TWM583041U - Vapor chamber - Google Patents

Abstract

A vapor chamber includes an upper plate and a lower plate. The lower plate is attached to the upper plate, and a working space is sandwiched between the lower plate and the upper plate. The lower plate can be in thermal contact with a heat source. At least one of the upper plate and the lower plate forms a reinforcing layer on the side away from the working space.

Description

Temperature plate

This creation is a heat dissipation device, especially a temperature-averaged plate composed of an upper plate or a lower plate with a reinforced layer.

The heat dissipation device of the temperature equalizing plate, especially the thin type temperature equalizing plate, is prone to deformation, especially after the temperature equalizing plate is attached to the heat source during the assembly operation. The structural strength, at the same time, will not hinder the normal operation of the temperature equalizing plate, which has always been a problem that the industry needs to solve.

The technical problem to be solved in this creation is to provide a temperature equalizing plate with the strengthening layer on the upper or lower plate in order to ensure the normal operation of the temperature equalizing plate while improving its structural strength and reliable use. Sex.

The technical solution adopted by this author to solve its technical problems is to provide a temperature equalizing plate, including an upper plate and a lower plate. The lower board is attached to the upper board, and a working space is interposed with the upper board, and the lower board can be in thermal contact with a heat source. At least one of the upper plate and the lower plate forms a strengthening layer on the side away from the working space.

Preferably, the reinforcement layer is superior to the upper or lower plate in terms of metal strength, and is inferior to the upper or lower plate in thermal conductivity.

Preferably, the standard for measuring the strength of the metal is selected from one of the following indicators: Vickers hardness Degree, tensile strength and elastic coefficient.

Preferably, the criterion for measuring thermal conductivity is the thermal conductivity coefficient.

Preferably, the main material constituting the strengthening layer is selected from one of the following: nickel, stainless steel and titanium.

Preferably, the reinforcement layer has corrosion resistance.

Preferably, the upper plate forms a first capillary structure on the side facing the action space, the lower plate forms a second capillary structure on the side facing the action space, and between the first capillary structure and the second capillary structure is formed There is at least one support structure.

Preferably, the temperature equalizing plate further includes a heat conduction block disposed between the lower plate and the heat source. The main material of the heat conduction block is pure copper.

Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the upper plate.

Preferably, the lower plate has a boss structure, and the boss structure is in thermal contact with the heat source.

Preferably, when the lower plate forms a strengthening layer on the side away from the working space, the strengthening layer is formed between the boss structure and the heat source.

Preferably, when the lower plate forms a reinforcement layer on the side away from the working space, the reinforcement layer forms an open space at the boss structure to reveal the boss structure.

Preferably, the temperature equalizing plate further includes a heat conduction block disposed between the boss structure and the heat source. The main material of the heat conduction block is pure copper.

Preferably, the temperature equalizing plate further includes a fixing frame that fits the lower plate, and the fixing frame includes a locking portion.

Preferably, when the heat source is fixed on a bearing plate, the locking portion of the fixing frame can be fixed together with the bearing plate.

Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the upper plate.

Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the fixing frame.

Preferably, the metal strength of the fixing frame is better than the metal strength of the lower plate.

Preferably, the main material constituting the lower plate is pure copper, and the main material constituting the fixing frame is selected from one of the following: copper alloy, stainless steel, plastic steel and aluminum alloy.

Preferably, the temperature equalizing plate further includes a heat conduction block disposed between the fixing frame and the heat source, and the main material constituting the heat conduction block is pure copper.

Preferably, the fixing frame further includes a fixing frame, and the fixing frame includes a locking portion. When the lower plate forms a strengthening layer on the side away from the working space, the fixing frame is attached to the strengthening layer.

Preferably, when the heat source is fixed on a bearing plate, the locking portion of the fixing frame can be fixed together with the bearing plate.

Preferably, the thermal conductivity of the lower plate is better than or equal to the thermal conductivity of the upper plate.

Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the fixing frame.

Preferably, the thermal conductivity of the lower plate is better than the thermal conductivity of the reinforcement layer.

Preferably, the metal strength of the fixing frame or the reinforcement layer is better than the metal strength of the lower plate.

Preferably, the main material constituting the lower plate is pure copper, the main material constituting the fixing frame is selected from one of the following: copper alloy, stainless steel, plastic steel and aluminum alloy, and the main material constituting the strengthening layer is selected from one of the following: nickel, Stainless steel and titanium.

