JP5344033B2 - Electronic equipment - Google Patents

Description

The present invention relates to electronic devices, and more particularly, to an electronic apparatus provided with a circuit board on which an electronic component is to be mounted on the surface.

  As a conventional circuit board, for example, a printed circuit board described in Patent Document 1 is known. FIG. 9 is an exploded perspective view of the electronic apparatus 510 including the printed circuit board 512 described in Patent Document 1. FIG. 10 is an external perspective view of the electronic device 510 described in Patent Document 1. FIG.

  As shown in FIG. 9, the electronic device 510 includes a printed circuit board 512, a lid body 514, and a frame body 516. The printed circuit board 512 includes rigid portions 512a and 512b and a flexible portion 512c. The rigid portions 512a and 512b are rectangular hard substrates made of resin, ceramic, or the like. Electronic components (not shown) are mounted on the main surfaces of the rigid portions 512a and 512b. The flexible part 512c is made of a flexible material and incorporates a wiring for connecting the rigid parts 512a and 512b.

  As shown in FIG. 10, the lid body 514 and the frame body 516 constitute a rectangular parallelepiped housing by being assembled, and include a printed circuit board 512 inside. As shown in FIG. 9, the frame 516 has claws 518 (518a to 518d) and 520 (520a to 520d). The claws 518 and 520 are protrusions protruding inward on the side surface of the frame body 516, and hold the rigid portions 512a and 512b. Specifically, as shown in FIG. 10, the printed circuit board 512 is bent in two at the flexible portion 512c. The rigid portion 512 b is held by the frame body 516 by being engaged with the claw 518. Further, the rigid portion 512 a is held by the frame body 516 by being engaged with the claw 520.

  By the way, in the printed circuit board 512 described in Patent Document 1, when the rigid portions 512a and 512b are attached to the frame body 516, the electronic components on the rigid portions 512a and 512b may come off as described below. is there. More specifically, when the rigid portions 512a and 512b are engaged with the claws 518 and 520, the rigid portions 512a and 512b are pushed into the frame body 516 from above by the assembler. At this time, the rigid portion 512b and the claw 518 are elastically deformed, so that the rigid portion 512b is fitted below the claw 518. Similarly, the rigid portion 512a and the claw 520 are elastically deformed, so that the rigid portion 512a is fitted below the claw 520.

  Here, the rigid portions 512a and 512b are hard substrates made of resin, ceramic, or the like. Therefore, the entire rigid parts 512a and 512b are bent at the time of attachment to the frame body 516. The electronic component is soldered on the rigid parts 512a and 512b. Therefore, the solder is damaged when the rigid portions 512a and 512b are bent. As a result, the electronic component is detached from the rigid portions 512a and 512b.

  As other circuit boards, for example, a multilayer wiring board described in Patent Document 2 and a flexible printed circuit board described in Patent Document 3 are known. The multilayer wiring board (flexible printed circuit board) is attached to the case with screws. Even in such a multilayer wiring board (flexible printed circuit board), when being fixed to the case, the board is bent by the force from the screw. As a result, the electronic components on the board may be removed.

JP 2001-332885 A JP-A-8-222855 Japanese Patent Laid-Open No. 7-1554038

An object of the present invention, upon attachment to the electronic device is to provide an electronic apparatus provided with a circuit board that can prevent the mounted electronic component is out.

An electronic device according to an aspect of the present invention includes a circuit board configured by a first substrate body made of a flexible material, an electronic device body, and a fixing member provided in the electronic device body. with which, the first substrate main body, possess a mounting region on which an electronic component is to be mounted, the deformable structure than the mounting region, is provided along the outer periphery of the first substrate main body A variable region including a fixed region having a structure that is more easily deformed than the mounting region , and the fixing member is the flexible material of the fixed region. The circuit board is fixed to the main body of the electronic device by directly contacting the electronic device .

  ADVANTAGE OF THE INVENTION According to this invention, when attaching to an electronic device, it can suppress that the electronic component mounted in the circuit board remove | deviates.

