WO2018138755A1 - Circuit forming method and circuit forming device - Google Patents

Circuit forming method and circuit forming device Download PDF

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Publication number
WO2018138755A1
WO2018138755A1 PCT/JP2017/002241 JP2017002241W WO2018138755A1 WO 2018138755 A1 WO2018138755 A1 WO 2018138755A1 JP 2017002241 W JP2017002241 W JP 2017002241W WO 2018138755 A1 WO2018138755 A1 WO 2018138755A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
wall
curable resin
resin
ultraviolet curable
Prior art date
Application number
PCT/JP2017/002241
Other languages
French (fr)
Japanese (ja)
Inventor
謙磁 塚田
明宏 川尻
良崇 橋本
克明 牧原
佑 竹内
亮二郎 富永
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2017/002241 priority Critical patent/WO2018138755A1/en
Priority to JP2018563952A priority patent/JP6663516B2/en
Publication of WO2018138755A1 publication Critical patent/WO2018138755A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view

Definitions

  • the present invention relates to a circuit forming method for forming a resin laminate having a cavity for housing a component by laminating a plurality of resin layers obtained by curing a curable resin discharged in a thin film shape, and circuit formation Relates to the device.
  • the goal is to form a cavity that can properly accommodate parts.
  • the present specification provides a resin laminate having a cavity for housing a component by laminating a plurality of resin layers obtained by curing a curable resin discharged in a thin film shape.
  • the resin laminate is formed by discharging the curable resin so that the wall surface of the cavity facing the corner of the component is recessed in a direction away from the corner of the component.
  • a circuit forming method is disclosed.
  • the present specification laminates a discharge device that discharges a curable resin and a plurality of resin layers obtained by curing the curable resin discharged in a thin film by the discharge device.
  • a discharge device that discharges a curable resin and a plurality of resin layers obtained by curing the curable resin discharged in a thin film by the discharge device.
  • FIG. 1 It is a figure which shows a circuit formation apparatus. It is a block diagram which shows a control apparatus. It is sectional drawing which shows an ideal resin laminated body. It is sectional drawing which shows the circuit of the state by which the electronic component was mounted
  • FIG. 1 shows a circuit forming device 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see FIG. 2) 27.
  • the conveying device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are disposed on the base 28 of the circuit forming device 10.
  • the base 28 has a generally rectangular shape.
  • the longitudinal direction of the base 28 is orthogonal to the X-axis direction
  • the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction.
  • the direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56.
  • the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and a lifting device 64.
  • the base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. The both edges in the X-axis direction of the substrate placed on the base 60 are sandwiched between the holding devices 62, so that the substrate is fixedly held.
  • the lifting device 64 is disposed below the base 60 and lifts the base 60.
  • the first modeling unit 22 is a unit that models wiring on a substrate (see FIG. 3) 70 placed on the base 60 of the stage 52, and includes a first printing unit 72 and a firing unit 74. ing.
  • the first printing unit 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink in a linear manner onto the substrate 70 placed on the base 60.
  • the metal ink is obtained by dispersing metal fine particles in a solvent.
  • the inkjet head 76 discharges a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the firing unit 74 has a laser irradiation device (see FIG. 2) 78.
  • the laser irradiation device 78 is a device that irradiates a metal ink discharged onto the substrate 70 with a laser, and the metal ink irradiated with the laser is baked to form a wiring.
  • the firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there.
  • metal wiring is formed by baking metal ink.
  • the second modeling unit 24 is a unit that models a resin layer on the substrate 70 placed on the base 60 of the stage 52, and includes a second printing unit 84 and a curing unit 86. .
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88 and discharges an ultraviolet curable resin onto the substrate 70 placed on the base 60.
  • the ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.
  • the curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 is for flattening the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the inkjet head 88. By scraping with a blade, the thickness of the UV curable resin is made uniform.
  • the irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the ultraviolet curable resin discharged onto the substrate 70 with ultraviolet rays. Thereby, the ultraviolet curable resin discharged on the board
  • the mounting unit 26 is a unit that mounts an electronic component (see FIG. 4) 96 on a substrate 70 placed on the base 60 of the stage 52, and includes a supply unit 100 and a mounting unit 102. ing.
  • the supply unit 100 includes a plurality of tape feeders 110 (see FIG. 2) that send out the taped electronic components 96 one by one, and supplies the electronic components 96 at the supply position.
  • the supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies the electronic component 96 from the tray.
  • the supply unit 100 may be configured to include both a tape type and a tray type, or other supply devices.
  • the mounting unit 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114.
  • the mounting head 112 has a suction nozzle (see FIG. 4) 118 for holding the electronic component 96 by suction.
  • the suction nozzle 118 sucks and holds the electronic component 96 by sucking air when negative pressure is supplied from a positive / negative pressure supply device (not shown). Then, the electronic component 96 is detached by supplying a slight positive pressure from the positive / negative pressure supply device.
  • the moving device 114 moves the mounting head 112 between the supply position of the electronic component 96 by the tape feeder 110 and the substrate 70 placed on the base 60. Thereby, in the mounting unit 102, the electronic component 96 supplied from the tape feeder 110 is held by the suction nozzle 118, and the electronic component 96 held by the suction nozzle 118 is mounted on the substrate 70.
  • the control device 27 includes a controller 120 and a plurality of drive circuits 122 as shown in FIG.
  • the plurality of drive circuits 122 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the tape feeder 110, and the mounting head. 112, connected to the moving device 114.
  • the controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 122. Thereby, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 120.
  • a circuit is formed by mounting the electronic component 96 on the substrate 70 with the above-described configuration. Specifically, the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. And in the 2nd modeling unit 24, as shown in FIG. 3, the resin laminated body 130 is formed on the board
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 in a thin film shape.
  • the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape.
  • the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86.
  • the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. Thereby, a thin resin layer 133 is formed on the substrate 70.
  • the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion above the thin resin layer 133. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape onto the thin resin layer 133 so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 133 is formed on the thin film resin layer 133. A thin resin layer 133 is laminated.
  • the discharge of the ultraviolet curable resin onto the thin resin layer 133 excluding the generally rectangular portion on the upper surface of the substrate 70 and the irradiation with the ultraviolet rays are repeated, and a plurality of resin layers 133 are laminated. Thereby, the resin laminate 130 having the cavity 132 is formed.
  • the stage 52 is moved below the mounting unit 26.
  • the electronic component 96 is supplied by the tape feeder 110, and the electronic component 96 is held by the suction nozzle 118 of the mounting head 112.
  • the mounting head 112 is moved by the moving device 114, and the electronic component 96 held by the suction nozzle 118 is placed inside the cavity 132 of the resin laminate 130 as shown in FIGS. .
  • the height dimension of the resin laminate 130 and the height dimension of the electronic component 96 are substantially the same.
  • the electronic component 96 is mounted inside the cavity 132 of the resin laminate 130.
  • the cavity 132 of the resin laminate 130 shown in FIGS. 3 to 5 has an ideal shape, and the cavity 132 of the actual resin laminate 130 is generally shaped like a bowl as shown in FIGS. 6 and 7. Become. That is, the wall surface 136 of the ideally shaped cavity 132 is perpendicular to the substrate 70 as shown in FIG.
  • the wall surface 136 of the cavity 132 of the actual resin laminate 130 becomes a tapered surface that inclines toward the inside of the cavity 132 as it goes downward, as shown in FIG.
  • the ultraviolet curable resin when the ultraviolet curable resin is discharged onto the resin layer 133 during the formation of the resin laminate 130, the discharged ultraviolet curable resin flows into the cavity 132.
  • the ultraviolet curable resin is cured while flowing into the cavity 132, so that the actual wall surface 136 of the cavity 132 becomes a tapered surface that inclines toward the inside of the cavity 132 as it goes downward.
  • the wall surface of the cavity 132 that faces the corner portion of the side surface of the electronic component 96 is generally at a right angle, like the corner portion of the electronic component 96.
  • the wall surface of the cavity 132 (hereinafter referred to as a corner-corresponding wall surface) facing the corner portion of the cavity is arcuate. The corner-corresponding side faces enter the cavity 132.
  • the electronic component 96 can be mounted on the substrate 70 inside the cavity 132 without interfering with the wall surface 136 of the cavity 132.
  • the formation area of the cavity becomes large, and a compact circuit cannot be formed. Therefore, in the circuit forming apparatus 10, the flow of the ultraviolet curable resin into the cavity 132 during the formation of the resin laminate 130 is suppressed, and the entry of the corner-corresponding wall surface into the cavity 132 is suppressed.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 in a thin film shape.
  • the inkjet head 88 discharges the ultraviolet curable resin 150 with a predetermined width, for example, a width of 50 to 100 ⁇ m so as to surround a generally rectangular portion of the upper surface of the substrate 70. That is, the ultraviolet curable resin 150 is generally discharged in a frame shape. The ultraviolet curable resin 150 is discharged so that the corners of the frame shape protrude in an arc shape toward the outside.
  • the ultraviolet curable resin 150 is discharged in a generally frame shape, the ultraviolet curable resin 150 is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin 150 becomes uniform in the curing unit 86. .
  • the irradiation device 92 irradiates the frame-shaped ultraviolet curable resin 150 with ultraviolet rays. As a result, a frame-shaped resin layer 133 is formed on the substrate 70.
  • the inkjet head 88 discharges the ultraviolet curable resin 150 in a thin film shape only on the portion above the frame-shaped resin layer 133.
  • the ultraviolet curable resin 150 is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin 150 discharged into the frame shape with ultraviolet rays, so that the frame is formed on the frame-shaped resin layer 133.
  • a resin layer 133 having a shape is laminated.
  • the discharge of the ultraviolet curable resin 150 onto the frame-shaped resin layer 133 surrounding the generally rectangular portion of the upper surface of the substrate 70 and the irradiation with ultraviolet rays are repeated, so that a plurality of frame-shaped resin layers 133 are formed.
  • a first wall 160 surrounding the cavity 132 is formed. Note that the height dimension of the first wall portion 160 is about half of the height dimension of the electronic component 96 to be mounted inside the cavity 132.
  • the wall surface 162 of the cavity 132 is a tapered surface that inclines toward the inside of the cavity 132 as it goes downward due to the flow of the ultraviolet curable resin 150 into the cavity 132 when the first wall 160 is formed. .
  • the ultraviolet curable resin 150 is discharged in a frame shape, so that the ultraviolet curable resin 150 is discharged over the entire surface other than the cavity 132 as shown in FIG. Therefore, the discharge amount of the ultraviolet curable resin 150 is very small.
  • the inclination angle of the wall surface 162 of the cavity 132 is large.
  • the inclination angle of the wall surface 136 of the cavity 132 formed by the conventional method is about 40 degrees, but the cavity formed by this method is shown in FIG.
  • the inclination angle of the wall surface 162 of 132 is about 80 degrees.
  • the ultraviolet curable resin 150 is discharged so that the corners of the frame shape protrude in an arc shape toward the outside. For this reason, even if the ultraviolet curable resin 150 discharged so as to protrude outward in an arc shape flows into the cavity 132, the protrusion amount into the cavity 132 is suppressed. As a result, as shown in FIG. 7, the corner-corresponding wall surface of the cavity 132 formed by the conventional method has entered greatly toward the inside of the cavity 132, but is formed by this method as shown in FIG. 10. The corner-corresponding wall surface of the cavity 132 hardly enters the cavity 132.
  • the first main body 170 is formed on the upper surface of the substrate 70 so as to surround the first wall 160 as shown in FIG.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the board
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 excluding the first wall 160 and the cavity 132.
  • the resin layer 133 is formed on the upper surface of the substrate 70 so as to surround the first wall portion 160 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays.
  • the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion of the resin layer 133 surrounding the first wall portion 160.
  • the resin layer 133 is laminated on the resin layer 133 surrounding the first wall portion 160 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays.
  • the discharge of the ultraviolet curable resin 150 onto the resin layer 133 surrounding the first wall 160 and the irradiation with the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, whereby the first A first main body portion 170 is formed so as to surround the wall portion 160.