Preferably, the temperature equalizing plate further includes a heat conduction block disposed between the fixing frame and the heat source, and the main material constituting the heat conduction block is pure copper.

1, 2, 3 ‧‧‧ temperature plate

11, 21, 31

12, 22, 32

121‧‧‧Boss structure

13, 23, 33

13A, 13B, 33A, 33B ‧‧‧ frame

131, 231, 331‧‧‧ open space

132, 232, 332

133, 333‧‧‧ Notch

14, 24, 34

15, 25, 35 ‧‧‧ capillary structure

16, 26, 36‧‧‧‧Capillary structure

17, 27, 37 ‧‧‧ support structure

19, 29, 39 ‧‧‧ strengthen layer

19A, 29A, 39A‧‧‧ open space

38‧‧‧ thermal block

4‧‧‧heat source

5‧‧‧Bearing plate

51‧‧‧Perforation

6‧‧‧screw

FIGS. 1A to 1B are respectively a three-dimensional exploded schematic diagram and a side schematic diagram of a temperature equalizing plate according to the first embodiment of the present creation.

FIGS. 1C to 1E are structural schematic diagrams of various implementations of a fixing frame in a temperature equalizing plate according to the first embodiment of the present creation.

FIG. 1F is a schematic diagram of the structure when the strengthening layer in the temperature equalizing plate according to the first embodiment of the present invention has an open space.

FIGS. 2A to 2B are respectively a three-dimensional exploded schematic diagram and a side schematic diagram of a temperature equalizing plate according to a second embodiment of the present creation.

FIG. 2C is a schematic diagram of the structure when the strengthening layer in the temperature equalizing plate according to the second embodiment of the present invention has an open space.

FIGS. 3A to 3B are respectively a three-dimensional exploded schematic diagram and a side schematic diagram of a temperature equalizing plate according to a third embodiment of the present creation.

FIGS. 3C to 3E are schematic structural views of various implementations of a fixing frame in a temperature equalizing plate according to a third embodiment of the present creation.

FIG. 3F is a schematic diagram of the structure when the strengthening layer in the temperature equalizing plate according to the first embodiment of the present invention has an open space.

Please refer to FIGS. 1A to 1B, which are a three-dimensional exploded schematic diagram and a side schematic diagram of the temperature equalizing plate provided according to the first embodiment of the present creation.

The first embodiment provides a temperature equalizing plate 1, which at least includes an upper plate 11, a lower plate 12 and a fixing frame 13. The lower plate 12 of the temperature equalizing plate 1 can make thermal contact with at least one heat source 4, and the heat source 4 is fixed on a bearing plate 5. The upper plate 11 and the lower plate 12 of the temperature equalizing plate 1 are bonded or pressed together Then an action space 14 is formed, the upper plate 11 forms a first capillary structure 15 on the side (inside) facing the action space 14, and the lower plate 12 is formed on the side (inside) facing the action space 14 The second capillary structure 16, and between the first capillary structure 15 of the upper plate 11 and the second capillary structure 16 of the lower plate 12, a supporting structure 17 such as a capillary powder column or a woven mesh is formed.

In order to strengthen the structural strength of the temperature equalizing plate 1, in this embodiment, in addition to the support structure 17 provided in the working space 14, in particular, at least one of the upper plate 11 and the lower plate 12 of the temperature equalizing plate 1 On the outer side, that is, the side away from the working space 14, a strengthening layer 19 is formed. As can be seen from the schematic cross-sectional view shown in FIG. 1B, this is a type of the upper plate 11 of the temperature equalizing plate 1 that is covered or formed with a reinforcement layer 19, and that the lower plate 12 can also be covered or formed with a reinforcement layer 19 Happening. It can be seen that the reinforcement layer 19 can be formed on the outer side of the upper plate 11 and the lower plate 12 according to product specifications and requirements, or only on the outer side of the upper plate 11 or the lower plate 12, and this creation is not limited.

