess 21, the terminal of the capacitor component 13 can be provided without providing a wiring pattern in the substrate body 11. It becomes possible to electrically connect between 32 and the circuit board 18. Thereby, the board | substrate 10 can be reduced in thickness.

  Further, the terminal of the capacitor component 13 is compared with the conventional substrate 100 in which the terminal 119 of the capacitor component 117 and the pad 113A are electrically connected by the wiring pattern including the wiring 116, the through via 107, and the lower wiring 113. The inductance between 32 and the circuit board 18 can be reduced.

  A plurality of through holes 25 are formed in the substrate body 11 located in the vicinity of the recess 21. The through hole 25 is for arranging the connection pin 12 (see FIG. 3). The depth D2 of the through hole 25 is formed to be substantially equal to the depth D1 of the recess 21 (D1 = D2).

  The opening 26 is formed on the lower surface 11B side of the substrate body 11 corresponding to the position where the through hole 25 is formed. The opening 26 is for exposing one end of the connection pin 12 so that the external connection terminal 17 can be electrically connected to the connection pin 12. The opening 26 is configured integrally with the through hole 25. The diameter R3 of the opening 26 is formed larger than the diameters of the connection pin 12 and the external connection terminal 17. Further, the substrate body 11 forming the opening 26 prevents the external connection terminal 17 connected to the connection pin 12 from coming into contact with the other external connection terminal 17.

  As a material of the substrate body 11, for example, a liquid crystal polymer resin, a glass epoxy resin, or the like can be used. When liquid crystal polymer resin is used as the material of the substrate body 11, the substrate body 11 uses a mold having protrusions corresponding to the shapes of the recesses 21, the notches 22, the openings 23 and 26, and the through holes 25. It can be formed by injection molding. Further, when glass epoxy resin is used as the material of the substrate body 11, the substrate body 11 is formed of a concave portion 21, a notch 22, and openings 23 and 26 using a drill or laser or the like on a plate-like glass epoxy resin. And through holes 25 are formed.

  Referring to FIG. 3, the connection pin 12 is provided in the through hole 25. The connection pin 12 protrudes from both ends of the through hole 25. The connection pin 12 is a conductive pin made of a metal such as copper or a copper alloy. An end portion of the through hole 25 on the upper surface 11A side of the substrate body 11 is electrically connected to the signal terminal 16C of the semiconductor chip 15, and an end portion of the through hole 25 on the lower surface 11B side of the substrate body 11 is an external connection terminal. The circuit board 18 is electrically connected via the circuit board 17.

  The capacitor component 13 includes a capacitor main body 30, a through electrode 33, and terminals 31A, 31B, and 32. The capacitor body 30 is substantially rectangular. The through electrode 33 is provided so as to penetrate the capacitor body 30. A terminal 31 </ b> A or a terminal 31 </ b> B is provided at the upper end portion of the through electrode 33, and a terminal 32 is provided at the lower end portion of the through electrode 33. As the capacitor component 13, for example, a multilayer ceramic capacitor can be used. In this case, the capacitor body 30 is configured such that thin ceramic base sheets and electrode layers are alternately stacked.

  The capacitor component 13 configured as described above is disposed in the recess 21 with the terminal 32 exposed from the opening 23. The capacitor component 13 disposed in the recess 21 is fixed to the substrate body 11 by a resin 19 provided in the notch 22. The resin 19 has a function of an adhesive for bonding the capacitor component 13 to the substrate body 11. As the resin 19, for example, a thermosetting resin such as epoxy can be used.

  Further, the terminal 31A of the capacitor component 13 is electrically connected to, for example, the power supply terminal 16A of the semiconductor chip 15, and the terminal 31B is electrically connected to, for example, the ground terminal 16B of the semiconductor chip 15.

  In this way, by electrically connecting the capacitor component 13 to the power supply terminal 16A and the ground terminal 16B of the semiconductor chip 15, for example, when the semiconductor chip 15 is a high frequency chip, the capacitor component 13 causes the semiconductor chip 15 to Noise can be absorbed.