  • the ultraviolet curable resin is discharged so as to surround the first wall portion 160, so that the first wall portion 160 cures the ultraviolet rays to the inside of the cavity 132. Inflow of resin is prevented.
  • the height of the first main body 170 is the same as the height of the first wall 160.
  • the inkjet head 88 discharges the ultraviolet curable resin onto the upper surface of the first wall portion 160 in the same frame shape as when the first wall portion 160 is formed. That is, the inkjet head 88 discharges the ultraviolet curable resin 150 having the shape shown in FIG. 8 on the upper surface of the first wall portion 160.
  • the discharge position of the ultraviolet curable resin at the time of forming the second wall portion 172 is a position away from the cavity 132 by a predetermined distance ⁇ from the discharge position of the ultraviolet curable resin at the time of forming the first wall portion 160. Yes.
  • the inkjet head 88 has a frame shape of the ultraviolet curable resin not only on the upper surface of the first wall portion 160 but also on the upper surface of the edge portion of the first main body portion 170 continuous with the first wall portion 160. Discharge. Then, the upper surface of the first wall portion 160 and the upper surface of the edge portion of the first main body portion 170 continuous with the first wall portion 160 are obtained by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays. In addition, a frame-shaped resin layer 133 is formed.
  • the predetermined distance ⁇ is set so that the inner edge of the upper surface of the first wall portion 160 and the inner edge of the resin layer 133 formed on the wall portion 160 coincide with each other in the vertical direction.
  • the resin layer 133 that defines the cavity 132 is formed on the first wall 160 that defines the cavity 132, and is continuous from the wall 160.
  • the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape only on the upper portion of the frame-shaped resin layer 133 formed on the first wall portion 160.
  • the frame-shaped resin layer 133 is laminated on the frame-shaped resin layer 133 by flattening the ultraviolet-curable resin and irradiating the ultraviolet-curable resin with ultraviolet rays. In this manner, the discharge of the ultraviolet curable resin 150 and the irradiation of the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, so that the second wall portion 172 is formed on the first wall portion 160.
  • the discharge position of the ultraviolet curable resin when the second wall portion 172 is formed is a predetermined distance ⁇ from the cavity 132 from the discharge position of the ultraviolet curable resin when the first wall portion 160 is formed. It is considered as a remote location. For this reason, the second wall portion 172 is formed at a position shifted from the cavity 132 by a predetermined distance ⁇ from the first wall portion 160.
  • the inclination angle of the wall surface of the second wall portion 172 is substantially the same as the inclination angle of the wall surface of the first wall portion 160 that defines the cavity 132.
  • the height dimension of the second wall portion 172 includes the height dimension from the upper surface of the substrate 70 to the upper surface of the second wall portion 172, and the height dimension of the electronic component 96 to be mounted inside the cavity 132. Are set to match. That is, the total dimension of the height dimension of the second wall part 172 and the height dimension of the first wall part 160 is the same as the height dimension of the electronic component 96 to be mounted inside the cavity 132. ing.
  • a second main body portion 176 is formed on the upper surface of the first main body portion 170 so as to surround the second wall portion 172, as shown in FIG. Is done.
  • the inkjet head 88 discharges the ultraviolet curable resin onto the upper surface of the first main body 170 in a thin film shape.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the first main body 170 excluding the second wall 172 and the cavity 132.
  • the resin layer 133 is formed on the upper surface of the first main body 170 so as to surround the second wall 172 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays.
  • the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape only on the portion above the resin layer 133 surrounding the second wall portion 172. Then, the resin layer 133 is laminated on the resin layer 133 surrounding the second wall portion 172 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays. As described above, the discharge of the ultraviolet curable resin 150 onto the resin layer 133 surrounding the second wall portion 172 and the irradiation with the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, whereby the second A second main body 176 is formed so as to surround the wall 172.
  • the second wall portion. 172 prevents the UV curable resin from flowing into the cavity 132.
  • the height dimension of the second main body 176 is the same as the height dimension of the second wall 172.
  • the first wall 160 is formed on the substrate 70, and the first main body 170 surrounding the first wall 160 is formed.
  • a second wall portion 172 is formed on the first wall portion 160, and a second main body portion 176 surrounding the second wall portion 172 is formed.
  • the resin laminate 180 having the cavity 132 is formed on the substrate 70. That is, the resin laminate 180 is formed by the first wall portion 160, the first main body portion 170, the second wall portion 172, and the second main body portion 176.
  • the stage 52 is moved below the mounting unit 26. Then, the electronic component 96 is held by the mounting head 112, and the electronic component 96 is placed inside the cavity 132 of the resin laminate 180. Subsequently, when the electronic component 96 is placed inside the cavity 132, as shown in FIG. 14, a resin laminate 190 is formed in a gap other than where the electronic component 96 is placed in the cavity 132.
  • the formation method of the resin laminated body 190 is the same as the 1st wall part 160, the 1st main-body part 170 grade
  • the height dimension of the resin laminate 190 is substantially the same as the height dimension of the resin laminate 180.
  • the stage 52 is moved below the first modeling unit 22. And in the 1st printing part 72, the inkjet head 76 discharges a metal ink linearly according to a circuit pattern. At this time, the metal ink is ejected linearly so as to connect the electrode 200 of the electronic component 96 and the other electrode (not shown). Subsequently, in the firing unit 74, the ejected metal ink is irradiated with a laser by the laser irradiation device 78, so that the metal ink is fired, and as shown in FIG. A wiring 202 connecting the electrodes is formed. Thereby, a circuit in which the electronic component 96 is mounted on the substrate 70 is formed.
  • the flow of the ultraviolet curable resin into the cavity 132 is suppressed when the resin laminate 180 is formed. Further, the ultraviolet curable resin 150 is discharged so that the wall surface of the cavity 132 facing the corner portion of the side surface of the electronic component 96 to be placed, that is, the corner corresponding wall surface protrudes in an arc shape toward the outside. For this reason, in the resin laminate 180, the inclination angle of the wall surface of the cavity 132 is increased, and in particular, the corner-corresponding wall surface of the cavity 132 hardly enters the inside of the cavity 132. As a result, the electronic component 96 can be appropriately placed in the cavity 132 without causing interference between the wall surface of the cavity 132 and the electronic component 96.
  • the second wall 172 and the second main body 176 are formed after the first wall 160 and the first main body 170 are formed. This is to prevent interference between the inkjet head 88 that discharges the ultraviolet curable resin and the discharged ultraviolet curable resin.
  • the distance between the tip of the discharge nozzle and the planned discharge position is 1 mm or less in order to appropriately discharge the ultraviolet curable resin to the planned discharge location.
  • the ink jet head 88 approaches the expected discharge position. For this reason, for example, when the height dimension of the electronic component 96 scheduled to be placed in the cavity 132 exceeds 1 mm, the height dimension of the wall portion defining the cavity 132 exceeds 1 mm.
  • the inkjet head 88 and the wall portion interfere with each other when the main body portion is formed. Therefore, as described above, the first wall portion 160 and the first main body portion 170 of 1 mm or less are formed, and the first wall portion 160 and the first main body portion 170 are formed on the first wall portion 160 and the first main body portion 170. Two wall portions 172 and a second body portion 176 are formed. Accordingly, it is possible to form a wall portion having a height dimension exceeding 1 mm without causing the inkjet head 88 and the wall portion to interfere with each other.
  • the resin laminate 180 having the cavity 132 is shaped according to the dimensions of the electronic component 96 mounted in the cavity 132. That is, when the dimension of the electronic component 96 at the time of mounting is large, a large cavity 132 is formed in the left-right direction, and when the dimension of the electronic component 96 at the time of mounting is small, it is small in the left-right direction. A cavity 132 is formed. In addition, the cavity 132 having a depth corresponding to the vertical dimension, that is, the height dimension of the electronic component 96 at the time of mounting is formed.
  • the horizontal dimension of the cavity 132 is set according to the horizontal dimension of the electronic component 96, and the vertical dimension of the cavity 132 is set to the height dimension of the electronic component 96.
  • the wall surface of the cavity 132 is a tapered surface. The larger the vertical dimension of the cavity 132, the smaller the bottom surface of the cavity 132. The smaller the vertical dimension of the cavity 132, the larger the bottom surface of the cavity 132. Become. That is, when the horizontal dimension of the cavity 132 is set considering only the horizontal dimension of the electronic component 96, the electronic component 96 may not be mounted in the cavity 132. Therefore, in the circuit forming apparatus 10, the horizontal dimension of the cavity 132 is set in consideration of not only the horizontal dimension of the electronic component 96 but also the vertical dimension of the electronic component 96.
  • the horizontal dimension of the cavity 132 is determined according to the shape of the ultraviolet curable resin discharged when the resin layer 133 of the resin laminate 180 is formed, that is, the discharge pattern of the ultraviolet curable resin. For this reason, the discharge pattern of the ultraviolet curable resin is set so that the location of the cavity 132 is larger than the dimensions of the left and right methods of the electronic component 96. At this time, the discharge pattern of the ultraviolet curable resin is set so that the portion that becomes the cavity 132 becomes larger as the height dimension of the electronic component 96 is larger.
  • FIG. 16 includes an ultraviolet curable resin discharge pattern of each of the electronic component 96a, the electronic component 96b, and the electronic component 96c, and a cavity 132 in which each of the electronic component 96a, the electronic component 96b, and the electronic component 96c is mounted.
  • a plan view and a cross-sectional view of the resin laminate 180 are shown.
  • the electronic components 96a, 96b, and 96c have the same horizontal dimension, but the height of the electronic component 96b is larger than the height of the electronic component 96a, and the height of the electronic component 96c is equal to the electronic component 96c. It is larger than the height dimension of 96b.
  • the black coating portion 210 indicates a portion where the ultraviolet curable resin is discharged
  • the white portion 212 indicates a portion where the ultraviolet curable resin is not discharged, that is, the cavity 132.
  • the part which becomes is shown.
  • the reason why the white portion 212 has a shape that is recessed in an arc shape toward the black coating portion 210 has been described above, and is omitted.
  • the first wall 160, the first main body 170, the second wall 172, and the second main body 176 are distinguished from each other. .
  • the first wall portion 160, the first main body portion 170, the second wall portion 172, and the second main body portion 176 are integrally formed with the resin laminate 180. Will be described.
  • the white portion 212 is made larger than the discharge pattern of the ultraviolet curable resin corresponding to the electronic component 96a.
  • the white portion 212 is made larger than the discharge pattern of the ultraviolet curable resin corresponding to the electronic component 96b. That is, the discharge pattern of the ultraviolet curable resin is set so that the portion that becomes the cavity 132 becomes larger as the height dimension of the electronic component 96 is larger.
  • the wall surface of the cavity 132 is a tapered surface that is inclined toward the inside of the cavity 132 as it goes downward, the size of the bottom surface of the cavity 132 for mounting each of the electronic components 96a, 96b, and 96c. It is almost the same.
  • each of the electronic components 96a, 96b, and 96c having different height dimensions is appropriately disposed inside the cavity 132. It becomes possible to attach to.
  • the controller 120 of the control device 27 includes a first wall portion forming portion 220, a first body portion forming portion 222, a second wall portion forming portion 224, and a second body portion forming portion. 226.
  • the first wall part forming part 220 is a functional part for forming the first wall part 160.
  • the first main body forming part 222 is a functional part for forming the first main body 170.
  • the second wall part forming part 224 is a functional part for forming the second wall part 172.
  • the second main body forming unit 226 is a functional unit for forming the second main body 176.
  • the circuit forming apparatus 10 is an example of a circuit forming apparatus.
  • the control device 27 is an example of a control device.
  • the inkjet head 88 is an example of a discharge device.
  • the electronic component 96 is an example of a component.
  • the cavity 132 is an example of a cavity.
  • the resin layer 133 is an example of a resin layer.
  • the resin laminate 180 is an example of a resin laminate.
  • the first wall portion 160 is an example of a first wall portion.
  • the first main body 170 is an example of a first main body.
  • the second wall portion 172 is an example of a second wall portion.
  • the second main body 176 is an example of a second main body.
  • the process performed by the 1st wall part formation part 220 is an example of a 1st wall part formation process.
