JP2018135705A - Heat conduction variable structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat conduction variable structure whose thermal conduction state changes while maintaining its shape.SOLUTION: A heat conduction variable structure 10 comprises a first panel 11, a second panel 12 facing the first panel 11, a first contact piece 13 positioned between the first panel 11 and the second panel 12 and connected to the first panel 11, and a second contact piece 14 positioned between the first panel 11 and the second panel 12 and connected to the second panel 12. In the heat conduction variable structure 10, the first state in which the first contact piece 13 and the second contact piece 14 are in contact with each other and the second state in which the first contact piece 13 and the second contact piece 14 do not contact switch according to change in temperature.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a heat conduction variable structure whose heat conduction state changes.

  Patent Document 1 discloses a plate material whose thermal conductivity changes. In the plate material described in Patent Document 1, the amount of gas in the closed space surrounded by the jacket material is controlled, and the thickness changes depending on the internal and external pressure difference according to the amount of gas. In a state where the amount of gas in the closed space is small, a heat transfer path is formed by a heat conductive material between one heat transfer surface of the heat conductivity variable plate and the other heat transfer surface. On the other hand, when the amount of gas in the closed space is large, a heat transfer path is blocked by a gap formed between one heat transfer surface of the heat conductivity variable plate and the other heat transfer surface.

JP 2010-25511 A

  In the plate material as described above, the problem is that the shape of the plate material changes when the thermal conductivity changes.

  The present invention provides a heat conduction variable structure in which the heat conduction state changes while the shape (outer shape) is maintained.

  The heat conduction variable structure according to an aspect of the present invention is located between the first panel, the second panel facing the first panel, the first panel and the second panel, and the first panel. A first contact piece connected to the first panel, and a second contact piece located between the first panel and the second panel and connected to the second panel, the first contact piece and the second The first state in which the contact piece contacts and the second state in which the first contact piece and the second contact piece do not contact are switched according to a change in temperature.

  The heat conduction variable structure of the present invention changes its heat conduction state while maintaining its shape.

FIG. 1 is a diagram for explaining a usage example of the heat conduction variable structure according to the first embodiment. 2 is a cross-sectional view (enlarged view of region II in FIG. 1) of the heat conduction variable structure according to the first embodiment. Drawing 3 is a figure for explaining modification of the 1st contact piece of the 1st pattern. FIG. 4 is a diagram for explaining the deformation of the first contact piece of the second pattern. FIG. 5 is a diagram for explaining a first example of switching between the heat transfer state and the heat insulation state in the first embodiment. FIG. 6 is a diagram for describing a second example of switching between the heat transfer state and the heat insulation state according to the first embodiment. FIG. 7 is a diagram for explaining a third example of switching between the heat transfer state and the heat insulation state according to the first embodiment. FIG. 8 is a sectional view of the heat conduction variable structure according to the second embodiment. FIG. 9 is a diagram for explaining switching between the heat transfer state and the heat insulation state according to the second embodiment. FIG. 10 is a diagram schematically showing a non-linearly changing displacement.

  Embodiments of the present invention will be described below. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Accordingly, the scales and the like do not necessarily match in each drawing. In each figure, substantially the same components are denoted by the same reference numerals, and redundant descriptions are omitted or simplified.

  In the present specification and drawings, the X axis, the Y axis, and the Z axis represent three axes of a three-dimensional orthogonal coordinate system. In the embodiment, the Z axis direction is, for example, the vertical direction, and Z The direction perpendicular to the axis (the direction parallel to the XY plane) is, for example, the horizontal direction.

(Embodiment 1)
[Constitution]
First, the configuration of the heat conduction variable structure according to Embodiment 1 will be described with reference to FIGS. 1 and 2. FIG. 1 is a diagram for explaining a usage example of the heat conduction variable structure according to the first embodiment. 2 is a cross-sectional view (enlarged view of region II in FIG. 1) of the heat conduction variable structure according to the first embodiment.