The strength layer 19 used in this embodiment has a metal strength superior to that of the upper plate 11 or the lower plate 12, but is inferior to the upper plate 11 or the lower plate 12 in terms of thermal conductivity. The standard for measuring the strength of the metal is selected from One of the following indicators: Vickers hardness, tensile strength and elastic coefficient, and the standard for measuring thermal conductivity is the thermal conductivity coefficient. In accordance with the above-mentioned design rules, the main material constituting the upper plate 11 used in this embodiment may be selected from copper alloys, and the main material constituting the lower plate 12 may be selected from pure copper, and the main material constituting the strengthening layer 19 is selected from one of the following : Nickel, stainless steel and titanium. In addition, the reinforcement layer 19 also has corrosion resistance in terms of material properties, with a view to improving the reliability and service life of the temperature equalizing plate 1.

In addition, the temperature equalizing plate 1 provided in this embodiment can choose to make the thermal conductivity of the lower plate 12 better than the thermal conductivity of the upper plate 11, so that the temperature outside the upper plate 11 is not too high, which affects the application of the temperature equalizing plate 1 such as The touch temperature of mobile phones or tablets.

The lower plate 12 provided in this embodiment may form at least one boss in a partial area Structure 121, and the protruding structure is used to make thermal contact with at least one heat source 4, the thermal contact includes the boss structure 121 directly attached to the heat source 4, or a thermal paste or other components or components are disposed between the heat source 4 and the heat source 4 And indirectly. In addition, the arrangement of the boss structure 121 allows the temperature equalizing plate 1 and the heat source 4 to make thermal contact, the boss structure 121 and the other parts of the lower plate 12 have a height difference, so they are less likely to be pressed or hindered by the carrier plate 5. The installation of other electronic components increases the flexibility and convenience of installation. In addition, when the lower plate 12 forms the strengthening layer 19 on the side away from the working space 14, the strengthening layer 19 is formed between the boss structure 121 of the lower plate 12 and the heat source 4. However, in other embodiments according to the present creation, the reinforcement layer 19 provided on the outer side of the lower plate 12 may also be formed only partially on the outer side of the lower plate 12, as shown in FIG. 1F, that is, the reinforcement layer 19 With an open space 19A, the lower plate 12 will not make thermal contact with the heat source 4 through the reinforcement layer 19 at this time.

In this embodiment, considering the ease of installation and stability of the temperature equalizing plate 1, a fixing frame 13 is provided, and the fixing frame 13 is attached to the reinforcing layer 19 outside the lower plate 12 by welding or other means. When the fixing frame 13 and the bearing plate 5 of the heat source 4 are fixed together, the boss structure 121 of the lower plate 12 can generate a pressure pressing the heat source 4, so that the heat energy generated by the heat source 4 can quickly and completely pass through the strengthening layer 19 and transferred to the boss structure 121, and then transferred out by the function of the temperature equalizing plate 1. In this embodiment, the fixing frame 13 includes an open space 131 and at least one locking portion 132, and the boss structure 121 and the reinforcement layer 19 of the lower plate 12 are located in the open space 131, or the boss structure 121 And the reinforcement layer 19 can extend or protrude outward from the open space 131, and this creation is not limited.

In this embodiment, the locking portion 132 formed on the fixing frame 13 is used to fix with the bearing plate 5. The locking portion 132 of the fixing frame 13 adopts a female stud structure, and correspondingly supports the A hole 51 is formed on the board 5, so that a screw 6 can pass through the hole 51 After being locked to the locking portion (female stud) 132, the three of the reinforcement layer 19 outside the lower plate 12, the fixing frame 13 and the bearing plate 5 (including the heat source 4) are assembled together. Of course, in other embodiments, the locking portion 132 of the fixing frame 13 can also be replaced from a female stud to a male stud, and a through hole 51 is formed on the bearing plate 5, so when the male stud passes through the through hole 51 After that, the male stud is fixed by a screw (not shown) to complete the assembly. In addition, in other embodiments, the locking portion 132 of the fixing frame 13 can also be formed into a screw hole structure, which can also be locked to the screw by a screw 6 passing through the through hole 51 in the carrier plate 5 The assembly is completed within the hole, and this creation is not restricted.

In this embodiment, the main material for forming the fixing frame 13 can be selected from copper alloy, stainless steel, plastic steel or aluminum alloy. The consideration factor is mainly the strength of the metal, so that the temperature equalizing plate 1 is installed during the installation process It is not easy to deform in the medium, and the standards for measuring the strength of the metal include Vickers hardness, tensile strength or elastic coefficient.