  • the process executed by the first body part forming unit 222 is an example of a first body part forming process.
  • the process executed by the second wall part forming part 224 is an example of a second wall part forming process.
  • the process executed by the second body part forming unit 226 is an example of a second body part forming process.
  • the whitened portion 212 in the discharge pattern of the ultraviolet curable resin, has a concave shape in an arc shape toward the blackened portion 210, but is shown in FIG. 17.
  • the white portion 232 may be recessed in a triangular shape toward the black coating portion 230. That is, when the ultraviolet curable resin is discharged so that the side surface corresponding to the corner is recessed in the direction away from the cavity 132 when the resin laminate 180 is formed, the recessed shape is an arc shape or a triangular shape.
  • various shapes can be used.
  • the resin laminated body 180 is the 1st laminated part comprised by the 1st wall part 160 and the 1st main body part 170, the 2nd wall part 172, and the 2nd main body. And a second layered portion formed by the portion 176.
  • the third wall portion and the third main body portion may be formed on the second wall portion 172 and the second main body portion 176, and the resin laminate may be formed of three or more laminated portions. Good.
  • Circuit forming device 27 Control device 88: Inkjet head (discharge device) 96: Electronic component (component) 132: Cavity 133: Resin layer 180: Resin laminate 160: First wall 170: First main body 172: Second wall portion 176: Second body portion 220: First wall portion forming portion (first wall portion forming step) 222: First body portion forming portion (first body portion forming step) 224: Second Wall part forming part (second wall part forming process) 226: Second body part forming part (second body part forming process)

Abstract

Disclosed is a circuit forming method wherein, at the time of forming a resin laminated body by laminating a plurality of resin layers formed by curing a curable resin ejected in a thin film shape, said resin laminated body having a cavity for housing a component, the resin laminated body is formed by ejecting the curable resin such that cavity wall surfaces facing the corner portions of the component are in a state of being recessed in the direction away from the corner portions of the component.

Description

回路形成方法、および回路形成装置Circuit forming method and circuit forming apparatus
　本発明は、薄膜状に吐出された硬化性樹脂を硬化させた樹脂層を、複数、積層することで、部品を収容するためのキャビティを有する樹脂積層体を形成する回路形成方法、および回路形成装置に関する。 The present invention relates to a circuit forming method for forming a resin laminate having a cavity for housing a component by laminating a plurality of resin layers obtained by curing a curable resin discharged in a thin film shape, and circuit formation Relates to the device.
　近年、下記特許文献に記載されているように、薄膜状に吐出された硬化性樹脂を硬化させた樹脂層を、複数、積層することで、部品を収容するためのキャビティを有する樹脂積層体を形成し、回路を形成する技術が開発されている。 In recent years, as described in the following patent document, a resin laminate having a cavity for housing a component by laminating a plurality of resin layers obtained by curing a curable resin discharged in a thin film shape. Techniques for forming and forming circuits have been developed.
特開２００２－０９３９８９号公報Japanese Patent Laid-Open No. 2002-093989
　部品を適切に収容することが可能なキャビティの形成を課題とする。 と す る The goal is to form a cavity that can properly accommodate parts.
　上記課題を解決するために、本明細書は、薄膜状に吐出された硬化性樹脂を硬化させた樹脂層を、複数、積層することで、部品を収容するためのキャビティを有する樹脂積層体を形成する際に、前記部品の角部と対向する前記キャビティの壁面が、前記部品の角部から離れる方向に凹んだ状態となるように硬化性樹脂を吐出することで、前記樹脂積層体を形成する回路形成方法を開示する。 In order to solve the above-described problems, the present specification provides a resin laminate having a cavity for housing a component by laminating a plurality of resin layers obtained by curing a curable resin discharged in a thin film shape. When forming, the resin laminate is formed by discharging the curable resin so that the wall surface of the cavity facing the corner of the component is recessed in a direction away from the corner of the component. A circuit forming method is disclosed.
　また、上記課題を解決するために、本明細書は、硬化性樹脂を吐出する吐出装置と、前記吐出装置により薄膜状に吐出された硬化性樹脂を硬化させた樹脂層を、複数、積層することで、部品を収容するためのキャビティを有する樹脂積層体を形成する際に、前記部品の角部と対向する前記キャビティの壁面が、前記部品の角部から離れる方向に凹んだ状態となるように硬化性樹脂を吐出するように、前記吐出装置の作動を制御する制御装置とを備えた回路形成装置を開示する。 Further, in order to solve the above-described problem, the present specification laminates a discharge device that discharges a curable resin and a plurality of resin layers obtained by curing the curable resin discharged in a thin film by the discharge device. Thus, when forming a resin laminate having a cavity for accommodating a component, the wall surface of the cavity facing the corner of the component is recessed in a direction away from the corner of the component. A circuit forming apparatus including a control device for controlling the operation of the discharging device so as to discharge the curable resin is disclosed.
　本開示によれば、部品の角部と対向するキャビティの壁面の形状を適切化することで、部品を適切に収容することが可能なキャビティを形成することが可能となる。 According to the present disclosure, it is possible to form a cavity capable of properly accommodating a component by optimizing the shape of the wall surface of the cavity facing the corner of the component.
回路形成装置を示す図である。It is a figure which shows a circuit formation apparatus. 制御装置を示すブロック図である。It is a block diagram which shows a control apparatus. 理想的な樹脂積層体を示す断面図である。It is sectional drawing which shows an ideal resin laminated body. 理想的な樹脂積層体のキャビティ内部に電子部品が装着された状態の回路を示す断面図である。It is sectional drawing which shows the circuit of the state by which the electronic component was mounted | worn inside the cavity of an ideal resin laminated body. 理想的な樹脂積層体のキャビティ内部に電子部品が装着された状態の回路を示す平面図である。It is a top view which shows the circuit of the state by which the electronic component was mounted | worn inside the cavity of an ideal resin laminated body. 従来の樹脂積層体のキャビティ内部に電子部品が装着された状態の回路を示す断面図である。It is sectional drawing which shows the circuit of the state by which the electronic component was mounted | worn inside the cavity of the conventional resin laminated body. 従来の樹脂積層体のキャビティ内部に電子部品が装着された状態の回路を示す平面図である。It is a top view which shows the circuit of the state by which the electronic component was mounted | worn inside the cavity of the conventional resin laminated body. 第１の壁部の形成時に吐出された紫外線硬化樹脂を示す平面図である。It is a top view which shows the ultraviolet curable resin discharged at the time of formation of a 1st wall part. 第１の壁部を示す断面図である。It is sectional drawing which shows a 1st wall part. 第１の壁部を示す平面図である。It is a top view which shows a 1st wall part. 第１の壁部、および第１本体部を示す断面図である。It is sectional drawing which shows a 1st wall part and a 1st main-body part. 第１の壁部、第１本体部、および第２の壁部を示す断面図である。It is sectional drawing which shows a 1st wall part, a 1st main-body part, and a 2nd wall part. 第１の壁部、第１本体部、第２の壁部、および第２の本体部を示す断面図である。It is sectional drawing which shows a 1st wall part, a 1st main-body part, a 2nd wall part, and a 2nd main-body part. 図１３の樹脂積層体のキャビティ内部に電子部品が装着された状態の回路を示す断面図である。It is sectional drawing which shows the circuit of the state by which the electronic component was mounted | worn inside the cavity of the resin laminated body of FIG. 配線が形成された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state in which wiring was formed. 紫外線硬化樹脂の吐出パターンと、キャビティ内部に電子部品が装着された状態の断面図および平面図とを示す図である。It is a figure which shows the discharge pattern of an ultraviolet curable resin, and sectional drawing and a top view of the state by which the electronic component was mounted | worn inside the cavity. 変形例の紫外線硬化樹脂の吐出パターンを示す図である。It is a figure which shows the discharge pattern of the ultraviolet curable resin of a modification.
　（Ａ）回路形成装置の構成
　図１に回路形成装置１０を示す。回路形成装置１０は、搬送装置２０と、第１造形ユニット２２と、第２造形ユニット２４と、装着ユニット２６と、制御装置（図２参照）２７を備える。それら搬送装置２０と第１造形ユニット２２と第２造形ユニット２４と装着ユニット２６とは、回路形成装置１０のベース２８の上に配置されている。ベース２８は、概して長方形状をなしており、以下の説明では、ベース２８の長手方向をＸ軸方向、ベース２８の短手方向をＹ軸方向、Ｘ軸方向及びＹ軸方向の両方に直交する方向をＺ軸方向と称して説明する。 (A) Configuration of Circuit Forming Device FIG. 1 shows a circuit forming device 10. The circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see FIG. 2) 27. The conveying device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are disposed on the base 28 of the circuit forming device 10. The base 28 has a generally rectangular shape. In the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.
　搬送装置２０は、Ｘ軸スライド機構３０と、Ｙ軸スライド機構３２とを備えている。そのＸ軸スライド機構３０は、Ｘ軸スライドレール３４とＸ軸スライダ３６とを有している。Ｘ軸スライドレール３４は、Ｘ軸方向に延びるように、ベース２８の上に配設されている。Ｘ軸スライダ３６は、Ｘ軸スライドレール３４によって、Ｘ軸方向にスライド可能に保持されている。さらに、Ｘ軸スライド機構３０は、電磁モータ（図２参照）３８を有しており、電磁モータ３８の駆動により、Ｘ軸スライダ３６がＸ軸方向の任意の位置に移動する。また、Ｙ軸スライド機構３２は、Ｙ軸スライドレール５０とステージ５２とを有している。Ｙ軸スライドレール５０は、Ｙ軸方向に延びるように、ベース２８の上に配設されており、Ｘ軸方向に移動可能とされている。そして、Ｙ軸スライドレール５０の一端部が、Ｘ軸スライダ３６に連結されている。そのＹ軸スライドレール５０には、ステージ５２が、Ｙ軸方向にスライド可能に保持されている。さらに、Ｙ軸スライド機構３２は、電磁モータ（図２参照）５６を有しており、電磁モータ５６の駆動により、ステージ５２がＹ軸方向の任意の位置に移動する。これにより、ステージ５２は、Ｘ軸スライド機構３０及びＹ軸スライド機構３２の駆動により、ベース２８上の任意の位置に移動する。 The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. The Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
　ステージ５２は、基台６０と、保持装置６２と、昇降装置６４とを有している。基台６０は、平板状に形成され、上面に基板が載置される。保持装置６２は、基台６０のＸ軸方向の両側部に設けられている。そして、基台６０に載置された基板のＸ軸方向の両縁部が、保持装置６２によって挟まれることで、基板が固定的に保持される。また、昇降装置６４は、基台６０の下方に配設されており、基台６０を昇降させる。 The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. The both edges in the X-axis direction of the substrate placed on the base 60 are sandwiched between the holding devices 62, so that the substrate is fixedly held. The lifting device 64 is disposed below the base 60 and lifts the base 60.
　第１造形ユニット２２は、ステージ５２の基台６０に載置された基板（図３参照）７０の上に配線を造形するユニットであり、第１印刷部７２と、焼成部７４とを有している。第１印刷部７２は、インクジェットヘッド（図２参照）７６を有しており、基台６０に載置された基板７０の上に、金属インクを線状に吐出する。金属インクは、金属の微粒子が溶剤中に分散されたものである。なお、インクジェットヘッド７６は、例えば、圧電素子を用いたピエゾ方式によって複数のノズルから導電性材料を吐出する。 The first modeling unit 22 is a unit that models wiring on a substrate (see FIG. 3) 70 placed on the base 60 of the stage 52, and includes a first printing unit 72 and a firing unit 74. ing. The first printing unit 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink in a linear manner onto the substrate 70 placed on the base 60. The metal ink is obtained by dispersing metal fine particles in a solvent. The inkjet head 76 discharges a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
　焼成部７４は、レーザ照射装置（図２参照）７８を有している。レーザ照射装置７８は、基板７０の上に吐出された金属インクにレーザを照射する装置であり、レーザが照射された金属インクは焼成し、配線が形成される。なお、金属インクの焼成とは、エネルギーを付与することによって、溶媒の気化や金属微粒子保護膜の分解等が行われ、金属微粒子が接触または融着をすることで、導電率が高くなる現象である。そして、金属インクが焼成することで、金属製の配線が形成される。 The firing unit 74 has a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device that irradiates a metal ink discharged onto the substrate 70 with a laser, and the metal ink irradiated with the laser is baked to form a wiring. The firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there. And metal wiring is formed by baking metal ink.