  As shown in FIG. 1, the heat conduction variable structure 10 according to Embodiment 1 is used as, for example, a heat insulating material (a heat insulating material for a house) included in a wall material of a building such as a house 100. The heat conduction variable structure 10 may be used as a heat insulating material included in a ceiling material of the house 100 or may be used as a heat insulating material included in a floor material of the house 100.

  As shown in FIG. 2, the heat conduction variable structure 10 includes a first panel 11, a second panel 12, a plurality of first contact pieces 13, and a plurality of second contact pieces 14. The heat conduction variable structure 10 may include at least one first contact piece 13 and two second contact pieces 14. In addition, the heat conduction variable structure 10 has a flat rectangular parallelepiped outer shape including the first panel 11 and the second panel 12, and the space 15 in the outer shape is a sealed closed space. The shape of the outline is not particularly limited.

  The first panel 11 is a plate material and is disposed on the indoor side of the house 100, for example. The 2nd panel 12 is a board | plate material, for example, is arrange | positioned at the outdoor side of the house 100. FIG. The second panel 12 faces the first panel 11. The first panel 11 may be disposed outside the house 100 and the second panel 12 may be disposed on the indoor side of the house 100. The shape of the first panel 11 and the second panel 12 is not particularly limited.

  The first panel 11 and the second panel 12 are formed of a metal material such as aluminum or copper, for example. The first panel 11 and the second panel 12 may be formed of stone, wood, glass, clay, plastic, synthetic fiber, artificial marble, rubber, or asphalt. The first panel 11 and the second panel 12 may be formed of the same material, or may be formed of different materials.

  The first contact piece 13 is located in the space 15 between the first panel 11 and the second panel 12 and is connected to the first panel 11. The first contact piece 13 has, for example, a strip shape, and one end thereof is connected to the inner surface of the first panel 11 (the surface facing the second panel 12 of the first panel 11). The connection between one end of the first contact piece 13 and the first panel 11 is performed by, for example, pressure bonding (pressure welding) or an adhesive. One first contact piece 13 faces one second contact piece 14.

  The 1st contact piece 13 is comprised by bonding the sheet-like 1st base material 13a and the sheet-like 2nd base material 13b. The first base material 13a is formed of a material having a larger linear expansion coefficient than the second base material 13b. As described above, the first contact piece 13 has a structure in which two kinds of materials having different linear expansion coefficients are laminated. The first base material 13a and the second base material 13b are bonded (joined) by, for example, pressure bonding (rolling or pressure welding).

  In the heat conduction variable structure 10, the first base material 13a is located closer to the first panel 11 than the second base material 13b. The second base material 13b is located closer to the second panel 12 than the first base material 13a. In Embodiment 1, the 1st base material 13a and the 2nd base material 13b are formed with metals, such as copper, for example, and the 1st contact piece 13 is what is called a bimetal. In addition, what kind of material is used for each of the first base material 13a and the second base material 13b under the condition that the first base material 13a has a larger linear expansion coefficient than the second base material 13b. Also good. For the first base material 13a and the second base material 13b, a resin material such as PET (polyethylene terephthalate) may be used, or an alloy (for example, an alloy of iron and nickel) may be used.

  The second contact piece 14 is located in the space 15 between the first panel 11 and the second panel 12 and is connected to the second panel 12. The second contact piece 14 has, for example, a strip shape, and one end thereof is connected to the inner surface of the second panel 12 (the surface facing the first panel 11 of the second panel 12). The connection between one end of the second contact piece 14 and the second panel 12 is performed by, for example, pressure bonding or an adhesive. One second contact piece 14 faces one first contact piece 13.

  The 2nd contact piece 14 is comprised by bonding the sheet-like 1st base material 14a and the sheet-like 2nd base material 14b. The first base material 14a is formed of a material having a larger linear expansion coefficient than the second base material 14b. As described above, the second contact piece 14 has a structure in which two kinds of materials having different linear expansion coefficients are laminated. The first base material 14a and the second base material 14b are bonded (bonded) by, for example, pressure bonding.