The design of the temperature equalizing plate 1 in this embodiment includes that the strengthening layer 19 is superior to the upper plate 11 or the lower plate 12 in terms of metal strength, and the thermal conductivity of the strengthening layer 19 is inferior to the upper plate 11 Either the lower plate 12, the thermal conductivity of the lower plate 12 is better than the thermal conductivity of the upper plate 11, the thermal conductivity of the lower plate 12 is better than the thermal conductivity of the fixing frame 13, or the metal strength of the fixing frame 13 is better than the lower plate The metal strength of 12, etc., the rules listed above may be adopted according to the actual situation.

In this embodiment, as shown in FIGS. 1A and 1C, the open space 131 of the fixing frame 13 defines the open space 131 for a hollow frame body, thereby allowing the boss structure 121 of the lower plate 12 and strengthening The layer 19 is located in the open space 131 so that the overall thickness of the temperature equalizing plate 1 is not increased. However, the open space 131 formed on the fixing frame 13 can also have different changes and structures. For example, as shown in FIG. 1D, the open space 131 is formed by a hollow frame body with a gap, which The boss structure 121 and the reinforcement layer 19 can still be accommodated in this space. At this time, The structure of the fixing frame 13 is a frame body with a notch 133 or a C-shaped frame. In addition, as shown in FIG. 1E, the open space 131 can also directly form the fixing frame 13 by at least two independent frame bodies 13A, 13B, and an open space 131 is naturally formed between the frame bodies 13A, 13B to allow convexity The mesa structure 121 and the reinforcement layer 19 can be embedded therein. In addition, if the reinforcement layer 19 is only partially formed on the outside of the lower plate 12 and the boss structure 121 is exposed as shown in FIG. 1F, only the boss structure 121 is located in the open space of the fixing frame 13 and does with the heat source 4 Thermal contact.

Please refer to FIG. 2A to FIG. 2B, which are a three-dimensional exploded schematic diagram and a side schematic diagram of the temperature equalizing plate according to the second embodiment of the present creation.

The second embodiment provides a temperature equalizing plate 2, which at least includes an upper plate 21, a lower plate 22 and a fixing frame 23. The fixing frame 23 includes at least one locking portion 232. The lower plate 22 of the temperature equalizing plate 2 can make thermal contact with at least one heat source 4, and the heat source 4 is fixed on a bearing plate 5. The upper plate 21 and the lower plate 22 of the temperature equalizing plate 2 form a working space 24 by laminating or pressing together. The upper plate 21 forms a first capillary structure 25 on the side (inside) facing the working space 24 , And the lower plate 22 forms a second capillary structure 26 on the side (inner side) facing the working space 24, and between the first capillary structure 25 of the upper plate 21 and the second capillary structure 26 of the lower plate 22, A supporting structure 27 such as a capillary powder column or a woven mesh is formed.

In order to enhance the structural strength of the temperature equalizing plate 2, in this embodiment, in addition to the support structure 27 provided in the working space 24, in particular, at least one of the upper plate 21 and the lower plate 22 of the temperature equalizing plate 2 The outer side, that is, the side away from the working space 24, forms a strengthening layer 29, as can be seen from the schematic cross-sectional view shown in FIG. 2B, this is that the upper plate 21 of the temperature equalizing plate 2 is covered or formed with a strengthening layer 29, and the outer layer 22 is also covered or formed with a reinforcement layer 29. The reinforcement layer 29 may be formed on the outer side of the upper plate 21 and the lower plate 22 according to product specifications and requirements, or may be formed only on the upper plate 21 Or the outer side of the lower plate 22, this creation is not limited.

The strength layer 29 used in this embodiment has a metal strength superior to that of the upper plate 21 or the lower plate 22, but is inferior to the upper plate 21 or the lower plate 22 in terms of thermal conductivity. The standard for measuring the strength of the metal is selected from One of the following indicators: Vickers hardness, tensile strength and elastic coefficient, and the standard for measuring thermal conductivity is the thermal conductivity coefficient. In accordance with the above design rules, the main material constituting the upper plate 21 used in this embodiment may be selected from copper alloys, and the main material constituting the lower plate 22 may be selected from pure copper, and the main material constituting the strengthening layer 29 is selected from one of the following : Nickel, stainless steel and titanium. In addition, the reinforcement layer 29 also has corrosion resistance in terms of material properties, in order to improve the reliability and service life of the temperature equalizing plate 2.