1 is an external perspective view of a circuit board according to an embodiment of the present invention. It is a disassembled perspective view of the circuit board of FIG. It is a perspective view in the manufacture process of the flexible sheet | seat of a circuit board. It is an external appearance perspective view of an electronic device. FIG. 5 is a cross-sectional structural view taken along line AA in FIG. FIG. 5 is a cross-sectional structure diagram along BB in FIG. 4. It is an external appearance perspective view of the circuit board concerning other embodiments. It is an external appearance perspective view of the circuit board concerning other embodiments. It is a disassembled perspective view of the electronic device provided with the printed circuit board of patent document 1. 1 is an external perspective view of an electronic device described in Patent Document 1. FIG.

Hereinafter, the engagement Ru electronic apparatus according to an embodiment of the present invention will be described with reference to the drawings.

(Configuration of circuit board)
The configuration of a circuit board according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of a circuit board 10a according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the circuit board 10a of FIG. FIG. 3 is a perspective view in the process of manufacturing the flexible sheet 26a of the circuit board 10a. 3A shows the back surface of the flexible sheet 26a, and FIG. 3B shows the surface of the flexible sheet 26a in a state where the resist films 20 and 24 are not formed. In addition, the surface of the flexible sheet 26 refers to a surface positioned on the upper side in the stacking direction, and the back surface of the flexible sheet 26 refers to a surface positioned on the lower side in the stacking direction. In FIG. 2, the resist films 20 and 24 are hatched for easy understanding of the presence or absence of the resist films 20 and 24.

  As shown in FIG. 1, the circuit board 10 a includes board main bodies 12 and 14 and a connection portion 16. The substrate body 12 has a rectangular shape, and is a rigid substrate on which a plurality of chip components 50 and an integrated circuit 52 are mounted. The board body 14 has a rectangular shape smaller than that of the board body 12 and is a rigid board on which the connector 54 is mounted. The connection portion 16 is a flexible substrate that connects the substrate body 12 and the substrate body 14. As shown in FIG. 2, the substrate bodies 12 and 14 and the connection portion 16 are made of a flexible sheet 26 (26a to 26a) made of a plurality (four in FIG. 2) of a flexible material (for example, a thermoplastic resin such as a liquid crystal polymer). 26d) is overlapped. Therefore, the substrate bodies 12 and 14 and the connection portion 16 have the same thickness (the thickness of the four flexible sheets 26).

  First, the substrate body 12 will be described. As shown in FIG. 2, the substrate body 12 is configured by stacking substrate sheets 27 a to 27 d of flexible sheets 26 a to 26 d. As shown in FIGS. 1 to 3, the substrate body 12 includes a resist film 20, dummy wirings 22, lands 28, wiring conductors 30 (30b, 30c), a ground conductor 36, and via-hole conductors b1 to b3. . In FIG. 1 to FIG. 3, only representative ones are assigned reference numerals to the wiring conductor 30 and the via-hole conductors b1 to b3 in order to prevent the drawings from becoming complicated.

  Further, as shown in FIG. 1, the substrate body 12 has a mounting area E1, a variable area E2, and a fixed area E3 on its main surface. The mounting region E1 is a region where the chip component 50 and the integrated circuit 52 are mounted, and has a rectangular shape that is slightly smaller than the substrate body 12. The variable area E <b> 2 is provided along the outer periphery of the substrate body 12. That is, the variable area E2 surrounds the mounting area E1. Further, the chip component 50 and the integrated circuit 52 are not mounted in the variable region E2. The fixed region E3 is included in the variable region E2, and is a region where a fixing member provided in the electronic device comes into contact, as will be described later.

  As shown in FIG. 2, the land 28 is a conductor layer provided on the surface of the substrate sheet 27a. As shown in FIG. 1, the chip component 50 and the integrated circuit 52 are mounted on the land 28 by soldering. Therefore, the land 28 is provided in the mounting area E1.