  The external connection terminals 17 are provided on the end portions of the connection pins 12 on the lower surface 11B side of the substrate body 11 and the terminals 32, respectively. The external connection terminal 17 is a terminal for electrically connecting the board 10 and the circuit board 18. As the external connection terminal 17, for example, a solder ball can be used.

  According to the substrate of the present embodiment, by providing the substrate body 11 with the recess 21 that substantially matches the outer shape of the capacitor component 13, the position of the capacitor component 13 is regulated by the substrate body 11 that forms the recess 21. The position accuracy of the component 13 can be improved. Further, by providing the notch portion 22 in the substrate body 11 forming the side surface 21A of the recess 21, the capacitor component 13 whose positional accuracy is improved by filling the notch portion 22 with the resin 19 is fixed to the substrate body 11. Can do.

  In the present embodiment, the case where the capacitor component 13 is provided as an electronic component has been described as an example. However, the present embodiment includes electronic components such as passive components and active components other than the capacitor component 13. The present invention can also be applied to a substrate.

  Further, when glass epoxy resin is used as the material of the substrate body 11, through vias may be formed using a printed wiring board technique (plating method or the like) instead of the connection pins 12. Further, the depth of the notch 22 may be deep enough that the resin 19 can fix the capacitor component 13 to the substrate body 11. Furthermore, the shape of the notch 22 is not limited to the shape shown in FIGS. Further, the present embodiment can be applied to a substrate that does not include the external connection terminal 17.

  FIG. 7 is a plan view of a substrate according to a modification of the first embodiment.

  Referring to FIG. 7, the substrate 40 is the same as the substrate 10 of the first embodiment except that the substrate body 11 is provided with a notch 41 instead of the notch 22 and the resin 19 is excluded from the configuration. It is comprised similarly.

  The notch portions 41 are formed in the substrate body 11 facing the corner portions 13A to 13D of the capacitor component 13, respectively. The substrate body 11 that forms the side surface 41 </ b> A of the notch 41 is formed so as to contact the corners 13 </ b> A to 13 </ b> D of the capacitor component 13.

  According to the substrate 40 of the modification of the first embodiment, by providing the notch portion 41 in the substrate body 11, the corner portion 13 </ b> A of the capacitor component 13 is formed by the substrate body 11 that forms the side surface 41 </ b> A of the notch portion 41. The capacitor component 13 can be fixed to the substrate body 11 without using the resin 19 by sandwiching ˜13D. In addition, the board | substrate 40 can acquire the effect similar to the board | substrate 10 of 1st Embodiment. Further, the notch 41 may be filled with the resin 19.

  8 to 13 are views showing a manufacturing process of the substrate according to the first embodiment. 8-13, the same code | symbol is attached | subjected to the same component as the board | substrate 10 demonstrated previously.

  A method for manufacturing the substrate 10 according to the first embodiment will be described with reference to FIGS. First, the substrate body 11 (see FIGS. 5 and 6) including the recess 21, the notch 22, the openings 23 and 26, and the through hole 25 is formed (a recess forming process and a notch forming process). Specifically, when liquid crystal polymer resin is used as the material of the substrate body 11, the substrate body 11 has protrusions corresponding to the shapes of the recesses 21, the notches 22, the openings 23 and 26, and the through holes 25. It is formed by injection molding using a mold having it.

  Thus, by forming the recess 21, the notch 22, the openings 23 and 26, and the through hole 25 at the same time, the recess 21, the notch 22, the openings 23 and 26, and the through hole 25 are separately formed. Compared with the case where it forms, productivity improves and the manufacturing cost of the board | substrate 10 can be reduced.

  Further, when glass epoxy resin is used as the material of the substrate body 11, the recess 21, the notch 22, the openings 23 and 26, and the through-hole 25 are formed on the plate-shaped glass epoxy resin using a drill or a laser. The substrate body 11 is formed by processing each of the above. In addition, about the shape and dimension of the recessed part 21, the notch part 22, opening part 23,26, and the through-hole 25, the recessed part 21, notch part 22, opening part 23,26, and through-hole 25 demonstrated previously are mentioned. Use shape and dimensions.