  In the heat conduction variable structure 10, the first base material 14a is located closer to the second panel 12 than the second base material 14b. The second base material 14b is located closer to the first panel 11 than the first base material 14a. In Embodiment 1, the 1st base material 14a and the 2nd base material 14b are formed with metals, such as copper, and the 2nd contact piece 14 is what is called a bimetal. In addition, what kind of material may be used for the 1st base material 14a and the 2nd base material 14b on the conditions that the 1st base material 14a has a larger linear expansion coefficient than the 2nd base material 14b. . A resin material such as PET or an alloy may be used for each of the first base material 13a and the second base material 13b.

  The space 15 between the first panel 11 and the second panel 12 is filled with air, for example. In addition, in order to improve the heat insulation of the heat conduction variable structure 10, the space 15 between the first panel 11 and the second panel 12 may be depressurized more than the space outside the heat conduction variable structure 10. Good. The space 15 may be, for example, a vacuum state or a state close to a vacuum (substantially vacuum state).

  Moreover, in order to improve the heat insulation of the heat conduction variable structure 10, the space 15 between the first panel 11 and the second panel 12 may be filled with a gas having higher heat insulation than air. The gas having higher heat insulation than air is, for example, Ar (argon).

[Deformation of contact piece]
The first contact piece 13 is based on the ambient temperature (hereinafter also referred to as the production environment temperature) when the first base material 13a and the second base material 13b are bonded together (when the first contact piece 13 is manufactured). When the ambient temperature is different from the reference temperature T, the temperature T is deformed due to a difference in linear expansion coefficient between the first base material 13a and the second base material 13b. Due to this deformation, a part of the first contact piece 13 approaches the second panel 12. FIG. 3 is a view for explaining the deformation of the first contact piece 13.

  As shown in FIG. 3A, when the ambient temperature is the reference temperature T, the first contact piece 13 is substantially parallel to the first panel 11. As shown in FIG. 3B, when the ambient temperature rises above the reference temperature T, the first contact piece 13 warps. As a result, the other end (the end not connected to the first panel 11) of the first contact piece 13 is lifted and approaches the second panel 12. The displacement σ1 at this time is the amount of change ΔT (> 0) in the ambient temperature, the thickness h of the first contact piece 13, the length L of the first contact piece 13, the linear expansion coefficient α1 of the first base material 13a, the second Using the linear expansion coefficient α2 of the base material 13b, the Young's modulus E1 of the first base material 13a, and the Young's modulus E2 of the second base material 13b, the following Expression 1 is used. The displacement σ1 is a displacement in a direction (Y-axis direction) orthogonal to the main surface (XZ plane) of the first panel 11 (or the second panel 12).

  On the other hand, as shown in FIG. 3C, when the ambient temperature is lower than the reference temperature T, the first contact piece 13 is warped in the opposite direction to that when the ambient temperature is increased. As a result, the central portion of the first contact piece 13 is lifted and approaches the second panel 12. The displacement σ2 at this time is the amount of change ΔT (<0) in the ambient temperature, the thickness h of the first contact piece 13, the length L of the first contact piece 13, the linear expansion coefficient α1 of the first base member 13a, the second Using the linear expansion coefficient α2 of the base material 13b, the Young's modulus E1 of the first base material 13a, and the Young's modulus E2 of the second base material 13b, the following expression 2 is used. The displacement σ2 is a displacement in a direction (Y-axis direction) orthogonal to the main surface (XZ plane) of the second panel 12 (or the first panel 11).

  In addition, when the direction of bonding of the first base material 13a and the second base material 13b is opposite, that is, the first base material 13a is pasted so as to be positioned closer to the second panel 12 than the second base material 13b. When they are aligned, the first contact piece 13 is deformed as shown in FIG. FIG. 4 is another view for explaining the deformation of the first contact piece 13.