  The resist film 20 is an insulating film that is provided on the surface of the substrate sheet 27a so as to cover the mounting region E1 and protects the substrate sheet 27a. However, the resist film 20 is not provided on the land 28. The resist film 20 is produced, for example, by applying a resin.

  As shown in FIGS. 1 to 3, the dummy wiring 22 is a surface conductor layer provided on the boundary between the mounting region E1 and the variable region E2 on the surface of the substrate sheet 27a. The dummy wiring 22 is not connected to the land 28 or other wiring. In the present embodiment, the dummy wiring 22 is provided so as to overlap the outer edge of the resist film 20 and surround the resist film 20.

  As shown in FIG. 2, the wiring conductors 30b and 30c are conductor layers provided on the surfaces of the substrate sheets 27b and 27c, respectively. The via-hole conductors b1 to b3 are provided so as to penetrate the substrate sheets 27a to 27c in the stacking direction, as shown in FIGS. The wiring conductors 30b and 30c and the via-hole conductors b1 to b3 are connected to each other to form a circuit by laminating the substrate sheets 27a to 27d.

  The ground conductor 36 is a single solid electrode having a large area provided in a portion overlapping the mounting region E1 on the surface of the substrate sheet 27d. The ground conductor 36 defines a mounting area E1 in the substrate body 12. That is, the ground conductor 36 has a shape that coincides with the mounting region E1 when viewed in plan from the normal direction of the main surface of the substrate body 12. The ground conductor 36 is kept at a ground potential by being grounded. The ground conductor 36 is connected to a circuit including the wiring conductors 30b and 30c and the via-hole conductors b1 to b3 via the via-hole conductor b3. Conductive patterns such as the ground conductor 36, the dummy wiring 22, the land 28, and the wiring conductor 30 are formed by patterning a metal foil such as a copper foil by photolithography or the like, and are harder than the flexible sheet 26.

  Next, the substrate body 14 will be described. As shown in FIG. 2, the substrate body 14 is configured by stacking substrate sheets 29 a to 29 d of flexible sheets 26 a to 26 d. As shown in FIGS. 1 to 3, the substrate body 14 includes a resist film 24, lands 33, wiring conductors 34 (34b, 34c), a ground conductor 40, and via-hole conductors b11, b12. 1 to 3, the wiring conductor 34 and the via-hole conductors b11 and b12 are provided with reference numerals only for representative ones in order to prevent the drawings from becoming complicated.

  As shown in FIG. 2, the land 33 is a conductor layer provided on the surface of the substrate sheet 29a. As shown in FIG. 1, a connector 54 is mounted on the land 28 by soldering.

  The resist film 24 is an insulating film that is provided on the surface of the substrate sheet 29a and protects the substrate sheet 29a. However, the resist film 24 is not provided on the land 33. The resist film 24 is produced, for example, by applying a resin.

  As shown in FIG. 2, the wiring conductors 34b and 34c are conductor layers provided on the surfaces of the substrate sheets 29b and 29c, respectively. As shown in FIGS. 2 and 3A, the via-hole conductors b11 and b12 are provided so as to penetrate through the substrate sheets 29a and 29b in the stacking direction. The wiring conductors 34b and 34c and the via-hole conductors b11 and b12 are connected to each other to form a circuit by laminating the substrate sheets 29a to 29d.

  The ground conductor 40 is a single solid electrode provided on the surface of the substrate sheet 29d. The ground conductor 40 may be provided on the plurality of substrate sheets 29.

  Next, the connection part 16 is demonstrated. As shown in FIG. 2, the connection portion 16 is configured by overlapping connection sheets 31 a to 31 d of the flexible sheets 26 a to 26 d. Moreover, the connection part 16 is provided with the wiring conductor 32 (32b, 32c) and the ground conductor 38, as shown in FIG.1 and FIG.2.

