CN204681722U - Electronic product heat sink - Google Patents
Electronic product heat sink Download PDFInfo
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- CN204681722U CN204681722U CN201520199064.9U CN201520199064U CN204681722U CN 204681722 U CN204681722 U CN 204681722U CN 201520199064 U CN201520199064 U CN 201520199064U CN 204681722 U CN204681722 U CN 204681722U
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- electronic product
- heat
- conducting layer
- high molecular
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of electronic product heat sink.Electronic product heat sink of the present utility model comprises metal temperature-reducing tablet, netted heat-conducting layer, high molecular polymer protective layer; Described metal temperature-reducing tablet, netted heat-conducting layer, high molecular polymer protective layer are mutually stacking successively; Described metal temperature-reducing tablet, netted heat-conducting layer, between the thermal source that high molecular polymer protective layer is arranged on electronic product inside and the shell of electronic product; Described metal temperature-reducing tablet is near thermal source; Described high molecular polymer protective layer comes close to or in contact with the shell of electronic product.Electronic product heat sink of the present utility model, can reach the effect of quick heat radiating, and can reduce the temperature of the shell of electronic product.
Description
Technical field
The utility model relates to a kind of electronic product heat sink, particularly relates to a kind ofly to be applied to the heat sink that electronic product can reduce electronic product casing temperature.
Background technology
Along with height is integrated and the fast development of high performance electronics, electronic devices and components volume is more and more less, speed and the efficiency requirements of work are more and more higher, accordingly, the caloric value of electronic devices and components is also increasing, metal species heat conduction and heat radiation assembly known has at present been subjected to the restriction of its material and self heat conduction and heat radiation limit, and the heat conduction and heat radiation material of advanced heat conduction and heat radiation technique and excellent performance must be adopted effectively to take away heat, ensures that electronic product effectively works.
In equal backing or fin technology, for accelerating heat-conducting effect, high-thermal conductive metal material is adopted to make.Current fin is many by aluminium alloy, and brass or bronze make sheet material, sheet, splintery etc.Although reach the effect of quick heat radiating, comparatively significantly hot spot region still can be there is in electronic product.Especially there is this larger temperature difference in heat source position and stow away from heat position, affects radiating effect.Especially, the electronic product casing temperature of near heating sources is too high, can cause the discomfort of user on the one hand, in addition on the one hand, due to the excessive temperature that shell bears, causes affecting the useful life of shell and causing the deterioration of casing appearance.
Because the heat of near heating sources can not leave fast, have impact on the useful life of heater element, even affect the whole service life of electronic product.
Need novel electronic product heat sink badly to solve the problem.
Utility model content
The utility model proposes to solve above-mentioned each problem, and it is faster that object is to provide a kind of heat radiation, and can reduce the heat abstractor of skin temperature.
To achieve these goals, electronic product heat sink of the present utility model, comprises metal temperature-reducing tablet, netted heat-conducting layer, high molecular polymer protective layer; Described metal temperature-reducing tablet, netted heat-conducting layer, high molecular polymer protective layer are mutually stacking successively; Described metal temperature-reducing tablet, netted heat-conducting layer, between the thermal source that high molecular polymer protective layer is arranged on electronic product inside and the shell of electronic product; Described metal temperature-reducing tablet is near thermal source; Described high molecular polymer protective layer comes close to or in contact with the shell of electronic product.
In addition, between described metal temperature-reducing tablet and electronic product thermal source, be provided with heat conduction glue-line, described metal temperature-reducing tablet is mutually bonding with described electronic product thermal source by described heat conduction glue-line.
Preferably, described netted heat-conducting layer comprises high molecular polymer base material; Described base material is provided with through equally distributed hole.
Electronic product heat sink of the present utility model can also comprise following improvement:
The surface-coated of described high molecular polymer base material has heat conducting coating.
Described high molecular polymer protective layer is coated with heat insulating coat near the one side of described netted heat-conducting layer.
Described metal temperature-reducing tablet is metal film, metal forming or the metal substrate that copper or aluminium are made.
For being 0.01 ~ 0.3mm between the caliper zones of 0.02mm ~ 0.3mm, netted heat-conducting layer between the caliper zones of described metal temperature-reducing tablet, be 0.01mm ~ 0.1mm between the caliper zones of high molecular polymer protective layer.