  Next, as shown in FIGS. 8 and 9, the capacitor component 13 is arranged in the recess 21 (electronic component arranging step). Thereby, the corners 13 </ b> A to 13 </ b> D of the capacitor component 13 are exposed from the recess 21. Subsequently, as shown in FIG. 10, a resin 19 serving as an adhesive is provided in the notch 22 to fix the capacitor component 13 to the substrate body 11 (electronic component fixing step).

  Next, as shown in FIG. 11, the connection pin 12 is inserted into the through hole 25. Thus, the manufacturing process can be simplified by using the connection pin 12 instead of the through via. When glass epoxy resin is used as the material of the substrate body 11, a through via is formed using a printed wiring board technique (plating method or the like) instead of the connection pins 12.

  Then, as shown in FIG. 12, the board | substrate 10 is manufactured by forming the external connection terminal 17 in the edge part of the connection pin 12 located in the terminal 32 side, and the terminal 32, respectively.

  According to the substrate manufacturing method of the present embodiment, the concave portion 21 that substantially matches the outer shape of the capacitor component 13 is formed in the substrate main body 11, and the capacitor component 13 is disposed in the concave portion 21, so that the positional accuracy of the capacitor component 13 is increased. Can be improved. In addition, the notch 22 is formed in the substrate body 11 that forms the side surface 21A of the recess 21, and the resin 19 is provided in the notch 22, so that the capacitor component 13 with improved positional accuracy is fixed to the substrate body 11. Can do.

  In the substrate manufacturing method of the present embodiment, the case where the resin component 19 is provided in the notch 22 after the capacitor component 13 is disposed in the recess 21 has been described as an example. Alternatively, the capacitor component 13 may be disposed in the recess 21 and the capacitor component 13 may be fixed to the substrate body 11. Alternatively, the capacitor component 13 may be fixed to the recess 21 of the substrate body 11 after the connection pin 12 is inserted into the through hole 25.

  Moreover, the board | substrate 40 of the modification of this Embodiment can be manufactured with the manufacturing method remove | excluding the process of providing resin 19 from the manufacturing process of the board | substrate 10 of 1st Embodiment.

(Second Embodiment)
FIG. 13 is a cross-sectional view of the substrate according to the second embodiment of the present invention, and FIG. 14 is a plan view of the substrate shown in FIG. Also in the present embodiment, the case where the capacitor component 13 is used as an electronic component will be described as an example.

  Referring to FIGS. 13 and 14, the substrate 50 is configured in the same manner as the substrate 10 of the first embodiment except that a substrate body 51 is provided instead of the substrate body 11.

  15 is a cross-sectional view of the substrate body, and FIG. 16 is a plan view of the substrate body shown in FIG.

  Referring to FIGS. 15 and 16, the substrate body 51 is formed with a through part 52, a through hole 53, and a notch part 54.

  The through portion 52 is formed in the substrate body 51 corresponding to the mounting area of the semiconductor chip 15. The through portion 52 is a space for arranging the capacitor component 13. The shape of the penetrating portion 52 substantially matches the outer shape of the capacitor component 13, and the thickness M3 of the penetrating portion 52 is set to be substantially equal to the thickness M1 of the capacitor component 13 (M3 = M1). .

  Thus, by making the thickness M3 of the substrate body 51 substantially equal to the thickness M1 of the capacitor component 13, the substrate 50 can be further reduced in thickness.

  The gap between the side surface 52A of the penetrating portion 52 and the capacitor component 13 can be set to 50 μm to 100 μm, for example.

  As described above, by providing the substrate body 11 with the through portion 52 that substantially matches the outer shape of the capacitor component 13, the position of the capacitor component 13 is regulated by the substrate body 51 that forms the side surface 52 </ b> A of the through portion 52. The position accuracy of 13 can be improved.

  A plurality of through holes 53 are formed in the substrate body 51 located in the vicinity of the through part 52. The through hole 53 passes through the substrate body 51. The through hole 53 is for arranging the connection pin 12 (see FIG. 13).