　また、第２造形ユニット２４は、ステージ５２の基台６０に載置された基板７０の上に樹脂層を造形するユニットであり、第２印刷部８４と、硬化部８６とを有している。第２印刷部８４は、インクジェットヘッド（図２参照）８８を有しており、基台６０に載置された基板７０の上に紫外線硬化樹脂を吐出する。なお、インクジェットヘッド８８は、例えば、圧電素子を用いたピエゾ方式でもよく、樹脂を加熱して気泡を発生させノズルから吐出するサーマル方式でもよい。 The second modeling unit 24 is a unit that models a resin layer on the substrate 70 placed on the base 60 of the stage 52, and includes a second printing unit 84 and a curing unit 86. . The second printing unit 84 has an inkjet head (see FIG. 2) 88 and discharges an ultraviolet curable resin onto the substrate 70 placed on the base 60. The ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.
　硬化部８６は、平坦化装置（図２参照）９０と照射装置（図２参照）９２とを有している。平坦化装置９０は、インクジェットヘッド８８によって基板７０の上に吐出された紫外線硬化樹脂の上面を平坦化するものであり、例えば、紫外線硬化樹脂の表面を均しながら余剰分の樹脂を、ローラもしくはブレードによって掻き取ることで、紫外線硬化樹脂の厚みを均一させる。また、照射装置９２は、光源として水銀ランプもしくはＬＥＤを備えており、基板７０の上に吐出された紫外線硬化樹脂に紫外線を照射する。これにより、基板７０の上に吐出された紫外線硬化樹脂が硬化し、樹脂層が造形される。 The curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 is for flattening the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the inkjet head 88. By scraping with a blade, the thickness of the UV curable resin is made uniform. The irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the ultraviolet curable resin discharged onto the substrate 70 with ultraviolet rays. Thereby, the ultraviolet curable resin discharged on the board | substrate 70 hardens | cures, and a resin layer is modeled.
　また、装着ユニット２６は、ステージ５２の基台６０に載置された基板７０の上に電子部品（図４参照）９６を装着するユニットであり、供給部１００と、装着部１０２とを有している。供給部１００は、テーピング化された電子部品９６を１つずつ送り出すテープフィーダ（図２参照）１１０を複数有しており、供給位置において、電子部品９６を供給する。なお、供給部１００は、テープフィーダ１１０に限らず、トレイから電子部品９６をピックアップして供給するトレイ型の供給装置でもよい。また、供給部１００は、テープ型とトレイ型との両方、あるいはそれ以外の供給装置を備えた構成でもよい。 The mounting unit 26 is a unit that mounts an electronic component (see FIG. 4) 96 on a substrate 70 placed on the base 60 of the stage 52, and includes a supply unit 100 and a mounting unit 102. ing. The supply unit 100 includes a plurality of tape feeders 110 (see FIG. 2) that send out the taped electronic components 96 one by one, and supplies the electronic components 96 at the supply position. The supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies the electronic component 96 from the tray. The supply unit 100 may be configured to include both a tape type and a tray type, or other supply devices.
　装着部１０２は、装着ヘッド（図２参照）１１２と、移動装置（図２参照）１１４とを有している。装着ヘッド１１２は、電子部品９６を吸着保持するための吸着ノズル（図４参照）１１８を有する。吸着ノズル１１８は、正負圧供給装置（図示省略）から負圧が供給されることで、エアの吸引により電子部品９６を吸着保持する。そして、正負圧供給装置から僅かな正圧が供給されることで、電子部品９６を離脱する。また、移動装置１１４は、テープフィーダ１１０による電子部品９６の供給位置と、基台６０に載置された基板７０との間で、装着ヘッド１１２を移動させる。これにより、装着部１０２では、テープフィーダ１１０から供給された電子部品９６が、吸着ノズル１１８により保持され、その吸着ノズル１１８によって保持された電子部品９６が、基板７０に装着される。 The mounting unit 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114. The mounting head 112 has a suction nozzle (see FIG. 4) 118 for holding the electronic component 96 by suction. The suction nozzle 118 sucks and holds the electronic component 96 by sucking air when negative pressure is supplied from a positive / negative pressure supply device (not shown). Then, the electronic component 96 is detached by supplying a slight positive pressure from the positive / negative pressure supply device. The moving device 114 moves the mounting head 112 between the supply position of the electronic component 96 by the tape feeder 110 and the substrate 70 placed on the base 60. Thereby, in the mounting unit 102, the electronic component 96 supplied from the tape feeder 110 is held by the suction nozzle 118, and the electronic component 96 held by the suction nozzle 118 is mounted on the substrate 70.
　また、制御装置２７は、図２に示すように、コントローラ１２０と、複数の駆動回路１２２とを備えている。複数の駆動回路１２２は、上記電磁モータ３８，５６、保持装置６２、昇降装置６４、インクジェットヘッド７６、レーザ照射装置７８、インクジェットヘッド８８、平坦化装置９０、照射装置９２、テープフィーダ１１０、装着ヘッド１１２、移動装置１１４に接続されている。コントローラ１２０は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１２２に接続されている。これにより、搬送装置２０、第１造形ユニット２２、第２造形ユニット２４、装着ユニット２６の作動が、コントローラ１２０によって制御される。 The control device 27 includes a controller 120 and a plurality of drive circuits 122 as shown in FIG. The plurality of drive circuits 122 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the tape feeder 110, and the mounting head. 112, connected to the moving device 114. The controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 122. Thereby, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 120.
　（Ｂ）回路形成装置の作動
　回路形成装置１０では、上述した構成によって、基板７０上に電子部品９６が装着されることで、回路が形成される。具体的には、ステージ５２の基台６０に基板７０がセットされ、そのステージ５２が、第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４において、図３に示すように、基板７０の上に樹脂積層体１３０が形成される。樹脂積層体１３０は、電子部品９６を装着するためのキャビティ１３２を有しており、インクジェットヘッド８８からの紫外線硬化樹脂の吐出と、吐出された紫外線硬化樹脂への照射装置９２による紫外線の照射とが繰り返されることにより形成される。 (B) Operation of Circuit Forming Device In the circuit forming device 10, a circuit is formed by mounting the electronic component 96 on the substrate 70 with the above-described configuration. Specifically, the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. And in the 2nd modeling unit 24, as shown in FIG. 3, the resin laminated body 130 is formed on the board | substrate 70. As shown in FIG. The resin laminate 130 has a cavity 132 for mounting the electronic component 96, and discharge of the ultraviolet curable resin from the inkjet head 88 and irradiation of ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin. Is formed by repeating.
　詳しくは、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、基板７０の上面に紫外線硬化樹脂を薄膜状に吐出する。この際、インクジェットヘッド８８は、基板７０の上面の所定の部分が概して矩形に露出するように、紫外線硬化樹脂を吐出する。続いて、紫外線硬化樹脂が薄膜状に吐出されると、硬化部８６において、紫外線硬化樹脂の膜厚が均一となるように、紫外線硬化樹脂が平坦化装置９０によって平坦化される。そして、照射装置９２が、その薄膜状の紫外線硬化樹脂に紫外線を照射する。これにより、基板７０の上に薄膜状の樹脂層１３３が形成される。 Specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 in a thin film shape. At this time, the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. Thereby, a thin resin layer 133 is formed on the substrate 70.
　続いて、インクジェットヘッド８８が、その薄膜状の樹脂層１３３の上の部分にのみ紫外線硬化樹脂を薄膜状に吐出する。つまり、インクジェットヘッド８８は、基板７０の上面の所定の部分が概して矩形に露出するように、薄膜状の樹脂層１３３の上に紫外線硬化樹脂を薄膜状に吐出する。そして、平坦化装置９０によって薄膜状の紫外線硬化樹脂が平坦化され、照射装置９２が、その薄膜状に吐出された紫外線硬化樹脂に紫外線を照射することで、薄膜状の樹脂層１３３の上に薄膜状の樹脂層１３３が積層される。このように、基板７０の上面の概して矩形の部分を除いた薄膜状の樹脂層１３３の上への紫外線硬化樹脂の吐出と、紫外線の照射とが繰り返され、複数の樹脂層１３３が積層されることで、キャビティ１３２を有する樹脂積層体１３０が形成される。 Subsequently, the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion above the thin resin layer 133. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape onto the thin resin layer 133 so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 133 is formed on the thin film resin layer 133. A thin resin layer 133 is laminated. Thus, the discharge of the ultraviolet curable resin onto the thin resin layer 133 excluding the generally rectangular portion on the upper surface of the substrate 70 and the irradiation with the ultraviolet rays are repeated, and a plurality of resin layers 133 are laminated. Thereby, the resin laminate 130 having the cavity 132 is formed.
　上述した手順により樹脂積層体１３０が形成されると、ステージ５２が装着ユニット２６の下方に移動される。装着ユニット２６では、テープフィーダ１１０により電子部品９６が供給され、その電子部品９６が装着ヘッド１１２の吸着ノズル１１８によって、保持される。そして、装着ヘッド１１２が、移動装置１１４によって移動され、吸着ノズル１１８により保持された電子部品９６が、図４及び図５に示すように、樹脂積層体１３０のキャビティ１３２の内部に載置される。なお、樹脂積層体１３０の高さ寸法と、電子部品９６の高さ寸法とは略同じとされている。 When the resin laminate 130 is formed by the procedure described above, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the electronic component 96 is supplied by the tape feeder 110, and the electronic component 96 is held by the suction nozzle 118 of the mounting head 112. Then, the mounting head 112 is moved by the moving device 114, and the electronic component 96 held by the suction nozzle 118 is placed inside the cavity 132 of the resin laminate 130 as shown in FIGS. . Note that the height dimension of the resin laminate 130 and the height dimension of the electronic component 96 are substantially the same.
　このように、回路形成装置１０では、電子部品９６が樹脂積層体１３０のキャビティ１３２の内部に装着される。しかしながら、図３乃至図５に示した樹脂積層体１３０のキャビティ１３２は、理想の形状であり、実際の樹脂積層体１３０のキャビティ１３２は、図６及び図７に示すように、概してお椀形状となる。つまり、理想形状のキャビティ１３２の壁面１３６は、図４に示すように、基板７０に対して直角となる。一方、実際の樹脂積層体１３０のキャビティ１３２の壁面１３６は、図６に示すように、下に向かうほどキャビティ１３２の内部に向かって傾斜するテーパ面となる。 Thus, in the circuit forming apparatus 10, the electronic component 96 is mounted inside the cavity 132 of the resin laminate 130. However, the cavity 132 of the resin laminate 130 shown in FIGS. 3 to 5 has an ideal shape, and the cavity 132 of the actual resin laminate 130 is generally shaped like a bowl as shown in FIGS. 6 and 7. Become. That is, the wall surface 136 of the ideally shaped cavity 132 is perpendicular to the substrate 70 as shown in FIG. On the other hand, the wall surface 136 of the cavity 132 of the actual resin laminate 130 becomes a tapered surface that inclines toward the inside of the cavity 132 as it goes downward, as shown in FIG.
　詳しくは、樹脂積層体１３０の形成時に、樹脂層１３３の上に紫外線硬化樹脂が吐出された際に、吐出された紫外線硬化樹脂がキャビティ１３２の内部に流れ込む。そして、キャビティ１３２に流れ込んだ状態で紫外線硬化樹脂が硬化することで、実際のキャビティ１３２の壁面１３６は、下に向かうほどキャビティ１３２の内部に向かって傾斜するテーパ面となる。 Specifically, when the ultraviolet curable resin is discharged onto the resin layer 133 during the formation of the resin laminate 130, the discharged ultraviolet curable resin flows into the cavity 132. The ultraviolet curable resin is cured while flowing into the cavity 132, so that the actual wall surface 136 of the cavity 132 becomes a tapered surface that inclines toward the inside of the cavity 132 as it goes downward.