  As shown in FIG. 4A, when the ambient temperature is the reference temperature T, the first contact piece 13 is substantially parallel to the first panel 11. As shown in FIG. 4B, when the ambient temperature rises, the first contact piece 13 warps. As a result, the central portion of the first contact piece 13 is lifted and approaches the second panel 12, and the displacement σ2 at this time is expressed by the above equation 2.

  On the other hand, as shown in FIG. 4C, when the ambient temperature decreases, the first contact piece 13 warps in the opposite direction to that when the ambient temperature increases. As a result, the other end of the first contact piece 13 is lifted and approaches the second panel 12. The displacement σ1 at this time is expressed by the above equation 1.

  In addition, although the 2nd contact piece 14 deform | transforms similarly to the 1st contact piece 13, it abbreviate | omits about the description using drawing.

  In the following description, as shown in FIG. 3, the first contact piece 13 in which the first base material 13a is bonded in a first pattern located closer to the first panel 11 than the second base material 13b is the first pattern. The first contact piece 13 is also described. Similarly, the 2nd contact piece 14 bonded together by the 1st pattern in which the 1st substrate 14a is located near the 2nd panel 12 rather than the 2nd substrate 14b is described as the 2nd contact piece 14 of the 1st pattern. Is done.

  On the other hand, as shown in FIG. 4, the first contact piece 13 bonded in a second pattern in which the first base material 13 a is positioned closer to the second panel 12 than the second base material 13 b is the first pattern of the second pattern. Also referred to as contact piece 13. Similarly, the 2nd contact piece 14 bonded together by the 2nd pattern in which the 1st substrate 14a is located near the 1st panel 11 rather than the 2nd substrate 14b is described as the 2nd contact piece 14 of the 2nd pattern. Is done.

[Switching between heat transfer state and heat insulation state]
The heat conduction variable structure 10 utilizes the deformation (warpage) of the first contact piece 13 and the second contact piece 14 as described above, and a heat transfer state (an example of the first state) and a heat insulation state (second state). An example of a state) switches according to a change in temperature. FIG. 5 is a diagram for explaining a first example of switching between a heat transfer state and a heat insulation state.

  In the heat conduction variable structure 10 shown in FIG. 5A, the opposed first contact piece 13 and second contact piece 14 do not contact each other. Therefore, the thermal conductivity (for example, thermal conductivity) between the first panel 11 and the second panel 12 is lowered, and the thermally conductive variable structure 10 is in a heat insulating state. The ambient temperature in this case is, for example, a temperature of 15 ° C. or less. In other words, the manufacturing environment temperature of the first contact piece 13 and the second contact piece 14 is, for example, 15 ° C. or less.

  On the other hand, when the ambient temperature of the heat conduction variable structure 10 rises, the opposed first contact piece 13 and second contact piece 14 come into contact with each other as shown in FIG. Therefore, the thermal conductivity between the first panel 11 and the second panel 12 is improved, and the heat conduction variable structure 10 is in a heat transfer state. The ambient temperature in this case is a temperature higher than 15 ° C.

  Such a heat conduction variable structure 10 is used in, for example, a house built in a cold region. In the season when the temperature is low and heating is used, the heat conduction variable structure 10 is in a heat insulating state, so that warm air in the room is difficult to escape to the outside. In addition, in the season when the temperature is relatively high and comfortable, the heat conduction variable structure 10 is in a heat transfer state, and therefore, energy saving air conditioning that brings the indoor temperature close to the outdoor temperature via the heat conduction variable structure 10 is realized. The

  FIG. 6 is a diagram for explaining a second example of switching between the heat transfer state and the heat insulation state. In the heat conduction variable structure 10 shown in FIG. 6A, the opposed first contact piece 13 and second contact piece 14 do not contact each other. Therefore, the heat conductivity between the first panel 11 and the second panel 12 is lowered, and the heat conduction variable structure 10 is in a heat insulating state. The ambient temperature in this case is a temperature higher than 25 ° C., for example. In other words, the manufacturing environment temperature of the first contact piece 13 and the second contact piece 14 is a temperature higher than 25 ° C., for example.