  The cutouts 54 are respectively formed in the substrate body 51 that faces the corners 13A to 13D of the capacitor component 13 among the substrate body 51 that forms the side surface 52A of the penetrating part 52 (see FIG. 14). The notch 54 passes through the substrate body 51 and is configured integrally with the recess 21. The cutout portion 54 in plan view has a fan shape with a part of a circle missing. The diameter R4 of the notch 54 can be set to 0.5 mm, for example.

  Thus, by providing the notch portion 54 in the substrate body 51 that forms the side surface 52A of the penetrating portion 52, the resin 19 is provided in the notch portion 54, and the capacitor component 13 with improved positional accuracy is provided in the substrate body 51. Can be fixed. As the material of the substrate body 51 having the above configuration, the same material as that of the substrate body 11 described in the first embodiment can be used.

  According to the substrate of the present embodiment, the substrate 50 can be further reduced in thickness by making the thickness M3 of the substrate body 51 substantially equal to the thickness M1 of the capacitor component 13. Further, by providing the substrate body 51 with the through portion 52 that substantially matches the outer shape of the capacitor component 13, the position of the capacitor component 13 is regulated by the side surface 52 </ b> A of the through portion 52, thereby improving the positional accuracy of the capacitor component 13. Can do. Further, the notch portion 54 is provided in the substrate body 51 that forms the side surface 52A of the penetrating portion 52, and the resin component 19 is provided in the notch portion 54, thereby fixing the capacitor component 13 with improved positional accuracy to the substrate body 51. be able to.

  In the substrate 50, the case where the capacitor component 13 is provided as an electronic component has been described as an example. However, in the present embodiment, the substrate 50 includes an electronic component such as a passive component or an active component other than the capacitor component 13. It can also be applied to. When glass epoxy resin is used as the material of the substrate body 51, a through via may be formed by using a printed wiring board technique (plating method or the like) instead of the connection pin 12.

  In the present embodiment, the notch 54 penetrating the substrate body 51 has been described as an example, but the depth of the notch 54 is determined by the resin 19 filled in the notch 54 being the capacitor component 13. The depth is sufficient to fix the substrate to the substrate body 51, and is not limited to this. Furthermore, the shape of the notch 54 is not limited to the shape shown in FIGS. Further, the present embodiment can be applied to a substrate that does not include the external connection terminal 17.

  FIG. 17 is a plan view of a substrate according to a modification of the second embodiment.

  Referring to FIG. 17, a substrate 60 is the same as the substrate 50 of the second embodiment except that the substrate body 51 is provided with a notch portion 61 instead of the notch portion 55 and the resin 19 is excluded from the configuration. It is comprised similarly.

  The notches 61 are respectively formed in the substrate body 51 that faces the corners 13A to 13D of the capacitor component 13. The substrate body 51 that forms the side surface 61 </ b> A of the notch 61 is formed so as to contact the corners 13 </ b> A to 13 </ b> D of the capacitor component 13.

  According to the substrate 60 of the modification of the second embodiment, by providing the notch portion 61 in the substrate body 51, the corner portion 13A of the capacitor component 13 is formed by the substrate body 51 that forms the side surface 61A of the notch 61. The capacitor component 13 can be fixed to the substrate body 51 without using the resin 19 by sandwiching ˜13D. In addition, the board | substrate 60 can acquire the effect similar to the board | substrate 50 of 2nd Embodiment. Further, the resin 19 may be provided in the notch 61.

  The substrate 50 of the present embodiment can be manufactured by a method similar to that of the substrate 10 of the first embodiment, and the same effect as the method of manufacturing the substrate 10 of the first embodiment can be obtained. . Moreover, the board | substrate 60 of the modification of this Embodiment can be manufactured with the manufacturing method remove | excluding the process of providing resin 19 from the manufacturing process of the board | substrate 10 of 1st Embodiment.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and within the scope of the present invention described in the claims, Various modifications and changes are possible.

  INDUSTRIAL APPLICABILITY The present invention can be applied to a substrate that can improve the positional accuracy of an electronic component fixed to a substrate body and can be thinned, and a method for manufacturing the substrate.