  As shown in FIG. 2, the wiring conductors 32b and 32c are conductor layers provided on the surfaces of the connection sheets 31b and 31c, respectively. As shown in FIG. 2, the wiring conductor 32b connects the wiring conductor 30b and the wiring conductor 34b. Further, as shown in FIG. 2, the wiring conductor 32c connects the wiring conductor 30c and the wiring conductor 34c.

  The ground conductor 38 is a conductor layer provided on the surface of the connection sheet 31 d and connecting the ground conductor 36 and the ground conductor 40. The ground conductor 38 and the wiring conductors 32b and 32c overlap each other when viewed in plan from the stacking direction, thereby forming a microstrip line. As a result, impedance matching is achieved between the circuit in the substrate body 12 and the circuit in the substrate body 14.

  As described above, in the circuit board 10a, as shown in FIG. 1, the ground region 36 that is harder than the flexible sheet 26 is provided in the mounting region E1. Further, a resist film 20 that is harder than the flexible sheet 26 is provided in the mounting region E1. On the other hand, the ground conductor 36 and the resist film 20 are not provided in the variable region E2 and the fixed region E3. Therefore, the variable region E2 and the fixed region E3 have a structure that is more easily deformed than the mounting region E1. In the present embodiment, the variable region E2 is continuously provided all around the substrate body 12, the connection portion 16, and the substrate body 14 that constitute the circuit board 10a.

(Configuration of electronic device)
Next, the electronic device 100 on which the circuit board 10a is mounted will be described with reference to the drawings. FIG. 4 is an external perspective view of the electronic device 100. FIG. 5 is a cross-sectional structural view taken along line AA of FIG. 6 is a cross-sectional structural view taken along line BB in FIG. FIG. 4 is an enlarged view of the vicinity of the circuit board 10a.

  The electronic device 100 is, for example, a mobile phone or a personal computer, and includes a circuit board 10a, an electronic device main body 102, and fixing members 104 (104a to 104d) as shown in FIG. The electronic device main body 102 is a main body such as a mobile phone or a personal computer. However, the electronic device main body 102 shown in FIG. 4 is a mother board such as a mobile phone or a personal computer.

  As shown in FIGS. 4 and 5, the circuit board 10 a is mounted on the electronic device main body 102 in a U-shaped state. In other words, the substrate body 14 wraps around the lower side of the substrate body 12 when the connecting portion 16 is bent.

  Further, as shown in FIG. 5, a connector 103 is provided on the main surface of the electronic apparatus main body 102. A connector 54 mounted on the board body 14 is connected to the connector 103. Thereby, the circuit board 10a and the electronic apparatus main body 102 are electrically connected.

  The substrate body 12 is fixed by a fixing member 104. As shown in FIGS. 4 and 5, the fixing member 104 extends upward from the main surface of the electronic device main body 102, and comes into contact with the main surface of the substrate main body 12 in the vicinity of the upper end. 12 is held. Specifically, the fixing member 104 is provided so as to come into contact with two opposite sides of the circuit board 10a. Further, the fixing member 104a and the fixing member 104c face each other with the circuit board 10a interposed therebetween, and the fixing member 104b and the fixing member 104d face each other with the circuit board 10a interposed therebetween.

  Hereinafter, details of the fixing member 104 will be described using the fixing member 104b as an example. As shown in FIG. 6, the fixing member 104b includes a support shaft 105b and claw-like members 106b and 108b. The support shaft 105 b is a member that extends vertically upward from the main surface of the electronic device main body 102. The claw-like members 106b and 108b are protrusions that protrude in the same direction with a predetermined gap left in the horizontal direction from the support shaft 105b. The predetermined gap is the thickness of the substrate body 12. As shown in FIG. 6, the fixing member 104b holds the substrate body 12 by sandwiching the outer edge of the substrate body 12 between the claw-like member 106b and the claw-like member 108b. A region where the claw-like member 106b is in contact with the upper surface of the substrate body 12 is referred to as a fixed region E3. Thereby, as shown in FIG. 1, the fixed region E <b> 3 is provided in contact with two opposite sides of the circuit board 10 a.