　また、理想形状の樹脂積層体１３０では、図５に示すように、電子部品９６の側面の角部に向かい合うキャビティ１３２の壁面は、電子部品９６の角部と同様に、概して直角とされている。しかしながら、樹脂積層体１３０の形成時の紫外線硬化樹脂のキャビティ１３２への流れ込みと、紫外線硬化樹脂の表面張力等によって、実際の樹脂積層体１３０では、図７に示すように、電子部品９６の側面の角部に向かい合うキャビティ１３２の壁面（以下、角部対応壁面）が、円弧状になっている。そして、角部対応側面が、キャビティ１３２の内部に向かって入り込んでいる。 Further, in the ideal-shaped resin laminate 130, as shown in FIG. 5, the wall surface of the cavity 132 that faces the corner portion of the side surface of the electronic component 96 is generally at a right angle, like the corner portion of the electronic component 96. . However, due to the flow of the ultraviolet curable resin into the cavity 132 at the time of forming the resin laminated body 130, the surface tension of the ultraviolet curable resin, and the like, in the actual resin laminated body 130, as shown in FIG. The wall surface of the cavity 132 (hereinafter referred to as a corner-corresponding wall surface) facing the corner portion of the cavity is arcuate. The corner-corresponding side faces enter the cavity 132.
　このように、キャビティ１３２の壁面１３６が、下に向かうほどキャビティ１３２の内部に向かって傾斜するテーパ面となり、角部対応壁面がキャビティ１３２の内部に向かって入り込んでいると、図６及び図７に示すように、電子部品９６とキャビティ１３２の壁面とが干渉する虞がある。このため、電子部品９６を適切に基板７０に装着することができない虞がある。 As described above, when the wall surface 136 of the cavity 132 becomes a tapered surface that is inclined toward the inside of the cavity 132 as it goes downward, and the corner-corresponding wall surface enters the inside of the cavity 132, FIG. 6 and FIG. As shown in FIG. 6, there is a possibility that the electronic component 96 and the wall surface of the cavity 132 interfere with each other. For this reason, there is a possibility that the electronic component 96 cannot be properly mounted on the substrate 70.
　そこで、大きなキャビティ１３２を形成すれば、キャビティ１３２の内部において、電子部品９６をキャビティ１３２の壁面１３６と干渉させることなく、基板７０に装着することが可能となる。しかしながら、大きなキャビティ１３２を形成した場合には、キャビティの形成領域が大きくなり、コンパクトな回路を形成することができない。そこで、回路形成装置１０では、樹脂積層体１３０の形成時の紫外線硬化樹脂のキャビティ１３２への流れ込みが抑制され、角部対応壁面のキャビティ１３２の内部への入り込みが抑制されている。 Therefore, if the large cavity 132 is formed, the electronic component 96 can be mounted on the substrate 70 inside the cavity 132 without interfering with the wall surface 136 of the cavity 132. However, when the large cavity 132 is formed, the formation area of the cavity becomes large, and a compact circuit cannot be formed. Therefore, in the circuit forming apparatus 10, the flow of the ultraviolet curable resin into the cavity 132 during the formation of the resin laminate 130 is suppressed, and the entry of the corner-corresponding wall surface into the cavity 132 is suppressed.
　詳しくは、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、基板７０の上面に紫外線硬化樹脂を薄膜状に吐出する。この際、インクジェットヘッド８８は、図８に示すように、基板７０の上面の概して矩形の部分を囲むように、所定の幅、例えば、５０～１００μｍの幅で紫外線硬化樹脂１５０を吐出する。つまり、紫外線硬化樹脂１５０が概して枠形状に吐出される。なお、枠形状の角部が外側に向かって円弧状に突出するように、紫外線硬化樹脂１５０は吐出される。続いて、紫外線硬化樹脂１５０が概して枠形状に吐出されると、硬化部８６において、紫外線硬化樹脂１５０の膜厚が均一となるように、紫外線硬化樹脂１５０が平坦化装置９０によって平坦化される。そして、照射装置９２が、その枠形状の紫外線硬化樹脂１５０に紫外線を照射する。これにより、基板７０の上に枠形状の樹脂層１３３が形成される。 Specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 in a thin film shape. At this time, as shown in FIG. 8, the inkjet head 88 discharges the ultraviolet curable resin 150 with a predetermined width, for example, a width of 50 to 100 μm so as to surround a generally rectangular portion of the upper surface of the substrate 70. That is, the ultraviolet curable resin 150 is generally discharged in a frame shape. The ultraviolet curable resin 150 is discharged so that the corners of the frame shape protrude in an arc shape toward the outside. Subsequently, when the ultraviolet curable resin 150 is discharged in a generally frame shape, the ultraviolet curable resin 150 is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin 150 becomes uniform in the curing unit 86. . The irradiation device 92 irradiates the frame-shaped ultraviolet curable resin 150 with ultraviolet rays. As a result, a frame-shaped resin layer 133 is formed on the substrate 70.
　続いて、インクジェットヘッド８８が、その枠形状の樹脂層１３３の上の部分にのみ紫外線硬化樹脂１５０を薄膜状に吐出する。そして、平坦化装置９０によって紫外線硬化樹脂１５０が平坦化され、照射装置９２が、その枠形状に吐出された紫外線硬化樹脂１５０に紫外線を照射することで、枠形状の樹脂層１３３の上に枠形状の樹脂層１３３が積層される。このように、基板７０の上面の概して矩形の部分を囲む枠形状の樹脂層１３３の上への紫外線硬化樹脂１５０の吐出と、紫外線の照射とが繰り返され、複数の枠形状の樹脂層１３３が積層されることで、図９及び図１０に示すように、キャビティ１３２を囲む第１の壁部１６０が形成される。なお、第１の壁部１６０の高さ寸法は、キャビティ１３２の内部に装着予定の電子部品９６の高さ寸法の半分程度とされている。 Subsequently, the inkjet head 88 discharges the ultraviolet curable resin 150 in a thin film shape only on the portion above the frame-shaped resin layer 133. Then, the ultraviolet curable resin 150 is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin 150 discharged into the frame shape with ultraviolet rays, so that the frame is formed on the frame-shaped resin layer 133. A resin layer 133 having a shape is laminated. In this manner, the discharge of the ultraviolet curable resin 150 onto the frame-shaped resin layer 133 surrounding the generally rectangular portion of the upper surface of the substrate 70 and the irradiation with ultraviolet rays are repeated, so that a plurality of frame-shaped resin layers 133 are formed. By laminating, as shown in FIGS. 9 and 10, a first wall 160 surrounding the cavity 132 is formed. Note that the height dimension of the first wall portion 160 is about half of the height dimension of the electronic component 96 to be mounted inside the cavity 132.
　なお、キャビティ１３２の壁面１６２は、第１の壁部１６０の形成時の紫外線硬化樹脂１５０のキャビティ１３２への流れ込みによって、下に向かうほどキャビティ１３２の内部に向かって傾斜するテーパ面となっている。しかしながら、第１の壁部１６０の形成時には、紫外線硬化樹脂１５０は枠形状に吐出されるため、図６に示すように、キャビティ１３２以外の全面に紫外線硬化樹脂１５０が吐出される場合と比較して、紫外線硬化樹脂１５０の吐出量は非常に少ない。このため、第１の壁部１６０の形成時に、キャビティ１３２の内部に流れ込む紫外線硬化樹脂１５０の量は非常に少なくなり、キャビティ１３２の壁面１６２の傾斜角度は大きくなる。具体的には、図６に示すように、従来の手法により形成されたキャビティ１３２の壁面１３６の傾斜角度は、４０度程度となるが、図９に示すように、本手法により形成されたキャビティ１３２の壁面１６２の傾斜角度は、８０度程度となる。 The wall surface 162 of the cavity 132 is a tapered surface that inclines toward the inside of the cavity 132 as it goes downward due to the flow of the ultraviolet curable resin 150 into the cavity 132 when the first wall 160 is formed. . However, when the first wall portion 160 is formed, the ultraviolet curable resin 150 is discharged in a frame shape, so that the ultraviolet curable resin 150 is discharged over the entire surface other than the cavity 132 as shown in FIG. Therefore, the discharge amount of the ultraviolet curable resin 150 is very small. For this reason, when the first wall portion 160 is formed, the amount of the ultraviolet curable resin 150 flowing into the cavity 132 is very small, and the inclination angle of the wall surface 162 of the cavity 132 is large. Specifically, as shown in FIG. 6, the inclination angle of the wall surface 136 of the cavity 132 formed by the conventional method is about 40 degrees, but the cavity formed by this method is shown in FIG. The inclination angle of the wall surface 162 of 132 is about 80 degrees.
　また、第１の壁部１６０の形成時には、枠形状の角部が外側に向かって円弧状に突出するように、紫外線硬化樹脂１５０が吐出される。このため、外側に向かって円弧状に突出するように吐出された紫外線硬化樹脂１５０が、キャビティ１３２の内部に流れ込んでも、キャビティ１３２の内部への突出量は抑制される。これにより、図７に示すように、従来の手法により形成されたキャビティ１３２の角部対応壁面は、キャビティ１３２の内部に向かって大きく入り込んでいるが、図１０に示すように、本手法により形成されたキャビティ１３２の角部対応壁面は、キャビティ１３２の内部に向かって殆ど入り込んでいない。 Also, when the first wall 160 is formed, the ultraviolet curable resin 150 is discharged so that the corners of the frame shape protrude in an arc shape toward the outside. For this reason, even if the ultraviolet curable resin 150 discharged so as to protrude outward in an arc shape flows into the cavity 132, the protrusion amount into the cavity 132 is suppressed. As a result, as shown in FIG. 7, the corner-corresponding wall surface of the cavity 132 formed by the conventional method has entered greatly toward the inside of the cavity 132, but is formed by this method as shown in FIG. 10. The corner-corresponding wall surface of the cavity 132 hardly enters the cavity 132.
　このようにして第１の壁部１６０が形成されると、図１１に示すように、第１の壁部１６０を囲むように、基板７０の上面に第１の本体部１７０が形成される。詳しくは、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、基板７０の上面に紫外線硬化樹脂を薄膜状に吐出する。この際、インクジェットヘッド８８は、第１の壁部１６０及びキャビティ１３２を除く、基板７０の上面に紫外線硬化樹脂を吐出する。そして、紫外線硬化樹脂の平坦化及び、紫外線硬化樹脂への紫外線の照射により、第１の壁部１６０を囲むように、基板７０の上面に樹脂層１３３が形成される。 When the first wall 160 is formed in this way, the first main body 170 is formed on the upper surface of the substrate 70 so as to surround the first wall 160 as shown in FIG. In detail, in the 2nd printing part 84 of the 2nd modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the board | substrate 70 in thin film form. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 excluding the first wall 160 and the cavity 132. Then, the resin layer 133 is formed on the upper surface of the substrate 70 so as to surround the first wall portion 160 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays.
　続いて、インクジェットヘッド８８が、第１の壁部１６０を囲む樹脂層１３３の上の部分にのみ紫外線硬化樹脂を薄膜状に吐出する。そして、紫外線硬化樹脂の平坦化及び、紫外線硬化樹脂への紫外線の照射により、第１の壁部１６０を囲む樹脂層１３３の上に樹脂層１３３が積層される。このように、第１の壁部１６０を囲む樹脂層１３３の上への紫外線硬化樹脂１５０の吐出と、紫外線の照射とが繰り返され、複数の樹脂層１３３が積層されることで、第１の壁部１６０を囲むように、第１の本体部１７０が形成される。 Subsequently, the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion of the resin layer 133 surrounding the first wall portion 160. Then, the resin layer 133 is laminated on the resin layer 133 surrounding the first wall portion 160 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays. As described above, the discharge of the ultraviolet curable resin 150 onto the resin layer 133 surrounding the first wall 160 and the irradiation with the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, whereby the first A first main body portion 170 is formed so as to surround the wall portion 160.