It is sectional drawing of the conventional board | substrate which incorporated the electronic component. It is a top view of the board | substrate shown in FIG. It is sectional drawing of the board | substrate which concerns on the 1st Embodiment of this invention. It is a top view of the board | substrate shown in FIG. It is sectional drawing of a board | substrate body. FIG. 6 is a plan view of the substrate body shown in FIG. 5. It is a top view of the board | substrate which concerns on the modification of 1st Embodiment. FIG. 3 is a diagram (part 1) illustrating a manufacturing process of a substrate according to the first embodiment; It is a top view of the structure in the process shown in FIG. It is FIG. (2) which shows the manufacturing process of the board | substrate which concerns on 1st Embodiment. It is FIG. (The 3) which shows the manufacturing process of the board | substrate which concerns on 1st Embodiment. It is FIG. (4) which shows the manufacturing process of the board | substrate which concerns on 1st Embodiment. It is sectional drawing of the board | substrate of the 2nd Embodiment of this invention. It is a top view of the board | substrate shown in FIG. It is sectional drawing of a board | substrate body. FIG. 16 is a plan view of the substrate body shown in FIG. 15. It is a top view of the board | substrate which concerns on the modification of 2nd Embodiment.

Explanation of symbols

10, 40, 50, 60 Substrate 11, 51 Substrate body 11A Upper surface 11B Lower surface 12 Connection pin 13 Capacitor parts 13A-13D Corner 15 Semiconductor chip 16A Power supply terminal 16B Ground terminal 16C Signal terminal 17 External connection terminal 18 Circuit board 19 resin 21 recess 21A, 41A, 52A, 61A side face 21B bottom face 22, 41, 54, 61 notch 23, 26 opening 25, 53 through hole 30 capacitor body 31A, 31B, 32 terminal 33 through electrode 52 through part D1 , D2 depth M1-M3 thickness R1-R4 diameter

Claims (10)

A substrate comprising a substrate body, a recess formed in the substrate body, and an electronic component disposed in the recess,
A substrate characterized in that the shape of the recess is substantially matched with the outer shape of the electronic component, and a notch is provided in the substrate body forming the side surface of the recess.   The substrate according to claim 1, wherein an opening for exposing a terminal of the electronic component is provided in a substrate body forming a bottom surface of the recess. A substrate comprising a substrate body, a penetrating portion formed in the substrate body, and an electronic component disposed in the penetrating portion,
The board | substrate characterized by making the shape of the said penetration part substantially correspond with the external shape of the said electronic component, and providing the notch part in the board | substrate body which forms the side surface of a penetration part.   4. The substrate according to claim 3, wherein the thickness of the substrate body is substantially equal to the thickness of the electronic component.   5. The substrate according to claim 1, wherein, when the electronic component has a substantially quadrangular shape, the notch is provided in a substrate body corresponding to a corner of the electronic component.   The substrate according to claim 5, wherein the four corners of the electronic component are in contact with a substrate body that forms the notch. The substrate body has a plurality of through holes,
The board according to claim 1, wherein the plurality of through holes are provided with conductive connection pins. A substrate manufacturing method comprising a substrate body, a recess formed in the substrate body, and an electronic component disposed in the recess,
A recess forming step for forming a recess substantially matching the outer shape of the electronic component on the substrate body;
A notch part forming step for forming a notch part on the substrate body forming the side surface of the recess,
An electronic component placement step of placing an electronic component in the recess,
An electronic component fixing step of fixing an electronic component to the substrate body by providing an adhesive in the notch.   9. The method for manufacturing a substrate according to claim 8, wherein the recess forming step and the notch forming step are simultaneously performed by an injection molding method using a mold. A substrate manufacturing method comprising a substrate body, a penetrating portion formed in the substrate body, and an electronic component disposed in the penetrating portion,
A penetrating part forming step of forming a penetrating part substantially matching the outer shape of the electronic component in the substrate body;
A notch part forming step for forming a notch part in the substrate body forming the side surface of the penetrating part,
An electronic component placement step of placing an electronic component in the penetrating portion;
And an electronic component fixing step of fixing the electronic component to the substrate body by providing an adhesive in the cutout portion.

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