(Circuit board manufacturing method)
Below, the manufacturing method of the circuit board 10a is demonstrated, referring drawings. Hereinafter, a case where one circuit board 10a is manufactured will be described as an example, but actually, a plurality of circuit boards 10a are simultaneously manufactured by laminating and cutting large-sized flexible sheets.

  First, a flexible sheet 26 having a copper foil formed on the entire surface is prepared. Next, a laser beam is irradiated from the back side to the positions (see FIGS. 2 and 3A) where the via hole conductors b1 to b3 of the flexible sheets 26a to 26c are formed to form via holes.

  Next, the dummy wiring 22 and the lands 28 and 33 shown in FIG. 3B are formed on the surface of the flexible sheet 26a by a photolithography process. Specifically, a resist having the same shape as the dummy wiring 22 and the lands 28 and 33 shown in FIG. 3B is printed on the copper foil of the flexible sheet 26a. And the copper foil of the part which is not covered with the resist is removed by performing an etching process with respect to copper foil. Thereafter, the resist is removed. As a result, dummy wirings 22 and lands 28 and 33 are formed on the surface of the flexible sheet 26a as shown in FIG. Furthermore, the resist films 20 and 24 shown in FIGS. 1 and 2 are formed by applying a resin to a region surrounded by the dummy wirings 22 on the surface of the flexible sheet 26a. In the electronic component 10a, as shown in FIG. 6, the resin is applied so that the resist film 20 slightly overlaps the dummy wiring 22 as well.

  Next, wiring conductors 30b, 32b, and 34b shown in FIG. 2 are formed on the surface of the flexible sheet 26b by a photolithography process. Further, wiring conductors 30c, 32c, and 34c shown in FIG. 2 are formed on the surface of the flexible sheet 26c by a photolithography process. Further, the ground conductors 36, 38, and 40 shown in FIG. 2 are formed on the surface of the flexible sheet 26d by a photolithography process. Note that these photolithography processes are the same as the photolithography processes for forming the dummy wirings 22 and the lands 28 and 33, and thus description thereof is omitted.

  Next, the via holes formed in the flexible sheets 26a to 26c are filled with a conductive paste mainly composed of copper to form via hole conductors b1 to b3 shown in FIGS. 2 and 3A.

  Next, the flexible sheets 26a to 26d are stacked in this order. And the flexible sheets 26a-26d are crimped | bonded by applying force from the up-down direction with respect to the flexible sheets 26a-26d. Thereby, the circuit board 10a shown in FIG. 1 is obtained.

(effect)
According to the circuit board 10a as described above, the chip component 50 and the integrated circuit 52 can be prevented from being detached from the board body 12 when attached to the electronic device 100 as described below. More specifically, when the circuit board 10 a is attached to the electronic device 100, the board body 12 is set on the fixing member 104 and the board body 12 is pressed against the fixing member 104. As a result, the fixing member 104 and the substrate body 12 are elastically deformed, and the substrate body 12 enters between the claw-like members 106 and 108. As a result, the substrate body 12 is held by the fixing member 104.

  Here, the substrate body 12 is elastically deformed when pressed against the fixing member 104. At this time, if the entire substrate body 12 has a uniform hardness, the entire substrate body 12 is bent. As a result, the solder that fixes the chip component 50 and the integrated circuit 52 to the substrate body 12 may be damaged, and the chip component 50 and the integrated circuit 52 may be detached from the substrate body 12.

  Therefore, in the circuit board 10a, the fixing region E3 with which the fixing member 104 contacts has a structure that is more easily deformed by an external force than the mounting region E1 in which the chip component 50 and the integrated circuit 52 are mounted. The fixing region E <b> 3 with which the fixing member 104 comes into contact is a portion where the load is most applied to the substrate body 12 when the substrate body 12 is pressed against the fixing member 104. For this reason, the fixed region E3 is configured to be more easily deformed than the mounting region E1, so that the fixed region E3 is elastically deformed and the mounting region E1 is hardly deformed. As a result, the mounting region E <b> 1 is deformed, and the chip component 50 and the integrated circuit 52 are prevented from being detached from the substrate body 12.