In addition, the temperature equalizing plate 2 provided in this embodiment can choose to make the thermal conductivity of the lower plate 22 better than the thermal conductivity of the upper plate 21, so that the temperature outside the upper plate 21 is not too high, which affects the application of the temperature equalizing plate 2 such as The touch temperature of mobile phones or tablets.

In this embodiment, considering the ease of installation and stability of the temperature equalizing plate 2, a fixing frame 23 is provided, and the fixing frame 23 is attached to the reinforcement layer 29 outside the lower plate 22 by welding or other means. When the fixing frame 23 and the bearing plate 5 of the heat source 4 are fixed together, a pressure pressing against the heat source 4 is generated, so that the heat energy generated by the heat source 4 can be quickly and completely transferred to the lower plate 22 through the strengthening layer 29, and then It is then transferred out by the action inside the temperature equalizing plate 2. In this embodiment, the fixing frame 23 includes at least one locking portion 232.

In this embodiment, the locking portion 232 formed on the fixing frame 23 is used to be fixed with the bearing plate 5. The locking portion 232 of the fixing frame 23 adopts a female stud structure and correspondingly supports the A through hole 51 is formed on the plate 5, so that a reinforcing layer 29 on the outer side of the lower plate 22 can be fixed by a screw 6 passing through the through hole 51 and then locked to the locking portion (female stud) 232 The rack 23 and the bearing plate 5 (including the heat source 4) are assembled together. Of course, in other embodiments, the fixing frame 23 The locking portion 232 can also be replaced from a female stud to a male stud, and a perforation 51 is formed on the carrier plate 5, so when the male stud passes through the perforation 51, a screw (not shown in the figure) is used. (Show) Fix the male stud to complete the assembly. In addition, in other embodiments, the locking portion 232 of the fixing frame 23 can also be formed into a screw hole structure, which can also be locked to the screw by a screw 6 passing through the through hole 51 in the carrier plate 5 The assembly is completed within the hole, and this creation is not restricted.

In this embodiment, the main material for forming the fixing frame 23 can be selected from copper alloy, stainless steel, plastic steel or aluminum alloy. The consideration factor is mainly the strength of the metal, so that the temperature equalizing plate 2 is installed during the process It is not easy to deform in the medium. Among them, the standards for measuring the strength of the metal include Vickers hardness, tensile strength or elastic coefficient.

The design rules of the temperature equalizing plate 2 provided in this embodiment include that the strengthening layer 29 is superior to the upper plate 21 or the lower plate 22 in terms of metal strength, and the thermal conductivity of the strengthening layer 29 is inferior to the upper plate 21 Either the lower plate 22, the thermal conductivity of the lower plate 22 is better than the thermal conductivity of the upper plate 21, the thermal conductivity of the lower plate 22 is better than the thermal conductivity of the fixing frame 23, or the metal strength of the fixing frame 23 is better than the lower The metal strength of the plate 22, etc., the rules listed above may be adopted according to the actual situation.

In other embodiments according to the present creation, the reinforcement layer 29 provided on the outer side of the lower plate 22 may also be formed only partially on the outer side of the lower plate 22 as shown in FIG. 2C, that is, the reinforcement layer 29 has a Open space 29A, at this time, the lower plate 22 will not make thermal contact with the fixing frame 23 or the heat source 4 through the reinforcement layer 29, that is, the heat energy generated by the heat source 4 will be transferred to the fixing frame 23 first, and then It is transferred to the lower plate 22 and enters the inside of the temperature equalizing plate 2 to dissipate heat.

Please refer to FIG. 3A to FIG. 3B, which are a three-dimensional exploded schematic diagram and a side schematic diagram of the temperature equalizing plate according to the third embodiment of the present creation.

The third embodiment provides a temperature equalizing plate 3, which includes at least one upper plate 31, a The lower plate 32, a fixing frame 33 and a heat conduction block 38. The temperature equalizing plate 3 can make thermal contact with at least one heat source 4, and the heat source 4 is fixed on a bearing plate 5. The upper plate 31 and the lower plate 32 of the temperature equalizing plate 3 form a working space 34 by laminating or pressing together, and the upper plate 31 forms a first capillary structure 35 on the side (inside) facing the working space 34 , And the lower plate 32 forms a second capillary structure 36 on the side (inner side) facing the working space 34, and between the first capillary structure 35 of the upper plate 31 and the second capillary structure 36 of the lower plate 32, A supporting structure 37 such as a capillary powder column or a woven mesh is formed.