　このように、第１の本体部１７０の形成時には、第１の壁部１６０を囲むように、紫外線硬化樹脂が吐出されるため、第１の壁部１６０によって、キャビティ１３２の内部への紫外線硬化樹脂の流れ込みが防止される。なお、第１の本体部１７０の高さ寸法は、第１の壁部１６０の高さ寸法と同じとされている。 As described above, when the first main body portion 170 is formed, the ultraviolet curable resin is discharged so as to surround the first wall portion 160, so that the first wall portion 160 cures the ultraviolet rays to the inside of the cavity 132. Inflow of resin is prevented. The height of the first main body 170 is the same as the height of the first wall 160.
　続いて、第１の本体部１７０が形成されると、図１２に示すように、第１の壁部１６０の上に第２の壁部１７２が形成される。詳しくは、インクジェットヘッド８８が、第１の壁部１６０の上面に、第１の壁部１６０の形成時と同様の枠形状に、紫外線硬化樹脂を吐出する。つまり、インクジェットヘッド８８が、第１の壁部１６０の上面に、図８に示す形状の紫外線硬化樹脂１５０を吐出する。 Subsequently, when the first main body 170 is formed, the second wall 172 is formed on the first wall 160 as shown in FIG. Specifically, the inkjet head 88 discharges the ultraviolet curable resin onto the upper surface of the first wall portion 160 in the same frame shape as when the first wall portion 160 is formed. That is, the inkjet head 88 discharges the ultraviolet curable resin 150 having the shape shown in FIG. 8 on the upper surface of the first wall portion 160.
　ただし、第２の壁部１７２の形成時における紫外線硬化樹脂の吐出位置は、第１の壁部１６０の形成時における紫外線硬化樹脂の吐出位置よりキャビティ１３２から所定の距離α離れた位置とされている。このため、インクジェットヘッド８８は、第１の壁部１６０の上面だけでなく、第１の壁部１６０に連続する第１の本体部１７０の縁部の上面にも、紫外線硬化樹脂を枠形状に吐出する。そして、紫外線硬化樹脂の平坦化及び、紫外線硬化樹脂への紫外線の照射により、第１の壁部１６０の上面及び、第１の壁部１６０に連続する第１の本体部１７０の縁部の上面に、枠形状の樹脂層１３３が形成される。 However, the discharge position of the ultraviolet curable resin at the time of forming the second wall portion 172 is a position away from the cavity 132 by a predetermined distance α from the discharge position of the ultraviolet curable resin at the time of forming the first wall portion 160. Yes. For this reason, the inkjet head 88 has a frame shape of the ultraviolet curable resin not only on the upper surface of the first wall portion 160 but also on the upper surface of the edge portion of the first main body portion 170 continuous with the first wall portion 160. Discharge. Then, the upper surface of the first wall portion 160 and the upper surface of the edge portion of the first main body portion 170 continuous with the first wall portion 160 are obtained by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays. In addition, a frame-shaped resin layer 133 is formed.
　なお、所定の距離αは、第１の壁部１６０の上面の内縁と、その壁部１６０の上に形成される樹脂層１３３の内縁とが、上下方向において一致するように設定されている。これにより、キャビティ１３２を区画する第１の壁部１６０の上に、その壁部１６０から連続し、キャビティ１３２を区画する樹脂層１３３が形成される。 The predetermined distance α is set so that the inner edge of the upper surface of the first wall portion 160 and the inner edge of the resin layer 133 formed on the wall portion 160 coincide with each other in the vertical direction. As a result, the resin layer 133 that defines the cavity 132 is formed on the first wall 160 that defines the cavity 132, and is continuous from the wall 160.
　続いて、インクジェットヘッド８８が、第１の壁部１６０の上に形成された枠形状の樹脂層１３３の上の部分にのみ紫外線硬化樹脂を薄膜状に吐出する。そして、紫外線硬化樹脂の平坦化及び、紫外線硬化樹脂への紫外線の照射により、枠形状の樹脂層１３３の上に枠形状の樹脂層１３３が積層される。このように、紫外線硬化樹脂１５０の吐出と、紫外線の照射とが繰り返され、複数の樹脂層１３３が積層されることで、第１の壁部１６０の上に第２の壁部１７２が形成される。 Subsequently, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape only on the upper portion of the frame-shaped resin layer 133 formed on the first wall portion 160. The frame-shaped resin layer 133 is laminated on the frame-shaped resin layer 133 by flattening the ultraviolet-curable resin and irradiating the ultraviolet-curable resin with ultraviolet rays. In this manner, the discharge of the ultraviolet curable resin 150 and the irradiation of the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, so that the second wall portion 172 is formed on the first wall portion 160. The
　なお、第２の壁部１７２の形成時の紫外線硬化樹脂の吐出位置は、上述したように、第１の壁部１６０の形成時の紫外線硬化樹脂の吐出位置よりキャビティ１３２から所定の距離α、離れた位置とされている。このため、第２の壁部１７２は、第１の壁部１６０よりキャビティ１３２から所定の距離α、ズレた箇所に形成される。 As described above, the discharge position of the ultraviolet curable resin when the second wall portion 172 is formed is a predetermined distance α from the cavity 132 from the discharge position of the ultraviolet curable resin when the first wall portion 160 is formed. It is considered as a remote location. For this reason, the second wall portion 172 is formed at a position shifted from the cavity 132 by a predetermined distance α from the first wall portion 160.
　また、第２の壁部１７２の形成時においても、第１の壁部１６０の形成時と同様に、キャビティ１３２の内部への紫外線硬化樹脂の流れ込みが抑制されるため、キャビティ１３２を区画する第２の壁部１７２の壁面の傾斜角度は、キャビティ１３２を区画する第１の壁部１６０の壁面の傾斜角度と略同じとなる。なお、第２の壁部１７２の高さ寸法は、基板７０の上面から第２の壁部１７２の上面までの高さ寸法と、キャビティ１３２の内部に装着予定の電子部品９６の高さ寸法とが一致するように設定されている。つまり、第２の壁部１７２の高さ寸法と第１の壁部１６０の高さ寸法とを合計した寸法と、キャビティ１３２の内部に装着予定の電子部品９６の高さ寸法とは同じとされている。 Also, when the second wall portion 172 is formed, similarly to the formation of the first wall portion 160, the flow of the ultraviolet curable resin into the cavity 132 is suppressed. The inclination angle of the wall surface of the second wall portion 172 is substantially the same as the inclination angle of the wall surface of the first wall portion 160 that defines the cavity 132. The height dimension of the second wall portion 172 includes the height dimension from the upper surface of the substrate 70 to the upper surface of the second wall portion 172, and the height dimension of the electronic component 96 to be mounted inside the cavity 132. Are set to match. That is, the total dimension of the height dimension of the second wall part 172 and the height dimension of the first wall part 160 is the same as the height dimension of the electronic component 96 to be mounted inside the cavity 132. ing.
　次に、第２の壁部１７２が形成されると、図１３に示すように、第２の壁部１７２を囲むように、第１の本体部１７０の上面に第２の本体部１７６が形成される。詳しくは、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、第１の本体部１７０の上面に紫外線硬化樹脂を薄膜状に吐出する。この際、インクジェットヘッド８８は、第２の壁部１７２及びキャビティ１３２を除く、第１の本体部１７０の上面に紫外線硬化樹脂を吐出する。そして、紫外線硬化樹脂の平坦化及び、紫外線硬化樹脂への紫外線の照射により、第２の壁部１７２を囲むように、第１の本体部１７０の上面に樹脂層１３３が形成される。 Next, when the second wall portion 172 is formed, a second main body portion 176 is formed on the upper surface of the first main body portion 170 so as to surround the second wall portion 172, as shown in FIG. Is done. Specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 discharges the ultraviolet curable resin onto the upper surface of the first main body 170 in a thin film shape. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the first main body 170 excluding the second wall 172 and the cavity 132. Then, the resin layer 133 is formed on the upper surface of the first main body 170 so as to surround the second wall 172 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays.
　続いて、インクジェットヘッド８８が、第２の壁部１７２を囲む樹脂層１３３の上の部分にのみ紫外線硬化樹脂を薄膜状に吐出する。そして、紫外線硬化樹脂の平坦化及び、紫外線硬化樹脂への紫外線の照射により、第２の壁部１７２を囲む樹脂層１３３の上に樹脂層１３３が積層される。このように、第２の壁部１７２を囲む樹脂層１３３の上への紫外線硬化樹脂１５０の吐出と、紫外線の照射とが繰り返され、複数の樹脂層１３３が積層されることで、第２の壁部１７２を囲むように、第２の本体部１７６が形成される。 Subsequently, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape only on the portion above the resin layer 133 surrounding the second wall portion 172. Then, the resin layer 133 is laminated on the resin layer 133 surrounding the second wall portion 172 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays. As described above, the discharge of the ultraviolet curable resin 150 onto the resin layer 133 surrounding the second wall portion 172 and the irradiation with the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, whereby the second A second main body 176 is formed so as to surround the wall 172.
　第２の本体部１７６の形成時においても、第１の本体部１７０の形成時と同様に、第２の壁部１７２を囲むように、紫外線硬化樹脂が吐出されるため、第２の壁部１７２によって、キャビティ１３２の内部への紫外線硬化樹脂の流れ込みが防止される。なお、第２の本体部１７６の高さ寸法は、第２の壁部１７２の高さ寸法と同じとされている。 Since the ultraviolet curable resin is discharged so as to surround the second wall portion 172 at the time of forming the second main body portion 176 as well as at the time of forming the first main body portion 170, the second wall portion. 172 prevents the UV curable resin from flowing into the cavity 132. The height dimension of the second main body 176 is the same as the height dimension of the second wall 172.
　このように、回路形成装置１０では、基板７０の上に、第１の壁部１６０が形成され、その第１の壁部１６０を囲む第１の本体部１７０が形成される。そして、第１の壁部１６０の上に、第２の壁部１７２が形成され、その第２の壁部１７２を囲む第２の本体部１７６が形成される。これにより、基板７０の上に、キャビティ１３２を有する樹脂積層体１８０が形成される。つまり、第１の壁部１６０と、第１の本体部１７０と、第２の壁部１７２と、第２の本体部１７６とによって、樹脂積層体１８０が形成される。 As described above, in the circuit forming apparatus 10, the first wall 160 is formed on the substrate 70, and the first main body 170 surrounding the first wall 160 is formed. A second wall portion 172 is formed on the first wall portion 160, and a second main body portion 176 surrounding the second wall portion 172 is formed. Thereby, the resin laminate 180 having the cavity 132 is formed on the substrate 70. That is, the resin laminate 180 is formed by the first wall portion 160, the first main body portion 170, the second wall portion 172, and the second main body portion 176.
　次に、樹脂積層体１８０が形成されると、ステージ５２が装着ユニット２６の下方に移動される。そして、装着ヘッド１１２によって電子部品９６が保持され、その電子部品９６が、樹脂積層体１８０のキャビティ１３２の内部に載置される。続いて、電子部品９６がキャビティ１３２の内部に載置されると、図１４に示すように、キャビティ１３２の電子部品９６が載置されている個所以外の隙間に、樹脂積層体１９０が形成される。なお、樹脂積層体１９０の形成方法は、第１の壁部１６０，第１の本体部１７０等と同じであるため説明を省略する。また、樹脂積層体１９０の高さ寸法は、樹脂積層体１８０の高さ寸法と略同じとされている。 Next, when the resin laminate 180 is formed, the stage 52 is moved below the mounting unit 26. Then, the electronic component 96 is held by the mounting head 112, and the electronic component 96 is placed inside the cavity 132 of the resin laminate 180. Subsequently, when the electronic component 96 is placed inside the cavity 132, as shown in FIG. 14, a resin laminate 190 is formed in a gap other than where the electronic component 96 is placed in the cavity 132. The In addition, since the formation method of the resin laminated body 190 is the same as the 1st wall part 160, the 1st main-body part 170 grade | etc., Description is abbreviate | omitted. The height dimension of the resin laminate 190 is substantially the same as the height dimension of the resin laminate 180.