  In particular, in the circuit board 10a, the variable area E2 having a structure that is more easily deformed than the mounting area E1 includes the fixed area E3 and is provided along the outer periphery of the board body 12. For this reason, when the substrate body 12 is pressed against the fixing member 104, the fixing region E3 is deformed, and the portion adjacent to the fixing region E3 in the variable region E2 is also deformed. As a result, deformation of the mounting region E1 is more effectively suppressed.

  Further, a variable region E2 is provided along the outer periphery of the substrate body 12. Therefore, even if the substrate body 12 is set on the fixed member 104 in a shifted state, the fixed member 104 is in contact with the variable region E2. Therefore, when the board body 12 is pressed against the fixing member 104, the variable area E2 is deformed and the mounting area E1 is prevented from being deformed. Therefore, it is not necessary to set the board body 12 with high accuracy, and the circuit board 10a can be easily attached to the electronic device 100.

  In the circuit board 10a, the resist film 20 is provided in the mounting area E1, and is not provided in the variable area E2 and the fixed area E3. Therefore, the variable region E2 and the fixed region E3 are more easily deformed by the resist film 20 than the mounting region E1.

  Further, in the circuit board 10a, the chip component 50 and the integrated circuit 52 are prevented from being detached from the board body 12 due to an impact when the electronic device 100 is dropped, as will be described below. More specifically, when the electronic device 100 falls, an impact is transmitted to the substrate body 12 via the fixing member 104. The substrate body 12 is elastically deformed by this impact.

  Here, in the substrate body 12, the fixed region E3 with which the fixing member 104 is in contact has a structure that is more easily deformed than the mounting region E1. Furthermore, the variable region E2 includes a fixed region E3 and is provided along the outer periphery of the substrate body 12. Therefore, when the substrate body 12 is elastically deformed, the variable region E2 and the fixed region E3 are deformed, and the mounting region E1 is hardly deformed. As a result, the chip component 50 and the integrated circuit 52 are prevented from being detached from the substrate body 12 due to an impact when the electronic device 100 is dropped.

  Further, in the electronic device 100, the fixing member 104 is in contact with the sides facing each other in the substrate body 12. Therefore, the force exerted by the fixing members 104a and 104c on the substrate body 12 and the force exerted by the fixing members 104b and 104d on the substrate body 12 are balanced in the opposite directions. As a result, the substrate body 12 is stably held by the fixing member 104.

  In particular, in the electronic device 100, the fixing members 104a and 104c are provided so as to face each other with the substrate body 12 interposed therebetween, as shown in FIG. Similarly, as shown in FIG. 4, the fixing members 104b and 104d are provided so as to face each other with the circuit board 10a interposed therebetween. Therefore, when viewed from the center of the base body 12 (intersection of diagonal lines), the moment that the fixing member 104a exerts on the substrate body 12 and the moment that the fixing member 104c exerts on the substrate body 12 are balanced. Furthermore, the moment that the fixing member 104b exerts on the substrate body 12 and the moment that the fixing member 104d exerts on the substrate body 12 are balanced. As a result, the moment of rotation of the substrate body 12 is canceled, and the substrate body 12 is more stably held by the fixing member 104.

  In addition, the ground conductor 36 is provided in the mounting area E1 and the ground conductor 36 is provided in the variable area E2 and the fixed area E3 so that the variable area E2 and the fixed area E3 are more easily deformed than the mounting area E1. Not. Thus, in the circuit board 10a, the ground conductor 36 which is an existing component is used, and a new configuration is not added. As a result, the circuit board 10a can be downsized.

  The circuit board 10a can be reduced in thickness and weight as described below. More specifically, in the printed circuit board 512 shown in FIG. 9, the rigid portions 512a and 512b are configured by sandwiching a flexible sheet between two substrates such as a resin. Therefore, the rigid portions 512a and 512b have a total thickness of the flexible sheet and the two substrates. Similarly, the rigid portions 512a and 512b have a total weight of the flexible sheet and the two substrates.