In order to enhance the structural strength of the temperature equalizing plate 3, in this embodiment, in addition to the support structure 37 provided in the working space 34, in particular, at least one of the upper plate 31 and the lower plate 32 of the temperature equalizing plate 3 On the outer side, that is, the side away from the working space 34, a strengthening layer 39 is formed. As can be seen from the schematic cross-sectional view shown in FIG. 3B, the upper plate 31 of the temperature equalizing plate 3 is covered or formed with the strengthening layer 39, and The lower plate 32 may also be covered or formed with a reinforcement layer 39. The reinforcement layer 39 may be formed on the outer side of the upper plate 31 and the lower plate 32 according to product specifications and requirements, or formed only on the upper plate 31 or the lower plate 32 Outside, this creation is not restricted.

The strengthening layer 39 used in this embodiment has a metal strength superior to that of the upper plate 31 or the lower plate 32, but is inferior to the upper plate 31 or the lower plate 32 in terms of thermal conductivity. The standard for measuring the strength of the metal is selected from One of the following indicators: Vickers hardness, tensile strength and elastic coefficient, and the standard for measuring thermal conductivity is the thermal conductivity coefficient. In accordance with the above-mentioned design rules, the main material constituting the upper plate 31 used in this embodiment may be selected from copper alloys, and the main material constituting the lower plate 32 may be selected from pure copper, and the main material constituting the strengthening layer 39 is selected from one of the following : Nickel, stainless steel and titanium. In addition, the reinforcement layer 39 also has corrosion resistance in terms of material properties, so as to improve the reliability and service life of the temperature equalizing plate 3.

In addition, the temperature equalizing plate 3 provided in this embodiment can choose to make the thermal conductivity of the lower plate 32 better than the thermal conductivity of the upper plate 31, so that the temperature outside the upper plate 31 is not too high, which affects the temperature equalizing plate 3 Use the touch temperature of a target such as a mobile phone or tablet.

In addition, in this embodiment, one side of the heat conduction block 38 is attached to the reinforcement layer 39 outside the lower plate 32 by welding or other fixing means, and the other side of the heat conduction block 38 is in thermal contact with at least one heat source 4 The thermal contact includes that the thermally conductive block 38 is directly attached to the heat source 4 or is indirectly in contact with the heat source 4 by a thermal paste or other elements or components. When the heat conduction block 38 is combined with the strengthening layer 39 and the heat source 4 respectively, the heat energy generated by the heat source 4 can be transferred to the strengthening layer 39 through the heat conduction block 38 and further transmitted to the lower plate 32 and then enter the temperature equalizing plate 3 For subsequent heat dissipation.

In this embodiment, considering the installation convenience and stability of the temperature equalizing plate 3, a fixing frame 33 is provided, and the fixing frame 33 is attached to the reinforcing layer 39 outside the lower plate 32 by welding or other means, and When the fixing frame 33 and the bearing plate 5 of the heat source 4 are fixed together, a pressure pressing against the heat source 4 can be generated, so that the heat energy generated by the heat source 4 can be quickly and completely transferred to the lower plate 32 through the strengthening layer 39, Afterwards, it is transferred by the function of the temperature equalizing plate 3. In this embodiment, the fixing frame 33 includes an open space 331 and at least one locking portion 332, and the heat conducting block 38 is located in the open space 331, that is, at a horizontal height, the fixing frame 33 and the heat conducting block 38 are Overlapping, so that the overall thickness of the temperature equalizing plate 3 can be reduced.

In this embodiment, the locking portion 332 formed on the fixing frame 33 is used to fix with the bearing plate 5. The locking portion 332 of the fixing frame 33 adopts a female stud structure, and correspondingly supports A through hole 51 is formed on the board 5, so that the reinforcing layer 39 on the outer side of the lower board 32 can be fixed by a screw 6 passing through the through hole 51 and locked to the locking portion (female stud) 332 The rack 33 and the bearing plate 5 (including the heat source 4) are assembled together. Of course, in other embodiments, the locking portion 332 of the fixing frame 33 can also be replaced from a female stud to a male stud, and a through hole 51 is formed on the bearing plate 5, so when the male stud passes through the through hole 51 Then, fix the male stud with a screw (not shown) Complete assembly. In addition, in other embodiments, the locking portion 132 of the fixing frame 33 can also be formed into a screw hole structure, which can also be locked to the screw by a screw 6 passing through the through hole 51 in the carrier plate 5 The assembly is completed within the hole, and this creation is not restricted.