The surface of described metal temperature-reducing tablet comprises at least one matsurface.
The surface of described metal temperature-reducing tablet is provided with groove spaced apart or fin; Two surfaces of described metal temperature-reducing tablet or one of them surface-coated have nano-sized carbon copper powders coating.
Described metal temperature-reducing tablet is provided with layers of two-sided near the one side of electronic product thermal source.
Described netted heat-conducting layer comprises high molecular polymer base material; Described high molecular polymer base material is provided with the bar hole of parallel or not parallel distribution.
The beneficial effect of the electronic product heat sink that the utility model provides is: owing to being provided with netted heat-conducting layer and high molecular polymer protective layer between the shell and thermal source of electronic product, on the one hand, and heat is spread along metal temperature-reducing tablet as soon as possible; On the other hand, delay heat and spread towards the direction of shell, thus while reaching cooling effect, reduce the temperature of electronic product casing.The discomfort that elimination may bring to user, can also extend the useful life of shell in addition and improve the mechanical strength of shell.
Accompanying drawing explanation
Fig. 1 shows the structural representation of the first embodiment of electronic product heat sink of the present utility model.
Fig. 2 shows the structural representation of the second embodiment of electronic product heat sink of the present utility model.
Fig. 3 shows the structural representation of the 3rd embodiment of electronic product heat sink of the present utility model.
Fig. 4 A shows netted heat-conducting layer first structural representation of electronic product heat sink of the present utility model.
Fig. 4 B shows the second structural representation of the netted heat-conducting layer of electronic product heat sink of the present utility model.
Fig. 4 C shows the 3rd structural representation of the netted heat-conducting layer of electronic product heat sink of the present utility model.
Fig. 5 shows another example structure of the netted heat-conducting layer of electronic product heat sink of the present utility model.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Before the technical scheme describing various embodiments of the present invention in detail, involved noun and term are explained.It should be noted that in this manual, the parts that title is identical or label is identical represent similar or identical structure, and are only limitted to the object of signal.
Fig. 1 shows the structural representation of the first embodiment of electronic product heat sink of the present utility model.As shown in Figure 1, electronic product heat sink of the present utility model comprises metal temperature-reducing tablet 200, netted heat-conducting layer 300, high molecular polymer protective layer 400; Described metal temperature-reducing tablet 200, netted heat-conducting layer 300, high molecular polymer protective layer 400 are mutually stacking successively; Described metal is lowered the temperature 200, netted heat-conducting layer 300, and high molecular polymer protective layer 400 is arranged between the thermal source 100 of electronic product inside and the shell 500 of electronic product; Described metal temperature-reducing tablet 200 is near thermal source 100; Described high molecular polymer protective layer 400 comes close to or in contact with the shell 500 of electronic product.Wherein, the circuit board 600 of electronic product is arranged on electronic product casing 500 inside; Described thermal source 100, the heater element namely in electronic product is arranged on circuit board 600.
Wherein, the structure of netted heat-conducting layer 300 is as shown in Fig. 4 A or Fig. 5.As shown in Figure 4 A, described netted heat-conducting layer 300 can adopt such structure: described netted heat-conducting layer 300 comprises high molecular polymer base material 302; Described base material 302 is provided with through equally distributed hole 301.Preferably, the surface of described high molecular polymer base material 302 can coated with thermally conductive coating, be conducive to the quick conduction of heat on metal temperature-reducing tablet 200 surface, and shell 500 direction delayed to a certain extent to electronic product is conducted; In addition, as shown in Figure 5, described netted heat-conducting layer 300 also can be designed as and comprises high molecular polymer base material 302; Described high molecular polymer base material is provided with the bar hole 303 of parallel or not parallel distribution.In structure shown in Fig. 5, each bar hole 303 is parallel.By instruction of the present utility model, those skilled in the art should be appreciated that described bar hole 303 also can be designed as uneven, the webbed bar hole of intersection or other shapes even mutually hole.