  On the other hand, when the ambient temperature of the heat conduction variable structure 10 is lowered, as shown in FIG. 6B, the first contact piece 13 and the second contact piece 14 facing each other come into contact with each other. Therefore, the thermal conductivity between the first panel 11 and the second panel 12 is improved, and the heat conduction variable structure 10 is in a heat transfer state. The ambient temperature in this case is a temperature of 25 ° C. or lower.

  Such a heat conduction variable structure 10 is used in, for example, a house built in a warm region. In the season when the air temperature is high and the cooling is used, the heat conduction variable structure 10 is in a heat insulating state, so that the indoor cold air hardly escapes to the outside. Further, in the season when the temperature is relatively low and comfortable, the heat conduction variable structure 10 is in a heat transfer state, and thus energy-saving air conditioning that brings the indoor temperature close to the outdoor temperature via the heat conduction variable structure 10 is realized. The

  As described above, the heat conduction variable structure 10 includes the heat transfer state in which the first contact piece 13 and the second contact piece 14 are in contact, and the heat insulation state in which the first contact piece 13 and the second contact piece 14 are not in contact. Switches according to changes in ambient temperature (environmental temperature). Thereby, the heat conduction variable structure 10 in which the heat conduction state changes while the shape is maintained is realized.

  Moreover, the structure which makes contact pieces surface-contact has an advantage which is easy to make contact pieces surface-contact. For this reason, the heat conduction variable structure 10 can obtain high heat conductivity in the heat transfer state, and can widen the difference in heat conductivity between the heat insulation state and the heat transfer state.

[Modification]
In the said Embodiment 1, the switching of the heat insulation state and the heat-transfer state was performed by combining the 1st contact piece 13 of a 1st pattern, and the 2nd contact piece 14 of a 1st pattern. However, the heat insulation state and the heat transfer state may be switched by combining the first contact piece 13 of the first pattern and the second contact piece 14 of the second pattern. FIG. 7 is a diagram for explaining a third example of switching between the heat transfer state and the heat insulation state.

  In the heat conduction variable structure 10 shown in FIG. 7, the first contact piece 13 of the first pattern and the second contact piece 14 of the second pattern are arranged to face each other. In the heat conduction variable structure 10 shown in FIG. 7A, the opposed first contact piece 13 and second contact piece 14 do not contact each other. Therefore, the heat conductivity between the first panel 11 and the second panel 12 is lowered, and the heat conduction variable structure 10 is in a heat insulating state.

  On the other hand, when the ambient temperature of the heat conduction variable structure 10 increases, as shown in FIG. 7B, the first contact piece 13 and the second contact piece 14 facing each other come into contact with each other. Therefore, the thermal conductivity between the first panel 11 and the second panel 12 is improved, and the heat conduction variable structure 10 is in a heat transfer state.

  Thus, in the heat conduction variable structure 10, even if switching between the heat insulation state and the heat transfer state is performed by combining the first contact piece 13 of the first pattern and the second contact piece 14 of the second pattern. Good. Moreover, although not shown in figure, the 1st contact piece 13 of a 2nd pattern and the 2nd contact piece 14 of a 1st pattern may be combined, and switching of a heat insulation state and a heat transfer state may be performed, and a 2nd pattern The first contact piece 13 and the second contact piece 14 of the second pattern may be combined to switch between the heat insulation state and the heat transfer state. In any combination, the heat conduction variable structure 10 may transition from the heat insulating state to the heat transfer state when the ambient temperature increases, or transition from the heat insulating state to the heat transfer state when the ambient temperature decreases. May be.