  On the other hand, in the circuit board 10 a, the board body 12 has only the thickness of the flexible sheet 26. The flexible sheet 26 is thinner and lighter than a substrate made of resin or the like. Therefore, the substrate body 12 is thinner than the rigid parts 512a and 512b. Similarly, the substrate body 12 is lighter than the rigid portions 512a and 512b. Therefore, the circuit board 10a can be reduced in thickness and weight.

(Other embodiments)
The circuit board and the electronic device including the circuit board according to the present invention are not limited to those described in the above embodiment, and can be changed within the scope of the gist. Hereinafter, circuit boards according to other embodiments and electronic devices including the circuit boards will be described.

  FIG. 7 is an external perspective view of a circuit board 10b according to another embodiment. The difference between the circuit board 10b and the circuit board 10a is the shape of the variable region E2. More specifically, in the circuit board 10a, the variable region E2 is provided along the outer periphery of the board body 12. On the other hand, in the circuit board 10b, the variable region E2 is provided only in the fixed region E3 and a part of the region adjacent to the fixed region E3. Even in the circuit board 10b having the above-described configuration, the chip component 50 and the integrated circuit 52 are prevented from being detached from the board body 12 in the same manner as the circuit board 10a. Furthermore, the variable area E2 is narrower in the circuit board 10b than in the circuit board 10a. Therefore, the circuit board 10b can have a larger mounting area E1 than the circuit board 10a.

  FIG. 8 is an external perspective view of a circuit board 10c according to another embodiment. The difference between the circuit board 10 c and the circuit board 10 a is a method of attaching to the electronic device main body 102. More specifically, the circuit board 10 a is attached to the electronic device main body 102 by being sandwiched between the fixing members 104. On the other hand, the circuit board 10c is attached to the electronic device main body 102 by screws 204 (204a to 204d). In this case, the part where the screw 204 contacts the substrate body 12 is around the screw hole. Therefore, in the circuit board 10c, the fixing region E3 is provided in an annular shape around the screw hole.

  Also in the circuit board 10c as described above, it is possible to prevent the chip component 50 and the integrated circuit 52 from being detached as described below. More specifically, when the screw 204 is attached, the screw 204 presses around the screw hole of the substrate body 12. At this time, the substrate body 12 is bent by the force from the screw 204.

  Therefore, in the circuit board 10c, the fixing region E3 around the screw hole is more easily deformed than the mounting region E1. Accordingly, the fixing region E3 is deformed by the force from the screw 204, and the mounting region E1 is hardly deformed. As a result, the circuit board 10 c can suppress the chip component 50 and the integrated circuit 52 from being detached from the board body 12.

  In the circuit board 10a, the mounting area E1 is defined by the ground conductor 36. However, the mounting region E1 may be defined by something other than the ground conductor 36, and may be defined by the resist film 20 or the dummy wiring 22, for example.

  Further, in the circuit board 10a, the ground conductor 36 is provided in the mounting region E1, and the ground conductor 36 is not provided in the variable region E2 and the fixed region E3, so that the variable region E2 and the fixed region E3 are deformed more than the mounting region E1. It has a structure that is easy to do. However, instead of the ground conductor 36, an internal conductor layer such as a capacitor conductor or a dummy conductor may be used.

  In the circuit board 10a, the ground conductor 36 is provided in the mounting region E1, and the ground conductor 36 is not provided in the variable region E2 and the fixed region E3, so that the variable region E2 and the fixed region E3 are more than the mounting region E1. It is easy to deform. However, the method of making the variable area E2 and the fixed area E3 easier to deform than the mounting area E1 is not limited to this. When the substrate body 12 is viewed in plan from the normal direction of the main surface, the ratio of the area of the mounting region E1 where the internal conductor layer is provided is the same as that of the variable region E2 and the fixed region E3. What is necessary is just to become higher than the ratio of the area of the part which has. Therefore, an internal conductor layer such as the ground conductor 36 may be provided in the variable region E2 and the fixed region E3.