Fig. 4 B and Fig. 4 C respectively illustrates two kinds of structures of netted heat-conducting layer 300.As shown in Figure 4 A, through hole 301 arrangement in matrix high molecular polymer base material 302 arranged.In addition, netted heat-conducting layer 300 also can be set to structure as shown in Figure 4 C.As shown in Figure 4 C, described netted heat-conducting layer 300 comprises the first netted heat-conducting layer 310 and the second netted heat-conducting layer 320, and described first netted heat-conducting layer 310 and described second netted heat-conducting layer 320 arrange through hole 301 respectively; Described first netted heat-conducting layer 310 fits with described second netted heat-conducting layer 320 and the hole 301 on described first netted heat-conducting layer 310 and the hole 301 on the second netted heat-conducting layer 320 misplace and arrange.Adopt the structure of netted heat-conducting layer 300 as shown in Figure 4 C, be more conducive to delaying the conduction of velocity of heat towards electronic product enclosure direction, thus be conducive to heat and conduct fast along the carrying out of metal fin and reduce the temperature on electronic product enclosure.
The electronic product heat sink that the utility model provides, owing to being provided with netted heat-conducting layer between the shell and thermal source of electronic product, on the one hand, makes heat spread along metal temperature-reducing tablet as soon as possible; On the other hand, delay heat and spread towards the direction of shell, thus while reaching cooling effect, reduce the temperature of electronic product casing, eliminate the discomfort may brought to user.The useful life of shell can also be extended in addition and improve the mechanical strength of shell.Especially; high molecular polymer protective layer 400 immediate with electronic product casing 500; delay heat to shell transmit while; again because it is exclusive high temperature resistant; heat-resisting, moisture resistancely wait premium properties, protective effect is from inside to outside played to shell; and with shell integrally, play the effect of protection electronic product internal electronic component.
It should be noted that, for being 0.01 ~ 0.3mm between the caliper zones of 0.02mm ~ 0.3mm, netted heat-conducting layer between the caliper zones of described metal temperature-reducing tablet, be 0.01mm ~ 0.1mm between the caliper zones of high molecular polymer protective layer; Preferably, the thickness of described metal temperature-reducing tablet is chosen as 35 μm, and the thickness of netted heat-conducting layer is chosen as 20 μm, and the thickness of high molecular polymer protective layer is chosen as 12 μm.Adopt the benefit between such caliper zones to be take into account the integrated lightening requirement of electronic product on the one hand, in addition on the one hand, reach best radiating and cooling effect.
Fig. 2 shows the structural representation of the second embodiment of electronic product heat sink of the present utility model.As shown in Figure 2, the structure of the structure shown in second embodiment and first embodiment is broadly similar.Difference is, between described metal temperature-reducing tablet 200 and electronic product thermal source 100, be provided with heat conduction glue-line 700, and described metal temperature-reducing tablet 200 is mutually bonding with described electronic product thermal source 100 by described heat conduction glue-line 700.Between metal temperature-reducing tablet 200 and thermal source 100, be provided with one deck heat-conducting glue, play the effect facilitating bonding metal temperature-reducing tablet 200 and thermal source 100.This one deck heat-conducting glue layer 700 can design on described cooling sheet metal 200, generally, preferably uses double faced adhesive tape, like this, facilitates assembling and the production of heat sink and electronic product.
Needs illustrate, the metal temperature-reducing tablet 200 described in the utility model is metal film, metal forming or the metal substrate that copper or aluminium are made.Certainly, also can be the metal that other heat conduction and heat dispersion are good and the laminar sheet that nonmetallic materials are made.The surface of described metal temperature-reducing tablet comprises at least one matsurface (not shown) to expand the area of dissipation of metal temperature-reducing tablet 200.In addition, the surface of described metal temperature-reducing tablet 200 can be provided with groove spaced apart or fin (not shown); As shown in Figure 3, two surfaces of described metal temperature-reducing tablet 200 or one of them surface 201 can be coated with nano-sized carbon copper powders coating 201 to improve the heat conduction velocity of metal temperature-reducing tablet 200, make metal temperature-reducing tablet 200 can quick heat radiating.Illustrate in Fig. 3 that a surface 201 of metal temperature-reducing tablet 200 can be coated with the structure of nano-sized carbon copper powders coating 201.
Fig. 3 shows the structural representation of the 3rd embodiment of electronic product heat sink of the present utility model.It should be noted that; structure shown in Fig. 3 and first embodiment and the structure shown in second embodiment are broadly similars; difference is, described high molecular polymer protective layer 400 is coated with heat insulating coat 401 near the one side of described netted heat-conducting layer 300.Heat insulation layer 401 can be made by the material powder mixing low thermal conductivity in coating or glue-line, such as glass dust, ceramic powders, asbestos powder etc.By heat insulating coat 401, avoid heat from thermal source 100 directly guiding shell 500, and heat is spread along metal temperature-reducing tablet 200 to periphery, effectively reduce the temperature of electronic product casing.