[Effects]
As described above, the heat conduction variable structure 10 is located between the first panel 11, the second panel 12 facing the first panel 11, the first panel 11, and the second panel 12. A first contact piece 13 connected to the panel 11 and a second contact piece 14 located between the first panel 11 and the second panel 12 and connected to the second panel 12 are provided. In the heat conduction variable structure 10, the first state in which the first contact piece 13 and the second contact piece 14 are in contact and the second state in which the first contact piece 13 and the second contact piece 14 are not in contact are the temperature. Switch according to change. The first state is, for example, the above-described heat transfer state, which is a state with lower heat insulation and higher heat transfer than the second state. A 2nd state is the above-mentioned heat insulation state, for example, and is a state in which heat insulation is higher and heat conductivity is lower than a 1st state.

  Thereby, the heat conduction variable structure 10 in which the heat conduction state changes while the shape is maintained is realized. Moreover, the structure which makes contact pieces surface-contact has an advantage which is easy to make contact pieces surface-contact. For this reason, the heat conduction variable structure 10 can obtain high heat conductivity in the heat transfer state, and can widen the difference in heat conductivity between the heat insulation state and the heat transfer state.

  For example, each of the first contact piece 13 and the second contact piece 14 has a structure in which two types of materials having different linear expansion coefficients are laminated.

  Thus, each of the first contact piece 13 and the second contact piece 14 is realized by laminating two kinds of materials having different linear expansion coefficients.

  The space 15 between the first panel 11 and the second panel 12 may be depressurized more than the space outside the heat conduction variable structure 10.

  Thereby, the heat insulation of the heat conduction variable structure 10 is improved.

  Further, the space 15 between the first panel 11 and the second panel 12 may be filled with a gas having higher heat insulation than air.

  Thereby, the heat insulation of the heat conduction variable structure 10 is improved.

(Embodiment 2)
[Constitution]
Hereinafter, the heat conduction variable structure according to the second embodiment will be described. FIG. 8 is a sectional view of the heat conduction variable structure according to the second embodiment.

  The manufacturing environment temperature of the first contact piece 13 included in the heat conduction variable structure 10a according to Embodiment 2 shown in FIG. 8 is, for example, the first temperature. On the other hand, the manufacturing environment temperature of the second contact piece 14 included in the heat conduction variable structure 10a is, for example, a second temperature higher than the first temperature. That is, the manufacturing environment temperature differs between the first contact piece 13 and the second contact piece included in the heat conduction variable structure 10a. Since the other structure of the heat conduction variable structure 10a is the same as that of the heat conduction variable structure 10, description thereof is omitted.

[Switching between heat transfer state and heat insulation state]
Switching between the heat transfer state and the heat insulation state of the heat conduction variable structure 10a will be described. FIG. 9 is a diagram for explaining switching between the heat transfer state and the heat insulation state of the heat conduction variable structure 10a.

  As described above, the manufacturing environment temperature of the first contact piece 13 included in the heat conduction variable structure 10a is the first temperature. The first contact piece 13 has a characteristic that a part of the first contact piece 13 approaches the second panel 12 as the ambient temperature rises higher than the first temperature (for example, a displacement characteristic according to the above formula 1).

  On the other hand, the production environment temperature of the second contact piece 14 included in the heat conduction variable structure 10a is a second temperature higher than the first temperature. The second contact piece 14 has a characteristic that a part of the second contact piece 14 approaches the first panel 11 as the ambient temperature is lower than the second temperature (for example, a displacement characteristic according to the above formula 2).

  Then, as shown in FIG. 9A, in the first temperature range near the first temperature (for example, the temperature range of less than 15 ° C.), the second contact piece 14 is greatly increased toward the first panel 11 side. Although displaced, the first contact piece 13 hardly displaces to the second panel 12 side. For this reason, the heat conduction variable structure 10a will be in a heat insulation state. Similarly, as shown in FIG. 9C, in the second temperature range near the second temperature (for example, a temperature range exceeding 25 ° C.), the first contact piece 13 is placed on the second panel 12 side. Although greatly displaced, the second contact piece 14 is hardly displaced toward the first panel 11 side. For this reason, the heat conduction variable structure 10a will be in a heat insulation state.