  Furthermore, in order to make the variable region E2 and the fixed region E3 easier to deform than the mounting region E1, a resist film 20 or a resin substrate may be used instead of the internal conductor layer such as the ground conductor 36.

  In FIG. 6, the claw-like member 106 b is not in contact with the dummy wiring 22. However, the claw-like member 106 b may be in contact with the dummy wiring 22. A region where the dummy wiring 22 is provided is less likely to be deformed than a region where the dummy wiring 22 is not provided. Therefore, the claw-like member 106 b comes into stronger pressure contact with the substrate body 12 by contacting the dummy wiring 22. As a result, the substrate body 12 is firmly fixed by the electronic device body 102.

The present invention is useful for an electronic apparatus provided with a circuit board, in particular, during installation of the electronic apparatus is excellent in that it can prevent the mounted electronic component is out.

b1 to b3, b11, b12 Via hole conductor E1 Mounting area E2 Variable area E3 Fixed area 10a to 10c Circuit board 12, 14 Substrate body 16 Connection part 20, 24 Resist film 22 Dummy wiring 26a to 26d Flexible sheets 27a to 27d, 29a to 29d Substrate sheet 28, 33 Land 30b, 30c, 32b, 32c, 34b, 34c Wiring conductor 31a-31d Connection sheet 36, 38, 40 Ground conductor 50 Chip component 52 Integrated circuit 54 Connector 100 Electronic device 102 Electronic device main body 103 Connector 104a 104d Fixed member 105b Support shaft 106b, 108b Claw-shaped member 204a-204d Screw

Claims (10)

A circuit board composed of a first substrate body made of a flexible material;
An electronic device body;
A fixing member provided in the electronic device body;
With
The first substrate body includes:
Mounting area where electronic components are mounted;
Have a deformable structure than the mounting region, a variable region is provided along the outer periphery of the first substrate main body, a fixed region having a deformable structure than the mounting region A variable region containing
A has,
The fixing member fixes the circuit board to the electronic device body by directly contacting the flexible material in the fixing region;
An electronic device characterized by the above. The variable region has a structure that is more easily deformed than the mounting region;
The electronic device according to claim 1. The first substrate body is configured by stacking a plurality of sheets made of a flexible material, and further includes an inner conductor layer laminated together with the sheets,
When the first substrate body is viewed in plan from the normal direction of the main surface, the ratio of the area of the mounting region where the internal conductor layer is provided is the same as that of the fixed region. Higher than the proportion of the area of the
Electronic device according to claim 1 or claim 2, characterized in. The internal conductor layer provided in the mounting region is either a ground conductor, a capacitor conductor or a dummy conductor, and is a single solid electrode,
The electronic device according to claim 3 . The first substrate body includes:
An insulating film provided on the main surface of the first substrate body and provided in the mounting region,
In addition,
The insulating film is not provided in the variable region on the main surface of the first substrate body,
The electronic device according to any one of claims 1 to 4 , wherein The first substrate body has a rectangular shape,
The fixed region is provided so as to be in contact with opposite sides;
Electronic device according to any one of claims 1 to 5, characterized in. The first substrate body includes:
A surface conductor layer provided on a main surface of the first substrate body and on a boundary between the variable region and the mounting region,
Including further,
Electronic device according to any one of claims 1 to 6, characterized in. A second substrate body;
A connecting portion for connecting the first substrate body and the second substrate body;
Further comprising
The first substrate body, the second substrate body, and the connection portion are configured by stacking a plurality of sheets made of a flexible material,
Electronic device according to any one of claims 1 to 7, characterized in. The fixing member is a claw-like member sandwiching the substrate body;
The electronic device according to claim 1, wherein: The fixing member is a screw;
The electronic device according to claim 1, wherein:

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