In this embodiment, the main material constituting the upper plate 31 is a copper alloy, the main material constituting the lower plate 32 is pure copper, and the main material constituting the strengthening layer 39 is selected from one of the following: nickel, stainless steel, and titanium, constituting the thermally conductive block 38 The main material may be selected from pure copper, and the main material constituting the fixing frame 33 may be selected from copper alloy, stainless steel, plastic steel or aluminum alloy. Such an arrangement is because the thermal conductivity of pure copper is better than that of a copper alloy, so the thermally conductive block 38 can transfer heat energy from the heat source 4 to the strengthening layer 39 more efficiently. In addition, in this embodiment, the reason why the main material of the fixing frame 33 is copper alloy, stainless steel, plastic steel or aluminum alloy is to consider the strength of the metal, so that the temperature equalizing plate 3 is not likely to be deformed during the installation process. In this embodiment, the standard for measuring thermal conductivity is thermal conductivity, and the standard for measuring metal strength includes Vickers hardness, tensile strength, or elastic coefficient.

The design rules of the temperature equalizing plate 3 provided in this embodiment include that the strengthening layer 39 is superior to the upper plate 31, the lower plate 32 or the heat conduction block 38 in metal strength, and the thermal conductivity of the strengthening layer 39 is inferior On the upper plate 31, the lower plate 32 or the heat conduction block 38, the thermal conductivity of the lower plate 32 is better than the thermal conductivity of the upper plate 31, the thermal conductivity of the lower plate 32 is better than the thermal conductivity of the fixing frame 33, and the fixing frame 33 The metal strength of the lower plate 32 is better than the metal strength of the lower plate 32, etc. In actual use, the rules listed above may be used as appropriate.

In this embodiment, as shown in FIGS. 3A and 3C, the open space 331 of the fixing frame 33 defines the open space 331 for a hollow frame body, so that the heat conduction block 38 can be located in the open space 331, In this way, the overall thickness of the temperature equalizing plate 3 is not increased. However, the open space 331 formed on the fixing frame 33 can also have different changes and structures. For example, the open space 331 can be a hollow part with a gap as shown in FIG. 3D, which can still allow heat conduction Block 38 It is accommodated in this space. At this time, the structure of the fixing frame 33 is a frame body having a notch 333 or a C-shaped frame. In addition, as shown in FIG. 3E, the open space 331 can also be composed of at least two independent frame bodies 33A, 33B, and an open space 331 is naturally formed between the frame bodies 33A, 33B to allow the heat conduction block 38 was put into it.

In other embodiments according to the present creation, the reinforcement layer 39 provided on the outer side of the lower plate 32 may also be formed only partially on the outer side of the lower plate 32 as shown in FIG. 3F, that is, the reinforcement layer 39 has a Open space 39A, at this time, the heat conduction block 38 is located in the open space 39A, so the lower plate 32 does not make thermal contact with the heat source 4 through the reinforcement layer 39 as shown in FIG. 3B, but can pass through the heat conduction block 38 Make thermal contact with the heat source 4. In this case, as shown in FIG. 3B, the fixing frame 33 is not attached to the reinforcement layer 39, but is attached to the lower plate 32 through the open space 39A.

The above summarizes the contents of several embodiments according to the creation, so that those with ordinary knowledge in the technical field can understand the creation technology disclosed in the creation. Those of ordinary skill in the art should understand that they can easily use this disclosure as a basis to design or modify other structures for implementing the same purposes and / or achieving the same advantages as the embodiments described herein. Creation is not restricted.

Directional terms mentioned in this creation, such as [upper], [lower], [inner], [outer], [side], etc., are only for the directions referring to the attached drawings. Therefore, the terminology used is to illustrate and understand this creation, not to limit it.