  On the other hand, as shown in FIG. 9B, in the third temperature range in the vicinity of the third temperature between the first temperature and the second temperature (for example, the temperature range of 15 ° C. or more and 25 ° C. or less). The heat conduction variable structure 10a enters a heat transfer state when the first contact piece 13 and the second contact piece 14 come into contact with each other.

  Thus, the heat conduction variable structure 10a is in a heat insulation state at the first temperature and the second temperature higher than the first temperature, and is in the heat transfer state at the third temperature between the first temperature and the second temperature. Such a heat conduction variable structure 10 a can improve the comfort of the house 100.

  For example, in a season when the temperature is low and heating is used (a season where the temperature is less than 15 ° C.) and a season when the temperature is high and the cooling is used (a season where the temperature is more than 25 ° C.), the heat conduction variable structure 10a is in an insulated state. Therefore, it is difficult for indoor warm air or cold air to escape to the outside. Further, in a comfortable season when the temperature is 15 ° C. or more and 25 ° C. or less, the heat conduction variable structure 10a is in a heat transfer state, so that the temperature of the room is brought close to the outdoor temperature via the heat conduction variable structure 10. Air conditioning is realized.

[Modification 1]
By the way, when the first contact piece 13 and the second contact piece 14 are bimetal, the displacement σ1 of the first contact piece 13 changes linearly as shown in the above equation 1, and as shown in the above equation 2, The displacement σ2 of the second contact piece 14 changes linearly. Therefore, when the ambient temperature is further lowered in the heat conduction variable structure 10a than in the state of FIG. 9 (a), the first contact piece 13 and the second contact piece 14 come into contact again and become a heat transfer state. there is a possibility. Similarly, when the ambient temperature rises further than the state shown in FIG. 9C, the heat conduction variable structure 10a comes into contact with the first contact piece 13 and the second contact piece 14 again, and enters a heat transfer state. There is a possibility. However, it is preferable that the heat conduction variable structure 10a is in a heat transfer state only in the vicinity of the third temperature shown in FIG. 9B in the operating temperature range.

  Therefore, a material whose linear expansion coefficient changes nonlinearly with respect to temperature is used for one of the first base material 13a and the second base material 13b, and the displacement σ1 of the first contact piece 13 changes nonlinearly. May be. Similarly, a material whose linear expansion coefficient varies nonlinearly with respect to temperature is used for one of the first substrate 14a and the second substrate 14b, and the displacement σ2 of the second contact piece 14 varies nonlinearly. May be. FIG. 10 is a diagram schematically illustrating the displacements σ1 and σ2 that change nonlinearly.

  As shown in FIG. 10A, the displacement σ1 of the first contact piece 13 basically increases as the temperature rises, but has a characteristic that the rate of change gradually decreases on the high temperature side. As shown in FIG. 10A, the displacement σ2 of the second contact piece 14 basically increases as the temperature decreases, but has a characteristic that the rate of change gradually decreases on the low temperature side.

  The sum of the displacement σ1 of the first contact piece 13 and the displacement σ2 of the second contact piece 14 is shown in FIG. 10 (b) and forms an upwardly convex curve. Accordingly, the heat conduction variable structure 10a including the first contact piece 13 and the second contact piece 14 is in a heat transfer state only in a temperature range corresponding to the center portion of the curve. Therefore, the temperature range in which the heat insulation state is maintained is expanded.

  Hereinafter, a specific example for realizing the displacement characteristics as shown in FIG. 10 will be described. For example, PET is used for the first base material 13a and the first base material 14a. In this case, for example, copper (copper foil) is used for the second base material 13b and the second base material 14b. PET is an example of a resin material whose linear expansion coefficient changes nonlinearly with respect to temperature.

  Moreover, copper (copper foil) is used for the first base material 13a and the first base material 14a, and an Fe—Ni alloy (nickel and iron alloy) is used for the second base material 13b and the second base material 14b. May be. An Fe—Ni-based alloy is an example of a metal material whose linear expansion coefficient changes nonlinearly with respect to temperature. Note that the coefficient of linear expansion and nonlinearity of Fe—Ni-based alloys change depending on the ratio of iron and nickel.