The beneficial effect of the electronic product heat sink that the utility model provides is: owing to being provided with netted heat-conducting layer and high molecular polymer protective layer between the shell and thermal source of electronic product, on the one hand, and heat is spread along metal temperature-reducing tablet as soon as possible; On the other hand, delay heat and spread towards the direction of shell, thus while reaching cooling effect, reduce the temperature of electronic product casing.The discomfort that elimination may bring to user, can also extend the useful life of shell in addition and improve the mechanical strength of shell.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only embodiment of the present utility model; and be not used in restriction protection range of the present utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (10)
1. an electronic product heat sink, comprises metal temperature-reducing tablet, netted heat-conducting layer, high molecular polymer protective layer; It is characterized in that, described metal temperature-reducing tablet, netted heat-conducting layer, high molecular polymer protective layer are mutually stacking successively; Described metal temperature-reducing tablet, netted heat-conducting layer, between the thermal source that high molecular polymer protective layer is arranged on electronic product inside and the shell of electronic product; Described metal temperature-reducing tablet is near thermal source; Described high molecular polymer protective layer comes close to or in contact with the shell of electronic product.
2. electronic product heat sink according to claim 1, is characterized in that, between described metal temperature-reducing tablet and electronic product thermal source, be provided with heat conduction glue-line, and described metal temperature-reducing tablet is mutually bonding with described electronic product thermal source by described heat conduction glue-line.
3. electronic product heat sink according to claim 1, is characterized in that, described netted heat-conducting layer comprises high molecular polymer base material; Described base material is provided with through equally distributed hole.
4. electronic product heat sink according to claim 3, is characterized in that, the through hole that described high molecular polymer base material is arranged is matrix arrangement.
5. electronic product heat sink according to claim 3, is characterized in that, described netted heat-conducting layer comprises the first netted heat-conducting layer and the second netted heat-conducting layer, and described first netted heat-conducting layer and described second netted heat-conducting layer arrange through hole respectively; Described first netted heat-conducting layer and described second netted heat-conducting layer fit and the hole on described first netted heat-conducting layer and the hole on the second netted heat-conducting layer misplace and arrange.
6. electronic product heat sink according to claim 3, is characterized in that, the surface-coated of described high molecular polymer base material has heat conducting coating.
7. electronic product heat sink according to claim 1, is characterized in that, described high molecular polymer protective layer is coated with heat insulating coat near the one side of described netted heat-conducting layer.
8. electronic product heat sink according to claim 1; it is characterized in that; for being 0.01 ~ 0.3mm between the caliper zones of 0.02mm ~ 0.3mm, netted heat-conducting layer between the caliper zones of described metal temperature-reducing tablet, be 0.01mm ~ 0.1mm between the caliper zones of high molecular polymer protective layer.
9. electronic product heat sink according to claim 1, is characterized in that, described metal temperature-reducing tablet is provided with layers of two-sided near the one side of electronic product thermal source.
10. electronic product heat sink according to claim 1, is characterized in that, described netted heat-conducting layer comprises high molecular polymer base material; Described high molecular polymer base material is provided with the bar hole of parallel or not parallel distribution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520199064.9U CN204681722U (en) | 2015-04-03 | 2015-04-03 | Electronic product heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520199064.9U CN204681722U (en) | 2015-04-03 | 2015-04-03 | Electronic product heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204681722U true CN204681722U (en) | 2015-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520199064.9U Expired - Fee Related CN204681722U (en) | 2015-04-03 | 2015-04-03 | Electronic product heat sink |
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| Country | Link |
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| CN (1) | CN204681722U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111186191A (en) * | 2019-12-09 | 2020-05-22 | 上海传英信息技术有限公司 | Electronic equipment shell and manufacturing method thereof |
-
2015
- 2015-04-03 CN CN201520199064.9U patent/CN204681722U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111186191A (en) * | 2019-12-09 | 2020-05-22 | 上海传英信息技术有限公司 | Electronic equipment shell and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150930 Termination date: 20210403 |
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| CF01 | Termination of patent right due to non-payment of annual fee |