　続いて、樹脂積層体１９０が形成されると、第１造形ユニット２２の下方にステージ５２が移動される。そして、第１印刷部７２において、インクジェットヘッド７６が、金属インクを回路パターンに応じて線状に吐出する。この際、金属インクは、電子部品９６の電極２００と、他の電極（図示省略）とを繋ぐように、線状に吐出される。続いて、焼成部７４において、吐出された金属インクに、レーザ照射装置７８によってレーザが照射されることで、金属インクが焼成し、図１５に示すように、電子部品９６の電極２００と、他の電極とを繋ぐ配線２０２が形成される。これにより、基板７０に電子部品９６が装着された回路が形成される。 Subsequently, when the resin laminate 190 is formed, the stage 52 is moved below the first modeling unit 22. And in the 1st printing part 72, the inkjet head 76 discharges a metal ink linearly according to a circuit pattern. At this time, the metal ink is ejected linearly so as to connect the electrode 200 of the electronic component 96 and the other electrode (not shown). Subsequently, in the firing unit 74, the ejected metal ink is irradiated with a laser by the laser irradiation device 78, so that the metal ink is fired, and as shown in FIG. A wiring 202 connecting the electrodes is formed. Thereby, a circuit in which the electronic component 96 is mounted on the substrate 70 is formed.
　このように、回路形成装置１０では、樹脂積層体１８０の形成時において、キャビティ１３２の内部への紫外線硬化樹脂の流れ込みが抑制される。さらに、載置される電子部品９６の側面の角部に向かい合うキャビティ１３２の壁面、つまり、角部対応壁面が外側に向かって円弧状に突出するように、紫外線硬化樹脂１５０が吐出される。このため、樹脂積層体１８０では、キャビティ１３２の壁面の傾斜角度は大きくされており、特に、キャビティ１３２の角部対応壁面は、キャビティ１３２の内部に向かって殆ど入り込んでいない。これにより、キャビティ１３２の壁面と電子部品９６とを干渉させることなく、電子部品９６を適切にキャビティ１３２に載置することが可能となる。 Thus, in the circuit forming apparatus 10, the flow of the ultraviolet curable resin into the cavity 132 is suppressed when the resin laminate 180 is formed. Further, the ultraviolet curable resin 150 is discharged so that the wall surface of the cavity 132 facing the corner portion of the side surface of the electronic component 96 to be placed, that is, the corner corresponding wall surface protrudes in an arc shape toward the outside. For this reason, in the resin laminate 180, the inclination angle of the wall surface of the cavity 132 is increased, and in particular, the corner-corresponding wall surface of the cavity 132 hardly enters the inside of the cavity 132. As a result, the electronic component 96 can be appropriately placed in the cavity 132 without causing interference between the wall surface of the cavity 132 and the electronic component 96.
　また、樹脂積層体１８０の形成時には、第１の壁部１６０及び第１の本体部１７０が形成された後に、第２の壁部１７２及び第２の本体部１７６が形成されている。これは、紫外線硬化樹脂を吐出するインクジェットヘッド８８と、吐出された紫外線硬化樹脂との干渉を防止するためである。詳しくは、インクジェットヘッド８８が紫外線硬化樹脂を吐出する際には、吐出予定箇所に適切に紫外線硬化樹脂を吐出するべく、吐出ノズルの先端と吐出予定位置との間の距離が１ｍｍ以下となるまで、インクジェットヘッド８８が吐出予定位置に接近する。このため、例えば、キャビティ１３２への載置予定の電子部品９６の高さ寸法が、１ｍｍを超えている場合には、キャビティ１３２を区画する壁部の高さ寸法は、１ｍｍを超える。このような場合に、１ｍｍを超える高さの壁部を形成すると、本体部の形成時に、インクジェットヘッド８８と壁部とが干渉する。そこで、先に説明したように、１ｍｍ以下の第１の壁部１６０及び第１の本体部１７０を形成し、第１の壁部１６０及び第１の本体部１７０の上に、１ｍｍ以下の第２の壁部１７２及び第２の本体部１７６を形成する。これにより、インクジェットヘッド８８と壁部とを干渉させることなく、高さ寸法が１ｍｍを超える壁部を形成することが可能となる。 Further, when the resin laminate 180 is formed, the second wall 172 and the second main body 176 are formed after the first wall 160 and the first main body 170 are formed. This is to prevent interference between the inkjet head 88 that discharges the ultraviolet curable resin and the discharged ultraviolet curable resin. Specifically, when the inkjet head 88 discharges the ultraviolet curable resin, the distance between the tip of the discharge nozzle and the planned discharge position is 1 mm or less in order to appropriately discharge the ultraviolet curable resin to the planned discharge location. The ink jet head 88 approaches the expected discharge position. For this reason, for example, when the height dimension of the electronic component 96 scheduled to be placed in the cavity 132 exceeds 1 mm, the height dimension of the wall portion defining the cavity 132 exceeds 1 mm. In such a case, if a wall portion having a height exceeding 1 mm is formed, the inkjet head 88 and the wall portion interfere with each other when the main body portion is formed. Therefore, as described above, the first wall portion 160 and the first main body portion 170 of 1 mm or less are formed, and the first wall portion 160 and the first main body portion 170 are formed on the first wall portion 160 and the first main body portion 170. Two wall portions 172 and a second body portion 176 are formed. Accordingly, it is possible to form a wall portion having a height dimension exceeding 1 mm without causing the inkjet head 88 and the wall portion to interfere with each other.
　なお、キャビティ１３２を有する樹脂積層体１８０は、キャビティ１３２に装着される電子部品９６の寸法に応じた形状とされる。つまり、装着時の電子部品９６の左右方向の寸法が大きい場合には、左右方向に大きいキャビティ１３２が形成され、装着時の電子部品９６の左右方向の寸法が小さい場合には、左右方向に小さいキャビティ１３２が形成される。また、装着時の電子部品９６の上下方向の寸法、つまり、高さ寸法に応じた深さのキャビティ１３２が形成される。 Note that the resin laminate 180 having the cavity 132 is shaped according to the dimensions of the electronic component 96 mounted in the cavity 132. That is, when the dimension of the electronic component 96 at the time of mounting is large, a large cavity 132 is formed in the left-right direction, and when the dimension of the electronic component 96 at the time of mounting is small, it is small in the left-right direction. A cavity 132 is formed. In addition, the cavity 132 having a depth corresponding to the vertical dimension, that is, the height dimension of the electronic component 96 at the time of mounting is formed.
　このため、従来の手法では、キャビティ１３２の左右方向の寸法は、電子部品９６の左右方向の寸法に応じて設定され、キャビティ１３２の上下方向の寸法は、電子部品９６の高さ方向の寸法に応じて設定されていた。しかしながら、キャビティ１３２の壁面はテーパ面とされており、キャビティ１３２の上下方向の寸法が大きいほど、キャビティ１３２の底面は小さくなり、キャビティ１３２の上下方向の寸法が小さいほど、キャビティ１３２の底面は大きくなる。つまり、キャビティ１３２の左右方向の寸法を、電子部品９６の左右方向の寸法のみを考慮して設定した場合には、電子部品９６をキャビティ１３２に装着することができない場合がある。そこで、回路形成装置１０では、キャビティ１３２の左右方向の寸法が、電子部品９６の左右方向の寸法だけでなく、電子部品９６の上下方向の寸法も考慮して設定されている。 Therefore, in the conventional method, the horizontal dimension of the cavity 132 is set according to the horizontal dimension of the electronic component 96, and the vertical dimension of the cavity 132 is set to the height dimension of the electronic component 96. Was set accordingly. However, the wall surface of the cavity 132 is a tapered surface. The larger the vertical dimension of the cavity 132, the smaller the bottom surface of the cavity 132. The smaller the vertical dimension of the cavity 132, the larger the bottom surface of the cavity 132. Become. That is, when the horizontal dimension of the cavity 132 is set considering only the horizontal dimension of the electronic component 96, the electronic component 96 may not be mounted in the cavity 132. Therefore, in the circuit forming apparatus 10, the horizontal dimension of the cavity 132 is set in consideration of not only the horizontal dimension of the electronic component 96 but also the vertical dimension of the electronic component 96.
　詳しくは、キャビティ１３２の左右方向の寸法は、樹脂積層体１８０の樹脂層１３３の形成時に吐出される紫外線硬化樹脂の形状、つまり、紫外線硬化樹脂の吐出パターンに応じて決まる。このため、紫外線硬化樹脂の吐出パターンは、キャビティ１３２となる箇所が電子部品９６の左右方法の寸法より大きくなるように、設定される。この際、電子部品９６の高さ寸法が大きいほど、キャビティ１３２となる箇所が大きくなるように、紫外線硬化樹脂の吐出パターンが設定される。 Specifically, the horizontal dimension of the cavity 132 is determined according to the shape of the ultraviolet curable resin discharged when the resin layer 133 of the resin laminate 180 is formed, that is, the discharge pattern of the ultraviolet curable resin. For this reason, the discharge pattern of the ultraviolet curable resin is set so that the location of the cavity 132 is larger than the dimensions of the left and right methods of the electronic component 96. At this time, the discharge pattern of the ultraviolet curable resin is set so that the portion that becomes the cavity 132 becomes larger as the height dimension of the electronic component 96 is larger.
　具体的に、電子部品９６の左右方向の寸法が同じであるが、高さ寸法が異なっている場合について、図１６を用いて説明する。図１６には、電子部品９６ａと電子部品９６ｂと電子部品９６ｃとの各々の紫外線硬化樹脂の吐出パターンと、電子部品９６ａと電子部品９６ｂと電子部品９６ｃとの各々が装着されたキャビティ１３２を有する樹脂積層体１８０の平面図及び断面図が記されている。なお、電子部品９６ａ，９６ｂ、９６ｃの左右方向の寸法は同じであるが、電子部品９６ｂの高さ寸法は、電子部品９６ａの高さ寸法より大きく、電子部品９６ｃの高さ寸法は、電子部品９６ｂの高さ寸法より大きい。 Specifically, the case where the electronic component 96 has the same horizontal dimension but the different height will be described with reference to FIG. FIG. 16 includes an ultraviolet curable resin discharge pattern of each of the electronic component 96a, the electronic component 96b, and the electronic component 96c, and a cavity 132 in which each of the electronic component 96a, the electronic component 96b, and the electronic component 96c is mounted. A plan view and a cross-sectional view of the resin laminate 180 are shown. The electronic components 96a, 96b, and 96c have the same horizontal dimension, but the height of the electronic component 96b is larger than the height of the electronic component 96a, and the height of the electronic component 96c is equal to the electronic component 96c. It is larger than the height dimension of 96b.
　また、紫外線硬化樹脂の吐出パターンを示す図では、黒塗部２１０が、紫外線硬化樹脂が吐出される部分を示しており、白抜部２１２が、紫外線硬化樹脂が吐出されない部分、つまり、キャビティ１３２となる部分を示している。なお、白抜部２１２が黒塗部２１０に向かって円弧状に凹んだ形状とされている理由は、先に説明しているため、省略する。また、上記説明では、樹脂積層体１８０の形成手法において、第１の壁部１６０と第１の本体部１７０と第２の壁部１７２と第２の本体部１７６とが区別して説明されている。ただし、以下の説明では、説明を簡略化するべく、第１の壁部１６０と第１の本体部１７０と第２の壁部１７２と第２の本体部１７６とを一体的に樹脂積層体１８０として説明する。 In the drawing showing the discharge pattern of the ultraviolet curable resin, the black coating portion 210 indicates a portion where the ultraviolet curable resin is discharged, and the white portion 212 indicates a portion where the ultraviolet curable resin is not discharged, that is, the cavity 132. The part which becomes is shown. The reason why the white portion 212 has a shape that is recessed in an arc shape toward the black coating portion 210 has been described above, and is omitted. In the above description, in the method of forming the resin laminate 180, the first wall 160, the first main body 170, the second wall 172, and the second main body 176 are distinguished from each other. . However, in the following description, in order to simplify the description, the first wall portion 160, the first main body portion 170, the second wall portion 172, and the second main body portion 176 are integrally formed with the resin laminate 180. Will be described.