Claims (28)

A temperature-equalizing plate includes: an upper plate; and a lower plate, the lower plate is attached to the upper plate, and a working space is interposed with the upper plate, the lower plate can be in thermal contact with a heat source; wherein, the upper plate At least one of the plate and the lower plate forms a strengthening layer on the side away from the working space. According to the temperature equalizing plate of the first patent application, the strengthening layer is superior to the upper plate or the lower plate in terms of metal strength, and is inferior in thermal conductivity to the upper plate or the lower plate. According to the temperature-averaging plate in the second item of the patent application scope, the standard for measuring the strength of the metal is selected from one of the following indexes: Vickers hardness, tensile strength and elastic coefficient. According to the temperature equalizing plate in the second item of the patent application scope, the standard for measuring the thermal conductivity is the thermal conductivity coefficient. According to the temperature equalizing plate of the first item of the patent application scope, the main material constituting the strengthening layer is selected from one of the following: nickel, stainless steel and titanium. According to the temperature equalizing board of the first item of the patent application scope, the strengthening layer has corrosion resistance. According to the temperature equalizing plate of claim 1, the upper plate forms a first capillary structure on the side facing the action space, and the lower plate forms a second capillary structure on the side facing the action space At least one supporting structure is formed between the first capillary structure and the second capillary structure. According to the temperature equalizing plate of the first item of the patent application scope, a heat conduction block is further disposed between the lower plate and the heat source, and the main material constituting the heat conduction block is pure copper. According to the temperature-averaged plate of item 1 of the patent application scope, the thermal conductivity of the lower plate is superior to that of the upper plate. According to the temperature equalizing plate of claim 1, the lower plate has a boss structure, and the boss structure is in thermal contact with the heat source. According to the temperature equalizing plate of claim 10 of the patent application scope, when the lower plate forms the strengthening layer on the side away from the working space, the strengthening layer is formed between the boss structure and the heat source. According to the temperature equalizing plate of claim 10, when the lower plate forms the strengthening layer on the side away from the working space, the strengthening layer forms an open space at the boss structure, revealing the boss structure . According to item 10 of the patent application, the temperature equalizing plate further includes a heat conduction block disposed between the boss structure and the heat source. The main material of the heat conduction block is pure copper. According to item 1 of the patent application, the temperature equalizing plate further includes a fixing frame attached to the lower plate, and the fixing frame includes a locking portion. According to the temperature equalizing plate of item 14 of the patent application scope, when the heat source is fixed on a bearing plate, the locking portion of the fixing frame can be fixed together with the bearing plate. According to item 14 of the patent application scope, the thermal conductivity of the lower board is superior to that of the upper board. According to item 14 of the patent application scope, the thermal conductivity of the lower plate is superior to the thermal conductivity of the fixing frame. According to item 14 of the patent application scope, the metal strength of the fixing frame is better than the metal strength of the lower plate. According to item 14 of the patent application scope, the main material constituting the lower plate is pure copper, and the main material constituting the fixing frame is selected from one of the following: copper alloy, stainless steel, plastic steel and aluminum alloy. According to item 14 of the patent application, the temperature equalizing plate further includes a heat conduction block disposed between the fixing frame and the heat source. The main material of the heat conduction block is pure copper. According to item 1 of the patent application, the temperature equalizing plate further includes a fixing frame including a locking portion. When the lower plate forms the reinforcement layer on the side away from the working space, the fixing frame is attached The strengthening layer. According to the temperature equalizing plate of claim 21 of the patent application scope, when the heat source is fixed on a bearing plate, the locking portion of the fixing frame is used to fix the bearing plate together. According to the temperature-averaged plate of the 21st patent application, the thermal conductivity of the lower plate is better than or equal to that of the upper plate. According to the temperature equalizing plate of the 21st patent application, the thermal conductivity of the lower plate is better than that of the fixing frame. According to the temperature equalizing plate of the 21st patent application, the thermal conductivity of the lower plate is better than that of the strengthening layer. According to the temperature equalizing plate of claim 21, the metal strength of the fixing frame or the strengthening layer is better than the metal strength of the lower plate. According to item 21 of the patent application scope, the main material constituting the lower plate is pure copper, and the main material constituting the fixing frame is selected from one of the following: copper alloy, stainless steel, plastic steel and aluminum alloy, which constitute the strengthening The main material of the layer is selected from one of the following: nickel, stainless steel and titanium. According to item 21 of the patent application, the temperature equalizing plate further includes a heat conduction block disposed between the fixing frame and the heat source. The main material of the heat conduction block is pure copper.