[Modification 2]
In the said Embodiment 2, the switching of the heat insulation state and the heat-transfer state was performed by combining the 1st contact piece 13 of a 1st pattern, and the 2nd contact piece 14 of a 1st pattern. However, as in the first embodiment, the heat insulating state and the heat transfer state may be switched by combining the first contact piece 13 of the first pattern and the second contact piece 14 of the second pattern. Further, the first contact piece 13 of the second pattern and the second contact piece 14 of the first pattern may be combined to switch between the heat insulation state and the heat transfer state, or the first contact of the second pattern. By combining the piece 13 and the second contact piece 14 of the second pattern, the heat insulation state and the heat transfer state may be switched.

[Effects]
As described above, the heat conduction variable structure 10a is in the second state at the second temperature higher than the first temperature and the first temperature, and is in the first state at the third temperature between the first temperature and the second temperature. It becomes. The first state is, for example, the above-described heat transfer state, which is a state with lower heat insulation and higher heat transfer than the second state. A 2nd state is the above-mentioned heat insulation state, for example, and is a state in which heat insulation is higher and heat conductivity is lower than a 1st state.

  Thereby, if the heat conduction variable structure 10a is used as a heat insulating material for a house as described above, the comfort of the house 100 can be improved.

  In addition, one of the two types of materials having different linear expansion coefficients constituting each of the first contact piece 13 and the second contact piece 14 may change nonlinearly with respect to temperature.

  Thereby, as above-mentioned, a heat insulation state is maintained in a wide temperature range.

  Also, one of the two types of materials having different linear expansion coefficients constituting each of the first contact piece 13 and the second contact piece 14 may be a resin or an alloy.

  Thereby, as above-mentioned, a heat insulation state is maintained in a wide temperature range.

(Other embodiments)
Although the embodiment has been described above, the present invention is not limited to the above embodiment.

  For example, in the said embodiment, although the heat conduction variable structure was used as a building material (for example, heat insulating material), a heat conduction variable structure may be used for uses other than a building material.

  Moreover, the material of the 1st base material and the 2nd base material which were demonstrated by the said embodiment is an example. Any material may be used for the first base material and the second base material as long as the heat conduction variable structure according to the embodiment can be realized.

  In addition, it is realized by variously conceiving various modifications conceived by those skilled in the art for each embodiment, or by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. This form is also included in the present invention.

10, 10a Heat conduction variable structure 11 First panel 12 Second panel 13 First contact piece 14 Second contact piece 15 Space

Claims (7)

The first panel,
A second panel facing the first panel;
A first contact piece located between the first panel and the second panel, connected to the first panel;
A second contact piece located between the first panel and the second panel and connected to the second panel;
The first state in which the first contact piece and the second contact piece are in contact with each other, and the second state in which the first contact piece and the second contact piece are not in contact are switched according to a change in temperature. body. The heat conduction variable structure is:
The second state at a first temperature and a second temperature higher than the first temperature,
The heat conduction variable structure according to claim 1, wherein the first state is reached at a third temperature between the first temperature and the second temperature. The heat conduction variable structure according to claim 2, wherein each of the first contact piece and the second contact piece has a structure in which two kinds of materials having different linear expansion coefficients are laminated. The heat conduction variable structure according to claim 3, wherein one of the two types of materials has a linear expansion coefficient that changes nonlinearly with respect to temperature. The heat conduction variable structure according to claim 3, wherein one of the two kinds of materials is a resin or an alloy. The heat conduction variable structure according to any one of claims 1 to 5, wherein a space between the first panel and the second panel is decompressed more than a space outside the heat conduction variable structure. The heat conduction variable structure according to any one of claims 1 to 5, wherein a space between the first panel and the second panel is filled with a gas having higher heat insulation than air.

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