　図１６から解るように、電子部品９６ｂに対応する紫外線硬化樹脂の吐出パターンでは、電子部品９６ａに対応する紫外線硬化樹脂の吐出パターンと比較して、白抜部２１２が大きくされている。また、電子部品９６ｃに対応する紫外線硬化樹脂の吐出パターンでは、電子部品９６ｂに対応する紫外線硬化樹脂の吐出パターンと比較して、白抜部２１２が大きくされている。つまり、電子部品９６の高さ寸法が大きいほど、キャビティ１３２となる箇所が大きくなるように、紫外線硬化樹脂の吐出パターンが設定されている。 As can be seen from FIG. 16, in the discharge pattern of the ultraviolet curable resin corresponding to the electronic component 96b, the white portion 212 is made larger than the discharge pattern of the ultraviolet curable resin corresponding to the electronic component 96a. In the discharge pattern of the ultraviolet curable resin corresponding to the electronic component 96c, the white portion 212 is made larger than the discharge pattern of the ultraviolet curable resin corresponding to the electronic component 96b. That is, the discharge pattern of the ultraviolet curable resin is set so that the portion that becomes the cavity 132 becomes larger as the height dimension of the electronic component 96 is larger.
　このように、紫外線硬化樹脂の吐出パターンを設定することで、電子部品９６の高さ寸法が大きくなるほど、キャビティ１３２の開口が大きくなり、電子部品９６の上面の縁とキャビティ１３２の開口とのクリアランスは大きくなる。一方で、キャビティ１３２の壁面が、下方に向かうほどキャビティ１３２の内部に向かって傾斜するテーパ面とされているため、電子部品９６ａ，９６ｂ、９６ｃの各々を装着するためのキャビティ１３２の底面の大きさは、略同じとされている。これにより、キャビティ１３２の壁面が、下方に向かうほどキャビティ１３２の内部に向かって傾斜するテーパ面であっても、高さ寸法の異なる電子部品９６ａ，９６ｂ、９６ｃの各々を適切にキャビティ１３２の内部に装着することが可能となる。 As described above, by setting the discharge pattern of the ultraviolet curable resin, the larger the height dimension of the electronic component 96 is, the larger the opening of the cavity 132 is, and the clearance between the upper edge of the electronic component 96 and the opening of the cavity 132 is increased. Will grow. On the other hand, since the wall surface of the cavity 132 is a tapered surface that is inclined toward the inside of the cavity 132 as it goes downward, the size of the bottom surface of the cavity 132 for mounting each of the electronic components 96a, 96b, and 96c. It is almost the same. As a result, even if the wall surface of the cavity 132 is a tapered surface that inclines toward the inside of the cavity 132 as it goes downward, each of the electronic components 96a, 96b, and 96c having different height dimensions is appropriately disposed inside the cavity 132. It becomes possible to attach to.
　また、制御装置２７のコントローラ１２０は、図２に示すように、第１壁部形成部２２０と、第１本体部形成部２２２と、第２壁部形成部２２４と、第２本体部形成部２２６とを有している。第１壁部形成部２２０は、第１の壁部１６０を形成するための機能部である。第１本体部形成部２２２は、第１の本体部１７０を形成するための機能部である。第２壁部形成部２２４は、第２の壁部１７２を形成するための機能部である。第２本体部形成部２２６は、第２の本体部１７６を形成するための機能部である。 Further, as shown in FIG. 2, the controller 120 of the control device 27 includes a first wall portion forming portion 220, a first body portion forming portion 222, a second wall portion forming portion 224, and a second body portion forming portion. 226. The first wall part forming part 220 is a functional part for forming the first wall part 160. The first main body forming part 222 is a functional part for forming the first main body 170. The second wall part forming part 224 is a functional part for forming the second wall part 172. The second main body forming unit 226 is a functional unit for forming the second main body 176.
　ちなみに、上記実施例において、回路形成装置１０は、回路形成装置の一例である。制御装置２７は、制御装置の一例である。インクジェットヘッド８８は、吐出装置の一例である。電子部品９６は、部品の一例である。キャビティ１３２は、キャビティの一例である。樹脂層１３３は、樹脂層の一例である。樹脂積層体１８０は、樹脂積層体の一例である。第１の壁部１６０は、第１の壁部の一例である。第１の本体部１７０は、第１の本体部の一例である。第２の壁部１７２は、第２の壁部の一例である。第２の本体部１７６は、第２の本体部の一例である。また、第１壁部形成部２２０により実行される工程は、第１壁部形成工程の一例である。第１本体部形成部２２２により実行される工程は、第１本体部形成工程の一例である。第２壁部形成部２２４により実行される工程は、第２壁部形成工程の一例である。第２本体部形成部２２６により実行される工程は、第２本体部形成工程の一例である。 Incidentally, in the above embodiment, the circuit forming apparatus 10 is an example of a circuit forming apparatus. The control device 27 is an example of a control device. The inkjet head 88 is an example of a discharge device. The electronic component 96 is an example of a component. The cavity 132 is an example of a cavity. The resin layer 133 is an example of a resin layer. The resin laminate 180 is an example of a resin laminate. The first wall portion 160 is an example of a first wall portion. The first main body 170 is an example of a first main body. The second wall portion 172 is an example of a second wall portion. The second main body 176 is an example of a second main body. Moreover, the process performed by the 1st wall part formation part 220 is an example of a 1st wall part formation process. The process executed by the first body part forming unit 222 is an example of a first body part forming process. The process executed by the second wall part forming part 224 is an example of a second wall part forming process. The process executed by the second body part forming unit 226 is an example of a second body part forming process.
　なお、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。例えば、上記実施例では、図１６に示すように、紫外線硬化樹脂の吐出パターンにおいて、白抜部２１２が黒塗部２１０に向かって円弧形状に凹んだ形状とされているが、図１７に示すように、白抜部２３２が黒塗部２３０に向かって三角形状に凹んだ形状とされてもよい。つまり、樹脂積層体１８０の形成時に、角部対応側面がキャビティ１３２から離れる方向に凹んだ形状とされるように、紫外線硬化樹脂が吐出されれば、その凹んだ形状は、円弧形状，三角形状など、種々の形状とすることが可能である。 In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. For example, in the above-described embodiment, as shown in FIG. 16, in the discharge pattern of the ultraviolet curable resin, the whitened portion 212 has a concave shape in an arc shape toward the blackened portion 210, but is shown in FIG. 17. As described above, the white portion 232 may be recessed in a triangular shape toward the black coating portion 230. That is, when the ultraviolet curable resin is discharged so that the side surface corresponding to the corner is recessed in the direction away from the cavity 132 when the resin laminate 180 is formed, the recessed shape is an arc shape or a triangular shape. For example, various shapes can be used.
　また、上記実施例では、樹脂積層体１８０が、第１の壁部１６０と第１の本体部１７０とにより構成される１層目の積層部と、第２の壁部１７２と第２の本体部１７６とにより構成される２層目の積層部とにより形成されている。ただし、第２の壁部１７２及び第２の本体部１７６の上に、第３の壁部及び第３の本体部を形成し、樹脂積層体を、３層以上の積層部により形成してもよい。 Moreover, in the said Example, the resin laminated body 180 is the 1st laminated part comprised by the 1st wall part 160 and the 1st main body part 170, the 2nd wall part 172, and the 2nd main body. And a second layered portion formed by the portion 176. However, the third wall portion and the third main body portion may be formed on the second wall portion 172 and the second main body portion 176, and the resin laminate may be formed of three or more laminated portions. Good.
　１０：回路形成装置　　２７：制御装置　　８８：インクジェットヘッド（吐出装置）　　９６：電子部品（部品）　　１３２：キャビティ　　１３３：樹脂層　　１８０：樹脂積層体　　１６０：第１の壁部　　１７０：第１の本体部　　１７２：第２の壁部　　１７６：第２の本体部　　２２０：第１壁部形成部（第１壁部形成工程）　　２２２：第１本体部形成部（第１本体部形成工程）　　２２４：第２壁部形成部（第２壁部形成工程）　　２２６：第２本体部形成部（第２本体部形成工程） 10: Circuit forming device 27: Control device 88: Inkjet head (discharge device) 96: Electronic component (component) 132: Cavity 133: Resin layer 180: Resin laminate 160: First wall 170: First main body 172: Second wall portion 176: Second body portion 220: First wall portion forming portion (first wall portion forming step) 222: First body portion forming portion (first body portion forming step) 224: Second Wall part forming part (second wall part forming process) 226: Second body part forming part (second body part forming process)

Claims (7)

  1. 　薄膜状に吐出された硬化性樹脂を硬化させた樹脂層を、複数、積層することで、部品を収容するためのキャビティを有する樹脂積層体を形成する際に、前記部品の角部と対向する前記キャビティの壁面が、前記部品の角部から離れる方向に凹んだ状態となるように硬化性樹脂を吐出することで、前記樹脂積層体を形成する回路形成方法。 When a resin laminate having a cavity for housing a component is formed by laminating a plurality of resin layers obtained by curing a curable resin discharged in a thin film shape, it faces the corner of the component. A circuit forming method for forming the resin laminate by discharging a curable resin so that a wall surface of the cavity is recessed in a direction away from a corner of the component.
  2. 　前記部品の高さ寸法が大きいほど、前記キャビティの開口を大きく形成する請求項１に記載の回路形成方法。 2. The circuit forming method according to claim 1, wherein the cavity opening is formed larger as the height dimension of the component is larger.
  3. 　前記部品の高さ寸法が大きいほど、前記部品の上面の縁と前記キャビティの開口とのクリアランスが大きくなるように、前記樹脂積層体を形成する請求項１に記載の回路形成方法。 2. The circuit forming method according to claim 1, wherein the resin laminate is formed such that a clearance between an edge of an upper surface of the component and the opening of the cavity increases as a height dimension of the component increases.
  4. 　前記キャビティを区画する第１の壁部を形成する第１壁部形成工程と、
    　前記第１壁部形成工程において形成された前記第１の壁部を囲むように、前記樹脂積層体の第１の本体部を形成する第１本体部形成工程と
    　を含む請求項１ないし請求項３のいずれか１つに記載の回路形成方法。     A first wall portion forming step of forming a first wall portion defining the cavity;
    The 1st main-body-part formation process which forms the 1st main-body part of the said resin laminated body so that the said 1st wall part formed in the said 1st wall-part formation process may be enclosed. 4. The circuit forming method according to any one of 3 above.
  5. 　前記第１の壁部の上に、前記キャビティを区画する第２の壁部を形成する第２壁部形成工程と、
    　前記第２壁部形成工程において形成された前記第２の壁部を囲むように、前記第１の本体部の上に、前記樹脂積層体の第２の本体部を形成する第２本体部形成工程と
    　を含む請求項４に記載の回路形成方法。     A second wall forming step of forming a second wall defining the cavity on the first wall;
    Second body part formation for forming a second body part of the resin laminate on the first body part so as to surround the second wall part formed in the second wall part forming step The circuit formation method of Claim 4 including the process.
  6. 　前記第２の壁部が、前記第１の壁部の形成位置より前記キャビティから離れる方向にズレた箇所に形成された請求項５に記載の回路形成方法。 6. The circuit forming method according to claim 5, wherein the second wall portion is formed at a location shifted in a direction away from the cavity from a position where the first wall portion is formed.
  7. 　硬化性樹脂を吐出する吐出装置と、
    　前記吐出装置により薄膜状に吐出された硬化性樹脂を硬化させた樹脂層を、複数、積層することで、部品を収容するためのキャビティを有する樹脂積層体を形成する際に、前記部品の角部と対向する前記キャビティの壁面が、前記部品の角部から離れる方向に凹んだ状態となるように硬化性樹脂を吐出するように、前記吐出装置の作動を制御する制御装置と
    　を備えた回路形成装置。     A discharge device for discharging a curable resin;
    When forming a resin laminate having a cavity for housing a component by laminating a plurality of resin layers obtained by curing the curable resin ejected in a thin film by the ejection device, the corners of the component And a control device that controls the operation of the discharge device so that the curable resin is discharged so that the wall surface of the cavity facing the portion is recessed in a direction away from the corner of the component. Forming equipment.
PCT/JP2017/002241 2017-01-24 2017-01-24 Circuit forming method and circuit forming device WO2018138755A1 (en)

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